Display component, manufacturing method thereof, and crack detection method

Abstract

A display component, a manufacturing method thereof, and a crack detection method belong to the field of display technology. The display component includes: a substrate, and a conductive layer and a peripheral circuit located on the substrate; the conductive layer includes at least one crack detection line located in the display area of the substrate, and at least a part of the at least one crack detection line is located in a flat area in the display area; the peripheral circuit is located in the non-display area of the substrate, and the peripheral circuit is electrically connected to the crack detection line and is used to provide a crack detection signal for crack detection of the display component to the crack detection line. The present application provides a solution for crack detection of a display component, and the present application is used for crack detection of the display component.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display component, a manufacturing method thereof, and a crack detection method. Background Art

[0002] With the development of display technologies, the demand and application scope of display components have been continuously expanding, and they are widely used in fields such as mobile phones, televisions, vehicle-mounted displays, wearable devices, tablet computers, laptop computers, commercial displays, etc.

[0003] A display component is composed of laminated film layers, and its manufacturing process may include processes such as evaporation coating, inkjet printing, and lamination. During the manufacturing process of the display component, it often happens that particulate matter falls on the film layer. Due to the presence of the particulate matter, cracks are likely to appear in the film layer.

[0004] After cracks appear in the film layer of the display component, external moisture may penetrate into the display component through the cracks, further causing damage to the display component and resulting in low product reliability. Therefore, there is an urgent need for a solution for crack detection of the display component. Summary of the Invention

[0005] The present application provides a display component, a manufacturing method thereof, and a crack detection method, which can provide a solution for crack detection of the display component. The technical solution is as follows:

[0006] In a first aspect, a display component is provided, including: a substrate, and a conductive layer and a peripheral circuit located on the substrate;

[0007] The conductive layer includes at least one crack detection line located in the display area of the substrate, and at least a part of the at least one crack detection line is located in a flat area in the display area;

[0008] The peripheral circuit is located in the non-display area of the substrate, and the peripheral circuit is electrically connected to the crack detection line for providing a crack detection signal for crack detection of the display component to the crack detection line.

[0009] Optionally, the at least one crack detection line includes a plurality of crack detection lines;

[0010] The display area of the substrate includes a plurality of sub-areas corresponding one-to-one to the plurality of crack detection lines, and the crack detection line is located in the corresponding sub-area.

[0011] Optionally, the display component satisfies at least one of the following conditions:

[0012] The display component further includes: a support layer located on the substrate; the support layer includes a plurality of support pillars, the conductive layer is located on a side of the support layer away from the substrate, and a positive projection of the at least one crack detection line on the substrate passes through a positive projection of at least one of the support pillars on the substrate;

[0013] In addition, the positive projection of the crack detection line on the substrate is located between sub-pixel regions within the display area.

[0014] Optionally, the display component further includes: an insulating layer and a touch electrode layer located on the substrate; the touch electrode layer, the insulating layer, and the conductive layer are stacked in sequence;

[0015] The touch electrode layer includes: touch electrode strips, a first touch electrode block, and a second touch electrode block; the first touch electrode block and the second touch electrode block are respectively located on both sides of the touch electrode strip, and there are intervals between them and the touch electrode strip;

[0016] The conductive layer further includes: a conductive bridge connecting the first touch electrode block and the second touch electrode block; the crack detection line is insulated from the touch electrode layer;

[0017] The insulating layer includes: insulating blocks, which are located between the touch electrode strips and the conductive bridges and are used to insulate the conductive bridges and the touch electrode strips.

[0018] Optionally, the peripheral circuit includes: a first control unit and a first input unit, and a first switch unit corresponding to each crack detection line. The display component further includes: a plurality of data lines located on the substrate;

[0019] The first control unit is connected to the control end of the first switch unit, and the first control unit is used to provide a first conduction signal and a first turn-off signal for the switch unit;

[0020] The first input unit is connected to one end of the crack detection line, and the first input unit is used to provide the crack detection signal when the first switch unit is turned on;

[0021] For the first switch unit corresponding to one crack detection line, the first end of the first switch unit is connected to the other end of the crack detection line, and the second end of the first switch unit is connected to one data line; the crack detection signal is used to drive the sub-pixels connected to the data line to be in a bright state or a dark state.

[0022] Optionally, the display component further includes: a pixel circuit layer located on the substrate; the conductive layer is located between the pixel circuit layer and the substrate, and the conductive layer blocks light.

[0023] For the active layer of at least one thin film transistor in the pixel circuit layer, the orthographic projection of the active layer on the substrate is located within the orthographic projection of the conductive layer on the substrate.

