Etching equipment and etching method for wafer processing

Abstract

The present invention relates to the technical field of wafer processing equipment, and relates to an etching device and etching method for wafer processing. The etching equipment includes a spraying device, a liquid storage device and a control device; the spraying device is used to spray or recover etching liquid toward the wafer; the liquid storage part is used to store the etching liquid, and obtain the concentration signal of the etching liquid in the liquid storage part through a concentration sensor. When using the etching equipment of this embodiment, the etching liquid can be sprayed onto the wafer through the provided spraying device, or the etching liquid on the wafer can be recovered to the liquid storage device. The concentration of the etching liquid in the liquid storage part is monitored in real time by the concentration sensor provided in the liquid storage part. The control device can adjust the etching time of the etching equipment according to a preset program to improve the etching uniformity of wafers between different batches, thereby improving the processing quality.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing equipment, and in particular to an etching device and an etching method for wafer processing. Background Art

[0002] In the existing single-wafer etching system, the etching liquid recovery process is as follows: after the etching is completed, the residual etching liquid is thrown out by centrifugal force and then sent to the recovery equipment. The recovered etching liquid is generally used directly for the next batch of etching. The etching time is not adjusted because the concentration of the etching liquid will change with the etching process. Therefore, using a fixed etching time will cause the etching uniformity between batches of wafers to decrease, thereby reducing production quality.

[0003] Therefore, it is necessary to make improvements to the above problems in order to change the current situation. Summary of the Invention

[0004] The present invention provides an etching device and an etching method for wafer processing, which are used to solve the problem in existing etching systems that etching uniformity is reduced when etching liquid is applied to subsequent batches of wafers for etching using a fixed etching time.

[0005] The present invention provides an etching device for wafer processing, comprising:

[0006] A spraying device, used for spraying or recovering etching liquid toward the wafer;

[0007] a liquid storage device, comprising a liquid storage element and a concentration sensor, wherein the liquid storage element is used to store the etching liquid and is connected to the spraying device via a pipeline, and the concentration sensor is used to obtain a concentration signal of the etching liquid in the liquid storage element; and

[0008] A control device is connected to the spray device and the concentration sensor by signal, and the control device controls the spray device to absorb the etching liquid on the wafer according to the concentration signal.

[0009] According to one embodiment of the present invention, the liquid storage device further includes a delivery pump, which is arranged between the spray device and the liquid storage component, and is used to drive the spray device to absorb the etching liquid on the wafer, and the delivery pump signal is connected to the control device.

[0010] According to one embodiment of the present invention, the spraying device is provided with a spraying hole and a reflux hole, and the liquid storage device further includes a liquid outlet control valve and a reflux control valve respectively connected to the control device by signals, the liquid outlet control valve is respectively connected to the liquid storage part and the spraying hole, and the reflux control valve is respectively connected to the liquid storage part and the reflux hole.

[0011] According to one embodiment of the present invention, the spraying device includes a spraying part, the spraying hole and the reflow hole are both arranged on the spraying part, and the spraying hole is arranged at the center position of the spraying part, and the reflow hole is arranged on the outside of the spraying hole, and the orthographic projection of the wafer on the spraying part covers the spraying hole and the reflow hole.

[0012] According to one embodiment of the present invention, the etching equipment also includes a carrier platform, which is used to carry the wafer, the spraying part and the carrier platform are spaced apart, and the spraying hole and the reflow hole are both arranged toward the wafer, the carrier platform and the spraying hole are coaxially arranged, and the carrier platform and the spraying part are arranged to rotate relative to each other.

[0013] According to one embodiment of the present invention, the spraying device further includes a lifting mechanism, which is connected to the spraying component and is used to drive the spraying component to move toward or away from the supporting platform.

[0014] According to one embodiment of the present invention, there are multiple reflow holes, and the multiple reflow holes are evenly arranged along the circumferential direction of the spraying hole.

[0015] According to one embodiment of the present invention, the liquid storage device further includes a liquid level sensor, which is disposed in the liquid storage element and is used to obtain a liquid amount signal in the liquid storage element, and the liquid level sensor signal is connected to the control device.

