Plug ink performance test method and PCB board

Abstract

The present invention provides a plugging ink performance test method and a PCB board, the plugging ink performance test method comprising: dividing the PCB board according to preset row and column conditions to obtain a sample test board; performing differentiation processing on the sample test board to obtain a sample module; performing solder masking and processing on the high voltage resistance test module, measuring the processed high voltage resistance test module to obtain the high voltage resistance value, dielectric constant and insulation resistance value of the PCB board; drilling and curing the plugging test module to obtain the plugging capacity range of the PCB board; performing development processing and tin spraying processing on the tinning test module to obtain the resolution condition parameters and tinning condition parameters of the PCB board; designing copper sinking holes and non-copper sinking holes with preset apertures for the development punching test module, performing development processing on the copper sinking holes and non-copper sinking holes, and obtaining the development punching capacity range of the PCB board. In the embodiment of the present invention, the plugging ink performance of the circuit board can be fully tested, the test process is simplified, and the test cost and resources are saved.

Description

Technical Field

[0001] The invention relates to the field of testing technology, and in particular to a plugging ink performance testing method and a PCB board. Background Art

[0002] With the continuous development of the electronics industry, the production of PCB circuit boards, which are part of electronic equipment, has become particularly important. Therefore, various manufacturers have put forward higher requirements for various surface mounting technologies in the production process of printed boards. With the improvement and progress of printed circuit board assembly requirements, more and more printed circuit boards have put forward plugging requirements. Plug holes in circuit boards can prevent short circuits in the welding process of PCB boards, prevent surface tin from flowing into cold solder joints, and prevent tin beads from popping out. Therefore, it is particularly important to test the performance of solder mask ink in the plugging process. The ink plugging process of printed circuit boards can protect the surface of circuit boards, thereby ensuring the safety of the internal structure of circuit boards. In the prior art, the ink plugging test of circuit boards is very complicated, requiring a large number of instruments and spare circuit boards for testing, thus consuming a lot of cost and human resources. In addition, during the test process, due to the cumbersome steps, the test of a certain performance may be missed, reducing the accuracy of the ink plugging test of the circuit board. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art, and provides a plugging ink performance testing method and a PCB board, which can comprehensively test the plugging ink performance of the circuit board, simplify the testing process, and save testing costs and resources.

[0004] In a first aspect, the present invention provides a method for testing plugging ink performance, comprising:

[0005] Divide the PCB board into rows and columns according to preset conditions to obtain a sample test board;

[0006] Performing differentiation processing on the sample test board to obtain a sample module, wherein the sample module includes a high voltage resistance test module, a plugging test module, a tinning test module and a developing and punching test module;

[0007] Performing solder masking on the high-voltage test module, processing the high-voltage test module after solder masking, and measuring the processed high-voltage test module to obtain the high-voltage resistance value, dielectric constant and insulation resistance value of the PCB board;

[0008] Drilling the via plugging test module, and curing the drilled via plugging test module to obtain the via plugging capacity range of the PCB board;

[0009] Performing a developing process and a tin spraying process on the tinning test module, and performing a curing process on the treated tinning test module to obtain the resolution condition parameters and the tinning condition parameters of the PCB board;

[0010] The copper-plated holes and non-copper-plated holes with preset apertures are designed for the developing and punching test module, and the copper-plated holes and the non-copper-plated holes are developed to obtain the developing and punching capacity range of the PCB board.