[0024] The peripheral circuit is further configured to provide a shielding signal to the crack detection line when the crack detection signal is not provided to the crack detection line, and the shielding signal is used to shield the charges located on the side of the thin film transistor close to the substrate outside the thin film transistor.

[0025] Optionally, the peripheral circuit includes: a first control unit and a first input unit, and a first switch unit corresponding to each crack detection line, and the display component further includes: a plurality of data lines located on the substrate.

[0026] The first control unit is connected to the control end of the first switch unit, and the first control unit is configured to provide a first conduction signal and a first turn-off signal for the switch unit.

[0027] The first input unit is connected to one end of the crack detection line, and the first input unit is configured to provide the crack detection signal when the first switch unit is turned on, and provide the shielding signal when the first switch unit is turned off.

[0028] For the first switch unit corresponding to one crack detection line, the first end of the first switch unit is connected to the other end of the crack detection line, and the second end of the first switch unit is connected to one data line; the crack detection signal is used to drive the sub-pixel connected to the data line to be in a bright state or a dark state.

[0029] Optionally, the peripheral circuit further includes: a second control unit and a second input unit, and a second switch unit corresponding to each crack detection line.

[0030] The second control unit is connected to the control end of the second switch unit, and the second control unit is configured to provide a second conduction signal and a second turn-off signal for the switch unit; the first switch unit and the second switch unit are not turned on simultaneously.

[0031] The second input unit is connected to the first end of the second switch unit, the second end of the second switch unit is connected to the other end of the crack detection line, and the second input unit is configured to provide the shielding signal when the second switch unit is turned on.

[0032] Optionally, the peripheral circuit further includes: a plurality of third switch units.

[0033] The first control unit is further connected to the control end of the third switch unit.

[0034] The first end of the third switch unit is connected to the first input unit, and the second end of the third switch unit is connected to one of the data lines.

[0035] In the peripheral circuit, different switch units are connected to different data lines, and the multiple third switch units are connected to the data lines among the multiple data lines that are not connected to the first switch unit; the crack detection signal is used to drive the sub-pixels connected to the data lines to be in a dark state.

[0036] Optionally, the peripheral circuit includes: a first input unit and a signal receiving unit;

[0037] The first input unit is connected to one end of the crack detection line, and the first input unit is used to provide the crack detection signal;

[0038] The signal receiving unit is connected to the other end of the crack detection line, and the signal receiving unit is used to receive the crack detection signal passing through the crack detection line and determine whether there is a crack in the display component according to the received signal.

[0039] In a second aspect, a manufacturing method of a display component is provided, which is used to manufacture any display component provided in the first aspect. The method includes:

[0040] Providing a substrate;

[0041] Forming a conductive layer and a peripheral circuit on the substrate;

[0042] Wherein, the conductive layer includes at least one crack detection line located in the display area of the substrate, and at least a part of the at least one crack detection line is located in the flat display area of the substrate;

[0043] The peripheral circuit is located in the non-display area of the substrate, and the peripheral circuit is electrically connected to the crack detection line and is used to provide a crack detection signal for crack detection of the display component to the crack detection line.

[0044] In a third aspect, a crack detection method of a display component is provided, and the display component is any display component provided in the first aspect. The method includes:

[0045] In the detection stage, the peripheral circuit provides a crack detection signal for crack detection of the display panel to the crack detection line.

[0046] Optionally, the peripheral circuit includes: a first control unit, a first input unit, and a first switch unit corresponding to each crack detection line. The display component further includes: a plurality of data lines located on the substrate. The first control unit is connected to the control end of the first switch unit. The first input unit is connected to one end of the crack detection line. For the first switch unit corresponding to the crack detection line, the first end of the first switch unit is connected to the other end of the crack detection line, and the second end of the first switch unit is connected to one of the data lines. The crack detection signal is used to drive the sub-pixels connected to the data line to be in a bright state or a dark state.

[0047] The peripheral circuit provides a crack detection signal for detecting cracks in the display panel to the crack detection line, including:

[0048] The first control unit provides a first conduction signal for the switch unit;

[0049] When the first switch unit is turned on, the first input unit provides the crack detection signal.

[0050] Optionally, the display component further includes: a pixel circuit layer located on the substrate. The conductive layer is located between the pixel circuit layer and the substrate, and the conductive layer shields light. For the active layer of at least one thin film transistor in the pixel circuit layer, the orthographic projection of the active layer on the substrate is located within the orthographic projection of the conductive layer on the substrate.

