Electronic module, method for manufacturing an electronic module, and endoscope

Abstract

An electronic module (50) has a three-dimensional wiring substrate (51) having a cavity (55) formed with a bottom surface (52) and walls (51a to 51d), and a plurality of electronic components (61, 62, 63) mounted on electrodes provided on the bottom surface (52), wherein the walls (51a, 51b) in the arrangement direction of the plurality of electronic components are inclined with respect to the bottom surface (52).

Description

TECHNICAL FIELD

[0001] The present application relates to a small, highly integrated, inexpensive, and highly reliable electronic module, a manufacturing method of an electronic module, and an endoscope. BACKGROUND

[0002] In recent years, with the popularization of portable terminals, the trend toward miniaturization of electronic components is accelerating, and techniques for pursuing miniaturization while providing a prescribed function to a substrate on which they are mounted are becoming active. For example, in Japanese Patent Application Publication No. 2016-86068, a technique is disclosed in which a substrate is provided with a base portion and a wiring pattern formed on the outer surface of the base portion, and a recess is formed in the mounting surface, and the substrate functions as a reflector for a light emitting element to be miniaturized. In addition, in Japanese Patent Application Publication No. 2016-86068, a closed space is formed by mounting a three-dimensional circuit substrate so that the direction of the recess portion abuts against a planar circuit substrate, thereby securing a mounting space for components.

[0003] However, in Japanese Patent Application Publication No. 2016-86068, the technical problem of mounting electronic components in a low-cost, highly integrated manner in the recess portion of a three-dimensional substrate is not considered.

[0004] The present application was completed in view of such circumstances, and provides a highly integrated, high-performance, and inexpensive ultra-small electronic module mounted on a three-dimensional substrate, a manufacturing method of an electronic module, and an endoscope. SUMMARY

[0005] Means for solving the problem

[0006] An electronic module of one embodiment of the present application includes a three-dimensional wiring substrate including a cavity portion formed with a bottom surface and four wall surfaces and provided with a plurality of electrodes on the bottom surface, and a plurality of electronic components mounted on the plurality of electrodes, including a plurality of chip components and an imaging module that images the direction of an opening portion of the cavity portion, and a wall surface of the four wall surfaces corresponding to the arrangement direction of the plurality of chip components is an inclined surface inclined with respect to the bottom surface.

[0007] A manufacturing method of an electronic module of one embodiment of the present application includes the steps of injection molding a structure provided with a cavity portion formed with a bottom portion extending in parallel with a gate direction in injection molding and four wall surfaces having an inclination with respect to the gate direction, forming a wiring pattern provided along the wall surfaces having the inclination from the bottom portion in the cavity portion, and mounting a plurality of components on electrodes provided on the wiring pattern.

[0008] An endoscope of one embodiment of the present application includes an electronic module and an insertion portion including the electronic module. The electronic module includes a three-dimensional wiring substrate including a cavity portion formed with a bottom surface and four wall surfaces and provided with a plurality of electrodes on the bottom surface, and a plurality of electronic components mounted on the plurality of electrodes, including a plurality of chip components and an imaging module that images a direction of an opening portion of the cavity portion. Among the four wall surfaces, a wall surface corresponding to an arrangement direction of the plurality of chip components is an inclined surface inclined with respect to the bottom surface. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 FIG. 1 is an enlarged perspective view of an electronic module of a first embodiment of the present application.

[0010] Figure 2 FIG. 2 is a side cross-sectional view of the electronic module of the first embodiment, which is illustrated from a side.

[0011] Figure 3 FIG. 3 is a main part enlarged perspective view of a structure of an insertion portion front end portion in an endoscope to which the electronic module of the first embodiment is applied.

[0012] Figure 4 FIG. 4 is a side cross-sectional view of a part of the insertion portion front end portion in the endoscope to which the electronic module of the first embodiment is applied, which is illustrated by being cut.

[0013] Figure 5 FIG. 5 is a side view of a state in which solder paste is supplied to the inside of the cavity portion of the electronic module of the first embodiment.

[0014] Figure 6 FIG. 6 is a side view of a positional relationship between a cavity portion of the electronic module and a dispenser nozzle when it is assumed that the electronic module is formed with wall surfaces having no inclination.

[0015] Figure 7 FIG. 7 is a flowchart of a manufacturing method of the electronic module of the first embodiment.

[0016] Figure 8 FIG. 8 is an explanatory view of a manufacturing step of the electronic module of the first embodiment.

[0017] Figure 9 FIG. 9 is a view for explaining a relationship between a shape of the electronic module and laser light in a laser process of the electronic module.

[0018] Figure 10 FIG. 10 is a view for explaining a relationship between a shape of the electronic module and laser light in a laser process of the electronic module.

[0019] Figure 11 FIG. 11 is a main part enlarged perspective view of an internal structure of an insertion portion front end portion in an endoscope to which an electronic module of a second embodiment of the present application is applied.

[0020] Figure 12 is a side cross-sectional view showing a part of the insertion section front end portion of the endoscope to which the electronic module of the second embodiment is applied, taken in section.

[0021] Figure 13 is a perspective view showing the electronic module of the third embodiment of the present application.

