Substrate cleaning device and control method thereof

Abstract

The present invention discloses a substrate cleaning device and a control method thereof. The substrate cleaning device is characterized in that it includes: a vacuum chuck portion for placing a wafer; an annular cover portion, which is opposite to the retaining ring portion of the wafer; an expander module, which is arranged in a manner that enables the annular cover portion to move and applies pressure to the retaining ring portion toward the vacuum chuck portion to expand the spacing between grains in the wafer; and a chuck module, which is arranged in the vacuum chuck portion to confine the annular cover portion, to which pressure is applied by the expander module, to the vacuum chuck portion.

Description

Technical Field

[0001] The present invention relates to a substrate cleaning device and a control method thereof, and more particularly, to a substrate cleaning device and a control method thereof, which can improve substrate processing performance and reduce substrate processing time. Background Art

[0002] Generally, semiconductor processes include an etching process for etching a wafer, a separation process for dicing a wafer into a plurality of dies, a cleaning process for cleaning the wafer, etc. A substrate processing apparatus is used in the wafer etching process or the wafer cleaning process.

[0003] The substrate processing apparatus is rotatably arranged and includes a rotating table on which wafers are placed, a sealing ring attached to the edge of the rotating table in an annular shape, etc. While the rotating table rotates, a processing liquid is supplied to the wafers placed on the rotating table.

[0004] However, when cleaning a wafer cut into multiple dies, it is difficult for existing substrate processing equipment to remove foreign matter remaining in the gaps between the dies. Furthermore, the cleaning time needs to be extended sufficiently to remove the foreign matter from the gaps between the dies, which may increase the cleaning time.

[0005] Furthermore, the process of attaching the seal ring to the top of the turntable is cumbersome, and the seal ring's state of engagement is not constant, which can lead to errors in engagement (such as misalignment). Furthermore, when the seal ring is misaligned, the process fluid can seep outside the seal ring, potentially damaging structures surrounding the turntable.

[0006] Furthermore, a wafer fixing module is provided to prevent the position of the wafer from being shifted, and a sealing ring fixing module is provided to fix the sealing ring. Therefore, the structure of the substrate processing apparatus becomes complicated, and the manufacturing cost may increase.

[0007] Background technology of the present invention is disclosed in Korean Patent Publication No. 10-2016-0122067 (published on October 21, 2016, title of the invention: Wafer processing device and sealing ring for wafer processing device). Summary of the Invention

[0008] An object of the present invention is to provide a substrate processing apparatus and a control method thereof that can improve substrate processing performance and reduce substrate processing time.

[0009] The substrate cleaning device of the present invention is characterized in that it includes: a vacuum chuck portion for placing a wafer; an annular cover portion, which is opposite to the retaining ring portion of the wafer; an expander module, which is arranged in a manner that can move the annular cover portion and applies pressure to the retaining ring portion toward the vacuum chuck portion to expand the spacing between grains in the wafer; and a chuck module, which is arranged on the vacuum chuck portion to confine the annular cover portion, to which pressure is applied by the expander module, to the vacuum chuck portion.

[0010] The expander module may include: an expander moving portion; an expander head portion disposed on the expander moving portion; and a plurality of expander arms connected to the expander head portion to grip the annular cover portion to move the annular cover portion, and the plurality of expander arms apply pressure to the annular cover portion so that the chuck module confines the annular cover portion to the vacuum chuck portion.

[0011] Alternatively, if the chuck module restrains the annular cover portion on the vacuum chuck portion, the expander arm portion may release the pressure applied to the annular cover portion.

[0012] It may be that the expander head includes: an expander sleeve portion, connected to the expander moving portion; a plurality of expander slider portions, coupled to the expander sleeve portion in a radially movable manner and respectively connected to the expander arm portions; an expander rod portion, arranged inside the expander sleeve portion to move the plurality of expander slider portions; and an expander driving portion, arranged in the expander sleeve portion to move the expander rod portion.

[0013] It may be that the expander sleeve portion includes: a sleeve main body portion, which is formed with a movable space portion for the expander rod portion to move; a first baffle portion, which seals one side of the sleeve main body portion; and a second baffle portion, which seals the other side of the sleeve main body portion and is formed with a movable hole portion for the expander rod portion to be inserted in a movably manner.

[0014] It may be that the expander rod portion includes: a movable disk portion, which is movably arranged in the movable space portion of the expander sleeve portion; a plunger portion, which is connected to the movable disk portion in a manner of being inserted into the movable hole portion of the expander sleeve portion; and a pushing portion, which is connected to the plunger portion and the expander slider portion in a manner of moving the expander slider portion as the plunger portion moves.

[0015] The plunger portion may be formed with a conical portion, and the pushing portion may be radially expanded as it is pressurized by the conical portion.

[0016] The expander drive portion may include: a first supply port for supplying a driving medium to one side of the movable space portion to move the movable disk portion toward the expander slider portion; and a second supply port for supplying a driving medium to the other side of the movable space portion to move the movable disk portion toward the opposite side of the expander slider portion.

[0017] The expander arm portion may include: an arm member connected to the expander slider portion; and a hook portion disposed on the arm member so as to restrain the annular cover portion.

[0018] The hook portion may include: a hook body portion connected to the arm portion so as to surround the outer side of the annular cover portion; and a hook pin portion combined with the hook body portion to be inserted into the cover hole portion of the annular cover portion.

[0019] It may be that the chuck module includes: a chuck base, which is arranged on the vacuum chuck part; a chuck rotating part, which is connected to the chuck base to rotate the chuck base; a plurality of chuck connecting rod parts, which are respectively radially connected to the chuck base, and the plurality of chuck connecting rod parts move when the chuck base rotates; and a plurality of cover limiting parts, which are respectively connected to the chuck connecting rod parts, so that the annular cover part can be limited to the vacuum chuck part when the chuck connecting rod part moves.

[0020] The chuck base may include: a base main body portion, which is formed in a ring shape in a manner concentric with the rotation axis of the vacuum chuck portion; a plurality of guide portions formed on the base main body portion for the chuck connecting rod portion to be movably coupled; and a base gear portion, which is formed on the base main body portion and connected to the chuck rotating portion.

[0021] The guide portion may be formed to be inclined with respect to a radial direction of the base body portion.

[0022] It may be that the chuck connecting rod portion includes: a guide slider, which is movably arranged on the chuck base; a connecting rod component, which is connected to the guide slider and moves linearly along the radial direction of the chuck base when the guide slider moves; and a connecting rod gear portion, which is formed on the connecting rod component to engage with the cover limiting portion to move.

[0023] The chuck link portion may further include guide roller portions supporting both sides of the link member.

[0024] It may be that the cover limiting portion includes: a cover limiting shaft portion, which is rotatably arranged on the vacuum chuck portion; a limiting gear portion, formed on the cover limiting shaft portion to engage with the connecting rod gear portion; a cover limiting rod, connected to the cover limiting shaft portion to pressurize and release the pressurization of the annular cover portion; and a limiting roller portion, which is rotatably arranged on the cover limiting rod to be in rolling contact with the annular cover portion.

[0025] The control method of the substrate cleaning device of the present invention is characterized in that it includes the following steps: an expander module limits the annular cover portion; a wafer is placed on a vacuum chuck portion; the expander module applies pressure to the annular cover portion to expand the spacing between the grains of the wafer; a chuck module limits the annular cover portion on the vacuum chuck portion; and an ultrasonic cleaning module sprays cleaning liquid onto the wafer and applies ultrasonic waves to the cleaning liquid to cause the cleaning liquid to generate ultrasonic vibrations.

[0026] Alternatively, after the chuck module restricts the annular cover portion on the vacuum chuck portion, the method may further include the step of the expander module releasing the restriction on the annular cover portion and moving to a waiting position.

[0027] Alternatively, the step of the expander module restricting the annular cover portion includes the following steps: a plurality of expander arms of the expander module move outward through an expander head portion; hooks of the expander arms correspond to the annular cover portion; and as the plurality of expander arms move inward through the expander head portion, the hooks restrict the annular cover portion.

