Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing device and a substrate processing method. The substrate processing device is characterized in that it includes: a suction nozzle part, which is used to suck sediment into a cup-shaped outer cover; a flow pipeline part, which is connected to the suction nozzle part to allow the sediment and the chemical liquid to flow; a suction tank part, which is connected to the flow pipeline part to allow the sediment and the chemical liquid to flow in; and an ejector part, which is arranged in the flow pipeline part to form a suction pressure in the suction nozzle part and the flow pipeline part.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and a substrate processing method, and more particularly, to a substrate processing device and a substrate processing method that can prevent a substrate from being contaminated again and can prevent a flow line portion from being blocked. Background Art

[0002] Generally, semiconductor processes include an etching process for etching a wafer, a singulation process for cutting a wafer into a plurality of dies, and a cleaning process for cleaning the wafer. A substrate processing apparatus is used in the wafer etching process or the wafer cleaning process.

[0003] The substrate processing apparatus includes a cup-shaped housing, a rotary chuck, and a spray nozzle. The rotary chuck is rotatably disposed within the cup-shaped housing, with a substrate placed on top of the rotary chuck. The spray nozzle is configured to spray a chemical solution onto the substrate. While the rotary chuck rotates, the spray nozzle sprays the chemical solution onto the substrate.

[0004] However, conventionally, if foreign matter remains on the surface of a substrate after substrate processing is completed, there is a possibility that substrate defects may occur in subsequent steps.

[0005] Furthermore, after the substrate processing step is completed, the chemical solution and sediment remaining in the spray nozzle portion may fall onto the substrate, and the substrate may be contaminated again.

[0006] The background technology of the present invention is disclosed in Korean Patent Publication No. 2020-0045071 (published on May 4, 2020, invention title: Liquid supply nozzle and substrate processing device). Summary of the Invention

[0007] An object of the present invention is to provide a substrate processing apparatus and a substrate processing method, which can prevent the substrate from being contaminated again and prevent the flow line from being blocked.

[0008] The substrate processing device of the present invention is characterized in that it includes: a suction nozzle part, which is used to suck sediment into the cup-shaped outer cover; a flow pipeline part, which is connected to the suction nozzle part to allow the sediment and the chemical liquid to flow; a suction tank part, which is connected to the flow pipeline part to allow the sediment and the chemical liquid to flow in; and an ejector part, which is arranged on the flow pipeline part to form a suction pressure between the suction nozzle part and the flow pipeline part.

[0009] The injector portion may include an injector body portion into which the sediment and the liquid medicine sucked by the flow line portion flow; and a gas supply portion connected to the injector body portion to supply gas to the injector body portion.

[0010] The suction tank portion may include: a suction tank main body portion connected to the flow line portion; a filter portion arranged inside the suction tank main body portion to filter the sediment discharged from the flow line portion; and a discharge portion connected to the suction tank main body portion to discharge the liquid medicine filtered in the filter portion.

[0011] The filter portion may include a plurality of filters stacked between the flow line portion and the discharge portion, the plurality of filters having meshes that become smaller toward the discharge portion.

[0012] The substrate processing apparatus may further include an overflow line portion connected to the suction tank body portion and the discharge portion.

[0013] The overflow line portion may be connected to an upper side of the filter portion in the suction tank portion.

[0014] The substrate processing apparatus may further include an overflow detection unit configured to detect that the chemical liquid in the suction tank body flows into the overflow line unit.

[0015] The substrate processing apparatus may further include a discharge line portion connected to the suction tank portion to discharge the chemical liquid mist and the gas from the suction tank portion.

[0016] The substrate processing apparatus may further include a spray nozzle portion for spraying the chemical liquid toward the substrate of the cup-shaped housing, and the suction nozzle portion may suck the sediment floating in the chemical liquid when the spray nozzle portion sprays the chemical liquid toward the substrate.

[0017] After a substrate processing process is completed, the ejector portion may form a suction pressure in the suction nozzle portion and the flow line portion for a preset time.

