Protective film forming sheet, method for manufacturing chip with protective film, and laminate

Abstract

The protective film forming sheet of the present application is provided with a support sheet and a curable resin film provided on one side of the support sheet, the curable resin film being a resin film for forming a protective film on a wafer by being attached to a face of the wafer having a convex electrode and being cured, the support sheet having a first region provided with the curable resin film and a second region surrounding the first region and not provided with the curable resin film on the one side of the support sheet.

Description

TECHNICAL FIELD

[0001] The present application relates to a protective film forming sheet, a method for manufacturing a chip with a protective film, and a laminate.

[0002] This application claims priority based on Japanese Patent Application No. 2020-031717 filed on February 27, 2020, and the contents thereof are incorporated herein. BACKGROUND

[0003] Conventionally, when a multi-pin LSI package (large scale integrated circuit package) for an MPU (microprocessor) or a gate array or the like is mounted on a printed wiring board, a flip chip mounting method is employed in which, as a chip, a chip having convex electrodes (also referred to as "bumps") composed of eutectic solder, high-temperature solder, gold, or the like formed on a connection pad portion of the chip is used, and these convex electrodes are brought into contact with corresponding terminal portions on a substrate for mounting the chip by a so-called face down method, and are fusion / diffusion soldered.

[0004] The chip used in this mounting method can be obtained by singulating a wafer on which the convex electrodes are formed on a circuit surface. And, in this process, for the purpose of protecting the circuit surface and the convex electrodes of the wafer, a curable resin film is usually attached to the circuit surface, and the resin film is cured, thereby forming a protective film on the circuit surface. The curable resin film is used in a state as a protective film forming sheet that is a laminate with a support sheet. For the protective film forming sheet, a curable resin film is provided on the entire surface of one side of the support sheet.

[0005] For example, for the curable resin film in the protective film forming sheet, the curable resin film is attached to the circuit surface of the wafer while being heated, and then the curable resin film is cut together with the support sheet along the outer periphery of the wafer, the region of the protective film forming sheet that is not attached to the wafer is removed, and then the support sheet is peeled off to remove the support sheet. Next, the curable resin film is cured to form a protective film on the circuit surface of the wafer. Next, the wafer is divided to singulate the wafer into chips, and the protective film is cut along the outer periphery of the chips, thereby obtaining a chip with a protective film in which the cut protective film is provided on the circuit surface of the chip (see Patent Document 1).

[0006] PRIOR ART DOCUMENTS

[0007] PATENT DOCUMENTS

[0008] Patent Document 1: International Publication No. 2017 / 077957 SUMMARY

[0009] Technical problems to be solved by the present application

[0010] For the above-mentioned curable resin film, in order to sufficiently tightly adhere it to the face of the wafer having a convex electrode (circuit face) when it is attached to the wafer, a relatively soft material is used. However, when the curable resin film heated to be soft is attached to the wafer, the following problems occur.

[0011] When the curable resin film in the state heated is attached to the face of the wafer having a convex electrode, a pressure is applied to the curable resin film. The curable resin film is usually used in the state of a protective film forming sheet as a laminate with a support sheet, and such a pressure is transmitted to the curable resin film via the support sheet. In this way, the pressure causes the curable resin film to flow in the direction toward the outside in the radial direction of the wafer, that is, from the region attached to the wafer toward the region not attached to the wafer. Consequently, since the curable resin film flows in the direction from the curable resin film to the wafer in the direction orthogonal to the radial direction of the wafer, the thickness of the curable resin film becomes thicker in the region of the curable resin film not attached to the wafer, particularly in the region near the wafer, than in the region attached to the wafer.

[0012] In this way, the region where the curable resin film becomes thick is a redundant portion, and in any manufacturing process of a chip with a protective film, it adheres to the side surface of the wafer or any portion of the manufacturing apparatus of the chip with a protective film, and contaminates them.

[0013] An object of the present application is to provide a protective film forming sheet which is a protective film forming sheet provided with a resin film for forming a protective film on a face of a wafer having a convex electrode by being attached to the face and being cured, and which is capable of suppressing the resin film from forming a region where the thickness becomes thick due to flow when the resin film is attached to the face of the wafer having a convex electrode.

[0014] Technical means for solving the technical problem

[0015] The present application adopts the following configuration.

[0016] (1). A protective film forming sheet which is a protective film forming sheet provided with a support sheet and a curable resin film provided on a face of one side of the support sheet, wherein the curable resin film is a resin film for forming a protective film on a face of a wafer having a convex electrode by being attached to the face of the wafer and being cured, and the support sheet has, on the face of the one side thereof, a first region where the curable resin film is provided and a second region which surrounds the first region and in which the curable resin film is not provided.

[0017] (2). The protective film forming sheet according to (1), wherein a test piece of the curable resin film having a diameter of 25 mm and a thickness of 1 mm is strained under conditions of a temperature of 90°C and a frequency of 1 Hz, the storage modulus of the test piece is measured, and when the storage modulus of the test piece at a strain of 1% is set as Gcl and the storage modulus of the test piece at a strain of 300% is set as Gc300, an X value calculated by the following formula is 19 or more and less than 10,000.

[0018] X = Gcl / Gc300

[0019] (3). The protective film forming sheet according to (1) or (2), wherein the thickness of the curable resin film is 25 μm or more.

[0020] (4). The protective film forming sheet according to any one of (1) to (3), wherein the maximum value of the width of the curable resin film is 140 to 150 mm, 190 to 200 mm, 290 to 300 mm, or 440 to 450 mm.

[0021] (5). The protective film forming sheet according to any one of (1) to (4), wherein the support sheet is circular.

[0022] (6). The protective film forming sheet according to (5), wherein the support sheet is an adhesive sheet, or the support sheet has an adhesive layer for a jig along the outer peripheral portion thereof.

[0023] (7). The protective film forming sheet according to any one of (1) to (4), wherein the support sheet is a release film.

[0024] (8). The protective film forming sheet according to any one of (1) to (7), wherein a groove as a division site of the wafer is formed on the face of the wafer.

[0025] (9). A method for manufacturing a chip with a protective film, comprising: a step of attaching the curable resin film of any one of the protective film forming sheets according to (1) to (8) to a face of a wafer having a convex electrode while heating the curable resin film; a step of forming a protective film on the face of the wafer by curing the curable resin film after the attachment; and a step of obtaining a chip with a protective film by dividing the wafer after the formation of the protective film and cutting the protective film, the chip with a protective film being provided with a chip and the protective film provided to the chip after the cutting.

[0026] (10) The method for manufacturing a chip with a protective film according to (9), wherein, as the wafer, a wafer whose planar area of the face is equal to or greater than the area of the adhered face of the cured resin film adhered to the wafer is used, and, in the adhering step, the entire face of the adhered face of the cured resin film is adhered to the face of the wafer.

[0027] (11) The method for manufacturing a chip with a protective film according to (9) or (10), wherein a groove serving as a division site of the wafer is formed on the face of the wafer, and, in the adhering step, the cured resin film is filled into the groove when the cured resin film is adhered to the face of the wafer.

[0028] (12) The method for manufacturing a chip with a protective film according to any one of (9) to (11), wherein, in the adhering step, the cured resin film is adhered to the face of the wafer using a roller.

[0029] (13) A laminate obtained by forming a thermosetting resin film on a peeling treatment face of a release film, and processing the thermosetting resin film into a circular shape together with the release film, adhering the entire face of the thermosetting resin film on the side opposite to the side provided with the release film to the surface of a back-grinding tape in a band shape, thereby obtaining the laminate.

[0030] (14) A laminate provided with a release film, a thermosetting resin film provided on a peeling treatment face on one side of the release film, and a back-grinding tape provided on a face of the thermosetting resin film on the side opposite to the side of the release film, the planar shape of the release film and the planar shape of the thermosetting resin film are each a circular shape, the release film and the thermosetting resin film are arranged in a manner that the positions of the outer peripheral portions in the radial directions of the release film and the thermosetting resin film coincide with each other, and the back-grinding tape is in a band shape.

[0031] Effects of the Invention

[0032] Figure 1A cross-sectional view for illustratively explaining a technical problem to be solved by the present application. Generally, in a region 622 near the periphery portion in the region of the curable resin film 62 not attached to the wafer 9, there is a region lower in temperature than the region 621 of the curable resin film 62 attached to the wafer 9 and the region 620 near the wafer 9 not attached to the wafer 9. The reason for this is as follows. That is, the region 621 of the curable resin film 62 attached to the wafer 9 is generally heated with the heated wafer 9 as a heat source in a manner such as described later, and the heat easily conducts to the region 621 and the region 620, thereby causing the temperature to rise, but the heat does not easily conduct to the region 622 near the periphery portion away from the wafer 9. Therefore, the curable resin film 62 easily flows in the region 621 attached to the wafer 9 and the region 620 near the wafer 9 not attached to the wafer 9, but the flowability is low in the region 622 of the curable resin film 62 near the periphery portion lower in temperature, and the curable resin film 62 flowing thereto is likely to accumulate. Therefore, as described above, the phenomenon that the thickness of the curable resin film 62 becomes thicker in the region of the curable resin film 62 not attached to the wafer 9, particularly in the region 620 near the wafer 9, than in the region 621 attached to the wafer 9 becomes more noticeable.

[0033] To this end, by using the protective film forming sheet of the present application, it is possible to make the region of the curable resin film not attached to the wafer narrow or disappear when the curable resin film in the protective film forming sheet is attached to the face of the wafer having a convex electrode, it is possible to reduce the amount of the curable resin film flowing, and therefore, it is possible to suppress the region where the thickness of the curable resin film formed becomes thick. Further, since the low-temperature region becomes non-existent in the region near the periphery portion of the curable resin film described above, it is possible to more highly suppress the region where the thickness of the curable resin film formed becomes thick.

[0034] According to the method for manufacturing a wafer with a protective film of the present application, by manufacturing a wafer with a protective film using the protective film forming sheet described above, it is possible to suppress the side surface of the wafer or any portion of the manufacturing apparatus of the wafer with a protective film from being contaminated by the excess portion of the curable resin film adhering thereto. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 A cross-sectional view for illustratively explaining a technical problem to be solved by the present application.

[0036] Figure 2 A plan view for illustratively showing one example of a protective film forming sheet of one embodiment of the present application.

[0037] Figure 3 A cross-sectional view of the protective film forming sheet shown in FIG. 1 taken along line I-I. Figure 2

[0038] ​Figure 4 A plan view for schematically showing another other example of the protective film forming sheet of one embodiment of the present application.

[0039] Figure 5 A plan view for schematically showing another other example of the protective film forming sheet of one embodiment of the present application.

[0040] Figure 6A A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application.

[0041] Figure 6B A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application.

[0042] Figure 6C A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application.

[0043] Figure 6D A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application.

[0044] Figure 6E A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application.

[0045] Figure 7A A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application.

[0046] Figure 7B A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application.

[0047] Figure 7C A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application.

[0048] Figure 7D A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application.

[0049] Figure 7E A cross-sectional view for schematically showing one example of a method for manufacturing a chip with a protective film of one embodiment of the present application. DETAILED DESCRIPTION

[0050] <<Protective film forming sheet>>

[0051] The protective film forming sheet of one embodiment of the present application includes a support sheet and a cured resin film provided on one side of the support sheet, the cured resin film being a resin film for forming a protective film on a wafer by being attached to a surface of the wafer having a convex electrode and being cured, and the support sheet has a first region in which the cured resin film is provided on the one side of the support sheet, and a second region surrounding the first region and in which the cured resin film is not provided.

