Electronic component mounting method, display device, and circuit substrate

Abstract

A workpiece is placed between a stage and a pressurizing fixture with its first and second surfaces facing each other, the workpiece comprising a circuit substrate and a chip, the circuit substrate comprising: an insulating substrate comprising the first surface; and a terminal portion and a spacer located on the first surface side, the chip comprising: a sapphire substrate comprising the second surface; and an electronic component located on the second surface side; the pressurizing fixture is brought into contact with a portion of the sapphire substrate, and a load is applied to the contact portion between a portion of the upper surface of the spacer and the second surface; the sapphire substrate is pressurized toward the circuit substrate side by using the pressurizing fixture, so that the other portion of the upper surface of the spacer is brought into contact with the second surface, thereby flattening the sapphire substrate.

Description

[0001] Cross-references to related applications

[0002] This application is based upon and claims the benefit of priority from Japanese patent application No. 2021-063629, filed on April 2, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments of the present invention relate to a method for mounting an electronic component, a display device, and a circuit board. Background Art

[0004] LED display devices using self-luminous elements, such as light-emitting diodes (LEDs), are generally known. However, in recent years, display devices using tiny diode elements called micro-LEDs have been developed as more refined display devices. Unlike conventional liquid crystal displays or organic EL displays, micro-LED displays are formed by mounting multiple chip-shaped micro-LEDs on the display area. This makes it easier to achieve both high definition and large size, and has attracted attention as a next-generation display device.

[0005] As a method for mounting multiple chip-shaped micro-LEDs on a display area, a method using laser lift-off (LLO) is known. Multiple micro-LEDs are formed on a sapphire substrate before being mounted on the display area. However, when using LLO to peel the micro-LEDs from the sapphire substrate, if the sapphire substrate is warped, the laser may not reach the desired position. To eliminate this problem, a method is known to flatten the warping of the sapphire substrate by pressing the entire surface of the sapphire substrate. Summary of the Invention

[0006] According to this embodiment, a workpiece is placed between a stage and a press jig in a manner in which the first surface and the second surface are opposite to each other, the workpiece comprising a circuit substrate and a chip, the circuit substrate comprising: an insulating substrate comprising the first surface; and a terminal portion and a spacer located on the first surface side, the chip comprising: a sapphire substrate comprising the second surface; and an electronic component located on the second surface side; the press jig is brought into contact with a portion of the sapphire substrate, and a load is applied to the contact portion between a portion of the upper surface of the spacer and the second surface; the sapphire substrate is pressurized toward the circuit substrate side by the press jig, so that the other portion of the upper surface of the spacer is brought into contact with the second surface, thereby flattening the sapphire substrate; a first laser is irradiated onto the workpiece through a window portion of the press jig to bond the electronic component to the circuit substrate; a second laser having a wavelength different from that of the first laser is irradiated onto the workpiece through the window portion to peel the electronic component from the sapphire substrate; and the press jig is separated from the sapphire substrate.

[0007] According to this embodiment, a display device is provided, comprising: an insulating substrate having a first surface; a spacer located on the first surface side and having multiple holes; and multiple electronic components located on the first surface side and within the holes, wherein the spacer is formed of aluminum oxide.

[0008] According to this embodiment, a circuit substrate is provided, comprising: an insulating substrate having a first surface; a spacer located on the first surface side and having multiple holes; and multiple terminal portions located on the first surface side and within the holes, wherein the spacer is formed of aluminum oxide.

[0009] The present embodiment can provide an electronic component mounting method, a display device, and a circuit board capable of improving yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a perspective view schematically showing the structure of a display device.

[0011] Figure 2 It is a cross-sectional view schematically showing the structure of a circuit board.

[0012] Figure 3 It is a cross-sectional view schematically showing the structure of a wafer.

[0013] Figure 4 It is a diagram showing the first step of the mounting method according to this embodiment.

[0014] Figure 5 It is a diagram showing the second step of the mounting method according to this embodiment.

[0015] Figure 6It is a diagram showing the third step of the mounting method according to this embodiment.

[0016] Figure 7 It is a diagram showing the fourth step of the mounting method according to this embodiment.

[0017] Figure 8 It is a diagram showing the fifth step of the mounting method according to this embodiment.

[0018] Figure 9 It is a diagram showing the sixth step of the mounting method according to this embodiment.

[0019] Figure 10 It is a cross-sectional view schematically showing the structure of a display panel.