[0022] Figure 14 is a perspective view showing the electronic module of the third embodiment from the back side.

[0023] Figure 15 is a side cross-sectional view showing the electronic module of the third embodiment from the side.

[0024] Figure 16 is a diagram for explaining the relationship between the shape of the electronic module and the laser in the laser process of the electronic module.

[0025] Figure 17 is a diagram showing an endoscope system to which the electronic modules of the first to third embodiments are applied. DETAILED DESCRIPTION

[0026] Hereinafter, the embodiments of the present application will be described using the drawings.

[0027] Further, in each of the diagrams used in the following description, the scale is sometimes made different for each constituent element in order to make each constituent element a size recognizable on the drawing, and the present application is not limited only to the number of constituent elements, the shape of the constituent elements, the ratio of the size of the constituent elements, and the relative positional relationship of each constituent element described in these diagrams.

[0028] <First Embodiment>

[0029] First, as the first embodiment of the present application, an example in which a plurality of chip components and the like are housed and mounted in a molded member having a cavity (recess) portion in order to miniaturize the electronic module will be described.

[0030] The electronic module can be used as an imaging unit in the case where the built-in electronic component is, for example, an imaging module. In this case, it can be used for various small cameras, assembled in wearable terminals, endoscope front end portions, and the like by miniaturization, and can perform imaging of an object.

[0031] Note that, in the mold of the box-shaped molded product, the outer side portion of the box is a female mold and is called a cavity, but the cavity (Cavity) has the meaning of "hollow, hole, recess", and therefore, in this case, the recess of the molded product is called a cavity portion.

[0032] In this embodiment, the molded component is formed using so-called MID (Molded Interconnect Devices) technology. Here, MID refers to a 3D molded circuit component in which wiring for circuitry is integrally formed on the surface of a three-dimensional molded article such as an injection-molded article. By using this MID technology, unlike conventional 2D circuits, wiring for circuitry can also be formed on inclined surfaces, vertical surfaces, curved surfaces, and through holes inside the molded body.

[0033] Furthermore, the micro-composite processing technology disclosed in Japanese Patent Application Publication Nos. 2008-159942 and 2011-134777 can be particularly utilized for this MID. According to this micro-composite processing technology, by using surface activation treatment technology and laser patterning process, etc., in the MID technology of forming circuits on the surface of injection-molded articles, a so-called 3D mounting device capable of micro-patterning and bare chip mounting can be realized.

[0034] The following is for reference Figure 1 , Figure 2 The electronic module 50 of the first embodiment of the present invention will be described below. Figure 1 This is an enlarged perspective view showing the electronic module according to the first embodiment of the present invention. Figure 2 This is a side sectional view showing the electronic module of the first embodiment.

[0035] like Figure 1 , Figure 2 As shown, the electronic module 50 includes a MID frame portion 51, which has a cavity 55 formed by four wall surfaces 51a, 51b, 51c, and 51d extending from the bottom 52.

[0036] Additionally, the bottom 52 of the electronic module 50 in the cavity 55 of the MID frame 51 is formed, for example, by forming a wiring pattern and electrodes along the slope direction of the wall surfaces 51a and 51b using a molding MID manufacturing process.

[0037] Specifically, for example, for the MID frame 51 formed by injection molding, the surface of the molded article is patterned and activated by irradiating with a laser, and only the part activated by plating is metallized to form a wiring pattern (not shown), and multiple electronic components can be mounted on the pads (not shown) of the wiring pattern.

[0038] In this embodiment, in addition to the camera module 61 mentioned above, the installed electronic components also include chip components such as capacitors and resistors 62 and 63.

[0039] Here, the imaging module 61 is a component in which the light receiving surface of the imaging element is parallel to the mounting surface, the optical axis of the optical system stacked on the imaging element is in a direction that is substantially perpendicular to the mounting surface, and thus the length in the height direction in which the imaging module 61 is vertically arranged from the bottom portion 52 is relatively long (i.e., relatively high). Note that, although the example of the imaging element is described here, it is self-evident that the same applies to components having a relatively long length in the height direction other than the imaging element. On the other hand, the chip components 62 and 63 are components having a relatively short length in the height direction (i.e., relatively low).

[0040] In addition, in the present embodiment, in order to secure the degree of freedom in routing the wiring for processing the control signal or the output signal, or in order to not be affected by light from the cavity portion, the imaging module 61 is mounted at a position closer to the center of the bottom portion 52 in the cavity portion 55. The chip components 62 and 63 have less wiring and are not affected by the cavity portion 55, and thus the wiring pattern is disposed near the wall surface 51b in the bottom portion 52.

[0041] In addition, in the case where the chip is mounted at a position closer to the center in the cavity and the cavity is filled with the resin 86, in the case where the resin expands and shrinks due to temperature characteristics, it is possible to design so as to adjust the balance between the expansion and contraction of the wall surface and the chip and reduce the unbalanced stress on the electronic component. That is, it is possible to consider a design in which, in the cavity portion of the three-dimensional substrate, the shapes of the opposing cavity wall surfaces are made symmetrical about the center of the electronic component mounting portion such as a sensor (for example, made the same inclination, slope, or the like), thereby eliminating the unbalance of the stress.