[0028] It may be that, in the step of the expander module applying pressure to the annular cover portion to expand the intervals between the grains of the wafer, the expander arm portion of the expander module applies pressure to the retaining ring portion of the wafer to expand the intervals between the grains.

[0029] In the step of spraying the cleaning liquid onto the wafer and applying ultrasonic waves to the cleaning liquid to cause the cleaning liquid to generate ultrasonic vibrations, the ultrasonic cleaning module may apply ultrasonic waves to the cleaning liquid while being immersed in the cleaning liquid.

[0030] It may be that the ultrasonic cleaning module sprays cleaning liquid onto the wafer, and applies ultrasonic waves to the cleaning liquid to make the cleaning liquid generate ultrasonic vibrations, which includes the following steps: the lifting arm part is raised by the lifting arm driving part; the swing part rotates the lifting arm part toward the upper side of the vacuum chuck part; the lifting arm driving part lowers the lifting arm part so that the cleaning head of the ultrasonic cleaning module is immersed in the cleaning liquid; and the cleaning liquid spraying part sprays the cleaning liquid onto the wafer, and the ultrasonic generating part causes the cleaning liquid to generate ultrasonic vibrations.

[0031] Alternatively, in the step where the lifting arm driving unit lowers the lifting arm unit to immerse the cleaning head of the ultrasonic cleaning module in the cleaning liquid, the internal pressure forming unit may form a pressure higher than atmospheric pressure inside the cleaning head.

[0032] Alternatively, in the step where the lifting arm driving unit lowers the lifting arm unit to immerse the cleaning head of the ultrasonic cleaning module in the cleaning liquid, the lower surface of the cleaning head may be configured so that the inflow side of the cleaning liquid is higher than the outflow side of the cleaning liquid.

[0033] The cleaning head may adjust the height of a lower surface portion of one side of the cleaning head according to a change in the height of the wafer.

[0034] It may be that in the step of lowering the lifting arm portion by the lifting arm driving portion to immerse the cleaning head of the ultrasonic cleaning module in the cleaning liquid, the lifting arm portion is lowered in such a manner that a predetermined distance is maintained between the cleaning head and the surface of the wafer.

[0035] The spray nozzle of the cleaning liquid spraying portion may spray the cleaning liquid obliquely in a direction in which the cleaning liquid flows through the wafer.

[0036] The step of placing the wafer on the vacuum chuck portion may include the following steps: a transfer unit receives the wafer from a conveying unit; the transfer unit moves toward the upper side of the vacuum chuck portion; and the transfer unit is lowered to place the wafer on the vacuum chuck portion.

[0037] Alternatively, the method for controlling the substrate cleaning device may further include the following steps: discharging the cleaning liquid after the cleaning time of the wafer ends; and drying the wafer as the vacuum chuck portion rotates.

[0038] Alternatively, the control method of the substrate cleaning device further includes the following steps: the expander module moves to restrict the annular cover portion; the chuck module releases the restriction on the annular cover portion; the expander module moves to a waiting position; and the wafer is discharged from the vacuum chuck portion.

[0039] According to the present invention, the cleaning process is performed while the spacing between the grains of a wafer is widened. Therefore, foreign matter adhering to the grain surfaces and foreign matter located in the gaps between the grains can be easily removed by the cleaning liquid. Consequently, wafer cleaning performance can be significantly improved, significantly reducing the defective rate of wafers.

[0040] Furthermore, according to the present invention, as the chuck base rotates via the chuck rotating portion, the annular cover portion is restrained by the vacuum chuck portion, thereby enabling the wafer to be restrained on the vacuum chuck portion using a single chuck rotating portion. This simplifies the structure of the substrate cleaning apparatus.

[0041] Furthermore, according to the present invention, the height adjustment portion can adjust the height of the cover restriction portion, thereby adjusting the height between the upper surface of the annular cover portion and the upper surface of the vacuum chuck portion. Therefore, by adjusting the tensile strength of the wafer bonding sheet, the spacing between multiple dies can be adjusted.

[0042] Furthermore, according to the present invention, the ultrasonic cleaning module sprays cleaning fluid onto the wafer and applies ultrasonic waves to the cleaning fluid, causing it to vibrate. Thus, the wafer is cleaned chemically by the cleaning fluid and physically cleaned by the cavitation phenomenon of the ultrasonic waves, significantly improving wafer cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 FIG. 1 is a top view schematically illustrating a wafer processed in a substrate cleaning apparatus according to an embodiment of the present invention.

[0044] Figure 2 FIG. 1 is a side view schematically illustrating a wafer processed in a substrate cleaning apparatus according to an embodiment of the present invention.

[0045] Figure 3 FIG. 1 is a side view schematically showing a substrate cleaning device according to an embodiment of the present invention.

[0046] Figure 4 A side view schematically illustrates a state in which the intervals between multiple dies are expanded as the expander module descends and applies pressure to the annular cover and the retaining ring of the wafer in a substrate cleaning apparatus according to an embodiment of the present invention.

[0047] Figure 5 A perspective view briefly illustrates a state in which an expander module holds and moves an annular cover in a substrate cleaning apparatus according to an embodiment of the present invention.

[0048] Figure 6 FIG. 1 is a side view schematically illustrating an expander module, an annular cover, and a vacuum chuck in a substrate cleaning apparatus according to an embodiment of the present invention.

[0049] Figure 7 A cross-sectional view briefly illustrates a state in which a chuck module restricts an annular cover portion in a substrate cleaning apparatus according to an embodiment of the present invention.

[0050] Figure 8 FIG. 1 is a perspective view schematically showing an expander module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0051] Figure 9 FIG. 1 is a cross-sectional view schematically illustrating an expander head of an expander module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0052] Figure 10 The present invention is a cross-sectional view schematically showing a state in which the expander slider portion of the expander module of the substrate cleaning device according to one embodiment of the present invention has moved to the inner side of the expander head portion.

[0053] Figure 11 FIG. 1 is a top view briefly showing a chuck module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0054] Figure 12 The present invention is a top view briefly showing a state in which a chuck connecting rod portion is driven as a chuck base of a chuck module rotates in a substrate cleaning apparatus according to an embodiment of the present invention.

[0055] Figure 13 A perspective view briefly illustrates a state in which a cover restricting portion of a chuck module is driven to restrict an annular cover portion in a substrate cleaning apparatus according to an embodiment of the present invention.

[0056] Figure 14 The present invention is a top view schematically showing a state in which an ultrasonic cleaning module and a cleaning liquid spraying module are arranged outside a vacuum chuck portion in a substrate cleaning apparatus according to an embodiment of the present invention.

[0057] Figure 15 FIG. 1 is a top view schematically showing an ultrasonic cleaning module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0058] Figure 16 FIG. 1 is a side view schematically showing an ultrasonic cleaning module in a substrate cleaning apparatus according to an embodiment of the present invention.

[0059] Figure 17 The figure is a side view schematically showing a state in which a cleaning head of an ultrasonic cleaning module is tilted relative to a wafer in a substrate cleaning apparatus according to an embodiment of the present invention.

[0060] Figure 18 The figure is a cross-sectional view schematically showing a coupling bolt portion and an angle adjustment bolt portion of a cleaning head in a substrate cleaning apparatus according to an embodiment of the present invention.

[0061] Figure 19 A cross-sectional view schematically illustrates a substrate cleaning apparatus according to an embodiment of the present invention, in which an angle adjustment bolt portion is provided.

[0062] Figure 20 The figure is a side view schematically showing an ion generator and a transfer unit of a substrate cleaning device according to an embodiment of the present invention.

[0063] Figure 21FIG. 1 is a flow chart illustrating a method for controlling a substrate cleaning apparatus according to an embodiment of the present invention.