[0011] The above-mentioned plugging ink performance test method has at least the following beneficial effects: first, the PCB board is divided according to preset row and column conditions to obtain a sample test board, and the sample test board is differentiated to obtain a plurality of sample modules, which is convenient for testing different parameters of the PCB board, wherein the sample module includes a high-voltage resistance test module, a plugging test module, a tinning test module and a developing punching test module, and then the high-voltage resistance test module is solder-resisted, and the high-voltage resistance test module after solder-resisting is processed, and the processed high-voltage resistance test module is measured to obtain the high-voltage resistance value, dielectric constant and insulation resistance value of the PCB board, thereby improving the environmental applicability of the PCB board. , drill and cure the plugging test module to obtain the plugging capacity range of the PCB board, so as to judge the plugging effect of the PCB board and whether the plugging is full, etc., develop and spray tin on the tinning test module to obtain the resolution parameters and tinning parameters of the PCB board, and finally design the copper-plated holes and non-copper-plated holes with preset apertures for the developing and punching test module, and then develop the copper-plated holes and non-copper-plated holes to obtain the developing and punching capacity range of the PCB board, thereby realizing the evaluation of the plugging ink performance of the PCB board. Since the above processes can occur simultaneously, the testing process can be simplified and the testing cost and resources can be saved.

[0012] According to some embodiments of the present invention, the sample module further comprises a negative ion migration module, wherein the negative ion migration module is provided with a plurality of staggered sparse lines; and the plugging ink performance test method further comprises:

[0013] Performing solder resist processing on the staggered sparse lines to obtain a processing result;

[0014] When the negative ion migration module is powered on, the staggered sparse lines are tested to observe the negative ion migration state and solder resist color state of the PCB board after the test, and to observe whether ion migration and solder resist discoloration problems occur under high temperature and high humidity conditions, so as to protect the PCB board.

[0015] According to some embodiments of the present invention, the sample module further includes a planar packaging module, wherein the planar packaging module includes a copper surface and a substrate surface; and the plugging ink performance test method further includes:

[0016] Designing 50 horizontal solder resist bridges and 50 vertical solder resist bridges on the copper surface;

[0017] Designing 50 horizontal solder resist bridges and 50 vertical solder resist bridges on the substrate surface;

[0018] The packaging range of the PCB board is obtained according to the designed copper surface and the designed substrate surface, so as to confirm the range of the ink limit bridge on the PCB board and prevent short circuit during the tinning process.

[0019] According to some embodiments of the present invention, the high voltage test module includes a plurality of high voltage sparse lines; before soldering the high voltage test module and measuring the high voltage test module after soldering to obtain the high voltage resistance value, dielectric constant and insulation resistance of the PCB board, the method further includes:

[0020] Performing copper plating on the high voltage resistance test module to obtain an energized copper pad;

[0021] The energized copper pad and the high-voltage sparse line are covered with oil to protect the PCB board.

[0022] According to some embodiments of the present invention, the sample module further includes a tracking module; and the plugging ink performance test method further includes:

[0023] Performing an oil covering operation on the tracking module to obtain a copper oil covering area and a copper oil non-covering area;

[0024] The copper-covered oil area and the copper-free oil area are subjected to solder masking, and the copper-covered oil area and the copper-free oil area after solder masking are measured to obtain the leakage tracking index of the PCB board, thereby determining the leakage index of the PCB board, which is convenient for the subsequent use of the PCB board.

[0025] According to some embodiments of the present invention, the copper-covered oil area and the copper-covered oil area are both squares with a side length of 50 mm, which ensures the accuracy of data during the test and avoids experimental data deviation.

[0026] According to some embodiments of the present invention, the step of performing solder masking on the high voltage test module and measuring the high voltage test module after solder masking to obtain the high voltage resistance value, dielectric constant and insulation resistance value of the PCB board includes:

[0027] Performing solder resistance on the high voltage resistance test module to obtain a solder resistance layer;

[0028] Applying direct current pressure to the solder resist layer, measuring the solder resist layer after the direct current pressure application, and determining the dielectric constant and the high voltage resistance value of the PCB board;

[0029] An insulation resistor is added to the solder resist layer, and the appearance of the solder resist layer after addition is inspected to obtain the insulation resistance value of the PCB board, thereby determining the chemical properties of the PCB board, which is convenient for the future application of the PCB board.