[0052] The protective film forming sheet of the present embodiment can suppress a region in which the cured resin film is not attached to the wafer and the thickness is thick when the cured resin film of the protective film forming sheet is attached to a surface of a wafer having a convex electrode, by having the first region and the second region in the support sheet.

[0053] The protective film forming sheet of the present embodiment will be described below with reference to drawings.

[0054] Figure 2 FIG. 1 schematically shows a plan view of one example of a protective film forming sheet of the present embodiment, Figure 3 Figure 2 FIG. 2 schematically shows a cross-sectional view at line I-I of the protective film forming sheet shown in FIG. 1.

[0055] In the following description, for easier understanding of the features of the present application, important parts are sometimes shown enlarged for convenience, but the dimensional proportions and the like of the respective components are not necessarily the same as in actuality.

[0056] In the following description, for easier understanding of the features of the present application, important parts are sometimes shown enlarged for convenience, but the dimensional proportions and the like of the respective components are not necessarily the same as in actuality. Figure 3 In the following description, for easier understanding of the features of the present application, important parts are sometimes shown enlarged for convenience, but the dimensional proportions and the like of the respective components are not necessarily the same as in actuality.

[0057] The protective film forming sheet 1 shown here includes a support sheet 11 and a cured resin film 12 provided on one side of the support sheet 11.

[0058] The support sheet 11 has a first region 111a in which the cured resin film 12 is provided on the one side of the support sheet 11, i.e., the side of the cured resin film 12, and a second region 112a surrounding the first region 111a and in which the cured resin film 12 is not provided. That is, on the support sheet 11, the entire region of the first region 111a is covered with the cured resin film 12, whereas the entire region of the second region 112a is not covered with the cured resin film 12.

[0059] It is preferable that the second region 112a on the one side of the support sheet 11 be exposed (be an exposed surface).

[0060] ​The curable resin film is a resin film for forming a protective film on a wafer having a convex electrode by attaching to a face of the wafer having a convex electrode and curing.

[0061] In the present specification, as the "wafer", a semiconductor wafer composed of silicon, germanium, selenium, or the like; GaAs, GaP, InP, CdTe, ZnSe, SiC, or the like can be exemplified. Further, an insulator wafer composed of sapphire, glass, or the like can be exemplified.

[0062] A circuit is formed on one side face of the wafer, and in the present specification, the one side face of the wafer on which the circuit is formed is referred to as the "circuit face". Further, the face of the wafer on the opposite side of the circuit face is referred to as the "back face". The face of the wafer having a convex electrode is synonymous with the circuit face.

[0063] The wafer is divided into chips by cutting or the like. In the present specification, as in the case of the wafer, the face of the chip on which the circuit is formed is referred to as the "circuit face", and the face of the chip on the opposite side of the circuit face is referred to as the "back face".

[0064] It is preferable that the circuit face of the wafer and the circuit face of the chip each be provided with a convex electrode such as a bump or a pillar. The convex electrode is preferably composed of solder.

[0065] The support sheet 11 supports the curable resin film 12. As the support sheet 11, more specifically, for example, a support sheet composed only of a substrate having the above-described support function; a release film; an adhesive sheet capable of being attached to a wafer when the back face of the wafer is polished and used can be exemplified. The adhesive sheet can also be provided with a jig such as a ring-shaped frame attached to the peripheral portion thereof. Further, by making the support sheet 11 the release film, the protective film formation sheet can sometimes be easily manufactured in the manner described later.

[0066] The planar shape of the support sheet 11, that is, the shape of the one side face 11a is circular. For example, when the support sheet 11 is an adhesive sheet, or as described later, has an adhesive layer for a jig along the outer peripheral portion thereof, it is particularly preferable to make the planar shape of the support sheet 11 circular as described above. The reason for this is that the planar shape of such a support sheet 11 matches the shape of the inner periphery of a jig such as a ring-shaped frame which is usually circular, and it is not necessary to cut the support sheet 11 after attachment to the jig such as a ring-shaped frame.

[0067] The planar shape of the curable resin film 12, that is, the shape of the face 12a on the opposite side of the support sheet 11 side is circular. In addition, in order to recognize or align the crystal orientation, a positioning edge or a positioning groove is sometimes provided on the wafer, so that the shape of the wafer is sometimes not a perfect circle, but the curable resin film 12 can also be provided with a planar shape matching therewith.

[0068] When the protective film forming sheet 1 is viewed from the upper side of the cured resin film 12 of the protective film forming sheet 1, the support sheet 11 and the cured resin film 12 are arranged in a concentric manner with the centers of both aligned.

[0069] The maximum value of the width (i.e., diameter D 11 ) of the support sheet 11 is larger than the maximum value of the width (i.e., diameter D 12 ) of the cured resin film 12.

[0070] The planar shape and size of the first region 111a of the support sheet 11 are the same as those of the cured resin film 12, and are circular with a diameter of D 12 .

[0071] The planar shape of the second region 112a of the support sheet 11 is a circular ring with a width of (D 11 -D 12 ) / 2.

[0072] The area of the surface 12a of the cured resin film 12 on the side opposite to the side of the support sheet 11 (i.e., the area of the first region 111a of the support sheet 11) is preferably equal to or smaller than the area of the back surface of the wafer (i.e., the planar area of the surface of the wafer having the convex electrodes) that is the attachment target of the cured resin film 12. By selecting such a cured resin film 12, the amount of protrusion of the cured resin film 12 on the second region 112a of the support sheet 11 can be further reduced when the cured resin film 12 in the protective film forming sheet 1 is attached to the surface of the wafer having the convex electrodes, and as a result, the region in which the cured resin film 12 is not attached to the wafer and the thickness is thickened can be further suppressed.

[0073] The maximum value (diameter) D 12 of the width of the cured resin film 12 is preferably equal to or smaller than the maximum diameter (e.g., diameter) of the wafer that is the attachment target of the cured resin film 12.

[0074] As the wafer having a circular planar shape, for example, there are wafers having a diameter of 6 inches, 8 inches, 12 inches, and 18 inches. As a preferred example of the cured resin film 12 having any one of these wafers as the attachment target, for example, there can be mentioned a cured resin film having a maximum value (diameter) D 12 of the width of 140 to 150 mm, 190 to 200 mm, 290 to 300 mm, or 440 to 450 mm.

[0075] The width ((D 11 -D 12 ) / 2) of the second region 112a on the surface 11a of the support sheet 11 on the side is preferably the maximum value (D 12), more preferably 0.05 to 0.4 times, and more preferably 0.07 to 0.3 times, of the width of the second region 112a. By setting the width of the second region 112a to be greater than the lower limit, when the support sheet 11 is an adhesive sheet or has the jig adhesive layer, the possibility of the curable resin film 12 contacting the jig, such as a ring frame, when the support sheet 11 is attached to the jig can be reduced. By setting the width of the second region 112a to be less than the upper limit, the area of ​​the second region 112a can be prevented from becoming excessively large.

[0076] The surface of the wafer having the protruding electrodes, to which the curable resin film 12 is attached, may also have grooves formed thereon. These grooves serve as the wafer division sites when the wafer is divided into individual chips. Specifically, the curable resin film 12 may be a resin film that is attached to the surface of the wafer having the protruding electrodes and cured to form a protective film on the surface of the wafer, wherein the surface further has grooves formed thereon to serve as the wafer division sites.

[0077] The grooves are formed on the surface of the wafer having the protruding electrodes in a form corresponding to the size and shape of the target chip.

[0078] For example, by grinding the surface (back side) opposite to the surface having the convex electrodes on which the grooves are formed until the grooves appear, chips separated along the grooves can be obtained. At this time, due to the application of the curable resin film 12, the grooves are filled with the curable resin film 12. As a result, if the grooves are filled with the cured product of the curable resin film 12, i.e., the protective film, after obtaining the chips, the protective film between the chips can be cut to obtain chips with protective films not only on the surface having the convex electrodes but also on the four side surfaces. Chips with protected side surfaces can achieve a higher protective effect from the protective film.

[0079] The support sheet 11 and the curable resin film 12 may each be composed of a single layer (monolayer) or a plurality of layers of two or more. When the support sheet 11 or the curable resin film 12 is composed of multiple layers, these multiple layers may be the same as or different from each other, and the combination of these multiple layers is not particularly limited.

[0080] In this specification, not limited to the case of the support sheet 11 and the curable resin film 12, "multiple layers may be the same as or different from each other" means "all layers may be the same, all layers may be different, or only some layers may be the same", and further "multiple layers may be different from each other" means "at least one of the constituent materials and thicknesses of each layer is different from each other".

[0081] Thickness T of the curable resin film 12 12There is no particular limitation, but it is preferably 10 μm or more, more preferably 20 μm or more, and further preferably 25 μm or more. By making T 12 As shown above, above a certain value, it is possible to more highly fill the trench with the curable resin film 12 without gaps when the curable resin film 12 is attached to the face of the wafer having the convex electrode and the trench formed therein. Further, it is possible to more highly cover the base portion of the vicinity of the circuit face of the convex electrode of the wafer without gaps. That is, the curable resin film 12 becomes more advantageous in terms of filling the trench and covering the base portion of the convex electrode.

[0082] The thickness T of the curable resin film 12 12 The upper limit value of T is not particularly limited. For example, from the viewpoint of avoiding making the thickness of the curable resin film 12 too thick, T 12 It is preferably 200 μm or less, more preferably 130 μm or less, and further preferably 80 μm or less.

[0083] In the present specification, the "thickness of the curable resin film" refers to the thickness of the entire curable resin film, and for example, the thickness of a curable resin film composed of a plurality of layers refers to the total thickness of all the layers that constitute the curable resin film.

[0084] For the protective film forming sheet 1, it is preferable that, under the condition where the temperature is 90°C and the frequency is 1 Hz, a test piece of the curable resin film 12 having a diameter of 25 mm and a thickness of 1 mm is strained, the storage modulus of the test piece is measured, and when the storage modulus of the test piece at a strain of 1% of the test piece is set as Gc1 and the storage modulus of the test piece at a strain of 300% of the test piece is set as Gc300, the X value calculated by the following equation is 19 or more and less than 10,000. Such a curable resin film 12 is soft in texture and is suitable for use in attaching to an attachment target having a concave-convex face such as a face of a wafer having a convex electrode of the wafer and the trench.

[0085] X = Gc1 / Gc300

[0086] The test piece is in a film shape, and the planar shape thereof is circular.

[0087] The test piece can be a single layer of the curable resin film 12 having a thickness of 1 mm, but in terms of ease of production, it is preferable to be a laminated film composed of a plurality of single layers of the curable resin film 12 each having a thickness of less than 1 mm.

[0088] The thickness of the plurality of single layers of the curable resin film 12 that constitute the laminated film can all be the same, all be different, or only some of them can be the same, but in terms of ease of production, it is preferable that they all be the same.

[0089] In the present specification, the "storage modulus of a test piece" means the storage modulus of a test piece corresponding to a strain when a test piece of a cured resin film having a diameter of 25 mm and a thickness of 1 mm is strained at a temperature of 90°C and a frequency of 1 Hz, and is not limited to Gc1 and Gc300.