[0042] In addition, the electronic module 50 is provided with the front end portion of the imaging cable 71 so as to transmit a signal for controlling the imaging element in the imaging module 61 or an imaging signal generated by the imaging element.

[0043] However, the electronic module 50 of the present embodiment is small and simple in structure, and thus can be mounted on various devices. For example, as shown in Figure 3 The front end portion 23 is a front end portion of an insertion portion of an endoscope that is not shown, and has, for example, a hard front frame portion 23a made of metal. Further, the front frame portion 23a has an advantage of protecting a plurality of surfaces of the electronic module from being easily impacted by a collision, for example, at the time of processing. The material of the hard front frame portion 23a is not limited to metal.

[0044] The front frame portion 23a is provided with an illumination optical system 41 that irradiates illumination light transmitted from a light source device via a light guide, and is provided with an opening portion of a treatment instrument insertion passage 26 that is arranged side by side with the light guide. In addition, a prescribed treatment instrument can be inserted in the treatment instrument insertion passage 26. Since the electronic module is small, it is possible to design under such a layout.

[0045] Although not shown, the camera cable 71 has a cable main body (cover portion) and an electrical contact portion (core wire portion) formed at a front end portion of the cable main body, and the camera cable 71 is provided so as to extend within a flexible tube portion, not shown, of the endoscope insertion portion, and transmit a camera signal generated by a camera element, not shown, in the camera module 61.

[0046] In addition, as shown in Figure 4 , a signal line (conductor wire, electric conductor) of the camera cable 71 is soldered to the solder portion 72 on the MID electrode. In this way, the electrically conductive pattern can be formed so as to surround the three-dimensional structure from the direction of the electronic module mounting to the back thereof, which can be said to be a design that takes advantage of the characteristics of the MID.

[0047] Here, Figure 4 is a side cross-sectional view that shows a portion of the front end portion of the endoscope insertion portion in which the electronic module described in Figure 3 is assembled.

[0048] The camera cable 71 has a cable main body (cover portion) and an electrical contact portion (core wire portion) formed at a front end portion of the cable main body, and the camera cable 71 is provided so as to extend within a flexible tube portion, not shown, of the endoscope insertion portion. In addition, the camera cable 71 is electrically connected by soldering to an electrode portion (electrical contact portion, solder pad), not shown, which is patterned from the electronic component mounting surface to the back of the camera module 61, and communication of control signals and camera signals is possible.

[0049] In this way, in the assembly of the front end portion 23, it is possible to set the space for soldering without interfering with the photographing, and to set the space for soldering without increasing the thickness in the radial direction (a direction perpendicular to the optical axis or a direction perpendicular to the endoscope insertion direction) of the camera portion. Furthermore, by studying the three-dimensional shape unique to the MID, it is possible to secure the space for soldering, and the workability is also improved, and miniaturization is possible.

[0050] As such a connection, for example, there are cases where a connector or the like is provided, but it is effective in cases where there is no space to configure as well. In addition, it is also possible to apply as a space to be configured as a connector.

[0051] In addition, it is possible to make a design that reduces the size in the radial direction described above and increases the ease of insertion of the endoscope, secures the space of the light guide or illumination optical system from the light source device provided in parallel, and secures the space of the treatment instrument insertion passage 26, and it is possible to become a light source that is bright and has an appropriate illumination range, and it is helpful to become a high-performance, high-function endoscope that can cope with complex treatments. That is, it is characterized by providing a space for electrical connection by providing a recess, a depression portion, which is not affected by the size of the opening of the lumen portion.

[0052] As described above, according to the electronic module 50 of the present embodiment, the cavity portion 55 in the MID frame portion 51 is covered by, for example, four wall surfaces. This is because the imaging element and the chip components generally occupy a quadrangular range on the mounting surface, but even in the case where the sealing resin is filled inside the cavity portion 55 for stabilization of these components, the resin does not flow out to the outside.

[0053] In addition, if the bottom surface is triangular, the wall surface can also be three, and several edges of the wall of the cavity portion as in the present embodiment can also not be necessary if sealing is performed so as to prevent overflow of the sealing resin. In addition, for at least one of the four wall surfaces, by forming a slope in a manner that the opening of the cavity portion is enlarged (in the present embodiment, the wall surfaces 51a and 51b have a slope), the opening is enlarged, and in addition, molding of the MID frame portion 51, production of the wiring pattern, and mounting of the electronic components are easy, and an improvement in reliability can also be expected. In the case where the electronic module of the present embodiment is provided to the distal end portion of the endoscope, it is formed so as to have a slope in the insertion direction of the insertion portion of the endoscope.

[0054] The slope of the wall surfaces 51a and 51b is set to be larger than the inclination angle of the wall surfaces 51c and 51d. The slope of the wall surfaces 51a and 51b is a slope for making the shape of the mounting tool or laser processing described later easy, and making the inflow of the resin easy, and is assumed to be substantially 5° or more, which is more inclined than the mold draft angle of 3° or less of general injection molding of the wall surfaces 51c and 51d.

