Carrier tape for packaging chips and chip packaging structure

Abstract

The application discloses a bearing tape for packaging chips and a chip packaging structure, and relates to the technical field of chip packaging. The bearing tape comprises a substrate, a chip slot is formed in the center of the top of the substrate, a fixer for fixing a chip is fixedly connected in the chip slot, a plurality of embedding slots are equidistantly formed on the two sides of the top of the substrate, pins are fixedly connected in the embedding slots, a connecting square ring is fixedly connected to the top of the substrate, a ring of protrusions is arranged on the top of the connecting square ring, a hot melt adhesive ring is fixedly connected to the periphery of the protrusions on the top of the connecting square ring, and a packaging cover is fixedly connected to the top of the connecting square ring. In the process of packaging the chip, the pins are connected to the electric contacts on the chip, the center pressing plate and the pressing feet of the chip presser are pressed on the chip and the pins, the connecting wires for connecting the chip and the pins are fixed, and thus the chip failure caused by the breakage of the connecting wires due to vibration during the transportation of the chip can be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to a bearing tape for packaging chips and a chip packaging structure. BACKGROUND

[0002] When a semiconductor integrated circuit chip is installed, it is packaged with a shell, which plays a role in placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. The protective shell is also a bridge between the internal world of the chip and the external circuit - the contacts on the chip are connected to the pins of the packaging shell by wires, and these pins are connected to other devices through wires on the printed board, so that the chip can be connected to the existing circuit in a standardized manner, which facilitates the preparation of printed circuit chip pins.

[0003] Currently, in the process of chip packaging, the phenomenon of disconnection of the chip connected by the wire pin due to vibration during use or transportation is not considered, which causes some chips to fail after transportation is completed. The bearing tape used for transporting chips is composed of two parts, which needs to be produced separately, resulting in high cost. SUMMARY

[0004] The purpose of the present application is to provide a bearing tape for packaging chips and a chip packaging structure to solve the problems raised in the background.

[0005] To achieve the above purpose, the present application provides the following technical scheme: a bearing tape for packaging chips and a chip packaging structure, comprising a substrate, a chip slot is formed in the center of the top of the substrate, a fixing device for fixing the chip is fixedly connected inside the chip slot, a plurality of embedding grooves are equidistantly formed on both sides of the top of the substrate, pins are fixedly connected inside the embedding grooves, a connecting square ring is fixedly connected to the top of the substrate, a ring of protrusions is provided on the top of the connecting square ring, a hot melt adhesive ring is fixedly connected to the periphery of the protrusions on the top of the connecting square ring, a packaging cover is fixedly connected to the top of the connecting square ring, a heat-conducting adhesive is fixedly connected to the inner wall of the top of the packaging cover, and a chip pressing device is attached to the bottom of the heat-conducting adhesive.

[0006] Further, the chip pressing device comprises a center pressing plate located directly above the chip slot, a plurality of pressing feet are fixedly connected to both sides of the center pressing plate, the positions of the plurality of pressing feet correspond one-to-one to the positions of the plurality of pins, and a heat collecting aluminum sheet is embeddedly fixedly connected to the top of the center pressing plate, and the top of the heat collecting aluminum sheet is connected to the heat-conducting adhesive.

[0007] Further, the fixing device comprises a bottom adhesive, a protective ring in the shape of a hairpin is fixedly connected to the top of the bottom adhesive, and the chip is attached to the bottom adhesive inside the protective ring.

[0008] Further, the packaging cover is rectangular, a triangular positioning groove is arranged at a corner of the top of the packaging cover, and an adsorption sheet with a smooth top surface is fixedly connected to the center of the top of the packaging cover.

[0009] The carrying tape is applied to the chip packaged by the carrying tape and the chip packaging structure, and comprises a carrying tape, a cover tape with the same structure as the carrying tape is clamped on the top of the carrying tape, and a plurality of chips packaged by the carrying tape and the chip packaging structure are placed between the carrying tape and the cover tape.