[0090] When the cured resin film 12 is attached to the face of the wafer having the convex electrodes, the upper portions of the convex electrodes protrude through the cured resin film 12. Also, the cured resin film 12 extends between the convex electrodes in a manner so as to cover the convex electrodes, and covers the surfaces of the convex electrodes, particularly the surfaces of the vicinity of the face of the wafer having the convex electrodes, while closely adhering to the face of the wafer having the convex electrodes, and buries the base portions of the convex electrodes. In this state, the cured resin film 12 can be inhibited from remaining on the upper portions of the convex electrodes. Therefore, the protective film 12' which is a cured product of the cured resin film 12 can also be inhibited from adhering to the upper portions of the convex electrodes. Further, when the grooves are formed on the face, the degree of strain of the cured resin film 12 greatly differs between an intermediate stage at which the cured resin film 12 starts to intrude into the grooves and a final stage at which the cured resin film 12 covers the base portions of the convex electrodes and sufficiently fills the grooves. More specifically, the strain of the cured resin film 12 is large at the intermediate stage, and the strain of the cured resin film 12 is small at the final stage.

[0091] For the cured resin film 12, by adopting Gc1 as the storage modulus when the strain is small, adopting Gc300 as the storage modulus when the strain is large, and setting the value X (=Gc1 / Gc300) to be 19 or more and less than 10,000 in a manner such that Gc1 is higher and Gc300 is lower, the excellent effects described above can be achieved.

[0092] In terms of further improving the effect of the cured resin film 12 covering the base portions of the convex electrodes, the value X is preferably 5,000 or less, more preferably 2,000 or less, further preferably 1,000 or less, particularly preferably 500 or less, for example, any of 300 or less, 100 or less, and 70 or less.

[0093] In terms of further improving the effect of inhibiting the cured resin film 12 from remaining on the upper portions of the convex electrodes and the effect of the cured resin film 12 sufficiently filling the grooves, the value X is preferably 25 or more, more preferably 30 or more, further preferably 40 or more, particularly preferably 50 or more, for example, can be 60 or more.

[0094] For the cured resin film 12, Gc1 is not particularly limited as long as the value X is 19 or more and less than 10,000.

[0095] However, in terms of easily increasing the value of X, Gc1 is preferably 1 x 10 4 ~ 1 x 10 6 Pa, more preferably 3 x 10 4 ~ 7 x 10 5 Pa, further preferably 5 x 10 4 ~ 5 x 10 5 Pa.

[0096] For the curable resin film 12, Gc300 is not particularly limited as long as it can make the value of X 19 or more and less than 10,000.

[0097] However, in terms of further improving the effect of making the curable resin film 12 sufficiently fill the groove, Gc300 is preferably less than 15,000 Pa, more preferably 10,000 Pa or less, further preferably 5,000 Pa or less, particularly preferably 4,000 Pa or less, and for example, can be 3,500 Pa or less.

[0098] In terms of further improving the effect of the curable resin film 12 covering the base of the convex electrode, Gc300 is preferably 100 Pa or more, more preferably 500 Pa or more, further preferably 1,000 Pa or more.

[0099] For the curable resin film 12, it is preferable that both Gc1 and Gc300 satisfy any of the above numerical ranges.

[0100] For the storage modulus of the curable resin film 12, not limited to the case of Gc1 and Gc300, it can be adjusted by, for example, adjusting the components contained in the curable resin film 12 and the content thereof. More specifically, for example, by using a polyvinyl acetal or the like as the polymer component (A) described later or a polymer (b) having no energy ray-curable group, the Gc300 is adjusted to an appropriate value, and further, the value of X is easily adjusted to an appropriate value. In addition, by adjusting the kind or content of the additive (I) described later or the like, the Gc1 is adjusted to an appropriate value, and further, the value of X is easily adjusted to an appropriate value. In addition, by increasing the content of either one of the filler material (D) and the additive (I) described later or the content of both the filler material (D) and the additive (I), the Gc1 is easily adjusted to a larger value, and further, the value of X is easily adjusted to a larger value.

[0101] The components contained in the curable resin film 12 or the like will be described additionally.

[0102] The thickness of the support sheet 11 is not particularly limited, but is preferably 50 to 850 μm, and more preferably 75 to 700 μm. By making the thickness of the support sheet 11 be the lower limit value or more, the support sheet 11 can be further made to have high strength. By making the thickness of the support sheet 11 be the upper limit value or less, the softness of the support sheet 11 can be improved, and the handleability can be further improved.

[0103] In the present specification, the "thickness of a support sheet" refers to the thickness of the entire support sheet, and for example, the thickness of a support sheet composed of a plurality of layers refers to the total thickness of all the layers that constitute the support sheet.

[0104] Figure 4 A plan view of another example of the protective film forming sheet of the present embodiment is schematically shown.

[0105] The protective film forming sheet 2 shown here is provided with a support sheet 21 and a cured resin film 12 provided on one side face 21a of the support sheet 21.

[0106] The support sheet 21 is a long strip-shaped belt, and a plurality of the cured resin films 12 are arranged in a row in the longitudinal direction thereof. The support sheet 21 is the same as the support sheet 11 in the protective film forming sheet 1 shown in Figures 2-3 except for the planar shape and size as shown above. For example, the thickness of the support sheet 21 is the same as the thickness of the support sheet 11.

[0107] Further, the protective film forming sheet 2 is the same as the protective film forming sheet 1 shown in Figures 2-3 except for the support sheet 21 being provided instead of the support sheet 11 and the number of the cured resin films 12 being different.

[0108] The protective film forming sheet 2 is suitable for continuously attaching the cured resin films 12 to the faces having convex electrodes of a plurality of wafers.

[0109] The support sheet 21 has a plurality of first regions 211a where the cured resin films 12 are provided and second regions 212a that surround the first regions 211a and where the cured resin films 12 are not provided, on one side face 21a thereof, i.e., the face on the cured resin film 12 side. That is, on the support sheet 21, the entire region of each first region 211a is covered with the cured resin film 12, and the entire region of the second region 112a is not covered with the cured resin film 12.

[0110] It is preferable that the second regions 212a on the one side face 21a of the support sheet 21 be exposed (be exposed faces).

[0111] The planar shape of the support sheet 21, i.e., the shape of the one side face 21a, is rectangular, and is preferably a belt shape.

[0112] When the protective film forming sheet 2 is viewed from above the curable resin film 12 side thereof, all the curable resin films 12 are provided at equal intervals on the support sheet 21 .

[0113] All the curable resin films 12 in the protective film forming sheet 2 have the same shape and size. Furthermore, all the curable resin films 12 are arranged in the same position in the width direction (orthogonal to the longitudinal direction) of the protective film forming sheet 2 and are aligned with the middle position in the width direction of the protective film forming sheet 2.

[0114] The maximum width D of the support piece 21 21 The maximum value (ie, the diameter D) of the curable resin film 12 is greater than 12 Here, since the width of the support piece 21 is constant in the longitudinal direction of the support piece 21 , the maximum value of the width of the support piece 21 refers only to the width of the support piece 21 .

[0115] The planar shape and size of the first region 211a of the support sheet 21 are the same as those of the curable resin film 12, and the diameter is D 12 round shape.

[0116] The planar shape of the second area 212a of the support sheet 21 is a rectangle with a plurality of columns of diameter D removed. 12 The shape of a circle.

[0117] On the surface 21a of the one side of the support sheet 21, when the minimum value of the line segment connecting a point on the periphery of the first region 211a and a point on the periphery of the support sheet 21 is set as L1, and the distance between two adjacent curable resin films 12 is set as L2, it is preferred that the smaller value of L1 and L2 / 2 is the maximum value of the width of the first region 211a (D 12 ) is 0.03 to 0.25 times, more preferably 0.05 to 0.2 times. The above value can be appropriately adjusted according to the specifications of the device for continuously attaching the curable resin film 12 on the surface of the convex electrodes of the plurality of wafers. Here, although L1 and (D 21 -D 12 ) / 2 are equal, but the formula representing L1 may differ depending on the configuration position of the first region 211a on the one surface 21a of the supporting sheet 21 or the size of the first region 211a.

[0118] The protective film forming sheet of this embodiment is not limited to Figures 2-4 The protective film forming sheet shown in the figure may also be Figures 2-4 The protective film forming sheet shown above is obtained by changing, deleting or adding a part of the configuration.

[0119] For example, as shown in Figure 5 In the second region 112a in the side face 11a of the support sheet 11 in the protective film forming sheet 1 shown in Figure 2 A belt-shaped (in this case, a circular ring-shaped) jig adhesive layer 13 is provided along the outer peripheral portion of the support sheet 11 in the second region 112a in the side face 11a of the support sheet 11 in the protective film forming sheet 1 shown in

[0120] Likewise, in the protective film forming sheet 2 shown in Figure 4 In the second region 212a in the side face 21a of the support sheet 21 in the protective film forming sheet 2 shown in

[0121] For example, in the protective film forming sheet 1 shown in Figure 2 When the support sheet 11 is an adhesive sheet, a jig adhesive layer (for example, the jig adhesive layer 13 shown in Figure 5 ) can be further provided on the adhesive layer of the adhesive sheet.

[0122] For example, in the protective film forming sheet 1 shown in Figure 2 and the protective film forming sheet 2 shown in Figure 4 Although the planar shape of the curable resin film 12 is circular, the planar shape of the curable resin film is not limited to this, and can be a quadrangle or the like.

[0123] For example, in the protective film forming sheet 2 shown in Figure 4 Part or all of the curable resin films 12 can be arranged without being at equal intervals, and the shape and size of part or all of the curable resin films 12 can be different. In addition, the arrangement position of part or all of the curable resin films 12 in the width direction of the protective film forming sheet 2 can be different.

[0124] The number of curable resin films 12 is, for example, three or more in the protective film forming sheet 2 shown in Figure 4 However, the number of curable resin films 12 is not limited to this.

[0125] For example, in the protective film forming sheet 1 shown in Figure 2 or the protective film forming sheet 2 shown in Figure 4 A support sheet can be provided on both faces (the face on the side of the support sheet 11 or the face on the side of the support sheet 21, and the face 12a on the opposite side of these faces) of the curable resin film 12. As one example, in the protective film forming sheet 2 shown in Figure 4 a support sheet can be provided on the face 12a on the opposite side of the support sheet 21 of the curable resin film 12.Figure 2 The support sheet 21 is preferably a release film, and the support sheet 11 is a pressure-sensitive adhesive sheet or a support sheet having the adhesive layer for the jig (for example, the adhesive layer 13) shown in FIG. 1. By using the protective film forming sheet in this form, it is easy to continuously supply the protective film forming sheet to the production line of the electronic device. Figure 5 The support sheet 21 is preferably a release film, and the support sheet 11 is a pressure-sensitive adhesive sheet or a support sheet having the adhesive layer for the jig (for example, the adhesive layer 13) shown in FIG. 1. By using the protective film forming sheet in this form, it is easy to continuously supply the protective film forming sheet to the production line of the electronic device. Figure 2 The support sheet 21 is preferably a release film, and the support sheet 11 is a pressure-sensitive adhesive sheet or a support sheet having the adhesive layer for the jig (for example, the adhesive layer 13) shown in FIG. 1. By using the protective film forming sheet in this form, it is easy to continuously supply the protective film forming sheet to the production line of the electronic device.

[0126] As one example of the protective film forming sheet of the present embodiment, a laminate obtained by forming a thermosetting resin film on a release-treated surface of a release film, and processing the thermosetting resin film together with the release film into a circular shape, and adhering the entire surface of the thermosetting resin film on the side opposite to the side provided with the release film to the surface of a back-grinding tape in a tape shape, thereby obtaining the laminate, can be cited.