[0051] Optionally, the peripheral circuit includes: a first control unit, a first input unit, and a first switch unit corresponding to each crack detection line. The display component further includes: a plurality of data lines located on the substrate. The first control unit is connected to the control end of the first switch unit. The first input unit is connected to one end of the crack detection line. For the first switch unit corresponding to the crack detection line, the first end of the first switch unit is connected to the other end of the crack detection line, and the second end of the first switch unit is connected to one of the data lines. The crack detection signal is used to drive the sub-pixels connected to the data line to be in a bright state or a dark state.

[0052] The peripheral circuit provides a crack detection signal for detecting cracks in the display panel to the crack detection line, including:

[0053] The first control unit provides a first conduction signal for the switch unit;

[0054] When the first switch unit is turned on, the first input unit provides the crack detection signal;

[0055] The method further includes:

[0056] During the shielding stage, the first control unit provides a first turn-off signal for the switching unit;

[0057] When the first switching unit is turned off, the first input unit provides a shielding signal for shielding the charges outside the thin film transistor on the side of the thin film transistor close to the substrate.

[0058] Optionally, the peripheral circuit includes: a first input unit and a signal receiving unit; the first input unit is connected to one end of the crack detection line, and the signal receiving unit is connected to the other end of the crack detection line;

[0059] The peripheral circuit provides a crack detection signal for detecting cracks in the display panel to the crack detection line, including:

[0060] The first input unit provides the crack detection signal;

[0061] The method further includes:

[0062] During the detection stage, the signal receiving unit receives the crack detection signal passing through the crack detection line;

[0063] The signal receiving unit determines whether there is a crack in the display component according to the received signal.

[0064] In summary, the present application provides a display component, a manufacturing method thereof, and a crack detection method. The display component includes a conductive layer, and at least one crack detection line is provided in the conductive layer. At least a part of the at least one crack detection line is located in a flat area of the display area of the substrate and is connected to a peripheral circuit located in the non-display area of the substrate. By sending a crack detection signal to the crack detection line through the peripheral circuit, crack detection of the display component can be realized. In this way, it is possible to detect whether there is a crack in the display component, and then screen out the display components with cracks during factory production to prevent the display components with cracks from entering the market and improve the reliability of the display components in the market. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1 is a schematic structural diagram of an OLED panel provided by an embodiment of the present application;

[0066] Figure 2 is a top view of a display component provided by an embodiment of the present application;

[0067] Figure 3 provided by an embodiment of the present application Figure 2 is a cross-sectional view of the display component shown;

[0068] Figure 4 Schematic diagram of sub - region division of a display component provided by an embodiment of the present application;

[0069] Figure 5 Schematic diagram of the routing of crack detection lines of a display component provided by an embodiment of the present application;

[0070] Figure 6 Schematic diagram of the positional relationship between a crack detection line and a support column provided by an embodiment of the present application;

[0071] Figure 7 Another schematic diagram of the positional relationship between a crack detection line and a support column provided by an embodiment of the present application;

[0072] Figure 8 Schematic diagram of a sub - pixel region provided by an embodiment of the present application;

[0073] Figure 9 Another cross - sectional view of a display component provided by an embodiment of the present application;

[0074] Figure 10 Provided by an embodiment of the present application Figure 9 Top view of the display component shown;

[0075] Figure 11 Another cross - sectional view of a display component provided by an embodiment of the present application;

[0076] Figure 12 Schematic diagram of the BSM layer within a sub - region provided by an embodiment of the present application;

[0077] Figure 13 Schematic diagram of the crack detection lines formed by the BSM layer within a sub - region provided by an embodiment of the present application;

[0078] Figure 14 Provided by an embodiment of the present application Figure 13 Enlarged schematic diagram of region B in;

[0079] Figure 15 Schematic diagram of a peripheral circuit provided by an embodiment of the present application;

[0080] Figure 16 Another schematic diagram of a peripheral circuit provided by an embodiment of the present application;

[0081] Figure 17 Another schematic diagram of a peripheral circuit provided by an embodiment of the present application;

[0082] Figure 18 Another schematic diagram of a peripheral circuit provided by an embodiment of the present application;

[0083] Figure 19 Schematic diagram of another peripheral circuit provided by an embodiment of the present application;

[0084] Figure 20 Schematic diagram of another peripheral circuit provided by an embodiment of the present application;

[0085] Figure 21 Schematic diagram of another peripheral circuit provided by an embodiment of the present application;

