A method for obtaining envelope conditions for domestically produced CQFP256 packaged devices for aerospace applications.

Abstract

A method for obtaining the envelope conditions of domestically produced CQFP256 packaged devices for aerospace applications, belonging to the field of electronic product mechanical reliability technology, includes: obtaining the stress-life curve of the domestically produced CQFP256 packaged device; constructing the characteristic matrix of the domestically produced CQFP256 packaged device; performing simulation of the packaged device in the typical characteristic matrix and calculating the expected life of the domestically produced CQFP256 packaged device; and determining the envelope conditions of the domestically produced CQFP256 packaged device. This invention will provide support for the efficient verification of mechanical reliability design of subsequent product models using domestically produced CQFP256 packaged devices. Furthermore, while meeting mechanical load conditions, it can also provide strong guidance and support for chassis configuration selection, device layout optimization, and determination of process hardening methods.

Description

Technical Field

[0001] This invention relates to a method for obtaining the envelope conditions of domestically produced CQFP256 packaged devices for aerospace applications. It is mainly used to efficiently verify the mechanical suitability of domestically produced CQFP256 devices packaged in electronic products under random vibration conditions during use, and belongs to the field of electronic product reliability. Background Technology

[0002] With the increasing localization of device manufacturing, CQFP256 packaged devices, represented by SiP2115, have been widely used. These devices are generally characterized by their heavy weight, large size, sensitivity to mechanical loads, and susceptibility to failure. Against the backdrop of a clear trend towards modularization and productization of single-unit products, these devices, under the combined influence of numerous factors such as structural configuration, board layout, and encapsulation process, and under increasingly severe mechanical load conditions, have repeatedly experienced lead breakage and malfunctions, seriously affecting the development progress of models, increasing product development costs, and amplifying the design risks related to mechanical reliability.

[0003] Considering the complexity and diversity of electronic products, current research on the mechanical adaptability of domestically produced CQFP256 devices faces the following bottlenecks:

[0004] (1) Generally, simulation analysis is carried out one by one through single-product simulation. The simulation work is complicated and the analysis cycle is long, resulting in limited guidance of the analysis results for the early stage of product reliability design.

[0005] (2) Due to the numerous factors affecting the mechanical reliability of domestically produced CQFP256 devices, traditional methods cannot fully consider them, resulting in a lack of effective verification and judgment of simulation analysis results;

[0006] (3) When conducting physical verification of the domestically produced CQFP256 device, there are problems such as difficulty in accurately capturing the device failure time and a long-term lack of verification methods and iterative calibration methods, which makes it impossible to provide conclusions on the applicability of the device. Summary of the Invention

[0007] The technical problem solved by this invention is to overcome the shortcomings of the prior art and provide a method for obtaining the envelope conditions of domestically produced CQFP256 packaged devices for aerospace applications, to determine the envelope conditions of CQFP256 devices, and further to quantify the mechanical envelope range of such devices based on a comprehensive consideration of influencing factors.

[0008] The technical solution of this invention is: a method for obtaining the envelope conditions of a domestically produced CQFP256 packaged device for aerospace applications, comprising:

[0009] Obtain the stress-life curve of the domestically produced CQFP256 packaged device;

[0010] Constructing the feature matrix of domestically produced CQFP256 packaged devices;

[0011] Simulations of the packaged device in a typical characteristic matrix were performed, and the expected lifetime of the domestically produced CQFP256 packaged device was calculated.

[0012] Determine the envelope conditions for domestically produced CQFP256 packaged devices.

[0013] Furthermore, the method for obtaining the stress-life curve of the domestically produced CQFP256 packaged device is to conduct a life test on a daisy-chain circuit board under constant frequency vibration conditions and then combine it with finite element simulation analysis.

[0014] Furthermore, the frequency of the fixed-frequency vibration is obtained by performing a small-scale frequency sweep on the single board, with a sweep magnitude of 0.1g and a sweep range of 10-500Hz.

[0015] Furthermore, the frequency of the fixed-frequency vibration is selected as the first-order natural frequency value of the single board during the frequency sweep process.