[0016] According to one embodiment of the present invention, the liquid level sensor includes a plurality of sensing elements, and the plurality of sensing elements are arranged in the liquid storage element at intervals along the vertical direction.

[0017] According to one embodiment of the present invention, the number of the liquid storage devices is multiple groups, and the liquid storage parts of the multiple groups of liquid storage devices are interconnected through pipes, wherein one group of the liquid storage devices is a first liquid storage device, and the other group of the liquid storage devices is a second liquid storage device, the first liquid storage device is used to output the etching liquid, and the second liquid storage device is used to receive the etching liquid absorbed by the spraying device.

[0018] The present invention further provides an etching method of an etching device, using any of the etching devices described above, the etching method comprising the following steps:

[0019] Adding etching liquid into the first liquid storage device;

[0020] Obtaining a first concentration signal obtained by a concentration sensor of the first liquid storage device, and controlling the spraying device to spray the etching liquid on the wafer according to a first preset time according to the obtained first concentration signal;

[0021] After etching is completed, the spraying device absorbs the etching liquid on the wafer and transports it to the second liquid storage device;

[0022] Obtain a second concentration signal obtained by the concentration sensor of the second liquid storage device, and control the spraying device to spray etching liquid on the wafer according to the second preset time based on the obtained second concentration signal; the first concentration signal value is greater than the second concentration signal, and the first preset time is less than the second preset time.

[0023] The implementation of the embodiments of the present invention has the following beneficial effects:

[0024] When using the etching equipment of this embodiment, the etching liquid can be sprayed onto the wafer through the provided spraying device, or the etching liquid on the wafer can be recovered into the liquid storage device. The concentration of the etching liquid in the liquid storage device is monitored in real time by a concentration sensor provided in the liquid storage device. The control device can adjust the etching time of the etching equipment according to a preset program to improve the etching uniformity of wafers between different batches, thereby improving the processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] in:

[0027] Figure 1 is a schematic structural diagram of an etching device according to an embodiment of the present invention;

[0028] Figure 2 is a flow chart of an etching method in an embodiment of the present invention;

[0029] Reference numerals:

[0030] 10. Etching equipment;

[0031] 100, spraying device; 110, spraying part; 111, spraying hole; 112, return hole; 120, lifting mechanism;

[0032] 200, liquid storage device; 210, liquid storage element; 211, liquid outlet control valve; 2111, liquid outlet; 212, reflux control valve; 2121, reflux outlet; 213, liquid discharge outlet; 214, water injection port; 220, concentration sensor; 230, delivery pump; 240, liquid level sensor; 241, sensing element; 200a, first liquid storage device; 200b, second liquid storage device;

[0033] 300, control device;

[0034] 400, carrying platform;

[0035] 20. Wafer; 30. Etching solution. DETAILED DESCRIPTION

[0036] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0037] See Figure 1 As shown, the present invention provides an etching device 10 for wafer processing, which includes a spraying device 100, a liquid storage device 200 and a control device 300; the spraying device 100 is used to spray or recover etching liquid 30 toward the wafer 20; the liquid storage device 200 includes a liquid storage part 210 and a concentration sensor 220, the liquid storage part 210 is used to store the etching liquid 30, and the liquid storage part 210 is connected to the spraying device 100 through a pipeline, and the concentration sensor 220 is used to obtain a concentration signal of the etching liquid 30 in the liquid storage part 210; the control device 300 is signal-connected to the spraying device 100 and the concentration sensor 220, and the control device 300 controls the spraying device 100 to absorb the etching liquid 30 on the wafer 20 according to the concentration signal.

[0038] When using the etching equipment 10 of this embodiment, the etching liquid 30 can be sprayed onto the wafer 20 through the provided spraying device 100, or the etching liquid 30 on the wafer 20 can be recovered into the liquid storage device 200. The concentration of the etching liquid 30 in the liquid storage part 210 is monitored in real time by the concentration sensor 220 provided in the liquid storage part 210. The control device 300 can adjust the etching time of the etching equipment 10 according to a preset program to improve the etching uniformity of the wafer 20 between different batches, thereby improving the processing quality.