[0055] If the inclination angle of the wall surfaces 51a and 51b is large, the laser processing or the resin filling becomes easy, but the size of the entire electronic module becomes large. Therefore, it is possible to suppress the influence by imparting a slope to the wall surface in only the necessary direction. For example, in the case where the mounting surface or the light receiving surface of the imaging element is rectangular, or the like, by mounting the direction in which the inclination angle is large in conformity with the length direction of the element light receiving surface or the mounting surface, it is possible to alleviate the influence of optical obstruction, and to minimize the expansion of the size of the electronic module.

[0056] In addition, by inclining several of the plurality of wall surfaces constituting the cavity portion, it is possible to design so as to release the stress at the time of expansion and contraction of the sealing resin due to temperature to the opening portion. In the present embodiment, the wall surfaces 51a and 51b have a function of stress dispersion based on this inclination. In this way, by the slope provided to the wall surfaces 51a and 51b, it is possible to form an electronic module that is excellent in processability and reliability.

[0057] Here, the mounting method of mounting each component to the electronic module with a cavity portion using MID in the present embodiment will be described, but in order to perform soldering for mounting the components, it is first necessary to be able to apply solder paste to the correct position. Therefore, with reference to Figure 5 , Figure 6The supply of solder paste for soldering the chip components 62, 63 disposed near the wall surfaces 51a, 51b will be described.

[0058] Figure 5 is a side sectional view showing the dispenser nozzle for supplying solder paste inside the cavity of the electronic module of the first embodiment, and also showing the case of supplying solder paste.

[0059] As Figure 5 shown, the dispenser nozzle 81 for soldering corresponding to the electronic module 50 of the present embodiment is a precision nozzle having a nozzle inner diameter portion 82, and a tapered portion 81a having a prescribed angle is formed at the tip end portion. Further, the inclination angle of the above-mentioned wall surface 51a in the MID frame portion 51 of the electronic module 50 is set to an angle corresponding to the angle of the above-mentioned tapered portion 81a.

[0060] When supplying solder paste 83 to the electrodes on the wiring pattern in the cavity portion 55, as Figure 5 shown, after positioning the tip end 82a of the nozzle inner diameter portion 82 in the dispenser nozzle 81 on a prescribed electrode, the solder paste 83 is applied from the tip end 82a.

[0061] Further, as mentioned above, the tip end portion of the dispenser nozzle 81 is provided with the tapered portion 81a, i.e., has a shape gradually expanding toward the base end portion, but the angle of the tapered portion 81a corresponds to the inclination angle of the wall surface 51a, so even in the case of supplying solder paste to the electrodes corresponding to the chip components 62 disposed at a position near the wall surface 51a in the bottom portion 52 of the cavity portion 55, the tip end portion of the dispenser nozzle 81 is not interfered with by the wall surface 51a, and smooth solder paste supply can be performed up to the vicinity of the wall edge of the mounting surface.

[0062] On the other hand, as Figure 6 shown, assuming that the electronic module is formed by a wall surface having no inclination, at the bottom portion inside the cavity, due to interference of the tip end face of the dispenser nozzle 102 with the wall, an unnecessary space in which solder paste cannot be applied is generated near the wall. Also, even in the case of an electronic module formed by a wall surface having no inclination, if the strength of the wall surface is considered, a certain wall thickness must be ensured, so if the mounting area of the electronic component is ensured, the entire module becomes large. On the other hand, in the case of a MID having an inclined wall, the wall thickness of the uppermost edge is thinner than that of the vicinity of the bottom portion, but is formed by ensuring the wall thickness of the bottom portion, so is also advantageous in strength.

[0063] <Manufacturing process of electronic module 50>

[0064] Next, the manufacturing process of the electronic module 50 will be described with reference to Figure 7 , Figure 8 .

[0065] Figure 7is a flowchart showing a manufacturing method of the electronic module of the first embodiment, Figure 8 is an explanatory diagram showing a manufacturing process of the electronic module. In addition, the reference numerals of the wall surfaces and the like shown here refer to Figure 1 and the like, the drawing is not made complicated by labeling the reference numerals only to the main parts.

[0066] In the case of manufacturing the electronic module 50, first, a prescribed resin material is set in a mold, and in injection molding, in the case of processing a plurality of pieces at the same time, in a direction orthogonal to a gate direction and orthogonal to an arrangement direction in which a plurality of pieces are processed at the same time, a MID frame portion 51 is injection molded, the MID frame portion 51 being provided with an opening portion 55 of a cavity portion 55 formed by a plurality of wall surfaces (51a, 51b, 51c, 51d) including wall surfaces 51a, 51b having a slope and a bottom portion 52 (step S1).

[0067] Next, a wiring pattern is formed on the bottom portion 52 of the cavity portion 55 and on the surfaces of the wall surfaces 51a, 51b on which the slope is formed (step S2).

[0068] In this step S2, for example, with respect to the MID frame portion 51 molded by the above-described injection molding step, patterning and activation are performed by irradiating laser light to the molded product surface, and only the portion activated by performing plating is subjected to metallization, thereby molding a wiring pattern 253, and a plurality of electrodes are formed on the wiring pattern.

[0069] Next, the plurality of electrodes molded on the wiring pattern are respectively supplied with solder paste for mounting corresponding electronic components (the imaging module 61, the chip components 62, 63) (step S3).