[0030] According to some embodiments of the present invention, the insulation resistance is greater than or equal to 500 megahertz, and the voltage of the DC voltage applied to the solder resist layer is greater than 500 volts, which facilitates the measurement of the insulation resistance and high voltage resistance of the circuit board.

[0031] According to some embodiments of the present invention, the sample module further includes a surface tension testing module; and the plugging ink performance testing method further includes:

[0032] Performing solder resistance on the surface tension test module to obtain a solder resistance tension module;

[0033] Performing an ink coating operation on the solder resist tension module to obtain an ink coating result;

[0034] The ink coating result is observed to determine the ink tension value of the PCB board, so as to facilitate the subsequent improvement of the ink tension performance of the PCB board.

[0035] In a second aspect, an embodiment of the present invention provides a PCB board, which is obtained by testing according to the plugging ink performance testing method of the first aspect as described above.

[0036] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

[0038] Figure 1 is a flow chart of a method for testing plugging ink performance provided by an embodiment of the present invention;

[0039] Figure 2 is a flow chart of a method for testing plugging ink performance provided by another embodiment of the present invention;

[0040] Figure 3 is a flow chart of a method for testing plugging ink performance provided by another embodiment of the present invention;

[0041] Figure 4 is a flow chart of a method for testing plugging ink performance provided by another embodiment of the present invention;

[0042] Figure 5 yes Figure 1 A specific method flow chart of step S103;

[0043] Figure 6 is a flow chart of a method for testing plugging ink performance provided by another embodiment of the present invention;

[0044] Figure 7 is a schematic diagram of a sample test board provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0046] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0048] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0049] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0050] The embodiments of the present invention are further described below in conjunction with the accompanying drawings.

[0051] refer to Figure 1 , Figure 1It is a flow chart of a plugging ink performance testing method provided by an embodiment of the present invention. The plugging ink performance testing method includes but is not limited to step S101 and step S106.

[0052] Step S101: Divide the PCB board into rows and columns according to preset conditions to obtain a sample test board;

[0053] It should be noted that the preset row and column conditions can be three rows and three columns, three rows and four columns, four rows and five columns, or five rows and five columns, etc., and the division can be manual drawing division, machine scanning division, etc., and this embodiment does not make specific limitations.

[0054] Step S102: performing differentiation processing on the sample test plate to obtain a sample module;

[0055] Reference Figure 7 , Figure 7 is a schematic diagram of a sample test board provided by another embodiment of the present invention;

[0056] It should be noted that the sample module includes a high-voltage resistance test module, a plugging test module, a tinning test module and a developing and punching test module, and the number of each sub-module in the sample module can be adjusted according to the preset row and column conditions. The sample module includes but is not limited to module 1, module 2 to module N. For example, when the sample test board has three rows and five columns, the number of high-voltage resistance test modules can be three, and they are respectively located in the first row and the first column, the second row and the first column, and the third row and the third column. The number of plugging test modules can be one, located in the first row and the second column. The number of tinning test modules can be two, located in the first row and the third column and the second row and the second column. The developing and punching test module can be one, located in the third row and the fourth column, and the present embodiment does not make specific restrictions.

[0057] Step S103: solder masking the high-voltage test module, processing the high-voltage test module after solder masking, and measuring the processed high-voltage test module to obtain the high-voltage resistance value, dielectric constant and insulation resistance value of the PCB board;

[0058] Step S104: drilling the via plugging test module, and curing the drilled via plugging test module to obtain the via plugging capacity range of the PCB board;

[0059] It should be noted that the number of holes drilled in the plugging test module can be 200, 250 or 300, and the diameter of the holes can be between 0.2 mm and 0.8 mm. For example, the plugging test module can be drilled to obtain 100 small holes with a diameter of 0.3 mm, 200 small holes with a diameter of 0.4 mm and 150 small holes with a diameter of 0.5 mm, or small holes with diameters of 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, and 0.6 mm, wherein the number of small holes with different diameters is 250 each, and this embodiment does not impose specific restrictions.

