Device and method for transferring an electronic component from a first carrier to a second carrier

Abstract

The invention relates to a device, which is designed to: accommodate a first carrier with a first container; guide the second carrier along its longitudinal extension with a second container in the conveying direction of the second carrier; accommodate the first carrier with the first container so that the components carried by the first carrier are oriented toward the second container, and as a response to information sent by a control system via a signal, separate the components from the first carrier in a contact or non-contact manner with a separation device to transfer the components to the second carrier; as a response to information sent by the control system via a signal, transport the second carrier in a position relative to the placement position of the second carrier with another conveying device so that the electronic assembly on the second carrier reaches the placement position on the second container guiding the second carrier; the second container has a contact surface for the second carrier that is curved along the conveying direction of the second carrier; the second container at least partially includes a second conveying device, which occupies only a part of the second container transversely to the conveying direction of the second carrier. A heating device is arranged and configured to act on the second carrier in the area of ​​the second container so as to adjust the temperature of the second carrier from the side of the second container away from the first container before, above and / or after the placement position.

Description

Technical Field

[0001] The invention describes a device and a method for transferring an electronic component from a first carrier to a second carrier. The invention also describes a device and a method for applying an adhesive to the second carrier. In particular, a device and a method for separating an electronic component from the first carrier and transferring it directly to the second carrier are described. The second carrier can, for example, have one or more electronic assemblies, to each of which the electronic component can be transferred. Background Art

[0002] When transferring electronic components, in particular chips ("wafers"), and especially when transferring singulated electronic components, there is often the problem that the electronic components are fragile and therefore need to be handled very carefully. In addition, electronic components have undergone a continuous miniaturization, so the requirements for precision when transferring electronic components are constantly increasing.

[0003] WO 2017 / 076989 A1 relates to a processing system and a method for processing a flexible substrate, such as a thin plate, using a fixture, the fixture comprising a vacuum plate movable in a conveying direction of the flexible substrate, the vacuum plate comprising an indicator that intermittently moves the flexible substrate for processing. The vacuum plate is configured to move in the conveying direction. The indicator is configured to intermittently move the flexible substrate for processing. The control system is configured to control the fixture and the indicator so that under all working conditions, even when the flexible substrate is stopped, the relative speed between the indicator and the vacuum plate of the fixture is maintained at a level above a predetermined threshold. The thin plate that can be used in this processing system has a certain number of electrical structures that are spaced a certain distance from each other. These electrical structures can be any type of flexible electronic device.

[0004] DE 10 2011 104 225 B4 relates to a device for positioning an electronic component to be transferred relative to an ejection device, comprising an ejection device having a slide for at least one electronic component and a housing surrounding the slide, wherein the housing has a first light-transmitting area. A first carrier provides the electronic component to be transferred. The first carrier has a first side facing the ejection device and a second side facing away from the ejection device. A plurality of electronic components are arranged on the second side. An image data acquisition device is configured to acquire image data of an area through the first light-transmitting area of ​​the housing, in which the slide is configured to interact with the at least one electronic component. A control system is configured to determine position data of the electronic component to be transferred based on the acquired image data and to generate control commands based on the position data. At least one actuator is configured to move the first carrier and the ejection device relative to each other based on the control command, thereby changing the relationship between the longitudinal axis of the slide and the central axis of the electronic component to be transferred, wherein the ejection device comprises a first reflector arranged in the interior of the housing.

[0005] DE 103 49 847 B3 describes a placement device and a placement method for transferring electronic components. In this case, a semiconductor wafer arranged on a carrier film is arranged above and parallel to a strip substrate. The wafer can be moved in the wafer plane via a wafer holder and can also be rotated about a rotation axis perpendicular to the wafer plane. The ejection device includes a pin, which acts on the back side of the chip to be separated via a downward movement and separates the chip from the carrier film. The chip separated from the carrier film is thereby placed in a bonding position on the strip substrate.

[0006] JP 2003 109979 A relates to a device having at least two slides for separating a component from a first carrier. The component is respectively received via a suction tube of a transfer element. In a final step, the transfer element with the suction tube and the component is placed above a second carrier that has been pretreated with an adhesive and the component is placed on the second carrier. The component is not transferred directly from the first carrier to the second carrier, but is received via the transfer element after separation from the first carrier and in a subsequent step the component is precisely oriented and fixed to the second carrier by the transfer element.

[0007] DE 10 2018 006 771 A1 relates to a solution for increasing the throughput during the transfer of components from a first carrier to a second carrier with high precision and repeatability, wherein a second carrier with low transparency or even completely opaque can also be used without causing quality losses in terms of positional accuracy of the component placement. For this purpose, a device for transferring electronic components from a first carrier to a second carrier is proposed, wherein the first carrier carries a plurality of individualized components in a manner that can be separated therefrom, and the second carrier has a nearly endless construction scheme and carries a plurality of electronic assemblies in its longitudinal and lateral extension, each of the plurality of components being transferred from the first carrier to one of the plurality of electronic assemblies. The device comprises: a first container configured to accommodate a first carrier; a second container configured to guide the second carrier along its longitudinal extension along the conveying direction of the second carrier; wherein the first container is configured to accommodate the first carrier so that the component carried by the first carrier is oriented toward the second container; a separation device configured to separate the component from the first carrier in a contact or non-contact manner, thereby transferring the component to the second carrier; a first conveying device, which is arranged and configured to move the first container relative to the second container transversely to the conveying direction of the second carrier; a second conveying device, which is arranged and configured to move the separation device relative to the second container transversely to the conveying direction of the second carrier; a first detection machine a structure which is arranged and configured to detect the position of at least one of the components relative to the placement position on the second receiving member guiding the second carrier; a second detection mechanism which is arranged on the upstream side of the placement position and is arranged and configured to detect the position of at least one of the multiple electronic assemblies located on the second carrier relative to the second receiving member and send information representing the position to the control system via a signal; a third conveying device which is arranged and configured to: in response to the information sent by the control system via a signal, convey the second carrier relative to the placement position so that at least one of the multiple electronic assemblies located on the second carrier reaches the placement position on the second receiving member guiding the second carrier.

[0008] In JP 5267451 A, EP 0 565 781 B1 and DE 198 22 512 A1, US 4,667,402 B1, US2008 / 0086874 A1, EP 1 764 826 A1, US 2002 / 019074 A1, US 2009 / 242124 A1, EP 0 140126 A1, US 4,990,051 B1, US 2006 / 237142 A1, US 2007 / 293022 A1, US 6,201,306 B1, JP2009 238881 A, JP 2010 161155 A, JP 60 097634 A.JP 01 109737 A.JP More devices and methods for transferring electronic components are described in JP 55 070041 A, JP 2002 050670 A, JP 09 162204 A, JP 53 100765 A, JP 2008 004936 A, WO 2007 / 137888 A1, WO 2000 / 014789 A1, EP 949 662 A2, US 2006 / 013680 A1, US 2016 / 308269A1, DE 10 2011 017 218 A1, and EP 2 491 583 B1, which constitute the technical background of the device described herein and the method described herein.

[0009] question

[0010] In this context, it is desirable to achieve an apparatus and a method by which the throughput during the transfer of components from a first carrier to a second carrier can be increased with high accuracy and repeatability. Furthermore, it should also be possible to use a second carrier of low transparency or even completely opaque without quality losses in terms of positional accuracy of component placement. Finally, it is desirable to handle the components in a gentle manner. Summary of the invention

[0011] Proposed Solution

[0012] To achieve the above-mentioned object, the present invention provides a device for transferring an electronic component from a first carrier to a second carrier, wherein the device is used to transfer an electronic component, such as an RFID chip, from a first carrier, such as a wafer carrier film, to a second carrier, such as an (antenna) carrier tape material with a nearly endless construction scheme, wherein the carrier tape material carries a plurality of electronic assemblies, such as antennas, along its lateral and / or longitudinal extension. In one variant, the first carrier carries a plurality of individualized components, such as RFID chips, in a manner that they can be separated therefrom. One of the plurality of components (RFID chips) is to be transferred from the first carrier (wafer carrier film) to the second carrier, namely the (antenna) carrier tape material.

[0013] The device is designed to: accommodate the first carrier with a first container; guide the second carrier along its longitudinal extension along the conveying direction of the second carrier with a second container; accommodate the first carrier with the first container in such a way that the component carried by the first carrier is oriented toward the second container; as a response to information sent by a control system via a signal, separate the component from the first carrier in a contact or non-contact manner with a separation device, thereby transferring the component to the second carrier; as a response to information sent by a control system via a signal, transport the second carrier in a relative placement position of the second carrier with a conveying device in such a way that the electronic assembly located on the second carrier reaches the placement position on the second container guiding the second carrier; wherein the second container has a contact surface for the second carrier that is bent along the conveying direction of the second carrier.

[0014] In a variant, the second container is assigned a drive as a conveying device, which occupies only a part of the second container transversely to the conveying direction of the second carrier. The conveying device is arranged and configured to convey the second carrier in its position relative to the placement position in response to information sent by the control system via a signal so that the electronic assembly located on the second carrier reaches the placement position on the second container guiding the second carrier. The heating device is arranged and configured to act on the second carrier in the area of ​​the second container in order to adjust the temperature of the second carrier from the side of the second container facing away from the first container before, at and / or after the placement position.