[0020] Figure 11 It is a plan view showing the circuit board and the chip according to this embodiment.

[0021] Figure 12 1 is a plan view showing a display panel according to this embodiment.

[0022] Figure 13 It is a plan view showing a circuit board and a chip according to a first modification.

[0023] Figure 14 1 is a plan view showing a display panel according to a first modification.

[0024] Figure 15 It is a plan view showing a circuit board and a chip according to a second modification.

[0025] Figure 16 1 is a plan view showing a display panel according to a second modification. DETAILED DESCRIPTION

[0026] Hereinafter, the present embodiment will be described with reference to the accompanying drawings. In addition, the disclosure is merely an example, and those skilled in the art can easily conceive of an embodiment that maintains the main idea of ​​the invention with appropriate changes, which are of course included in the scope of the present invention. In addition, in order to make the description clearer, the drawings sometimes schematically represent the width, thickness, shape, etc. of each part compared to the actual method, but this is merely an example and does not limit the interpretation of the present invention. In addition, in this specification and each figure, the same reference figure numerals are marked for the constituent elements that perform the same or similar functions as the above-mentioned constituent elements related to the figures that have appeared, and repeated detailed descriptions are sometimes appropriately omitted.

[0027] Figure 1 It is a perspective view schematically showing the structure of the display device DSP.

[0028] In this specification, the first direction X, the second direction Y, and the third direction Z are defined as shown in the figure. The second direction Y is a direction perpendicular to the first direction X, and the third direction Z is a direction perpendicular to the first direction X and the second direction Y. The first direction X and the second direction Y intersect perpendicularly, but may intersect at an angle other than perpendicular. In this specification, the direction toward the front end of the arrow representing the third direction Z is referred to as "up", and the direction from the front end of the arrow toward the opposite direction is referred to as "down". In addition, there is an observation position for observing the display device DSP or the manufacturing device on the front side of the arrow representing the third direction Z, and observation from this observation position toward the X-Y plane defined by the first direction X and the second direction Y is referred to as a top view.

[0029] In this specification, an LED chip (light-emitting element) used in a display device DSP is described as an example of an electronic component.

[0030] Hereinafter, in this specification, a case will be described in which the display device DSP is a micro LED display device using micro LEDs as self-luminous elements.

[0031] like Figure 1 As shown, the display device DSP includes a display panel PNL, printed circuit boards PCB1 and PCB2 , and a driver IC chip 2 .

[0032] The display panel PNL is rectangular in one example. In the example shown in the figure, the short side EX of the display panel PNL is parallel to the first direction X, and the long side EY of the display panel PNL is parallel to the second direction Y. The third direction Z corresponds to the thickness direction of the display panel PNL. The main surface of the display panel PNL is parallel to the X-Y plane defined by the first direction X and the second direction Y. The display panel PNL has a display area DA and a non-display area NDA outside the display area DA. In the example shown in the figure, the non-display area NDA surrounds the display area DA. The display panel PNL has a terminal area MT in the non-display area NDA. The terminal area MT is provided along the short side EX of the display panel PNL and includes terminals for electrically connecting the display panel PNL to an external device or the like.

[0033] The display area DA is an area for displaying images and includes, for example, a plurality of pixels PX arranged in a matrix. The pixels PX include light-emitting elements (micro LEDs) and switching elements for driving the light-emitting elements.

[0034] The printed circuit board PCB1 is mounted on the terminal area MT and electrically connected to the display panel PNL. The printed circuit board PCB1 is, for example, a flexible printed circuit board. The printed circuit board PCB2 is, for example, connected to the printed circuit board PCB1 below the printed circuit board PCB1. The printed circuit board PCB2 is, for example, a rigid printed circuit board.

[0035] The driver IC chip 2 is mounted on the printed circuit board PCB1. Alternatively, the driver IC chip 2 can be mounted below the printed circuit board PCB1, in the non-display area NDA of the display panel PNL, or on the printed circuit board PCB2. The driver IC chip 2 is connected to a control substrate (not shown) via the printed circuit boards PCB1 and PCB2, for example. The driver IC chip 2 drives the plurality of pixels PX based on image signals output from the control board, controlling the display of images on the display panel PNL.

[0036] Next, a method for mounting light emitting elements LED on a circuit board CB serving as a base substrate of the display panel PNL will be described. More specifically, a method for mounting light emitting elements LED on a circuit board CB serving as a base substrate of the display panel PNL by laser lift-off (LLO) will be described. Figure 3 The light emitting diodes (LEDs) are peeled off from the wafer WF and mounted on Figure 2 The method shown is on the circuit board CB.