[0016] Furthermore, the lifespan determination during the fixed-frequency vibration process is based on the moment when the dynamic resistance value increases by more than 30% for five consecutive times, corresponding to the moment of the first resistance increase.

[0017] Furthermore, prior to simulating the packaged device in the typical characteristic matrix, a preliminary verification is performed, specifically by selecting the fundamental frequency of the single board and the amplification factor of the single board vibration response for verification.

[0018] Furthermore, through simulation modeling analysis, the maximum stress value of the CQFP256 packaged device under various combinations of influencing factors is calculated, and the expected life of the CQFP256 packaged device is calculated using the stress-life curve.

[0019] An envelope condition acquisition system for domestically produced CQFP256 packaged devices for aerospace applications includes:

[0020] The first module is used to obtain the stress-life curve of the domestically produced CQFP256 packaged device;

[0021] The second module is used to construct the feature matrix of the domestically produced CQFP256 packaged device;

[0022] The third module is used to simulate the packaged device in the typical characteristic matrix and calculate the expected lifetime of the domestic CQFP256 packaged device.

[0023] The fourth module is used to determine the envelope conditions of the domestically produced CQFP256 packaged device.

[0024] Furthermore, the method for obtaining the stress-life curve of the domestically produced CQFP256 packaged device is to conduct a life test on a daisy-chain circuit board under constant frequency vibration conditions and combine it with finite element simulation analysis.

[0025] The frequency of the fixed-frequency vibration is obtained by performing a small-scale frequency sweep on the single board, with a sweep magnitude of 0.1g and a sweep range of 10-500Hz.

[0026] The frequency of the fixed-frequency vibration is selected as the first-order natural frequency value of the single board during the frequency sweep process;

[0027] The lifespan determination criterion during the constant frequency vibration process is the moment of the first resistance increase when the dynamic resistance value increases by more than 30% for five consecutive times.

[0028] Before simulating the packaged device in the typical characteristic matrix, a preliminary model verification is performed, specifically by selecting the single-board fundamental frequency and the single-board vibration response amplification factor for verification.

[0029] Through simulation modeling and analysis, the maximum stress value of the CQFP256 packaged device under various combinations of influencing factors is calculated. Using the stress-life curve, the expected life of the CQFP256 packaged device is calculated.

[0030] An envelope condition acquisition device for aerospace-grade CQFP256 packaged devices includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the steps of the envelope condition acquisition method for aerospace-grade CQFP256 packaged devices.

[0031] The advantages of this invention compared to the prior art are:

[0032] This invention will provide support for the efficient verification of mechanical reliability design in subsequent product models using domestically produced CQFP256 packaged devices. Furthermore, while meeting mechanical load conditions, it can also provide strong guidance and support for chassis configuration selection, device layout optimization, and determination of process hardening methods. Attached Figure Description

[0033] Figure 1 This is a flowchart illustrating the process of obtaining the mechanical envelope of the CQFP256 packaged device of the present invention.

[0034] Figure 2 The dynamic resistance test curve of the CQFP256 packaged device of this invention;

[0035] Figure 3 This is the dynamic resistance test curve of the CQFP256 packaged device of the present invention. Detailed Implementation

[0036] To better understand the above technical solutions, the technical solutions of this application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of this application and the specific features in the embodiments are detailed descriptions of the technical solutions of this application, rather than limitations on the technical solutions of this application. In the absence of conflict, the embodiments of this application and the technical features in the embodiments can be combined with each other.

[0037] The following description, in conjunction with the accompanying drawings, provides a more detailed explanation of a method for obtaining the envelope conditions of a domestically produced CQFP256 packaged device for aerospace applications, as provided in this application. Specific implementation methods may include (e.g.) Figures 1-3 As shown):

[0038] Step 1: Obtain the stress-life curve of the domestically produced CQFP256 packaged device.

[0039] Using a specially designed daisy-chain verification board, dynamic parameter monitoring of domestically produced CQFP256 packaged devices was conducted to accurately obtain the device's failure time and corresponding lifetime value. Through simulation analysis, the critical locations and stress parameters of the device were obtained, and stress-life parameter curves of the device were plotted.

