Immersion cooling system with dual circulation of liquid for dielectric cooling

Abstract

The present application provides an immersion cooling system with a double circulation of dielectric cooling liquid. The cooling system includes a container that receives dielectric cooling liquid and receives electronic components immersed in the dielectric cooling liquid. A first pump circulates a first portion of the dielectric cooling liquid in the container to perform convection cooling of the electronic components. A second pump draws a second portion of the dielectric cooling liquid from the container and directs the second portion of the dielectric cooling liquid toward the electronic components to perform direct cooling of the electronic components. A manifold fluidically connected to an outlet of the second pump receives the second portion of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidically connected to the manifold place a portion of the second portion of the dielectric cooling liquid in thermal contact with the electronic components.

Description

Technical Field

[0001] The technology of the present application relates to a cooling system for immersion cooling of electronic components. In particular, the immersion cooling system realizes a double circulation of liquid for dielectric cooling. Background Art

[0002] Electronic equipment such as servers, storage libraries, computer disks, etc. are often grouped in equipment racks. Large data centers and other large computing facilities may house thousands of racks supporting thousands or even tens of thousands of servers.

[0003] A rack including devices mounted in the backplane of the rack consumes a large amount of power and generates a large amount of heat. The need for cooling is important in such a rack. Some electronic devices, such as processors, generate so much heat that they may fail within seconds in the absence of cooling.

[0004] Fans are typically installed within equipment racks to provide forced air cooling to the rack mounted equipment. This solution is simply to transfer some of the heat generated within the rack to the general environment of the data center. Recently, liquid cooling, particularly water cooling, has been introduced as a supplement or alternative to traditional forced air cooling. Cooling plates, such as water blocks, with internal channels for water circulation can be installed on heat generating components such as processors to transfer heat from the processors to heat exchangers. The racks can be installed with air-to-liquid heat exchangers, such as fin-and-tube heat exchangers similar to radiators, to absorb some of this transferred heat and transport it to external cooling equipment, such as cooling towers, located outside the data center.

[0005] Immersion cooling (sometimes called immersive cooling) is a relatively recent introduction. Electronic components are inserted into a container that is fully or partially filled with a non-conductive cooling liquid, such as an oil-based dielectric cooling liquid. Good thermal contact can be obtained between the electronic components and the dielectric cooling liquid. However, electronic components such as servers include: some devices that may generate most of the heat, such as processors; and other devices that may generate much less heat, such as memory boards. It is usually necessary to ensure that the dielectric cooling liquid can be circulated in the container at a level sufficient to cool the hottest devices in the electronic components. This requires the use of efficient pumps that consume a lot of energy. Heat sinks can be installed on some heat generating devices. Some other heat generating devices may have porous surfaces so that the contact between these devices and the dielectric cooling liquid is closer and therefore more thermally efficient. These solutions only moderately reduce the energy required to operate the pump to circulate the dielectric cooling liquid in the container.

[0006] Even though the recent developments described above may provide benefits, improvements are still needed.

[0007] The subject matter discussed in the background section should not be considered to be prior art simply because of the mention of the subject matter in the background section. Similarly, the problems mentioned in the background section or problems related to the subject matter in the background section should not be considered to have been previously recognized in the prior art. The subject matter in the background section merely presents a different approach. Summary of the invention

[0008] Embodiments of the present technology were developed based on the developers' understanding of the shortcomings associated with the prior art.

[0009] In particular, such disadvantages may include: (1) failure to address cooling requirements for devices that generate the majority of the heat; and / or, (2) significant power consumption by the cooling system.

[0010] In one aspect, various implementations of the present technology provide a cooling system, the cooling system comprising:

[0011] a container configured to receive a dielectric cooling liquid, and the container configured to receive one or more electronic components immersed in the dielectric cooling liquid;

[0012] a first pump configured to circulate a first portion of the dielectric cooling liquid in the container to provide convective cooling of the one or more electronic components;

[0013] a second pump configured to direct a second portion of the dielectric cooling liquid toward at least one of the one or more electronic components to directly cool the at least one of the one or more electronic components;

[0014] a manifold fluidly connected to the outlet of the second pump, the manifold being adapted to receive a second portion of the dielectric cooling liquid from the second pump; and

[0015] One or more outlet tubes are fluidly connected to the manifold, each outlet tube being configured to bring a portion of the second portion of the dielectric cooling liquid into thermal contact with a corresponding electronic component.