[0086] Figure 22 Flow chart of a manufacturing method of a display component provided by an embodiment of the present application;

[0087] Figure 23 Schematic diagram of a manufacturing process of a display component provided by an embodiment of the present application;

[0088] Figure 24 Schematic diagram of a manufacturing process of another display component provided by an embodiment of the present application;

[0089] Figure 25 Flow chart of a crack detection method provided by an embodiment of the present application;

[0090] Figure 26 Flow chart of another crack detection method provided by an embodiment of the present application;

[0091] Figure 27 Flow chart of another crack detection method provided by an embodiment of the present application. Detailed implementation manners

[0092] To make the principles, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0093] The display component is composed of laminated films. The display component can be a display panel, or an array substrate in the display panel. The display panel can be any product or component with a display function, such as a liquid crystal panel, an organic light-emitting diode (OLED) panel, a light-emitting diode (LED) panel, an electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc. The display component can be a foldable display component, a fully flexible display component or a stretchable display component.

[0094] The manufacturing process of the display component may include processes such as evaporation coating, ink jet printing (IJP), and lamination. During the manufacturing process of the display component, the films in the display component are prone to cracks, resulting in cracks in the display component and affecting the reliability of the display component.

[0095] Take an OLED panel with a display component of Flexible Multi Layer On Cell (FMLOC) as an example. As Figure 1 shown, the OLED panel 1 includes: a substrate substrate 11, a Bottom Shelter Metal (BSM) layer 12, a pixel circuit layer 13, an OLED layer 14, a support layer 15, a planarization layer 16, a first touch electrode layer 17, an insulating layer 18, a second touch electrode layer 19, and a cover plate 20, which are stacked in sequence. Among them, the substrate substrate 11 includes a Polyimide (PI) layer, a Barrier layer, and a Buffer layer ( Figure 1 not shown in the figure) stacked in sequence along the direction close to the BSM layer 12. The OLED layer 14 includes a pixel definition layer 141 and an OLED 142 located between the pixel dielectric layers 141; the support layer 15 includes a plurality of Post Space (PS) 151. The first touch electrode layer 17 and the second touch electrode layer 19 are insulated by the insulating layer 18, and the first touch electrode layer 17 and the second touch electrode layer 19 form a mutual capacitance type touch electrode. The first touch electrode layer 17 can be referred to as touch metal A (TMA), and the second touch electrode layer 19 can be referred to as touch metal B (TMB).

[0096] There are various reasons for cracks to occur in the OLED panel 1.

[0097] Exemplarily, before preparing the above-mentioned OLED 142, the above-mentioned support pillar 151 is first formed, and then the above-mentioned OLED 142 is prepared using a Fine Metal Mask (FMM). During this process, the support pillar 151 is located between the substrate 11 and the FMM, and the support pillar 151 is relatively easily scratched by the FMM. Subsequently, a first partial film layer (which can be referred to as the CVD1 layer) of the flat layer 16 for encapsulating the OLED 142 is formed by Chemical Vapor Deposition (CVD) in sequence, and a second partial film layer (which can be referred to as the IJP layer) of the flat layer 16 for encapsulating the OLED 142 is formed by IJP, and a third partial film layer (which can be referred to as the CVD2 layer) of the flat layer 16 for encapsulating the OLED 142 is formed by CVD. During the process of forming the CVD1 layer by CVD, the scratched support pillar 151 will be further coated and form support pillar particles (PS Particles). When the height of the support pillar particles is too large, during the subsequent process of forming the IJP layer by IJP, the support pillar particles cannot be effectively coated, resulting in the surface of the IJP layer away from the substrate 11 being uneven, and further the surface of the flat layer 16 away from the substrate 11 being uneven. After the flat layer 16 is prepared, the entire combination of the first touch electrode layer 17, the insulating layer 18, the second touch electrode layer 19, and the cover plate 20 can be attached to the surface of the flat layer 16 away from the substrate 11. Since the surface of the flat layer 16 away from the substrate 11 is uneven, there is a risk that the film layers above the support pillar particles will be cracked during this attachment process.

[0098] Exemplarily again, when preparing the substrate 11, a PI layer, a barrier layer, and a buffer layer can be provided respectively, and then the PI layer, the barrier layer, and the buffer layer are attached using processes such as Bottom Film (BF) process, Bottom Protection Film (BPF), u-Film process, Super Clean Foam (SCF) process, etc. During this process, particles will inevitably appear on the machine platform where these film layers are attached and on these film layers, and these particles will also damage these film layers, thereby causing cracks in these film layers.