[0127] The support sheet 21 and the laminate structure of the curable resin film 12 in the protective film forming sheet 2 shown in FIG. 2. In this laminate, the back-grinding tape corresponding to the support sheet 21 has the second region, but the release film does not have the second region. Figure 4 The support sheet 21 and the laminate structure of the curable resin film 12 in the protective film forming sheet 2 shown in FIG. 2. In this laminate, the back-grinding tape corresponding to the support sheet 21 has the second region, but the release film does not have the second region.

[0128] As one example of the protective film forming sheet of the present embodiment, a laminate obtained by forming a thermosetting resin film on a release-treated surface of a release film, and processing the thermosetting resin film together with the release film into a circular shape, and adhering the entire surface of the thermosetting resin film on the side opposite to the side provided with the release film to the surface of a back-grinding tape in a tape shape, thereby obtaining the laminate, can be cited.

[0129] As one example of the protective film forming sheet of the present embodiment, a protective film forming sheet provided with a support sheet and a cured resin film provided on one side surface of the support sheet, the cured resin film being a resin film for forming a protective film on a surface of a wafer having a convex electrode by being attached to the surface of the wafer and being cured, the support sheet having, on the one side surface thereof, a first region provided with the cured resin film and a second region surrounding the first region and not provided with the cured resin film (wherein a laminate obtained by forming a thermosetting resin film on a peeling treatment surface of a release film, processing the thermosetting resin film together with the release film into a circular shape, and attaching the entire surface of the thermosetting resin film on the side opposite to the side provided with the release film to the surface of a tape-shaped back-grinding tape is excluded).

[0130] As another example of the protective film forming sheet of the present embodiment, a protective film forming sheet provided with a support sheet and a cured resin film provided on one side surface of the support sheet, the cured resin film being a resin film for forming a protective film on a surface of a wafer having a convex electrode by being attached to the surface of the wafer and being cured, the support sheet having, on the one side surface thereof, a first region provided with the cured resin film and a second region surrounding the first region and not provided with the cured resin film (wherein a laminate provided with a release film, a thermosetting resin film provided on a peeling treatment surface of one side of the release film, and a back-grinding tape provided on a surface of the thermosetting resin film on the side opposite to the release film side, the planar shape of the release film and the planar shape of the thermosetting resin film each being circular, the release film and the thermosetting resin film being arranged in such a manner that the positions of the outer circumferential portions in the radial directions of the release film and the thermosetting resin film coincide with each other, the back-grinding tape being a tape-shaped laminate is excluded).

[0131] The cured resin film constituting the protective film forming sheet of the present embodiment is either one of thermosetting and energy ray-curable, and can have both of the properties of thermosetting and energy ray-curable.

[0132] In the present specification, "energy ray" means a ray having an energy quantum among electromagnetic waves or a charged particle beam. As examples of energy rays, ultraviolet rays, radioactive rays, electron beams, and the like can be given. As ultraviolet rays, for example, irradiation can be performed by using a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light lamp, or an LED lamp, or the like as an ultraviolet ray source. As an electron beam, an electron beam generated using an electron beam accelerator or the like can be irradiated.

[0133] In the present specification, "energy ray-curable" means a property of being cured by irradiation of an energy ray.

[0134] The curable resin film can be formed by using a curable resin film-forming composition containing the constituent material thereof. For example, the curable resin film can be formed by applying the curable resin film-forming composition on a subject surface on which the curable resin film is to be formed, and drying as necessary. The content ratio of components in the curable resin film-forming composition that do not undergo vaporization at ordinary temperature is generally the same as the content ratio of the components in the curable resin film. In the present specification, "ordinary temperature" means a temperature without special cooling or heating, i.e., a temperature as usual, and for example, a temperature of 15 to 25°C or the like can be mentioned.

[0135] The application of the curable resin film-forming composition can be performed using a publicly known method, and for example, a method using various coaters such as an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll-knife coater, a curtain coater, a die coater, a doctor blade coater, a screen coater, a Meyer rod coater, a kiss coater, and the like can be mentioned.

[0136] The drying conditions for the curable resin film-forming composition are not particularly limited regardless of whether the curable resin film is thermosetting or energy ray-curable. However, when the curable resin film-forming composition contains a solvent described later, it is preferable to perform heating drying thereon. Also, for the curable resin film-forming composition containing a solvent, for example, it is preferable to perform heating drying under conditions of 70 to 130°C and 10 seconds to 5 minutes. However, for the thermosetting resin film-forming composition, it is preferable to perform heating drying in a manner such that the composition itself and the thermosetting resin film formed from the composition do not undergo thermosetting.

[0137] As the thermosetting resin film, for example, a thermosetting resin film containing a polymer component (A) and a thermosetting component (B) can be mentioned.

[0138] As the thermosetting resin film-forming composition, for example, a thermosetting resin film-forming composition (III) (in the present specification, sometimes referred to simply as "composition (III)") containing a polymer component (A) and a thermosetting component (B), and the like can be mentioned.

[0139] The polymer component (A) is preferably a polyvinyl acetal from the viewpoint of easily adjusting the value of X to a suitable value by adjusting the value of Gc300 to a suitable value as described above.

[0140] As the polyvinyl acetal in the polymer component (A), known polyvinyl acetals can be cited. Among them, as the preferred polyvinyl acetal, for example, polyvinyl formal, polyvinyl butyral, or the like can be cited, and more preferably polyvinyl butyral.

[0141] As the thermosetting component (B), for example, an epoxy-based thermosetting resin composed of an epoxy resin (B1) and a thermosetting agent (B2); a polyimide resin; an unsaturated polyester resin; or the like can be cited.

[0142] The thermosetting resin film and the composition (III) can further contain other components which do not belong to either the polymer component (A) or the thermosetting component (B).

[0143] As the other components, for example, a curing accelerator (C), a filler material (D), a coupling agent (E), a crosslinking agent (F), an energy ray-curable resin (G), a photopolymerization initiator (H), an additive (I), a solvent, or the like can be cited.

[0144] By adjusting the content of the filler material (D), the X value can be more easily adjusted.

[0145] The filler material (D) is any one of an organic filler material and an inorganic filler material, but is preferably an inorganic filler material. As the preferred inorganic filler material, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride, or the like; beads obtained by spheroidizing these inorganic filler materials; surface-modified products of these inorganic filler materials; single-crystal fibers of these inorganic filler materials; glass fibers; or the like can be cited.

[0146] Among them, the inorganic filler material is preferably silica or alumina.

[0147] From the viewpoint of further improving the filling property of the thermosetting resin film to the trenches of the wafer, in the thermosetting resin film and the composition (III), the proportion of the content of the filler material (D) with respect to the total content of all components except for the solvent is preferably 5 to 45 mass%, more preferably 5 to 40 mass%, and further preferably 5 to 30 mass%.

[0148] As the additive (I), for example, a colorant, a plasticizer, an antistatic agent, an antioxidant, a gettering agent, a rheology control agent, a surfactant, a silicone oil, or the like can be cited.

[0149] In terms of the ease of adjustment of the X value by appropriately adjusting the above-described Gc1, as the preferred additive (I), for example, a rheology control agent, a surfactant, a silicone oil, or the like can be cited.

[0150] More specifically, as the rheology control agent, for example, polyhydroxy carboxylate, polycarboxylic acid, polyamide resin, etc. can be exemplified.

[0151] As the surface active agent, for example, modified silicone, acrylic polymer, etc. can be exemplified.

[0152] As the silicone oil, for example, aralkyl-modified silicone oil, modified polydimethylsiloxane, etc. can be exemplified, and as the modifying group, aralkyl group; polar group such as hydroxyl group; group having unsaturated bond such as vinyl group, phenyl group, etc. can be exemplified.

[0153] From the viewpoint of more easily adjusting the value of X, the content of additive (I) in the thermosetting resin film and the composition (III) is preferably 0.5 to 10 mass%, more preferably 0.5 to 7 mass%, and further preferably 0.5 to 5 mass%, relative to the total content of all components except the solvent.

[0154] Each of the components contained in the thermosetting resin film and the composition (III), i.e., polymer component (A), thermosetting component (B), curing accelerator (C), filler material (D), coupling agent (E), crosslinking agent (F), energy ray-curable resin (G), photopolymerization initiator (H), additive (I), solvent, etc. can be only one, or two or more, and when two or more, the combination and ratio thereof can be arbitrarily selected.

[0155] As the energy ray-curable resin film, for example, an energy ray-curable resin film containing energy ray-curable component (a) can be exemplified.

[0156] As the energy ray-curable resin film-forming composition, for example, an energy ray-curable resin film-forming composition (IV) (in the present specification, sometimes simply abbreviated as "composition (IV)") containing energy ray-curable component (a), etc. can be exemplified.

[0157] The energy ray-curable resin film and the composition (IV) can further contain other components which do not belong to energy ray-curable component (a).

[0158] As the other components, for example, polymer (b) not having energy ray-curable group, thermosetting component, filler material, coupling agent, crosslinking agent, photopolymerization initiator, additive, solvent, etc. can be exemplified.

[0159] From the viewpoint of adjusting Gc300 to an appropriate value and further easily adjusting the value of X to an appropriate value, polymer (b) not having energy ray-curable group is preferably polyvinyl acetal.

[0160] The energy ray-curable resin film and the thermosetting component, filler, coupling agent, crosslinking agent, photopolymerization initiator, additive, and solvent contained in the composition (IV) are the same as the thermosetting component (B), filler (D), coupling agent (E), crosslinking agent (F), photopolymerization initiator (H), additive (I), and solvent in the composition (III) described above.

[0161] The energy ray-curable component (a), polymer (b) not having an energy ray-curable group, thermosetting component, filler, coupling agent, crosslinking agent, photopolymerization initiator, additive, solvent, and the like contained in the energy ray-curable resin film and the composition (IV) can each be only one kind, or two or more kinds, and when two or more kinds, the combination and ratio thereof can be arbitrarily selected.

[0162] The support sheet constituting the protective film-forming sheet according to the present embodiment can be a publicly known support sheet.

[0163] For example, as the constituent material of the support sheet composed only of a substrate, various resins can be listed.

[0164] As the resin, for example, polyethylene; polyolefin other than polyethylene such as polypropylene; ethylene-based copolymer (copolymer obtained using ethylene as a monomer); vinyl chloride-based resin (resin obtained using vinyl chloride as a monomer); polystyrene; polycycloolefin; polyester; copolymer of two or more kinds of the polyester; poly(meth)acrylate; polyurethane; polyurethane acrylate; polyimide; polyamide; polycarbonate; fluororesin; polyacetal; modified polyphenylene ether; polyphenylene sulfide; polysulfone; polyether ketone, and the like can be listed.

[0165] Further, as the resin, for example, a polymer alloy such as a mixture of the polyester and a resin other than the same can be listed.

[0166] Further, as the resin, for example, a crosslinked resin crosslinked by one or two or more kinds of the resins exemplified so far; a modified resin such as an ionomer using one or two or more kinds of the resins exemplified so far can be listed.

[0167] In the present specification, "(meth)acrylic acid" is a concept including both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth)acrylic acid, for example, "(meth)acrylate" is a concept including both "acrylate" and "methacrylate".

[0168] The resin constituting the support sheet composed only of the base material can be only one kind, or two or more kinds, and the combination and ratio thereof can be arbitrarily selected.