[0039] In one embodiment, the liquid storage device 200 further includes a delivery pump 230 , which is disposed between the spray device 100 and the liquid storage component 210 , and is used to drive the spray device 100 to absorb the etching liquid 30 on the wafer 20 , and the delivery pump 230 signal is connected to the control device 300 .

[0040] With this arrangement, when the etching liquid 30 on the wafer 20 needs to be recovered, negative pressure can be generated at the spraying device 100 by starting the delivery pump 230, so that the etching liquid 30 can be transported back to the liquid storage part 210 through the pipeline of the delivery pump 230 under the action of negative pressure for recovery and storage.

[0041] In other embodiments, the liquid storage device 200 may also be provided with a liquid collecting part, which is arranged around the lower side of the wafer 20. After the etching of the wafer 20 is completed, the etching liquid flows into the liquid collecting part under the action of gravity and is transported to the liquid storage part 210 through the liquid collecting part. It can be driven by a liquid pump, or flow into the liquid storage part 210 through a pipeline under the action of gravity.

[0042] Specifically, the spraying device 100 is provided with a spraying hole 111 and a reflux hole 112, and the liquid storage device 200 also includes a liquid outlet control valve 211 and a reflux control valve 212, which are respectively connected to the control device 300 by signal. The liquid outlet control valve 211 is respectively connected to the liquid storage part 210 and the spraying hole 111, and the reflux control valve 212 is respectively connected to the liquid storage part 210 and the reflux hole 112.

[0043] By setting the liquid outlet control valve 211 and the reflux control valve 212 to cooperate with the spray hole 111 and the reflux hole 112 respectively, the spray pipeline and the recovery pipeline of the spray device 100 can be controlled, and the liquid output and liquid input of the liquid storage part 210 can be controlled at the same time.

[0044] In one embodiment, the spraying device 100 includes a spraying part 110, and the spraying hole 111 and the return hole 112 are both arranged on the spraying part 110, and the spraying hole 111 is arranged at the center position of the spraying part 110, and the return hole 112 is arranged on the outside of the spraying hole 111, and the positive projection of the wafer 20 on the spraying part 110 covers the spraying hole 111 and the return hole 112.

[0045] When the etching liquid is output through the spray hole 111, since the spray hole 111 is located at the center of the spray part 110, when the center of the wafer 20 corresponds to the center of the spray part 110, the etching liquid can be evenly coated on the top of the wafer 20. At the same time, since the reflux hole 112 is arranged on the outside of the reflux hole 112, after the etching is completed, the reflux hole 112 can absorb the etching liquid flowing to the edge of the wafer 20 and recover the etching liquid through the pipeline to the liquid storage part 210 for storage; this arrangement can not only ensure the uniformity of the etching liquid coating of the spray part 110, but also improve the recovery effect of the etching liquid recovered by the reflux hole 112.

[0046] Specifically, the etching equipment 10 also includes a carrier platform 400, which is used to carry the wafer 20. The spraying part 110 is spaced apart from the carrier platform 400, and the spraying hole 111 and the reflow hole 112 are both set toward the wafer 20. The carrier platform 400 is coaxially arranged with the spraying hole 111, and the carrier platform 400 and the spraying part 110 are arranged to rotate relative to each other.

[0047] With this arrangement, after the spraying member 110 applies the etching liquid to the center of the wafer 20, the carrier platform 400 can be rotated to drive the wafer 20 to rotate, and the etching liquid can flow toward the edge of the wafer 20 under the action of centrifugal force, so that the etching liquid can cover the entire wafer 20. At the same time, when the etching liquid is recovered, the absorption effect of the reflux hole 112 can also be improved.

[0048] Furthermore, the spraying device 100 further includes a lifting mechanism 120 , which is connected to the spraying member 110 and is used to drive the spraying member 110 to move toward or away from the supporting platform 400 .