[0060] Step S105: performing a developing process and a tinning process on the tinning test module, and performing a curing process on the tinning test module after the process, so as to obtain the resolution condition parameters and the tinning condition parameters of the PCB board;

[0061] In one embodiment, the tinning test module is developed and sprayed with tin, and the treated tinning test module is cured, so that the cured tinning test module is observed to observe the tinning condition and resolution condition of the PCB board, thereby obtaining the resolution condition parameters and tinning condition parameters of the PCB board.

[0062] Step S106: designing copper-plated holes and non-copper-plated holes with preset apertures for the developing and punching test module, performing developing processing on the copper-plated holes and non-copper-plated holes, and obtaining the developing and punching capacity range of the PCB board.

[0063] It should be noted that in step S106, the developing and punching test module is drilled to obtain copper holes and non-copper holes with apertures of 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, and 0.6 mm, wherein the number of copper holes and non-copper holes with different apertures is 100 respectively. After developing them, the capacity range of the solder mask ink punching development can be determined, thereby obtaining the plugging ink range of the PCB board.

[0064] In one embodiment, a PCB board is first divided according to preset row and column conditions to obtain a sample test board, and the sample test board is differentiated to obtain a plurality of sample modules, which is convenient for testing different parameters of the PCB board, wherein the sample module includes a high voltage resistance test module, a plugging test module, a tinning test module and a developing punching test module, and then the high voltage resistance test module is solder-resisted, and the high voltage resistance test module after solder-resisting is processed, and the processed high voltage resistance test module is measured to obtain the high voltage resistance value, dielectric constant and insulation resistance value of the PCB board, thereby improving the environmental applicability of the PCB board and performing the plugging test module test. The block is drilled and cured to obtain the plugging capacity range of the PCB board, so as to judge the plugging effect of the PCB board and whether the plugging is full, etc. The tinning test module is developed and tin-sprayed to obtain the resolution parameters and tinning parameters of the PCB board, and finally the development and punching test module is drilled to obtain copper-plated holes and non-copper-plated holes, and then the copper-plated holes and non-copper-plated holes are developed to obtain the plugging ink range of the PCB board, thereby realizing the evaluation of the plugging ink performance of the PCB board. Since the above processes can occur simultaneously, the test process can be simplified and the test cost and resources can be saved.

[0065] refer to Figure 2 , Figure 2 It is a flow chart of a plugging ink performance testing method provided by another embodiment of the present invention. The plugging ink performance testing method includes but is not limited to step S201 and step S202.

[0066] It should be noted that the sample module also includes a negative ion migration module, wherein the negative ion migration module is provided with a plurality of staggered sparse lines.

[0067] Step S201: performing solder resist processing on the staggered sparse lines to obtain a processing result;

[0068] Step S202: When the negative ion migration module is powered on, the staggered sparse lines are tested to observe the negative ion migration state and solder mask color state of the PCB board after the test.

[0069] In one embodiment, the staggered sparse lines are first subjected to a solder resist curing treatment to obtain a treatment result. Thereafter, when the negative ion migration module is powered on, the staggered sparse lines are tested to observe the negative ion migration state and solder resist color state of the tested PCB board, and to observe whether ion migration and solder resist discoloration problems occur under high temperature and high humidity conditions, so as to protect the PCB board.

[0070] It should be noted that the line width or line spacing of the staggered sparse lines in this embodiment is 12.5 mils, 16 mils and 25 mils, and the number of staggered sparse lines of various line widths is 15. The use of staggered sparse lines with different line widths and line spacings can make it easier to observe the problems of ion migration and solder mask discoloration, thereby facilitating observation by testers.

[0071] It is understandable that in the process of testing the staggered sparse lines, it is necessary to ensure that the negative ion migration module is carried out under high temperature and high humidity conditions, so that the negative ion migration module can be observed for ion migration and solder mask color change under high temperature and high humidity conditions.

