A wafer drying equipment swing mechanism

By designing the accommodating seat structure composed of side limit blocks, inner positioning blocks and top blocks, the problem of inconvenient installation of wafer drying equipment is solved, and simple installation and high-strength wafer drying effect is achieved.

CN115218627BActive Publication Date: 2025-07-25JIANGSU ASIA ELECTRONICS TECH CO LTD
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
CN202210713995.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-06-22
Publication Date
2025-07-25
Estimated Expiration
2042-06-22

AI Technical Summary

Technical Problem

The swing mechanism of existing wafer drying equipment is inconvenient to install, especially the installation of wafer boxes is difficult to align, and the structural strength is insufficient, which affects the drying effect.

Method used

A wafer drying equipment swing mechanism including a horizontal slide rail, a sliding mounting block, an arched sliding arm and a receiving seat is designed. The receiving seat consists of a side limit block, an inner positioning block and a top block. The side limit block is hollow, and the inner positioning block and the top block are suspended between the receiving seat to form an installation positioning structure. A pulley is arranged on the sliding mounting block to increase the swing amplitude.

Benefits of technology

It achieves simplicity of installation, high structural strength, and does not hinder the flow of drying gas, improving the wafer drying effect.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN115218627B_ABST
    Figure CN115218627B_ABST
Patent Text Reader

Abstract

The present application relates to a swing mechanism of a wafer drying device. The inner positioning block serves to position the distance between the two side limiting blocks and provides an installation position for the top block. The inner positioning block and the top block are suspended above the hollow part in the middle of the receiving seat. The hollow side limiting blocks, inner positioning block, and top block form a complete set of installation structures, which have the advantages of installation positioning function, simple installation, and relatively high structural strength. At the same time, it does not hinder the flow of drying gas, improving the drying effect.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application belongs to the technical field of wafer cleaning, and particularly relates to a swing mechanism of a wafer drying device. Background Art

[0002] For semiconductor wafer cleaning, the wafer needs to go through processes such as alkaline cleaning solution cleaning, pure water cleaning, hydrofluoric acid cleaning, ozone water cleaning, and drying. Wafer drying is generally the last step of wafer cleaning, which can remove the residual cleaning solution on the wafer surface, prevent wafer oxidation, and control the surface moisture and surface cleanliness. Chinese patent document CN114496847A discloses a swing mechanism disposed inside a cleaning tank. There are two wafer cassette bearing areas provided on the swing mechanism, and the wafer cassette bearing areas are used to place wafer cassettes.

[0003] The outer shell of the wafer cleaning tank is made of metal material. The swing mechanism includes a driving motor, a sliding track, a sliding block, a pivot track, and a swing arm. The sliding track and the pivot track are arranged in parallel, the sliding track is located above the pivot track, the sliding block is slidably installed on the sliding track, and the driving motor is used to control the reciprocating movement of the sliding block on the sliding track.

[0004] However, the wafer cassette holder (wafer cassette bearing area) in this swing mechanism lacks flexibility and is inconvenient to install. In particular, the installation of multiple cross beams in the middle is difficult to align. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: to provide a swing mechanism of a wafer drying device that is convenient to install in order to solve the deficiencies in the prior art.

[0006] The technical solution adopted by the present invention to solve its technical problems is:

[0007] The swing mechanism of the wafer drying device of the present invention includes a top mounting plate having a horizontal slide rail, a driving member provided on the top mounting plate, a sliding mounting block slidably disposed on the horizontal slide rail and capable of moving along the horizontal slide rail under the drive of the driving member, an arched sliding arm mounted on the sliding mounting block, and a receiving seat mounted on the arched sliding arm. When the driving member works, it can drive the arched sliding arm to swing together with the receiving seat;

[0008] The receiving seat is used to accommodate a wafer cassette and includes a hollow base connected to the arched sliding arm, side limit blocks mounted on the base for respectively limiting the two sides of the wafer cassette, and a top block located between the side limit blocks. The middle of the side limit blocks is hollow, and there are oppositely arranged protrusions on the inner walls of the hollow parts of the two side limit blocks. The receiving seat further includes an inner positioning block;

[0009] Both ends of the inner positioning block are respectively connected to the protrusions of the side limiting blocks, and the connection points are distributed on both sides in the width direction of the inner positioning block. The top block is installed on both sides in the length direction of the inner positioning block.