[0049] In this embodiment, a lifting mechanism 120 is provided in connection with the spraying member 110. The lifting mechanism 120 can drive the spraying member 110 to move relative to the wafer 20, so as to adjust the distance between the openings of the spray holes 111 and the reflow holes 112 and the wafer 20. Specifically, the lifting mechanism 120 can be a linear drive device, including but not limited to a combination of a drive motor and a lead screw mechanism, a linear motor, a linear slide, and a hydraulic / pneumatic cylinder.

[0050] In some embodiments, there are multiple reflow holes 112 , and the multiple reflow holes 112 are evenly arranged along the circumferential direction of the spraying hole 111 .

[0051] With this arrangement, when the wafer 20 is rotated to evenly distribute the etching liquid on the wafer 20 , since the reflux holes 112 are evenly arranged along the circumferential direction of the wafer 20 , the absorption range and uniformity of the etching liquid absorbed by the reflux holes 112 can be improved.

[0052] Furthermore, the liquid storage device 200 further includes a liquid level sensor 240 , which is disposed in the liquid storage component 210 and is used to obtain a liquid amount signal in the liquid storage component 210 , and the liquid level sensor 240 signal is connected to the control device 300 .

[0053] By setting a liquid level sensor 240 in the liquid storage part 210, the liquid level sensor 240 can obtain the liquid amount signal of the etching liquid recovered or stored in the liquid storage part 210 in real time, and transmit the liquid amount signal to the control device 300 to realize the negative feedback function.

[0054] In one embodiment, the liquid level sensor 240 includes a plurality of sensing elements 241 , and the plurality of sensing elements 241 are vertically spaced apart within the liquid storage element 210 .

[0055] It can be understood that in this embodiment, the liquid level sensor 240 can adopt a switch-type sensing element 241. By arranging multiple sensing elements 241 at intervals in the vertical direction, when the liquid surface of the etching liquid contacts the sensing element 241 at the corresponding height, the sensing element 241 can obtain the liquid volume signal and transmit it to the control device 300. For example, when the etching liquid contacts the sensing element 241 at the highest position, the control device 300 can determine that the liquid volume has reached the preset maximum liquid volume. When the etching liquid contacts the sensing element 241 at the lowest position, the control device 300 can determine that the liquid volume has reached the preset minimum liquid volume, thereby performing corresponding control on the spraying device 100 and the liquid storage device 200.

[0056] See Figure 1 As shown, in a preferred embodiment, the number of liquid storage devices 200 is multiple groups, and the liquid storage parts 210 of the multiple groups of liquid storage devices 200 are interconnected through pipes, wherein one group of liquid storage devices 200 is a first liquid storage device 200, and the other group of liquid storage devices 200 is a second liquid storage device 200. The first liquid storage device 200 is used to output the etching liquid 30, and the second liquid storage device 200 is used to receive the etching liquid 30 absorbed by the spraying device 100.

[0057] In this embodiment, the number of liquid storage devices 200 is two groups, and the two groups of liquid storage devices 200 are defined as a first liquid storage device 200a and a second liquid storage device 200b. The liquid storage part 210 is provided with a liquid outlet 2111 and a reflux port 2121. The liquid outlet 2111 is connected to the spray hole 111 through a pipe, and the reflux port 2121 is connected to the reflux hole 112 through a pipe.

[0058] When using the etching device 10 of this embodiment, at the beginning of etching, the etching liquid is injected into the first liquid storage device 200a, and the second liquid storage device 200b is first used to recover the etching liquid 30; the first liquid storage device 200a is provided with three sensing elements 241 at high, medium and low positions corresponding to three liquid volume signals respectively, and used to monitor the liquid level in the liquid storage element 210, and the concentration sensor 220 is used to detect the concentration of the liquid in the liquid storage element 210.