[0099] According to the above content, some film layers in the OLED panel are prone to cracks. If there is a crack in one film layer of the OLED panel, during subsequent manufacturing and use, this crack will penetrate into other film layers of the OLED panel. In this way, external moisture and the like may penetrate into the OLED display panel through the crack, causing the OLED display panel to deteriorate further and generate Growing Dark Spots (GDS), rendering the OLED display panel unable to work properly. Therefore, there is an urgent need for a solution to detect cracks in the display component.

[0100] An embodiment of the present application provides a display component, which includes a Panel Crack Detection (PCD) line and a peripheral circuit, and the peripheral circuit can transmit a crack detection signal for detecting cracks in the display component to the crack detection line. Therefore, the detection of cracks in the display component can be realized, and then the display components with cracks can be screened out during factory production to prevent the display components with cracks from entering the market.

[0101] Exemplarily, Figure 2 is a top view of a display component 0 provided by an embodiment of the present application. Figure 3 is provided by an embodiment of the present application Figure 2 A schematic diagram of the middle cross-section PP'. Please refer to Figure 2 and Figure 3 The display component 0 provided by an embodiment of the present application may include: a substrate 01, and a conductive layer 02 and a peripheral circuit 03 located on the substrate. The material of the conductive layer 02 may be a conductive material such as a metal (such as molybdenum, silver, copper, titanium, aluminum, etc.) or a non-metal (such as indium tin oxide, titanium nitride, etc.).

[0102] The conductive layer 02 includes at least one crack detection line 021 located within the Active Area (AA) 011 of the substrate 01. Figure 2 and Figure 3 Taking the display component 0 shown in

[0103] as an example where the conductive layer 02 includes one crack detection line 021, it can be understood that the number of crack detection lines in the display component 0 can also be greater than 1, and the embodiment of the present application does not limit this.

[0104] Figure 2 and Figure 3In the display component 0 shown, the entire display area 011 of the base substrate 01 is a flat area, and the crack detection line 021 is entirely located in the flat area. It is understandable that the display area 011 of the base substrate 01 may also include a flat area and a non-flat area, and a portion of the crack detection line 021 is located in the flat area, and another portion is located in the non-flat area. Alternatively, the display area 011 of the base substrate 01 may also include a flat area and a non-flat area, and the crack detection line 021 is entirely located in the flat area, which is not limited in the embodiments of the present application. In addition, the shape of the crack detection line 021 varies, Figure 2 Only one shape is taken as an example.

[0105] Please continue to refer to the above Figure 2 and Figure 3 , the peripheral circuit 03 is located in the non-display area 012 of the base substrate 01, and the peripheral circuit 03 is electrically connected to the crack detection line 021. The peripheral circuit 03 is used to provide a crack detection signal for crack detection of the display component 0 to the crack detection line 021. The electrical connection between the peripheral circuit 03 and the crack detection line 021 means that the peripheral circuit 03 is connected to the crack detection line 021, and an electrical signal can be transmitted between the peripheral circuit 03 and the crack detection line 021 based on the connection. The crack detection signal is an electrical signal.

[0106] It should be noted that if the crack detection line is broken, the crack detection signal cannot be effectively transmitted on the crack detection line. By detecting whether the crack detection signal can be effectively transmitted on the crack detection line, it can be determined whether the crack detection line is broken. When it is determined that the crack detection line is broken, it can be determined that a crack appears in the area where the crack detection line passes through the display component, thereby realizing crack detection of the display component.

[0107] In summary, the display component provided in the embodiment of the present application includes a conductive layer, and at least one crack detection line is provided in the conductive layer. At least part of the at least one crack detection line is located in the flat area of the display area of the substrate, and is connected to the peripheral circuit located in the non-display area of the substrate. By transmitting a crack detection signal to the crack detection line through the peripheral circuit, crack detection of the display component can be achieved. In this way, it is possible to detect whether there are cracks in the display component, and then the display components with cracks can be screened when leaving the factory to avoid the display components with cracks from entering the market, thereby improving the reliability of the display components in the market.

[0108] For further information, please refer to Figure 4 The display area 011 of the base substrate 01 includes a plurality of sub-areas 0111. Figure 4Taking the display area 011 including three rows and two columns of sub-areas 0111 as an example. Optionally, the multiple sub-areas 0111 in the display area 011 may not include the three-row and two-column sub-areas 0111. For example, the multiple sub-areas 0111 may include two-row and two-column sub-areas 0111, four-row and three-column sub-areas 0111, etc. In addition, Figure 4 Taking the shape of the sub-area 0111 as a rectangle as an example, the shape of the sub-area 0111 may also be other shapes, such as circular, hexagonal, annular, etc. The embodiments of the present application do not limit the shape of the sub-area 0111.