[0064] Description of Reference Signs

[0065] 10: Wafer; 11: Die; 12: Adhesive sheet; 13: Clamping ring; 100: Substrate cleaning device; 101: Housing; 102: Chamber; 105: Cup-shaped housing; 110: Drive unit; 111: Rotating shaft; 113: Motor; 120: Vacuum chuck; 122: Vacuum flow path; 124: Vacuum chamber; 130: Ring cover; 131: Cover body; 132: Restriction step; 133: Cover pressurizing unit; 135: Cover hole; 140: Expander module; 141: Expander moving unit; 150: Expander head; 151: Expander sleeve; 152: Sleeve body; 152a : Slider groove; 152b: Moving space; 153: First baffle; 153a: First sealing member; 153b: Lock ring; 154: Second baffle; 154a: Second sealing member; 154b: Moving hole; 155: Expander slider; 156: Expander rod; 156a: Moving disk; 156b: Plunger; 156c: Pushing member; 156d: Disk sealing member; 158: Expander drive; 158a: First supply port; 158b: Second supply port; 160: Expander arm; 161: Arm member; 163: Hook; 164: Hook body; 165: Hook pin 170: Chuck module; 171: Chuck base; 172: Base body; 173: Guide; 174: Base gear; 175: Chuck rotating portion; 180: Chuck connecting rod; 181: Guide slider; 182: Connecting rod component; 183: Connecting rod gear; 184: Guide roller; 190: Cover limiting portion; 191: Cover limiting shaft; 192: Limiting gear; 193: Cover limiting rod; 194: Limiting roller; 210: Height adjustment module; 211: Adjustment component; 213: Height adjustment portion; 220: Ultrasonic cleaning module; 221: Lifting arm drive unit; 222: Lifting arm unit; 2 23: Swinging part; 224: Ultrasonic cleaning part; 225: Cleaning head; 225a: Connecting bolt part; 225b: Angle adjustment bolt part; 226: Ultrasonic generating part; 227: Voltage applying part; 228: Internal pressure forming part; 229: Cleaning liquid injection part; 229a: Cleaning liquid inflow part; 229b: Injection nozzle; 230: Cleaning liquid injection module; 231: Rotating arm driving part; 232: Rotating arm part; 233: Rotating part; 234: Cleaning liquid spraying part; 240: Ion generator; 250: Transfer unit; 251: Transfer moving part; 253: Transfer lifting part; 255: Transfer carrying part. DETAILED DESCRIPTION

[0066] An embodiment of the substrate cleaning apparatus and control method thereof according to the present invention is described below with reference to the accompanying drawings. In describing the substrate cleaning apparatus and control method thereof, the thickness of lines or dimensions of structural elements shown in the accompanying drawings may be exaggerated for clarity and convenience. Furthermore, the terms described below are defined based on their functions within the present invention and may differ depending on the intentions or practices of users and application personnel. Therefore, the definitions of such terms should be based on the entire text of this specification.

[0067] Figure 1 To briefly illustrate a top view of a wafer processed in a substrate cleaning apparatus according to an embodiment of the present invention, Figure 2 FIG. 1 is a side view schematically illustrating a wafer processed in a substrate cleaning apparatus according to an embodiment of the present invention. Figure 3 FIG. 1 is a side view schematically showing a substrate cleaning device according to an embodiment of the present invention. Figure 4 A side view schematically illustrates a state in which the intervals between multiple dies are expanded as the expander module descends and applies pressure to the annular cover and the retaining ring of the wafer in a substrate cleaning apparatus according to an embodiment of the present invention.

[0068] Reference Figures 1 to 4 A substrate cleaning apparatus 100 according to an embodiment of the present invention includes a vacuum chuck portion 120 , an annular cover portion 130 , an expander module 140 , and a chuck module 170 .

[0069] The substrate cleaning apparatus 100 cleans the wafer 10. After being etched in the etching process, the wafer 10 is cut into a matrix in the separation process, forming a plurality of crystal dies 11. During the cleaning process, a cleaning liquid is sprayed onto the wafer 10, removing foreign matter adhering to the plurality of crystal dies 11. Various cleaning liquids, such as deionized water (DI-water), can be used.

[0070] Wafer 10 comprises a plurality of die 11 arranged in a matrix; a bonding sheet 12 for attaching the die 11; and a retaining ring 13 connected to the periphery of the bonding sheet 12 to firmly support it. Bonding sheet 12 is made of a horizontally stretchable material. As bonding sheet 12 is tightened by retaining ring 13, the die 11 are fixed in place, maintaining the thin sheet of die 11 in a flat state.

[0071] A chamber portion 102 is formed inside the housing 101, and a cup-shaped housing 105 is provided in the chamber portion 102. The vacuum chuck portion 120 is disposed inside the cup-shaped housing 105 for accommodating the cleaning liquid. The cup-shaped housing 105 is provided so as to surround the outside of the vacuum chuck portion 120. The cup-shaped housing 105 can prevent the vacuum from entering the cup-shaped housing 105 (see FIG. 1 ). Figure 14 ) The sprayed cleaning fluid is discharged or scattered to the outside.

[0072] The vacuum chuck portion 120 is rotatably disposed on the driving portion 110. The vacuum chuck portion 120 may be in the shape of a disk as a whole.

[0073] The drive unit 110 includes a rotating shaft 111 connected to the center of rotation of the vacuum chuck unit 120 and a motor unit 113 disposed on the rotating shaft 111. The motor unit 113 includes a stator (not shown) disposed within a housing (not shown) and a rotor (not shown) disposed within the stator so as to surround the rotating shaft 111. Furthermore, the drive unit 110 may employ a belt drive method that rotates the rotating shaft 111 using a belt or a chain drive method that rotates the rotating shaft 111 using a chain. This drive unit 110 may take a variety of forms as long as it can rotate the vacuum chuck unit 120.

[0074] A vacuum flow path 122 is formed on the rotating shaft 111 to create a vacuum in the vacuum chuck 120. The vacuum flow path 122 extends along the length of the rotating shaft 111. A vacuum chamber 124 is formed in the vacuum chuck 120 to connect to the vacuum flow path 122. A plurality of vacuum holes (not shown) are formed in the vacuum chuck 120 to apply vacuum pressure to the wafer 10. The vacuum chuck 120 can be formed in various configurations.

[0075] The wafer 10 is placed on the vacuum chuck 120. The wafer 10 cut into a plurality of dies 11 is placed on the vacuum chuck 120. When the wafer 10 is cut into dies 11, foreign matter may remain on the surface of the dies 11 and in the gaps between the dies 11.

[0076] The annular cover portion 130 is opposite to the retaining ring portion 13 of the wafer 10. The annular cover portion 130 includes: a cover body portion 131 formed to surround the periphery of the vacuum chuck portion 120; a limiting step portion 132 formed to protrude inward from the lower side of the cover body portion 131; and a cover pressurizing portion 133 extending inward from the upper side of the cover body portion 131 to apply pressure to the retaining ring portion 13 of the wafer 10 (see FIG. Figure 7 The thickness of the cover pressurizing portion 133 may gradually become thinner toward the end. The cover pressurizing portion 133 can seal the upper side of the collar portion 13, thereby preventing the cleaning liquid from penetrating into the components outside the collar portion 13.

[0077] The expander module 140 is provided to move the annular cover portion 130 , and applies pressure to the collar portion 13 toward the vacuum chuck portion 120 to expand the intervals between the dies 11 in the wafer 10 .

[0078] Chuck module 170 is installed on vacuum chuck 120 to secure the retaining ring 13 of wafer 10 to vacuum chuck 120. Chuck module 170 secures retaining ring 13 to the periphery of vacuum chuck 120 by pressing retaining ring 13 downward. Therefore, when vacuum chuck 120 rotates, chuck module 170 presses against annular cover 130 and retaining ring 13, preventing wafer 10 from shifting in position and maintaining a flat surface. Chuck module 170 is described in detail below.

[0079] Figure 5 This is a perspective view briefly showing a state in which the expander module holds the annular cover to move it in a substrate cleaning apparatus according to an embodiment of the present invention. Figure 6 1 is a side view briefly showing an expander module, an annular cover, and a vacuum chuck in a substrate cleaning device according to an embodiment of the present invention. Figure 7 This is a cross-sectional view briefly illustrating a state in which the chuck module restricts the annular cover portion in a substrate cleaning device according to an embodiment of the present invention. Figure 8 This is a perspective view briefly showing an expander module in a substrate cleaning device according to an embodiment of the present invention. Figure 9 FIG2 is a cross-sectional view briefly showing an expander head of an expander module in a substrate cleaning device according to an embodiment of the present invention. Figure 10 The present invention is a cross-sectional view schematically showing a state in which an expander slider moves toward the inside of an expander head in an expander module of a substrate cleaning device according to an embodiment of the present invention.

