Flexible printed circuit board and display touch device

By designing flexible printed circuit boards, optimizing signal line layout and reinforcement structures, the problem of high production costs in display touch devices after increasing integration has been solved, realizing the product requirements of flexible folding and narrow bezels, and improving signal transmission efficiency.

CN115176220BActive Publication Date: 2026-01-23BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
CN202080003385.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-12-17
Publication Date
2026-01-23
Estimated Expiration
2041-03-31

AI Technical Summary

Technical Problem

With increased integration, existing display touch devices have high production costs, making it difficult to meet the product requirements of flexible folding and narrow bezels.

Method used

The design employs a flexible printed circuit board, including a bonding terminal area, a first circuit area, and a second circuit area, along with a special layout of signal lines and conductive layers. Combined with reinforcement structures and connectors, it achieves efficient connection and layout optimization of signal lines.

Benefits of technology

It reduced production costs, met the product requirements for flexible folding and narrow bezels, and improved integration and signal transmission efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

A flexible printed circuit board and a display touch device. The flexible printed circuit board comprises a binding terminal area (431), a first circuit area (432) and a second circuit area (433); the binding terminal area (431) comprises a plurality of terminals, the first circuit area (432) comprises a driving circuit (410), a plurality of first signal lines (401), a plurality of second signal lines (402) and a plurality of third signal lines (403), and the second circuit area (433) comprises an external connection port; the first ends of the plurality of first signal lines (401), the plurality of second signal lines (402) and the plurality of third signal lines (403) are respectively connected to the plurality of terminals of the binding terminal area (431), the second ends of the plurality of first signal lines (401) and the plurality of second signal lines (402) are respectively connected to the driving circuit (410), and the second ends of the plurality of third signal lines (403) are connected to a connector (420); the orthographic projection of the plurality of first signal lines (401) and the plurality of second signal lines (402) on the plane of the flexible printed circuit board (400) has no overlapping area with the orthographic projection of the plurality of third signal lines (403) on the plane of the flexible printed circuit board (400).
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Description

TECHNICAL FIELD

[0001] The present disclosure relates to, but is not limited to, the technical field of display, and in particular to a flexible printed circuit board and a display touch device. BACKGROUND

[0002] With the rapid development of display technology, touch screens have gradually spread in people's lives. According to the composition structure, the touch screen can be divided into add-on mode, on-cell, in-cell and the like. According to the working principle, the touch screen can be divided into capacitive, resistive, infrared, surface acoustic wave and the like. The capacitive on-cell type forms a touch structure on the light-emitting side surface of the display screen, which gradually becomes the mainstream technology due to its simple structure, thin thickness, high transmittance and the like. SUMMARY

[0003] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.

[0004] An exemplary embodiment of the present disclosure provides a flexible printed circuit board, comprising a binding terminal area, a first circuit area located on one side of the binding terminal area, and a second circuit area located on the side of the first circuit area away from the binding terminal area; the binding terminal area comprises a plurality of terminals, the first circuit area comprises a driving circuit, a plurality of first signal lines, a plurality of second signal lines and a plurality of third signal lines, and the second circuit area comprises an external connection port; the first ends of the plurality of first signal lines, the plurality of second signal lines and the plurality of third signal lines are respectively connected to the plurality of terminals of the binding terminal area, the second ends of the plurality of first signal lines and the plurality of second signal lines are respectively connected to the driving circuit, and the second ends of the plurality of third signal lines are connected to the external connection port; the orthogonal projection of the plurality of first signal lines and the plurality of second signal lines on the plane of the flexible printed circuit board has no overlapping area with the orthogonal projection of the plurality of third signal lines on the plane of the flexible printed circuit board.

[0005] In an exemplary embodiment, the plurality of terminals in the binding terminal area are arranged along a first direction, and along the first direction, the binding terminal area comprises a first terminal area, a middle terminal area and a second terminal area arranged in sequence; the plurality of terminals in the first terminal area are connected to the first ends of the plurality of first signal lines in correspondence, the plurality of terminals in the second terminal area are connected to the first ends of the plurality of second signal lines in correspondence, and the plurality of terminals in the middle terminal area are connected to the first ends of the plurality of third signal lines in correspondence.

[0006] In an example embodiment, along the first direction, the driving circuit is located on a side close to the first terminal area, and the plurality of first signal lines are located in the first circuit area, with the second ends of the plurality of first signal lines connected to the driving circuit.

[0007] In an example embodiment, along the first direction, the second circuit area is located on a side away from the first terminal area; the second ends of the plurality of third signal lines extend from the first circuit area to the second circuit area and are connected to the external connection port; and the second ends of the plurality of second signal lines extend from the first circuit area to the second circuit area, bypass the third signal lines, and then extend from the second circuit area to the first circuit area and are connected to the driving circuit.

[0008] In an example embodiment, the second signal line comprises a first connection line, a turning connection line, and a second connection line connected in sequence; the first connection line is located in the first circuit area, with the first end of the first connection line connected to a terminal of the second terminal area and the second end of the first connection line extending to a boundary area between the first circuit area and the second circuit area; the turning connection line is located in the second circuit area, with the first end of the turning connection line connected to the second end of the first connection line and the second end of the turning connection line extending to the boundary area between the first circuit area and the second circuit area after bypassing the third signal line; and the second connection line is located in the first circuit area, with the first end of the second connection line connected to the second end of the turning connection line and the second end of the second connection line connected to the driving circuit.

[0009] In an example embodiment, the turning connection line comprises a first sub-line, a turning sub-line, and a second sub-line connected in sequence; the first sub-line is located on a side of the third signal line away from the driving circuit, with the first end of the first sub-line connected to the second end of the first connection line located in the boundary area and the second end of the first sub-line extending in the direction of the external connection port and connected to the first end of the turning sub-line; the second sub-line is located on a side of the third signal line close to the driving circuit, with the first end of the second sub-line connected to the second end of the turning sub-line and the second end of the second sub-line extending in the direction of the boundary area and connected to the first end of the second connection line located in the boundary area; and the turning sub-line is located on a side of the external connection port away from the first circuit area, with the turning sub-line bypassing the external connection port or bypassing a terminal of the external connection port connected to the third signal line.

[0010] In an exemplary embodiment, in a plane perpendicular to the plane of the flexible printed circuit board, the flexible printed circuit board includes: a first conductive layer disposed on a first substrate, a first protective layer disposed on the side of the first conductive layer away from the first substrate, and a second protective layer disposed on the side of the first substrate away from the first conductive layer; the first sub-line, the folded rotor line, and the second sub-line are all located on the first conductive layer.

[0011] In an exemplary embodiment, in a plane perpendicular to the plane of the flexible printed circuit board, the flexible printed circuit board includes: a first conductive layer disposed on a first substrate, a first protective layer disposed on the first conductive layer away from the first substrate, a first adhesive layer disposed on the first substrate away from the first conductive layer, a second substrate disposed on the first adhesive layer away from the first substrate, a second conductive layer disposed on the second substrate away from the first substrate, and a second protective layer disposed on the second conductive layer away from the first substrate; the first sub-line, the folded rotor line, and the second sub-line are all located on the first conductive layer, or the first sub-line, the folded rotor line, and the second sub-line are all located on the second conductive layer.

[0012] In an exemplary embodiment, in a plane perpendicular to the plane of the flexible printed circuit board, the flexible printed circuit board includes: a first conductive layer disposed on a first substrate, a first protective layer disposed on the first conductive layer away from the first substrate, and a second protective layer disposed on the first substrate away from the first conductive layer; at the end of the second circuit area away from the first circuit area, a reinforcing structure opening is provided on the second protective layer, and a reinforcing structure is disposed within the reinforcing structure opening; the reinforcing structure includes: a reinforcing adhesive layer disposed on the first substrate away from the first conductive layer, a reinforcing substrate disposed on the reinforcing adhesive layer away from the first substrate, a reinforcing conductive layer disposed on the reinforcing substrate away from the first substrate, and a reinforcing protective layer disposed on the reinforcing conductive layer away from the first substrate; the first sub-line and the second sub-line are both located on the first conductive layer, the folding rotor line is located on the reinforcing conductive layer, and the folding rotor line is connected to the first sub-line and the second sub-line respectively through connecting posts.

[0013] In an exemplary embodiment, in a plane perpendicular to the plane of the flexible printed circuit board, the flexible printed circuit board includes: a first conductive layer disposed on a first substrate; a first protective layer disposed on the side of the first conductive layer away from the first substrate; a first adhesive layer disposed on the side of the first substrate away from the first conductive layer; a second substrate disposed on the side of the first adhesive layer away from the first substrate; a second conductive layer disposed on the side of the second substrate away from the first substrate; and a second protective layer disposed on the side of the second conductive layer away from the first substrate. At the end of the second circuit region away from the first circuit region, a reinforcing structure opening is provided on the second protective layer, and a reinforcing structure is disposed within the reinforcing structure opening. The reinforcing structure includes: a reinforcing adhesive layer disposed on the side of the second conductive layer away from the second substrate; a reinforcing substrate disposed on the side of the reinforcing adhesive layer away from the second substrate; a reinforcing conductive layer disposed on the side of the reinforcing substrate away from the second substrate; and a reinforcing protective layer disposed on the side of the reinforcing conductive layer away from the second substrate. The first sub-line and the second sub-line are both located on the first conductive layer, and the folding rotor line is located on the reinforcing conductive layer. The folding rotor line is connected to the first sub-line and the second sub-line respectively via connecting posts. Alternatively, the first sub-line and the second sub-line are both located on the second conductive layer, and the folding rotor line is located on the reinforcing conductive layer. The folding rotor line is connected to the first sub-line and the second sub-line respectively via connecting posts.

[0014] In an exemplary embodiment, the external connection port includes a connector; at the end of the second circuit area away from the first circuit area, a connector opening is provided on the first protective layer, and the connector is disposed within the connector opening.