[0016] In some implementations of the present technology, the cooling system further includes: a first piping arrangement including an inlet configured to draw a first portion of the dielectric cooling liquid from an upper portion of the container and an outlet fluidly connected to an inlet of the first pump; and a second piping arrangement including an inlet fluidly connected to the outlet of the first pump and an outlet configured to return the first portion of the dielectric cooling liquid to a lower portion of the container.

[0017] In some implementations of the present technology, the second pump is configured to be immersed in the dielectric-cooling liquid, and the second pump includes an inlet configured to draw the second portion of the dielectric-cooling liquid from the container.

[0018] In some implementations of the present technology, the cooling system further includes: a first piping arrangement including an inlet configured to pump the first and second portions of the dielectric-cooling liquid from an upper portion of the container and an outlet fluidly connected to the inlet of the first pump; and a second piping arrangement including an inlet fluidly connected to the outlet of the first pump, a first outlet configured to return the first portion of the dielectric-cooling liquid to the lower portion of the container, and a second outlet configured to direct the second portion of the dielectric-cooling liquid toward the inlet of the second pump.

[0019] In some implementations of the present technology, the cooling system also includes a heat exchanger, which is in thermal contact with one of the first pipe arrangement structure and the second pipe arrangement structure, and the heat exchanger is configured to extract heat from the dielectric cooling liquid present in the one of the first pipe arrangement structure and the second pipe arrangement structure, and the heat exchanger is selected from a gas-to-liquid heat exchanger and a liquid-to-liquid heat exchanger.

[0020] In some implementations of the present technology, the outlet tube is not sealingly connected to the manifold.

[0021] In some implementations of the present technology, each outlet tube is mounted to a corresponding electronic component and is configured to be connected in fluid communication to the manifold when the corresponding electronic component is inserted into the receptacle.

[0022] In some implementations of the present technology, the first pump and the second pump are configured such that a pressure of a second portion of the dielectric-cooling liquid directed toward the at least one of the one or more electronic components is greater than a pressure of a first portion of the dielectric-cooling liquid circulating in the container.

[0023] In some implementations of the present technology, the cooling system also includes one or more heat transfer devices, each heat transfer device is suitable for being mounted on a corresponding electronic component, and each heat transfer device includes an inlet connected to the second pump in a fluid-connected manner via a corresponding outlet pipe and configured to receive a flow of dielectric cooling liquid directed toward the corresponding electronic component by the second pump.

[0024] In some implementations of the present technology, the cooling system further includes: one or more heat transfer devices, each heat transfer device is suitable for being mounted on a corresponding electronic component, and each heat transfer device is suitable for selectively receiving a flow of dielectric cooling liquid directed toward the corresponding electronic component by a second pump, each heat transfer device including an inlet fluidically connected to the second pump via a corresponding outlet pipe and including a plug, the plug being formed of a phase change material, the melting temperature of the phase change material being higher than a normal operating temperature of the cooling system and lower than a maximum safe operating temperature of the corresponding electronic component; the plug being configured to obstruct the flow of the dielectric cooling liquid within the heat transfer device when the temperature of the dielectric cooling liquid is lower than the melting temperature of the phase change material, and the plug being configured to melt and allow the flow of the dielectric cooling liquid in the heat transfer device when the temperature of the dielectric cooling liquid exceeds the melting temperature.

[0025] In some implementations of the present technology, at least one of the heat transfer devices includes an outlet configured to release the flow of dielectric cooling liquid in the container.

[0026] In some implementations of the present technology, at least one of the heat transfer devices includes an outlet fluidly connected to a tubular member, the tubular member being configured to redirect a flow of the dielectric cooling liquid toward another component.

[0027] In some implementations of the present technology, the manifold includes one or more orifices, each orifice configured to connect in fluid communication with a corresponding one of the one or more outlet tubes.

[0028] In some implementations of the present technology, the cooling system also includes: a first sensor for the temperature of the dielectric cooling liquid; and a controller, the controller being configured to receive a signal indicating the temperature of the dielectric cooling liquid from the first sensor, and to operate the first pump in response to the temperature of the dielectric cooling liquid being greater than a first threshold.