[0072] refer to Figure 3 , Figure 3 It is a flow chart of a plugging ink performance testing method provided by another embodiment of the present invention. The plugging ink performance testing method includes but is not limited to step S301 and step S303.

[0073] It should be noted that the sample module also includes a planar packaging module, wherein the planar packaging module includes a copper surface and a substrate surface.

[0074] Step S301: designing 50 horizontal solder resist bridges and 50 vertical solder resist bridges on the copper surface;

[0075] Step S302: designing 50 horizontal solder resist bridges and 50 vertical solder resist bridges on the substrate surface;

[0076] Step S303: obtaining a packaging area of ​​the PCB board according to the designed copper surface and the designed substrate surface.

[0077] In one embodiment, 50 horizontal solder resist bridges and 50 vertical solder resist bridges are designed on the copper surface and the substrate surface respectively, so that the packaging range of the PCB board is obtained according to the designed copper surface and substrate surface, which is convenient for confirming the range of the ink limit bridge on the PCB board and preventing short circuit during the tinning process.

[0078] It should be noted that the width of the horizontal solder resist bridge and the vertical solder resist bridge is set between 2 mils and 6 mils, and the length is 125 mils. For example, 50 horizontal solder resist bridges and vertical solder resist bridges with widths of 2.0 mils, 2.5 mils, 3.0 mils, 3.5 mils, 4.0 mils, 4.5 mils, 5.0 mils and 6.0 mils are set on the copper surface and the substrate surface to measure the packaging interval, and by setting solder resist bridges of different widths, the adhesion of the ink to the PCB board surface can be tested.

[0079] In one embodiment of the present invention, the high-voltage test module includes a plurality of high-voltage sparse lines, and the high-voltage test module is solder-resisted and the high-voltage test module after solder-resisting is measured to obtain the high-voltage resistance value, dielectric constant and insulation resistance of the PCB board. It also includes copper plating the high-voltage test module to obtain a powered copper pad; the powered copper pad and the high-voltage sparse lines are covered with oil to protect the PCB board and increase the accuracy of the high-voltage resistance value, dielectric constant and insulation resistance.

[0080] refer to Figure 4 , Figure 4 It is a flow chart of a plugging ink performance testing method provided by another embodiment of the present invention. The plugging ink performance testing method includes but is not limited to step S401 and step S402.

[0081] It should be noted that the sample module also includes a tracking module.

[0082] Step S401: performing an oil covering operation on the tracking module to obtain a copper oil covering area and a copper oil non-covering area;

[0083] Step S402: solder masking is performed on the copper cover oil area and the copper cover oil free area, and the copper cover oil area and the copper cover oil free area after solder masking are measured to obtain the tracking index of the PCB board.

[0084] In one embodiment of the present invention, an oil covering operation is performed on a leakage tracking module to obtain a copper oil covering area and a copper non-oil covering area, and then the copper oil covering area and the copper non-oil covering area are subjected to solder masking, and the copper oil covering area and the copper non-oil covering area after solder masking are measured to obtain a leakage tracking index of the PCB board, thereby determining the leakage index of the PCB board, which is convenient for subsequent judgment of the usage scenario based on the performance of the PCB board.

[0085] In one embodiment of the present invention, both the copper-covered oil area and the copper-covered oil area are squares with a side length of 50 mm, which ensures the accuracy of data during the test and avoids experimental data deviation.

[0086] It is understandable that the number of the copper-covered oil area and the number of the copper-covered oil area can be 1, 2, or 3, etc., respectively, and this embodiment does not impose any specific limitation.

[0087] refer to Figure 5 , Figure 5 yes Figure 1 A specific method flow chart of step S103 is a further description of step S103, and step S103 includes but is not limited to steps S501 to S503.

[0088] Step S501: performing solder resist on the high voltage test module to obtain a solder resist layer;

[0089] Step S502: applying DC pressure to the solder resist layer, measuring the solder resist layer after the DC pressure application, and determining the dielectric constant and high voltage resistance value of the PCB board;

[0090] Step S503: adding an insulation resistor to the solder resist layer, and performing a visual inspection on the solder resist layer after the addition, to obtain the insulation resistance value of the PCB board.