[0037] First, refer to Figure 2 and Figure 3 , the structures of the circuit board CB and the chip WF are explained.

[0038] Figure 2 It is a cross-sectional view schematically showing the structure of the circuit board CB.

[0039] The circuit board CB includes an insulating substrate 10 , a plurality of terminal portions 11 , a plurality of bonding members 12 , and a spacer SP.

[0040] The insulating substrate 10 is, for example, a glass substrate or a flexible resin substrate and has a surface (first surface) 10A and a surface 10B opposite to surface 10A. Although not shown, switching elements for driving the light-emitting elements LED and various wiring patterns are formed on the insulating substrate 10. The switching elements are thin-film transistors. The circuit substrate CB is sometimes also referred to as an array substrate or backplane substrate.

[0041] Multiple terminal portions 11 are located on the surface 10A side of the insulating substrate 10. Each terminal portion 11 is composed of a set of a first electrode 11A and a second electrode 11B. For example, the terminal portions 11 are formed in the same number as the light-emitting elements LEDs mounted on the display device DSP. The terminal portions 11 are formed, for example, from a metal material such as Al (aluminum), Ti (titanium), Mo (molybdenum), or W (tungsten), or a laminate of these metal materials.

[0042] A plurality of bonding components 12 are respectively arranged on the terminal portion 11. One bonding component 12 is composed of a first bonding component 12A and a second bonding component 12B as a group. The first bonding component 12A is located on the first electrode 11A. The second bonding component 12B is located on the second electrode 11B. The bonding component 12 is a component for bonding the terminal portion 11 and the terminal portion 22 of the light-emitting element LED described later. Although described in detail later, the bonding component 12 is formed of a metal material that is heated and melted by laser ablation when irradiated with a laser having a wavelength of 400nm to 3000nm, and is formed of, for example, a metal material such as Sn (tin), Ag (silver), etc. The bonding component 12 can also be called a solder component. In addition, in the example shown in the figure, the bonding component 12 is provided at the terminal portion 11, but can also be provided at the terminal portion 22 of the light-emitting element LED described later.

[0043] The spacer SP is located on the surface 10A side of the insulating substrate 10. Figure 11 As will be described later, the spacer SP is integrally formed and has a plurality of holes HL. The spacer SP is made of, for example, Al2O3 (aluminum oxide). The plurality of terminals 11 are located in the holes HL.

[0044] Figure 3 It is a cross-sectional view schematically showing the structure of the wafer WF.

[0045] The wafer WF includes a sapphire substrate 20 and a plurality of light emitting elements (electronic components) LEDs. The sapphire substrate 20 includes a surface (second surface) 20A and a surface 20B opposite to the surface 20A. The sapphire substrate 20 is made of Al 2 O 3 .

[0046] The plurality of light emitting elements LED are located on the surface 20A side of the sapphire substrate 20. The light emitting element LED includes a light emitting layer 21 and a terminal portion 22.

[0047] The light-emitting layer 21 is fixed to the surface 20A of the sapphire substrate 20 via a release layer (not shown). The terminal portion 22 is disposed on the light-emitting layer 21. Each terminal portion 22 is composed of a set of a first electrode 22A and a second electrode 22B. One of the first electrode 22A and the second electrode 22B serves as an anode electrode, and the other serves as a cathode electrode. The terminal portion 22 is bonded to the terminal portion 11 via a bonding member 12 disposed on the circuit board CB side, thereby being electrically connected to the terminal portion 11. The terminal portion 22 may also be referred to as a bump.

[0048] Next, refer to Figures 4 to 9 Hereinafter, in this specification, a component in which the circuit board CB and the wafer WF are stacked is referred to as a workpiece WK.

[0049] Figure 4 This diagram illustrates the first step of the mounting method of this embodiment. The first step involves placing the workpiece WK on the stage ST. The terminals 11 and bonding members 12 of the circuit board CB and the light-emitting elements LED of the wafer WF are each shown as a simplified layer.

[0050] First, the structure of the mounting apparatus 100 will be described. The mounting apparatus 100 is an apparatus for mounting the light emitting element LED on the wafer WF on the circuit board CB.

[0051] The mounting device 100 includes a stage ST on which a workpiece is placed, a press jig 41 , a laser device 60 , and a driving unit DR.