[0015] An exemplary embodiment of this disclosure also provides a display touch device, including a touch display panel and the aforementioned flexible printed circuit board. The touch display panel includes an effective area and a bonding area located on one side of the effective area. The bonding area includes a bonding pin area, which includes a plurality of pins. A plurality of terminals in the bonding terminal area of ​​the flexible printed circuit board are correspondingly connected to the plurality of pins in the bonding pin area.

[0016] In an exemplary embodiment, a plurality of pins in the bonding pin area are arranged along a first direction. Along the first direction, the bonding pin area includes a first pin area, a middle pin area, and a second pin area arranged sequentially. A plurality of terminals in the first terminal area are connected to a plurality of pins in the first pin area, a plurality of terminals in the second terminal area are connected to a plurality of pins in the second pin area, and a plurality of terminals in the middle terminal area are connected to a plurality of pins in the middle pin area.

[0017] In an exemplary embodiment, the bonding area further includes multiple sensing leads, multiple driving leads, and multiple display leads. The multiple sensing leads are connected to multiple pins in the first pin area, the multiple driving leads are connected to multiple pins in the second pin area, and the multiple display leads are connected to multiple pins in the central pin area.

[0018] In an exemplary embodiment, the driving circuit includes a touch driving circuit, and the connector includes a board-to-board connector.

[0019] After reading and understanding the accompanying diagrams and detailed descriptions, other aspects can be understood. Attached Figure Description

[0020] The accompanying drawings are provided to further illustrate the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure. The shapes and sizes of the components in the drawings do not reflect actual proportions and are only intended to illustrate the content of this disclosure.

[0021] Figure 1 This is a schematic diagram of a planar structure of a display touch device, which is an exemplary embodiment of the present disclosure.

[0022] Figure 2 This is a schematic diagram of the structure of a binding region as an exemplary embodiment of the present disclosure;

[0023] Figure 3 A schematic diagram of the structure of an edge region is provided as an exemplary embodiment of this disclosure;

[0024] Figure 4 This is a schematic cross-sectional view of a display touch device, which is an exemplary embodiment of the present disclosure.

[0025] Figure 5 This is a schematic diagram of a flexible printed circuit board bonding connection as an exemplary embodiment of the present disclosure;

[0026] Figure 6 This is a schematic diagram of a bend connection line routing as an exemplary embodiment of the present disclosure;

[0027] Figure 7 This is a schematic diagram of the film layer structure of a flexible printed circuit board, which is an exemplary embodiment of the present disclosure.

[0028] Figure 8 This is a schematic diagram of the film layer structure of another flexible printed circuit board, which is an exemplary embodiment of the present disclosure.

[0029] Figure 9 This is a schematic diagram of another flexible printed circuit board bonding connection as an exemplary embodiment of the present disclosure;

[0030] Figure 10 A schematic diagram of another exemplary embodiment of the bending connection line routing is disclosed;

[0031] Figure 11 This is a schematic diagram of the film layer structure of another flexible printed circuit board, which is an exemplary embodiment of the present disclosure.

[0032] Figure 12 This is a schematic diagram of the structure of an in-board connection line, which is an exemplary embodiment of the present disclosure.

[0033] Figure 13 This is a schematic diagram of the film layer structure of another flexible printed circuit board, which is an exemplary embodiment of the present disclosure.

[0034] Explanation of reference numerals in the attached figures:

[0035] 10—First substrate; 11—First conductive layer; 12—First protective layer;

[0036] 13—First shielding layer; 14—First adhesive layer; 20—Second substrate;

[0037] 21—Second conductive layer; 22—Second protective layer; 23—Second shielding layer;

[0038] 50—Reinforcing substrate; 51—Reinforcing conductive layer; 52—Reinforcing protective layer;

[0039] 53—Reinforcing adhesive layer; 61—First connecting post; 62—Second connecting post;

[0040] 100—Touch area; 101—Substrate; 102—Driver circuit layer;

[0041] 103—Light-emitting device; 104—Encapsulation layer; 105—Buffer layer;

[0042] 106—First metal mesh layer; 107—Insulating layer; 108—Second metal mesh layer;

[0043] 109—Protective layer; 110—First touch unit; 111—First touch electrode;

[0044] 112—First connecting part; 120—Second touch unit; 121—Second touch electrode;

[0045] 122—Second connecting section; 200—Binding area; 201—First fan-out area;

[0046] 202—Bending area; 203—Second fan-out area; 204—Anti-static area;

[0047] 205—Driver chip area; 206—Bonding pin area; 300—Edge area;

[0048] 301—Induction lead; 302—Drive lead; 400—Flexible printed circuit board;

[0049] 401—Sensing signal line; 402—Drive signal line; 403—Display signal line;

[0050] 404—Boundary area; 410—Touch drive circuit; 411—First connection line;

[0051] 412—Turnover connector; 413—Second connector; 420—Connector;

[0052] 421—First sub-line; 422—Bend-rotor line; 423—Second sub-line;

[0053] 431—Binding terminal area; 432—First circuit area; 433—Second circuit area;

[0054] 601—First cutting line; 602—Second cutting line. Detailed Implementation

[0055] The embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. Note that the implementation can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be varied in many ways without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the contents described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0056] In the accompanying drawings, the size of the constituent elements, the thickness of the layers, or the area are sometimes exaggerated for clarity. Therefore, one aspect of this disclosure is not necessarily limited to these dimensions, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and one aspect of this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0057] The ordinal numbers “first,” “second,” and “third” used in this specification are used to avoid confusion among the constituent elements, not to limit their quantity.

[0058] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of each constituent element being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0059] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the specific meaning of these terms in this disclosure based on the specific circumstances.

[0060] In this specification, a transistor is a device that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between the drain electrode (drain electrode terminal, drain region, or drain electrode) and the source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to the region through which current primarily flows.

[0061] In this specification, the first electrode can be the drain electrode and the second electrode can be the source electrode, or vice versa. In cases where transistors with opposite polarities are used or the current direction changes during circuit operation, the functions of the "source electrode" and "drain electrode" may sometimes be interchanged. Therefore, in this specification, the "source electrode" and "drain electrode" can be interchanged.

[0062] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0063] In this specification, "parallel" refers to the state where the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore also includes the state where the angle is greater than or equal to -5° and less than 5°. Similarly, "perpendicular" refers to the state where the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore also includes the state where the angle is greater than or equal to 85° and less than 95°.

[0064] In this specification, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may sometimes be replaced with "conductive film." Similarly, "insulating film" may sometimes be replaced with "insulating layer."

[0065] In this disclosure, “about” means a value that is not strictly limited and allows for process and measurement errors.

[0066] Capacitive on-cell touch panels are mainly divided into mutual capacitive and self-capacitive structures. The mutual capacitive structure uses a mutual capacitance formed by the first and second touch electrodes, and position detection is performed based on changes in this mutual capacitance. The self-capacitive structure uses a self-capacitance formed by the touch electrodes and the human body, and position detection is performed based on changes in this self-capacitance. Self-capacitive touch panels are single-layer structures, characterized by low power consumption and simple structure, while mutual capacitive touch panels are multi-layer structures, featuring multi-touch capabilities.

[0067] The display touch device of the exemplary embodiments of this disclosure may include a display panel disposed on a substrate and a touch panel disposed on the display panel. The display panel may be a Liquid Crystal Display (LCD) panel, an Organic Light Emitting Diode (OLED) display panel, a Plasma Display Panel (PDP) panel, or an Electrophoretic Display Panel (EPD) panel. In an exemplary embodiment, the display panel may be an OLED display panel. OLEDs are active-matrix light-emitting display devices, possessing advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, and extremely high response speed. With the continuous development of display technology, flexible display devices using OLEDs as light-emitting devices and thin-film transistors (TFTs) for signal control have become the mainstream products in the display field. Based on the needs of flexible folding and narrow bezel products, the existing OLED-based touch structure adopts the Flexible Multi Layer On Cell (FMLOC) structure. The display structure and touch structure are all integrated on the substrate, and the touch panel is set on the encapsulation layer of the OLED backplane to form an on-cell structure. It has the advantages of being thin, light and foldable, and can meet the needs of flexible folding and narrow bezel products.

[0068] Figure 1 This is a schematic diagram of a planar structure of a display touch device according to an exemplary embodiment of the present disclosure. A touch panel is disposed on a display panel, forming an FMLOC structure. In a plane parallel to the touch panel, the touch panel includes an effective area (AA), a bonding area located on one side of the effective area, and edge areas located on the other sides of the effective area. For a stacked display panel and touch panel, the effective area can be either the touch area of ​​the touch panel or the display area of ​​the display panel; in the following description, both touch area and display area refer to the effective area. In an exemplary embodiment, the touch area 100 includes at least a plurality of regularly arranged touch electrodes, the edge area 300 includes at least a plurality of touch leads, and the bonding area 200 includes at least pins connecting the touch leads to an external control device.

[0069] In an exemplary embodiment, the touch panel can be a mutually compliant structure. The touch area 100 may include a plurality of first touch units 110 and a plurality of second touch units 120. The first touch units 110 have a linear shape extending along a first direction D1, and the plurality of first touch units 110 are arranged sequentially along a second direction D2. The second touch units 120 also have a linear shape extending along the second direction D2, and the plurality of second touch units 120 are arranged sequentially along the first direction D1, where the first direction D1 intersects the second direction D2. Each first touch unit 110 includes a plurality of first touch electrodes 111 and a first connecting portion 112 arranged sequentially along the first direction D1. The first touch electrodes 111 and the first connecting portions 112 are alternately arranged and sequentially connected. Each second touch unit 120 includes a plurality of second touch electrodes 121 arranged sequentially along the second direction D2. The plurality of second touch electrodes 121 are spaced apart, and adjacent second touch electrodes 121 are connected to each other through second connecting portions 122. In an exemplary embodiment, the film layer where the second connection portion 122 is located is different from the film layer where the first touch electrode 111 and the second touch electrode 121 are located. The first touch electrode 111 and the second touch electrode 121 are alternately arranged on a third direction D3, which intersects with the first direction D1 and the second direction D2.