[0091] In one embodiment of the present invention, a high voltage test module is firstly subjected to solder resistance to obtain a solder resistance layer of the high voltage test module, and then a DC voltage is applied to the solder resistance layer, wherein a number of isolation points are selected in the high voltage test module, and during the DC voltage application process, the voltage between different isolation points is measured, thereby determining the dielectric constant and the high voltage resistance value of the PCB board, and when measuring the insulation resistance value of the PCB board, the solder resistance layer is first visually inspected, and after confirming that the appearance of the solder resistance layer has not changed, an insulation resistance is added to the solder resistance layer, and then the solder resistance layer is observed again to see if bubbles, delamination, etc. are present, thereby obtaining the insulation resistance value of the PCB board, which is convenient for determining the physical and chemical properties of the PCB board and facilitating the subsequent application of the PCB board.

[0092] In one embodiment of the present invention, the insulation resistance is greater than or equal to 500 megahertz, and the voltage of the DC voltage applied to the solder resist layer is greater than 500 volts, which is convenient for measuring the insulation resistance and high voltage withstand value of the circuit board.

[0093] refer to Figure 6 , Figure 6 It is a flow chart of a plugging ink performance testing method provided by another embodiment of the present invention. The plugging ink performance testing method includes but is not limited to step S601 and step S603.

[0094] It should be noted that the sample module also includes a surface tension testing module.

[0095] Step S601: performing solder resist on the surface tension test module to obtain a solder resist tension module;

[0096] Step S602: performing an ink coating operation on the solder resist tension module to obtain an ink coating result;

[0097] Step S603: Observe the ink coating result and determine the ink tension value of the PCB board.

[0098] In one embodiment of the present invention, the sample module also includes a surface tension testing module, and the surface tension testing module is subjected to solder resistance to obtain a solder resistance tension module, and then the solder resistance tension module is ink-coated to obtain an inking result. After standing for a period of time, the inking result is observed to determine the ink tension value of the PCB board, thereby meeting customer needs.

[0099] It can be understood that the solder resist tension module can be inked by brushing a 100 mm long ink strip on the solder resist tension module, or by brushing three 100 mm long grinding ink strips on the solder resist tension module. After obtaining the inking result, observe whether more than 90% of the ink strips shrink or form ink droplets within two seconds, so as to obtain the ink tension value of the PCB board.

[0100] It should be noted that the plugging ink performance test method in this embodiment also includes various common test methods such as testing the ink thickness of the sample test board, pencil hardness test, adhesion test, masked via test, chemical resistance test, etc.

[0101] In one embodiment of the present invention, the sample test board is sliced ​​to measure the line surface and line angle oil thickness values ​​of the sample test board, and the hardness range of the sample test board is obtained by using a pencil to scratch the sample test board at 45 degrees. The sample test board is pulled by using the adhesion of tape to obtain the adhesion range and the masking range of the via hole of the sample test board. After soaking the sample test board in 10% sulfuric acid, 10% sodium hydroxide, and 100% isopropyl alcohol for 30 minutes each, the sample test board is pulled by using the adhesion of tape to obtain the chemical resistance range of the sample test board.

[0102] Further, based on the above embodiments, another embodiment of the present invention also provides a PCB board, wherein the PCB board is tested according to any one of the above plugging ink performance test methods.

[0103] Therefore, the PCB board has the beneficial effects brought about by the plugging ink performance testing method in any of the above embodiments.