[0052] The stage ST has a support surface STA for supporting a workpiece.

[0053] The press jig 41 faces the stage ST in the third direction Z. The press jig 41 is configured to pressurize the workpiece WK between the press jig 41 and the stage ST. The press jig 41 includes a window 41A facing the support surface STA in the third direction Z. The window 41A is formed of a transparent material, for example, and transmits laser light.

[0054] The laser device 60 includes a first laser light source LS1, a second laser light source LS2, an optical system OS, and a laser head 60A. The first laser light source LS1 emits a first laser light LZ1. The second laser light source LS2 emits a second laser light LZ2 (see Figure 7 and Figure 8 The optical system OS includes, for example, a reflecting mirror for adjusting the optical paths of the first laser beam LZ1 and the second laser beam LZ2. The laser device 60 emits the first laser beam LZ1 and the second laser beam LZ2 from a laser head 60A.

[0055] The drive unit DR includes a first drive unit DR1 that controls the drive of the press jig 41 and a second drive unit DR2 that controls the drive of the laser device 60. The first drive unit DR1 moves the press jig 41 in a vertical direction V relative to the support surface STA. Here, the vertical direction V is parallel to the third direction Z. The second drive unit DR2 emits the first laser beam LZ1 and the second laser beam LZ2 from the laser device 60. Furthermore, the second drive unit DR2 moves, for example, the laser head 60A.

[0056] Here, the first step is described. A workpiece WK, which is composed of a stacked circuit board CB and a wafer WF, is placed between the stage ST and the press jig 41. Alternatively, the press jig 41 may be placed on the workpiece WK after the workpiece WK is placed on the stage ST. The circuit board CB and the wafer WF are stacked so that the surface 10A of the insulating substrate 10 and the surface 20A of the sapphire substrate 20 are opposed to each other. The surface 10B of the insulating substrate 10 is in contact with the support surface STA. The surface 20B of the sapphire substrate 20 is opposed to the press jig 41. Furthermore, when the workpiece WK is placed on the stage ST, the circuit board CB and the wafer WF are aligned.

[0057] In this embodiment, a case where the wafer WF warps is assumed. Specifically, a gap GP is locally formed between the circuit board CB and the wafer WF. In the illustrated example, the gap GP increases as it approaches the peripheral edge CA of the workpiece WK. Meanwhile, the circuit board CB and the wafer WF are in contact at the center MA of the workpiece WK.

[0058] Figure 5 1 and 2 are diagrams showing a second step of the mounting method according to this embodiment. The second step is a step of bringing the press jig 41 into contact with the workpiece WK on the stage ST.

[0059] The first drive unit DR1 moves the pressurizing fixture 41 toward the stage ST along the vertical direction V so as to abut against a portion of the sapphire substrate 20. The first drive unit DR1 further uses the pressurizing fixture 41 to pressurize the sapphire substrate 20 toward the circuit board CB, applying a load to the abutting portion between a portion of the upper surface US of the spacer SP and the surface 20A. At this time, the other portions of the upper surface US of the spacer SP are separated from the surface 20A. In addition, in the central portion MA of the workpiece WK, the terminal portion 22 of the light-emitting element LED contacts the bonding component 12 or slightly crushes the bonding component 12.

[0060] The height HS of the spacer SP is formed to be equal to or smaller than the total thickness of the terminal portion 11, the bonding member 12, the terminal portion 22, and the light-emitting layer 21. If the height HS is smaller than the total thickness of the aforementioned components, the bonding member 12 is slightly crushed compared to its original shape when the sapphire substrate 20 is pressurized by the press jig 41.

[0061] Figure 6 1 and 2 are diagrams showing a third step of the mounting method according to the present embodiment. The third step is a step of pressing the workpiece WK toward the stage ST using the pressing jig 41 .

[0062] The first driving unit DR1 moves the pressing jig 41 toward the stage ST in the vertical direction V. That is, the first driving unit DR1 moves the pressing jig 41 toward the stage ST. Figure 5From the state shown, the sapphire substrate 20 is further pressed toward the circuit substrate CB side using the press jig 41. Thus, the sapphire substrate 20 is flattened. At this time, the light emitting element LED is housed in the hole HL. Figure 5 The remaining portion of the upper surface US of the separated spacer SP contacts the surface 20A. For example, the entire upper surface US of the spacer SP contacts the surface 20A. The pressurizing fixture 41 secures the workpiece WK between it and the stage ST. The workpiece WK is secured so that the terminals 11 of the circuit board CB and the terminals 22 of the wafer WF overlap. The window 41A contacts the surface 20B of the sapphire substrate 20.