[0080] Reference Figures 5 to 10 The expander module 140 includes an expander moving portion 141 , an expander head portion 150 and a plurality of expander arms 160 .

[0081] The expander moving portion 141 is arranged on the upper side of the vacuum chuck portion 120 in a manner that allows it to move up and down. The expander moving portion 141 can take various forms, such as a robotic arm form that allows it to move up and down, a ball screw form, etc. The expander head 150 is arranged in a manner that allows it to move through the expander moving portion 141. A plurality of expander arms 160 are connected to the expander head 150 to grip the annular cover portion 130 to move it, and to apply pressure to the annular cover portion 130 so that the chuck module 170 restricts the annular cover portion 130 to the vacuum chuck portion 120. The plurality of expander arms 160 are radially arranged on the expander head 150. Four or more expander arms 160 can be arranged around the expander head 150.

[0082] When the multiple expander arms 160 apply pressure to the annular cover 130, the chuck module 170 restricts the annular cover 130 to the vacuum chuck 120. Therefore, the retaining ring 13 of the wafer 10 moves downward through the annular cover 130. In this case, as the annular cover 130 descends, the bonding sheet 12 of the wafer 10 is pulled in the radial direction. As the bonding sheet 12 is stretched in the radial direction, the intervals between the multiple dies 11 will expand (see FIG. Figure 4 If the cleaning liquid is sprayed onto the plurality of crystal grains 11 while the spacing between the plurality of crystal grains 11 is expanded, the cleaning liquid can easily remove foreign matter adhering to the surface of the crystal grains 11 and foreign matter located in the gaps between the plurality of crystal grains 11. Therefore, the performance of cleaning foreign matter in the wafer 10 can be significantly improved. Furthermore, as the cleaning performance of the wafer 10 is significantly improved, the defective rate of the wafer 10 can be significantly reduced.

[0083] Once the chuck module 170 has restrained the annular cover 130 within the vacuum chuck 120, the expander arm 160 releases the pressure on the annular cover 130. Furthermore, the expander moving unit 141 moves the expander head 150 and the expander arm 160 upward from the vacuum chuck 120. This prevents the ultrasonic cleaning module 220 from colliding with or being disturbed by the expander module 140 as it moves upward from the wafer 10.

[0084] The dilator head 150 includes a dilator sleeve portion 151 , a plurality of dilator slider portions 155 , a dilator rod portion 156 , and a dilator driving portion 158 .

[0085] The expander sleeve portion 151 is connected to the expander moving portion 141. The expander sleeve portion 151 can be cylindrical as a whole. A plurality of expander slider portions 155 are coupled to the expander sleeve portion 151 in a radially movable manner and are respectively connected to the expander arm portion 160. In this case, slider groove portions 152a are radially formed on the peripheral portion of the expander sleeve portion 151 so that the expander slider portions 155 are coupled in a movable manner. The expander rod portion 156 is arranged inside the expander sleeve portion 151 to move the plurality of expander slider portions 155. The expander rod portion 156 is arranged inside the expander sleeve portion 151 in a manner that allows for vertical movement. The expander drive portion 158 is arranged in the expander sleeve portion 151 to move the expander rod portion 156.

[0086] When the expander driving unit 158 ​​is driven, the expander slider 155 moves radially within the expander sleeve 151 as the expander rod 156 moves. As the expander slider 155 moves outward of the expander sleeve 151, the expander arm 160 moves outward and releases the restriction on the annular cover 130. As the expander slider 155 moves inward of the expander sleeve 151, the expander arm 160 moves inward and restricts the annular cover 130.

[0087] The expander cannula 151 includes a cannula body 152 , a first baffle 153 , and a second baffle 154 .

[0088] The sleeve body 152 is formed with a movable space 152b for the expansion rod 156 to move. The movable space 152b can be cylindrical. A first baffle 153 is provided to close one side of the sleeve body 152. The first baffle 153 is detachably mounted on the upper side of the sleeve body 152. A first sealing member 153a is provided around the first baffle 153. A locking ring 153b is provided on one side of the first baffle 153 to prevent the first baffle 153 from separating from the sleeve body 152. After the expander rod 156 is inserted into the movable space 152b, the first baffle 153 closes one side of the sleeve body 152. The second baffle 154 closes the other side of the sleeve body 152, forming a movable hole 154b for the expander rod 156 to be movably inserted. A second sealing member 154 is provided around the movable hole 154b to seal a gap with the expander rod 156. The expander rod 156 is provided to be movable in the vertical direction.

[0089] The expander rod 156 includes a moving plate portion 156 a , a plunger portion 156 b , and a pushing portion 156 c .

[0090] The movable disc 156a is movably disposed within the movable space 152b. A disc seal 156d is provided around the movable disc 156a to seal the gap between the inner surface of the expander sleeve 151 and the outer surface of the movable disc 156a. The movable disc 156a is disc-shaped. The plunger 156b is connected to the movable disc 156a by being inserted into the movable hole 154b. It engages with the center of the plunger 156b. The pusher 156c is connected to the plunger 156b and the expander slider 155 so as to move the expander slider 155 in response to the movement of the plunger 156b. As the pusher 156c lowers to apply pressure to the expander slider 155, the expander slider 155 moves outward. As the pusher 156c rises to release the pressure on the expander slider 155, the expander slider 155 moves inward.

[0091] The plunger portion 156b is formed with a conical portion (not shown). As the conical portion applies pressure to the pusher portion 156c, the pusher portion 156c expands radially. Furthermore, as the conical portion releases pressure on the pusher portion 156c, the pusher portion 156c contracts radially due to its restoring force. The pusher portion 156c can be connected by a spring (not shown) or made of a retractable material, allowing the multiple pusher pieces (not shown) to expand and contract.

[0092] The expander drive unit 158 ​​includes a first supply port 158a for supplying a driving medium to one side of the movable space 152b to move the movable disk 156a toward the expander slider 155, and a second supply port 158b for supplying a driving medium to the other side of the movable space 152b to move the movable disk 156a toward the side opposite the expander slider 155. The first supply port 158a is connected to a first supply line, and the second supply port 158b is connected to a second supply line. When the first supply port 158a supplies the driving medium to one side of the movable space 152b, the second supply port 158b discharges the driving medium to the other side of the movable space 152b. When the second supply port 158b supplies the driving medium to the other side of the movable space 152b, the first supply port 158a discharges the driving medium to one side of the movable space 152b. Therefore, as the driving medium is supplied to the first supply port 158a or the second supply port 158b, the movable disk portion 156a can move to one side or the other side of the movable space portion 152b, and thus the expander arm portion 160 can move radially in the cannula body portion 152.

[0093] The expander arm 160 includes an arm member 161 connected to the expander slider 155 and a hook 163 configured on the arm member 161 to restrain the annular cover 130. The arm member 161 is radially disposed in the cannula body 152. The hook 163 is disposed at the end of the arm member 161. When the expander slider 155 moves inward of the cannula body 152, the hook 163 restrains the annular cover 130.

[0094] The hook portion 163 includes: a hook body portion 164 connected to the arm member 161 to surround the outer side of the annular cover portion 130; and a hook pin portion 165 combined with the hook body portion 164 to be inserted into the cover hole portion 135 of the annular cover portion 130. The hook body portion 164 can be substantially The hook pin 165 is formed so as to contact the outer corner of the annular cover 130. The hook pin 165 is formed to protrude inwardly from the hook body 164. As the arm member 161 moves inwardly via the expander slider 155, the hook pin 165 is inserted into the cover hole 135 of the annular cover 130. This prevents the annular cover 130 from being separated from the expander module 140 when the expander module 140 moves.

[0095] Figure 11 To briefly illustrate a top view of a chuck module in a substrate cleaning device according to an embodiment of the present invention, Figure 12 This is a top view briefly illustrating a state in which the chuck connecting rod portion is driven as the chuck base of the chuck module rotates in a substrate cleaning device according to an embodiment of the present invention. Figure 13 A perspective view briefly illustrates a state in which a cover restricting portion of a chuck module is driven to restrict an annular cover portion in a substrate cleaning apparatus according to an embodiment of the present invention.