[0015] The device is used in particular for transferring electronic components from a first carrier to a second carrier. The first carrier carries a plurality of individualized components in a manner that can be separated therefrom. The second carrier adopts a nearly endless construction scheme and carries a plurality of electronic assemblies in its longitudinal extension, each of which is to be transferred from the first carrier to one of the plurality of electronic assemblies. The device comprises a first receiving part, which is arranged and configured to receive the first carrier. The device comprises a second receiving part, which is arranged and configured to guide the second carrier along its longitudinal extension in the conveying direction of the second carrier. The first receiving part is arranged and configured to receive the first carrier in such a way that the components carried by the first carrier are oriented toward the second receiving part.

[0016] The separation device is provided and configured to separate the component from the first carrier in a contact or non-contact manner, thereby transferring the component to the second carrier. The first conveying device is provided and configured to move the first container relative to the second container.

[0017] The conveying device is arranged and configured to convey the second carrier relative to the placement position in response to information sent by the control system via a signal so that the electronic assembly located on the second carrier reaches the placement position on the second receiving member guiding the second carrier. The second receiving member has a contact surface for the second carrier that is curved along the conveying direction of the second carrier.

[0018] The heating device acting in the region of the second receiving part is arranged and configured to control the temperature of the second carrier from a side of the second receiving part remote from the first receiving part before, during and / or after the placement position.

[0019] The second receiving element at least partially comprises a conveying device which occupies only a part of the second receiving element transversely to the conveying direction of the second carrier.

[0020] In another modification, the second accommodating part is designed as a cylindrical reel and can be heated as a whole with a heating device. In a modification, this heatable reel can be rotated by a conveying device comprising a drive, and the conveying device transports the second carrier toward / away from the placement position of the assembly along the conveying direction.

[0021] As an alternative to a cylindrical drum, the second receiving part can also be designed as a surface which is arched or curved convexly toward the first receiving part, which surface is arranged in a fixed position and is spatially and / or functionally associated with a further third conveying device for the second support body.

[0022] Advantages and working method

[0023] At present, for the assembly of assemblies or connection frames via direct placement (DDA), a single-row strip is usually used as the second carrier, on which the components originating from the first carrier are placed. The solution proposed by the present invention allows the use of a single-row strip as the second carrier. The reduced complexity and increased throughput of the direct placement layout also act in the area of ​​the equipment that can handle single-row strips. The solution proposed here allows the inspection of the second carrier at the placement position to be replaced. Therefore, it is also possible to use a low-transparency or even completely opaque second carrier to combine components and assemblies in a precisely matched manner without causing a loss of precision during the placement of the components.

[0024] In order to detect the placement position on the strip before placing the component, conventional DDA devices for single-row strips use a camera that is mounted directly in the placement area on the back / bottom side of the strip of the second carrier. Based on this arrangement, conventional DDA devices can only process completely transparent materials, such as PET, without limiting the placement accuracy, and opaque materials cannot usually be used as the second carrier.

[0025] The solution proposed by the invention detects the placement position on the strip (in terms of space / time) before the actual placement of the component, wherein the second image acquisition device detects the placement point of the component on the second carrier itself directly, i.e. without passing through the second carrier. In this case, the second carrier is conveyed to the placement position in such a controlled manner that when the separation device separates the component from the first carrier and transfers this component in the Z direction to the second carrier, the placement point of the component is aligned as accurately as possible with the position of the component to be placed on the first carrier.

[0026] Compared to pick-and-place devices or flip-chip devices, the throughput of components can be significantly increased when the solution proposed by the invention is used due to the reduced structural complexity. The components can be separated directly and individually from the (sawn) wafer and placed on the corresponding assembly (or connecting frame or the like) on the second carrier; the intermediate carrier in conventional automatic assembly machines is no longer required. The transparency of the material of the second carrier no longer affects the positional accuracy during component placement.

[0027] For example, the device proposed here enables the production of RFID inlays or RFID modules, in which the electrical contact between the RFID chip and the antenna is established by soldering. To this end, the antenna is made of an electrically conductive material that melts under the action of a corresponding temperature. In this molten state, the RFID chip is placed with its contacts (bumps) into the melted bare ends of the antenna. As a result, the contacts of the RFID chip are permanently and fully connected electrically and mechanically to the contact points of the antenna.

[0028] Thus, the electrical and mechanical connection is established when the component is placed on the base material (strip), more specifically on the antenna applied on the base material (strip). To this end, at the time of placement, the base material (strip) is brought to a temperature at which the solder / material of the antenna reaches its melting temperature at least in the region of the exposed end of the antenna and allows the contacts of the RFID chip to come into contact with it.

[0029] The process described herein can eliminate the need for an electrically conductive adhesive (ACA) that is applied between the exposed end of the antenna and the RFID chip when an RFID inlay is conventionally manufactured.

[0030] If an adhesive is used to connect the RFID chip to the antenna, the adhesive only has to ensure a mechanical connection. For this purpose, a cheap adhesive or hot melt adhesive that is not filled with conductive material can be used. In a variant, this non-conductive adhesive can be applied to the base material (strip) at least in the area of ​​the exposed end of the antenna. When the base material (strip) is temperature-controlled, the solder / material of the antenna and the non-conductive adhesive are brought to their melting temperature, which means that in a variant, no adhesive feed device can be provided.

[0031] Furthermore, in some variants, the conventional final bonding module in the process chain can be omitted. This would significantly reduce the complexity, size and cost of the machine.

[0032] By means of the proposed device and method, a substrate material (strip) coated with an antenna, for example, is heated by at least one corresponding heating element on its way to, at and / or away from a placement location. The heating element / s are applied to the substrate material (strip) on the side facing away from the assembly (for example, the antenna), so that at least the solder / material at the exposed end of the antenna reaches its melting temperature. By releasing the assembly from the first carrier, the contacts of the RFID chip come into contact with the exposed end of the antenna. After the solder / material at the exposed end of the antenna has cooled (controlled) to below the melting temperature, the assembly (RFID chip) is electrically and mechanically connected to the assembly (antenna).

[0033] In a variant of the device, the curved abutment surface and / or the conveying device has a plurality of openings to be connected to a negative pressure source. The plurality of openings are arranged and configured to closely abut the second carrier against the curved abutment surface. When transporting the second carrier, the second carrier is fixed without slipping by the openings under negative pressure, such as vacuum holes, so that the second carrier is transported in a controlled manner and the components are placed in a precisely matched manner relative to the assembly.

[0034] In a variant of the device, the curved abutment surface is rigid. In addition, the conveying device divides the curved abutment surface into at least two sections along the conveying direction of the second carrier.

[0035] In another variant of the device, a heat shield is arranged upstream and / or downstream of the placement position, as viewed in the conveying direction of the second carrier. Alternatively or additionally, a gap for the second carrier is arranged between the curved contact surface and the heat shield. As a result, the heating device does not heat the first carrier and the adhesive layer between the component and the first carrier, or heats as little as possible.

[0036] In another variant, the device is provided with a buffer storage on the upstream and / or downstream side of the placement position or the curved abutment surface, which is arranged and configured to accommodate a reserve of the second carrier. In one variant, the buffer storage is constructed as a box open to the placement position, which guides the second carrier in a negative pressure-retaining or decelerating manner as the case may be.

[0037] In another variation, a first image acquisition device is provided and configured to acquire an image of at least one component on the first carrier in the region of the placement position and send the image to the control system via a signal. In another variation, a second and / or third image acquisition device is arranged, which is provided and configured to acquire an image of at least one electronic assembly on the second carrier containing / not containing a component in the region on the upstream or downstream side of the placement position and send the image to the control system via a signal.

[0038] In another variant, a distance is provided between the curved abutment surface and between the conveying device and the first receiving element, and the distance can be adjusted by means of a first adjusting device.

[0039] In another variant, the curved abutment surface and the conveying device are held by a substantially U-shaped receiving element, which is received by two bearings and is movably guided substantially perpendicularly to the conveying direction of the second carrier, wherein the U-shaped receiving element, the curved abutment surface and / or at least one conveying device are positioned as appropriate by corresponding adjustment devices in response to information sent by the control system via signals.

[0040] In another variant, at least one hold-down element is provided and arranged in the region of the curved abutment surface or the upstream and / or downstream side of the placement position, respectively, so that the second carrier is exposed to negative pressure in the region of the curved abutment surface.

[0041] In another variant, at least one heating zone is arranged in the area on the upstream and downstream sides of the curved abutment surface or placement position, and / or along the lateral extension of the abutment surface or placement position, and the at least one heating zone is arranged and configured to release heat in response to information sent by the control system via a signal, wherein when multiple heating zones are provided, the multiple heating zones are arranged and configured to release heat independently of each other in response to information sent by the control system via a signal.

[0042] In another variant, a curved abutment surface and an adhesive feeder are arranged in the area upstream of the placement position, which are arranged and configured to allow the second carrier to pass between the abutment surface and the adhesive feeder, and to release the adhesive to the second carrier in portions in response to information sent by the control system via a signal.

[0043] In another embodiment, a fourth and / or fifth image acquisition device is arranged in the area on the upstream and / or downstream side of the curved abutment surface, and is configured and arranged to capture an image of at least one electronic component on a second carrier containing / not containing the released adhesive in the area on the upstream or downstream side of another curved abutment surface, and send it to the control system via a signal.