[0040] Step 2: Construction of the feature matrix of the domestically produced CQFP256 packaged device

[0041] For domestically produced CQFP256 packaged devices, we analyzed the application trajectory, product configuration, layout, process hardening, and mechanical load conditions of individual products, forming a characteristic matrix for domestically produced CQFP256 packaged devices. The matrix information is as follows:

[0042] serial number name Track type Single-mechanism type Layout Process reinforcement methods Mechanical load 1. XX…1 Low Orbit XX…1 Placement Area 1 Method 2 Vibration condition 1 2. XX…2 Medium and high rail XX…2 Placement area 5 The third method Vibration condition 2 3. XX…3 space station XX…2 Placement area 6 Method 1 Vibration condition 3 4. …… …… …… …… …… ……

[0043] Step 3: Simulation results and lifetime prediction of the packaged device in the typical characteristic matrix.

[0044] The characteristic matrix is ​​initially screened to determine typical characteristic conditions for mechanical simulation analysis. The maximum stress simulation results of the domestic CQFP256 packaged device are obtained. By combining the device stress-life parameter curve from step 1, the life of the packaged device is predicted based on the device failure criteria.

[0045] Step 4: Determining the envelope conditions of the domestically produced CQFP256 packaged device

[0046] Building upon step 3, relevant parameters in the feature matrix are sampled and combined to supplement verification samples, enabling iterative analysis of mechanical envelope conditions under various feature combinations. Simultaneously, based on previous experimental conclusions, if the device is intact after inspection, this feature information can be used as a benchmark for comparison with subsequent feature values, improving iteration efficiency. Ultimately, the successful envelope of mechanical loads on the domestically produced CQFP256 packaged device under different single-mechanism configurations is solidified and determined.

[0047] In the solutions provided in the embodiments of this application, such as Figure 1 Specifically, it includes the following steps:

[0048] Step 1: Obtain the stress-life curve of the domestically produced CQFP256 packaged device.

[0049] Using a specially designed 6U daisy-chain verification board, two domestically produced CQFP256 devices were symmetrically assembled. A resistance testing device was connected via external leads, followed by assembly of the board and vibration fixture, and then sealing to establish a device testing platform. The testing platform was placed on a vibration table for vibration testing. Dynamic monitoring of the packaged device parameters was conducted to obtain the accurate failure time and corresponding lifetime value of the device. Figure 2 , 3 As shown.

[0050] By using simulation modeling and analysis methods, the critical locations and stress values ​​of the device were obtained, and the stress-life parameter curve of the domestic CQFP256 device was finally plotted.

[0051] Step 2: Construction of the feature matrix of the domestically produced CQFP256 packaged device

[0052] For domestically produced CQFP256 packaged devices, the application trajectory, product configuration, layout, process hardening, and mechanical load conditions of individual products were analyzed to form a characteristic matrix of domestically produced CQFP256 packaged devices. The matrix information is as follows:

[0053] serial number name Track type Single-mechanism type Layout Process reinforcement methods Mechanical load 1. XX…1 Low Orbit XX…1 Placement Area 1 Method 2 Vibration condition 1 2. XX…2 Medium and high rail XX…2 Placement area 5 The third method Vibration condition 2 3. XX…3 space station XX…2 Placement area 6 Method 1 Vibration condition 3 4. …… …… …… …… …… ……

[0054] The single-frame architecture mainly covers the existing major chassis structure types; the layout fully considers the regional division of the 6U single board, and currently the single board is divided into 8 regions; the process reinforcement methods include 4 states; the types of mechanical load conditions vary greatly depending on the requirements.

[0055] Step 3: Simulation results and lifetime prediction of the packaged device in the typical characteristic matrix.

[0056] Given the long iteration cycle of device-level analysis for products, preliminary screening of parameter combinations in the feature matrix is ​​necessary in the early stages. While ensuring analytical accuracy, the analysis dimensions and sample size should be appropriately reduced to improve the efficiency of simulation result acquisition and lifetime prediction. This process primarily employs feature clustering to classify and filter matrix information with similar single-structure architectures, identical device layouts, consistent process hardening methods, and similar load conditions, forming a typical feature matrix for the product.