[0010] Further, the carrying tape comprises a tape body, the tape body is in a U-shaped structure, a plurality of deformable partition sheets are fixedly connected to the inner wall of the bottom of the tape body at equal intervals, a placing space is formed between adjacent partition sheets for placing the chip packaged by the carrying tape and the chip packaging structure, and adaptive teeth are fixedly connected to the two sides of the top of the tape body at equal intervals.

[0011] Further, the adaptive tooth comprises an elastic buckle, one end of the elastic buckle is fixedly connected to the tape body, a buckle head is fixedly connected to the end of the elastic buckle away from the tape body, a limiting groove is arranged on the side of the elastic buckle close to the tape body for embedding the buckle head on the other elastic buckle when the adaptive teeth cooperate with each other, and a guide inclined surface is arranged in the middle of the side of the elastic buckle.

[0012] Further, the partition sheet is in a double-layer structure, and a segmented groove is arranged in the middle of the outer wall of the tape body in the double-layer structure of the partition sheet.

[0013] Compared with the prior art, the present application has the following advantages:

[0014] The carrying tape for packaging the chip and the chip packaging structure can prevent the chip from being damaged due to the rupture of the connecting wire caused by vibration during transportation of the chip.

[0015] Meanwhile, the carrying tape for transporting and packaging the chip is changed, two carrying tapes with the same structure and a cover tape are used to form the carrying tape, so that only one type of carrying tape needs to be produced, the production cost is reduced, the adaptive teeth in the carrying tape and the cover tape can be clamped and fixed by cooperation, the placing space in the partition sheet in the carrying tape can be used to independently place each chip, and the protection of the chip during transportation is further ensured. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The figure is a structure diagram of the carrying tape of the present application;

[0017] Figure 2 Figure is schematic diagram of carrying tape structure of the present application;

[0018] Figure 3 Figure is schematic diagram of the present application Figure 1 Figure is schematic diagram of enlarged structure at A in the middle;

[0019] Figure 4 Figure is schematic diagram of matching structure of the present application

[0020] Figure 5 Figure is schematic diagram of disassembled structure of the present application

[0021] Figure 6 Figure is schematic diagram of top structure of the present application

[0022] Figure 7 Figure is schematic diagram of bottom structure of the present application

[0023] Figure 8 Figure is schematic diagram of the present application

[0024] Figure 9 Figure is schematic diagram of the present application

[0025] Figure 10 Figure is schematic diagram of the present application

[0026] Figure: 1, carrying tape; 101, tape body; 102, segmented groove; 103, partition piece; 104, placement space; 105, matching tooth; 106, elastic buckle; 107, buckle head; 108, guide slope; 109, limiting groove; 2, cover tape; 3, embedded groove; 4, lead; 5, fixator; 501, bottom glue; 502, protection ring; 6, connecting square ring; 7, hot melt glue ring; 8, core presser; 801, center pressing plate; 802, pressing foot; 803, heat collecting aluminum sheet; 9, heat conducting glue; 10, packaging cover; 11, positioning groove; 12, adsorption piece; 13, heat dissipation groove; 14, base plate; 15, chip groove. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0028] It should be noted that in the description of the present application, the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0029] In addition, it should be understood that in order to facilitate description, the sizes of various components shown in the drawings are not drawn in accordance with the actual proportional relationship, for example, the thickness or width of certain layers can be exaggerated relative to other layers.

[0030] It should be noted that similar reference numbers and letters represent similar items in the following drawings, and therefore, once an item is defined or described in one drawing, it will not need to be further specifically discussed and described in the description of subsequent drawings.

[0031] In the process of packaging the chip, first, the substrate 14 of the house chip needs to be prepared, the chip slot 15 for placing the chip is opened on the substrate, in order to enable the chip to be more stably fixed in the chip slot, the chip slot is provided with a fixer inside, the chip is fixed in the chip slot through the bottom glue inside the fixer, then the chip is further protected by the surrounding protective ring of ceramic material, the packaging machine connects the contact and the pin on the chip through the connecting line, then the sealing cover is compacted, after the hot melt adhesive ring is heated and melted, the sealing cover is tightly connected with the connecting ring, the packaging of the whole chip is realized, then the chip is placed in the bearing belt for transportation.