[0044] In another variant, an additional conveying device is assigned to the further curved contact surface, which is provided and configured to convey the second carrier body along the further curved contact surface.

[0045] In another variant, the separation device is associated with an adjustment device, which is arranged and configured to position the separation device along the conveying direction of the second carrier and / or transversely to the conveying direction. In another variant, a first image acquisition device is arranged at the placement position, which is arranged and configured to detect the position of at least one of the assemblies relative to the placement position on the second container guiding the second carrier. Optionally, a second image acquisition device is arranged, which is arranged and configured to be arranged upstream of the placement position (AP), detect the position of at least one of the electronic assemblies located on the second carrier relative to the second container, and send information representing the detected position to the control system via a signal.

[0046] The conveying device which is functionally and / or spatially associated with the second receiving part is also referred to here as third or further conveying device for the second carrier.

[0047] The method proposed here is for transferring an electronic component from a first carrier to a second carrier, wherein the first carrier carries a plurality of singulated components in a manner that they can be separated therefrom, and the second carrier has a nearly endless construction scheme and carries a plurality of electronic assemblies in its longitudinal extension, each of the plurality of components being transferred from the first carrier to one of the plurality of electronic assemblies. The method comprises the following steps, which are carried out in the order given below or in another order:

[0048] Using a first container to accommodate the first carrier;

[0049] guiding the second carrier along its longitudinal extension along the conveying direction of the second carrier using a second receiving member;

[0050] The first receiving part receives the first carrier so that the component carried by the first carrier is oriented toward the second receiving part;

[0051] Separating the plurality of components from the first carrier by a separation device in a contact or non-contact manner to transfer the components to the second carrier;

[0052] In response to information sent by a control system via a signal, the second carrier is transported by a conveying device in a position relative to the placement position so that the electronic assembly located on the second carrier reaches the placement position on a second container guiding the second carrier; and the second carrier is acted on by a heating device in the area of ​​the second container so that the second carrier is temperature-controlled from a side of the second container away from the first container before, at and / or after the placement position.

[0053] By controlling the heating device accordingly with a control system, the temperature adjustment is performed uniformly or section by section / area by section in the area of ​​the second receiving part according to the material properties / melting point of the contact points of the component to be transferred and / or the material properties / melting point of the contact points of the component / electronic assembly located on the second carrier. In this way, it is possible to simply and quickly ensure that the mechanical connection and electrical connection between the component to be transferred and the component / electronic assembly located on the second carrier are both safe and reliable.

[0054] The position of the second carrier and the assembly located thereon is determined by one or more of the image acquisition devices before, at and / or after the placement position in order to place the component to be placed on the assembly. Subsequently, the control system combines the result of the image acquisition (s) with the position data of the other conveying device and uses it to determine the exact position of the assembly located on the second carrier and to position the first carrier and the assembly to be placed accordingly. One of the image acquisition devices checks the top side of the second carrier. Therefore, the quality of the image acquisition is independent of the transparency of the substrate material.

[0055] Preferably, a fixed heating device that at least partially follows the contour of the second container heats the second carrier in the region of the second container, the heating device being constructed as a heating strip having one or more heating zones to be heated to different temperatures. In this way, the second carrier is temperature-controlled from the side of the second container that is remote from the first container before, at and / or after the placement position. The possible multiple heating zones of the heating strip enable the heating and cooling characteristics of the material to be set more precisely. For this purpose, in a variant, the heating device is arranged in a recess in the second container. In a variant, the heating strip or a part of the heating strip may protrude slightly from the second container in the direction of the first container. As a result, the second carrier and the assembly located on the second carrier are temperature-controlled in a targeted and spatially / positionally specific manner.

[0056] In a variant, for example, two, three or more assemblies are arranged laterally on the second carrier. Accordingly, two, three or more heating devices spaced apart from each other laterally are provided, and the plurality of heating devices are constructed as an annular support disk with corresponding heating strips.

[0057] As an alternative or in addition to a heating device with heating strips which is primarily temperature controlled in a contact manner, the second carrier and the assembly located thereon can be heated in a contact-free manner by means of laser, infrared or induction.

[0058] In a variant, the first container containing the first carrier is located directly above the second carrier on the second container. Unlike the current solutions, the first container and the separation device have a movement space transverse to the conveying direction of the second carrier and at least approximately equal to the width of the second carrier. As a result, the working area / component placement area is significantly increased within the width of the second carrier. Thus, multiple side-by-side rows of electronic components, such as RFID antennas, located on the wider second carrier can be reached via the first carrier and assembled in the placement position by manipulating the separation device.

[0059] In one embodiment, the first carrier has a first side facing the separation device and a second side facing away from the separation device, the second side facing the second carrier located on the second container, wherein a plurality of components are detachably applied to the second side of the first carrier; the first image acquisition device is configured to acquire image data of an area, within which the separation device is configured to interact with at least one of the plurality of components in a contact or non-contact manner, thereby separating the component from the first carrier; and the control system is configured to determine position data of the component to be transferred based on the acquired image data, and to generate control commands for the separation device and the corresponding conveying device based on the position data.

[0060] In one variation, the second image acquisition device is arranged on the upstream side of the placement position on the second carrier (relative to the conveying direction of the second carrier), and is arranged and configured to detect one or more of the multiple electronic assemblies located on the second carrier along the conveying direction of the second carrier and / or transverse to the conveying direction of the second carrier with respect to their positions relative to the second accommodating member, and send information representing the detected positions to the control system via a signal.

[0061] In a variant, the third transport device is assigned a first sensor device which is arranged and configured to send information about the transport direction and transport path of the second carrier and / or the position of the relative placement position of the electronic assembly located on the second carrier to the control system via signals.

[0062] In one embodiment, the control system is configured to control the second conveying device based on information about the position of at least one electronic component from the second image acquisition device, information about the conveying direction and conveying path of the second carrier, and information about the position of the relative placement position of at least one of the multiple components from the first image acquisition device, so that the separation device moves transversely to the conveying direction of the second carrier to the placement position, and the separation device is activated for separation of the component from the first carrier.

[0063] In one embodiment, the device includes a fourth conveying device, which is configured and arranged to: in response to information sent by the control system via a signal, cause the first accommodating member to move relative to the second accommodating member along the conveying direction of the second carrier; and / or includes a fifth conveying device, which is configured and arranged to: in response to information sent by the control system via a signal, cause the first accommodating member to rotate a certain angle relative to the second accommodating member.

[0064] In another embodiment, the device includes a sixth conveying device, which is arranged and configured to: in response to information sent by the control system via a signal, convey the second carrier through the second container along the conveying direction in such a way that (without sliding and without stretching) at least one of the multiple electronic assemblies located on the second carrier reaches a placement position on the second container guiding the second carrier.

[0065] In another variation of the device, when the separation device is configured to separate the component from the first carrier in a contact manner, the separation device includes a contact pin, which is configured and dimensioned to pierce the first carrier in response to information sent via a signal via the control system so as to separate one of the multiple components from the first carrier and transfer it to a second carrier; or, when the separation device is configured to separate the component from the first carrier in a non-contact manner, the separation device has a controllable energy source, which is configured and dimensioned to supply energy to the first carrier in response to information sent via a signal via the control system so as to separate one of the multiple components from the first carrier and transfer it to the second carrier.

[0066] In another variant of the device, the second container comprises a (circular) cylindrical drum or a convex surface through which the second carrier reaches the placement position on the second container, wherein in one variant, the second container has a plurality of outlets on its cylinder / surface for guiding the second carrier, which are configured to hold the second carrier on the second container (without sliding and without stretching) via negative pressure.

[0067] In another embodiment, the device includes a third image acquisition device, which is arranged on the downstream side of the placement position (relative to the conveying direction of the second carrier) and is configured and arranged to detect at least one of the multiple electronic assemblies located on the second carrier and the components transferred to the assembly in terms of their relative positions to each other, and send information representing the detected position to the control system via a signal.

[0068] In another embodiment, the device includes an eighth conveying device, which is configured and arranged to convey the second image acquisition device relative to the second container and the placement position, so as to detect at least one component placement point located on the second carrier through the second image acquisition device, and / or detect the position of at least one of the multiple electronic assemblies located on the second carrier, and send information representing the detected position to the control system via a signal; and / or includes a ninth conveying device, which is configured and arranged to convey the third image acquisition device relative to the second container and the placement position, so as to detect the positions of at least one of the multiple electronic assemblies located on the second carrier and the components transferred to the assemblies relative to each other, and send information representing the detected positions to the control system via a signal.

[0069] As an alternative, the second and / or third image acquisition device can be pivotably mounted on the second receiving element and can be electronically controlled or manually adjusted with respect to its orientation toward the component placement point or the electronic assembly located on the second carrier and toward the transferred component.