[0169] From the viewpoint of general use, and the viewpoint of imparting heat resistance to the support sheet when thermally curing the curable resin film in the state of having the support sheet in the manufacturing method of the chip with the protective film described later, and easily preventing warping of the wafer, the resin is preferably a polyester such as polyethylene terephthalate or polybutylene terephthalate; polypropylene or the like. At this time, the support sheet (base material) can be a single layer, or a plurality of layers of two or more layers, as long as it has one layer or two or more layers selected from the group consisting of a layer containing a polyester and a layer containing a polypropylene film.

[0170] The support sheet composed only of the base material and containing the resin can be produced by molding a resin composition containing the resin.

[0171] The release film of the support sheet can be composed of a material having a mold-releasing property by itself, or can be a release film that makes the release of the curable resin film easy by having a layer having an easy-release property. The release film can be the same as the support sheet composed only of the base material except for the point of being composed of a material having a mold-releasing property by itself or having a layer having an easy-release property on the base material.

[0172] As the material having a mold-releasing property, for example, fluororesin or the like can be cited.

[0173] As the layer having an easy-release property, for example, a layer composed of a silicone-based release agent, an alkyd-based release agent, or the like can be cited.

[0174] The adhesive sheet of the support sheet generally has a base material and an adhesive layer in a film or sheet shape, and further can have an intermediate layer for burying a convex electrode between the base material and the adhesive layer.

[0175] As the base material in the adhesive sheet, for example, the same material as the support sheet composed only of the base material can be cited.

[0176] As the adhesive contained in the adhesive layer in the adhesive sheet, for example, an acrylic adhesive, a rubber-based adhesive, a urethane-based adhesive, or the like can be cited. The adhesive layer can also be an adhesive layer in which the adhesiveness is further decreased by irradiation of energy rays.

[0177] As the component contained in the intermediate layer in the adhesive sheet, for example, a cured product of a urethane (meth)acrylate compound, a thermoplastic polyolefin-based resin (a thermoplastic resin having a structural unit derived from an olefin), or the like can be cited.

[0178] The support sheet can also be a back grinding tape. That is, the back surface grinding of the wafer described later can also be performed with the support sheet attached to the curable resin film.

[0179] In addition, the support sheet can also not be attached to the curable resin film when grinding the back surface of the wafer. For example, the support sheet used in the manufacturing method 2 in the manufacturing method of the chip with a protective film described later can be removed before the curing step, and at this time, a back grinding tape is attached to the curable resin film when grinding the back surface of the wafer. Therefore, the support sheet does not necessarily have the properties required as a back grinding tape. In addition, even if the curing step is accompanied by heating of the curable resin film, and further the support sheet is deformed due to the heating, or the support sheet has an adhesive layer and the adhesive layer is softened due to the heating, the support sheet having such properties can be removed before the curing step to avoid the problems of deformation, softening, and the like.

[0180] The jig adhesive layer can have, for example, a single layer structure containing an adhesive component, or can have a multilayer structure having a sheet material serving as a core material and layers containing an adhesive component provided on both surfaces of the sheet material. As the layer containing an adhesive component, the same layer as the adhesive layer in the adhesive sheet can be cited.

[0181] <Method for manufacturing a protective film forming sheet>

[0182] The protective film forming sheet of the present embodiment can be manufactured by sequentially laminating the above-described respective layers (support sheet, curable resin film, jig adhesive layer, and the like) in a manner so as to become the corresponding positional relationship. The method for forming each layer is as described above. In addition, each layer can be adjusted in shape at any timing before and after it is laminated as needed.

[0183] For example, when manufacturing the protective film forming sheet, the curable resin film can be laminated on the support sheet by applying the curable resin film forming composition on one side surface of the support sheet and drying as needed.

[0184] Further, in the production of the protective film forming sheet, a release film is used as a support sheet, and the curable resin film is formed on the release film by applying the curable resin film forming composition on one side of the release film (release treatment surface) and drying as necessary, and further, the protective film forming sheet is obtained. In the case where the release film is used as the support sheet as described above, it is preferable in terms of the fact that the protective film forming sheet can be easily obtained by forming the curable resin film on substantially the entire surface of the release film, cutting the curable resin film into a shape (for example, a circular shape) identical to the shape of the first region of the release film after that, and removing the excess curable resin film to produce the second region. Further, in the case where a release film in a band shape is used as the support sheet, the protective film forming sheet can be easily obtained by continuously removing the excess curable resin film to produce the second region. In this case, the release film on the curable resin film can be removed at the time of use of the protective film forming sheet. Figure 4 Further, in the production of the protective film forming sheet, a release film is used as a support sheet, and the curable resin film is formed on the release film by applying the curable resin film forming composition on one side of the release film (release treatment surface) and drying as necessary, and further, the protective film forming sheet is obtained. In the case where the release film is used as the support sheet as described above, it is preferable in terms of the fact that the protective film forming sheet can be easily obtained by forming the curable resin film on substantially the entire surface of the release film, cutting the curable resin film into a shape (for example, a circular shape) identical to the shape of the first region of the release film after that, and removing the excess curable resin film to produce the second region. Further, in the case where a release film in a band shape is used as the support sheet, the protective film forming sheet can be easily obtained by continuously removing the excess curable resin film to produce the second region. In this case, the release film on the curable resin film can be removed at the time of use of the protective film forming sheet. Figure 2 Further, in the production of the protective film forming sheet, a release film is used as a support sheet, and the curable resin film is formed on the release film by applying the curable resin film forming composition on one side of the release film (release treatment surface) and drying as necessary, and further, the protective film forming sheet is obtained. In the case where the release film is used as the support sheet as described above, it is preferable in terms of the fact that the protective film forming sheet can be easily obtained by forming the curable resin film on substantially the entire surface of the release film, cutting the curable resin film into a shape (for example, a circular shape) identical to the shape of the first region of the release film after that, and removing the excess curable resin film to produce the second region. Further, in the case where a release film in a band shape is used as the support sheet, the protective film forming sheet can be easily obtained by continuously removing the excess curable resin film to produce the second region. In this case, the release film on the curable resin film can be removed at the time of use of the protective film forming sheet.

[0185] <Method for manufacturing chip with protective film>

[0186] The method for manufacturing a chip with a protective film according to one embodiment of the present application has: an attaching step of attaching the curable resin film in the protective film forming sheet according to one embodiment of the present application described above to a surface of a wafer having a convex electrode while heating the curable resin film; a curing step of forming a protective film on the surface of the wafer by curing the curable resin film after the attachment; and a processing step of obtaining a chip with a protective film by dividing the wafer after the formation of the protective film and cutting the protective film.

[0187] According to the method for manufacturing a chip with a protective film according to the present embodiment, it is possible to suppress the formation of a region where the curable resin film is not attached to the wafer and the thickness is thick in the attaching step. As a result, it is possible to suppress the occurrence of contamination due to the attachment of the excess portion of the curable resin film to the side surface of the wafer or any portion of the manufacturing apparatus of the chip with a protective film in the step after the attaching step.

[0188] Figures 6A-6EA cross-sectional view for illustrating one example of a manufacturing method of a chip with a protective film for schematically explaining the present embodiment.

[0189] Here, a case where the protective film forming sheet 1 illustrated in Figures 2-3 is taken as an example, but the gist of the manufacturing method of the chip with a protective film is the same in the case where the protective film forming sheet 2 illustrated in Figure 4 or another protective film forming sheet of the present embodiment is adopted.

[0190] In the attaching process, the curable resin film 12 in the protective film forming sheet 1 is heated while being attached to the face 9a of the wafer 9 having the convex electrodes 91. Thus, as illustrated in Figure 6A , a wafer 101 with a protective film forming sheet having the following configuration is obtained: the wafer 9 with the protective film forming sheet 1, and the convex electrodes 91 on the wafer 9 are covered with the curable resin film 12 at the base portions thereof near the face 9a. In addition, although Figure 6A the state where the curable resin film 12 covers the top portions of the convex electrodes 91 is illustrated in the , the top portions of the convex electrodes 91 can also be exposed without being covered with the curable resin film 12. Furthermore, when the support sheet 11 is an adhesive sheet or a support sheet having an adhesive layer for a jig, a jig such as a ring frame can also be attached to the peripheral portion of the support sheet 11 (omitted from the illustration).

[0191] The support sheet 11 in the protective film forming sheet 1 has a second region 112a on the face 11a on one side thereof. Thus, when the curable resin film 12 in the protective film forming sheet 1 is attached to the face 9a of the wafer 9 having the convex electrodes, the region of the curable resin film 12 that is not attached to the wafer 9 can be narrowed or eliminated, thereby reducing the amount of the curable resin film that flows. Furthermore, the region near the peripheral portion in the region of the curable resin film 12 that is not attached to the wafer 9 does not become low temperature. As a result, even in the attaching process, the curable resin film 12 flows toward the radial outside of the wafer 9 (to the left, to the right, or to the left and to the right in the Figure 6A ), that is, from the region attached to the wafer 9 (on the first region 111a of the support sheet 11) to the region not attached to the wafer 9 (on the second region 112a of the support sheet 11), the formation of a region where the curable resin film 12 is thickened on the second region 112a of the support sheet 11 can also be suppressed.

[0192] On the face 9a of the wafer 9 having the convex electrodes 91, a plurality of grooves 90 are formed, which are division sites of the wafer 9 when the wafer 9 is singulated into chips. At this time, in the attaching step, when the curable resin film 12 is attached to the face 9a of the wafer 9, the curable resin film 12 is filled to part or all of the regions of the grooves 90. Figure 6A The state in which all of the regions of the grooves 90 are filled with the curable resin film 12 is shown in FIG. 24.

[0193] The grooves 90 can be formed, for example, by forming a cut in the thickness direction of the wafer 9 from the face 9a of the wafer 9 using a publicly known cutting method. This method is sometimes referred to as "half-cut" in the field. As the cutting method, for example, blade cutting, plasma cutting, or the like can be listed, and there is no particular limitation.

[0194] There is no particular limitation as long as the depth of the grooves 90 is less than the thickness of the wafer 9, but it is preferably 30 to 700 μm, more preferably 60 to 600 μm, and further preferably 100 to 500 μm. By making the depth of the grooves 90 be the lower limit value or more, it is easy to reach the wafer 9 by polishing the back face 9b of the wafer 9 in the processing step described later, and thus it is easier to divide the wafer 9. By making the depth of the grooves 90 be the upper limit value or less, the strength of the wafer 9 before polishing can be made higher.

[0195] The width of the grooves 90 is preferably 10 to 2000 μm, more preferably 30 to 1000 μm, further preferably 40 to 500 μm, and particularly preferably 50 to 300 μm. By making the width of the grooves 90 be the lower limit value or more, it is easy to prevent the singulated chips from contacting each other due to vibration of polishing when polishing the back face 9b of the wafer 9 in the processing step described later. By making the width of the grooves 90 be the upper limit value or less, the strength of the wafer 9 before polishing can be made higher.

[0196] There is no particular limitation on the height of the convex electrodes 91, but it is preferably 30 to 300 μm, more preferably 60 to 250 μm, and further preferably 80 to 200 μm. By making the height of the convex electrodes 91 be the lower limit value or more, the function of the convex electrodes 91 can be further improved. By making the height of the convex electrodes 91 be the upper limit value or less, it is easy to arrange the convex electrodes 91 at a high density, and the possibility of breakage of the convex electrodes 91 when handling the wafer 9 can be reduced.