[0070] In this step S3, when the electrodes on the wiring pattern in the cavity portion 55 are supplied with solder paste, as shown in Figure 5 , after the front end 82a of the nozzle inner diameter portion 82 in the dispenser nozzle 81 is positioned on a prescribed electrode, the solder paste 83 is applied from the front end 82a.

[0071] Next, the electronic components, for example, the imaging module 61, the chip components 62, 63 are mounted on the corresponding electrodes (step S4).

[0072] Next, inside the cavity portion 55, a space formed by the above-described wall surfaces 51a, 51b, 51c, 51d and the above-described plurality of mounted components (the imaging module 61, the chip components 62, 63) is filled with and sealed by a prescribed resin 86 (step S5; refer to Figure 2 ).

[0073] When the sealing with the resin is completed in this step S5, a cutting process (singulation) is performed (step S6), and the electronic module 50 in which the above-described electronic components are mounted is completed. Note that the cutting process can not be the last process, and can be, for example, immediately after the molding process. The entire electronic module manufacturing process is reviewed, and is performed at an appropriate timing.

[0074] As described above, the wall surfaces 51a, 51b of the MID frame portion 51 have a prescribed inclination, and then, the laser is scanned using Figure 9 , Figure 10 and Figure 16 The effect of the inclination of the wall surfaces 51a, 51b is described.

[0075] Figure 9 , Figure 10 and Figure 16 are diagrams for explaining the relationship between the shape of the electronic module and the laser irradiation for forming the electric connection pattern in the laser process of the electronic module.

[0076] In the case where the electronic module 50 is manufactured by the laser process as in the present embodiment, it is desirable that the laser irradiation is performed while maintaining an appropriate angle with respect to the resin surface that is the object of formation of the electrically conductive pattern (wiring pattern), but if the wall surface is Figure 9 such a steep wall surface, the laser irradiation cannot be performed due to the shadow of the wall portion, and the pattern that extends from the bottom of the cavity to the upper wall surface cannot be formed.

[0077] Therefore, if the structure in which the wall surface has an inclination is adopted as in the present embodiment, as shown in Figure 10 , the laser can be scanned in the arrow direction, and the wiring pattern that extends from the component mounting portion of the bottom of the cavity can be guided to the outside of the cavity portion without trouble in one scanning. In this way, the laser process is simplified by the inclination of the wall portion, and a reliable, inexpensive module can be manufactured with reliable wiring.

[0078] It is desirable that the laser irradiation angle is 90° with respect to the resin surface that is the object, and as the irradiation angle becomes smaller, the quality deteriorates.

[0079] In addition, for example, as shown in Figure 16 , in the case where the cavity portion of the electronic module is formed by a wall surface that does not have an inclination and the depth of the cavity is deep, the laser is blocked by the wall surface, and thus, the degree of freedom of manufacturing is low.

[0080] On the other hand, the electronic module 50 such as the present embodiment, as described above, since the slopes are given to the wall surfaces 51a, 51b of the four wall surfaces that form the cavity 55, the degree of freedom of the shape of the cavity 55 is high due to the presence of the slopes. Not only the laser scanning, but also the wiring pattern can be made by switching the irradiation position with the movement of the MID member side, and they can be combined. In order to irradiate to the direction opposite to the mounting portion, a plurality of laser light sources can be used, or the inclination of the member can be changed.

[0081] [Second Embodiment]

[0082] Next, the second embodiment of the present application will be described. Figure 11 is a main part enlarged perspective view showing the internal structure of the insertion portion front end portion in the endoscope of the second embodiment of the present application, Figure 12 is a side sectional view showing a part of the insertion portion front end portion.

[0083] As Figure 11 shown in the present second embodiment, in order to image the side surface when the endoscope is inserted, the electronic module 150 surrounded by the MID frame portion 151 as shown in Figure 1 is arranged.

[0084] The illumination optical system 132 that irradiates the illumination light transmitted from the light source device via the light guide 124 and the imaging module 161 are provided at the front end portion 123 of the insertion portion not shown.

[0085] The electronic module 150 at the front end portion 123 is housed in the recess of the hard front frame portion 123a (for example, made of metal), and has the advantage of protecting a plurality of surfaces of the electronic module from impact such as collision when handled.

[0086] And, on the hard front frame portion 123a, the treatment instrument insertion passage 131 is provided in parallel with the electronic module 150, and a prescribed treatment instrument can be inserted. In this way, since the electronic module 150 (and the illumination optical system 132) is arranged at a position where the movement of the treatment instrument in a direction different from the insertion direction of the endoscope can be confirmed, it is necessary to miniaturize the electronic module 150 together with the treatment instrument insertion passage 131.

[0087] In particular, for the direction orthogonal to the insertion direction of the endoscope, in order to reduce the pain when the insertion portion is inserted into the body cavity of the subject, and in order to be able to be inserted from a small hole even in other examinations, it is important to reduce the insertion portion. Therefore, a layout is adopted in which the wall surfaces 151a, 151b having slopes are aligned with the insertion direction of the endoscope.

[0088] In front of the treatment instrument insertion passage 131, a so-called treatment instrument lifting table is provided, and a treatment instrument inserted into the treatment instrument insertion passage 131 can change the orientation of the front end portion of the treatment instrument in the operation of the lifting table. A smaller endoscope can also be protruded from here. In order to prevent deformation of the treatment instrument that is rich in operability when it is inserted or changes the orientation on the lifting table, such an insertion passage is a component that uses a hard material such as metal or resin.