[0018] The substrate processing method of the present invention is characterized in that it includes the following steps: supplying a chemical liquid to a cup-shaped outer cover to process the substrate; an ejector part generates suction pressure in a suction nozzle part and a flow line part; the suction nozzle part sucks in sediment floating on the upper side of the chemical liquid and the chemical liquid; and the sediment and the chemical liquid flowing in the flow line part flow into the suction tank part.

[0019] In the step of the ejector portion generating the suction pressure in the suction nozzle portion and the flow line portion, the ejector portion may supply gas to the flow line portion.

[0020] In the step in which the sediment and the medicinal liquid flowing in the flow pipeline portion flow into the suction tank portion, the medicinal liquid flowing into the suction tank portion can be discharged through the discharge portion after being filtered in the filter portion, and the medicinal liquid smoke and the gas generated in the suction tank portion are discharged through the discharge pipeline portion.

[0021] The substrate processing method may further include the following steps: an overflow detection unit detects whether the chemical liquid overflows in the suction tank unit; and when the overflow detection unit detects the overflow of the chemical liquid, a control unit controls to interrupt the supply of the chemical liquid to the cup-shaped outer cover.

[0022] The substrate processing method may further include the following step: after the substrate processing step is completed, the ejector portion forms a suction pressure in the suction nozzle portion and the flow line portion for a preset time.

[0023] According to the present invention, the ejector portion is provided in the flow line portion, so the suction nozzle portion can be expanded, and the size of the ejector portion can be increased. Therefore, the suction nozzle portion and the ejector portion can be prevented from being clogged by sediment.

[0024] Furthermore, according to the present invention, after the substrate processing step is completed, the ejector unit is driven for a predetermined time, thereby preventing the chemical liquid from remaining in the suction nozzle unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 FIG. 1 is a diagram schematically showing a substrate processing apparatus according to an embodiment of the present invention.

[0026] Figure 2 This is an enlarged view schematically showing a suction tank portion of a substrate processing apparatus according to an embodiment of the present invention.

[0027] Figure 3 FIG. 1 is a diagram schematically illustrating a nozzle arm in a substrate processing apparatus according to an embodiment of the present invention.

[0028] Figure 4 A diagram schematically illustrating the rotation angle of the nozzle arm in a substrate processing apparatus according to an embodiment of the present invention.

[0029] Figure 5 FIG. 1 is a diagram schematically illustrating a suction nozzle unit and a spray nozzle unit in a substrate processing apparatus according to an embodiment of the present invention.

[0030] Figure 6 FIG. 1 is a diagram briefly illustrating a substrate processing method according to an embodiment of the present invention.

[0031] Description of Reference Numerals

[0032] 100: substrate processing device; 110: rotary chuck portion; 112: cup-shaped outer cover; 120: nozzle arm; 122: driving portion; 125: suction nozzle portion; 126: first injection nozzle portion; 127: second injection nozzle portion; 130: flow pipeline portion; 140: suction tank portion; 141: suction tank body portion; 142: bottom portion portion; 143: window portion; 144: filter portion; 144a: filter; 145: support portion; 146: discharge portion; 150: ejector portion; 151: ejector body portion; 153: air supply portion; 161: overflow pipeline portion; 163: overflow detection portion; 165: reminder portion; 167: discharge pipeline portion; 170: control portion; W: substrate. DETAILED DESCRIPTION

[0033] Below, an embodiment of the substrate processing apparatus and substrate processing method of the present invention is described with reference to the accompanying drawings. When describing the substrate processing apparatus and substrate processing method, the thickness of lines or the dimensions of structural elements shown in the accompanying drawings may be exaggerated for clarity and convenience. Furthermore, the terms described below are defined based on their functions within the present invention and may vary depending on the intentions or practices of users and application personnel. Therefore, the definitions of such terms should be based on the entire content of this specification.

