Microelectronic chip ultra-high speed vertical injection precision packaging device and method

Abstract

The application discloses a microelectronic chip ultra-high-speed vertical injection precision packaging device and method. The device comprises a double-plasticizing device, an ultra-high-speed material feeding device, a microelectronic locking device, a plasticizing fluid storage valve, a packaging substrate conveying belt, a heating pipe, a gas inlet pipe and an inert gas quantitative output device. The technology uses a thermotropic liquid crystal polymer TLCP as a packaging material of the microelectronic chip, and the TLCP has good fluidity and excellent characteristics. The double-plasticizing system is used to top the co-extrusion vacuum feeding technology, so that the material source is ensured. The ultra-high-speed material feeding device fills the TLCP fluid into a precision packaging mold cavity after the plasticizing of the storage valve, and can realize a continuous ultra-high-speed microelectronic chip packaging process. The device adopts high-purity gas protection magnetic fluid sealing, and high-purity gas is introduced in the packaging process to prevent material denaturation in the TLCP plasticizing and packaging process. Under the conveying of the packaging substrate conveying belt, the packaging operation is continuously and rapidly realized. The device can be applied to the packaging of microelectronic chips and electronic components.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of injection molding machines used for injection molding, in particular to a kind of microelectronic chip ultra-high-speed vertical injection precision packaging device and method. BACKGROUND

[0002] Electronic packaging is to electrically connect one or more electronic component chips with each other and then package them in a protective structure, which aims to provide electrical connection, mechanical protection, chemical corrosion protection, etc. for the electronic chips. The substrate of this protective structure is used to carry the chips and lead in / out power and electrical signals. The development trend of packaging technology is to make the package smaller, more functional and lower in cost.

[0003] Currently, the electronic packaging process mostly uses piston injection molding, which melts the quantitative granular raw materials in the injection cavity and then injects them into the mold cavity. The injection speed is slow, and the uneven injection amount of granules is difficult to control. Patent CN114023734A discloses a LED and IC high-density integrated packaging structure, process and LED lamp strip, which includes IC chips and LED chips, and the IC chips and LED chips are electrically connected. It also includes a packaging layer, the IC chips and LED chips are encapsulated in the packaging layer by injection molding packaging, and the passive surface of the IC chip and the positive light emitting surface of the LED chip face the same air surface. It also includes a conductive external terminal arranged on the outer wall of the packaging layer, and the external terminal and the IC chip are electrically connected. It mainly innovates the packaging process. Patent CN114083747A discloses a low-pressure injection packaging device for lithium batteries in the technical field of injection molding devices, which includes a base, a lower mold seat, an installation arm, an upper mold seat, a drive unit, an injection cavity, a special-shaped fluid passage, a material injection port, a rubber plug, a sealing groove, an elastic return unit, a top block, and a through groove. When the upper mold seat is turned upward, the top block is driven by the lifting unit to move upward, and when the upper mold seat is turned downward, the lifting unit drives the top block to move downward, so that the top surface of the top block is flush with the inner bottom wall of the injection cavity. The downward turning of the upper mold seat can drive the rubber plug to slide upward in the sealing groove, so that the special-shaped fluid passage is connected with the injection cavity, so that the injection material conveying mechanism can convey the injection material into the injection cavity, thereby facilitating injection. After injection is completed, the rubber plug can move downward and close the special-shaped fluid passage by turning the upper mold seat upward. It does not innovate in packaging speed and packaging rate.

[0004] In view of the current deficiency of packaging speed in microelectronic chip packaging, the present application proposes a kind of microelectronic chip ultra-high-speed vertical injection precision packaging device and method. SUMMARY

[0005] The technical problem to be solved by the present application is to adopt a molding technology for high-speed batch electronic packaging in view of the above deficiencies of the prior art and the wide demand for microelectronic chips in the electronic industry.

[0006] The present application adopts a double plasticizing system to provide a microelectronic chip ultra-high-speed vertical injection precision packaging device.

[0007] The double plasticizing system uses two TLCP extruders arranged in a top-to-top manner to deliver plasticizing material to the melt cavity, and inert gas is supplied to the material outlet of the extruder to prevent TLCP denaturation.

[0008] The packaging baseband adopts a clamping groove structure to pass through the lower die plate, and is mechanically combined with the baseband positioning hole through the pin positioning structure to realize positioning and stable pressing during the packaging process.

[0009] The fast material injection molding cavity structure gets its stamping power from a high-speed crankshaft punch structure. The push plate simultaneously pushes the piston rod to inject the material into the mold cavity, and simultaneously pushes the movable die plate to realize the mold forming process under the combination of the spring. The copper substrate is driven by the conveying belt to enter the packaging mold cavity for packaging operation. The packaging time can be controlled within 0.13 nanoseconds.

[0010] The packaging material uses TLCP as the packaging material. TLCP high molecular material has good fluidity, and has special material advantages in the field of electronic packaging, especially for microelectronic element structure, which can guarantee the uniformity and tightness of filling and packaging to the greatest extent.