[0096] Reference Figures 11 to 13 The chuck module 170 includes a chuck base 171 , a chuck rotating portion 175 , a plurality of chuck link portions 180 , and a plurality of cover restricting portions 190 .

[0097] A chuck base 171 is mounted on the vacuum chuck unit 120. A chuck rotating unit 175 is connected to the chuck base 171 to rotate the chuck base 171. A plurality of chuck connecting rods 180 are radially connected to the chuck base 171 and move when the chuck base 171 rotates. A plurality of cover restricting units 190 are respectively connected to the chuck connecting rods 180 to secure the annular cover 130 to the vacuum chuck unit 120 when the chuck connecting rods 180 move.

[0098] As the chuck rotating portion 175 is driven, the base gear portion 174 rotates. As the base main portion 172 and the base gear portion 174 rotate together, the chuck link portion 180 moves in the radial direction of the base main portion 172. In this case, when the base main portion 172 of the chuck base 171 rotates, the multiple chuck link portions 180 rotate simultaneously. As the chuck link portions 180 move, the annular cover portion 130 is fixed to the vacuum chuck portion 120. Therefore, a single chuck base 171 and a single chuck rotating portion 175 can be used to simultaneously fix the wafer 10 and the annular cover portion 130 to the vacuum chuck portion 120, thereby further simplifying the structure of the substrate cleaning apparatus 100.

[0099] The chuck base 171 includes a base body portion 172 , a plurality of guide portions 173 , and a base gear portion 174 .

[0100] The base body portion 172 is annular in shape so as to be concentric with the rotation axis 111 of the vacuum chuck portion 120. The base body portion 172 is arranged inside the vacuum chuck portion 120. A plurality of guide portions 173 are formed on the base body portion 172 so that the chuck link portion 180 can be movably coupled. The number of the plurality of guide portions 173 is the same as the number of the chuck link portions 180, and they are formed at equal intervals along the circumferential direction of the base body portion 172. The base gear portion 174 is formed on the base body portion 172 and connected to the chuck rotating portion 175. The base gear portion 174 is arranged in an arc shape on the inner circumferential surface of the base body portion 172. As the chuck rotating portion 175 is driven, the base gear portion 174 rotates, and as the base body portion 172 rotates together with the base gear portion 174, the chuck link portion 180 moves in the radial direction of the base body portion 172.

[0101] The guide portion 173 is formed obliquely relative to the radial direction of the base body 172. The guide portion 173 may be a guide hole, a guide groove, or a guide protrusion. Because the guide portion 173 is formed obliquely relative to the radial direction of the base body 172, as the base body 172 rotates a certain angle, the chuck link portion 180 moves linearly in the radial direction of the base body 172.

[0102] The chuck link portion 180 includes a guide slider 181 , a link member 182 , and a link gear portion 183 .

[0103] The guide slider 181 is movably coupled to the guide portion 173. A link member 182 is coupled to the guide slider 181. When the guide slider 181 moves, it moves linearly along the radius of the base body 172. A link gear portion 183 is formed on the link member 182 and moves by meshing with the lid stopper 190. The link member 182 is in the form of a straight rod. The link gear portion 183 is formed in the form of a rack arranged in parallel along the length of the link member 182.

[0104] The chuck link 180 further includes guide rollers 184 supporting both sides of the link member 182. When the base body 172 rotates, the guide rollers 184 prevent the chuck link 180 from rotating in the circumferential direction of the base body 172. Therefore, when the base body 172 rotates, if the guide slider 181 moves along the guide rollers 184, the link member 182 does not rotate but moves linearly.

[0105] The cover limiting portion 190 includes: a cover limiting shaft portion 191, which is rotatably arranged on the vacuum chuck portion 120; a limiting gear portion 192, formed on the cover limiting shaft portion 191 to engage with the connecting rod gear portion 183; a cover limiting rod 193, which is connected to the cover limiting shaft portion 191 to pressurize and release the pressure on the annular cover portion 130; and a limiting roller portion 194, which is rotatably arranged on the cover limiting rod 193 to be in rolling contact with the annular cover portion 130.

[0106] As connecting rod member 182 moves linearly, connecting rod gear portion 183 engages with limiting gear portion 192 to drive the device. As limiting gear portion 192 rotates, cover limiting shaft portion 191 and cover limiting rod 193 rotate, causing limiting roller portion 194 to roll and move along limiting step portion 132 of annular cover portion 130. Consequently, limiting roller portion 194 rolls and contacts limiting step portion 132 of annular cover portion 130, thereby preventing the generation of foreign matter due to wear or scratches on limiting step portion 132 of annular cover portion 130. Consequently, the defective rate of wafer 10 can be reduced by preventing foreign matter from entering wafer 10 located inside annular cover portion 130.

[0107] The substrate cleaning apparatus 100 further includes a height adjustment module 210 provided at the vacuum chuck portion 120 to adjust the height of the cover stopper 190. The height adjustment module 210 adjusts the height of the cover stopper 190 before the cleaning process begins.

[0108] If the setting height of the cover limiting portion 190 is adjusted by the height adjustment portion 213, the height between the upper surface of the annular cover portion 130 and the upper surface of the vacuum chuck portion 120 is adjusted. As the setting height of the cover limiting portion 190 is adjusted, the height of the limiting roller portion 194 of the cover limiting portion 190 is adjusted. In this case, if the annular cover portion 130 is restricted by the cover limiting portion 190 in the state of crimping the retaining ring portion 13, the degree of stretching of the bonding sheet 12 of the wafer 10 is adjusted according to the restricted height of the retaining ring portion 13. For example, the lower the setting height of the cover limiting portion 190, the greater the degree of stretching of the bonding sheet 12, and the higher the setting height of the cover limiting portion 190, the smaller the degree of stretching of the bonding sheet 12. As the degree of stretching of the bonding sheet 12 is adjusted, the spacing between the multiple grains 11 can be adjusted.

[0109] The height adjustment module 210 includes an adjustment member 211, which is provided with a cover stopper 190 and is movably coupled to the periphery of the vacuum chuck unit 120; and a height adjustment unit 213, which is connected to the adjustment member 211 to adjust the installation height of the adjustment member 211. The adjustment member 211 can be in the form of a block disposed vertically around the vacuum chuck unit 120. The height adjustment unit 213 can take various forms, such as a cylinder or a ball screw, to adjust the height of the adjustment member 211.

[0110] Height adjustment module 210 adjusts the height of lid stopper 190 so that the height difference between the upper surface of vacuum chuck 120 and the upper surface of retaining ring 13 is approximately within a range of 5 mm to 15 mm. The height of lid stopper 190 can be adjusted appropriately based on factors such as the size of wafer 10 and the cleaning speed of wafer 10.

[0111] Figure 14 This is a top view briefly showing a state in which an ultrasonic cleaning module and a cleaning liquid spraying module are arranged outside a vacuum chuck portion in a substrate cleaning apparatus according to an embodiment of the present invention. Figure 15 To briefly illustrate a top view of an ultrasonic cleaning module in a substrate cleaning device according to an embodiment of the present invention, Figure 16 To briefly illustrate a side view of an ultrasonic cleaning module in a substrate cleaning device according to an embodiment of the present invention, Figure 17 This is a side view briefly illustrating a state in which the cleaning head of the ultrasonic cleaning module is tilted and arranged on the wafer in a substrate cleaning device according to an embodiment of the present invention. Figure 18 1 is a cross-sectional view briefly showing a connecting bolt portion and an angle adjustment bolt portion of a cleaning head in a substrate cleaning device according to an embodiment of the present invention. Figure 19 A cross-sectional view schematically illustrates a substrate cleaning apparatus according to an embodiment of the present invention, in which an angle adjustment bolt portion is provided.

[0112] Reference Figures 14 to 19 The substrate cleaning apparatus 100 further includes an ultrasonic cleaning module 220 that sprays a cleaning liquid onto the wafer 10 and applies ultrasonic waves to the cleaning liquid to cause the cleaning liquid to vibrate. In this manner, the wafer 10 is cleaned chemically by the cleaning liquid, while physical cleaning is performed through cavitation generated by the ultrasonic waves, thereby significantly improving the cleaning efficiency of the wafer 10.