[0029] In some implementations of the present technology, the cooling system further includes a second sensor of a temperature of the one or more electronic components; and the controller is further configured to operate the second pump in response to the temperature of the one or more electronic components being greater than a second threshold.

[0030] In the context of this application document, unless otherwise expressly specified, a computer system may refer to but is not limited to an "electronic device", "operating system", "system", "computer-based system", "controller unit", "monitoring device", "control device" and / or any combination of the above that is suitable for the relevant task at hand.

[0031] In the context of the present application document, unless otherwise expressly provided, the expressions "computer-readable medium" and "memory" are intended to include any nature and type of medium, non-limiting examples of which include RAM, ROM, disks (CD-ROM, DVD, floppy disks, hard disk drives, etc.), USB keys, flash memory cards, solid-state drives, and tape drives. Still in the context of the present application document, "a" computer-readable medium and "the" computer-readable medium should not be understood as the same computer-readable medium. On the contrary, and where appropriate, "a" computer-readable medium and "the" computer-readable medium may also be understood as a first computer-readable medium and a second computer-readable medium.

[0032] In the context of this application document, unless expressly specified otherwise, the words "first", "second", "third", etc. are used as adjectives merely to allow the nouns modified by these words to be distinguished from each other, rather than to describe any specific relationship between these nouns.

[0033] The implementations of the present technology each have at least one of the above-mentioned purposes and / or aspects, but not necessarily all of the above-mentioned purposes and / or aspects. It should be understood that some aspects of the present technology generated by attempting to achieve the above-mentioned purpose may not meet the purpose and / or may meet other purposes not specifically described herein.

[0034] Additional and / or alternative features, aspects, and advantages of implementations of the present technology will become apparent from the following description, drawings, and appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] For a better understanding of the present technology, as well as other aspects and further features of the present technology, reference is made to the following description which will be used in conjunction with the accompanying drawings, in which:

[0036] Figure 1 is a schematic diagram of an immersion cooling system according to an embodiment of the present technology;

[0037] Figure 2 is a schematic diagram of another immersion cooling system according to an embodiment of the present technology;

[0038] Figure 3Various connection types of outlet tubes between manifolds and electronic components are shown according to embodiments of the present technology;

[0039] Figure 4 is a block diagram of a gas-to-liquid heat exchanger thermally connected to a piping arrangement in accordance with an embodiment of the present technology;

[0040] Figure 5 is a block diagram of a liquid-to-liquid heat exchanger thermally connected to a piping arrangement according to an embodiment of the present technology;

[0041] Figure 6 is a schematic diagram of a phase change material plug for selectively allowing a dielectric cooling liquid to reach a heat transfer device in accordance with an embodiment of the present technology; and

[0042] Figure 7 is a block diagram of a system for controlling a pump according to an embodiment of the present technology.

[0043] It should also be noted that unless otherwise expressly indicated herein, the drawings are not drawn to scale. DETAILED DESCRIPTION

[0044] The examples and conditional language described herein are primarily intended to help readers understand the principles of the present technology, rather than to limit the scope of the present technology to these specifically described examples and conditions. It will be understood that a person skilled in the art can design various arrangements that, even if not explicitly described or shown herein, still embody the principles of the present technology.

[0045] In addition, as an aid to understanding, the following description may describe a relatively simplified implementation of the present technology. As will be appreciated by those skilled in the art, various implementations of the present technology may have greater complexity.

[0046] In some cases, useful examples that are considered modifications of the present technology may also be listed. This is done solely to aid understanding, and is not intended to limit the scope of the present technology or to list the limits of the present technology. These modifications are not exhaustive, and those skilled in the art may make other modifications while still remaining within the scope of the present technology. In addition, if no examples of modifications are listed, it should not be interpreted that any modification is impossible and / or that the described examples are the only way to implement elements of the present technology.

[0047] In addition, all statements herein setting forth the principles, aspects, and implementations of the present technology, as well as specific examples of the present technology, are intended to include structural and functional equivalents thereof, whether currently known or developed in the future. Thus, for example, it will be understood by those skilled in the art that any block diagram herein presents a conceptual view of an illustrative system that implements the principles of the present technology.