[0089] At the time of this orientation change, for example, a wire needs to be used to pull a component that is strong in rigidity, and even if it is subjected to this force, deformation can be suppressed, and it is important to be able to control the treatment instrument to the correct position. In order not to be affected by the force at this time or the configuration arrangement, the electronic module is arranged side by side with the insertion passage 131 in a direction orthogonal to the insertion direction (which also becomes the pulling direction).

[0090] In Figure 12 , the Figure 4 Similarly, a case where there is a space in the electronic module 150 in which a solder portion 172 is provided is shown, and the solder portion 172 is used to solder a cable that constitutes a wiring that controls a camera element or the like and communicates a camera signal. In this way, by keeping the cable that has the effect of shielding or the like as close as possible to the configuration of the electronic component, it is possible to become a high-quality design that is less likely to be affected by noise or the like and is highly reliable.

[0091] Here, in order to be able to make the cable 171 as close as possible to the electronic module 150, a recessed portion (recess) is provided on the opposite portion of the mounting surface of the electronic module, and miniaturization is achieved by research on the three-dimensional shape unique to MID.

[0092] In the first embodiment, an example in which a bump of solder is housed in this recessed portion is shown, but here, a space that houses the cable itself is provided. The solder portion of the cable and the electrode of the electronic module 150 are described in the third embodiment.

[0093] In addition, the cable wiring can be performed without interfering with the layout of the previous pulling configuration. In this way, by providing a small electronic module that is a feature of the present application, it is possible to miniaturize a side-view type endoscope. Furthermore, it is possible to provide an endoscope product that is highly reliable and easy to use through reliable treatment instrument control and camera element control.

[0094] <Third Embodiment>

[0095] Next, the third embodiment of the present application will be described. Figure 13 to 15The third embodiment of the present application is shown, but using these drawings, the first and second embodiments described above can also be explained, and the wiring pattern is also easily understood here. That is, the portions not described in the drawings of the first and second embodiments are as described here.

[0096] As Figure 13 shown, the third embodiment has an assembly portion 256 for easily assembling the electronic module 250 to the endoscope front end portion or the like.

[0097] The assembly portion 256 has, for example, a recess portion so that positioning can be performed using a screw or the like. It is provided at a portion shaped by providing an extension portion in the same direction as the slope of the cavity portion of the electronic module 250, and for example, by being aligned with the insertion direction of the endoscope, so that the dimension in the radial direction that becomes an obstacle at the time of insertion is suppressed.

[0098] Since the portion can be processed in a manner that the metal wiring pattern is contacted in the assembly work without causing defects such as a gap, it becomes a design that improves the processing at the time of product manufacturing or module inspection.

[0099] In addition, Figure 15 is a side sectional view of the electronic module of the third embodiment, and as with the first and second embodiments, the slope of the cavity portion of the frame member (MID) is effectively utilized in relation to the electronic components, and the mounting surface in the direction having the slope is also aligned.

[0100] The imaging module 261 having a height with respect to the mounting surface due to the stacked lens or the like is sealed as needed by filling sealing resin into the cavity. At the time of resin filling, the generation of bubbles or the like can also be prevented by the inflow of the resin along the slope portion, and overflow and outgassing are prevented, so that manufacturing that manages the amount of sealing resin filled around to be substantially uniform, which is also preferable from the viewpoint of improving reliability, can be performed.

[0101] The present embodiment can also become a liquid-tight structure by research on the material or design of the resin, optical system, and since it is small, it can be applied in various uses.

[0102] In addition, the direction of the extension portion that is extended in the direction in which the walls having the slope are aligned is also Figure 8 the direction in which the runner extends described in the first embodiment. Also, this becomes a shape that extends in the insertion direction when the electronic module (imaging unit) is assembled to the endoscope front end portion or the like, and contributes to miniaturization for entering narrow places. That is, by providing the assembly portion, the length in the direction orthogonal to the insertion direction does not become long.

[0103] At the time of injection molding, resin is injected from the gate direction. It is generally known that the linear expansion coefficient of a resin containing a filler in the flow direction is smaller than that in the direction at right angles. The wall of the cavity is at right angles to the flow direction, that is, the bottom surface of the cavity in which the electronic component is mounted is parallel to the flow direction of the resin, and thus the linear expansion coefficient is small, which is advantageous from the viewpoint of reliability.

[0104] In addition, in the case where the electronic component is mounted at a position in the cavity that is relatively central and the cavity is filled with resin in a filled manner, in the case where the resin expands and shrinks due to temperature characteristics, the shape of each of the opposing cavity wall surfaces in the cavity portion of the three-dimensional substrate can also be made a shape that is symmetrical about the center of the electronic component mounting portion such as a sensor. Thereby, it is possible to expect adjustment of the balance of forces that act due to expansion and shrinkage between the wall surface and the electronic component, and thus to reduce uneven stress on the electronic component.