[0197] In the present specification, the "height of the convex electrode" refers to the height of the portion of the convex electrode that is located at the highest position from the face of the wafer having the convex electrodes (circuit face).

[0198] The thickness of the wafer 9 is not particularly limited, but is preferably 100 to 1000 μm, more preferably 200 to 900 μm, and further preferably 300 to 800 μm. By making the thickness of the wafer 9 be the lower limit value or more, it is easy to suppress warping accompanying shrinkage of the cured resin film 12 at the time of curing. By making the thickness of the wafer 9 be the upper limit value or less, it is possible to reduce the polishing amount of the back surface 9b of the wafer 9 in the processing step described later, and shorten the time required for polishing.

[0199] The heating of the cured resin film 12 at the time of attaching the heated cured resin film 12 to the surface 9a of the wafer 9 while heating the cured resin film 12 can be performed by a publicly known method. For example, the wafer can be heated by raising the temperature of a stage on which the wafer is placed, and the cured resin film 12 can be heated using the heated wafer as a heat source.

[0200] The temperature (heating temperature) of the cured resin film 12 at the time of attaching the heated cured resin film 12 to the surface 9a of the wafer 9 while heating the cured resin film 12 is not particularly limited, but is preferably 50 to 150°C, more preferably 60 to 130°C, and further preferably 70 to 110°C. By making the temperature be the lower limit value or more, it is possible to more highly fill the cured resin film 12 into the base of the convex electrode 91 or the groove 90 without gaps. By making the temperature be the upper limit value or less, it is possible to suppress an adverse condition that occurs when the flowability of the cured resin film 12 is too high.

[0201] The pressure (pressing pressure in the thickness direction of the wafer 9) applied to the cured resin film 12 at the time of attaching the heated cured resin film 12 to the surface 9a of the wafer 9 while heating the cured resin film 12 is not particularly limited, but is preferably 0.1 to 1.5 MPa, and more preferably 0.3 to 1 MPa. By making the pressure be the lower limit value or more, it is possible to more highly fill the cured resin film 12 into the groove 90 of the wafer 9 without gaps. By making the pressure be the upper limit value or less, it is possible to highly suppress breakage of the wafer 9.

[0202] In the attaching step, the curable resin film 12 is preferably attached to the face 9a of the wafer 9 using a roller. When a curable resin film of a conventional product is attached to the face 9a of the wafer 9 using a roller, it is extremely easy to cause a flow of the curable resin film from a region attached to the wafer to a region not attached to the wafer, and thus to make the thickness of the curable resin film thicker in the region not attached to the wafer than in the region attached to the wafer. This is because the flow direction of the curable resin film is biased toward the advancing direction of the roller. However, in the present embodiment, by using the protective film forming sheet, it is possible to suppress such a defect. That is, in the present embodiment, by attaching the curable resin film 12 to the face 9a of the wafer 9 using a roller in the attaching step, the effect of the present application is remarkably enhanced.

[0203] The curable resin film 12 can be attached to the face 9a of the wafer 9 using a publicly known method and using a roller. That is, the roller surface of the roller in rotation is brought into contact with the outermost surface of the support sheet 11 side (in this case, the face of the support sheet 11 on the opposite side from the curable resin film 12 side) of the protective film forming sheet 1, the protective film forming sheet 1 is conveyed along the advancing direction of the roller while being brought into close contact with the face 12a of the curable resin film 12 on the opposite side from the support sheet 11 side in the protective film forming sheet 1 and the face 9a of the wafer 9, and thus the curable resin film 12 is attached to the face 9a of the wafer 9.

[0204] As the wafer 9, it is preferable to use a wafer whose area as viewed from above the face 9a of the wafer 9 having the convex electrode 91 toward the lower side (i.e., the planar area of the face 9a) is equal to or greater than the area of the face 12a of the curable resin film 12 on the opposite side from the support sheet 11 side (i.e., the area of the attachment face of the curable resin film 12 attached to the wafer 9).

[0205] Further, in the attaching step, it is preferable to use such a wafer 9 to attach the entire face of the face 12a (attachment face attached to the wafer 9) of the curable resin film 12 to the face 9a of the wafer 9.

[0206] Thus, by covering the entire face of the face 12a of the curable resin film 12 with the face 9a of the wafer 9, it is possible to reduce the amount of protrusion of the curable resin film 12 over the second region 112a of the support sheet 11, and as a result, it is possible to further suppress the formation of a region in which the curable resin film 12 is not attached to the wafer and the thickness thereof is thickened.

[0207] Thus, in terms of further suppressing the formation of a region in which the curable resin film 12 is thickened in thickness, as a combination of the curable resin film 12 and the wafer 9 suitable for use in the attaching step, for example, it is possible to cite a combination in which the maximum value (diameter) D 12The combination of the curable resin film 12 having a thickness of 140 to 150 mm and the wafer 9 having a diameter of 6 inches; the maximum width (diameter) D 12 The combination of the curable resin film 12 having a thickness of 190 to 200 mm and the wafer 9 having a diameter of 8 inches; the maximum width (diameter) D 12 The maximum width (diameter) D of the combination of the curable resin film 12 with a diameter of 290 to 300 mm and the wafer 9 with a diameter of 12 inches is 12 This is a combination of a curable resin film 12 having a thickness of 440 to 450 mm and a wafer 9 having a diameter of 18 inches.

[0208] In the curing step, the curable resin film 12 attached to the wafer 9 is cured. Figure 6B As shown, a protective film 12' can be formed on the surface 9a of the wafer 9. Thus, a wafer 102 with a protective film can be obtained, which includes the wafer 9 and the protective film 12' provided on the surface 9a of the wafer 9 having the convex electrode 91. The protective film 12' in the wafer 102 with a protective film further includes a support sheet 11 on its surface 12b' opposite to the wafer 9 side. Figure 6B In the figure, reference numeral 12a' indicates the surface of the protective film 12' that is opposite to the support sheet 11 side.

[0209] In the wafer 102 with a protective film, the bases of the bump electrodes 91 on the wafer 9 near the surface 9 a are covered with the protective film 12 ′, and the entire trench 90 of the wafer 9 is filled with the protective film 12 ′.

[0210] The curing of the curable resin film 12 may be performed by a known method depending on the properties of the curable resin film 12. For example, when the curable resin film 12 is thermosetting, it may be cured by heating the curable resin film 12, and when the curable resin film 12 is energy-ray curable, it may be cured by irradiating the curable resin film 12 with energy rays.

[0211] When the curable resin film 12 is thermally cured, the heating temperature is preferably 100 to 200° C., more preferably 120 to 150° C. The heating time is preferably 0.5 to 5 hours, more preferably 1 to 3 hours.

[0212] When the curable resin film 12 is cured by energy rays, the illuminance of the energy rays is preferably 180 to 280 mW / cm 2 The amount of energy ray is preferably 450 to 1000 mJ / cm 2 .

[0213] In the above process, the wafer 9 (of the wafer 102 with protective film) after the protective film 12' is formed is divided. Thus, the wafer 9 is singulated into chips 9', such as Figure 6CAs shown, the wafer with protective film division body 103, which has a plurality of chips 9' and the protective film 12' provided on the surface 9a' of the plurality of chips 9' having the convex electrode 91, is obtained, and the protective film 12' is not cut and is connected together (one piece).

[0214] The division of the wafer 9 can be performed, for example, by grinding the surface (back surface) 9b of the wafer 9, which is opposite to the surface 9a having the convex electrode 91, using a grinding tool such as a grinder. At this time, the wafer 9 is ground until the ground surface reaches the groove 90 from the back surface 9b of the wafer 9 to the surface 9a (until the groove 90 appears). Thus, the wafer 9 is thinned, and the wafer 9 is divided at the groove 90 as a division site. The grinding of the back surface 9b of the wafer 9 is performed until the thickness of the chip 9' reaches a target value.

[0215] Next, in the processing step, the back surface 9b' of all the chips 9' in the wafer with protective film division body 103 is attached to the dicing sheet 8 before the protective film 12' is cut, and the support sheet 11 is removed from the protective film 12'. Thus, as shown, Figure 6D As shown, the dicing sheet laminated body 104 having the following configuration is obtained: the wafer with protective film division body 103 is disposed on the surface of one side of the dicing sheet 8 with the chips 9' of the wafer with protective film division body 103 facing the side of the dicing sheet 8.

[0216] The dicing sheet 8 can be a publicly known material. For example, as the dicing sheet 8, a dicing sheet composed only of a base material; a dicing sheet having a base material and an adhesive layer provided on one surface of the base material; and the like can be listed. When the dicing sheet 8 having the base material and the adhesive layer is used, the adhesive layer is attached to the back surface 9b' of the chip 9'.

[0217] In addition, in the present specification, the base material in the protective film forming sheet of the present embodiment is referred to as a "first base material" and the base material in the dicing sheet is referred to as a "second base material" in order to distinguish between these base materials, in consideration of the protective film forming sheet (for example, Figures 2-3 the protective film forming sheet 1 shown in Figure 4 the protective film forming sheet 2 shown in) and the dicing sheet (for example, Figure 6D the dicing sheet 8 shown in) of the present embodiment.

[0218] The second base material in the dicing sheet 8 and the adhesive layer can each be a publicly known material.

[0219] As the second base material, the same material as the first base material can be listed.

[0220] As the adhesive layer, an energy ray-curable or non-curable material can be listed.

[0221] In the present specification, "non-curable" means a property that does not undergo curing regardless of any method such as heating or irradiation of energy rays.

[0222] Before the dicing sheet 8 is attached to the wafer singulated body 103 with the protective film, for example, the support sheet 11 can also be cut in the wafer singulated body 103 with the protective film along the outline of the assembly of the chips 9', that is, the portion corresponding to the outer periphery of the wafer 9 before singulation. When the wafer singulated body 103 with the protective film is viewed downward from the upper side of the chips 9' side of the wafer singulated body 103 with the protective film, in the case where the protective film 12' cannot be accommodated within the shape of the support sheet 11, the portion of the protective film 12' that protrudes from the support sheet 11 can be cut at the same time. Figure 6D The case where the support sheet 11 and the protective film 12' are cut in the above-described manner is shown in FIG. 10.

[0223] Next, in the processing step, the surface layer portion of the surface 12b' of the protective film 12' on the side opposite to the chips 9' is removed by cleaning, whereby the upper portion of the convex electrode 91 is exposed. When the top portion of the convex electrode 91 is covered with the curable resin film 12 as shown in FIG. 11, it is preferable to perform this cleaning treatment. Further, in the processing step, the protective film 12' is cut, and as shown in FIG. 12, a plurality of chips 9' with the protective film 105 provided with the chips 9' and the cut protective film 120' provided to the chips 9' are obtained. In the present specification, only the "cut protective film" is sometimes referred to as the "protective film". More specifically, the cut protective film 120' is provided to the surface 9a' of the chips 9' having the convex electrode 91. Figure 6A Figure 6E The cleaning of the surface layer portion of the surface 12b' of the protective film 12' can be performed by a publicly known method such as plasma irradiation.

[0224] The protective film 12' is cut along the outer periphery (in other words, the side surface) of the chips 9'. At this time, it is preferable to cut the protective film 12' filled between the adjacent chips 9' along the outer periphery (side surface) of the chips 9', thereby dividing it into two portions. Thus, the cut protective film 120' is also provided to the respective side surfaces of the adjacent chips 9', and for each of the chips 9', the total of five surfaces of the surface 9a' having the convex electrode 91 and four side surfaces are protected by the protective film 120', and thus, for the chips 9', a remarkably high protection effect based on the protective film 120' can be obtained.