[0104] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0105] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

[0106] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A method for testing the performance of plugging ink, characterized in that: include: Divide the PCB board into rows and columns according to preset conditions to obtain a sample test board; Performing differentiation processing on the sample test board to obtain a sample module, wherein the sample module includes a high voltage resistance test module, a plugging test module, a tinning test module and a developing and punching test module; Performing solder masking on the high-voltage test module, processing the high-voltage test module after solder masking, and measuring the processed high-voltage test module to obtain the high-voltage resistance value, dielectric constant and insulation resistance value of the PCB board; Drilling the via plugging test module, and curing the drilled via plugging test module to obtain the via plugging capacity range of the PCB board; Performing a developing process and a tin spraying process on the tinning test module, and performing a curing process on the treated tinning test module to obtain the resolution condition parameters and the tinning condition parameters of the PCB board; Designing copper-plated holes and non-copper-plated holes with preset apertures for the development and punching test module, performing development processing on the copper-plated holes and the non-copper-plated holes, and obtaining the development and punching capacity range of the PCB board; The sample module further includes a negative ion migration module, wherein the negative ion migration module is provided with a plurality of staggered sparse lines; the plugging ink performance test method further includes: Performing solder resist processing on the staggered sparse lines to obtain a processing result; When the negative ion migration module is powered on, the staggered sparse lines are tested, and the negative ion migration state and solder mask color state of the PCB board after the test are observed.

2. The plugging ink performance testing method according to claim 1, characterized in that: The sample module further includes a planar packaging module, wherein the planar packaging module includes a copper surface and a substrate surface; the plugging ink performance test method further includes: Designing 50 horizontal solder resist bridges and 50 vertical solder resist bridges on the copper surface; Designing 50 horizontal solder resist bridges and 50 vertical solder resist bridges on the substrate surface; The packaging area of ​​the PCB board is obtained according to the designed copper surface and the designed substrate surface.

3. The plugging ink performance testing method according to claim 1, characterized in that: The high voltage test module includes a plurality of high voltage sparse lines; before soldering the high voltage test module and measuring the high voltage test module after soldering to obtain the high voltage resistance value, dielectric constant and insulation resistance value of the PCB board, the method further includes: Performing copper plating on the high voltage resistance test module to obtain an energized copper pad; The energized copper pad and the high-voltage sparse wire are covered with oil.

4. The plugging ink performance testing method according to claim 1, characterized in that: The sample module also includes a tracking module; The plugging ink performance testing method also includes: Performing an oil covering operation on the tracking module to obtain a copper oil covering area and a copper oil non-covering area; The copper-covered oil area and the copper-free oil area are subjected to solder resist, and the copper-covered oil area and the copper-free oil area after solder resist are measured to obtain the tracking index of the PCB board.

5. The plugging ink performance testing method according to claim 4, characterized in that: The copper-covered oil area and the copper-free oil area are both squares with a side length of 50 mm.

6. The plugging ink performance testing method according to claim 1, characterized in that: The step of soldering the high-voltage test module, processing the high-voltage test module after soldering, and measuring the processed high-voltage test module to obtain the high-voltage resistance value, dielectric constant and insulation resistance value of the PCB board includes: Performing solder resistance on the high voltage resistance test module to obtain a solder resistance layer; Applying direct current pressure to the solder resist layer, measuring the solder resist layer after the direct current pressure application, and determining the dielectric constant and the high voltage resistance value of the PCB board; An insulation resistor is added to the solder resist layer, and a visual inspection is performed on the solder resist layer after the addition to obtain the insulation resistance value of the PCB board.

7. The plugging ink performance testing method according to claim 6, characterized in that: The insulation resistance is greater than or equal to 500 megohms, and the voltage of applying direct current to the solder resist layer is greater than 500 volts.

8. The plugging ink performance testing method according to claim 1, characterized in that: The sample module further includes a surface tension test module; and the plugging ink performance test method further includes: Performing solder resistance on the surface tension test module to obtain a solder resistance tension module; Performing an ink coating operation on the solder resist tension module to obtain an ink coating result; The ink coating result is observed to determine the ink tension value of the PCB board.

9. A PCB board, characterized in that: The method is tested according to the plugging ink performance testing method as described in any one of claims 1 to 8.

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