[0034] Figure 1 FIG. 1 is a diagram briefly illustrating a substrate processing apparatus according to an embodiment of the present invention. Figure 2 This is an enlarged view briefly showing the suction tank portion of a substrate processing apparatus according to one embodiment of the present invention. Figure 3 FIG. 1 is a diagram briefly illustrating a nozzle arm in a substrate processing apparatus according to an embodiment of the present invention. Figure 4 FIG. 1 is a diagram briefly illustrating the rotation angle of the nozzle arm in the substrate processing apparatus according to one embodiment of the present invention. Figure 5 FIG. 1 is a diagram schematically illustrating a suction nozzle unit and a spray nozzle unit in a substrate processing apparatus according to an embodiment of the present invention.

[0035] Reference Figures 1 to 5 The substrate processing apparatus 100 according to one embodiment of the present invention includes a suction nozzle portion 125 , a flow line portion 130 , a suction tank portion 140 , and an ejector portion 150 .

[0036] The rotary chuck 110 is rotatably mounted within a cup-shaped housing 112. A substrate W, such as a wafer, is placed on the upper side of the rotary chuck 110. The substrate W may be cut into a matrix of multiple dies (not shown). Foreign matter may remain in the gaps between the dies (not shown).

[0037] A nozzle arm 120 is provided outside the cup-shaped outer cover 112. The nozzle arm 120 is connected to a driving unit 122. The nozzle arm 120 is moved in the vertical direction of the cup-shaped outer cover 112 by the driving unit 122 and is provided so as to be rotatable from the outside to the inside of the cup-shaped outer cover 112.

[0038] The nozzle arm 120 is provided with a suction nozzle portion 125 and spray nozzle portions 126 and 127. The spray nozzle portions 126 and 127 include a first spray nozzle portion 126 and a second spray nozzle portion 127. The suction nozzle portion 125 is immersed in the chemical liquid to suck in the chemical liquid and sediment contained in the cup-shaped outer cover 112. In addition, the first spray nozzle portion 126 and the second spray nozzle portion 127 are arranged at a certain height from the chemical liquid to spray the chemical liquid onto the substrate W placed on the spin chuck portion 110. The first spray nozzle portion 126 sprays a chemical liquid mixed with deionized water and nitrogen onto the substrate W. The second spray nozzle portion 127 sprays a chemical liquid not mixed with nitrogen onto the substrate W. When the chemical liquid is sprayed from one of the first spray nozzle portion 126 and the second spray nozzle portion 127 to process the substrate W, the suction nozzle portion 125 sucks in sediment floating on the chemical liquid.

[0039] The chemical solution may be changed in various ways according to the processing steps of the substrate W, the processing speed of the substrate W, the material of the substrate W, and the like.

[0040] After the substrate W is placed on the spin chuck 110, the nozzle arm 120 moves toward the upper side of the cup-shaped housing 112. A chemical solution is sprayed onto the substrate W from the first spray nozzle 126 or the second spray nozzle 127. As the chemical solution is sprayed onto the substrate W, foreign matter remaining in the gaps between the crystal grains is suspended above the chemical solution. Foreign matter remaining on the substrate W is referred to as sediment.

[0041] Flow line 130 is connected to suction nozzle 125, allowing sediment and liquid medicine to flow through flow line 130. When suction pressure is generated in flow line 130, suction nozzle 125 draws in sediment floating above the liquid medicine. The sediment and liquid medicine drawn in by suction nozzle 125 flow through flow line 130.

[0042] The suction tank portion 140 is connected to the flow line portion 130 so that the sediment and the medical solution flow into the suction tank portion 140. A negative pressure lower than the atmospheric pressure is formed inside the suction tank portion 140 to suck the sediment and the medical solution.

[0043] The ejector unit 150 is provided in the flow line section 130 to generate suction pressure in the suction nozzle section 125 and the flow line section 130. Since the ejector unit 150 is provided in the flow line section 130, the suction nozzle section 125 can be expanded compared to a structure in which the ejector unit 150 is provided in the suction nozzle section 125. Furthermore, the size of the ejector unit 150 can be increased. Consequently, the suction nozzle section 125 and the ejector unit 150 can be prevented from being clogged by sediment.