[0010] Preferably, in the swing mechanism of the wafer drying equipment of the present invention, a width limiting block is further provided between the two side limiting blocks.

[0011] Preferably, in the swing mechanism of the wafer drying equipment of the present invention, the bottom of the side limiting block is mortise-jointed with the base.

[0012] Preferably, in the swing mechanism of the wafer drying equipment of the present invention, the top surface of the side limiting block is an inclined surface.

[0013] Preferably, in the swing mechanism of the wafer drying equipment of the present invention, the top surface of the top block is an inclined surface.

[0014] Preferably, in the swing mechanism of the wafer drying equipment of the present invention, the top block is provided with a long strip hole in the height direction.

[0015] Preferably, in the swing mechanism of the wafer drying equipment of the present invention, the middle of the inner positioning block has a material-reducing through hole that both reduces the weight and allows gas to pass through.

[0016] Preferably, in the swing mechanism of the wafer drying equipment of the present invention, the arched sliding arm crosses over the top of the trough and extends into the trough to form a first arm located outside the trough and a second arm located inside the trough. The receiving seat is installed at the bottom of the second arm.

[0017] Preferably, in the swing mechanism of the wafer drying equipment of the present invention, the first arm is rotatably connected to the rotating mounting seat. There is a sliding groove in the middle of the first arm, and a pulley located in the sliding groove is provided on the sliding mounting block.

[0018] Preferably, in the swing mechanism of the wafer drying equipment of the present invention, the sliding mounting block extends downward to form an extension part, and the pulley is arranged on the extension part.

[0019] The beneficial effects of the present invention are:

[0020] In the swing mechanism of the wafer drying equipment of the present invention, the inner positioning block plays a role in positioning the distance between the two side limiting blocks and provides an installation position for the top block. The inner positioning block and the top block are suspended above the hollow part in the middle of the receiving seat. The hollow side limiting blocks, inner positioning block, and top block form a complete set of installation structures, which have the advantages of installation positioning function, simple installation, high structural strength, and at the same time do not hinder the flow of drying gas, improving the drying effect. In addition, by extending downward to form an extension part on the sliding mounting block and arranging a pulley on the extension part, the pulley can be made as far away as possible from the moving center line of the sliding mounting block (i.e., the center line of the slide rail), so that the cooperation point of the entire pulley and the sliding groove is lower, improving the swing amplitude. Brief Description of the Drawings

[0021] The technical solution of the present application will be further described below in conjunction with the drawings and embodiments.

[0022] Figure 1 is a schematic structural diagram of a swing-type wafer drying device according to an embodiment of the present application;

[0023] Figure 2 is Figure 1 a schematic structural diagram of the swing-type wafer drying device after removing the cover in

[0024] Figure 3 is a schematic structural diagram of the swing mechanism in Embodiment 1 of the present application;

[0025] Figure 4 and Figure 5 are respectively schematic diagrams of two states of the swing of the swing mechanism;

[0026] Figure 6 is a schematic structural diagram of the receiving seat in Embodiment 1 of the present application;

[0027] The reference numerals in the figure are:

[0028] 1 tank body;

[0029] 2 cover body;

[0030] 3 swing mechanism;

[0031] 9 wafer cassette;

[0032] 21 gas pipeline;

[0033] 31 top mounting plate;

[0034] 32 arched sliding arm;

[0035] 33 driving member;

[0036] 34 sliding mounting block;

[0037] 35 rotating mounting seat;

[0038] 36 receiving seat;

[0039] 321 sliding groove;

[0040] 341 pulley;

[0041] 342 extension part;

[0042] 360 base;

[0043] 361 side limit block;

[0044] 362 inner positioning block;

[0045] 363 Top block;

[0046] 364 Width limit block. Detailed implementation manner

[0047] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments may be combined with each other.

[0048] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the protection scope of this application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of this invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0049] In the description of this application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood through specific situations.