[0105] In addition, if such an extension portion exists, the wiring pattern from the cavity portion to the cable along the wall surface having a slope (see Figure 4 ) becomes long, and the quality of the signal deteriorates, and thus the through hole 252 is provided so that wiring guidance on the back surface of the mounting surface of the imaging element or the like can be performed at a short distance. It is possible to use this hole 252 to make the pattern 253 up to the solder portion at a short wiring, and it is possible to simplify the scanning range of the laser that is continuously irradiated along the pattern. In addition, manufacturing is made easy by such research.

[0106] That is, the through hole that penetrates the front and back surfaces of the three-dimensional substrate is provided at a portion of the three-dimensional substrate other than the cavity portion, and a pattern for connecting the sensor mounting portion terminal and the external terminal is formed via the opening portion surface. By the through hole, the effort of the wiring process is saved and manufacturing is easy, and the wiring itself is shortened, and at the time of inspection of the module or actual use, the influence of noise or the like into the signal line is reduced. In addition, a part of the wiring is difficult to collide at the portion where the through hole is formed, and handling is also good, and contributes to an increase in productivity.

[0107] Furthermore, as shown in Figure 15 , it is also known that when the electronic module 250 is handled by gripping the extension portion, the bottom portion of the frame member becomes flat, and is a configuration that is easy to load on a workbench or the like.

[0108] In addition, as shown in Figure 14 , the perspective view of the back surface of the electronic module of the present third embodiment also shows that in the third embodiment, it is possible to confirm how the wiring pattern 253 that was omitted from the explanation in the first and second embodiments spreads from the cavity portion.

[0109] Together with Figure 13 , it is also shown how the wiring that rises from the mounting surface along the slope portion is continuous with the solder pad 254, but the same wiring is also assumed in the first and second embodiments.

[0110] In particular, it is assumed that the cable in the second embodiment Figure 12 ) is welded to the Figure 14 cable connection electrode (welding pad) 254 shown.

[0111] In the first embodiment, the welding pad can be provided on the side of the electronic circuit along the wiring on the portion of the surface that is substantially orthogonal to the module bottom surface. Figure 14

[0112] In addition, the inspection electrode 255 is provided on the module bottom surface corresponding to the back surface of the mounting surface so as to be able to be placed on an inspection stage or the like to verify the function and performance of the imaging element or the like. Thus, the image of the object incident to the imaging element or the like is not obstructed or the like at the time of inspection, and inspection including the imaging signal can be performed.

[0113] That is, the pattern extending toward the back surface side of the field of view of the imaging element for the signal of the imaging element or the like is electrically connected to the inspection terminal provided on the parallel plane of the back surface of the above-described sensor mounting portion, and thus in the process of inspection, the inspection pin or the like can be reliably abutted without being affected by the inspection tool, circuit, wiring, or the like.

[0114] Next, referring to Figure 17 An endoscope system to which the electronic modules of the first to third embodiments are applied will be described.

[0115] As shown in Figure 17 , the endoscope system 9 is provided with an endoscope 2, a processor 5A, a light source device 5B, and a monitor 5C. The endoscope 2 captures an in-vivo image of a subject and outputs an imaging signal by inserting the insertion portion 3 into a body lumen of the subject. That is, the endoscope 2 is provided with any of the electronic modules (imaging units) 50, 150, 250 at the tip end portion of the insertion portion 3.

[0116] On the proximal end side of the insertion portion 3 of the endoscope 2, an operation portion 4 is provided, which is provided with various buttons for operating the endoscope 2. The operation portion 4 has a treatment instrument insertion port 4A through which a treatment instrument such as a biopsy forceps, an electrosurgical knife, and an examination probe is inserted into the body lumen of the subject. The treatment instrument insertion port 4A has a channel opening portion at the tip end.

[0117] The insertion portion 3 is composed of a tip end portion 3A provided with the imaging device 1, a bendable bending portion 3B provided continuously with the proximal end side of the tip end portion 3A, and a flexible tube portion 3C provided continuously with the proximal end side of the bending portion 3B. The bending portion 3B is bent by operation of the operation portion 4.

[0118] In a general-purpose cord 4B provided on the proximal end side of the operation portion 4, a signal cable 75 connected to the imaging device 1 of the tip end portion 3A is inserted.​

[0119] The general-purpose cord 4B is connected to the processor 5A and the light source device 5B via the connector 4C. The processor 5A controls the entire endoscope system 9, and performs signal processing on the imaging signal output from the imaging device 1 to output as an image signal. The monitor 5C displays the image signal output from the processor 5A.

[0120] The light source device 5B has, for example, a white LED. The white light emitted from the light source device 5B is guided to the illumination optical system (not shown) of the distal end portion 3A via a light guide (not shown) that penetrates the general-purpose cord 4B, and illuminates the object.

[0121] The endoscope 2 is provided with a small-sized imaging device 50, 150, 250 at the distal end portion of the insertion portion, and thus can be slimmed down. As described above, with the endoscope in which the imaging unit (electronic module) and the channel are arranged in the distal end portion in a manner orthogonal to the insertion direction of the endoscope, the imaging unit is less likely to be stressed by components that pass in and out of the channel portion, and the three-dimensional wiring board having a cavity portion formed of a bottom surface and a plurality of walls, and a plurality of electronic components mounted to electrodes provided on the bottom surface of the three-dimensional wiring board are securely protected. The walls of the cavity portion corresponding to the arrangement direction of the plurality of electronic components are inclined with respect to the bottom surface of the cavity portion, and are arranged in a direction substantially orthogonal to the arrangement direction of the adjacent channel, and thus the distal end of the endoscope can be slimmed down to be easily inserted.