[0113] The ultrasonic cleaning module 220 applies ultrasonic waves to the cleaning liquid while being immersed in the cleaning liquid, so that cavitation can be actively generated at the lower side of the ultrasonic cleaning module 220 .

[0114] The ultrasonic cleaning module 220 includes a lifting arm driving unit 221, a lifting arm unit 222, a swinging unit 223, and an ultrasonic cleaning unit 224. As the lifting arm driving unit 221, there is a motor, a cylinder, or a ball screw unit. The lifting arm unit 222 is connected to the lifting arm driving unit 221 so as to be lifted and lowered by the lifting arm driving unit 221. The swinging unit 223 is connected to the lifting arm unit 222 so as to rotate the lifting arm unit 222. The ultrasonic cleaning unit 224 is connected to the lifting arm unit 222 to spray a cleaning liquid onto the wafer 10 and apply ultrasonic waves to the cleaning liquid. While the wafer 10 is placed on the vacuum chuck unit 120, the swinging unit 223 is arranged on the outside of the vacuum chuck unit 120. After the wafer 10 is placed in the vacuum chuck unit 120, the swinging unit 223 moves toward the upper side of the vacuum chuck unit 120.

[0115] The ultrasonic cleaning unit 224 includes a cleaning head 225 , an ultrasonic wave generating unit 226 , a voltage applying unit 227 , an internal pressure generating unit 228 , and a cleaning liquid spraying unit 229 . The ultrasonic cleaning unit 224 is disposed outside the cup-shaped housing 105 .

[0116] The cleaning head 225 is connected to the lifting arm 222. An ultrasonic wave generator 226 is disposed inside the cleaning head 225 to apply ultrasonic waves to the cleaning liquid. A voltage application unit 227 is disposed inside the cleaning head 225 to apply voltage to the ultrasonic wave generator 226. The voltage application unit 227 is connected to an electrical wire (not shown). An internal pressure generating unit 228 is provided in the cleaning head 225 to generate a pressure higher than atmospheric pressure inside the cleaning head 225. A cleaning liquid spraying unit 229 is formed in the cleaning head 225 to spray the cleaning liquid onto the wafer 10. When the voltage application unit 227 applies voltage to the ultrasonic wave generator 226, ultrasonic waves are generated in the ultrasonic wave generator 226, causing the cleaning liquid to vibrate ultrasonically. In this case, the internal pressure generating unit 228 generates a pressure higher than atmospheric pressure inside the cleaning head 225, thereby preventing the cleaning liquid from flowing into the cleaning head 225. Therefore, the voltage application unit 227 and the ultrasonic wave generator 226 can be prevented from leaking electricity or being damaged by the cleaning liquid.

[0117] The cleaning liquid spraying portion 229 includes: a cleaning liquid inlet portion 229a for allowing the cleaning liquid to flow in; and a plurality of spray nozzles 229b for spraying the cleaning liquid discharged from the cleaning liquid inlet portion 229a onto the wafer 10. Regarding the plurality of spray nozzles 229b, one or more rows can be formed on the lower side of the cleaning head 225. The spray nozzles 229b are arranged along the radial direction of the wafer 10. The plurality of spray nozzles 229b spray the cleaning liquid onto the wafer 10, so that the wafer 10 can be cleaned by the spray pressure of the cleaning liquid. In addition, the plurality of spray nozzles 229b are arranged along the radial direction of the wafer 10, so that when the wafer 10 is rotated by the vacuum chuck portion 120, the cleaning liquid can be sprayed onto the wafer 10 with the cleaning head 225 in a fixed position.

[0118] The plurality of spray nozzles 229b spray the cleaning liquid at a predetermined angle in the direction in which the cleaning liquid flows in the wafer 10 (see FIG. Figure 17 For example, when the wafer 10 rotates clockwise, the plurality of spray nozzles 229b spray the cleaning liquid at an angle clockwise relative to the cleaning head 225. Furthermore, when the wafer 10 rotates counterclockwise, the plurality of spray nozzles 229b spray the cleaning liquid at an angle counterclockwise relative to the cleaning head 225. By guiding the cleaning liquid to flow smoothly from the bottom side of the cleaning head 225, stagnation of the cleaning liquid is prevented and fluidity of the cleaning liquid is ensured.

[0119] The lower surface of the cleaning head 225 is formed so that the inflow side of the cleaning liquid is higher than the outflow side of the cleaning liquid (H1>H2). This prevents the cleaning liquid from colliding with the inflow corners of the cleaning head 225 and stagnating. Furthermore, after the cleaning liquid flows smoothly toward the lower surface of the cleaning head 225, it can flow out of the lower surface of the cleaning head 225 more quickly.

[0120] The cleaning head 225 further includes: a plurality of coupling bolts 225a, which are screwed to the cleaning head 225 and the lifting arm 222; and an angle adjustment bolt 225b, which is screwed to the cleaning head 225 and the lifting arm 222 to adjust the angle θ of the cleaning head 225 (refer to FIG. Figure 17 ) (refer to Figure 18 and Figure 19 ). Multiple coupling bolts 225a and angle adjustment bolts 225b are provided on both sides of the cleaning head 225 in the width direction. As the angle adjustment bolts 225b protrude and engage with the cleaning head 225, the cleaning head 225 is slightly spaced apart from one side of the lifting arm 222, so that the coupling bolts 225a are coupled to the cleaning head 225 and the lifting arm 222. Therefore, as the cleaning head 225 is coupled to the lifting arm 222 in a slightly tilted state, the setting angle of the cleaning head 225 can be adjusted. The setting angle of the cleaning head 225 can be appropriately designed in consideration of the rotation speed of the wafer 10, the size of the wafer 10, the spacing distance of the cleaning heads 225, the viscosity of the cleaning liquid, and the like.

[0121] The substrate cleaning apparatus 100 further includes a cleaning liquid spraying module 230 for spraying a cleaning liquid toward the wafer 10. The cleaning liquid spraying module 230 may spray a cleaning liquid containing deionized water (DIW) and nitrogen gas toward the wafer 10.

[0122] The cleaning liquid spraying module 230 includes a rotary arm driving unit 231 , a rotary arm unit 232 , a rotary unit 233 , and a spraying unit 234 .

[0123] The pivot arm drive unit 231 includes a motor, a cylinder, or a ball screw. The pivot arm unit 232 is connected to the pivot arm drive unit 231 so as to be raised and lowered by the pivot arm drive unit 231. The pivot unit 233 is connected to the pivot arm unit 232 to rotate the pivot arm unit 232. The spray unit 234 is connected to the pivot arm unit 232 and is used to spray cleaning liquid onto the wafer 10.

[0124] The spraying portion 234 may include a spraying nozzle that sprays the cleaning liquid toward the wafer 10 . Thus, when the wafer 10 rotates through the vacuum chuck portion 120 , the spraying portion 234 repeatedly rotates within a certain angle range and sprays the cleaning liquid toward the wafer 10 .

[0125] The ultrasonic cleaning module 220 and the cleaning liquid spraying module 230 may be selectively used according to a processing step of the wafer 10 .

[0126] Figure 20 The figure is a side view schematically showing an ion generator and a transfer unit of a substrate cleaning device according to an embodiment of the present invention.

[0127] Reference Figure 20 An ion generator 240 is provided inside the housing 101. The ion generator 240 is located above the chamber 102 and is used to remove static electricity generated during both the processing and non-processing steps of the wafers 10. The ion generator 240 prevents static electricity from being generated within the wafers 10 and the chamber, thereby preventing foreign matter from reattaching to the wafers 10 due to static electricity.

[0128] If air is supplied as the supply gas to the ionizer 240 and deionized water (DI water) is supplied as the cleaning liquid, the cations and anions ionized by the ionizer 240 can be sprayed onto the upper portion of the wafer together with the cleaning liquid.