[0048] In one aspect, the present technology introduces a cooling system having two pumps for circulating a dielectric cooling liquid in a container that receives one or more electronic components immersed in the dielectric cooling liquid. One pump is used to circulate the dielectric cooling liquid extensively within the container. The other pump is used to direct the flow of the dielectric cooling liquid toward the electronic components. In this way, the directed flow provides enhanced cooling for specific devices of the electronic components, such as, for example, a processor that generates the most heat energy, while the extensive circulation of the cooling liquid within the container allows cooling of other devices of the electronic components while controlling the temperature of the dielectric cooling liquid as a whole.

[0049] With these basic principles in place, some non-limiting examples will now be considered to illustrate various implementations of aspects of the present technology. Figure 1 is a schematic diagram of an immersion cooling system 100. In the illustrated embodiment, the cooling system 100 includes a container 110 configured to receive a dielectric cooling liquid 120 and configured to receive one or more electronic components 130 immersed in the dielectric cooling liquid 120. A pump 140 is used to circulate a first portion of the dielectric cooling liquid 120 in the container 110 for convective cooling of the one or more electronic components 130. Another pump 150 is used to direct a second portion of the dielectric cooling liquid 120 toward at least one of the one or more electronic components 130 for direct cooling of the electronic component 130. Figure 1 In an embodiment, a pump 150 is immersed in the dielectric-cooling liquid 120, and the pump 150 includes an inlet 152 configured to pump a second portion of the dielectric-cooling liquid 120 from the container 110. The system 100 also includes two pipe arrangements 160 and 170. The pipe arrangement 160 has an inlet 162 for pumping a first portion of the dielectric-cooling liquid 120 from the upper portion 112 of the container 110, and an outlet 164 fluidly connected to the inlet 142 of the pump 140. The pipe arrangement 170 has an inlet 172 and an outlet 174, the inlet 172 being fluidly connected to the outlet 144 of the pump 140, the outlet 174 being used to return the first portion of the dielectric-cooling liquid 120 to the lower portion 114 of the container 110.

[0050] like Figure 1As shown, the cooling system 100 may include a heat exchanger 180 for extracting heat from the dielectric cooling liquid 120 present in the pipe arrangement 160. It is also contemplated that the heat exchanger 180 may be mounted on the pipe arrangement 170 and between the inlet 172 and the outlet 174. Details of various embodiments of the heat exchanger 180 are provided below.

[0051] In some embodiments, the cooling system 100 includes one or more heat transfer devices 400, which may also be referred to as "cold plates" or "water blocks" (although water is not supplied in the present cooling system 100). As shown, the heat transfer devices 400 are mounted on corresponding electronic components 130, and more specifically, the heat transfer devices 400 are mounted on processors 132 as part of the electronic components 130. In different embodiments, one or more heat transfer devices 400 may be mounted on corresponding central processing units (CPUs), graphics processing units (GPUs), and other heat generating devices of the electronic components 130.

[0052] Figure 1 As also shown, the cooling system 100 further includes another piping arrangement 190 having a manifold 192 fluidly connected to the outlet 154 of the pump 150, the manifold 192 for receiving the second portion of the dielectric cooling liquid from the pump 150. The piping arrangement 190 further includes one or more outlet pipes 194 fluidly connected to the manifold 192, each outlet pipe 194 being configured to bring a portion of the second portion of the dielectric cooling liquid 120 into thermal contact with a corresponding electronic component 130. Each heat transfer device 400 includes an inlet 402 ( Figure 3) and corresponding outlet tubes 194, the inlet 402 being fluidly connected to the pump 150 via the manifold 192, the outlet tubes 194 being used to receive the flow of dielectric-cooling liquid 120 directed toward the corresponding electronic component 130 by the pump 150. In some embodiments, some of the outlet tubes 194 deliver at least a portion of the second portion of the dielectric-cooling liquid 120 to the inlet 402 of the heat transfer device 400 directly mounted on the processor 132 or similar heat generating device of the electronic component 130. In the same or other embodiments, some of the outlet tubes 194 deliver at least a portion of the second portion of the dielectric-cooling liquid 120 to the vicinity of other devices 134 of the electronic component 130. In either case, the second portion of the dielectric-cooling liquid 120 is then released into the container 110. The second portion of the dielectric-cooling liquid 120 that has absorbed heat from the electronic components 130 has a density less than the remainder of the dielectric-cooling liquid 120 present in the container 110 and tends to move toward the upper portion 112 of the container 110 where it is likely to be picked up by the inlet 162 of the piping arrangement 160 for cooling in the heat exchanger 180 and for recirculation.