[0059] During etching, the etching liquid in the first liquid storage device 200a is sprayed onto the wafer 20 through the spray hole 111 of the spraying member 110 under the control of the liquid outlet control valve 211. When the liquid level value in the liquid storage member 210 drops to the lowest position of the sensing member 241, the liquid supply of the first liquid storage device 200a is stopped. At this time, the control device 300 simultaneously controls the delivery pump 230 to recover the reacted etching liquid into the liquid storage member 210 of the second liquid storage device 200b through the reflux hole 112 of the spraying member 110 under the control of the reflux control valve 212. The reflux control valve 212 of the first liquid storage device 200a is closed. When the liquid level value in the liquid storage member 210 of the second liquid storage device 200b drops to the lowest position of the sensing member 241, the liquid supply of the first liquid storage device 200a is stopped. When the liquid level reaches the highest position of the sensing element 241, the recovered etching liquid is circulated and filtered inside the liquid storage element 210, and the concentration sensor 220 in the second liquid storage device 200b measures the concentration of the recovered etching liquid in the second liquid storage device 200b and feeds the concentration signal back to the control device 300. The control device 300 adjusts the etching time corresponding to the concentration, and then transports the recovered etching liquid in the second liquid storage device 200b to the spray hole 111 through the reflux control valve 212 to etch the wafer 20; the first liquid storage device 200a and the second liquid storage device 200b circulate as a raw liquid storage device and a recovered liquid storage device to store and transport the etching liquid.

[0060] Furthermore, the liquid storage member 210 is further provided with a liquid discharge port 213 .

[0061] With this arrangement, when the etching liquid is fully utilized, the waste liquid can be discharged through the drain port 213 provided in the liquid storage member 210. It should be noted that, according to process requirements, the etching time corresponding to different concentrations needs to be determined through experiments, and the number of times the etching liquid is recycled needs to be determined according to process requirements. Without affecting the production rhythm and production capacity, it can be recycled multiple times according to actual conditions.

[0062] Of course, in other embodiments, three or more liquid storage devices 200 may be provided, and the liquid outlets 2111 of multiple groups of liquid storage devices 200 are commonly connected to the spray hole 111, and the reflux ports 2121 between multiple groups of liquid storage devices 200 are interconnected. The number of liquid storage devices 200 is not limited here.

[0063] In one embodiment, the liquid storage part 210 is also provided with a water injection port 214. When the etching equipment 10 of this embodiment is used, when the liquid storage part 210 needs to be flushed or maintained, it can be connected to the pipeline through the water injection port 214, and pure water can be injected into the liquid storage part 210. After cleaning or maintenance is completed, the pure water can be discharged through the drain port 213; specifically, in the process of injecting pure water, the liquid level signal of the pure water in the liquid storage part 210 can also be obtained through the liquid level sensor 240 provided in the liquid storage part 210. When the pure water reaches the highest point of the liquid level in the liquid storage part 210, the pure water filling operation can be stopped.

[0064] See Figure 1 and Figure 2 As shown, the present invention also provides an etching method of an etching device, which adopts the etching device 10 in the above embodiment. The etching method includes the following steps:

[0065] Step S100, adding etching solution 30 into the first liquid storage device 200a;

[0066] Step S200: obtaining a first concentration signal obtained by the concentration sensor 220 of the first liquid storage device 200a, and controlling the spraying device 100 to spray the etching liquid 30 on the wafer 20 according to the first preset time according to the obtained first concentration signal;

[0067] Step S300: After etching is completed, the spraying device 100 absorbs the etching liquid 30 on the wafer 20 and transports it to the second liquid storage device 200b;

[0068] Step S400, obtain the second concentration signal obtained by the concentration sensor 220 of the second liquid storage device 200b, and control the spraying device 100 to spray the etching liquid 30 on the wafer 20 according to the second preset time according to the obtained second concentration signal; the first concentration signal value is greater than the second concentration signal, and the first preset time is less than the second preset time.

[0069] It can be understood that when the etching method of this embodiment is used for etching processing, the etching liquid 30 can be sprayed onto the wafer 20 through the spraying device 100 provided in the etching equipment 10, or the etching liquid 30 on the wafer 20 can be recovered to the liquid storage device 200, and the concentration of the etching liquid 30 in the liquid storage part 210 is monitored in real time by the concentration sensor 220 provided in the liquid storage part 210. The control device 300 can adjust the etching time of the etching equipment 10 according to a preset program to improve the etching uniformity of the wafer 20 between different batches, thereby improving the processing quality.