[0070] In addition, to achieve the above-mentioned purpose, the present invention also proposes another device for applying adhesive from a reserve to a second carrier, wherein the second carrier adopts a nearly endless construction scheme and carries a plurality of electronic assemblies to be applied thereto in its longitudinal and lateral extensions, so as to subsequently transfer the components to one of the assemblies, wherein the other device includes: a third container, which is configured to guide the second carrier along its longitudinal extension along the conveying direction of the second carrier through the third container; a feeding device for the adhesive, which is configured to apply the adhesive toward the third container in a controlled and quantitative manner to a bonding point located on the second carrier at an adhesive release position, where one of the plurality of electronic assemblies is located; an eleventh conveying device a device which is arranged and configured to enable a feeding device for the adhesive to move relative to the third container transversely to the conveying direction of the second carrier; a fourth image acquisition device which is arranged on the upstream side of the adhesive release position and is arranged and configured to detect the position of at least one of the plurality of electronic assemblies located on the second carrier relative to the third container, and send information representing the detected position to the control system via a signal; a twelfth conveying device which is arranged and configured to: in response to information sent via a signal via the control system, convey the second carrier relative to the adhesive release position in such a manner that at least one of the plurality of electronic assemblies having a bonding point on the second carrier reaches the adhesive release position on the third container guiding the second carrier.

[0071] The adhesive releasing device is advantageously used in conjunction with the device for transferring the electronic component from the first carrier to the second carrier and is arranged on the upstream side thereof, but can also be used independently.

[0072] The same applies to the adhesive dispensing device, which allows the use of multiple strips as the second carrier, reduces the complexity of the adhesive dispensing process and increases the throughput to the area of ​​the device that can also process multiple strips. The solution proposed here for dispensing adhesive can replace the previous inspection of the second carrier at the adhesive dispensing point. Thus, it is also possible to use a second carrier with low transparency or even completely opaque without causing a loss of precision in the adhesive dispensing process before the component is placed.

[0073] In order to detect the adhesive release position on the tape before the adhesive is released, conventional DDA devices for single-row tapes use a camera that is mounted directly in the placement area on the back / bottom side of the tape of the second carrier. Based on this layout, conventional DDA devices can only process completely transparent materials, such as PET, without restrictions on placement accuracy, and opaque materials cannot usually be used as the second carrier.

[0074] By means of the solution proposed by the invention, the bonding points on the strip are detected (in terms of space / time) before the actual adhesive is released, wherein the fourth image acquisition device detects the corresponding bonding points located on the second carrier itself directly, i.e. without passing through the second carrier (in combination with the corresponding electronic assembly). In this case, the second carrier is conveyed to the adhesive release position in such a controlled manner that when the feed device releases a portion of adhesive in a quantitative manner at the bonding point, the bonding point is aligned as accurately as possible with the outlet position of the feed device for the adhesive.

[0075] In one variation, the fourth image acquisition device is arranged on the upstream side of the adhesive release position on the second carrier (relative to the conveying direction of the second carrier), and is arranged and configured to detect one or more of the multiple electronic assemblies located on the second carrier relative to the third receiving member transversely to the conveying direction of the second carrier, and send information representing the detected position to the control system via a signal.

[0076] In a variant, the twelfth conveying device has associated therewith a second sensor device which is arranged and configured to send information about the conveying direction and the conveying path of the second carrier relative to the adhesive release position to the control system via a signal.

[0077] In one embodiment, the control system is configured to control the eleventh conveying device based on information about the position of at least one electronic component from a fourth image acquisition device, information about the conveying direction and conveying path of the second carrier, and information about the position of at least one of the components relative to the adhesive release position from the fourth image acquisition device, so that the feeding device moves transversely to the conveying direction of the second carrier to a placement position, and the feeding device is activated with respect to separation of the component from the first carrier.

[0078] In one embodiment, the device includes a thirteenth conveying device, which is arranged and configured to: in response to information sent by the control system via a signal, convey the second carrier along the conveying direction through the second container in such a way that the second carrier is conveyed (without sliding and without stretching) so that at least one of the multiple electronic assemblies located on the second carrier reaches the adhesive release position on the second container guiding the second carrier.

[0079] In another variant of the device, the third accommodating member comprises a (circular) cylindrical drum or a convex surface through which the second carrier reaches the placement position on the third accommodating member, wherein in one variant, the second accommodating member has several outlets on its cylinder / surface for guiding the second carrier, which are configured to hold the second carrier on the third accommodating member (without sliding and without stretching) via negative pressure.

[0080] In another embodiment, the device includes a fifth image acquisition device, which is arranged on the downstream side of the adhesive release position (relative to the conveying direction of the second carrier) and is configured and arranged to detect at least one of the multiple electronic components located on the second carrier and the adhesive released to the component relative to each other, and send information representing the detected position to the control system via a signal.

[0081] In another embodiment, the device includes a fourteenth conveying device, which is arranged and configured to convey a fourth image acquisition device relative to a third receiving member and an adhesive release position, thereby detecting at least one bonding point located on the second carrier through a fifth image acquisition device, thereby detecting the position of at least one of the multiple electronic assemblies located on the second carrier, and sending information indicating the detected position to the control system via a signal; and / or includes a fifteenth conveying device, which is arranged and configured to convey a fifth image acquisition device relative to a third receiving member and an adhesive release position, thereby detecting the relative positions of at least one of the multiple electronic assemblies located on the second carrier and the adhesive released to the assemblies, and sending information indicating the detected position to the control system via a signal.

[0082] As an alternative, the fourth and / or fifth image acquisition device is mounted in a pivotable manner and its orientation can be electronically controlled or manually adjustable.

[0083] In the aforementioned device for transferring an electronic component from a first carrier to a second carrier, and / or for applying an adhesive from a reserve to a second carrier, the second to fifth image acquisition devices may be constructed as follows: the image acquisition device is associated with an illumination device, wherein the illumination device is configured to illuminate a second container with light of different wavelengths, the second container is configured to carry an object located on the second carrier to be photographed by the image acquisition device, the sixteenth, seventeenth, eighteenth and / or nineteenth conveying device is configured to convey the corresponding image acquisition device together with the illumination device associated therewith along the second container, and the eighth, ninth, fourteenth and / or fifteenth conveying device is provided and configured to convey the corresponding second, third, fourth and / or fifth image acquisition device relative to the second and / or third container and the component placement position or the adhesive release position along the conveying direction of the second carrier.

[0084] In a variant of the image acquisition device, the illumination device comprises a white light source, a red light source and / or a (super) blue light source.

[0085] In a variant of the lighting device, the red light source and / or the (super) blue light source is designed as a ring light source which at least partially surrounds a detection area of ​​the image acquisition device.

[0086] In a variant of the image acquisition device, the white light source is arranged on a side of the at least partially light-transmissive beam deflection system that is remote from a detection region of the image acquisition device.

[0087] In a variant of the image acquisition device, the image acquisition device comprises a focusing optical system which has a fixed adjustable distance from a side of the at least partially light-transmissive beam deflection system facing the focusing optical system.

[0088] Although some of the foregoing aspects are described in conjunction with the working method of the device, these aspects may also relate to the structure of the device. The aspects described in conjunction with the device are also applicable to the working method. The foregoing describes various aspects of the device and the working method in an interrelated manner to illustrate their interaction; however, the multiple aspects are also independent of each other and disclose other devices and other working methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0089] Further objects, features, advantages and uses will become apparent from the following description of the embodiments in conjunction with the accompanying drawings. The sizes and proportions of the components shown in the drawings are not necessarily drawn to scale; in the embodiments to be implemented, the sizes and proportions may differ from those shown here.

[0090] Figure 1 A schematic side view of an apparatus for transferring an electronic component from a first carrier to a second carrier and an apparatus for applying an adhesive to the second carrier is shown.

[0091] Figure 1a A schematic perspective view of a second pod with a partially shown second carrier on which components can be placed is shown.

[0092] Figure 2 A schematic top view of a worktable that can be adjusted in X / Y / Theta coordinates is shown.

[0093] Figure 3 Schematic top views of the second to fifth image acquisition devices are shown.

[0094] The method and device variants described herein, as well as their functions and operation, are intended only to make the structure, working method and characteristics easier to understand. The drawings are partially schematically shown, in which the main characteristics and effects are partially and significantly enlarged to illustrate the functions, working principles, technical solutions and characteristics. DETAILED DESCRIPTION

[0095] In the drawings, components that are equivalent to each other or have similar functions are indicated by consistent reference numerals. The method and the device are now described in conjunction with embodiments.

[0096] Figure 1 (On the right) a device 100 is shown for transferring an electronic component B from a first carrier W to a second carrier BM. In this variant, the first carrier W has the shape of a semiconductor component wafer, which is roughly circular here, and carries a plurality of individualized components B, which can be separated from the first carrier in the manner described below. The second carrier BM is constructed as a nearly endless strip and carries a plurality of electronic assemblies ANT in its longitudinal and / or lateral extension. In the variant shown here, the assembly ANT is a printed antenna section of an RFID module or an antenna section laid as a wire. Each of the plurality of components B is to be transferred from the first carrier W to one of the plurality of electronic assemblies ANT. The device has a first container A1, which is configured to accommodate the first carrier W. The first container A1 matches the first carrier W in terms of its shape.

[0097] In the variant shown, the second container A2 has the shape of a cylindrical roll. The second carrier BM is guided along its longitudinal extension along the conveying direction FR by means of a cylindrical outer wall. Detailed information related to this is provided below. The first container A1 accommodates the first carrier W in such a way that the component B carried by the first carrier is oriented toward the second container A2. A separation device TE is provided on the side of the first container A1 away from the second container A2. The first carrier W has a first side facing the separation device TE and a second side facing away from the separation device TE, the second side facing the second carrier BM located on / at the second container A2. A plurality of components B are applied in a detachable manner on the second side of the first carrier W. The separation device TE is used to separate the component B from the first carrier W in a contact or non-contact manner, thereby transferring the component to the second carrier BM at the placement position AP.