[0053] Figure 2 is a schematic diagram of another immersion cooling system 100 . Figure 2 The cooling system 100 shown includes Figure 1 Many components introduced in the description of FIG. 1 and the description of these components will not be repeated in this article. Figure 2 In the embodiment of the present invention, the pump 150 is not immersed in the dielectric cooling liquid 120. The inlet 162 of the pipe arrangement 160 draws both the first portion and the second portion of the dielectric cooling liquid 120 from the upper portion 112 of the container 110. The first outlet 175 of the pipe arrangement 170 returns the first portion of the dielectric cooling liquid 120 to the lower portion 114 of the container 110. Figure 1 In the case of FIG. 1 , the second outlet 177 of the conduit arrangement 170 directs the second portion of the dielectric-cooling liquid 120 toward the inlet 152 of the pump 150, which pushes the second portion of the dielectric-cooling liquid 120 toward the conduit arrangement 190 via the outlet 154 of the pump 150. It is also conceivable that the pump 150 may be connected to a separate conduit arrangement (not shown) having its own inlet (not shown) for drawing the second portion of the dielectric-cooling liquid 120 from the upper portion 112 of the container 110.

[0054] consider Figure 1 and Figure 2In some non-limiting embodiments, pumps 140 and 150 can be configured such that the pressure of the second portion of dielectric-cooling liquid 120 directed toward electronic component 130 is greater than the pressure of the first portion of dielectric-cooling liquid 120 circulating in container 110. This higher pressure provided by pump 150 can help overcome the pressure drop of dielectric-cooling liquid 120 flowing in heat transfer device 400. Figure 1 In the case of , the flow rates of pump 140 and pump 150 are independent. However, in Figure 2 In this case, the flow rate of the pump 140 is greater than the flow rate of the pump 150 , so that the pump 140 can deliver both the first part and the second part of the dielectric-cooling liquid 120 .

[0055] Since the same dielectric-cooling liquid 120 circulates within the container 110 as the first portion of the dielectric-cooling liquid 120 and circulates in the manifold 192 toward the electronic components 130 as the second portion of the dielectric-cooling liquid 120, it is not necessary to prevent any leakage of the dielectric-cooling liquid 120 between the manifold 190 and the container 110. For example, Figure 3 Various types of connections of the outlet tubes 194 between the manifold 192 and the electronic components 130 are shown. The outlet tubes 194 need not be sealingly connected to the manifold 192. Instead, the manifold includes a series of apertures 196, each of which is sized and positioned to receive a lower end of a corresponding outlet tube 194 to deliver a portion of the second portion of the dielectric-cooling liquid 120 toward the electronic components 130. Although the apertures 196 may be sized to provide a tight fit with the outlet tubes 194 received therein, some leakage of the second portion of the dielectric-cooling liquid 120 from the manifold 192 to the container 110 is acceptable given that the container 110 is substantially filled with such dielectric-cooling liquid 120.

[0056] Thus, to insert the electronic component 130 into the container 110, the heat transfer device 400 and the corresponding outlet tube 194 can be pre-installed on the electronic component 130, and then the electronic component 130 can be inserted into the container 110 at a position such that the lower end of the outlet tube 194 reaches the corresponding orifice 196 of the manifold 192. In this way, a fluid connection is obtained between the manifold 192 and the outlet tube 194 without using any special type of sealable or complex connection between the manifold 192 and the outlet tube 194. The final removal of the electronic component 130 from the container 110 can be obtained without disconnecting any special connection at the joint between the manifold 192 and the outlet tube 194.

[0057] As described above, each heat transfer device 400 includes an inlet 402 fluidly connected to the pump 150 via the manifold 192 and includes a corresponding outlet tube 194. Each heat transfer device 400 also includes an outlet 404 for releasing a flow of dielectric cooling liquid 120 in the container 110. The flow of dielectric cooling liquid 120 can be released directly in the container 110 from the outlet 404. Tubing 406 can be fluidly connected to the outlet 404 of some of the heat transfer devices 400 to redirect the flow of dielectric cooling liquid 120 toward another component present in the container 110, such as another electronic component 130 or another heat transfer device 400.