[0070] In an exemplary embodiment, a plurality of first touch electrodes 111, a plurality of second touch electrodes 121, and a plurality of first connection portions 112 can be disposed on the same layer of the touch layer and formed by the same patterning process. The first touch electrodes 111 and the first connection portions 112 can be an integral structure interconnected with each other. The second connection portions 122 can be disposed on a bridging layer, and adjacent second touch electrodes 121 are interconnected through vias. An insulating layer is disposed between the touch layer and the bridging layer. In some possible implementations, a plurality of first touch electrodes 111, a plurality of second touch electrodes 121, and a plurality of second connection portions 122 can be disposed on the same layer of the touch layer. The second touch electrodes 121 and the second connection portions 122 can be an integral structure interconnected with each other. The first connection portions 112 can be disposed on a bridging layer, and adjacent first touch electrodes 111 are interconnected through vias. In an exemplary embodiment, the first touch electrode can be a driving (Tx) electrode, and the second touch electrode can be a sensing (Rx) electrode. Alternatively, the first touch electrode can be a sensing (Rx) electrode, and the second touch electrode can be a driving (Tx) electrode.

[0071] In an exemplary embodiment, the first touch electrode 111 and the second touch electrode 121 may have a rhomboid shape, such as a regular rhombus, a horizontally elongated rhombus, or a vertically elongated rhombus. In some possible implementations, the first touch electrode 111 and the second touch electrode 121 may have any one or more of the following shapes: triangle, square, trapezoid, parallelogram, pentagon, hexagon, and other polygons, which are not limited herein.

[0072] In one exemplary embodiment, the first touch electrode 111 and the second touch electrode 121 can be in the form of transparent conductive electrodes. In another exemplary embodiment, the first touch electrode 111 and the second touch electrode 121 can be in the form of a metal mesh, which is formed by multiple interwoven metal wires. The metal mesh includes multiple mesh patterns, and each mesh pattern is a polygon composed of multiple metal wires. The metal mesh-type first touch electrode 111 and the second touch electrode 121 have advantages such as low resistance, small thickness, and fast response speed.

[0073] Figure 2 This is a schematic diagram of the structure of a binding region as an exemplary embodiment of this disclosure. Figure 2 As shown, in an exemplary embodiment, the bonding area 200 is located on one side of the touch area 100, along a direction away from the touch area 100 (second direction D2). The bonding area 200 may include a first fan-out area 201, a bending area 202, a second fan-out area 203, an anti-static area 204, a driver chip area 205, and a bonding pin area 206 arranged sequentially. The first fan-out area 201 may house the signal transmission lines of the display panel and the touch leads of the touch panel. The signal transmission lines of the display panel include at least a first power line (VDD), a second power line (VSS), and multiple data transmission lines. The multiple data transmission lines are configured to connect to the data lines of the display panel in a fan-out routing manner. The first power line VDD and the second power line VSS are configured to connect to the high-level power line and low-level power line of the display panel, respectively. The multiple touch leads of the touch panel are configured to connect to the multiple pins of the bonding pin area 206. The bending area 202 can be provided with a groove, configured to bend the second fan-out area 203, the anti-static area 204, the driver chip area 205, and the bonding pin area 206 to the back of the touch area 100. The second fan-out area 203 can be provided with multiple touch leads and multiple data transmission lines led out in a fan-out routing manner. The anti-static area 204 can be provided with an anti-static circuit, configured to eliminate static electricity. The driver chip area 205 can be provided with a source driver circuit (Driver IC), configured to connect to the multiple data transmission lines of the second fan-out area 203. The bonding pin area 206 can be provided with multiple pins, which are connected to the multiple touch leads and the multiple display signal lines of the source driver circuit. The bonding pin area 206 is configured to bond to the flexible printed circuit board (FPC) 400.

[0074] In an exemplary embodiment, the flexible printed circuit board 200 includes at least a touch driving circuit (Touch IC) 410 and a connector 420, with multiple touch leads connected to the touch driving circuit 410 and multiple display signal lines connected to the connector 420.

[0075] In an exemplary embodiment, a first cutting line 601 and a second cutting line 602 are further provided on the outer side of the bonding area 200. The second cutting line 602 is a fine cutting line, located on the periphery of the bonding area 200, and its shape is the same as the outline of the bonding area 200. The first cutting line 601 is a coarse cutting line, located on the periphery of the second cutting line 602, and its shape is the same as the outline of the second cutting line 602. After the film layer process is completed, the cutting equipment cuts along the first cutting line 601 (coarse cutting line). After testing is completed, the cutting equipment cuts along the second cutting line 602 (fine cutting line) to form the display panel and the touch panel.

[0076] Figure 3 This is a schematic diagram of the structure of an edge region as an exemplary embodiment of this disclosure. Figure 3 As shown, in an exemplary embodiment, the edge region 300 is located on the other side of the touch region 100, except for the side where the bonding region 200 is located. In an exemplary embodiment, the first touch electrode 111 is a sensing (Rx) electrode, and the second touch electrode 121 is a driving (Tx) electrode. In an exemplary embodiment, multiple sensing (Rx) leads 301 and multiple driving (Tx) leads 302 are provided in the edge region 300. The first end of the driving lead 302 is connected to the driving electrode, and the second end of the driving lead 302 extends to one side of the bonding region 200. The first end of the sensing lead 301 is connected to the sensing electrode, and the second end of the sensing lead 301 extends along the edge region 300 to the other side of the bonding region 200. In an exemplary embodiment, the sensing lead 301 and the driving lead 302 together form the touch leads.

[0077] Figure 4 This is a cross-sectional structural diagram of a display touch device, illustrating the structure of three sub-pixels, as an exemplary embodiment of this disclosure. Figure 4 As shown, a touch panel is disposed on a display panel. In an exemplary embodiment, on a plane perpendicular to the display panel, the display panel may include a driving circuit layer 102 disposed on a substrate 101, a light-emitting device 103 disposed on the side of the driving circuit layer 102 away from the substrate 101, and an encapsulation layer 104 disposed on the side of the light-emitting device 103 away from the substrate 101. In some possible implementations, the display panel may include other film layers, such as spacers, etc., which are not limited herein.

[0078] In an exemplary embodiment, the substrate can be a flexible substrate or a rigid substrate. The flexible substrate may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked together. The materials of the first and second flexible material layers may be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer film, etc. The materials of the first and second inorganic material layers may be silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the substrate's resistance to water and oxygen. The material of the semiconductor layer may be amorphous silicon (a-Si).

[0079] In an exemplary embodiment, the driving circuit layer 102 of each sub-pixel may include a plurality of transistors and a storage capacitor constituting a pixel driving circuit. Figure 4 The illustration uses an example where each sub-pixel includes a driving transistor and a storage capacitor. In some possible implementations, the driving circuit layer 102 of each sub-pixel may include: a first insulating layer disposed on a substrate; an active layer disposed on the first insulating layer; a second insulating layer covering the active layer; a gate electrode and a first capacitor electrode disposed on the second insulating layer; a third insulating layer covering the gate electrode and the first capacitor electrode; a second capacitor electrode disposed on the third insulating layer; a fourth insulating layer covering the second capacitor electrode, wherein vias are formed in the second, third, and fourth insulating layers, and the vias expose the active layer; a source electrode and a drain electrode disposed on the fourth insulating layer, and the source electrode and drain electrode are respectively connected to the active layer through vias; and a planarization layer covering the aforementioned structure, wherein vias are formed in the planarization layer, and the vias expose the drain electrode. The active layer, the gate electrode, the source electrode, and the drain electrode constitute the driving transistor, and the first capacitor electrode and the second capacitor electrode constitute the storage capacitor.

[0080] In an exemplary embodiment, the light-emitting device 103 may include an anode, a pixel definition layer, an organic light-emitting layer, and a cathode. The anode is disposed on a planarization layer and connected to the drain electrode of a driving transistor through a via formed in the planarization layer; the pixel definition layer is disposed on the anode and the planarization layer, and a pixel opening is provided on the pixel definition layer, exposing the anode; the organic light-emitting layer is at least partially disposed within the pixel opening and is connected to the anode; the cathode is disposed on the organic light-emitting layer and is connected to the organic light-emitting layer; the organic light-emitting layer emits light of a corresponding color under the driving of the anode and the cathode.

[0081] In an exemplary embodiment, the encapsulation layer 104 may include a first encapsulation layer, a second encapsulation layer and a third encapsulation layer stacked together. The first encapsulation layer and the third encapsulation layer may be made of inorganic materials, while the second encapsulation layer may be made of organic materials. The second encapsulation layer is disposed between the first encapsulation layer and the third encapsulation layer to ensure that external moisture cannot enter the light-emitting device 103.

[0082] In an exemplary embodiment, the organic light-emitting layer of an OLED light-emitting element may include an emitting layer (EML) and one or more films selected from the following: a hole injection layer (HIL), a hole transport layer (HTL), a hole block layer (HBL), an electron block layer (EBL), an electron injection layer (EIL), and an electron transport layer (ETL). Driven by the voltages of the anode and cathode, the organic material emits light at the required grayscale level.

[0083] In exemplary embodiments, the emitting layers of OLED light-emitting elements of different colors are different. For example, a red light-emitting element includes a red emitting layer, a green light-emitting element includes a green emitting layer, and a blue light-emitting element includes a blue emitting layer. To reduce process complexity and improve yield, the hole injection layer and hole transport layer on one side of the emitting layer can be common layers, and the electron injection layer and electron transport layer on the other side of the emitting layer can also be common layers. In exemplary embodiments, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer can be fabricated in a single process (single vapor deposition process or single inkjet printing process), but isolation is achieved through surface steps of the formed film layers or through surface treatment. For example, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer corresponding to adjacent sub-pixels can be isolated. In exemplary embodiments, the organic light-emitting layer can be formed by vapor deposition using a fine metal mask (FMM) or an open mask, or by inkjet printing.