[0063] In this manner, by correcting the warpage of the sapphire substrate 20 and bringing the circuit board CB and the wafer WF into close contact, a state in which the light emitting element LED and the circuit board CB can be bonded can be achieved.

[0064] For example, in the process of flattening the sapphire substrate 20, as shown in FIG. Figure 5 As shown, the maximum load is applied at the position where the circuit board CB and the wafer WF first come into contact, and the terminal portion 11, the bonding member 12, and the terminal portion 22 may be excessively crushed. In addition, this may cause a short circuit.

[0065] According to this embodiment, the upper surface US of the spacer SP contacts the surface 20A. Therefore, the contact portion between the upper surface US of the spacer SP and the surface 20A bears the load, reducing the load applied to the terminal portion 11, the bonding component 12, and the terminal portion 22. In other words, excessive crushing of the terminal portion 11, the bonding component 12, and the terminal portion 22 due to the load can be prevented, thereby suppressing the occurrence of short circuits. Consequently, the manufacturing yield can be improved.

[0066] Furthermore, the rigidity of the spacer SP is equal to or greater than the rigidity of the sapphire substrate 20. Therefore, even if a load for correcting the warping of the sapphire substrate 20 is applied, the spacer SP does not deform or the like.

[0067] Figure 7 1 and 2 are diagrams showing a fourth step of the mounting method according to the present embodiment. The fourth step is a step of irradiating the workpiece WK with the first laser beam LZ1.

[0068] The second drive unit DR2 drives the laser device 60, causing the laser head 60A to emit the first laser light LZ1. The laser device 60 irradiates the workpiece WK with the first laser light LZ1 through the window portion 41A of the pressurizing jig 41, thereby bonding the light-emitting element LED to the circuit board CB. Specifically, the bonding member 12 is heated and melted by laser ablation, thereby bonding the terminal portion 11 of the circuit board CB to the terminal portion 22 of the wafer WF. More specifically, the first electrode 22A is bonded to the first electrode 11A via the first bonding member 12A. Furthermore, the second electrode 22B is bonded to the second electrode 11B via the second bonding member 12B. The wavelength range of the first laser light LZ1 is 400 nm to 3000 nm.

[0069] Figure 8 1 and 2 are diagrams showing the fifth step of the mounting method according to the present embodiment. The fifth step is a step of irradiating the workpiece WK with the second laser beam LZ2.

[0070] The second drive unit DR2 drives the laser device 60, causing the laser head 60A to emit the second laser light LZ2. The laser device 60 irradiates the workpiece WK with the second laser light LZ2 through the window 41A of the press jig 41, thereby peeling the light-emitting element LED from the sapphire substrate 20. Specifically, a peeling layer (not shown) that secures the light-emitting element LED to the sapphire substrate 20 is sublimated by laser ablation, thereby peeling the light-emitting element LED from the sapphire substrate 20. The second laser light LZ2 has a different wavelength band from the first laser light LZ1. The wavelength band of the second laser light LZ2 is 200 nm to 366 nm.

[0071] Figure 9 1 and 2 are diagrams showing the sixth step of the mounting method according to this embodiment. The sixth step is a step of moving the press jig 41 .

[0072] The first driving unit DR1 moves the press jig 41 in the vertical direction V and moves away from the sapphire substrate 20. That is, the press jig 41 moves in the vertical direction V to the side away from the stage ST. The press jig 41 is separated from the workpiece WK, and the warped state of the sapphire substrate 20 returns to Figure 4 As shown in the figure, the light emitting element LED is separated from the sapphire substrate 20.

[0073] Figure 10 It is a cross-sectional view schematically showing the structure of the display panel PNL. Figure 10 Indicates that by using Figure 3 The wafer WF shown in Figure 2 The display panel PNL is manufactured by mounting light-emitting elements LED on a circuit board CB shown.

[0074] The display panel PNL includes an insulating substrate 10 having a surface 10A, a spacer SP located on the surface 10A side and having a plurality of holes HL, and a plurality of light-emitting elements LED located on the surface 10A side and within the holes HL. Furthermore, the display panel PNL includes the aforementioned first and second electrodes 11A and 11B, and the first and second bonding members 12A and 12B.