[0058] exist Figure 1 and Figure 2 The heat exchanger 180 introduced in the description may include a gas-liquid heat exchanger. Figure 4 is a block diagram of an air-to-liquid heat exchanger 200 thermally connected to a duct arrangement 160 or a duct arrangement 170. One or more fans 210 positioned downstream (as shown) or upstream of the air-to-liquid heat exchanger 200 cause airflow through the air-to-liquid heat exchanger 200 to extract heat from the dielectric cooling liquid 120 flowing through a core 220 of the air-to-liquid heat exchanger 200.

[0059] Alternatively, in Figure 1 and Figure 2 The heat exchanger 180 introduced in the description may include a liquid-to-liquid heat exchanger. Figure 5 1 is a block diagram of a liquid-to-liquid heat exchanger 300 thermally connected to a pipe arrangement 160 or a pipe arrangement 170. The liquid-to-liquid heat exchanger 300 includes a primary side 310 in thermal contact with the pipe arrangement 160 or the pipe arrangement 170 and a secondary side 320 in thermal contact with the primary side 310. A flow of liquid coolant 350, such as water, is received in the secondary side 320 via a liquid coolant inlet 330 and returned from the secondary side 320 via a liquid coolant outlet 340. The flow of the liquid coolant 350 in the secondary side 320 allows heat to be extracted from the dielectric cooling liquid 120 present in the pipe arrangement 160 or the pipe arrangement 170. The liquid coolant inlet 330 and the liquid coolant outlet 340 are connected to an external liquid coolant source (not shown), such as an external dry cooler.

[0060] In an embodiment, the flow of dielectric-cooling liquid 120 to some of the heat transfer devices 400 may be prevented before the temperature of the dielectric-cooling liquid 120 in the reservoir 110 reaches an unacceptable level. Figure 6is a schematic diagram of a phase change material (PCM) plug 410 for selectively allowing the dielectric cooling liquid 120 to reach the heat transfer device 400. One heat transfer device 400 mounted on a corresponding electronic component 130 selectively receives a flow of the dielectric cooling liquid 120 directed toward the corresponding electronic component 130 by the pump 150. The plug 410 formed of a suitable PCM such as wax, resin, paraffin, grease, silicone, synthetic glue, and polymer is inserted into the outlet pipe 194, for example, near the inlet 402 of the heat transfer device 400. Alternatively, the plug 410 may be formed at any point between the lower portion of the outlet pipe 194 and the inlet 402 of the heat transfer device 400; at the outlet 404 of the heat transfer device 400; or at any point between the inlet 402 and the outlet 404 of the heat transfer device 400.

[0061] The melting temperature of the PCM is higher than the normal operating temperature of the cooling system 100 and lower than the maximum safe operating temperature of the corresponding electronic component 130. In normal operation of the cooling system 100, the temperature of the dielectric cooling liquid 120 in the container 110 is lower than the melting temperature of the PCM. In this case, the plug 410 blocks the flow of the dielectric cooling liquid 120 into the heat transfer device 400. When the temperature of the dielectric cooling liquid 120 exceeds the melting temperature of the PCM, the plug 410 melts and allows the dielectric cooling liquid 120 to flow into the heat transfer device 400, thereby providing enhanced cooling for the electronic component 130.

[0062] It may be noted that once the plug 410 melts, the plug 410 no longer exists and the PCM is dispersed within the dielectric cooling liquid 120. If the temperature of the dielectric cooling liquid 120 decreases below the melting temperature of the PCM, the material of the plug 410 is expected to solidify and float in the upper portion 112 of the container 110 or fall to the lower portion 114 of the container depending on the material density of the plug 410.