[0109] When the display area 011 of the substrate 01 includes multiple sub-areas 0111, please refer to Figure 5 , at least one of the above crack detection lines 021 may include multiple crack detection lines 021 corresponding one-to-one to the multiple sub-areas 0111. The crack detection line 021 is located within the corresponding sub-area 0111. As Figure 5 shown, the at least one crack detection line 021 includes six crack detection lines 021, and these six crack detection lines 021 are correspondingly located within the above three-row and two-column sub-areas 0111.

[0110] Since cracks may appear at various positions in the display component, the display area of the substrate 01 can be divided into the above multiple sub-areas 0111, and a crack detection line 021 is provided within each sub-area 0111. When a crack appears in a sub-area 0111 of the display component, a crack detection signal is provided to the crack detection line 021 within the sub-area 0111 through the peripheral circuit 03 to detect whether there is a crack within the sub-area, so that the position where the crack appears can be accurately located within the sub-area 0111 in the display area.

[0111] In the embodiments of the present application, the position of the crack detection line on the substrate may be related to at least one film layer in the display component. The following will take the position being related to the support layer in the display component and the sub-pixel area in the substrate as an example for explanation.

[0112] (1) The position of the crack detection line on the substrate is related to the support layer in the display component.

[0113] Exemplarily, in the foregoing embodiments, the display component 0 includes a substrate 01, a conductive layer 02, and a peripheral circuit 03. On this basis, as Figure 6 shown, the display component 0 further includes a support layer 04 located on the substrate 01; the support layer 04 includes multiple support columns 041, the conductive layer 02 is located on the side of the support layer 04 away from the substrate 01, and the orthographic projection of at least one crack detection line 021 on the substrate 01 passes through the orthographic projection of at least one support column 041 on the substrate 01.

[0114] Figure 6 Taking as an example that the orthographic projection of a crack detection line 021 on a substrate 01 passes through the orthographic projections of two support columns 041 on the substrate 01. It can be understood that it can also be that the orthographic projection of a crack detection line 021 on the substrate 01 passes through the orthographic projections of all support columns 041 on the substrate 01; or, the orthographic projections of multiple crack detection lines 021 on the substrate 01 pass through the orthographic projections of different support columns 041 on the substrate 01, and the orthographic projection of each crack detection line 021 on the substrate 01 passes through the orthographic projections of multiple support columns 041 on the substrate 01.

[0115] Exemplarily, as described above Figure 5 shown, when the display area 011 of the substrate 01 includes multiple sub-regions 0111, and the above-mentioned crack detection lines 021 are arranged in each sub-region 0111, the arrangement of the crack detection lines 021 and the support columns 041 in a sub-region 0111 can be as Figure 7 shown. Please refer to Figure 7 , there are 32 support columns 041 arranged on the sub-region 0111, and there is a crack detection line 021 arranged on the sub-region 0111. The crack detection line 021 is serpentine, and the orthographic projection of the crack detection line 021 on the substrate 01 sequentially passes through the orthographic projections of the 32 support columns on the substrate 01. Optionally, the number of support columns 041 on the sub-region 0111 may not be 32 either. For example, the number of support columns 041 on the sub-region 0111 may be 20 or 40, etc. Additionally, it can also be that the orthographic projections of some crack detection lines 021 on the substrate 01 pass through the orthographic projections of some support columns 041 on the substrate 01.

[0116] According to the foregoing content, it can be known that when the display component includes a support layer, if the support columns in the support layer are scratched during the manufacturing process of the display component, cracks are likely to appear at the positions of the support columns in the display component. In the embodiments of the present application, there is a crack detection line 021 whose orthographic projection on the substrate 01 passes through the orthographic projection of the support column 041 on the substrate 01. In this way, a crack detection signal can be provided to the crack detection line 021 through the peripheral circuit 03 to detect whether there are cracks at the position of the support column 041 in the display component.

[0117] Optionally, the display component may not include a support layer either. Additionally, when the display component includes a support layer, the orthographic projections of all crack detection lines on the substrate may not pass through the orthographic projection of the support layer on the substrate.

[0118] (2) The position of the crack detection line on the substrate is related to the sub-pixel region in the substrate.