[0098] The first receiving element A1 is part of a workbench with adjustable X / Y / Theta coordinates, the X / Y axes of which as well as the rotational position Theta are adjusted via a conveying device controlled by an electronic control system ECU. In particular, the first conveying device F1 constructed as a linear servo drive is arranged and configured to move the first receiving element A1 relative to the second receiving element A2 transversely to the conveying direction FR of the second carrier BM. (See also Figure 2 ).

[0099] In one embodiment, a second conveying device F2 designed as a linear servo drive is provided and configured to move the separating device TE relative to the second receiving element A2 transversely to the conveying direction FR of the second carrier bodies BM.

[0100] An image acquisition device I1 designed as a camera is arranged at the separating device TE and serves to acquire, from a top view, the position of at least one of the components B relative to its placement position AP on the second receiving part A2 guiding the second carrier BM.

[0101] The second image acquisition device I2 is arranged on the upstream side of the placement position AP and is assigned to the second container A2. Figure 1a ) is available in which the second image acquisition device I2 is movable in a controlled manner on the second accommodating part A2 (for the second carrier BM having a plurality of electronic assemblies ANT in the transverse direction) along the longitudinal extension of the roll-shaped second accommodating part A2, i.e. transversely to the conveying direction FR of the second carrier BM, and / or can be adjusted manually or motor-driven by a predetermined degree along the circumference on the circumferential surface of the roll-shaped second accommodating part A2. The image acquisition device I2 can be connected to the second accommodating part A2, for example, via a deflection arm. In the variant in which the second carrier BM has a single row of electronic assemblies ANT, the second image acquisition device I2 is rigidly mounted and its field of view is adjusted once.

[0102] The second image acquisition device I2 is used to acquire the position of at least one of the plurality of electronic assemblies ANT located on the second carrier BM relative to the second receiving part A2, and send information representing the acquired position to the control system ECU via a signal.

[0103] In this embodiment, the third conveying device F3' for the second carrier BM is composed of two conveying rollers driven in a controlled manner, which are arranged on the upstream side and the downstream side of the roll-shaped second container A2, and the second carrier BM is guided around the two conveying rollers. In response to information sent by the control system ECU via a signal, the second carrier BM is conveyed by the two conveying rollers driven in a controlled manner with respect to its position relative to the placement position AP, so that at least one of the plurality of electronic assemblies ANT located on the second carrier BM reaches the placement position AP on the second container A2 guiding the second carrier BM.

[0104] Alternatively or in addition, another third conveying device F3" for the second carrier BM is provided and configured to, in response to information sent by the control system via a signal, convey the second carrier BM relative to its placement position AP so that the electronic assembly ANT located on the second carrier BM reaches the placement position AP on the second container A2 guiding the second carrier BM.

[0105] In the case where the second receiving element A2 is designed as a cylindrical drum, an alternative / supplementary embodiment of a further third conveying device F3" for the second carrier BM is a rotary drive of said drum (cf. Figure 1a ).

[0106] In the case of the second receiving part A2 being designed as a fixing surface which is arched or curved convexly toward the first receiving part A1 , an alternative / supplementary embodiment of a further third conveying device F3 ″ is a drive for the second carrier body BM arranged on both sides of the respective heating device H.

[0107] It can be understood that the placement position AP can be changed along the longitudinal direction of the second carrier BM and along the lateral extension of the second carrier to accurately place the component B at the default position of the assembly ANT, and the corresponding area of ​​the second carrier BM is located on the second receiving part A2 and is to be aligned with the component B on the first carrier W. Correspondingly, the first carrier W is also displaced along both the longitudinal direction and the lateral extension of the second carrier BM under the control of the control system ECU.

[0108] Obviously, a strip of multiple rows is used as the second carrier BM. This means a strip that carries, for example, rows of two, three or more assemblies ANT in its transverse extension, which are repeated almost endlessly in the longitudinal direction (conveying direction) of the strip. Slightly transparent or even completely opaque substrate materials can be used as the second carrier BM without causing a loss of precision during the placement of the components.

[0109] exist Figure 1a In the embodiment shown, the second accommodation member A2 is arranged along the cylindrical axis (see also Figure 3 ) is a rigid drum of a generally cylindrical shape with a plurality of sections, each section AF1, AF2 of which is fixed or can be rotated by a drive or by a corresponding drive / conveying device. In a variant, one of the two sections AF1, AF2 of the generally cylindrical drum is fixed and the other part is rotating. Between the two sections AF1, AF2 of the generally cylindrical drum of the second accommodating part A2, a heating device H is arranged, which is generally constructed in the form of an annular support disk and is fixed in position relative to the two sections AF1, AF2. The heating device H is arranged on the circumference of the support disk. The outer circumference of the annular support disk generally corresponds to the diameter of the cylindrical drum of the second accommodating part A2, or is slightly larger than the diameter. The heating device H is arranged and configured to perform temperature control on the second carrier BM and in particular the assembly ANT located thereon from the side of the second accommodating part A2 that is away from the first accommodating part A1 before, on and / or after the placement position AP.

[0110] Alternatively, the two sections AF1, AF2 can rotate on both sides of the fixed heating device H. In another variant, a rotating component with an opening O1 under negative pressure is provided on one or both sides between the fixed heating device H and the two sections AF1, AF2, which are also fixed in position. The rotating component can be an annular drive. One or more motor-driven components associated with the second container A2 form another conveying device F3.

[0111] In particular, at least one heating device H is arranged in the region upstream and / or downstream of the curved abutment surface AF or at least of the placement position AP and / or along the lateral extension of the abutment surface or the placement position, and is configured to release heat in response to information sent by the control system via signals. In another variant with multiple heating zones, not further shown, the multiple heating zones are provided and configured to release heat independently of one another in response to information sent by the control system ECU via signals.

[0112] The cylindrical roll of the second container A2 has a curved abutment surface AF with an opening O1 to be connected to the negative pressure source Vak. If the second carrier BM is arranged around the curved abutment surface AF and the negative pressure source Vak is connected to the opening O1, the second carrier BM is tightly abutted against the curved abutment surface AF by the negative pressure. In a variant of the device, another conveying device F3 includes two drives that cause the sections AF1 and AF2 to rotate synchronously so as to convey the second carrier BM along the placement position AP under the control of a signal from the ECU.

[0113] For clarity, Figure 1a Only a section of the second carrier BM is shown, which section is located directly at the placement position AP and on which the component B has already been separated from the first carrier W by the separating device TE and from which the component B was transferred by the separating device TE.

[0114] In a variant not shown further, the fixed strip engages parallel to the central longitudinal axis of the cylindrical reel on the heating device H. As a result, the second carrier BM is lifted from the heating device in a controlled manner when it is guided onto the curved abutment surface AF.

[0115] The heating device is used to heat the electronic assembly ANT on the second carrier BM before the placement position AP and / or in the area before the placement position AP and / or after the placement position AP. For this purpose, in the variant shown, the heating device H is designed as a resistive heating strip that at least partially follows the circumference of the second receiving part A2, which is divided into independently energizable heating zones. In this way, the temperature of the assembly ANT on the second carrier BM can be raised and lowered in a controlled manner so that the soldered connection (and possibly also the adhesive connection) between the corresponding components B placed on the corresponding assembly ANT is electrically and mechanically stable and reliable.

[0116] In another variant of the device, not shown further, a heat shield is arranged before and / or after the placement position, as seen in the conveying direction of the second carrier BM. Alternatively or additionally, a gap for the second carrier BM is arranged between the curved contact surface AF and the heat shield. As a result, the heating device H does not heat the first carrier and the adhesive layer between the component B and the first carrier W, or heats it only slightly.

[0117] Figure 1 It is shown how a buffer store PS is arranged upstream of the placement position AP / curved abutment surface AF, which is provided and configured to accommodate a supply of second carriers BM. To this end, the second carriers BM are guided through the buffer store PS, which is designed as a rectangular box open toward the top and, in a variant not shown, holds the second carriers BM with negative pressure or slows them down.

[0118] The first image acquisition device I1 is provided and configured to acquire an image of at least one component B on the first carrier W in a vertical (plus or minus 50°) top-down manner in the area of ​​the placement position AP, and to send the position of at least one component B to the control system ECU via a signal. In addition, image acquisition devices I2 and I3 are arranged, which are provided and configured to acquire an image of the second carrier BM containing / not containing the component B transferred to the assembly ANT in a corresponding vertical (plus or minus 50°) top-down manner in the area upstream or downstream of the placement position AP, and to send the position of at least one component B to the control system ECU via a signal.

[0119] Furthermore, the distance D between the curved abutment surface AF and the first receiving part A1 can be adjusted by the first adjusting device V1 .

[0120] Along the second carrier BM, at least one pressing member NH is provided in the area on the upstream and / or downstream side of the placement position AP, which is configured to expose the second carrier BM in the area of ​​the abutment surface AF from the opening to the negative pressure Vak with a controlled contact pressure in the area of ​​the curved abutment surface AF.

[0121] The hold-down element NH is a rotatably mounted roller without a drive, which has a greater circumference / one or more ridges in sections, ie in the area of ​​the assembly ANT, and along its axis of rotation. The ridges orient the second carrier BM towards the second receiving element A2 as early as possible.