[0075] The upper surface US of the spacer SP and the upper surface LU of the light-emitting element LED are coplanar. The upper surface LU of the light-emitting element LED corresponds to, for example, a light-emitting surface from which light is emitted. The first electrode 22A of the light-emitting element LED is connected to the first electrode 11A via the first bonding member 12A. The second electrode 22B of the light-emitting element LED is connected to the second electrode 11B via the second bonding member 12B.

[0076] The display panel PNL may also include an adhesive layer covering the spacer SP, the light-emitting elements LED, and the like, and an insulating substrate covering the adhesive layer. The adhesive layer may be formed, for example, from OCA (Optical Clear Adhesive) or OCR (Optical Clear Resin). Furthermore, the display panel PNL may also include a resin layer covering the spacer SP, the light-emitting elements LED, and the like.

[0077] Figure 11 1 is a plan view showing the circuit board CB and wafer WF according to the present embodiment. Figure 11 (a) shows a circuit board CB. Figure 11 (b) shows the wafer WF. Figure 11 The wafer WF shown in (b) is Figure 11 A light-emitting element LED is mounted on the circuit board CB shown in (a).

[0078] like Figure 11 As shown in (a), the outer shape of the circuit substrate CB is rectangular. That is, the outer shape of the insulating substrate 10 is rectangular. The spacer SP is lattice-shaped when viewed from above. The spacer SP includes: a plurality of first portions SP1 extending along the first direction X and arranged along the second direction Y, and a plurality of second portions SP2 extending along the second direction Y and arranged along the first direction X. One hole portion HL is equivalent to a space enclosed by two adjacent first portions SP1 and two adjacent second portions SP2. The plurality of hole portions HL are arranged in a matrix in the first direction X and the second direction Y. The plurality of hole portions HL are arranged in the first direction X with a spacing PT1 and in the second direction Y with a spacing PT2. In the example shown in the figure, one terminal portion 11 is located in one hole portion HL. As described above, one terminal portion 11 is composed of a group of first electrodes 11A and second electrodes 11B.

[0079] like Figure 11As shown in (b), the wafer WF has a circular outer shape. That is, the sapphire substrate 20 has a circular outer shape. Multiple light-emitting elements LED are arranged in a matrix in the first direction X and the second direction Y. The multiple light-emitting elements LED are arranged with a pitch PT3 in the first direction X and a pitch PT4 in the second direction Y. The pitch PT3 is equal to the pitch PT1 of the hole portion HL. The pitch PT4 is equal to the pitch PT2 of the hole portion HL.

[0080] like Figure 6 As shown, when the sapphire substrate 20 is flattened, one light emitting element LED is housed in one hole HL. Furthermore, one light emitting element LED is mounted in each of substantially all holes HL. The planar shapes of the circuit board CB and wafer WF are not limited to the above examples.

[0081] Figure 12 1 is a plan view showing the display panel PNL according to this embodiment. Figure 12 Indicates that by using Figure 11 The wafer WF shown in (b) Figure 11 The display panel PNL is manufactured by mounting light-emitting elements LED on the circuit board CB shown in (a).

[0082] One light emitting element LED is mounted in each hole HL, and one light emitting element LED is surrounded by two adjacent first portions SP1 and two adjacent second portions SP2.

[0083] In the above example, a single wafer WF is used for a single circuit board CB. However, if the area of ​​the circuit board CB is equivalent to the area of ​​multiple wafers WF, the light-emitting elements LED can be mounted while the wafers WF are replaced. Furthermore, when mounting light-emitting elements LEDs of different colors, such as red, green, and blue, they may be mounted from separate wafers WF containing light-emitting elements LEDs of each color.

[0084] Figure 13 1 is a plan view showing a circuit board CB and a wafer WF according to a first modification. Figure 13 (a) shows a circuit board CB. Figure 13 (b) shows the wafer WF. Figure 13 The wafer WF shown in (b) is Figure 13 A light-emitting element LED is mounted on the circuit board CB shown in (a). Figure 13 The structure of the wafer WF shown in (b) is Figure 11 The structure of the wafer WF shown in (b) is the same.

[0085] Figure 13 The circuit board CB shown in (a) is Figure 11Compared to the circuit board CB shown in (a), the circuit board CB is different in that it includes holes HL without terminal portions 11. The multiple holes HL include a first hole HL1 and a second hole HL2. The terminal portion 11 is located in the first hole HL1 and not in the second hole HL2. In the illustrated example, a terminal portion 11 is provided in every other hole HL in the first direction X and every other hole HL in the second direction Y.