[0225] The protective film 12' can be cut by a publicly known method. For example, a publicly known cutting tool such as a dicing blade can be used to cut the protective film 12'.

[0226] The protective film 12' can be cut by a publicly known method. For example, a publicly known cutting tool such as a dicing blade can be used to cut the protective film 12'.

[0227] ​After the processing step, the resulting chip 105 with a protective film is picked up by pulling it away from the dicing sheet 8.

[0228] The chip 105 with a protective film can be picked up by a known method.

[0229] When the dicing sheet 8 with an adhesive layer is used, the chip 105 with a protective film can be picked up by pulling it away from the adhesive layer.

[0230] When the adhesive layer is curable, the picking up of the chip 105 with a protective film after the adhesive layer is cured makes it easier to pick up.

[0231] So far, the case where the dicing sheet 8 is used to cut the protective film 12' in the processing step has been described, but as described above, the protective film can be provided on the back surface 9b' of the chip 9' to further protect the chip 9'. At this time, a protective film forming sheet having the following configuration can be used instead of the dicing sheet 8: a support sheet is provided, and a protective film forming film for forming a protective film is provided on the side of the support sheet. Here, the support sheet can have a base material and an adhesive layer, and at this time, the protective film forming film is provided on the side of the adhesive layer opposite the side of the base material.

[0232] When the protective film forming sheet is used, the protective film forming film is attached to the back surface 9b' of the chip 9'.

[0233] In addition, in the present specification, the protective film forming sheet of the present embodiment (for example, the protective film forming sheet 1 shown in Figures 2-3 the protective film forming sheet 2 shown in Figure 4 is referred to as a "first protective film forming sheet", and the protective film forming sheet provided with the protective film forming film is referred to as a "second protective film forming sheet" in order to distinguish between these protective film forming sheets.

[0234] Further, at this time, the support sheet in the protective film forming sheet of the present embodiment (for example, the support sheet 11 shown in Figures 2-3 the support sheet 21 shown in Figure 4 is referred to as a "first support sheet", and the support sheet in the protective film forming sheet provided with the protective film forming film is referred to as a "second support sheet" in order to distinguish between these support sheets. The same applies to the adhesive layer provided in the support sheet, and the adhesive layer in the first support sheet is referred to as a "first adhesive layer", and the adhesive layer in the second support sheet is referred to as a "second adhesive layer" in order to distinguish between these adhesive layers.

[0235] Furthermore, in this case, the protective film (for example, Figure 6B The protective film 12' shown in the figure is referred to as a "first protective film", and the protective film formed of the protective film-forming film (for example, the protective film provided on the back surface 9b' of the chip 9') is referred to as a "second protective film" in order to distinguish these protective films.

[0236] The second supporting sheet in the second protective film-forming sheet may be made of the same material as the first supporting sheet in the first protective film-forming sheet.

[0237] The protective film-forming film in the second protective film-forming sheet may be either curable or non-curable.

[0238] The curable protective film-forming film may be either thermosetting or energy-ray curable, or may have both thermosetting and energy-ray curable properties.

[0239] The non-curable protective film-forming film is regarded as a protective film after the stage of being provided (formed) on the target object (ie, wafer).

[0240] When a second protective film forming sheet having a curable protective film forming film is used in the processing step, after the second protective film forming sheet (the protective film forming film) is attached to the back surface 9b' of the chip 9', the protective film forming film can be cured at any stage to form the second protective film. In addition, before the chip 105 with the protective film is pulled off the second supporting sheet and picked up, the protective film forming film or the second protective film can be cut along the outer periphery of the chip 9'.

[0241] When the second protective film forming sheet is used, the chip 105 with the protective film is pulled off the second supporting sheet and picked up while the cut protective film forming film or the second protective film is further provided on the back surface 9 b ′ of the chip 9 ′.

[0242] When the second supporting sheet includes a curable adhesive layer, the chip 105 with a protective film can be picked up more easily by picking it up after the adhesive layer is cured.

[0243] The manufacturing method of the chip with a protective film of this embodiment is not limited to the above-mentioned manufacturing method (hereinafter referred to as "manufacturing method 1") as long as it has the above-mentioned steps in the order of the attachment step, curing step and processing step, and part of the structure can also be changed, deleted or added in the above-mentioned manufacturing method (manufacturing method 1).

[0244] Although the above has been described for the case where the protective film formation sheet is attached to the wafer having the grooves provided on the surface with the convex electrodes and the wafer is singulated by polishing the back surface of the wafer in the manufacturing method 1 to produce the chips, for example, a wafer not provided with the grooves can be used and the above wafer can be cut by a cutting blade, that is, by so-called full-cut to singulate the wafer to produce the chips.

[0245] Further, the wafer can be singulated to produce the chips by using a wafer not provided with the grooves, irradiating a laser to provide a modified layer as a singulation starting point inside the wafer in advance, and expanding the sheet provided with the wafer, or by the impact at the time of polishing the back surface of the wafer.

[0246] In these modification examples, the protective film can be cut at the same time as the wafer is singulated to produce the chips.

[0247] Further, in the manufacturing method 1, the process of producing the protective film formation sheet and the above attachment process can be continuously performed instead of using the protective film formation sheet prepared in advance for the attachment process. More specifically, the manufacturing method 1 can have a cutting process of producing the protective film formation sheet in which the cured resin film formed on substantially the entire surface of the support sheet is cut into the same shape as the shape of the first region of the support sheet and the excess cured resin film is removed to produce the second region, before the attachment process is performed. By using an apparatus in which this cutting process and the above attachment process are continuously performed, the production of the protective film formation sheet and the attachment to the wafer can be performed on the same production line.

[0248] Figures 7A-7E A cross-sectional view for another example of a manufacturing method of a chip with a protective film for illustratively explaining the present embodiment (hereinafter, sometimes referred to as "manufacturing method 2"). The manufacturing method 2 described below corresponds to a manufacturing method in which the order of the processes is changed in part from the above-described manufacturing method 1.

[0249] In the manufacturing method 2, first, the above attachment process is performed in the same manner as in the manufacturing method 1, and as shown in FIG. 10, a wafer 101 with a protective film formation sheet is produced. Figure 7A

[0250] As in the manufacturing method 1, the manufacturing method 2 can also suppress the formation of a region where the cured resin film 12 is thickened in the second region 112a of the support sheet 11.

[0251] ​In the curing step of the manufacturing method 2, before the curable resin film 12 is cured, the wafer 101 of the sheet with a protective film is cut along the outer periphery of the wafer 9, and the support sheet 11 and the curable resin film 12 are cut off. When the support sheet 11 is an adhesive sheet or a support sheet having an adhesive layer for a jig, the peripheral portion of the support sheet 11 can be attached to a jig such as a ring frame (not shown) before the support sheet 11 and the curable resin film 12 are cut off. In addition, the support sheet 11 can be removed from the curable resin film 12 after the support sheet 11 and the curable resin film 12 are cut off, or the support sheet 11 can be removed from the curable resin film 12 without cutting off the support sheet 11 and the curable resin film 12.

[0252] In the curing step of the manufacturing method 2, the curable resin film 12 attached to the wafer 9 is cured by the same method as the curing step of the manufacturing method 1, and thus a protective film 12' is formed on the surface 9a of the wafer 9 as shown in FIG. 8. Thus, a wafer with a protective film 102 having the same configuration as the manufacturing method 1 can be obtained. However, unlike the manufacturing method 1, the protective film 12' in the wafer with a protective film 102 further has the support sheet 11 after being cut off, or does not have the support sheet 11, on the surface 12b' opposite to the wafer 9 side. Figure 7B Figure 7B A case where the support sheet 11 is not provided is shown in FIG. 9.

[0253] In the processing step of the manufacturing method 2, before the wafer 9 is divided, the surface layer portion of the surface 12b' of the protective film 12' opposite to the wafer 9 side is removed by cleaning, and thus the upper portion of the convex electrode 91 is exposed, and a back polishing tape 7 different from the support sheet 11 is attached to the surface 12b' of the protective film 12' after cleaning.

[0254] In the manufacturing method 2, the cleaning of the surface layer portion of the surface 12b' of the protective film 12' can be performed by the same method as the manufacturing method 1.

[0255] In the attaching step of the manufacturing method 2, as described above, since the region where the curable resin film 12 is formed to be thick can be suppressed, in this step, the protective film 12' can be suppressed from exceeding the outer periphery of the wafer 9. Thus, the back polishing tape 7 can be stably attached to the surface 12b' of the protective film 12'.

[0256] Next, in the processing step of the manufacturing method 2, the wafer 9 after the protective film 12' is formed (in the wafer with a protective film 102) is divided. Thus, the wafer 9 is singulated and manufactured into a chip 9' as shown in FIG. 10. Figure 7C ​As shown, a wafer piece 103' with a protective film is obtained, which has a plurality of chips 9' and the protective film 12' that is not cut and is connected together (one piece) at the face 9a' of the plurality of chips 9' having the convex electrode 91.

[0257] The wafer piece 103' with a protective film differs from the wafer piece 103 with a protective film in the manufacturing method 1 in that the thickness of the protective film 12' is made thinner than before by cleaning.

[0258] In the manufacturing method 2, the division of the wafer 9 can be performed in the same manner as in the manufacturing method 1.

[0259] Next, in the processing step of the manufacturing method 2, the dicing sheet 8 is attached to the back face 9b' of all the chips 9' in the wafer piece 103' with a protective film before the protective film 12' is cut, and the back grinding tape 7 is removed from the protective film 12'. Thus, as shown, Figure 7D As shown, a wafer piece 103' with a protective film is obtained, which has a plurality of chips 9' and the protective film 12' that is not cut and is connected together (one piece) at the face 9a' of the plurality of chips 9' having the convex electrode 91.

[0260] Next, in the processing step of the manufacturing method 2, the protective film 12' is cut, and as shown, Figure 7E As shown, a wafer piece 103' with a protective film is obtained, which has a plurality of chips 9' and the protective film 12' that is not cut and is connected together (one piece) at the face 9a' of the plurality of chips 9' having the convex electrode 91.

[0261] In the manufacturing method 2, the division of the wafer 9 can be performed in the same manner as in the manufacturing method 1.

[0262] For the manufacturing method 2, for the same reason as in the manufacturing method 1, it is also preferable that, when the protective film 12' is cut along the outer periphery (in other words, the side face) of the chip 9', the protective film 12' filled between the adjacent chips 9' is cut along the outer periphery (side face) of the chip 9' to be divided into two parts.

[0263] After the processing step of the manufacturing method 2, the obtained chip 105 with a protective film is picked up by being pulled away from the dicing sheet 8 in the same manner as in the manufacturing method 1.

[0264] As in the manufacturing method 1, in the processing step of the manufacturing method 2, a wafer that is not provided with the groove can also be used, and singulated to be made into a chip.

[0265] Further, as in the manufacturing method 1, the manufacturing method 2 can also have the cutting step immediately before the attachment step.

[0266] In either case of the production method 1 or the production method 2, a substrate device (not shown) can be produced by flip-chip connecting the chip 105 with the protective film, the top of the convex electrode 91 in the chip 105, and the connection pad portion on the circuit board. At this time, the chip 105 with the protective film is connected to the circuit formation surface of the circuit board. For example, when a semiconductor wafer is used as the wafer, a semiconductor device can be cited as the substrate device.