[0044] After the substrate processing step is completed, the ejector unit 150 can be driven for a predetermined time. For example, the ejector unit 150 can be driven for approximately 3 to 5 minutes after the substrate processing step is completed. This allows any sediment and chemical solution remaining in the suction nozzle unit 125 and the flow line unit 130 to be completely discharged to the suction tank unit 140 , thereby preventing chemical solution from dripping from the suction nozzle unit 125 and re-contaminating the substrate W.

[0045] The injector part 150 includes an injector body part 151 and an air supply part 153. The sediment and the medicine liquid sucked in by the flow line part 130 flow into the injector body part 151. The air supply part 153 is connected to the injector body part 151 to supply gas to the injector body part 151. The gas uses hydrogen gas to prevent explosion or prevent chemical combination with the medicine liquid. The air supply part 153 supplies gas to the injector body part 151, thereby generating a suction pressure lower than the atmospheric pressure inside the injector body part 151. In addition, the gas of the injector body part 151 flows into the suction tank part 140 and is discharged, thereby forming a negative pressure inside the suction tank part 140.

[0046] The suction tank portion 140 includes a suction tank body 141 , a filter portion 144 , and a discharge portion 146 .

[0047] The suction tank body 141 is connected to the flow line 130. The liquid medicine, sediment, and gas flowing in the flow line 130 flow into the suction tank body 141. As the gas is discharged through the discharge line 167, a negative pressure lower than atmospheric pressure is formed in the suction tank body 141. The bottom surface of the suction tank body 141 is tilted toward the center to collect the liquid medicine.

[0048] A window portion 143 is provided on the upper side of the suction tank main body 141 so that the interior of the suction tank can be viewed from the outside. Therefore, a worker can inspect the internal state of the suction tank main body 141 while viewing the window portion 143 .

[0049] The filter unit 144 is disposed inside the suction tank body 141 to filter sediment discharged from the flow line 130 . The filter unit 144 is supported by the support 145 .

[0050] The filter section 144 includes multiple filters 144a stacked between the flow line section 130 and the discharge section 146. The filters 144a have meshes that gradually become smaller as they move toward the discharge section 146. Therefore, the upper filters 144a filter out large sediment particles, while the lower filters 144a filter out small sediment particles. The multiple filters 144a are detachably mounted on the support section 145. Therefore, if a filter 144a becomes clogged, it can be cleaned by detaching it from the support section 145 and then reattaching it to the support section 145.

[0051] The discharge portion 146 is connected to the suction tank body 141 to discharge the liquid medicine filtered by the filter portion 144. The discharge portion 146 is connected to the lowest portion of the bottom portion 142 of the suction tank body 141. The discharge portion 146 can be connected to a liquid medicine recovery portion (not shown) or the cup-shaped outer cover 122. Since the discharge portion 146 is connected to the lowest portion of the bottom portion 142 of the suction tank body 141, it is possible to prevent the liquid medicine from remaining inside the suction tank body 141.

[0052] The substrate processing apparatus 100 further includes an overflow line 161 connected to the suction tank body 141 and the discharge section 146. The overflow line 161 is connected to the upper side of the filter section 144 in the suction tank 140. If the filter section 144 becomes clogged with sediment, the chemical solution may overflow toward the upper side of the suction tank body 141. In this case, the overflowing chemical solution is discharged to the discharge section 146 through the overflow line 161.

[0053] The substrate processing apparatus 100 further includes an overflow detection unit 163 for detecting the flow of chemical liquid from the suction tank body 141 into the overflow pipeline 161. The overflow detection unit 163 may be a water level detection sensor for detecting the water level of the chemical liquid. If overflow of the chemical liquid is detected in the overflow detection unit 163, the overflow detection unit 163 transmits a signal to the control unit 170. The control unit 170 controls the reminder unit 165 to emit a reminder sound to interrupt the supply of chemical liquid from the first and second injection nozzle units 126 and 127. After opening the suction tank body 141, the staff replaces or cleans the filter unit 144.