[0084] In an exemplary embodiment, on a plane perpendicular to the touch panel, the touch panel may include a buffer layer 105 disposed on the side of the encapsulation layer 104 away from the substrate 101, a first metal mesh (TMA) layer 106 disposed on the side of the buffer layer 105 away from the substrate 101, an insulating layer 107 disposed on the side of the first metal mesh layer 106 away from the substrate 101, a second metal mesh (TMB) layer 108 disposed on the side of the insulating layer 107 away from the substrate 101, and a protective layer 109 disposed on the side of the second metal mesh layer 108 away from the substrate 101.

[0085] In an exemplary embodiment, the buffer layer 105 and the insulating layer 107 can be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be a single layer, multiple layers, or composite layers. The first metal mesh layer 106 and the second metal mesh layer 108 can be made of metallic materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, and the protective layer 109 can be made of organic materials.

[0086] In an exemplary embodiment, the first metal mesh layer 106 can be referred to as a bridging layer, and the second metal mesh layer 108 can be referred to as a touch layer. Multiple first touch electrodes, second touch electrodes, and first connecting portions can be disposed on the same layer of the touch layer, and the second connecting portions can be disposed on the bridging layer. Adjacent second touch electrodes are connected to each other through vias.

[0087] In an exemplary embodiment, the touch control device disclosed herein can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0088] Currently, display devices are becoming increasingly integrated. Display and touch devices that integrate both display and touch functions onto the panel offer advantages such as low cost and thinness, and have become a development trend. However, with increased integration, display and touch devices also face challenges such as higher production costs.

[0089] Figure 5 This is a schematic diagram of a flexible printed circuit board bonding connection as an exemplary embodiment of this disclosure. Figure 5 As shown, in an exemplary embodiment, along a direction parallel to the edge of the binding area (first direction D1), the binding area 200 can be divided into a first side area, a middle area, and a second side area. The edge of the binding area is the edge of the binding area adjacent to the touch area. In the following description, the left side of the binding area refers to the first side area of ​​the binding area, the right side of the binding area refers to the second side area of ​​the binding area, and the middle area of ​​the binding area refers to the middle area between the left and right sides of the binding area. In an exemplary embodiment, the binding pin area 206 in the binding area 200 may include a first pin area located in the first side area, a middle pin area located in the middle area, and a second pin area located in the second side area. Each of the first pin area, the middle pin area, and the second pin area includes multiple pins.

[0090] In an exemplary embodiment, multiple sensing leads 301 are introduced from the touch area 100 to the left side of the bonding area, extending to a first pin area and correspondingly connected to multiple pins in the first pin area. Multiple driving leads 302 are introduced from the touch area 100 to the right side of the bonding area, extending to a second pin area and correspondingly connected to multiple pins in the second pin area. Multiple display leads 303 are introduced from the source driving circuit located in the middle of the bonding area to the central pin area and correspondingly connected to multiple pins in the central pin area.

[0091] In an exemplary embodiment, the flexible printed circuit board 400 is located on the side of the bonding area 200 away from the touch area 100. Along the direction away from the touch area 100 (second direction D2), the flexible printed circuit board 400 may include a bonding terminal area 431, a first circuit area 432 and a second circuit area 433 arranged sequentially.

[0092] The bonding terminal area 431 may include multiple terminals, which are connected to multiple pins corresponding to the bonding pin area 206. The first circuit area 432 may include at least a touch driving circuit (Touch IC) 410, which is configured to connect to multiple driving signal lines and multiple sensing signal lines on the flexible printed circuit board 400. The second circuit area 433 may include at least a connector 420, which is configured to connect to multiple display signal lines on the flexible printed circuit board 400.

[0093] In an exemplary embodiment, multiple terminals in the bonding terminal area 431 are arranged regularly along a first direction D1. The bonding terminal area 431 may include a first terminal area, a middle terminal area, and a second terminal area. The position of the first terminal area corresponds to the position of the first pin area of ​​the bonding area, and multiple terminals in the first terminal area are connected to multiple pins in the first pin area. The position of the middle terminal area corresponds to the position of the middle pin area of ​​the bonding area, and multiple terminals in the middle terminal area are connected to multiple pins in the middle area. The position of the second terminal area corresponds to the position of the second pin area of ​​the bonding area, and multiple terminals in the second terminal area are connected to multiple pins in the second pin area.

[0094] In an exemplary embodiment, the first circuit area 432 may be rectangular, and may include a touch driving circuit 410, multiple sensing signal lines 401, multiple driving signal lines 402, and multiple display signal lines 403. Along the first direction D1, the touch driving circuit 410 may be located on the side of the first circuit area closer to the first terminal area, that is, on the left side of the flexible printed circuit board 400.

[0095] In an exemplary embodiment, the second circuit area 433 may be rectangular and may include a connector 420, multiple drive signal lines 402, and multiple display signal lines 403. Along the first direction D1, the width of the second circuit area 433 is smaller than the width of the first circuit area 432, and the second circuit area 433 may be located on the side away from the first terminal area, i.e., on the right side of the flexible printed circuit board 400. In an exemplary embodiment, the connector 420 is located at the end of the second circuit area 433 on the side away from the first circuit area 432.

[0096] In an exemplary embodiment, the sensing signal line 401 serves as the first signal line, the driving signal line 402 serves as the second signal line, the display signal line 403 serves as the third signal line, the touch driving circuit 410 serves as the driving circuit, and the connector 420 serves as the external connection port. In an exemplary embodiment, the connector can be a board-to-board (BTB) connector.

[0097] In an exemplary embodiment, multiple sensing signal lines 401 (first signal lines) are only provided in the first circuit area 432. The first ends of the multiple sensing signal lines 401 are connected to multiple terminals in the first terminal area, and are connected to multiple sensing leads 301 on the left side of the bonding area via the multiple terminals in the first terminal area and the multiple pins in the first pin area. The second ends of the multiple sensing signal lines 401 extend to the touch driving circuit 410 and are connected to the touch driving circuit 410 located in the first circuit area. This enables the touch driving circuit 410 to connect with the multiple sensing leads 301 in the bonding area, allowing the touch driving circuit 410 to provide touch sensing signals to the multiple sensing leads 301. In an exemplary embodiment, the sensing signal lines 401 can be straight lines extending along the second direction D2, or they can be broken lines. Since the first terminal area and the touch driving circuit 410 are both located on the left side of the flexible printed circuit board 400, and the multiple sensing signal lines 401 are also located on the left side of the flexible printed circuit board 400, the multiple sensing signal lines 401 and the multiple display signal lines 403 do not overlap in the first circuit area.

[0098] In an exemplary embodiment, drive signal lines 402 (second signal lines) are respectively disposed in the first circuit area 432 and the second circuit area 433. The first ends of the multiple drive signal lines 402 are connected to multiple terminals in the second terminal area, and are connected to multiple drive leads 302 in the bonding area through the multiple terminals in the second terminal area and the multiple pins in the second pin area. The second ends of the multiple drive signal lines 402 extend from the first circuit area 432 to the second circuit area 433, bypass the multiple display signal lines 403 in the second circuit area, and then extend from the second circuit area 433 to the first circuit area 432, connecting with the touch drive circuit 410 located in the first circuit area. This enables the touch drive circuit 410 to connect with the multiple drive leads 302 in the bonding area, allowing the touch drive circuit 410 to provide touch sensing signals to the multiple drive leads 302. Since the second terminal area and the second circuit area 433 are both located on the right side of the flexible printed circuit board 400, and multiple drive signal lines 402 bypass multiple display signal lines 403, the multiple drive signal lines 402 and the multiple display signal lines 403 do not overlap in the first circuit area and the second circuit area.

[0099] In an exemplary embodiment, multiple display signal lines 403 (third signal lines) are respectively disposed in the first circuit area 432 and the second circuit area 433. The first ends of the multiple display signal lines 403 are connected to multiple terminals in the central terminal area, and are connected to multiple display leads 303 in the bonding area via the multiple terminals in the central terminal area and the multiple pins in the central pin area. The second ends of the multiple display signal lines 403 extend from the first circuit area 432 to the second circuit area 433 and are connected to a connector 420 located in the second circuit area. This enables the connector 420 to connect to the multiple display leads 303 in the bonding area, allowing an external control device to provide display signals to the multiple display leads 303 through the connector 420. In an exemplary embodiment, the display signal line 403 can be a straight line extending along the second direction D2, or it can be a broken line. In an exemplary embodiment, the broken line can include at least one first straight line extending along the first direction D1 and at least two second straight lines extending along the second direction D2, with the first and second straight lines connected sequentially.

[0100] In an exemplary embodiment, the drive signal line 402 may include a first connecting line 411, a bend connecting line 412, and a second connecting line 413 connected in sequence.

[0101] In an exemplary embodiment, the first connecting line 411 is located in the first circuit area 432. The first end of the first connecting line 411 serves as the first end of the drive signal line 402 and is correspondingly connected to multiple terminals in the second terminal area. The second end of the first connecting line 411 extends to the boundary region 404 between the first circuit area and the second circuit area. In an exemplary embodiment, the first connecting line 411 can be a straight line extending along the second direction D2, or it can be a broken line. In an exemplary embodiment, the broken line can include at least one first straight line extending along the first direction D1 and at least two second straight lines extending along the second direction D2, with the first and second straight lines connected sequentially.

[0102] In an exemplary embodiment, the bend connection line 412 is located in the second circuit area 433. The first end of the bend connection line 412 is connected to the second end of the first connection line 411 located in the boundary area 404. The second end of the bend connection line 412 first extends towards the connector 420, then bypasses the connector 420, and then extends away from the connector 420, extending to the boundary area 404 between the first circuit area and the second circuit area.