[0119] The orthographic projection of the crack detection line on the substrate can be located between the sub-pixel regions within the display area. Exemplarily, as described above Figure 5 As shown, in the display area 011 of the substrate 01, there are multiple sub-regions 0111, and when the above-mentioned crack detection line 021 is disposed in each sub-region 0111, the arrangement of multiple sub-pixel regions 01111 and support pillars 041 within one sub-region 0111 can be as Figure 8 shown. The support pillars 041 can be disposed between these sub-pixel regions 01111. The setting position of the crack detection line 021 on this sub-region 0111 can be as Figure 7 shown. It can be seen that the crack detection line 021 is disposed between these sub-pixel regions 01111.

[0120] Figure 8 In [0000302], taking the sub-pixel region 01111 as a diamond sub-pixel region as an example, it can be understood that the shape of the sub-pixel region 01111 can also be different from the Figure 8 shape shown. For example, the shape of the sub-pixel region 01111 can be rectangular or hexagonal, etc. The embodiments of the present application do not make any limitations thereto.

[0121] It should be noted that when the crack detection line 021 is located in the light-emitting direction of the light-emitting layer on the sub-pixel region of the substrate 01, if the orthographic projection of the crack detection line 021 on the substrate 01 is located on the sub-pixel region and the crack detection line 021 blocks light, the crack detection line 021 will block the light emitted by the light-emitting layer. However, in the embodiments of the present application, the orthographic projection of the crack detection line 021 on the substrate 01 is located between the sub-pixel regions. When the crack detection line 021 is located in the light-emitting direction of the light-emitting layer on the sub-pixel region of the substrate 01, the crack detection line 021 will not block the light emitted by the light-emitting layer. Therefore, even if the crack detection line 021 blocks light, it will not affect the display effect of the display component.

[0122] It can be understood that when the crack detection line 021 is not located in the light-emitting direction of the light-emitting layer on the sub-pixel region of the substrate 01, the orthographic projection of the crack detection line 021 on the substrate 01 can be located between the sub-pixel regions within the display area, or the orthographic projection of the crack detection line 021 on the substrate 01 may not be located between the sub-pixel regions within the display area. The embodiments of the present application do not make any limitations thereto.

[0123] Furthermore, in the embodiments of the present application, there are various implementation manners for the conductive layer. The conductive layer can be a newly added film layer in the display component, or can be implemented by multiplexing a certain film layer in the display component. The embodiments of the present application do not make any limitations thereto. Hereinafter, an example will be given by taking the conductive layer implemented by multiplexing the film layer for touch control or the BSM layer in the display component.

[0124] (1) The conductive layer is multiplexed to implement the film layer for touch control.

[0125] Exemplarily, please refer to Figure 9 , the display component 0, on the basis of including the substrate 01, the conductive layer 02 and the peripheral circuit ( Figure 9 not shown in the figure), further includes an insulating layer 05 and a touch electrode layer 06 located on the substrate 01, and the substrate 01, the conductive layer 02, the insulating layer 05 and the touch electrode layer 06 are stacked in sequence.

[0126] It should be noted that Figure 9 only the substrate 01, the conductive layer 02, the insulating layer 05 and the touch electrode layer 06 in the display component 0 are shown in the figure. It can be understood that the display component 0 may further include other film layers except the substrate 01, the conductive layer 02, the insulating layer 05 and the touch electrode layer 06, and the embodiments of the present application do not limit this.

[0127] Figure 10 This is a top view of a partial area of a display component 0 provided by an embodiment of the present application. Figure 9 It shows Figure 10 the structure of the cross-section NN' in the figure. Please refer to Figure 9 and Figure 10 , the touch electrode layer 06 includes: touch electrode strips 061, a first touch electrode block 062 and a second touch electrode block 063. The first touch electrode block 062 and the second touch electrode block 063 are respectively located on both sides of the touch electrode strip 061, and there is a gap between them and the touch electrode strip 061. The conductive layer 02 includes: the above-mentioned crack detection line 021, and a conductive bridge 022 connecting the first touch electrode block 062 and the second touch electrode block 063. The insulating layer 05 includes: an insulating block 051, and the insulating block 051 is located between the touch electrode 061 and the conductive bridge 022 for insulating the conductive bridge 022 and the touch electrode strip 061. It should be noted that the crack detection line 021 is also insulated from the touch electrode layer 06, for example, the crack detection line 021 and the touch electrode layer 06 are insulated through the insulating layer 05.