[0086] like Figure 6 As shown, when the sapphire substrate 20 is flattened, one light-emitting element LED is housed within each hole HL. Furthermore, only one light-emitting element LED is mounted in each hole HL where the terminal portion 11 is located. Light-emitting elements LEDs not used for mounting are prevented from being separated from the wafer WF. By providing holes HL at positions corresponding to unmounted light-emitting elements LEDs, collisions between the light-emitting elements LED and the spacer SP can be suppressed.

[0087] Figure 14 1 is a plan view showing a display panel PNL according to a first modification. Figure 14 Indicates that by using Figure 13 The wafer WF shown in (b) Figure 13 The display panel PNL is manufactured by mounting light-emitting elements LED on the circuit board CB shown in (a).

[0088] The light-emitting element LED is located in the first hole portion HL1 and not in the second hole portion HL2. In the illustrated example, a light-emitting element LED is located in every other hole portion HL in the first direction X and in every other hole portion HL in the second direction Y. The layout of the holes HL where light-emitting elements LEDs are located and those where light-emitting elements LEDs are not located is not limited to this example. Furthermore, other electronic components, such as optical sensors, may also be located in the holes HL where light-emitting elements LEDs are not located.

[0089] Figure 15 1 is a plan view showing a circuit board CB and a wafer WF according to a second modification. Figure 15 (a) shows a circuit board CB. Figure 15 (b) shows the wafer WF. Figure 15 The wafer WF shown in (b) is Figure 15 A light-emitting element LED is mounted on the circuit board CB shown in (a). Figure 15 The structure of the wafer WF shown in (b) is Figure 11 The structure of the wafer WF shown in (b) is the same.

[0090] Figure 15 The circuit board CB shown in (a) is Figure 11Compared to the circuit board CB shown in (a), the difference is that the second portion SP2 of the spacer SP is not formed. That is, the spacer SP has multiple first portions SP1 extending in the first direction X and arranged in the second direction Y. The multiple holes HL extend in the first direction X and are arranged in the second direction Y. In addition, multiple terminals 11 are located in each hole HL.

[0091] like Figure 6 As shown in FIG. 1 , when the sapphire substrate 20 is flattened, a plurality of light emitting elements LED are housed in one hole HL.

[0092] Figure 16 FIG. 1 is a plan view showing a display panel PNL according to a second modification. Figure 16 Indicates that by using Figure 15 The wafer WF shown in (b) Figure 15 The display panel PNL is manufactured by mounting light-emitting elements LED on the circuit board CB shown in (a).

[0093] Multiple light emitting elements LED are located in one hole HL. In the illustrated example, the hole HL extends in the first direction X, but may also extend in the second direction Y. That is, the first portion SP1 of the spacer SP may not be formed, and only the second portion SP2 may be formed.

[0094] As described above, according to the present embodiment, it is possible to obtain an electronic component mounting method, a display device, and a circuit board capable of improving yield.

[0095] In this specification, a light-emitting element is described as an example of an electronic component. However, this embodiment can also be applied to electronic components other than light-emitting elements.

[0096] While several embodiments of the present invention have been described, these embodiments are provided as examples and are not intended to limit the scope of the invention. These new embodiments may be implemented in various other ways, and various omissions, substitutions, and modifications may be made without departing from the spirit of the invention. These embodiments and their variations are intended to be within the scope and spirit of the invention and are encompassed by the invention set forth in the claims and their equivalents.

Claims

1. A method for mounting an electronic component, A workpiece is placed between a stage and a press jig with its first surface and second surface facing each other, the workpiece comprising a circuit substrate and a wafer, the circuit substrate comprising: an insulating substrate having the first surface; and a terminal portion and a spacer located on the first surface side; the wafer comprising: a sapphire substrate having the second surface; and an electronic component located on the second surface side; causing the pressurizing jig to contact a portion of the sapphire substrate and applying a load to a contact portion between a portion of the upper surface of the spacer and the second surface; Using the pressurizing fixture to pressurize the sapphire substrate toward the circuit substrate, so that the other portion of the upper surface of the spacer abuts against the second surface, thereby flattening the sapphire substrate; The press jig is fixed in a state where the sapphire substrate is flattened, and a first laser is irradiated onto the workpiece through a window of the press jig to bond the electronic component to the circuit substrate; irradiating the workpiece with a second laser beam having a wavelength different from that of the first laser beam through the window portion to peel the electronic component from the sapphire substrate; and Separating the pressurizing fixture from the sapphire substrate; in, The rigidity of the spacer is equal to or greater than the rigidity of the sapphire substrate.