[0032] As Figures 1-10As shown, the present application provides a technical solution: the bearing tape for packaging chip and chip packaging structure, wherein the packaging structure for packaging chip includes the substrate 14, the chip slot 15 is opened in the top center of the substrate 14, the chip slot 15 is fixedly connected with the fixer 5 for fixing the chip inside, a plurality of embedding grooves 3 are equidistantly opened on both sides of the top of the substrate 14, the embedding grooves 3 are fixedly connected with the pins 4 inside, the connecting square ring 6 is fixedly connected on the top of the substrate 14, a ring of protrusions is arranged on the top of the connecting square ring 6, the hot melt adhesive ring 7 is fixedly connected on the top of the connecting square ring 6 at the periphery of the protrusions, the packaging cover 10 is fixedly connected on the top of the connecting square ring 6, the heat-conducting adhesive 9 is fixedly connected on the inner wall of the top of the packaging cover 10, the pressure core device 8 is pasted on the bottom of the heat-conducting adhesive 9, the fixer 5 includes the bottom adhesive 501, the back-shaped protection ring 502 is fixedly connected on the top of the bottom adhesive 501, the chip is placed inside the protection ring 502 and bonded with the bottom adhesive 501 together, the packaging cover 10 is rectangular, the positioning groove 11 in triangular shape is opened on the top corner of the packaging cover 10, the adsorption sheet 12 with smooth top surface is fixedly connected on the top center of the packaging cover 10, a plurality of heat dissipation grooves 13 are opened on the bottom of the substrate 14.

[0033] As shown, Figure 9 The pressure core device 8 includes the center pressing plate 801 located directly above the chip slot 15, a plurality of pressing feet 802 are fixedly connected on both sides of the center pressing plate 801 respectively, the positions of the plurality of pressing feet 802 correspond to the plurality of pins 4 one by one, the heat collecting aluminum sheet 803 is embeddedly fixedly connected on the top of the center pressing plate 801, and the heat collecting aluminum sheet 803 is connected with the heat-conducting adhesive 9 on the top.

[0034] It should be noted that, in order to avoid the connection line connecting the chip and the pin being broken due to vibration during transportation, the pressure core device 8 is used in the packaging mechanism, after the pins are connected to the electric contacts on the chip during the packaging process of the chip, the center pressing plate 801 and the pressing feet 802 of the pressure core device 8 are pressed on the chip and the pin 4, and the connection line connecting the chip and the pin 4 is fixed at the same time, so as to prevent the chip from being damaged due to the connection line being broken caused by vibration during the transportation of the chip, and the heat collecting aluminum sheet 803 arranged inside the pressure core device 8 can absorb the heat generated by the chip during the work, and then transfer the heat to the packaging cover 9 through the heat-conducting adhesive 9, which is convenient for heat dissipation of the whole chip, and the heat dissipation grooves 13 arranged on the bottom of the substrate can increase the contact area with air, thereby increasing the heat dissipation efficiency and avoiding damage of the whole packaged chip during the work.

[0035] In addition, since the installation process of the chip is now mostly installed by robot, in its installation dust-free workshop, the robot takes the packaged chip through the suction cup, and then fixes it on the circuit board. In order to facilitate the process, an adsorption piece 12 made of glass is arranged on the top of the packaging cover 9, which has a smooth upper surface for easy adsorption, and a positioning groove 11 is arranged to facilitate the robot to position the pin position of the chip, so as to avoid the reverse installation of the chip.

[0036] As shown in Figures 1-4 The bearing belt for transporting the chip is applied to the packaged chip of the packaging structure, which comprises a bearing belt 1, and a cover belt 2 with the same structure is connected to the top of the bearing belt 1. A plurality of bearing belts for packaging chips and chip packaging structure packaged chips are placed between the bearing belt 1 and the cover belt 2. The bearing belt 1 comprises a belt body 101, which is in U-shaped structure. A plurality of deformable partition pieces 103 are fixedly connected to the inner wall of the bottom of the belt body 101 at equal intervals. The adjacent partition pieces 103 form a placing space 104 between them for placing the bearing belt for packaging chips and the chip packaging structure packaged chip. The top of the belt body 101 is fixedly connected with adaptive teeth 105 at equal intervals on both sides.