[0122] like Figure 1As shown in the left half, a third container A3 and a feeder SE for adhesive K are arranged in the area upstream of the placement position AP. The second carrier (BM) passes between the other curved abutment surface AF2 and the adhesive feeder. In response to information sent by the control system ECU via a signal, the feeder SE releases the adhesive K to the second carrier BM in portions.

[0123] During operation of the device, the electronic components B are transferred from the first carrier W to the second carrier BM. The first carrier W carries a plurality of individualized components in a manner that they can be separated from it. The second carrier BM adopts a nearly endless construction scheme and carries a plurality of electronic assemblies ANT on a track in its longitudinal extension. For each electronic assembly ANT, one of the components B is transferred from the first carrier W. The processing method is as follows:

[0124] The first carrier W is accommodated in the first receiving part A1 together with the component B. The first receiving part A1 is used to accommodate the first carrier W so that the component B carried by the first carrier is oriented toward the second receiving part A2 and thus toward the electronic assembly ANT.

[0125] The second carrier BM is guided along its longitudinal extension through the second accommodating member A2 in the conveying direction of the second carrier BM toward the placement position AP, so that each assembly ANT of the second carrier BM passes through the placement position AP in sequence.

[0126] In response to information sent by the control system via a signal, the second carrier BM is transported by the second conveying device F2 in a relative placement position AP of the second carrier so that the electronic assembly ANT located on the second carrier BM reaches the placement position AP on the second accommodating part A2 guiding the second carrier BM at a position for the corresponding component B to fall.

[0127] The component B is separated from the first carrier W in a contact or non-contact manner by a separating device TE in the form of a feeler pin or a laser beam controlled by an electronic control device, in order to transfer the component to a second carrier BM.

[0128] The heating device H acts in the region of the second receiving part A2 in order to control the temperature of the second carrier BM from the side of the second receiving part remote from the first receiving part A1 before, at and / or after the placement position AP.

[0129] The placement position AP on the strip of the second carrier BM is detected before the actual placement of the component in terms of space / time. In this case, the second image acquisition device I2 detects the component placement point on the second carrier BM itself directly (i.e. without passing through the second carrier). In this case, the second carrier BM is transported to / placed at the placement position AP in such a controlled manner that when the separation device TE separates the component B from the first carrier W and transfers this component to the second carrier BM in the Z direction, the component placement point is aligned as accurately as possible with the position of the component to be placed on the first carrier W.

[0130] By temperature-controlling the second carrier BM / the electronic assembly ANT on the second carrier BM with the heating device H, the relevant part / area of ​​the electronic assembly ANT is heated so that the solder or part of the electronic assembly ANT thereon melts, and the component is transferred with its contact points from the first carrier to the electronic assembly ANT precisely at the placement position AP, and is firmly and reliably electrically and mechanically connected to the assembly. By sending the second carrier BM and the electronic assembly ANT along the heating device (depending on the situation, the temperature along the heating system to the placement position AP can be individually set to increase stepwise or steplessly, and then decrease to a predetermined temperature), which matches the material of the electronic assembly ANT to be temperature-controlled or melted, electrical and / or mechanical contact can be implemented extremely accurately.

[0131] The first container A1 containing the first carrier W is located directly above the second carrier BM arranged on the second container A2. The first container A1 and the separation device TE have a movement space that is transverse to the conveying direction FR of the second carrier BM and is at least approximately equal to the width of the second carrier BM. (See Figure 2 ) Thus, the working area / component placement area extends substantially within the width of the second carrier BM. This also applies in particular to the variants designed to process the second carrier BM and a plurality of electronic assemblies ANT in the transverse direction.

[0132] The first image acquisition device I1 is configured to acquire image data of an area in which the separation device TE is configured to interact with at least one of the individual components B in a contacting or non-contacting manner to separate the component from the first carrier W.

[0133] The control system ECU is configured to determine position data of the component B to be transferred from the acquired image data and to generate control commands for the separating device TE and the corresponding conveying devices F1 to Fn based on the position data.

[0134] The second image acquisition device I2 is arranged on the upstream side of the placement position AP on the second carrier A2 relative to the conveying direction X of the second carrier BM, and is set and configured to detect one or more of the multiple electronic assemblies ANT located on the second carrier BM relative to the second accommodating member transversely to the conveying direction X of the second carrier BM, and send information representing the detected position to the control system ECU via a signal.

[0135] The third transport device F3 for the second carrier BM is assigned a first sensor device SE1 which is arranged and configured to send information about the transport direction and the transport path of the second carrier BM and any electronic assemblies thereon relative to the placement position AP via signals to the control system ECU.

[0136] The control system ECU is used to control the second conveying device F2 based on the information about the position of at least one electronic assembly ANT from the second image acquisition device I2, based on the information about the conveying direction and the conveying path of the second carrier BM, and based on the information about the position of at least one of the components B relative to the placement position AP from the first image acquisition device I1. In this way, in a variant designed to process the second carrier BM and a plurality of electronic assemblies ANT in the transverse direction, the control system ECU moves the separation device TE (in the conveying direction and) transversely to the conveying direction X of the second carrier BM) to the placement position AP, and activates the separation device TE with respect to the separation of the component B from the first carrier W. When the electronic assemblies ANT are arranged in a single row, during the operation of the device, the separation device TE does not perform any transverse movement, but only performs a lowering / lifting movement (in the z direction).

[0137] In response to information sent by the control system ECU via signals, the fourth conveying device F4 is used to move the first container A1 relative to the second container A2 in the conveying direction FR of the second carrier BM.

[0138] In general, by controlling the corresponding X / Y drives of the conveying devices F1 and F4 accordingly, each component B can be placed in the double-dash area AF to transfer the component B to the second carrier BM located on the second container A2. In a variant, the double-dash area AF can be larger than the lateral extension of the second carrier BM in the lateral extension direction of the second carrier BM.

[0139] In response to information sent by the control system ECU via a signal, the fifth conveying device F5 is used to rotate the first container A1 relative to the second container A2 by an angle Theta.

[0140] In a variant, the separating device TE is configured to separate the component B from the first carrier W by contact. To this end, the separating device has a contact pin N which is configured and dimensioned so that, in response to information sent by the control system ECU via a signal, (at Figure 1 The first carrier W is pierced by a laser beam (from above) to separate each of the components B from the first carrier W and transfer them to a second carrier BM. In a second variant, the separation device is configured to separate the components B from the first carrier W in a contactless manner. To this end, the separation device TE has a controllable energy source, which is configured and dimensioned so as to supply the first carrier W with laser energy, for example, in response to information sent by the control system ECU via a signal, to separate each of the components B from the first carrier W and transfer them to a second carrier BM.

[0141] The second accommodating member A2 is a cylindrical roll or a convex surface, through which the second carrier BM passes to reach the placement position AP on the second accommodating member A2. In a variant, the second accommodating member A2 has a plurality of small outlets on its cylinder / surface for guiding the second carrier BM, so as to keep the second carrier BM on the second accommodating member A2 without sliding and stretching via the negative pressure Vak.

[0142] In one variation, the cylinder / surface of the second container may be configured, or the negative pressure Vak may be controlled, so that the cylinder / surface does not have a negative pressure Vak below the placement position, but only exists on the upstream and downstream sides of the placement position AP. Thereby, the second carrier BM is held by the negative pressure on the upstream and downstream sides of the placement position AP.

[0143] In a variation, the second accommodating member A2 can be moved toward and away from the first accommodating member A1 along the Z direction via the adjusting device to adjust the distance between the first and second accommodating members.

[0144] In another variant, compressed air can be introduced into the second accommodating part A2 and / or the third accommodating part A3 at least in a portion of the corresponding area where the second carrier BM is not in abutment with the accommodating part A2 or A3, and the air is discharged through the opening to blow out dirt that may be sucked into the vacuum hole over time.

[0145] The third image acquisition device I3 is arranged at the downstream side of the placement position AP in the second container A2 relative to the conveying direction FR of the second carrier BM. The image acquisition device is used to detect the relative positions of at least one of the multiple electronic assemblies ANT located on the second carrier BM and the component B transferred to the assembly, and sends information representing the detected position to the control system ECU via a signal.

[0146] The eighth conveying device F8 is used to convey the second image acquisition device I2 relative to the second container A2 and the placement position AP, so that at least one component placement point located on the second carrier BM is detected by the second image acquisition device I2. In a variant designed to process the second carrier BM and a plurality of electronic assemblies ANT in the transverse direction, the second image acquisition device I2 can be moved in a controlled manner along the longitudinal direction of the roll-shaped second container A2, that is, can be moved transversely to the conveying direction FR of the second carrier BM, and / or can be moved in a controlled manner along the circumference of the circumferential surface of the roll-shaped second container A2 by a predetermined degree. As an alternative, the angle is manually adjusted before starting. In a variant in which the second carrier BM has a single row of electronic assemblies ANT, the second image acquisition device I2 is rigidly mounted and its field of view is adjusted once.

[0147] Thereby, at least one of the plurality of electronic assemblies ANT located on the second carrier BM can be detected in terms of its position, and information indicating the detected position can be sent to the control system ECU via a signal. In addition, in this variant, a ninth conveying device F9 is provided, which is used to convey the third image acquisition device I3 relative to the second container A2 and the placement position AP, similar to the eighth conveying device F8 for the second image acquisition device I2. Thereby, the third image acquisition device I3 can detect at least one of the plurality of electronic assemblies ANT located on the second carrier BM and the component B transferred to the assembly in terms of their relative positions to each other, and send information indicating the detected position to the control system ECU via a signal.