[0103] In an exemplary embodiment, the second connecting line 413 is located in the first circuit area 432. The first end of the second connecting line 413 is connected to the second end of the bend connecting line 412 located in the boundary area 404. The second end of the second connecting line 413 serves as the second end of the drive signal line 402, extending to and connecting with the touch driving circuit 410. In an exemplary embodiment, the second connecting line 413 can be a straight line extending in the opposite direction of the first direction D1, or it can be a broken line. In an exemplary embodiment, the broken line can include at least two first straight lines extending in the opposite direction of the first direction D1 and at least one second straight line extending in the opposite direction of the second direction D2, with the first and second straight lines connected sequentially.

[0104] In an exemplary embodiment, the orthographic projection of the display signal line 403 on the substrate and the orthographic projection of the sensing signal line 401 on the substrate do not overlap, the orthographic projection of the display signal line 403 on the substrate and the orthographic projection of the drive signal line 402 on the substrate do not overlap, and the orthographic projection of the sensing signal line 401 on the substrate and the orthographic projection of the drive signal line 402 on the substrate do not overlap.

[0105] Figure 6 This is a schematic diagram of a bend connection line routing as an exemplary embodiment of this disclosure. Figure 5 and Figure 6As shown, the turning connection line 412 located in the second circuit area is configured to form a trace that bypasses the connector 420 in the second circuit area 433, so that the drive signal line 402 avoids crossing the display signal line 403, that is, the orthographic projection of the drive signal line 402 on the substrate and the orthographic projection of the display signal line 403 on the substrate have no overlapping area.

[0106] In an exemplary embodiment, the second circuit area 433 may be rectangular and disposed on the side of the first circuit area 432 away from the bonding terminal area 431. The connector 420 may be rectangular and disposed at the end of the second circuit area 433 away from the first circuit area 432. A plurality of third signal lines 403 are located in the middle region of the second circuit area 433 in the first direction D1, and the plurality of third signal lines 403 extend along the second direction D2 to the connector 420 and connect to the connector 420. In an exemplary embodiment, the plurality of third signal lines 403 may be straight lines or broken lines.

[0107] In an exemplary embodiment, the second circuit region 433 has a first region, a second region, and a third region. The first region may be located on the side of the third signal line 403 in the first direction D1 away from the touch driving circuit 410, or on the side of the connector 420 in the first direction D1 away from the touch driving circuit 410. The second region may be located on the side of the third signal line 403 in the first direction D1 close to the touch driving circuit 410, or on the side of the connector 420 in the first direction D1 close to the touch driving circuit 410. The third region may be located on the side of the connector 420 in the second direction D2 away from the touch driving circuit 410.

[0108] In an exemplary embodiment, the bend connecting line 412 includes a first sub-line 421, a zigzag rotor line 422, and a second sub-line 423 connected sequentially. The first sub-line 421 is located in the first region of the second circuit region 433 and can be a straight line or a zigzag line. The first end of the first sub-line 421 serves as the first end of the bend connecting line 412 and connects to the second end of the first connecting line 411 located in the boundary region 404. The second end of the first sub-line 421 extends along the second direction D2 and extends into the third region of the second circuit region 433. The zigzag rotor line 422 is located in the third region of the second circuit region 433 and can be a straight line or a zigzag line. The first end of the zigzag rotor line 422 connects to the second end of the first sub-line 421, and the second end of the zigzag rotor line 422 extends in the opposite direction of the first direction D1. The second sub-line 423 is located in the second region of the second circuit region 433 and can be a straight line or a zigzag line. The first end of the second sub-line 423 is connected to the second end of the folded rotor line 422. The second end of the second sub-line 423 extends to the boundary region 404 in the opposite direction of the second direction D2. The second end of the second sub-line 423 serves as the second end of the turning connection line 412 and is connected to the first end of the second connection line 413 located in the boundary region 404. Since the first sub-line 421 is located to the right of the third signal line 403, the folded rotor line 422 is located below the connector 420, and the second sub-line 423 is located to the left of the third signal line 403, the orthographic projection of the turning connection line 412 on the substrate does not overlap with the orthographic projection of the display signal line 403 on the substrate, nor does it overlap with the orthographic projection of the connector 420 on the substrate. This allows the turning connection line 412 to bypass the display signal line 403 and the connector 420.

[0109] Figure 7 This is a schematic diagram of the film layer structure of a flexible printed circuit board, as an exemplary embodiment of the present disclosure. Figure 6 A sectional view along the AA direction. (e.g.) Figure 6 and Figure 7 As shown, in a plane perpendicular to the plane of the flexible printed circuit board, the main structure of the flexible printed circuit board includes: a first conductive layer 11 disposed on a first substrate 10, a first protective layer 12 disposed on the side of the first conductive layer 11 away from the first substrate 10, a first shielding layer 13 disposed on the side of the first protective layer 12 away from the first substrate 10, a second protective layer 22 disposed on the side of the first substrate 10 away from the first conductive layer 11, and a second shielding layer 23 disposed on the side of the second protective layer 22 away from the first substrate 10, forming a single-layer board structure.

[0110] In an exemplary embodiment, at the end of the second circuit region away from the first circuit region, the flexible printed circuit board further includes a connector 420. The connector 420 is disposed on the side of the first protective layer 12 away from the first substrate 10. The first protective layer 12 has a connector opening that exposes the first conductive layer 11. The connector 420 is disposed within the connector opening so that the terminals of the connector 420 are connected to the first conductive layer 11.

[0111] In an exemplary embodiment, multiple drive signal lines 402 and multiple display signal lines 403 are all located on the first conductive layer 11, achieving optimized wiring of display signal lines and touch signal lines on a flexible printed circuit board with a single-layer board structure, effectively avoiding interference between display signal lines and touch signal lines.

[0112] Figure 8 This is a schematic diagram of the film layer structure of another flexible printed circuit board according to an exemplary embodiment of the present disclosure. Figure 6 A sectional view along the AA direction. (e.g.) Figure 6 and Figure 8 As shown, in a plane perpendicular to the plane of the flexible printed circuit board, the main structure of the flexible printed circuit board includes: a first conductive layer 11 disposed on a first substrate 10, a first protective layer 12 disposed on the side of the first conductive layer 11 away from the first substrate 10, a first shielding layer 13 disposed on the side of the first protective layer 12 away from the first substrate 10, a first adhesive layer 14 disposed on the side of the first substrate 10 away from the first conductive layer 11, a second substrate 20 disposed on the side of the first adhesive layer 14 away from the first substrate 10, a second conductive layer 21 disposed on the side of the second substrate 20 away from the first substrate 10, a second protective layer 22 disposed on the side of the second conductive layer 21 away from the first substrate 10, and a second shielding layer 23 disposed on the side of the second protective layer 22 away from the first substrate 10, forming a double-layer board structure.

[0113] In an exemplary embodiment, at the end of the second circuit region away from the first circuit region, the flexible printed circuit board further includes a connector 420. The connector 420 is disposed on the side of the first protective layer 12 away from the first substrate 10. The first protective layer 12 has a connector opening that exposes the first conductive layer 11. The connector 420 is disposed within the connector opening so that the terminals of the connector 420 are connected to the first conductive layer 11.

[0114] In an exemplary embodiment, multiple display signal lines 403 can be located on the first conductive layer 11, and multiple drive signal lines 402 can be located on the second conductive layer 21. This optimizes the wiring of display signal lines and touch signal lines on a flexible printed circuit board with a double-layer structure, effectively avoiding interference between them. In some possible embodiments, multiple display signal lines 403 can be located on the second conductive layer, and multiple drive signal lines can be located on the first conductive layer.

[0115] In a display touch device, both the display signal lines connecting to the display leads and the touch signal lines connecting to the touch leads are arranged on the same flexible printed circuit board. The display signal lines are introduced to a connector, and the touch signal lines are introduced to a touch driving circuit. The touch signal lines include driving signal lines and sensing signal lines, which are introduced to the flexible printed circuit board from different sides. Since the touch driving circuit is usually located on one side of the flexible printed circuit board and the connector is located on the other side, the driving signal lines or sensing signal lines need to cross the display signal lines to be introduced into the touch driving circuit. Figure 5 As shown by the dashed line 402a. To avoid interference between display signal lines and touch signal lines, flexible printed circuit boards (PCBs) require a multi-layer (≥3-layer) structure, or a two-layer board + bridging structure. In this configuration, display signal lines and touch signal lines are placed on different layers of the PCB, with a shielding layer between them. Research indicates that the multi-layer board structure has drawbacks such as high cost, increased thickness, and reduced product yield, while the two-layer board + bridging structure has drawbacks such as increased thickness at the bridging location and complex bonding processes.

[0116] This exemplary embodiment provides a display touch device that integrates a display structure and a touch structure. By optimizing the wiring of the display signal lines and touch signal lines, interference between the display signal lines and touch signal lines can be effectively avoided when the flexible printed circuit board adopts a single-layer board structure or a two-layer board structure. In the wiring scheme of the exemplary embodiments of this disclosure, while introducing the display signal line from the first circuit area to the second circuit area, one of the drive signal line and the sensing signal line is simultaneously introduced from the first circuit area to the second circuit area. The signal line introduced to the second circuit area bypasses the display signal line and returns to the first circuit area, so that the touch signal line avoids the display signal line. This effectively prevents the touch signal line from crossing the display signal line, which not only effectively avoids mutual interference between the display signal line and the touch signal line, ensuring operational reliability and increasing performance stability, but also allows the flexible printed circuit board to be implemented using a single-layer board structure or a two-layer board structure, avoiding the use of a multi-layer board structure or a two-layer board + bridge structure. On the one hand, this frees up the thickness space of the flexible printed circuit board, effectively reducing the thickness of the flexible printed circuit board, which is conducive to the thinning of the display touch device. On the other hand, it reduces the cost of the flexible printed circuit board, simplifies the difficulty of the bonding process, reduces the risk of defects, and improves the product yield.