2. The electronic component mounting method according to claim 1, wherein: When the pressurizing jig is brought into contact with a portion of the sapphire substrate and a load is applied to the contact portion between a portion of the upper surface of the spacer and the second surface, the remaining portion of the upper surface of the spacer moves away from the second surface.

3. The electronic component mounting method according to claim 1, wherein: When the sapphire substrate is planarized, the entire upper surface of the spacer contacts the second surface.

4. The method for mounting an electronic component according to claim 1, wherein: The spacer has a plurality of holes. When the sapphire substrate is pressed toward the circuit substrate by the pressurizing jig, the electronic component is housed in the hole.

5. A display device comprising: an insulating substrate having a first surface; a spacer located on the first surface side and having a plurality of holes; and a plurality of electronic components located on the first surface side and in the hole portion; The spacer is formed of aluminum oxide; The display device is formed by the following installation method: The workpiece is placed between a stage and a press jig with the first surface and the second surface facing each other, the workpiece including a circuit substrate and a wafer, the circuit substrate including: the insulating substrate having the first surface, and the terminal portion and the spacer located on the first surface side; the wafer including: a sapphire substrate having the second surface, and the electronic component located on the second surface side; causing the pressurizing jig to contact a portion of the sapphire substrate and applying a load to a contact portion between a portion of the upper surface of the spacer and the second surface; Using the pressurizing fixture to pressurize the sapphire substrate toward the circuit substrate, so that the other portion of the upper surface of the spacer abuts against the second surface, thereby flattening the sapphire substrate; The press jig is fixed in a state where the sapphire substrate is flattened. irradiating the workpiece with a first laser through a window of the press jig to bond the electronic component to the circuit board; irradiating the workpiece with a second laser beam having a wavelength different from that of the first laser beam through the window portion to peel the electronic component from the sapphire substrate; and Separating the pressurizing fixture from the sapphire substrate; in, The rigidity of the spacer is equal to or greater than the rigidity of the sapphire substrate. The display device according to claim 5 , wherein: An upper surface of the spacer and an upper surface of the electronic component are located on the same plane.

7. The display device according to claim 5, wherein: The spacers have a lattice shape in a plan view.

8. The display device according to claim 5, wherein The plurality of hole portions include a first hole portion and a second hole portion, The electronic component is located in the first hole portion but not in the second hole portion.

9. The display device according to claim 5, wherein: The plurality of electronic components are located in one hole.

10. A circuit substrate comprising: an insulating substrate having a first surface; a spacer located on the first surface side and having a plurality of holes; and a plurality of terminal portions located on the first surface side and in the hole portion; The spacer is formed of aluminum oxide; The circuit board is used for the following mounting methods: The workpiece is placed between a stage and a press jig with the first surface and the second surface facing each other, the workpiece including the circuit substrate and a wafer, the circuit substrate including: the insulating substrate having the first surface, the terminal portion and the spacer located on the first surface side; and the wafer including: a sapphire substrate having the second surface, and an electronic component located on the second surface side. causing the pressurizing jig to contact a portion of the sapphire substrate and applying a load to a contact portion between a portion of the upper surface of the spacer and the second surface; Using the pressurizing fixture to pressurize the sapphire substrate toward the circuit substrate, so that the other portion of the upper surface of the spacer abuts against the second surface, thereby flattening the sapphire substrate; The press jig is fixed in a state where the sapphire substrate is flattened. irradiating the workpiece with a first laser through a window of the press jig to bond the electronic component to the circuit board; irradiating the workpiece with a second laser beam having a wavelength different from that of the first laser beam through the window portion to peel the electronic component from the sapphire substrate; and Separating the pressurizing fixture from the sapphire substrate; Wherein, the rigidity of the spacer is equal to or greater than the rigidity of the sapphire substrate.

11. The circuit substrate according to claim 10, wherein: The spacers have a lattice shape in a plan view.

12. The circuit substrate according to claim 10, wherein: The plurality of hole portions include a first hole portion and a second hole portion, The terminal portion is located in the first hole portion but not in the second hole portion.

13. The circuit substrate according to claim 10, wherein The plurality of terminal portions are located in one hole portion.

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