[0148] like Figure 1 On the left, a further (sub)device is shown for applying adhesive K from a reserve to a second carrier BM. As described above, the second carrier BM has a nearly endless construction scheme and carries in its longitudinal and / or transverse extension a plurality of electronic assemblies ANT to which adhesive K is applied, for the subsequent transfer of the component B to one of the assemblies ANT. The further device comprises a third receiving element A3, which guides the second carrier BM along its longitudinal extension in the conveying direction FR of the second carrier BM.

[0149] exist Figure 1 In the embodiment, a feeding device SE for adhesive K is provided above the third accommodating part A3, for applying adhesive K toward the third accommodating part A3 to a bonding point KS located on the second carrier BM in a controlled and quantitative manner at an adhesive release position KAP, where one of the multiple electronic assemblies ANT is located.

[0150] The eleventh conveying device F11 is used to move the feeding device SE for the adhesive K relative to the third container A3 transversely to the conveying direction FR of the second carrier BM. The fourth image acquisition device I4 is assigned to the third container A3 and is arranged on the upstream side of the adhesive release position KAP. The fourth image acquisition device I4 is used to detect at least one of the multiple electronic assemblies ANT located on the second carrier BM with respect to its position relative to the third container A3, and send information representing the detected position to the control system ECU via a signal.

[0151] In this embodiment, the twelfth conveying device F12 is composed of two conveying rollers driven in a controlled manner, which are respectively arranged on the upstream side and the downstream side of the roll-shaped third container A3, and the second carrier BM is guided around the two conveying rollers. In response to information sent by the control system ECU via signals, the second carrier BM is conveyed by the two conveying rollers driven in a controlled manner in its position relative to the adhesive release position KAP so that at least one of the plurality of electronic assemblies ANT having adhesive points KS located on the second carrier BM reaches the adhesive release position KAP on the third container A3 guiding the second carrier BM.

[0152] Alternatively, the twelfth conveying device F12 corresponds to the second conveying device of the second container A2.

[0153] In the embodiment shown here, the adhesive release device cooperates with the transfer device for transferring the component from the first carrier to the second carrier. To this end, the adhesive release device is inserted on the upstream side of the transfer device for the component.

[0154] When the device is used, the bonding point located on the tape is detected before the actual adhesive is released in terms of space / time. In this case, the fourth image acquisition device I4 detects the bonding point KS located at the corresponding electronic component on the second carrier BM itself directly (that is, without passing through the second carrier BM). In this case, the second carrier BM is conveyed to the adhesive release position KAP in such a controlled manner that when the feed device releases a portion of adhesive K to the bonding point KS in a quantitative manner, the bonding point KS is aligned as accurately as possible with the outlet position of the feed device SE for the adhesive K.

[0155] The fourth image acquisition device I4 is arranged on the upstream side of the adhesive release position KAP on the circumference of the roll-shaped third container A3 (relative to the conveying direction FR of the second carrier BM), and is used to detect the position of one or more of the multiple electronic assemblies ANT located on the second carrier BM relative to the third container A3 along the conveying direction and / or transverse to the conveying direction FR of the second carrier BM, and send information representing the detected position to the control system ECU via a signal.

[0156] A second sensor device SE2 is associated with the twelfth conveying device F12 for transmitting information about the conveying direction and the conveying path of the second carrier BM relative to the adhesive release position KAP to the control system ECU via signals.

[0157] The control system ECU is used to control the eleventh conveying device F11 based on information about the position of at least one electronic assembly ANT from the fourth image acquisition device I4, based on information about the conveying direction and conveying path of the second carrier BM, and based on information about the position of at least one of the individual components B relative to the adhesive release position KAP from the fourth image acquisition device I4, so that the feeding device SE moves transversely to the conveying direction FR of the second carrier BM.

[0158] In response to the information sent by the control system ECU via a signal, the thirteenth conveying device F13 is used to convey the second carrier BM along the conveying direction FR through the third receiving part A3. This is carried out under the control of the control system ECU so that at least one of the plurality of electronic assemblies ANT located on the second carrier BM reaches the adhesive release position KAP on the third receiving part A3 for guiding the second carrier BM.

[0159] Similar to the second accommodating member A2, the third accommodating member A3 is a cylindrical roll or a convex surface, through which the second carrier BM reaches the adhesive release position KAP located on the third accommodating member A3. Here, the third accommodating member also has a plurality of outlets on its cylinder / surface for guiding the second carrier BM, so as to keep the second carrier BM on the third accommodating member A3 without sliding and stretching via the negative pressure Vak.

[0160] The fifth image acquisition device I5 is arranged on the downstream side of the adhesive release position KAP on the circumference of the roll-shaped third container A3 relative to the conveying direction FR of the second carrier BM, and is used to detect the relative positions of at least one of the multiple electronic assemblies ANT located on the second carrier BM and the adhesive K applied to the assemblies, and send information representing the detected position to the control system ECU via a signal.

[0161] The fourteenth conveying device F14 is used to convey the fourth image acquisition device I4 relative to the third receiving part A3 and the adhesive release position KAP. Thereby, the fourth image acquisition device I4 can detect at least one bonding point KS located on the second carrier BM, thereby detecting the position of at least one of the plurality of electronic assemblies ANT located on the second carrier BM, and sending information indicating the detected position to the control system ECU via a signal.

[0162] The fifteenth conveying device F15 is used to convey the fifth image acquisition device I5 relative to the third accommodating part A3 and the adhesive release position KAP along the circumference of the third accommodating part A3 and / or transversely to the conveying direction FR of the second carrier BM. Thereby, the fifth image acquisition device I5 can detect at least one of the plurality of electronic assemblies ANT located on the second carrier BM and the adhesive K released to the assembly in terms of their relative positions to each other, and send information indicating the detected position to the control system ECU via a signal.

[0163] Particularly simply and advantageously, Figure 2 The illustrated workbench with adjustable X / Y / Theta coordinates is constructed as follows: a container A1 for accommodating a first carrier W is arranged on a first carrier plate, wherein a fifth conveying device F5 is used to rotate the first container A1 relative to the first carrier plate by an angle Theta.

[0164] The first carrier plate is arranged on the second carrier plate in a movable manner along the transverse extension (Y) of the second carrier BM. The first conveying device F1 is configured to move the first carrier plate and thus the first receiving element A1 relative to the second carrier plate (only) transversely to the conveying direction FR of the second carrier BM.

[0165] The second carrier is arranged on a rigid third carrier or support frame in a manner movable in the conveying direction FR of the second carrier BM. The fourth conveying device F4 is configured to move the first container W, the first carrier and the second carrier (only) relative to the third carrier in the conveying direction FR of the second carrier BM.

[0166] exist Figure 3 In the embodiment, the second to fifth image acquisition devices I2 to I5 for the aforementioned device for transferring the electronic component B from the first carrier W to the second carrier BM and the device for applying the adhesive K from the reserve to the second carrier BM are constructed as described below.

[0167] In one embodiment, the image acquisition device BE (camera) of the image acquisition devices I2 to I5 can be moved in the Y direction. In this variant, no beam deflection system is required. As an alternative, the remaining optical system including the focusing optical system, the beam deflection system and / or the illumination system can be moved in the Y direction, while the camera remains fixed and does not move in the Y direction. In this variant, the angle of the camera is adjusted only by the deflection arm.

[0168] The image acquisition device BE constructed as a camera is associated with an illumination device. The illumination device has a white light source WL, a red light source RLR and a blue light source RLB. The illumination device is used to illuminate the second container A2 with light of different wavelengths. In this way, different details of the components / assemblies and adhesives can be imaged via the image acquisition device BE directed toward the second carrier BM.

[0169] The sixteenth, seventeenth, eighteenth and / or nineteenth conveying devices F16 to F19 are respectively configured to convey the corresponding image acquisition device BE together with the lighting device WL, RLR, RLB associated therewith along the second or third receiving part A2, A3, i.e. transversely to the conveying direction of the second carrier BM. In other words, the sixteenth, seventeenth, eighteenth and / or nineteenth conveying devices F16 to F19 are y-drives, and the eighth, ninth, fourteenth and / or fifteenth conveying devices F8, F9, F14, F15 are motor-driven deflection arms, whose functions can also be realized manually.

[0170] The eighth, ninth, fourteenth, and fifteenth conveying devices F8, F9, F14, and F15 are used to convey the corresponding second, third, fourth, and / or fifth image acquisition devices I2 to I5 relative to the second and / or third receiving parts A2, A3 and the component placement position AP or the adhesive release position KAP along the conveying direction FR of the second carrier BM. In this way, the second, third, fourth, and / or fifth image acquisition devices I2 to I5 can be advantageously adjusted according to different distances of the electronic components located on the second carrier.

[0171] In the variant of the lighting device WL, RLB shown in the figure, the red light source RLR and the blue light source RLB are designed as annular light sources, which surround the detection area EB of the image capture device BE. The white light source WL is arranged on the side of the partially transparent beam deflection system SU designed in the form of a 45° reflector facing away from the detection area EB of the image capture device BE. The image capture device BE has a focusing optical system FO, which is arranged at a fixed adjustable distance FL on the side of the at least partially transparent beam deflection system SU facing the focusing optical system.