[0117] Figure 9 This is a schematic diagram illustrating another flexible printed circuit board bonding connection as an exemplary embodiment of this disclosure. Figure 9 As shown, the structure of the bonding region 200 can be similar to the aforementioned exemplary embodiment. The flexible printed circuit board 400 may include a bonding terminal area 431, a first circuit area 432, and a second circuit area 433. The first circuit area 432 may include a touch driving circuit 410, which is located on the left side of the flexible printed circuit board 400. The second circuit area 433 may include a connector 420, which is located on the right side of the flexible printed circuit board 400. The bonding terminal area 431 may include a first terminal area, a middle terminal area, and a second terminal area. Multiple terminals in the first terminal area are connected to multiple pins in the first pin area, multiple terminals in the middle terminal area are connected to multiple pins in the middle area, and multiple terminals in the second terminal area are connected to multiple pins in the second pin area. The sensing signal line 401 serves as the first signal line, the driving signal line 402 serves as the second signal line, the display signal line 403 serves as the third signal line, the touch driving circuit 410 serves as the driving circuit, and the connector 420 serves as the external connection port.

[0118] In an exemplary embodiment, multiple sensing signal lines 401 are only provided in the first circuit area 432. The first ends of the multiple sensing signal lines 401 are connected to multiple terminals in the first terminal area, and are connected to multiple sensing leads 301 on the left side of the bonding area via the multiple terminals in the first terminal area and the multiple pins in the first pin area. The second ends of the multiple sensing signal lines 401 extend to the touch driving circuit 410 and are connected to the touch driving circuit 410 located in the first circuit area, thus enabling the touch driving circuit 410 to connect with the multiple sensing leads 301 and provide touch sensing signals to the multiple sensing leads 301. In an exemplary embodiment, the sensing signal lines 401 can be straight lines extending along the second direction D2, or they can be broken lines. Since both the first terminal area and the touch driving circuit 410 are located on the left side of the flexible printed circuit board 400, and the multiple sensing signal lines 401 are also located on the left side of the flexible printed circuit board 400, the multiple sensing signal lines 401 and the multiple display signal lines 403 do not overlap in the first circuit area.

[0119] In an exemplary embodiment, drive signal lines 402 are respectively disposed in a first circuit area 432 and a second circuit area 433. The first ends of the multiple drive signal lines 402 are connected to multiple terminals in the second terminal area, and are connected to multiple drive leads 302 in the bonding area via the multiple terminals in the second terminal area and the multiple pins in the second pin area. The second ends of the multiple drive signal lines 402 extend from the first circuit area 432 to the second circuit area 433, bypass multiple display signal lines 403 in the second circuit area, and then extend from the second circuit area 433 to the first circuit area 432, connecting with the touch drive circuit 410 located in the first circuit area. This enables the touch drive circuit 410 to connect with the multiple drive leads 302 in the bonding area, allowing the touch drive circuit 410 to provide touch sensing signals to the multiple drive leads 302. Since the second terminal area and the second circuit area 433 are both located on the right side of the flexible printed circuit board 400, and multiple drive signal lines 402 bypass multiple display signal lines 403, the multiple drive signal lines 402 and the multiple display signal lines 403 do not overlap in the first circuit area and the second circuit area.

[0120] In an exemplary embodiment, multiple display signal lines 403 are respectively disposed in a first circuit area 432 and a second circuit area 433. The first ends of the multiple display signal lines 403 are connected to multiple terminals in the central terminal area, and are connected to multiple display leads 303 in the bonding area via the terminals in the central terminal area and the pins in the central pin area. The second ends of the multiple display signal lines 403 extend from the first circuit area 432 to the second circuit area 433 and are connected to a connector 420 located in the second circuit area. This enables the connector 420 to connect to the multiple display leads 303 in the bonding area, allowing an external control device to provide display signals to the multiple display leads 303 through the connector 420.

[0121] In an exemplary embodiment, the drive signal line 402 may include a first connecting line 411, a bend connecting line 412, and a second connecting line 413 connected in sequence.

[0122] In an exemplary embodiment, the first connecting line 411 is located in the first circuit area 432, and the first end of the first connecting line 411 serves as the first end of the drive signal line 402, correspondingly connected to a plurality of terminals in the second terminal area. The second end of the first connecting line 411 extends to the boundary area 404 between the first circuit area and the second circuit area.

[0123] In an exemplary embodiment, the bend connection line 412 is located in the second circuit area 433. The first end of the bend connection line 412 is connected to the second end of the first connection line 411 located in the boundary area 404. The second end of the bend connection line 412 first extends towards the connector 420, then bypasses the terminal in the connector 420 connected to the display signal line 403 using the in-board connection line, and then extends away from the connector 420 and extends to the boundary area 404 between the first circuit area and the second circuit area.

[0124] In an exemplary embodiment, the second connection line 413 is located in the first circuit area 432. The first end of the second connection line 413 is connected to the second end of the turning connection line 412 located in the boundary area 404. The second end of the second connection line 413 serves as the second end of the drive signal line 402, extends to the touch drive circuit 410, and is connected to the touch drive circuit 410.

[0125] In an exemplary embodiment, the orthographic projection of the display signal line 403 on the substrate and the orthographic projection of the sensing signal line 401 on the substrate do not overlap, the orthographic projection of the display signal line 403 on the substrate and the orthographic projection of the drive signal line 402 on the substrate do not overlap, and the orthographic projection of the sensing signal line 401 on the substrate and the orthographic projection of the drive signal line 402 on the substrate do not overlap.

[0126] Figure 10A schematic diagram of another exemplary embodiment of the bend connection line routing is disclosed. For example... Figure 9 and Figure 10 As shown, the turning connection line 412 located in the second circuit area is configured to form a trace that bypasses the terminal in the connector 420 through the board connection line in the second circuit area 433, so that the drive signal line 402 avoids crossing the display signal line 403, that is, to achieve that the orthographic projection of the drive signal line 402 on the substrate and the orthographic projection of the display signal line 403 on the substrate have no overlapping area.

[0127] In an exemplary embodiment, the second circuit area 433 may be rectangular and disposed on the side of the first circuit area 432 away from the bonding terminal area 431. The connector 420 may be rectangular and disposed at the end of the second circuit area 433 away from the first circuit area 432. A plurality of third signal lines 403 are located in the middle region of the second circuit area 433 in the first direction D1, and the plurality of third signal lines 403 extend along the second direction D2 to the connector 420 and connect to the connector 420. In an exemplary embodiment, the plurality of third signal lines 403 may be straight lines or broken lines.

[0128] In an exemplary embodiment, the second circuit region 433 has a first region, a second region, and a third region. The first region may be located on the side of the third signal line 403 in the first direction D1 away from the touch driving circuit 410, the second region may be located on the side of the third signal line 403 in the first direction D1 close to the touch driving circuit 410, and the third region may be located on the side of the second circuit region 433 away from the first circuit region 432. In an exemplary embodiment, the third region may be located in the area where the connector 420 is located.

[0129] In an exemplary embodiment, the bend connection line 412 includes a first sub-line 421, a bend rotor line 422, and a second sub-line 423 connected sequentially. The first sub-line 421 and the second sub-line 423 can serve as on-board connection lines, and the bend rotor line 422 can serve as an in-board connection line. The first sub-line 421 is located in the first region of the second circuit region 433 and is located on the first film layer. The first end of the first sub-line 421 serves as the first end of the bend connection line 412 and is connected to the second end of the first connection line 411 located in the boundary region 404. The second end of the first sub-line 421 extends along the second direction D2 and extends into the third region of the second circuit region 433. The bend rotor line 422 is located in the third region of the second circuit region 433 and is located on the second film layer, which is a different film layer from the first film layer. The first end of the bend rotor line 422 is connected to the second end of the first sub-line 421 through a connecting post, and the second end of the bend rotor line 422 extends in the opposite direction of the first direction D1 and bypasses multiple terminals in the connector 420 that are connected to the display signal line 403. The second sub-line 423 is located in the second region of the second circuit region 433 and on the first film layer. The first end of the second sub-line 423 is connected to the second end of the folded rotor line 422 via a connecting post. The second end of the second sub-line 423 extends to the boundary region 404 in the opposite direction of the second direction D2. The second end of the second sub-line 423 serves as the second end of the turning connection line 412 and is connected to the first end of the second connection line 413 located in the boundary region 404. Since the first sub-line 421 is located to the right of the third signal line 403, the folded rotor line 422 bypasses multiple terminals in the connector 420 that are connected to the display signal line 403, and the second sub-line 423 is located to the left of the third signal line 403, the orthographic projection of the turning connection line 412 on the substrate and the orthographic projection of the display signal line 403 on the substrate do not overlap, thus enabling the turning connection line 412 to bypass the display signal line 403.

[0130] In an exemplary embodiment, since the folded rotor line 422 is located in a different film layer from the first sub-line 421 and the second sub-line 423, the folded rotor line 422 forms an in-plate connection line. The folded rotor line 422 does not need to completely bypass the connector 420. Even if there is an overlapping area between the orthographic projection of the folded rotor line 422 on the substrate and the orthographic projection of the connector 420 on the substrate, the folded connection line 412 can bypass the display signal line 403.

[0131] Figure 11 This is a schematic diagram of the film layer structure of another flexible printed circuit board according to an exemplary embodiment of the present disclosure. Figure 10 A sectional view along the AA direction. (e.g.) Figure 10 and Figure 11As shown, in a plane perpendicular to the plane of the flexible printed circuit board, the main structure of the flexible printed circuit board includes: a first conductive layer 11 disposed on a first substrate 10, a first protective layer 12 disposed on the side of the first conductive layer 11 away from the first substrate 10, a first shielding layer 13 disposed on the side of the first protective layer 12 away from the first substrate 10, a second protective layer 22 disposed on the side of the first substrate 10 away from the first conductive layer 11, and a second shielding layer 23 disposed on the side of the second protective layer 22 away from the first substrate 10, forming a single-layer board structure.

[0132] In an exemplary embodiment, at the end of the second circuit region on the side away from the first circuit region, the flexible printed circuit board further includes a connector 420 and a reinforcing structure 500.

[0133] In an exemplary embodiment, connector 420 is disposed on the side of the first protective layer 12 away from the first substrate 10. The first protective layer 12 has a connector opening that exposes the first conductive layer 11. Connector 420 is disposed inside the connector opening so that the terminals of connector 420 are connected to the first conductive layer 11.