[0054] The substrate processing apparatus 100 further includes an exhaust line portion 167 connected to the suction tank portion 140 to exhaust chemical liquid fume and gas from within the suction tank portion 140. The exhaust line portion 167 can be connected to a recovery device (not shown). Chemical liquid fume is generated as the chemical liquid evaporates, and the chemical liquid fume and gas are exhausted through the exhaust line portion 167, thereby forming a negative pressure within the suction tank portion 140. Therefore, the chemical liquid, sediment, and gas in the flow line portion 130 are sucked into the interior of the suction tank portion 140.

[0055] The following describes a substrate processing method of the substrate processing apparatus according to an embodiment of the present invention constructed in the above manner.

[0056] Figure 6 FIG. 1 is a diagram briefly illustrating a substrate processing method according to an embodiment of the present invention.

[0057] Reference Figure 6 The spray nozzles 126 and 127 supply chemical liquid to the cup-shaped housing 112, and as the spin chuck 110 rotates, the substrate W is processed (step S11). In this process, the ends of the spray nozzles 126 and 127 are spaced a certain height above the surface of the chemical liquid, and the end of the suction nozzle 125 is slightly immersed above the chemical liquid. The nozzle arm 120 repeatedly rotates within a certain angle θ, so that the spray nozzles 126 and 127 spray the chemical liquid along the radius of the substrate W. As the chemical liquid is sprayed across the entire rotating substrate W, foreign matter trapped between the crystal grains of the substrate W or adhering to the substrate W is separated and floats above the chemical liquid.

[0058] The ejector unit 150 generates suction pressure in the suction nozzle unit 125 and the flow line unit 130 (step S12). In this case, as the ejector unit 150 supplies gas to the flow line unit 130, suction pressure is generated in the flow line unit 130.

[0059] The sediment floating on the upper side of the chemical liquid and the chemical liquid are sucked in by the suction nozzle unit 125 (step S13 ), and the sediment and the chemical liquid flow along the flow line unit 130 .

[0060] The sediment, liquid medicine, and gas flowing in the flow line 130 flow into the suction tank 140 (step S14 ). As the gas is discharged through the discharge line 167 , a negative pressure lower than atmospheric pressure is formed inside the suction tank 140 .

[0061] The medicinal liquid flowing into the suction tank portion 140 is filtered in the filter portion 144 and then discharged through the discharge portion 146 (step S15), and the medicinal liquid smoke and gas generated from the suction tank portion 140 are discharged through the discharge pipeline portion 167 (step S16). In this case, the filter 144a on the upper side filters out precipitates with large particles, and the filter 144a on the lower side filters out precipitates with small particles. In addition, the bottom of the suction tank main body 141 is inclined toward the center side to gather the medicinal liquid, so that the medicinal liquid can be discharged smoothly through the discharge portion 146. In addition, the medicinal liquid smoke and gas are discharged through the discharge pipeline portion 167, so that a negative pressure can be maintained inside the suction tank portion 140.

[0062] Overflow detection unit 163 detects whether the drug solution has overflowed from suction tank 140 (step S17). In this case, if filter 144 is clogged with sediment, the drug solution may overflow toward the upper side of suction tank body 141. The overflowed drug solution is discharged to drain unit 146 through overflow line 161.

[0063] If overflow detection unit 163 detects overflow of liquid medicine from suction tank 140 (step S18), control unit 170 controls injection nozzles 126 and 127 to interrupt the supply of liquid medicine to cup-shaped housing 112 (step S19). Furthermore, control unit 170 controls reminder unit 165 to emit a warning sound. If the warning sound is emitted by reminder unit 165, a worker opens suction tank 140 and replaces or cleans filter 144.

[0064] After the substrate processing step is completed, the ejector unit 150 can be driven for a predetermined time. For example, the ejector unit 150 can be driven for approximately 3 to 5 minutes. This allows any sediment and chemical solution remaining in the suction nozzle unit 125 and the flow line unit 130 to be completely discharged to the suction tank unit 140 , thereby preventing chemical solution from dripping from the suction nozzle unit 125 and re-contaminating the substrate W.