[0063] Figure 71 is a block diagram of a system for controlling pumps 140 and 150. In a non-limiting embodiment, the fluid temperature sensor 122 can detect the temperature of the dielectric cooling liquid 120 in the container 110. The temperature reading can be provided to the controller 500 by the fluid temperature sensor 122. The controller 500 can control the operation of the pump 140 by starting the pump 140 when the temperature of the dielectric cooling liquid 120 rises above a first threshold and stopping the pump 140 when the temperature of the dielectric cooling liquid 120 drops below the first threshold. The controller 500 can implement hysteresis so that the pump 140 is stopped when the temperature of the dielectric cooling liquid 120 drops to a temperature slightly below the first threshold to avoid frequently starting and stopping the pump 140. It is also contemplated that a timer is used to keep the pump 140 operating for at least a minimum duration. In the same or another embodiment, the processor temperature sensor 136 can detect the temperature of the electronic component 130, such as the temperature of the processor 132. The controller 500 may control the operation of the pump 150 by starting the pump 150 when the temperature of the electronic component 130 rises above the second threshold and stopping the pump 150 when the temperature of the electronic component 130 drops below the second threshold. The controller 500 may implement a hysteresis effect so that the pump 150 is stopped when the temperature of the electronic component 130 drops to a temperature slightly below the threshold to avoid frequent starting and stopping of the pump 150. It is also conceivable to use a timer to keep the pump 150 operating for at least a minimum duration. It is also conceivable that when the temperature of the electronic component 130 rises above the second threshold, the controller 500 may start the pump 140 regardless of whether the temperature of the dielectric cooling liquid 120 is above or below the first threshold, so that when the temperature of the electronic component 130 reaches the second threshold and the pump 150 is started, the circulation of the dielectric cooling liquid 120 is always maintained in the container 110 via the pipe arrangement 160.

[0064] Although the above implementations have been described and illustrated with reference to specific steps performed in a specific order, it will be understood that these steps may be combined, subdivided, or reordered without departing from the teachings of the present technology. At least some of these steps may be performed in parallel or in series. Accordingly, the order and grouping of steps are not limitations of the present technology.

[0065] It should be clearly understood that not every implementation of the present technology is required to enjoy all the technical effects mentioned in this article.

[0066] Modifications and improvements to the above implementations of the present technology may be obvious to those skilled in the art. The above description is intended to be exemplary rather than restrictive. Therefore, the scope of the present technology is intended to be limited only by the scope of the appended claims.

Claims

1. A cooling system, comprising: a container configured to receive a dielectric cooling liquid, and the container configured to receive one or more electronic components immersed in the dielectric cooling liquid; a first pump configured to circulate a first portion of the dielectric cooling liquid in the container to provide convective cooling of the one or more electronic components; a second pump configured to direct a second portion of the dielectric cooling liquid toward at least one of the one or more electronic components to directly cool the at least one of the one or more electronic components; a manifold fluidly connected to an outlet of the second pump, the manifold being adapted to receive the second portion of the dielectric cooling liquid from the second pump; as well as One or more outlet tubes are fluidly connected to the manifold, each outlet tube being configured to place a portion of the second portion of the dielectric cooling liquid in thermal contact with a corresponding electronic component.

2. The cooling system according to claim 1, further comprising: A first pipeline arrangement structure, wherein the first pipeline arrangement structure comprises: an inlet configured to draw the first portion of the dielectric cooling liquid from an upper portion of the container, and an outlet fluidly connected to an inlet of the first pump; and A second pipeline arrangement structure, wherein the second pipeline arrangement structure comprises: an inlet fluidly connected to an outlet of the first pump; and An outlet configured to return the first portion of the dielectric cooling liquid to the lower portion of the vessel.

3. The cooling system according to claim 2, wherein: The second pump is configured to be immersed in the dielectric-cooling liquid, and the second pump includes an inlet configured to draw the second portion of the dielectric-cooling liquid from the container.

4. The cooling system according to claim 1, further comprising: A first pipeline arrangement structure, wherein the first pipeline arrangement structure comprises: an inlet configured to draw the first portion and the second portion of the dielectric cooling liquid from an upper portion of the container, and an outlet fluidly connected to an inlet of the first pump; and A second pipeline arrangement structure, wherein the second pipeline arrangement structure comprises: an inlet fluidly connected to an outlet of the first pump; a first outlet configured to return the first portion of the dielectric cooling liquid to a lower portion of the container, and A second outlet is configured to direct the second portion of the dielectric-cooling liquid toward an inlet of the second pump.

5. The cooling system of claim 2, further comprising a heat exchanger in thermal contact with one of the first and second tube arrangements, the heat exchanger configured to extract heat from the dielectric cooling liquid present in the one of the first and second tube arrangements.