[0057] Mechanical simulation analysis was conducted under various influencing factors to obtain the maximum stress simulation results of the domestically produced CQFP256 packaged device. Combined with the device stress-life parameter curve from step 1, and using the three-interval method as the life model, the cumulative damage value D (D≥0.7) was used as the device failure criterion to predict the life of the packaged device. The parameter combinations must be based on actual load conditions and product status for the simulation results output.

[0058] Step 4: Determining the envelope conditions of the domestically produced CQFP256 packaged device

[0059] Building upon step 3, and considering the sufficiency of verification, the Latin hypersquared sampling method was used to sample and combine the parameters of the feature matrix to supplement the verification samples. The evaluation process method from step 3 was applied to achieve iterative analysis of the mechanical envelope conditions under various feature combinations. Simultaneously, combining previous experimental information, if the device is found to be intact after inspection, this feature information can be used as a benchmark for comparison with subsequent feature values, improving iteration efficiency. While ensuring sufficient test samples, the mechanical conditions were gradually recorded and plotted, ultimately solidifying and determining the successful mechanical load envelope of the domestically produced CQFP256 packaged device under different single-mechanism configurations.

[0060] Based on the obtained mechanical envelope conditions, the experimental magnitude can be directly determined, and a clear mechanical reliability design conclusion can be given. This patent provides a method for efficiently identifying the mechanical design margin of domestically produced CQFP256 devices. It has supported the mechanical design evaluation of domestically produced CQFP256 devices for multiple product models, significantly reducing the work cycle and development cost, and the application effect is good.

[0061] In summary, the beneficial effects of this invention are as follows: This method will provide support for the efficient verification of mechanical reliability design of subsequent products using domestically produced CQFP256 packaged devices. Furthermore, while meeting mechanical load conditions, it can also provide strong guidance and support for chassis configuration selection, device layout optimization, and determination of process hardening methods.

[0062] This application provides a computer-readable storage medium storing computer instructions that, when executed on a computer, cause the computer to perform... Figure 1 The method described.

[0063] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product implemented on one or more computer-usable storage media (including, but not limited to, disk storage and optical storage) containing computer-usable program code.

[0064] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0065] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0066] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0067] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

[0068] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A method for obtaining envelope conditions for a domestic CQFP256 package device for space applications, characterized by, The method comprises the following steps: obtaining the stress-life curve of the domestic CQFP256 packaged device; specifically, using the 6U daisy chain verification board, two domestic CQFP256 devices of the symmetry electric appliance are connected to the resistance test equipment through external wires, then the single board and the vibration tool are assembled and sealed to realize the construction of the device test platform, and the test platform is placed on the vibration table for vibration test; constructing the feature matrix of the domestic CQFP256 packaged device; specifically, for the domestic CQFP256 packaged device, the track type, single machine type, layout position, process reinforcement, and mechanical load condition of the single machine product are sorted out to form the feature matrix of the domestic CQFP256 packaged device; the single machine type is a chassis structure type; the layout position considers the regional division of the 6U single board; simulating the packaged device in the feature matrix and calculating the expected life of the domestic CQFP256 packaged device; specifically, the parameter combinations in the feature matrix are preliminarily screened in the early stage to reduce the analysis dimension and the number of sub-samples under the premise of ensuring the analysis accuracy, and the simulation result acquisition and life prediction efficiency are improved; in this process, the matrix information numbers of similar single machine types, similar device layout positions, consistent process reinforcement methods, and similar load conditions are classified and screened in the form of feature clustering to form the typical feature matrix of the product; determining the envelope condition of the domestic CQFP256 packaged device; specifically, the Latin hypercube sampling method is used to sample and combine the parameters in the feature matrix to supplement the verification samples, realize the iterative analysis of the mechanical envelope condition under various feature quantity combinations, and at the same time, combined with the previous test information conclusion, if the device is intact after inspection, the corresponding feature quantity information is taken as the reference and compared with the subsequent feature quantity to improve the iteration efficiency and complete the solidification determination of the mechanical load success envelope of the domestic CQFP256 packaged device under different single machine types; the method for obtaining the stress-life curve of the domestic CQFP256 packaged device is to use the daisy chain circuit board to perform life test under the condition of constant frequency vibration and combine finite element simulation analysis to obtain the stress-life curve; the frequency of the constant frequency vibration is obtained by small-scale frequency sweeping of the daisy chain circuit board, the frequency sweeping scale is 0.1g, and the frequency sweeping range is 10-500Hz; the frequency of the constant frequency vibration is selected as the first-order natural frequency value of the daisy chain circuit board in the frequency sweeping process; the life time judgment basis in the constant frequency vibration process is the first time when the dynamic resistance value continuously increases by more than 30% for 5 times; the pre-model verification is performed before the simulation of the packaged device in the feature matrix, specifically, the fundamental frequency of the daisy chain circuit board and the vibration response amplification of the daisy chain circuit board are verified; the verification result is used to provide a model basis for the subsequent stress acquisition of the device after the model calibration; after the model calibration, the maximum stress value of the CQFP256 packaged device under the combination of various influencing factors is calculated through simulation modeling analysis, and the expected life of the CQFP256 packaged device is calculated by using the stress-life curve.