[0050] The technical solutions of this application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0051] Embodiment 1

[0052] This embodiment provides a swing mechanism for a wafer drying device, as Figure 1 and Figure 2 and Figure 3 shown.

[0053] A top mounting plate 31 with a horizontal sliding rail, a driving member 33 provided on the top mounting plate, a sliding mounting block 34 slidably arranged on the horizontal sliding rail and capable of moving along the horizontal sliding rail under the drive of the driving member 33, an arched sliding arm 32 mounted on the sliding mounting block 34, and a receiving seat 36 mounted on the arched sliding arm 32. When the driving member 33 operates, it can drive the arched sliding arm 32 together with the receiving seat 36 to swing;

[0054] The receiving seat 36 is used to receive the wafer cassette 9 and includes a base 360 connected to the arched sliding arm 32, side limit blocks 361 mounted on the base 360 for respectively limiting the two sides of the wafer cassette, and a top block 363 located between the side limit blocks 361. The middle of the side limit blocks 361 is hollow, and there are oppositely arranged protrusions on the inner walls of the hollow parts of the two side limit blocks 361. The receiving seat 36 further includes an inner positioning block 362;

[0055] Both ends of the inner positioning block 362 are respectively connected to the protrusions of the side limit blocks 361, and the connection points are distributed on both sides in the width direction of the inner positioning block 362. The top block 363 is mounted on both sides in the length direction of the inner positioning block 362. After the wafer cassette 9 is placed into the receiving seat 36, the top block 363 can lift the wafers in the wafer cassette 9 to a certain height (slightly lift) to improve the drying effect. The middle of the receiving seat 36 is hollowed out to make the drying air flow more smoothly.

[0056] In the swinging mechanism of the wafer drying device of this embodiment, the inner positioning block 362 plays a role in positioning the distance between the two side limit blocks 361 and provides an installation position for the top block 363. The inner positioning block 362 and the top block 363 are suspended above the hollow part in the middle of the receiving seat 36. The hollow side limit blocks, the inner positioning block 362, and the top block 363 form a complete set of installation structures, which have the advantages of installation positioning function, simple installation, and relatively high structural strength. At the same time, it does not hinder the flow of drying gas and improves the drying effect.

[0057] As Figure 4 and 5 shown, the driving member 33 drives the sliding mounting block 34 to move on the sliding rail, and then acts on the sliding groove 321 through the pulley 341, thereby causing the receiving seat 36 to swing. Among them, Figure 4 is the position in the exact middle, and at this time, the wafer cassette 9 can be loaded and unloaded, Figure 5 is the maximum amplitude of swinging to the right.

[0058] Furthermore, a width limit block 364 is also provided between the two side limit blocks 361. The two ends of the width limit block 364 abut against the side limit blocks 361 to improve the structural stability.

[0059] Further, the bottom of the side limit block 361 is tenoned with the base 360. That is, the side limit block 361 is installed by sliding in from the side and then fastened by bolts, improving the installation convenience.

[0060] The sliding installation block extends downward to form an extension part, and a pulley is arranged on the extension part, which can make the pulley as far away as possible from the moving center line of the sliding installation block (that is, the center line of the slide rail), so that the cooperation point of the whole pulley and the sliding groove is lower, improving the swing amplitude.

[0061] The top surfaces of the side limit block 361 and the top block 363 are both set as inclined surfaces, that is, the top is sharp. The inclined surfaces of the side limit block 361 face each other, facilitating the wafer cassette 9 to slide in from the inclined surface and playing a positioning role. The inclined surface on the top surface of the top block 363 can reduce the contact area with the wafer and improve the drying effect.

[0062] The top block 363 is provided with a long strip hole in the height direction to facilitate adjusting the installation height of the top block 363.

[0063] The inner positioning block 362 has a material-removing through hole in the middle. The material-removing through hole has two functions. One is to reduce the weight, and the other is to allow the drying gas to pass through from the bottom. And the opening of the material-removing through hole is larger closer to the top surface.