6. The cooling system according to claim 5, wherein: The heat exchanger is a gas-liquid heat exchanger; and The cooling system includes one or more fans configured to cause airflow through the air-to-liquid heat exchanger.

7. The cooling system according to claim 5, wherein: The heat exchanger is a liquid-liquid heat exchanger, and the liquid-liquid heat exchanger comprises: a primary side portion in thermal contact with said one of the first duct arrangement and the second duct arrangement, and a secondary side portion in thermal contact with the primary side portion, and a liquid coolant inlet and a liquid coolant outlet, the liquid coolant inlet and the liquid coolant outlet being connected in fluid communication to the secondary side of the liquid-to-liquid heat exchanger and configured to allow liquid coolant to flow in the secondary side to extract heat from the dielectric cooling liquid present in the one of the first and second tube arrangements.

8. The cooling system according to claim 1, wherein: The outlet tube is not sealingly connected to the manifold.

9. The cooling system according to claim 1, wherein: Each outlet tube is mounted to a corresponding electronic component and is configured to be connected in fluid communication to the manifold when the corresponding electronic component is inserted into the receptacle.

10. The cooling system according to claim 1, wherein: The first pump and the second pump are configured such that a pressure of the second portion of the dielectric cooling liquid directed toward the at least one of the one or more electronic components is greater than a pressure of the first portion of the dielectric cooling liquid circulating in the container.

11. The cooling system of claim 1 , further comprising one or more heat transfer devices, each heat transfer device being adapted to be mounted on a corresponding electronic component, each heat transfer device comprising an inlet fluidically connected to the second pump via a corresponding outlet pipe and configured to receive a flow of the dielectric cooling liquid directed toward the corresponding electronic component by the second pump.

12. The cooling system according to claim 1, further comprising: one or more heat transfer devices, each heat transfer device being adapted to be mounted on a corresponding electronic component and each heat transfer device being adapted to selectively receive a flow of the dielectric cooling liquid directed toward the corresponding electronic component by the second pump, each heat transfer device comprising: is fluidly connected to an inlet of the second pump via a corresponding outlet pipe, and a plug formed of a phase change material having a melting temperature higher than a normal operating temperature of the cooling system and lower than a maximum safe operating temperature of a corresponding electronic component; in, The plug is configured to impede flow of the dielectric cooling liquid within the heat transfer device when the temperature of the dielectric cooling liquid is below the melting temperature of the phase change material, and The plug is configured to melt and allow flow of the dielectric cooling liquid in the heat transfer device when the temperature of the dielectric cooling liquid exceeds the melting temperature.

13. The cooling system according to claim 11, wherein: At least one of the heat transfer devices includes an outlet configured to release the flow of the dielectric cooling liquid into the container.

14. The cooling system according to claim 11, wherein: At least one of the heat transfer devices includes an outlet fluidly connected to a tubular member configured to redirect a flow of the dielectric cooling liquid toward another component.

15. The cooling system according to claim 1, wherein: The manifold includes one or more apertures, each aperture being configured to connect in fluid communication with a corresponding one of the one or more outlet tubes.

16. The cooling system according to claim 1, further comprising: a first sensor for the temperature of the dielectric cooling liquid; as well as A controller, the controller being configured to: receiving a signal from the first sensor indicative of a temperature of the dielectric cooling fluid, and The first pump is operated in response to the temperature of the dielectric cooling fluid being greater than a first threshold.

17. The cooling system according to claim 16, further comprising: a second sensor for the temperature of the one or more electronic components; Wherein the controller is further configured to operate the second pump in response to a temperature of the one or more electronic components being greater than a second threshold.

18. The cooling system according to claim 17, wherein: The controller is further configured to operate the first pump in response to a temperature of the one or more electronic components being greater than a second threshold regardless of a temperature of the dielectric cooling fluid.

19. The cooling system according to claim 1, further comprising: a second sensor for the temperature of the one or more electronic components; as well as A controller, the controller being configured to: receiving a signal from the second sensor indicative of a temperature of the one or more electronic components, and The second pump is operated in response to the temperature of the one or more electronic components being greater than a second threshold.

20. The cooling system of claim 19, wherein: The controller is also configured to operate the first pump in response to a temperature of the one or more electronic components being greater than a second threshold.

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