[0267] Examples

[0268] Hereinafter, the present application will be described in more detail by specific examples. However, the present application is not limited to the examples shown below.

[0269] The raw materials for producing the composition (III) shown below are as follows.

[0270] Polymer component (A)-1: polyvinyl butyral having structural units represented by the following formulae (i)-1, (i)-2, and (i)-3 ("S-LEC BL-10" manufactured by SEKISUI CHEMCAL CO., LTD., weight average molecular weight 25000, glass transition temperature 59°C).

[0271] [Chemical Formula 1]

[0272]

[0273] In the formula, 11 is about 28, m1 is 1 to 3, and n1 is an integer of 68 to 74.

[0274] Epoxy resin (B1)-1: liquid modified bisphenol A type epoxy resin ("EPICLON EXA-4850-150" manufactured by DIC CORPORATION, molecular weight 900, epoxy equivalent 450 g / eq)

[0275] Epoxy resin (B1)-4: dicyclopentadiene type epoxy resin ("EPICLON HP-7200HH" manufactured by DIC CORPORATION, epoxy equivalent 254 to 264 g / eq)

[0276] Thermosetting agent (B2)-1: o-cresol type novolak resin ("phenolite KA-1160" manufactured by DIC CORPORATION)

[0277] Curing accelerator (C)-1: 2-phenyl-4,5-dihydroxymethylimidazole ("CUREZOL 2PHZ-PW" manufactured by SHIKOKU CHEMICALS CORPORATION)

[0278] Filling material (D)-1: epoxy-modified spherical silica ("ADMANANO YA050C-MKK" manufactured by Admatechs, average particle diameter 50 nm)

[0279] Additive (I)-1: rheology control agent (polyhydroxycarboxylate, "BYK-R606" manufactured by BYK

[0280] [Example 1]

[0281] Polymer component (A)-1 (100 parts by mass), epoxy resin (B1)-1 (350 parts by mass), epoxy resin (B1)-4 (270 parts by mass), thermal curing agent (B2)-1 (190 parts by mass), curing accelerator (C)-1 (2 parts by mass), filling material (D)-1 (90 parts by mass), and additive (I)-1 (9 parts by mass) were dissolved or dispersed in methyl ethyl ketone, and stirring was performed at 23°C, whereby a composition (III) having a total concentration of 45% by mass of all components except for the solvent was obtained as a composition for forming a thermosetting resin film. In addition, the blending amounts of the components shown here other than the solvent are all the amounts of the target substances excluding the solvent.

[0282] A release film (SP-PET381031" manufactured by Lintec Corporation, thickness 38 μm) on which a release treatment was performed by single-sidedly treating a polyethylene terephthalate film with silicone was used, and the above-obtained composition (III) was applied to the release-treated face thereof, and heated and dried at 120°C for 2 minutes, whereby a thermosetting resin film having a thickness of 30 μm was formed.

[0283] Next, a test piece with a release film was produced by processing the thermosetting resin film together with the release film into a circle having a diameter of 170 mm.

[0284] A laminate was obtained by adhering the entire face of the exposed face (in other words, the face on the side opposite to the side provided with the release film) of the obtained test piece to the surface of a transparent tape-shaped backside polishing adhesive tape ("E-8180" manufactured by Lintec Corporation).

[0285] The obtained laminate had a constitution in which the backside polishing adhesive tape, the test piece (thermosetting resin film), and the release film were laminated in that order in the thickness direction thereof.

[0286] [Example 2]

[0287] A laminate was obtained in the same manner as in Example 1, except that the thickness of the thermosetting resin film was changed to 45 μm and the adhered back-grinding tape was changed to "E-8510HR" manufactured by Lintec Corporation.

[0288] Further, 20 pieces of thermosetting resin film which were the same as the above except that the thickness was not 45 μm but 50 μm were additionally manufactured, and these thermosetting resin films were laminated and cut, whereby test pieces in the form of a round plate having a thickness of 1 mm and a diameter of 25 mm were obtained. Using a viscoelasticity measuring device ("MCR301" manufactured by Anton-Paar Corporation), viscoelasticity measurement was performed on the test pieces, Gc1 and Gc300 were measured, and the X value was calculated, with the result as follows.

[0289] Gc1 = 115000 Pa

[0290] Gc300 = 3900 Pa

[0291] X value = 29

[0292] The filling property of the thermosetting resin film in the laminate obtained above to the groove was evaluated in accordance with the following procedure, with the result being "A".

[0293] (1) Preparation of a wafer for manufacturing a semiconductor chip

[0294] As a wafer for manufacturing a semiconductor chip, a 12-inch silicon wafer (thickness 750 μm) on which a scribe line was implemented with a half-cut was used. The width of the half-cut portion of the silicon wafer, that is, the groove, was 60 μm, and the depth of the groove was 230 μm.

[0295] (2) Evaluation method

[0296] The release film was removed from the laminate, and the surface (exposed surface) of the thermosetting resin film thus exposed was adhered to the half-cut-formed surface of the wafer for manufacturing a semiconductor chip under the following conditions while being pressed.

[0297] • Adhering device: full-automatic laminator (manufactured by Lintec Corporation, product name "RAD-3510")

[0298] • Roll pressure: 0.5 MPa

[0299] • Roll height: -400 μm

[0300] • Adhering speed: 5 mm / sec

[0301] • Adhering temperature: 90°C

[0302] Next, after peeling the back grinding tape from the thermosetting resin film, the wafer for manufacturing a semiconductor chip to which the thermosetting resin film was attached was heated at 130°C for 4 hours to cure the thermosetting resin film to form a protective film. Next, the wafer for manufacturing a semiconductor chip was cut at the half-cut portion (trench) from the back surface of the half-cut formation surface, and the filling property of the protective film to the half-cut portion (trench) was evaluated using an optical microscope ("VHX-1000" manufactured by KEYENCE CORPORATION). The evaluation criteria for the filling property were as follows.

[0303] S: The shape of the protective film was not seen to be distorted, and the filling property was best.

[0304] A: Although the shape of the protective film was slightly seen to be distorted near the opening portion of the trench, the filling property was good.

[0305] B: The filling property was poor.

[0306] Industrial applicability

[0307] The present application can be used for manufacturing a chip or the like having a convex electrode and provided with a protective film on a surface having the convex electrode. Such a chip provided with a protective film is suitable for use in manufacturing a substrate device by flip-chip connection with a connection pad on a circuit board.

[0308] Explanation of reference numerals

[0309] 1, 2: sheet for protective film formation; 11, 21: support sheet; 11a, 21a: one side surface of the support sheet (surface on the cured resin film side of the support sheet); 111a: first region on the one side surface of the support sheet; 112a: second region on the one side surface of the support sheet; 12: cured resin film, 12a: surface on the opposite side of the support sheet side of the cured resin film; 12': protective film, 120': protective film after cutting; 9: wafer; 91: convex electrode of the wafer; 9a: surface (circuit surface) of the wafer having a convex electrode; 90: trench of the wafer; 9': chip; 105: chip with protective film;D 12 : Maximum value (diameter) of the width of the cured resin film; T 12 : Thickness of the cured resin film.

Claims

1. A protective film forming sheet comprising a support sheet and a curable resin film provided on one surface of the support sheet, wherein: The curable resin film is a resin film for forming a protective film on the surface of the wafer having the protruding electrodes by being attached to the surface and cured. The support sheet has, on the one side thereof, a first region provided with the curable resin film, and a second region surrounding the first region and not provided with the curable resin film. A test piece of the curable resin film having a diameter of 25 mm and a thickness of 1 mm is strained under the conditions of a temperature of 90° C. and a frequency of 1 Hz, and the storage modulus of the test piece is measured. The storage modulus of the test piece when the strain of the test piece is 1% is defined as Gc1, and the storage modulus of the test piece when the strain of the test piece is 300% is defined as Gc300. The value of X calculated by the following formula is 19 or more and less than 10,000. X=Gc1 / Gc300.

2. The protective film-forming sheet according to claim 1, wherein The curable resin film has a thickness of 25 μm or more.

3. The protective film-forming sheet according to claim 1 or 2, wherein The maximum width of the curable resin film is 140 to 150 mm, 190 to 200 mm, 290 to 300 mm, or 440 to 450 mm.

4. The protective film-forming sheet according to claim 1 or 2, wherein The supporting piece is circular.

5. The protective film-forming sheet according to claim 4, wherein The support sheet is an adhesive sheet, or the support sheet has a jig adhesive layer along its outer periphery.

6. The protective film-forming sheet according to claim 1 or 2, wherein The supporting sheet is a peeling film.

7. The protective film-forming sheet according to claim 1 or 2, wherein Grooves serving as dividing portions of the wafer are formed on the surface of the wafer.

8. A method for manufacturing a chip with a protective film, comprising: a step of attaching the curable resin film in the protective film-forming sheet according to any one of claims 1 to 7 to a surface of a wafer having protruding electrodes while heating the curable resin film; a curing step of forming a protective film on the surface of the wafer by curing the attached curable resin film; and A processing step of dividing the wafer on which the protective film is formed and cutting the protective film to obtain chips with protective films, each including chips and the cut protective film provided on the chips.

9. The method for manufacturing a chip with a protective film according to claim 8, wherein: As the wafer, a wafer having a planar area of ​​the surface equal to or larger than the area of ​​the attachment surface of the curable resin film attached to the wafer is used. In the attaching step, the entire attaching surface of the curable resin film is attached to the surface of the wafer.

10. The method for manufacturing a chip with a protective film according to claim 8, wherein: Grooves serving as dividing portions of the wafer are formed on the surface of the wafer. In the attaching step, when attaching the curable resin film to the surface of the wafer, the curable resin film is filled into the groove.

11. The method for manufacturing a chip with a protective film according to claim 8, wherein: In the attaching step, the curable resin film is attached to the surface of the wafer using a roller.

12. A laminate obtained by: A thermosetting resin film is formed on the release-treated surface of the release film, and the thermosetting resin film is processed into a circular shape together with the release film. The entire surface of the thermosetting resin film opposite to the side provided with the release film is bonded to the surface of a strip-shaped back grinding tape to obtain the laminate. A test piece of the thermosetting resin film having a diameter of 25 mm and a thickness of 1 mm is strained under the conditions of a temperature of 90° C. and a frequency of 1 Hz, and the storage modulus of the test piece is measured. The storage modulus of the test piece when the strain of the test piece is 1% is defined as Gc1, and the storage modulus of the test piece when the strain of the test piece is 300% is defined as Gc300. When the value of X calculated by the following formula is 19 or more and less than 10,000, X=Gc1 / Gc300.

13. A laminate comprising: A release film, a thermosetting resin film provided on a release-treated surface on one side of the release film, and a back-grinding tape provided on a surface of the thermosetting resin film opposite to the release film side, wherein the planar shape of the release film and the planar shape of the thermosetting resin film are both circular, the release film and the thermosetting resin film are arranged so that the positions of the radial peripheral portions of the release film and the thermosetting resin film coincide with each other, and the back-grinding tape is in the form of a strip. A test piece of the thermosetting resin film having a diameter of 25 mm and a thickness of 1 mm is strained under the conditions of a temperature of 90° C. and a frequency of 1 Hz, and the storage modulus of the test piece is measured. The storage modulus of the test piece when the strain of the test piece is 1% is defined as Gc1, and the storage modulus of the test piece when the strain of the test piece is 300% is defined as Gc300. When the value of X calculated by the following formula is 19 or more and less than 10,000, X=Gc1 / Gc300.

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