[0064] The specific structure of the arched sliding arm 32 is to be able to extend from the outside of the tank body 1 to the inside of the tank body 1, as Figure 6 shown. Therefore, the arched sliding arm 32 crosses the top of the tank body 1 and extends into the tank body 1 to form a first arm located outside the tank body 1 and a second arm located inside the tank body 1. The accommodating seat 36 is installed at the bottom of the second arm. The first arm is rotatably connected to the rotating mounting seat 35. There is a sliding groove 321 in the middle of the first arm. A pulley 341 is arranged on the sliding installation block 34 and is located in the sliding groove 321. The sliding installation block 34 extends downward to form an extension part 342, and the pulley 341 is arranged on the extension part 342. By extending downward to form an extension part on the sliding installation block and arranging a pulley on the extension part, the pulley can be made as far away as possible from the moving center line of the sliding installation block (that is, the center line of the slide rail), so that the cooperation point of the whole pulley and the sliding groove is lower, improving the swing amplitude.

[0065] Inspired by the above ideal embodiments according to the present application, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this application. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A swing mechanism of a wafer drying device, characterized in that, Comprising: A top mounting plate (31) having a horizontal sliding rail, a driving member (33) disposed on the top mounting plate, a sliding mounting block (34) slidably disposed on the horizontal sliding rail and capable of moving along the horizontal sliding rail under the drive of the driving member (33), an arched sliding arm (32) mounted on the sliding mounting block (34), a receiving seat (36) mounted on the arched sliding arm (32), and when the driving member (33) operates, it can drive the arched sliding arm (32) together with the receiving seat (36) to swing; The receiving seat (36) for receiving the wafer cassette (9), including a base (360) with a hollow middle connected to the arched sliding arm (32), side limiting blocks (361) mounted on the base (360) for respectively limiting the two sides of the wafer cassette and a top block (363) located between the side limiting blocks (361), the middle of the side limiting blocks (361) is hollow, and there are oppositely arranged protrusions on the inner walls of the hollow parts of the two side limiting blocks (361), and the receiving seat (36) further includes an inner positioning block (362); Both ends of the inner positioning block (362) are respectively connected to the protrusions of the side limiting blocks (361), and the connection points are distributed on both sides of the width direction of the inner positioning block (362), and the top block (363) is mounted on both sides of the length direction of the inner positioning block (362); The middle of the inner positioning block (362) has a material-removing through hole that serves both to reduce weight and allow gas to pass through; The top surface of the side limiting block (361) is an inclined surface; The top surface of the top block (363) is an inclined surface.

2. The swing mechanism of the wafer drying equipment according to claim 1, characterized in that A width limiting block (364) is further provided between the two side limiting blocks (361).

3. The swing mechanism of the wafer drying equipment according to claim 2, wherein, The bottom of the side limiting block (361) is tenoned to the base (360).

4. The swing mechanism of the wafer drying equipment according to claim 1, characterized in that, The top block (363) is provided with a long hole in the height direction.

5. The swing mechanism of the wafer drying equipment according to claim 1, characterized in that, The arched sliding arm (32) passes over the top of the trough body (1) and extends into the trough body (1) to form a first arm located outside the trough body (1) and a second arm located inside the trough body (1), and the receiving seat (36) is mounted at the bottom of the second arm.

6. The swing mechanism of the wafer drying equipment according to claim 5, characterized in that, The first arm is rotatably connected to a rotating mounting seat (35), and there is a sliding groove (321) in the middle of the first arm, and a pulley (341) is provided on the sliding mounting block (34) and located in the sliding groove (321).

7. The swing mechanism of the wafer drying equipment according to claim 6, characterized in that, The sliding mounting block (34) extends downward to form an extension part (342), and the pulley (341) is arranged on the extension part (342).

Citation Information

Patent Citations

  • LED (Light Emitting Diode) chip cleaning basket

    CN103367211A

  • Self-swinging wafer cleaning and drying device

    CN114496847A

  • Swing mechanism of wafer drying equipment

    CN217952968U

  • wafer box for the transport of solar cell wafers

    DE202008003205U1

  • Flexible carrier for semiconductor wafer cassettes

    US4762353A