[0122] The present application is not limited to the above-described embodiments, and various modifications, changes, and the like can be made within the scope of the gist of the present application. For example, the portion described as an endoscope can be replaced with other consumer cameras, industrial cameras, in-vehicle cameras, surveillance cameras, and the like. That is, if the features of the miniaturization of the present application are utilized, including the cable wiring that controls the imaging unit and receives the signals thereof, space saving can be achieved with respect to the direction orthogonal to the lead direction of the wiring, and thus even in the case of a system or a layout in which the control circuit that controls the imaging unit is separately arranged with respect to the imaging unit arranged in a small space, a high-performance imaging device can be assembled. Therefore, in a car having a demand for imaging various places without dead angles outside and inside the car, a larger number of imaging units are mounted, and thus miniaturization including the wiring as in the present application is important, and the design at the time of assembly becomes easy. In addition, it can also be applied to portable terminals that require miniaturization and lightness due to portability, or network terminals represented by AI speakers that want to reduce the placement site, IoT home appliances, and surveillance cameras that secure the safety of the object of guardianship. Furthermore, it becomes an imaging unit that is easily assembled into a robot (including a vacuum cleaner and the like), a mobile body such as a drone, and the like, which is important due to the mobility function, and thus miniaturization, lightness, and further the center of gravity and balance of the device are important.

[0123] In addition, in the above description, the three-dimensional wiring substrate having a cavity of the electronic module and the imaging unit does not need to be limited to a three-dimensional wiring substrate produced by MID technology based on injection molding, and for example, can be produced by processing or cutting processing based on a 3D printer. The material is also not limited to resin, and ceramic or epoxy glass can be used.

Claims

1. An electronic module, characterized in that, have: A three-dimensional wiring substrate having a cavity having a bottom surface and four wall surfaces, and having a plurality of electrodes disposed on the bottom surface; and Multiple electronic components, mounted on the multiple electrodes, include multiple chip components and a camera module that captures images in the direction of the opening of the cavity. The four walls include a first wall corresponding to the arrangement direction of the plurality of chip components and a second wall not corresponding to the arrangement direction of the plurality of chip components. Both the first wall and the second wall are inclined surfaces that are inclined relative to the bottom surface, and the inclination of the first wall is greater than that of the second wall.

2. The electronic module according to claim 1, characterized in that, The camera module is mounted in the center of the bottom surface, and the plurality of chip components are mounted around the camera module.

3. The electronic module according to claim 2, characterized in that, The wiring pattern mounted on the bottom surface along the inclined surface formed by the first wall extends to the back side of the mounting surface in the electronic component.

4. The electronic module according to claim 1, characterized in that, The electronic module also includes resin filling a space formed by the cavity and at least one of the plurality of electronic components.

5. The electronic module according to claim 1, characterized in that, At least a portion of the electronic module is disposed within a metal housing.

6. The electronic module according to claim 5, characterized in that, The electronic module also has an assembly part disposed on the inclined surface of the first wall in the inclined direction, which fixes the electronic module when it is disposed in the metal housing.

7. The electronic module according to claim 1, characterized in that, The electronic module is located at the front end of the endoscope. The endoscope has a channel at its front end. The electronic module and the channel are configured orthogonally to the endoscope insertion direction, and the slope direction of the first wall of the electronic module is approximately orthogonal to the arrangement direction of the adjacent channel and the electronic module.

8. The electronic module according to claim 7, characterized in that, The channel has a movable part. The movable part is a pliers lifting platform.

9. A method for manufacturing an electronic module, characterized in that, It includes the following steps: Injection molding is a structure with a cavity formed by four walls that are inclined relative to the gating direction during injection molding and a bottom that extends parallel to the gating direction. The four walls include a first wall and a second wall, and the inclination of the first wall and the second wall is different. A wiring pattern is formed from the bottom of the cavity along the direction of the wall with the greater inclination among the first and second walls; as well as Multiple electronic components are mounted on electrodes disposed on the wiring pattern.

10. The method for manufacturing an electronic module according to claim 9, characterized in that, The manufacturing method further includes the following steps: The space formed by the cavity and at least one of the plurality of electronic components is filled with resin.

11. An endoscope, characterized in that, This endoscope is equipped with: Electronic modules; and The electronic module has an insertion section. This electronic module has: A three-dimensional wiring substrate having a cavity having a bottom surface and four wall surfaces, and having a plurality of electrodes disposed on the bottom surface; and Multiple electronic components, mounted on the multiple electrodes, include multiple chip components and a camera module that captures images in the direction of the opening of the cavity. The four walls include a first wall corresponding to the arrangement direction of the plurality of chip components and a second wall not corresponding to the arrangement direction of the plurality of chip components. Both the first wall and the second wall are inclined surfaces that are inclined relative to the bottom surface, and the inclination of the first wall is greater than that of the second wall.

Images