[0134] In an exemplary embodiment, the reinforcing structure 500 is disposed on the side of the second protective layer 22 away from the first substrate 10. The second protective layer 22 has an opening for the reinforcing structure, which exposes the surface of the first substrate 10 away from the first conductive layer 11. The reinforcing structure 500 is disposed on the first substrate 10 within the opening. In an exemplary embodiment, the reinforcing structure 500 may include: a reinforcing adhesive layer 53 disposed on the side of the first substrate 10 away from the first conductive layer 11; a reinforcing substrate 50 disposed on the side of the reinforcing adhesive layer 53 away from the first substrate 10; a reinforcing conductive layer 51 disposed on the side of the reinforcing substrate 50 away from the first substrate 10; and a reinforcing protective layer 52 disposed on the side of the reinforcing conductive layer 51 away from the first substrate 10. Thus, in a single-layer flexible printed circuit board, a partial two-layer structure is formed by the reinforcing structure 500 disposed in the area where the connector 420 is located.

[0135] In an exemplary embodiment, the reinforcing structure 500 can be used to form an in-plate connecting line of the turning connection line, namely the turning rotor line 422. Figure 12 This is a schematic diagram of the structure of an in-board connection line, which is an exemplary embodiment of the present disclosure. Figure 10 A sectional view along the BB direction. (e.g.) Figure 10 and Figure 12As shown, the first sub-line 421 and the second sub-line 423 are both located in the first conductive layer 11. The display signal line 403 can be located in the first conductive layer 11. The folding rotor line 422 is located in the reinforcing conductive layer 51. The first end of the folding rotor line 422 is connected to the second sub-line 423 through the first connecting post 61, and the second end of the folding rotor line 422 is connected to the first sub-line 421 through the second connecting post 62, so that the first sub-line 421 and the second sub-line 423 are connected through the first connecting post 61, the folding rotor line 422 and the second connecting post 62.

[0136] In an exemplary embodiment, a first via and a second via can be formed in the regions where the first sub-line 421 and the second sub-line 423 are located, respectively, by etching. The first sub-line 421, the first substrate 10, the reinforcing adhesive layer 53, and the reinforcing substrate 50 in the first via are etched away, exposing the surface of the first end of the folding rotor line 422. Similarly, the second sub-line 423, the first substrate 10, the reinforcing adhesive layer 53, and the reinforcing substrate 50 in the second via are etched away, exposing the surface of the second end of the folding rotor line 422. Subsequently, a first connecting post 61 and a second connecting post 62 are formed in the first and second vias, respectively, by electroforming. The lower ends of the first connecting post 61 and the second connecting post 62 are connected to the folding rotor line 422, the upper end of the first connecting post 61 is connected to the second sub-line 423, and the upper end of the second connecting post 62 is connected to the first sub-line 421, forming an in-plate interconnect. In an exemplary embodiment, the first connecting post 61 and the second connecting post 62 can be formed by deposition or other methods; this disclosure is not limited thereto.

[0137] This exemplary embodiment provides a display touch device that integrates a display structure and a touch structure. By optimizing the wiring of the display signal lines and touch signal lines, interference between the display signal lines and touch signal lines can be effectively avoided when the flexible printed circuit board adopts a single-layer board + partial two-layer board structure. In the wiring scheme of the exemplary embodiments of this disclosure, while introducing the display signal line from the first circuit area to the second circuit area, one of the drive signal line and the sensing signal line is simultaneously introduced from the first circuit area to the second circuit area. The signal line introduced to the second circuit area simultaneously bypasses the display signal line through the in-board interconnection line in the partial two-layer board structure and returns to the first circuit area. This allows the touch signal line to avoid the display signal line, effectively preventing the touch signal line from crossing the display signal line. This not only effectively avoids mutual interference between the display signal line and the touch signal line, ensuring operational reliability and increasing performance stability, but also allows the flexible printed circuit board to be implemented using a single-layer board + partial two-layer board structure, avoiding the use of multi-layer board structures or two-layer board + bridging structures. On the one hand, this frees up the thickness space of the flexible printed circuit board, effectively reducing the thickness of the flexible printed circuit board, which is conducive to the thinning of the display touch device. On the other hand, it reduces the cost of the flexible printed circuit board, simplifies the bonding process, reduces the risk of defects, and improves the product yield. Furthermore, the flexible printed circuit board (PCB) adopts a single-layer board + partial two-layer board structure, which not only enables the on-board connection lines to bypass the display signal lines, but also enables structural reinforcement in the area where the connectors are located, thereby improving the working reliability and service life of the flexible PCB.

[0138] Figure 13 This is a schematic diagram of the film layer structure of another flexible printed circuit board according to an exemplary embodiment of the present disclosure. Figure 10 A sectional view along the AA direction. (e.g.) Figure 10 and Figure 13 As shown, in a plane perpendicular to the plane of the flexible printed circuit board, the main structure of the flexible printed circuit board includes: a first conductive layer 11 disposed on a first substrate 10, a first protective layer 12 disposed on the side of the first conductive layer 11 away from the first substrate 10, a first shielding layer 13 disposed on the side of the first protective layer 12 away from the first substrate 10, a first adhesive layer 14 disposed on the side of the first substrate 10 away from the first conductive layer 11, a second substrate 20 disposed on the side of the first adhesive layer 14 away from the first substrate 10, a second conductive layer 21 disposed on the side of the second substrate 20 away from the first substrate 10, a second protective layer 22 disposed on the side of the second conductive layer 21 away from the first substrate 10, and a second shielding layer 23 disposed on the side of the second protective layer 22 away from the first substrate 10, forming a double-layer board structure.

[0139] In an exemplary embodiment, at the end of the second circuit region away from the first circuit region, the flexible printed circuit board further includes a connector 420 and a reinforcing structure 500. In an exemplary embodiment, the connector 420 is disposed on the side of the first protective layer 12 away from the first substrate 10, and the first protective layer 12 has a connector opening that exposes the first conductive layer 11. The connector 420 is disposed within the connector opening so that the terminals of the connector 420 are connected to the first conductive layer 11.

[0140] In an exemplary embodiment, the reinforcing structure 500 is disposed on the side of the second protective layer 22 away from the first substrate 10. The second protective layer 22 has an opening for the reinforcing structure, which exposes the surface of the second conductive layer 21 away from the first substrate 10. The reinforcing structure 500 is disposed on the second conductive layer 21 within the opening. In another exemplary embodiment, the reinforcing structure 500 may include: a reinforcing adhesive layer 53 disposed on the side of the second conductive layer 21 away from the first substrate 10; a reinforcing substrate 50 disposed on the side of the reinforcing adhesive layer 53 away from the first substrate 10; a reinforcing conductive layer 51 disposed on the side of the reinforcing substrate 50 away from the first substrate 10; and a reinforcing protective layer 52 disposed on the side of the reinforcing conductive layer 51 away from the first substrate 10. Thus, in a double-layer flexible printed circuit board, a partial three-layer structure is formed by the reinforcing structure 500 disposed in the area where the connector 420 is located.

[0141] In an exemplary embodiment, the reinforcing structure 500 can be used to form an in-plate connecting line of the bend connection line, namely the folded rotor line 422. For example, the display signal line is located in the first conductive layer 11, and multiple display signal lines are connected to multiple terminals of the connector 420. The first sub-line 421 and the second sub-line 423 in the bend connection line 412 are located in the second conductive layer 21, and the folded rotor line 422 in the bend connection line 412 is located in the reinforcing conductive layer 51. The folded rotor line 422 bypasses multiple terminals in the connector 420 that are connected to the display signal line 403. The two ends of the folded rotor line 422 are connected to the first sub-line 421 and the second sub-line 423 respectively through connecting posts, so that the first sub-line 421 and the second sub-line 423 are connected by connecting posts and the folded rotor line. In this way, outside the connector area, the drive signal line is located in the first conductive layer or the second conductive layer. After the drive signal line reaches the area where the connector is located, the drive signal line 402 is led to the reinforcing conductive layer on the back of the connector. After the drive signal line bypasses other traces and corresponding terminals, it returns from the reinforcing conductive layer to the first conductive layer or the second conductive layer, and finally is introduced into the touch driving circuit. For example, the first sub-line 421 and the second sub-line 423 can be located in the first conductive layer 11, multiple display signal lines can be located in the second conductive layer 21, and the rotor line 422 can be located in the reinforcing conductive layer 51.

[0142] The structures shown in this disclosure are merely illustrative examples, and the structure of the folded rotor wire can be modified according to actual needs; this disclosure does not limit it. For example, an in-plate connection wire, i.e., a folded rotor wire, can be formed using a second conductive layer to create a bend connection line. Figure 8 The double-layer board structure shown can be configured such that the display signal lines and sensing signal lines are located on the first conductive layer, the first connecting line, the second connecting line, and some of the bend connecting lines in the drive signal lines are located on the first conductive layer, and the folded rotor line in the bend connecting lines is located on the second conductive layer. Alternatively, the folded rotor line can be located inside the connector, forming a folded rotor line around multiple connecting terminals in the connector, with both ends of the folded rotor line connected to the first sub-line and the second sub-line, etc.