[0011] A microelectronic chip ultra-high-speed vertical injection precision packaging method, two extruders inject the completely plasticized packaging fluid into the piston assembly through the control of the one-way valve, when the piston reaches the movement top end, the motor drives the one-way valve to close, the piston cavity assembly completes the storage of the TLCP fluid, the punch moves downward to drive the piston rod and the spring plate to move downward, the piston in the storage piston cavity moves downward quickly to inject the material, and the stamping and injection process starts, the fluid is initially extruded into the melt cavity, and the piston injects the fluid in the cavity into the mold cavity at high speed. At this time, the upper mold plate and the lower mold plate are separated, the spring is compressed and pushes the upper mold plate and the lower mold plate to be pressed, and the fluid fills the forming mold cavity through the hot runner. During the spring compression process, the spring compresses the upper mold plate to ensure the sealing of the packaging mold cavity and provide the required holding pressure for forming. As the punch moves upward, the piston moves upward, the motor drives the rotating valve to open, and the fluid flows into the piston cavity assembly under the action of pressure to enter the next storage process. During the piston rising process, the spring is stretched but still in a compressed state, and the cavity pressure still exists. At this time, the forming mold cavity is closed, and the hot runner gate is closed to ensure that the fluid can only be supplied in one direction. After the storage is completed, the holding spring is reset, the mold cavity is opened at the next moment, the rotating valve motor drives the rotating valve to close, the storage cavity is full, the mold cavity is opened, and the base tape feeding motor drives the base tape feeding wheel to rotate a certain distance to replace the copper base material. During the replacement of the base tape, the fixed mold plate is designed with a base tape track to ensure that the base tape replacement process is smooth and stable. When the packaging base material is replaced, the next injection cycle starts, the high-speed pulley drives the punch to rotate at high speed, and the eccentric characteristics of the crank make the punch drive plate move along the straight bearing on the mold plate to press the base tape. The fixed pin on the movable mold plate is inserted into the positioning hole on the two sides of the base tape. After cooling, the forming is completed, and the action is repeated in sequence.

[0012] The injection channel can adopt a hot runner, the one-way valve structure adopts a rotating valve structure and is driven by a motor to rotate at high speed, the upper mold plate and the punch are provided with four sets of compression spring assemblies of inner sleeve pins, and the spring structure adopts a compression spring which can be realized in a cylindrical spring or a rectangular compression spring.

[0013] The stamping die is installed on a slide rod with four sets of sliding bearings to ensure the stability and smoothness of the stamping die during high-speed movement.

[0014] Compared with the prior art, the patent adopts a double-extruder co-extrusion feeding mode to supply TLCP molten material with excellent material performance to the high-speed packaging mold cavity, realizes the precision high-speed packaging operation of the microelectronic chip under the feeding and injection of the high-speed punch device, has compact layout, realizes fast operation by referring to the structure of a punch, and integrates the packaging production process of the microelectronic chip product and improves the forming efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 This is a three-dimensional schematic diagram of a high-speed vertical injection precision packaging device for microelectronic chips according to the present invention.

[0016] Figure 2 This is a three-dimensional view of the packaging fixture for an ultra-high-speed vertical injection precision packaging device for microelectronic chips according to the present invention.

[0017] Figure 3 This is a schematic diagram of the substrate feeding process for the packaging fixture of the present invention.

[0018] Figure 4 This is a schematic diagram of the substrate feeding, positioning, and fixing of the packaging fixture of the present invention.

[0019] Figure 5 This is a partially enlarged schematic diagram of the substrate feeding, positioning, and fixing of the packaging fixture of the present invention.

[0020] Figure 6 This is a front view of a high-speed vertical injection precision packaging device for microelectronic chips according to the present invention.

[0021] Figure 7 This is a three-dimensional schematic diagram of the structure of the ultra-high speed crank high speed component of the present invention.

[0022] Figure 8 This is a cross-sectional view of the eccentric crank structure of the ultra-high speed crank assembly of the present invention.

[0023] In the diagram: 1. High-speed punching machine, 2. Packaging fixture, 3. Extruder, 4. Packaging substrate conveyor belt, 5. Punching drive plate, 6. Spring, 7. Moving template, 8. Fixed template, 9. Piston chamber assembly, 10. Melt chamber, 11. One-way valve, 12. Heating plate, 13. Inert gas protection device, 14. Base belt feed roller, 15. Conveyor belt, 16. Base belt feed motor, 17. Positioning pin, 18. Punch press crank, 19. Crank connecting rod, 20. Crank fixed bushing, 21. High-speed pulley, 22. Linear bearing, 23. Slide rod. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings.

[0025] This invention provides a high-speed, precision injection packaging device for microelectronic chips, such as... Figure 1 As shown, two extruders 3 are arranged opposite each other, simultaneously feeding material into the storage cavity 2. At the material outlet, an inert gas is introduced diagonally from bottom to top through a gas protection device 13 to form a gas protection system and prevent TLCP from denaturing. The copper encapsulation substrate is conveyed by a feeding wheel under the feeding of the encapsulation substrate conveyor belt 4. The ultra-high-speed punching device 1 is vertically arranged at the material cavity and substrate conveyor belt position, injecting material vertically into the molding die through a high-speed punch.