[0065] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely examples, and those skilled in the art will appreciate that various modifications and equivalent embodiments may be implemented.

[0066] Therefore, the true scope of protection of the present invention is defined by the following claims.

Claims

1. A substrate processing device, characterized in that: include: A suction nozzle portion, used for sucking sediment into the cup-shaped outer cover; a flow line portion connected to the suction nozzle portion to allow the sediment and the liquid medicine to flow; a suction tank portion connected to the flow line portion to allow the sediment and the liquid medicine to flow in; as well as an ejector portion, provided on the flow line portion to form a suction pressure between the suction nozzle portion and the flow line portion, The suction tank portion comprises: a suction tank main body connected to the flow line portion; and A discharge portion connected to the main body of the suction tank to discharge the liquid medicine filtered in the filter portion, The substrate processing device further includes: an overflow pipeline portion connected to the suction tank main body and the discharge portion; and The overflow detection unit is used to detect that the liquid medicine in the suction tank body flows into the overflow line unit.

2. The substrate processing apparatus according to claim 1, wherein: The ejector unit comprises: an injector body into which the sediment and the liquid medicine sucked by the flow line portion flow; and The gas supply part is connected to the injector main body to supply gas to the injector main body.

3. The substrate processing apparatus according to claim 1, wherein: The suction tank portion further comprises: The filter unit is disposed inside the suction tank body to filter the sediment discharged from the flow line unit.

4. The substrate processing apparatus according to claim 3, wherein: The filter portion includes a plurality of filters stacked between the flow line portion and the discharge portion. The plurality of filters have meshes that become smaller toward the discharge portion.

5. The substrate processing apparatus according to claim 1, wherein: The overflow line portion is connected to an upper side of the filter portion in the suction tank portion.

6. The substrate processing apparatus according to claim 1, wherein: Also includes: The discharge pipeline part is connected to the suction tank part to discharge the liquid medicine smoke and gas of the suction tank part.

7. The substrate processing apparatus according to claim 1, wherein: It also includes a spray nozzle portion for spraying the liquid medicine toward the substrate of the cup-shaped cover. When the spray nozzle unit sprays the chemical liquid toward the substrate, the suction nozzle unit sucks the sediment floating in the chemical liquid.

8. The substrate processing apparatus according to claim 1, wherein: After a substrate processing process is completed, the ejector portion forms a suction pressure in the suction nozzle portion and the flow line portion for a preset time.

9. A substrate processing method, characterized in that: The steps include: Supplying liquid medicine to the cup-shaped cover to treat the substrate; The ejector section generates suction pressure in the suction nozzle section and the flow line section; The suction nozzle portion sucks in the sediment floating on the upper side of the liquid medicine and the liquid medicine; The sediment and the liquid medicine flowing in the flow line portion flow into the suction tank portion, an overflow detection unit detecting whether the liquid medicine overflows in the suction tank unit; and When the overflow detection unit detects overflow of the chemical liquid, the control unit performs control to interrupt the supply of the chemical liquid to the cup-shaped housing.

10. The substrate processing method according to claim 9, wherein: In the step of the ejector portion generating a suction pressure in the suction nozzle portion and the flow line portion, the ejector portion supplies gas to the flow line portion.

11. The substrate processing method according to claim 10, wherein: In the step in which the sediment and the medicinal liquid flowing in the flow pipeline portion flow into the suction tank portion, the medicinal liquid flowing into the suction tank portion is filtered in the filter portion and then discharged through the discharge portion, and the medicinal liquid smoke and the gas generated in the suction tank portion are discharged through the discharge pipeline portion.

12. The substrate processing method according to claim 9, wherein: It also includes the following steps: After a substrate processing process is completed, the ejector portion forms a suction pressure in the suction nozzle portion and the flow line portion for a preset time.

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