[0129] Before deionized water containing cations and anions was sprayed onto the upper portion of wafer 10, the measured electrostatic potential of wafer 10 was approximately 3.6 kV. Conversely, after deionized water containing cations and anions was sprayed onto the upper portion of wafer 10, the measured electrostatic potential was approximately -0.10 kV to -0.17 kV. With such a negative voltage, the static electricity of wafer 10 can be controlled to an ideal value close to "0" by increasing the amount of (+) ions generated by ion generator 240.

[0130] The chamber section 102 is provided with a transfer unit 250 for receiving the wafer 10 from the transfer unit (not shown). The transfer unit 250 includes a transfer moving section 251 movably provided on the bottom surface of the chamber section 102; a transfer elevating section 253 provided on the transfer moving section 251; and a transfer supporting section 255 provided on the transfer elevating section 253. When the wafer 10 transferred from the transfer unit is supported on the transfer supporting section 255, the transfer elevating section 253 moves toward both sides of the vacuum chuck section 120 via the transfer transport section. When the transfer elevating section 253 lowers the transfer supporting section 255, the wafer 10 is placed on the upper side of the vacuum chuck section 120. After the wafer 10 is placed on the vacuum chuck section 120, the transfer unit 250 returns to its original position to receive the wafer 10 from the transfer unit.

[0131] The control method of the substrate cleaning apparatus according to one embodiment of the present invention will be described.

[0132] Figure 21 FIG. 1 is a flow chart illustrating a method for controlling a substrate cleaning apparatus according to an embodiment of the present invention.

[0133] Reference Figure 21 , the expander module 140 restrains the annular cover 130 (step S11). In this case, as the multiple expander arms 160 of the expander module 140 move outward through the expander head 150, the hooks 163 of the expander arms 160 correspond to the annular cover 130. As the multiple expander arms 160 move inward through the expander head 150, the hooks 163 restrain the annular cover 130.

[0134] The transfer unit 250 places the wafer 10 on the vacuum chuck 120 (step S12). In this case, the transfer unit 250 receives the wafer 10 from the transfer unit. As the transfer unit 250's transfer and transport sections move toward both sides of the vacuum chuck 120, the transfer carrier 255 moves toward the upper side of the vacuum chuck 120 and descends to place the wafer 10 on the vacuum chuck 120. Once the wafer 10 is placed on the vacuum chuck 120, the transfer unit 250 returns to its original position to receive a new wafer 10.

[0135] The expander module 140 descends and applies pressure to the annular cover 130 (step S13) to increase the spacing between the dies 11 on the wafer 10. In this process, the expander module 140 grips the annular cover 130 and moves it upwards toward the wafer 10. As the expander module 140 descends, the expander arm 160 of the expander module 140 applies downward pressure to the annular cover 130. As the annular cover 130 applies downward pressure to the retaining ring 13 and moves downward, the bonding sheet 12 is stretched radially as the bonding sheet 12 on the wafer 10 is pulled radially. As the bonding sheet 12 stretches radially, the spacing between the dies 11 increases.

[0136] Once the expander module 140 has fully pressurized the annular cover 130, the chuck module 170 restrains the annular cover 130 within the vacuum chuck 120 (step S14). Specifically, when the chuck rotating unit 175 of the chuck module 170 engages with the base gear 174 for driving, the chuck link 180 moves outward as the chuck base 171 rotates a certain angle. As the link gear 183 of the chuck link 180 engages with the restraining gear 192 of the lid restraining unit 190 for driving, the lid restraining rod 193 and the restraining roller 194 rotate and restrain the restraining step 132 of the annular cover 130. As the lid restraining unit 190 restrains the annular cover 130, the retaining ring 13 of the wafer 10 remains lowered, thereby maintaining the expanded spacing between the dies 11 within the wafer 10.

[0137] If the cover restrictor 190 completely restricts the annular cover 130, the expander module 140 releases the restriction on the annular cover 130 and moves to the waiting position (step S15). In this state, the expander module 140 is sufficiently separated from the vacuum chuck 120 to prevent the ultrasonic cleaning module 220 from colliding with or contacting the vacuum chuck 120 when the ultrasonic cleaning module 220 moves toward the upper side of the vacuum chuck 120.

[0138] The ultrasonic cleaning module 220 sprays cleaning liquid onto the wafer 10, causing the cleaning liquid to generate ultrasonic vibrations (step S16). In this case, the ultrasonic cleaning module 220 applies ultrasonic waves to the cleaning liquid while being immersed in the cleaning liquid. Specifically, the lifting arm 222 is raised by the lifting arm driving unit 221, the swinging unit 223 rotates the lifting arm 222 toward the upper side of the vacuum chuck unit 120, and the lifting arm driving unit 221 lowers the lifting arm 222 to immerse the cleaning head 225 of the ultrasonic cleaning module 220 in the cleaning liquid. The cleaning liquid spraying unit 229 sprays the cleaning liquid onto the wafer 10, and the ultrasonic generating unit 226 generates ultrasonic vibrations in the cleaning liquid.

[0139] In this case, the intervals between the plurality of crystal grains 11 remain expanded, so foreign matter between the crystal grains 11 can be removed more quickly and easily. Furthermore, the wafer 10 can be cleaned more quickly and cleanly by the spray pressure of the cleaning liquid and the ultrasonic vibration of the cleaning liquid.

[0140] It is determined whether the cleaning time of the wafer 10 is over (step S17). In this case, the cleaning time of the wafer 10 can be pre-set in the control unit (not shown).

[0141] When the cleaning time of the wafer 10 is completed, the cleaning liquid is discharged from the cup-shaped housing 105 (step S18 ). The cleaning liquid discharged from the cup-shaped housing 105 is recovered again in a cleaning liquid recovery tank (not shown).

[0142] Then, the ultrasonic cleaning module 220 moves outward from the vacuum chuck 120 (step S19 ). In this case, the lifting arm driving unit raises the lifting arm 222 , and the swing unit 223 rotates the lifting arm 222 , so that the ultrasonic cleaning unit 224 moves outward from the vacuum chuck 120 .

[0143] Determine whether the discharge of the cleaning fluid has ended (step S20). In this case, the control unit pre-sets a cleaning fluid discharge time. In addition, a discharge detection sensor (not shown) can be used to detect whether the cleaning fluid is completely discharged from the cup-shaped housing 105.

[0144] As the vacuum chuck unit 120 rotates, the wafer 10 is dried (step S21). In this case, no cleaning liquid is supplied to the cup-shaped housing 105. As the vacuum chuck unit 120 rotates, the cleaning liquid remaining on the wafer 10 is removed from the wafer 10 by centrifugal force. In this case, the wafer 10 can be rotated by the vacuum chuck unit 120 while the crystal grains 11 of the wafer 10 are enlarged. Therefore, the cleaning liquid remaining between the crystal grains 11 can be removed more quickly. In addition, as air or gas is sprayed onto the wafer 10, the drying of the wafer 10 can be accelerated.

[0145] The expander module 140 moves to restrain the annular cover 130 (step S22). In this state, the expander module 140 descends toward the vacuum chuck 120, and the hook 163 of the expander arm 160 faces the annular cover 130. As the expander head 150 moves the expander arm 160 inward, the hook body 164 contacts the annular cover 130, and the hook pin 165 of the hook 163 is inserted into the cover hole 135 of the annular cover 130, restraining the annular cover 130.

[0146] Chuck module 170 releases the restraint on annular cover 130 (step S23). In this case, when chuck rotating unit 175 rotates chuck base 171 by a certain angle, chuck link 180 moves toward the center of chuck base 171. As link gear 183 engages and drives with restraining gear 192, the cover restraining rod 193 and restraining roller 194 disengage from the restraining step 132 of annular cover 130. Even at the moment the restraint on annular cover 130 is released, the expander module 140 maintains its pressure on the annular cover 130.

[0147] The expander module 140 moves to the waiting position (step S24). As the expander moving unit 141 rises, the expander head 150 and expander arm 160 also rise. As the expander arm 160 rises while restraining the annular cover 130, the retaining ring 13 of the wafer 10 rises, while the bonding sheet 12 of the wafer 10 contracts to its original position. Consequently, the spacing between the dies 11 on the wafer 10 returns to its original position.