[0143] This exemplary embodiment provides a display touch device that integrates a display structure and a touch structure. By optimizing the wiring of the display signal lines and touch signal lines, interference between the display signal lines and touch signal lines can be effectively avoided when the flexible printed circuit board adopts a double-layer board + partial triple-layer board structure. In the wiring scheme of the exemplary embodiments of this disclosure, while introducing the display signal line from the first circuit area to the second circuit area, one of the drive signal line and the sensing signal line is simultaneously introduced from the first circuit area to the second circuit area. The signal line introduced to the second circuit area simultaneously bypasses the display signal line through the in-board interconnection line in the local three-layer board structure and returns to the first circuit area. This allows the touch signal line to avoid the display signal line, effectively preventing the touch signal line from crossing the display signal line. This not only effectively avoids mutual interference between the display signal line and the touch signal line, ensuring operational reliability and increasing performance stability, but also allows the flexible printed circuit board to be implemented using a double-layer board + local three-layer board structure, avoiding the use of multi-layer board structures or two-layer board + bridging structures. On the one hand, this frees up the thickness space of the flexible printed circuit board, effectively reducing the thickness of the flexible printed circuit board, which is conducive to the thinning of the display touch device. On the other hand, it reduces the cost of the flexible printed circuit board, simplifies the difficulty of the bonding process, reduces the risk of defects, and improves the product yield. Furthermore, the flexible printed circuit board adopts a double-layer board + partial triple-layer board structure, which not only enables the internal connection lines to bypass the display signal lines, but also enables structural reinforcement in the area where the connectors are located, thereby improving the working reliability and service life of the flexible printed circuit board.

[0144] The accompanying drawings in this application only illustrate the structures involved in this disclosure; other structures can be referred to in common design. Unless otherwise specified, embodiments of this disclosure, i.e., features within the embodiments, can be combined with each other to obtain new embodiments.

[0145] Those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions disclosed herein without departing from the spirit and scope of the technical solutions disclosed herein, and all such modifications and substitutions should be covered within the scope of the claims of this application.

Claims

1. A flexible printed circuit board, comprising a bonding terminal area, a first circuit area located on one side of the bonding terminal area, and a second circuit area located on the side of the first circuit area away from the bonding terminal area; the bonding terminal area includes a plurality of terminals, the first circuit area includes a driving circuit, a plurality of first signal lines, a plurality of second signal lines, and a plurality of third signal lines, and the second circuit area includes an external connection port; the first ends of the plurality of first signal lines, the plurality of second signal lines, and the plurality of third signal lines are respectively connected to the plurality of terminals of the bonding terminal area, the second ends of the plurality of first signal lines and the plurality of second signal lines are respectively connected to the driving circuit, and the second ends of the plurality of third signal lines are connected to the external connection port; the orthographic projections of the plurality of first signal lines and the plurality of second signal lines on the plane of the flexible printed circuit board have no overlapping area with the orthographic projections of the plurality of third signal lines on the plane of the flexible printed circuit board; in, The multiple terminals in the bonding terminal area are arranged along a first direction. Along the first direction, the bonding terminal area includes a first terminal area, a middle terminal area, and a second terminal area arranged sequentially. Along the first direction, the second circuit area is located on the side away from the first terminal area. The second ends of the multiple third signal lines extend from the first circuit area to the second circuit area and are connected to the external connection port. The second ends of the multiple second signal lines extend from the first circuit area to the second circuit area, and after bypassing the third signal lines, extend from the second circuit area to the first circuit area and are connected to the drive circuit.

2. The flexible printed circuit board according to claim 1, wherein, Multiple terminals in the first terminal area are connected to the first ends of the multiple first signal lines, multiple terminals in the second terminal area are connected to the first ends of the multiple second signal lines, and multiple terminals in the middle terminal area are connected to the first ends of the multiple third signal lines.

3. The flexible printed circuit board according to claim 2, wherein, Along the first direction, the driving circuit is located on the side close to the first terminal area, the plurality of first signal lines are located in the first circuit area, and the second ends of the plurality of first signal lines are connected to the driving circuit.

4. The flexible printed circuit board according to claim 3, wherein, The second signal line includes a first connecting line, a bend connecting line, and a second connecting line connected in sequence; the first connecting line is located in the first circuit area, and its first end is connected to a terminal in the second terminal area, and its second end extends to the boundary area between the first circuit area and the second circuit area; the bend connecting line is located in the second circuit area, and its first end is connected to the second end of the first connecting line, and its second end extends beyond the third signal line to the boundary area between the first circuit area and the second circuit area; the second connecting line is located in the first circuit area, and its first end is connected to the second end of the bend connecting line, and its second end is connected to the driving circuit.

5. The flexible printed circuit board according to claim 4, wherein, The bend connection line includes a first sub-line, a folded rotor line, and a second sub-line connected in sequence. The first sub-line is located on the side of the third signal line away from the driving circuit. The first end of the first sub-line is connected to the second end of the first connection line located in the boundary area. The second end of the first sub-line extends towards the external connection port and is connected to the first end of the folded rotor line. The second sub-line is located on the side of the third signal line close to the driving circuit. The first end of the second sub-line is connected to the second end of the folded rotor line. The second end of the second sub-line extends towards the boundary area and is connected to the first end of the second connection line located in the boundary area. The folded rotor line is located on the side of the external connection port away from the first circuit area. The folded rotor line bypasses the external connection port or bypasses the terminal in the external connection port connected to the third signal line.

6. The flexible printed circuit board according to claim 5, wherein, In a plane perpendicular to the plane of the flexible printed circuit board, the flexible printed circuit board includes: a first conductive layer disposed on a first substrate, a first protective layer disposed on the side of the first conductive layer away from the first substrate, and a second protective layer disposed on the side of the first substrate away from the first conductive layer; the first sub-line, the folded rotor line, and the second sub-line are all located on the first conductive layer.

7. The flexible printed circuit board according to claim 5, wherein, In a plane perpendicular to the plane of the flexible printed circuit board, the flexible printed circuit board includes: a first conductive layer disposed on a first substrate, a first protective layer disposed on the first conductive layer away from the first substrate, a first adhesive layer disposed on the first substrate away from the first conductive layer, a second substrate disposed on the first adhesive layer away from the first substrate, a second conductive layer disposed on the second substrate away from the first substrate, and a second protective layer disposed on the second conductive layer away from the first substrate; the first sub-line, the folded rotor line, and the second sub-line are all located on the first conductive layer, or the first sub-line, the folded rotor line, and the second sub-line are all located on the second conductive layer.

8. The flexible printed circuit board according to claim 5, wherein, In a plane perpendicular to the plane of the flexible printed circuit board, the flexible printed circuit board includes: a first conductive layer disposed on a first substrate, a first protective layer disposed on the first conductive layer away from the first substrate, and a second protective layer disposed on the first substrate away from the first conductive layer; at the end of the second circuit area away from the first circuit area, a reinforcing structure opening is provided on the second protective layer, and a reinforcing structure is disposed within the reinforcing structure opening; the reinforcing structure includes: a reinforcing adhesive layer disposed on the first substrate away from the first conductive layer, a reinforcing substrate disposed on the reinforcing adhesive layer away from the first substrate, a reinforcing conductive layer disposed on the reinforcing substrate away from the first substrate, and a reinforcing protective layer disposed on the reinforcing conductive layer away from the first substrate; the first sub-line and the second sub-line are both located on the first conductive layer, the folding rotor line is located on the reinforcing conductive layer, and the folding rotor line is connected to the first sub-line and the second sub-line respectively through connecting posts.

9. The flexible printed circuit board according to claim 5, wherein, In a plane perpendicular to the plane of the flexible printed circuit board, the flexible printed circuit board includes: a first conductive layer disposed on a first substrate; a first protective layer disposed on the side of the first conductive layer away from the first substrate; a first adhesive layer disposed on the side of the first substrate away from the first conductive layer; a second substrate disposed on the side of the first adhesive layer away from the first substrate; a second conductive layer disposed on the side of the second substrate away from the first substrate; and a second protective layer disposed on the side of the second conductive layer away from the first substrate. At the end of the second circuit region on the side away from the first circuit region, a reinforcing structure opening is provided on the second protective layer, and a reinforcing structure is disposed within the reinforcing structure opening; the reinforcing structure includes... The system comprises: a reinforcing adhesive layer disposed on the side of the second conductive layer away from the second substrate; a reinforcing substrate disposed on the side of the reinforcing adhesive layer away from the second substrate; a reinforcing conductive layer disposed on the side of the reinforcing substrate away from the second substrate; and a reinforcing protective layer disposed on the side of the reinforcing conductive layer away from the second substrate. The first sub-line and the second sub-line are both located on the first conductive layer, and the folding rotor line is located on the reinforcing conductive layer. The folding rotor line is connected to the first sub-line and the second sub-line respectively via connecting posts. Alternatively, the first sub-line and the second sub-line are both located on the second conductive layer, and the folding rotor line is located on the reinforcing conductive layer. The folding rotor line is connected to the first sub-line and the second sub-line respectively via connecting posts.

10. The flexible printed circuit board according to any one of claims 6 to 9, wherein, The external connection port includes a connector; at the end of the second circuit area away from the first circuit area, a connector opening is provided on the first protective layer, and the connector is disposed in the connector opening.

11. A display touch device, comprising a touch display panel and a flexible printed circuit board as described in any one of claims 1 to 10, wherein the touch display panel includes an effective area and a bonding area located on one side of the effective area, the bonding area includes a bonding pin area, the bonding pin area includes a plurality of pins, and a plurality of terminals in the bonding terminal area of ​​the flexible printed circuit board are correspondingly connected to the plurality of pins in the bonding pin area.

12. The display touch device according to claim 11, wherein, The multiple pins of the bonding pin area are arranged along a first direction. Along the first direction, the bonding pin area includes a first pin area, a middle pin area, and a second pin area arranged sequentially. Multiple terminals in the first terminal area are connected to multiple pins in the first pin area, multiple terminals in the second terminal area are connected to multiple pins in the second pin area, and multiple terminals in the middle terminal area are connected to multiple pins in the middle pin area.

13. The display touch device according to claim 12, wherein, The bonding area also includes multiple sensing leads, multiple driving leads, and multiple display leads. The multiple sensing leads are connected to multiple pins in the first pin area, the multiple driving leads are connected to multiple pins in the second pin area, and the multiple display leads are connected to multiple pins in the central pin area.

14. The display touch device according to any one of claims 11 to 13, wherein, The driving circuit includes a touch driving circuit, and the connector includes a board-to-board connector.

Citation Information

Patent Citations

  • Display device and circuit board assembly

    CN211044880U