[0070] Specifically, in this embodiment, the control device 300 includes but is not limited to control modules such as an industrial computer, a PLC, and a single-chip microcomputer. Of course, a storage device can also be provided to store data and control programs obtained by the control module, which will not be elaborated here.

[0071] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0072] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; and direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on the specific circumstances.

[0073] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0074] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An etching method for an etching device, characterized in that: This is achieved by using an etching device for wafer processing, wherein the etching device for wafer processing comprises: A spraying device, used for spraying or recovering etching liquid toward the wafer; a liquid storage device, comprising a liquid storage member and a concentration sensor, wherein the liquid storage member is used to store the etching liquid and is connected to the spraying device via a pipeline, and the concentration sensor is used to obtain a concentration signal of the etching liquid in the liquid storage member; and a control device, signal-connected to the spraying device and the concentration sensor, wherein the control device controls the spraying device to absorb the etching liquid on the wafer according to the concentration signal; The number of the liquid storage devices is multiple groups, wherein the liquid storage devices in one group are first liquid storage devices, and the liquid storage devices in another group are second liquid storage devices, the first liquid storage devices are used to output the etching liquid, and the second liquid storage devices are used to receive the etching liquid absorbed by the spraying device; The etching method comprises the following steps: Adding etching liquid into the first liquid storage device; Acquire a first concentration signal acquired by the concentration sensor of the first liquid storage device, and control the spraying device to spray the etching liquid on the wafer according to a first preset time according to the acquired first concentration signal; After etching is completed, the spraying device absorbs the etching liquid on the wafer and transports it to the second liquid storage device; Obtain a second concentration signal obtained by the concentration sensor of the second liquid storage device, and control the spraying device to spray the etching liquid on the wafer according to the second preset time based on the obtained second concentration signal; the first concentration signal value is greater than the second concentration signal value, and the first preset time is less than the second preset time.

2. The etching method of the etching equipment according to claim 1, characterized in that: The liquid storage device further includes a delivery pump, which is disposed between the spray device and the liquid storage component and is used to drive the spray device to absorb the etching liquid on the wafer. The delivery pump signal is connected to the control device.

3. The etching method of the etching equipment according to claim 1, characterized in that: The spraying device is provided with a spraying hole and a reflux hole, and the liquid storage device also includes a liquid outlet control valve and a reflux control valve respectively connected to the control device by signal, the liquid outlet control valve is respectively connected to the liquid storage part and the spraying hole, and the reflux control valve is respectively connected to the liquid storage part and the reflux hole.

4. The etching method of the etching equipment according to claim 3, characterized in that: The spraying device includes a spraying part, the spraying hole and the return hole are both arranged on the spraying part, and the spraying hole is arranged at the center position of the spraying part, and the return hole is arranged outside the spraying hole, and the orthographic projection of the wafer on the spraying part covers the spraying hole and the return hole.

5. The etching method of the etching equipment according to claim 4, characterized in that: The etching equipment also includes a carrier platform, which is used to carry the wafer. The spraying part is spaced apart from the carrier platform, and the spraying hole and the reflow hole are both arranged toward the wafer. The carrier platform is coaxial with the spraying hole, and the carrier platform and the spraying part are arranged to rotate relative to each other.

6. The etching method of the etching equipment according to claim 5, characterized in that: The spraying device further includes a lifting mechanism, which is connected to the spraying component and is used to drive the spraying component to move toward or away from the supporting platform.

7. The etching method of the etching equipment according to claim 4, characterized in that: There are multiple reflow holes, and the multiple reflow holes are evenly arranged along the circumferential direction of the spraying hole.

8. The etching method of the etching equipment according to claim 1, characterized in that: The liquid storage device further includes a liquid level sensor, which is disposed in the liquid storage element and is used to obtain a liquid amount signal in the liquid storage element, and the liquid level sensor signal is connected to the control device.

9. The etching method of the etching equipment according to claim 8, characterized in that: The liquid level sensor includes a plurality of sensing elements, which are arranged in the liquid storage element at intervals along a vertical direction.

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