[0148] Wafer 10 is ejected from vacuum chuck 120 (step S25). In this process, transfer unit 250's transfer moving portion 251 moves toward both sides of vacuum chuck 120, and transfer elevator 253 descends. As transfer carrier 255 rotates, wafer 10 is carried on transfer carrier 255. Once transfer moving portion 251 reaches the wafer 10 ejection position, the transfer unit receives wafer 10 and ejects it outside chamber 102. The transfer unit then transfers wafer 10 to a wafer storage unit or to a subsequent process.

[0149] Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely illustrative and a person skilled in the relevant art will appreciate that various modifications and equivalent embodiments may be implemented.

[0150] Therefore, the true scope of protection of the present invention is defined by the following claims.

Claims

1. A substrate cleaning device, characterized in that: include: A vacuum chuck portion for placing wafers; an annular cover portion, facing the retaining ring portion of the wafer; an expander module, arranged in a manner capable of moving the annular cover portion and applying pressure to the retaining ring portion toward the vacuum chuck portion to expand the intervals between the grains in the wafer; as well as a chuck module disposed on the vacuum chuck portion to confine the annular cover portion to which the expander module applies pressure to the vacuum chuck portion; The expander module comprises: Expander head; as well as A plurality of expander arms are connected to the expander head and include hook pins for gripping the annular cover to move the annular cover and to be inserted into the outer side surface of the annular cover.

2. The substrate cleaning device according to claim 1, wherein: The expander module further includes an expander moving portion, which moves the expander head. The plurality of expander arms apply pressure to the annular cover portion, so that the chuck module constrains the annular cover portion to the vacuum chuck portion.

3. The substrate cleaning device according to claim 2, wherein: If the chuck module restrains the annular cover portion on the vacuum chuck portion, the expander arm portion releases the pressure applied to the annular cover portion.

4. The substrate cleaning device according to claim 2, wherein: The expander head comprises: an expander sleeve portion connected to the expander moving portion; A plurality of expander sliders are coupled to the expander sleeve in a radially movable manner and are respectively connected to the expander arm portions; an expander rod portion, disposed inside the expander sleeve portion, to move the plurality of expander slider portions; and The expander driving unit is disposed on the expander sleeve unit to move the expander rod unit.

5. The substrate cleaning device according to claim 4, wherein: The expander casing portion comprises: The sleeve body is formed with a moving space for the expander rod to move; a first baffle portion, sealing one side of the sleeve body portion; and The second baffle portion seals the other side of the sleeve main body portion and is formed with a movable hole portion for the expander rod portion to be movably inserted.

6. The substrate cleaning device according to claim 4, wherein: The expander rod portion includes: a movable disk portion movably disposed in the movable space portion of the expander sleeve portion; a plunger portion connected to the movable disk portion in a manner of being inserted into the movable hole portion of the expander sleeve portion; and The pusher is connected to the plunger and the expander slider so as to move the expander slider as the plunger moves.

7. The substrate cleaning device according to claim 4, wherein: The expander arm comprises: an arm member connected to the expander slider; and The hook portion is arranged on the arm member so as to restrict the annular cover portion.

8. A substrate cleaning device, characterized in that: include: A vacuum chuck portion for placing wafers; an annular cover portion, facing the retaining ring portion of the wafer; an expander module, arranged in a manner capable of moving the annular cover portion and applying pressure to the retaining ring portion toward the vacuum chuck portion to expand the intervals between the grains in the wafer; as well as a chuck module disposed on the vacuum chuck portion to confine the annular cover portion to which the expander module applies pressure to the vacuum chuck portion; The chuck module comprises: a chuck base, disposed on the vacuum chuck portion; a plurality of chuck connecting rods, each radially connected to the chuck base, wherein the plurality of chuck connecting rods move when the chuck base rotates; and A plurality of cover restricting parts are respectively connected to the chuck link part, and restrict the annular cover part to the vacuum chuck part or release the restriction of the annular cover part from the vacuum chuck part along the moving direction of the chuck link part.

9. The substrate cleaning device according to claim 8, wherein: The chuck module further includes a chuck rotating portion, which is connected to the chuck base to rotate the chuck base. The chuck base comprises: a base body portion formed in an annular shape so as to be concentric with the rotation axis of the vacuum chuck portion; a plurality of guide portions formed on the base body portion for movably engaging the chuck link portion; and The base gear portion is formed on the base body portion and is connected to the chuck rotating portion.

10. The substrate cleaning device according to claim 9, wherein: The guide portion is formed to be inclined with respect to a radial direction of the base body portion.

11. A control method for a substrate cleaning device, characterized in that: The control method of the substrate cleaning device according to claim 1 comprises the following steps: The expander module limits the annular cover portion; placing the wafer on the vacuum chuck; The expander module applies pressure to the annular cover to expand the intervals between the grains of the wafer; A chuck module constrains the annular cover portion to the vacuum chuck portion; and The ultrasonic cleaning module sprays cleaning liquid onto the wafer and applies ultrasonic waves to the cleaning liquid to cause the cleaning liquid to generate ultrasonic vibrations.

12. The control method of the substrate cleaning device according to claim 11, wherein: After the step of the chuck module restraining the annular cover portion on the vacuum chuck portion, the expander module further includes a step of releasing the restraint on the annular cover portion and moving to a waiting position.

13. The control method of the substrate cleaning device according to claim 11, wherein: The step of limiting the annular cover portion by the expander module comprises the following steps: The plurality of expander arms of the expander module move outward through the expander head; The hook portion of the expander arm portion corresponds to the annular cover portion; and As the plurality of expander arms move inwardly through the expander head, the hook portion restrains the annular cover portion.

14. The control method of the substrate cleaning device according to claim 11, wherein: In the step of spraying the cleaning liquid onto the wafer and applying ultrasonic waves to the cleaning liquid to cause the cleaning liquid to generate ultrasonic vibrations, the ultrasonic cleaning module applies ultrasonic waves to the cleaning liquid while being immersed in the cleaning liquid.

15. The control method of the substrate cleaning device according to claim 14, wherein: The step of spraying a cleaning liquid onto the wafer by the ultrasonic cleaning module and applying ultrasonic waves to the cleaning liquid to cause the cleaning liquid to generate ultrasonic vibrations includes the following steps: The lifting arm portion is raised by the lifting arm driving portion; The swing portion rotates the lifting arm portion toward the upper side of the vacuum chuck portion; The lifting arm driving unit lowers the lifting arm unit so that the cleaning head of the ultrasonic cleaning module is immersed in the cleaning liquid; as well as The cleaning liquid spraying unit sprays the cleaning liquid toward the wafer, and the ultrasonic wave generating unit generates ultrasonic vibrations in the cleaning liquid.

16. The control method of the substrate cleaning device according to claim 15, wherein: In the step in which the lifting arm driving unit lowers the lifting arm unit so that the cleaning head of the ultrasonic cleaning module is immersed in the cleaning liquid, the internal pressure forming unit forms a pressure higher than the atmospheric pressure inside the cleaning head, or the lower surface portion of the cleaning head is configured so that the inflow side of the cleaning liquid is higher than the outflow side of the cleaning liquid.

17. The control method of the substrate cleaning device according to claim 15, wherein: In the step of lowering the lift arm to immerse the cleaning head of the ultrasonic cleaning module in the cleaning liquid, the lift arm is lowered so that a predetermined distance is maintained between the cleaning head and the surface of the wafer.

18. The control method of the substrate cleaning device according to claim 11, wherein: The step of placing the wafer on the vacuum chuck portion comprises the following steps: The transfer unit receives the wafer from the conveying unit; The transfer unit moves toward the upper side of the vacuum chuck portion; and The transfer unit is lowered to place the wafer on the vacuum chuck portion.

19. The control method of the substrate cleaning device according to claim 18, wherein: It also includes the following steps: After the cleaning time of the wafer is over, draining the cleaning liquid; and As the vacuum chuck portion rotates, the wafer is dried.

20. The control method of the substrate cleaning device according to claim 18, wherein: It also includes the following steps: The expander module moves to restrict the annular cover; The chuck module releases the restriction on the annular cover; The expander module moves to a waiting position; and The wafer is ejected from the vacuum chuck portion.

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