[0026] This invention discloses a method for ultra-high-speed precision encapsulation of microelectronic chips, such as... Figures 1-2 and Figure 6 As shown, rotating the one-way valve 11 opens the molten fluid, which is then transported through the two extruders 3 to inject the fully plasticized encapsulation fluid into the piston assembly 9. Rotating the one-way valve 11 opens the piston cavity assembly 9, storing the molten encapsulation material through its upward movement. When the piston reaches its top, the motor drives the one-way valve 11 to close, completing the storage of the TLCP fluid in the piston cavity assembly 9. The punch 5 moves downward, driving the piston rod and spring plate downward. Inside the storage piston cavity, the piston moves rapidly downward to inject material, initiating the injection process. The fluid is initially squeezed into the melt cavity 10, and the piston injects the fluid from the cavity into the mold cavity at high speed. At this time, the upper mold plate 7 separates from the lower mold plate 8. The spring 6 compresses and pushes the upper and lower mold plates together, simultaneously compacting the positioning strip-shaped encapsulation base 4. The fluid fills the molding cavity through the hot runner. During the spring compression process, the spring 6 presses the upper mold plate 7, ensuring the sealing of the encapsulation cavity and providing the required holding pressure for molding. As punch 5 moves upward, it drives the piston upward. The motor drives rotary valve 11 to open, and fluid flows into piston chamber assembly 9 under pressure to enter the next material storage process. During the piston's ascent, the spring extends but remains compressed, and the cavity pressure persists. At this time, the molding cavity closes, and the hot runner gate is sealed, ensuring that fluid can only be supplied in one direction. After material storage is complete, the pressure-holding spring returns to its original position. In the next moment, the mold cavity opens, the rotary valve motor drives rotary valve 11 to close, the material storage chamber is full, and the mold cavity opens again. Figure 3 As shown, the baseband feeding motor drives the conveyor belt 15 at a fixed frequency, causing the baseband feeding wheel 14 to rotate a certain distance. The copper substrate 4 is then replaced. Figure 4 , Figure 5 As shown, during the baseband replacement process, the fixed template 8 is designed with a baseband track to ensure smooth transmission and reduce vibration during the replacement process. Once the encapsulation substrate conveyor belt rotates and the encapsulation substrate replacement is complete, the next injection cycle begins. Figures 6-7 As shown, the high-speed pulley 21 drives the crank 18 of the punching machine to rotate at high speed, and at the same time... Figure 8 The eccentricity of the crank shown causes it to drive the linear shaft 22 on the punching drive plate template 5 to slide along the slide rod 23, thus punching the material. This causes the moving template and the fixed template to press against the base strip, as shown. Figure 5 The positioning pins on the moving template are inserted into the positioning holes on both sides of the base strip. After cooling, it is formed, and this action is repeated sequentially.

[0027] Finally, it should be noted that the above-described embodiments are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Other variations and modifications are possible without departing from the technical solutions described in the claims.

Claims

1. A microelectronic chip ultra-high speed vertical injection precision packaging method, characterized in that: Two extruders by controlling the check valve into the piston assembly inside the fully encapsulated fluid plastic, when the piston reaches the top of the movement, the motor driven check valve closed, piston cavity assembly complete TLCP fluid storage, punch down movement driven piston rod and spring plate down, storage piston cavity inside the piston down quickly injection of material, and began to stamp injection process, the fluid was first extruded into the melt cavity, the piston cavity fluid injection into the mold cavity inside high speed; At this time the forming die plate and lower die plate separation, spring compression and push the upper die plate and lower die plate compression, while compacting positioning strip encapsulation matrix, fluid through the hot runner filling full of forming mold cavity; Spring compression process, spring compression of the upper die plate, to ensure the encapsulation of the mold cavity closure, provide the pressure needed for molding; With the punch up, driven piston up, motor driven rotary valve open, fluid under the action of pressure into the piston cavity assembly into the next storage process; Piston rising process spring stretch, but still in the compression state, the cavity pressure still exists, at this time the forming mold cavity closed, hot runner gate closed, to ensure that the fluid can only be supplied one-way; Storage complete, pressure spring reset, the next moment the mold cavity open, rotary valve motor driven rotary valve closed, storage cavity full, mold cavity open, base tape feeding motor constant frequency drive belt driven base tape feeding wheel rotation a certain distance, replace the copper base material, in the replacement of the base tape process, the fixed die plate design base tape track to ensure that the base tape replacement process to reduce vibration smooth transmission, when the encapsulation of the base material conveyor belt rotation complete encapsulation of the base material replacement; Into the next injection cycle, high-speed pulley driven punch machine crank high-speed rotation, while the crank eccentric characteristics make the crank driven punch drive plate template on the linear bearing along the slide bar sliding punch; Drive the die and die plate compression base tape, die plate on the positioning pin inserted into the base tape both sides of the positioning hole; After cooling, forming, in turn, complete this action.

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