[0037] As shown in Figure 4 The adaptive teeth 105 comprise elastic clamping pieces 106, one end of which is fixedly connected with the belt body 101, and the other end away from the belt body 101 is fixedly connected with a clamping head 107. A limiting groove 109 is formed on the side of the elastic clamping piece 106 close to the belt body 101, in which the clamping head 107 on the other elastic clamping piece 106 is embedded when the adaptive teeth 105 cooperate with each other. A guide slope 108 is formed in the middle of the side of the elastic clamping piece 106.

[0038] It should be noted that there are two bearing belts 1 and cover belts 2 with the same structure to form the bearing belt for transporting the chip. Only one type needs to be produced in production, thereby reducing the production cost. The mutual cooperation of the adaptive teeth 105 in the bearing belt 1 and the cover belt 2 can realize the clamping and fixing of the bearing belt and the cover belt. The placing space separated by the partition pieces 103 in the bearing belt 1 and the cover belt 2 can place each chip independently, thereby further ensuring the protection of the chip during transportation.

[0039] When the adaptive teeth 105 of the bearing belt 1 and the cover belt 2 cooperate, the two adaptive teeth 105 approach each other, and then the clamping head 107 bends slightly along the guide of the guide slope 108, and then is clamped in the limiting groove 109 due to its elasticity to realize the mutual engagement of the two adaptive teeth 105. There is a gap between the adjacent adaptive teeth 105 of the bearing belt 1 and the cover belt 2 to facilitate the deformation. The adaptive teeth 105, the partition pieces 103 and the belt body 101 are integrally formed, which are made of rubber material. When the bearing belt 1 and the cover belt 2 are separated, they can be separated by tearing outward at the port.

[0040] As Figure 10 shown, the partition piece 103 is a double-layer structure, and the outer wall of the belt body 101 is provided with a segmented groove 102 at the middle of the double-layer structure of the partition piece 103.

[0041] It should be noted that, since the chips placed in the inner part of the belt may need to be separated, in order to protect the chips from being damaged to the greatest extent, the segmented groove 102 for facilitating air cutting is arranged on the surface of the belt body 101, and the segmented groove is just at the middle of the double-layer structure of the partition piece 103, so that the chips can be separated without being taken out.

[0042] Although the embodiments of the present application have been shown and described, it should be understood by those ordinary skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended embodiments and their equivalents.

Claims

1. A chip package structure for packaging a chip, comprising a substrate (14), characterized in that: The top center of the substrate (14) is provided with a chip slot (15), and the inside of the chip slot (15) is fixedly connected with a fixator (5) for fixing the chip. The fixator (5) includes a bottom glue (501), and the top of the bottom glue (501) is fixedly connected with a back-protecting ring (502).

2. The chip package structure for packaging a chip according to claim 1, wherein: The packaging cover (10) is rectangular, and a triangular positioning groove (11) is formed at the top corner of the packaging cover (10).

3. The chip package structure for packaging a chip according to claim 1, wherein: The application is applied to the chip packaged by the carrying tape and the chip packaging structure as claimed in any one of claims 1-3, and includes the carrying tape (1), and the carrying tape (1) is clamped with the cover tape (2) with the same structure.

4. Carrier tape, characterized in that: The carrying tape (1) includes a tape body (101), and the tape body (101) is a U-shaped structure.

5. The carrier tape of claim 4, wherein: The adaptive tooth (105) includes an elastic buckle (106), one end of the elastic buckle (106) is fixedly connected with the tape body (101), the other end of the elastic buckle (106) away from the tape body (101) is fixedly connected with a buckle head (107), and a limiting groove (109) is formed in the side of the elastic buckle (106) close to the tape body (101), the buckle head (107) on the other elastic buckle (106) is embedded in the limiting groove (109) when the adaptive teeth (105) are matched with each other, and a guide inclined surface (108) is formed in the middle of the side of the elastic buckle (106).

6. The carrier tape of claim 5, wherein: ​ 7. The carrier tape of claim 5, wherein: The partition piece (103) is a double-layer structure, and the segmented groove (102) is formed in the middle of the double-layer structure of the partition piece (103).

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