Claims

1. A device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM), wherein - the first carrier (W) carries a plurality of individualized components in such a way that they can be separated therefrom, and - the second carrier (BM) carries in its longitudinal extension a plurality of electronic assemblies (ANT), each of the plurality of components being to be transferred from the first carrier (W) to one of the plurality of electronic assemblies (ANT), and wherein the device comprises: - a first receiving element (A1), which is arranged and configured to receive the first carrier (W); - a second receiving element (A2) arranged and configured to guide the second carrier (BM) along its longitudinal extension in a conveying direction of the second carrier (BM); wherein The first receiving part (A1) is arranged and configured to receive the first carrier (W) such that the plurality of components (B) carried by the first carrier are oriented toward the second receiving part (A2); - a separation device (TE) arranged and configured to separate the plurality of components (B) from the first carrier (W) in a contact or non-contact manner, thereby transferring the plurality of components to the second carrier (BM); the second receiving element (A2) has an abutment surface (AF) for the second carrier (BM) which is curved in the conveying direction of the second carrier (BM), and - a transport device (F3, F3', F3") for the second carrier (BM) is at least partially associated with the second container (A2), wherein the transport device (F3, F3', F3") is arranged and configured to transport the second carrier (BM) relative to its placement position (AP) in response to information sent by the control system via a signal, so that the electronic assembly (ANT) located on the second carrier (BM) reaches the placement position (AP) on the second container (A2) guiding the second carrier (BM), and wherein - a heating device (H) is arranged in the area of ​​the second container (A2) and is effective. The heating device is set and configured to control the heating device (H) accordingly by the control system (ECU) so that the second carrier (BM) is temperature-controlled uniformly or section by section / area by section from the side of the second container (A2) away from the first container (A1) before the placement position (AP), at the placement position and / or after the placement position in the area of ​​the second container (A2) according to the material properties and melting point of the contact points of the component to be transferred (B) and / or the material properties and melting point of the contact points of the electronic assembly (ANT) located on the second carrier (BM), and wherein - the heating device (H) is arranged as a heating strip having one or more heating zones to be heated to different temperatures, the heating strip having a shape at least partially following the contour of the second container (A2), and the heating strip is arranged and configured to heat the second carrier (BM) in the area of ​​the second container (A2).

2. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1, wherein - the second receiving part (A2) at least partially comprises a conveying device (F3, F3', F3'') for the second carrier (BM), and the conveying device (F3, F3', F3'') occupies only a part of the second receiving part (A2) transversely to the conveying direction of the second carrier (BM), and / or The curved abutment surface (AF) and / or the conveying device (F3, F3', F3'') have a plurality of openings (O1) to be connected to a negative pressure source (Vak), the plurality of openings being arranged and configured to tightly abut the second carrier (BM) against the curved abutment surface (AF).

3. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein - said curved abutment surface (AF) is rigid, and The transport device (F3, F3', F3") for the second carrier (BM) divides the curved contact surface (AF) into at least two sections (AF1, AF2) along the transport direction of the second carrier (BM).

4. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein - the heating device (H) is arranged and configured to establish an electrical connection and a mechanical connection between the component (B) and the second carrier (BM) by means of a signal from a control system (ECU) when the component (B) is placed on the second carrier (BM) in such a way that the plurality of electronic components (ANT) located on the second carrier (BM) are adjusted to a temperature at which the material / solder of the plurality of electronic components (ANT) reaches its melting temperature at least in the region of the exposed ends of the plurality of electronic components (ANT), and when the component (B) is placed, the contacts of the component (B) are brought into contact with the plurality of exposed ends.

5. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein - a thermal insulation element (WA) is arranged before and / or after the placement position (AP), as seen in the transport direction of the second carrier (BM), and / or A gap (SP) for the second carrier (BM) is arranged between the curved contact surface (AF) and the thermal insulation (WA).

6. A device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein the device is associated with a buffer storage (PS) upstream and / or downstream of the placement position (AP) or the curved abutment surface (AF), and the buffer storage is arranged and configured to accommodate a reserve of the second carrier (BM).

7. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein - a first image acquisition device (I1) is arranged and configured to acquire an image of at least one component (B) located on the first carrier (W) in the area of ​​the placement position (AP) and send the image to the control system via a signal, and / or - A second and / or third image acquisition device (I2, I3) is arranged and configured to capture an image of at least one electronic assembly (ANT) on a second carrier (BM) containing / not containing the component (B) in an area on the upstream or downstream side of the placement position (AP), and send the image to the control system via a signal.

8. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein - the distance (D) between the curved abutment surface (AF) and the first receiving part (A1) can be adjusted by means of a first adjustment device.

9. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein - the curved abutment surface (AF) and the conveying device (F3, F3', F3") for the second carrier (BM) are movably guided substantially perpendicularly to the conveying direction of the second carrier (BM), wherein as a response to information sent by the control system (ECU) via a signal, the curved abutment surface (AF) and / or at least one of the conveying devices (F3, F3', F3") are positioned by corresponding adjustment devices.

10. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 2, wherein - at least one pressing member (NH1, NH2) is respectively arranged and configured in the area upstream and / or downstream of the curved abutment surface (AF) or the placement position (AP), so that the second carrier (BM) is exposed to the negative pressure (Vak) in the area of ​​the curved abutment surface (AF).

11. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein The heating device (H) has a heating zone or a plurality of heating zones to be heated to different temperatures, wherein - In the area of ​​the upstream and / or downstream side of the curved abutment surface (AF) or the placement position (AP), and / or along the lateral extension of the abutment surface or the placement position, at least one heating zone is arranged, and the at least one heating zone is arranged and configured to release heat in response to information sent by the control system (ECU) via signals, and wherein in the case where a plurality of heating zones are provided, the plurality of heating zones are arranged and configured to release heat independently of each other in response to information sent by the control system (ECU) via signals.

12. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein - In the area upstream of the placement position (AP), a curved third container (A3) and an adhesive feeder (KS1) are arranged, which are arranged and configured to allow the second carrier (BM) to pass between the third container and the adhesive feeder, and in response to information sent by the control system via a signal, release adhesive to the second carrier (BM) in portions.

13. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 12, wherein - A fourth and / or fifth image acquisition device (I4, I5) is arranged in the upstream and / or downstream side area of ​​the third container (A3), which is configured and arranged to capture an image of at least one electronic component (ANT) on the second carrier (BM) containing / not containing the released adhesive in the upstream or downstream side area of ​​the third container (A3) and send it to the control system via a signal.

14. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 12, wherein The third receiving element (A3) is associated with an additional conveying device (F12, F13), which is arranged and configured to convey the second carrier (BM) along a further curved contact surface.

15. The device for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM) according to claim 1 or 2, wherein - an adjustment device (JE) is assigned to the separating device (TE), which is arranged and configured to position the separating device (TE) in a conveying direction of the second carrier (BM) and / or transversely to the conveying direction, and / or - a first image acquisition device (I1) is arranged at the placement position (AP), which is arranged and configured to detect the position of at least one of the plurality of assemblies (ANT) relative to the placement position (AP) on the second receiving member (A2) guiding the second carrier (BM); and / or - A second image acquisition device (I2) is arranged and configured to detect the position of at least one of the multiple electronic assemblies (ANT) located on the second carrier (BM) relative to the second receiving part (A2) on the upstream side of the placement position (AP), and send information representing the detected position to the control system via a signal.

16. A method for transferring an electronic component (B) from a first carrier (W) to a second carrier (BM), wherein the first carrier (W) carries a plurality of singulated components in such a way that they can be separated therefrom, and the second carrier (BM) carries a plurality of electronic assemblies (ANT) in its longitudinal extension, each of the plurality of components being to be transferred from the first carrier (W) to one of the plurality of electronic assemblies, and wherein the method comprises: - using a first container (A1) to accommodate the first carrier (W); - guiding the second carrier (BM) along its longitudinal extension along the conveying direction of the second carrier (BM) by means of a second receiving element (A2); - accommodating the first carrier (W) by the first accommodating part (A1) in such a way that the plurality of components (B) carried by the first carrier are oriented toward the second accommodating part (A2); - separating the plurality of components (B) from the first carrier (W) by a separation device (TE) in a contact or non-contact manner, thereby transferring the plurality of components to the second carrier (BM); - in response to information sent by the control system via a signal, a transport device (F3, F3', F3") for the second carrier (BM) transports the second carrier (BM) in a position relative to a placement position (AP) of the second carrier such that the electronic assembly (ANT) located on the second carrier (BM) reaches the placement position (AP) on the second receiving part (A2) guiding the second carrier (BM), wherein - A heating device (H) acts in the area of ​​the second container (A2) so that the second carrier (BM) is temperature-controlled uniformly or section by section / area by section from the side of the second container (A2) away from the first container (A1) before the placement position (AP), at the placement position and / or after the placement position according to the material properties and melting point of the contact points of the component to be transferred (B) and / or the material properties and melting point of the contact points of the electronic assembly (ANT) located on the second carrier (BM) by correspondingly controlling the heating device (H) with the control system (ECU), the heating device (H) being configured as a heating strip having one or more heating zones to be heated to different temperatures, the heating strip having a shape that at least partially follows the contour of the second container (A2), and the heating strip heats the second carrier (BM) in the area of ​​the second container (A2).

Images