2. An envelope condition acquisition system for a domestic CQFP256 package device for space application, characterized by, ​ The first module is used for obtaining a stress-life curve of a domestic CQFP256 packaged device; specifically, a 6U daisy chain verification board is used to test two domestic CQFP256 devices of the same type, and an external lead is introduced into a resistance test device, then a single board is assembled with a vibration tool and is sealed to build a device test platform, and the test platform is placed on a vibration table for vibration test; The second module is used for constructing a feature matrix of the domestic CQFP256 packaged device; specifically, for the domestic CQFP256 packaged device, the track type, the single machine type, the layout position, the process reinforcement, and the mechanical load condition of the single machine product are sorted to form the feature matrix of the domestic CQFP256 packaged device; The single machine type is a chassis structure type; The layout position considers the area division of the 6U single board; The third module is used for simulating the packaged device in the feature matrix and calculating the predicted life of the domestic CQFP256 packaged device; specifically, the parameter combinations in the feature matrix are preliminarily screened in the early stage to reduce the analysis dimension and the number of sub-samples under the premise of ensuring the analysis accuracy, and the simulation result acquisition and life prediction efficiency are improved; in this process, the matrix information numbering of the similar single machine type, the similar device layout position, the consistent process reinforcement method, and the similar load condition are classified and screened in the feature clustering manner to form the typical feature matrix of the product; The fourth module is used for determining the envelope condition of the domestic CQFP256 packaged device; specifically, the Latin hypercube sampling method is used to sample and combine the parameters in the feature matrix to supplement the verification samples, to realize the iterative analysis of the mechanical envelope condition under various feature quantity combinations, and to improve the iteration efficiency by comparing the corresponding feature quantity information as the reference with the subsequent feature quantity if the device is intact after inspection, and to complete the solidification determination of the mechanical load success envelope of the domestic CQFP256 packaged device under different single machine types; The method for obtaining the stress-life curve of the domestic CQFP256 packaged device is to perform life test under the condition of constant frequency vibration by using the daisy chain circuit board and to obtain the result by combining finite element simulation analysis; The frequency of the constant frequency vibration is obtained by small-scale frequency sweeping of the daisy chain circuit board, the frequency sweeping scale is 0.1g, and the frequency sweeping range is 10-500Hz; The frequency of the constant frequency vibration is selected as the first-order natural frequency value of the daisy chain circuit board in the frequency sweeping process; The life time judgment basis in the constant frequency vibration process is the first time when the dynamic resistance value continuously increases by more than 30% for 5 times; The pre-test is performed before the simulation of the packaged device in the typical feature matrix, specifically, the fundamental frequency of the daisy chain circuit board and the vibration response amplification of the daisy chain circuit board are selected for verification; Through simulation modeling analysis, the maximum stress value of the CQFP256 packaged device under various influence factor combination conditions is calculated, and the predicted life of the CQFP256 packaged device is calculated by using the stress-life curve.

3. An apparatus for obtaining envelope conditions for a domestic CQFP256 packaged device for space applications, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: The processor executes the computer program to realize the steps of the method of claim 1.

Images