[0128] According to the above content, the first touch electrode block 062, the conductive bridge 022, and the second touch electrode block 063 are connected in sequence to form a touch electrode. The above touch electrode strip 061 forms another touch electrode. Among these two touch electrodes, one touch electrode can be called the TX touch electrode, and the other touch electrode can be called the RX touch electrode. The TX touch electrode and the RX touch electrode cross and are insulated from each other, and a capacitance is formed at the position where the TX touch electrode and the RX touch electrode cross. When this crossed position is touched, the magnitude of the capacitance changes. Therefore, touch detection can be achieved by detecting the magnitude of the capacitance at this position. In the embodiment of the present application, the conductive layer 02 simultaneously includes the above crack detection line 021 and the conductive bridge 022. In this way, the film layer for touch can be reused to implement the conductive layer 02, and the functions of crack detection and touch detection can be simultaneously realized by using the conductive layer 02.

[0129] The orthographic projection of the crack detection line 021 on the substrate can be located between the sub-pixel regions within the display area; the orthographic projection of the above touch electrode layer 06 on the substrate can also be located between the sub-pixel regions within the display area. At this time, the orthographic projection of the crack detection line 021 on the substrate 01 can be located within the orthographic projection of the touch electrode layer 06 on the substrate.

[0130] Taking Figure 1 the shown OLED display panel as an example, in the embodiment of the present application, the first touch electrode layer 17 for touch in Figure 1 can be reused to implement the conductive layer 02.

[0131] (2) The conductive layer is implemented by reusing the BSM layer.

[0132] Exemplarily, as Figure 11 shown, the display component 0 provided in the embodiment of the present application, on the basis of including the substrate 01, the conductive layer 02, and the peripheral circuit ( Figure 11 not shown in Figure 11 ), further includes: a pixel circuit layer 07 located on the substrate 01; the conductive layer 02 is located between the pixel circuit layer 07 and the substrate 01, and the conductive layer 02 blocks light; for the active layer ( Masked thin film transistor not shown in

[0133] The BSM layer can shield the active layer in the thin-film transistor and can also shield the charges outside the thin-film transistor on the side of the thin-film transistor close to the substrate when a shielding signal is applied, thereby effectively improving the characteristics of the thin-film transistor and enhancing the display effect of the display component, such as reducing the afterimage of the display component.

[0134] It should be noted that the display component 0 includes a plurality of sub-pixels, and the above pixel circuit layer 07 includes a plurality of pixel circuits. The plurality of sub-pixels and the plurality of pixel circuits correspond one by one, and each sub-pixel includes a corresponding pixel circuit. The pixel circuit is used to drive the corresponding sub-pixel to emit light. The pixel circuit includes at least one thin-film transistor. Optionally, the pixel circuit may further include a capacitor and the like. Generally, the performance of the active layer of the thin-film transistor may change under light irradiation. In the embodiment of the present application, for the active layer of at least one thin-film transistor in the pixel circuit layer 07, the orthographic projection of the active layer on the substrate 01 is located within the orthographic projection of the conductive layer 02 on the substrate 01, and the conductive layer 02 shields light. In this way, the active layer can be shielded by the conductive layer 02, thereby preventing the performance of the thin-film transistor where the active layer is located from changing and improving the stability of the thin-film transistor.

[0135] When the conductive layer is implemented by multiplexing the BSM layer, the arrangement of the conductive layer on the substrate is diverse. The following will be combined with Figure 12 、 Figure 13 and Figure 14 to give an example of an implementable manner of this arrangement.

[0136] Exemplarily, when the BSM layer is not multiplexed as the conductive layer, the top view of the BSM layer on a sub-region 0111 in the substrate can be as shown in Figure 12 . Please refer to Figure 12 . The BSM layer includes a plurality of light-shielding blocks 0211 and a plurality of connection lines 0212. The above plurality of light-shielding blocks 0211 correspond one by one to the driving thin-film transistors (not shown in the figure) in the plurality of pixel circuits. For a light-shielding block 0211 and its corresponding driving thin-film transistor, the orthographic projection of the active layer in the driving thin-film transistor on the substrate is located within the orthographic projection of the light-shielding block 0211 on the substrate, so that the light-shielding block 0211 can shield the active layer.

[0137] When the BSM layer is multiplexed as the conductive layer in the present application, a part of the connection lines 0212 in the BSM layer can be segmented so that the connection lines 0212 and the plurality of light-shielding blocks 0211 in the BSM layer are connected to form a crack detection line on the sub-region 0111. For example, after segmenting the connection lines 0212 in the BSM layer shown in Figure 12 , the trend of the crack detection line formed by connecting the connection lines 0212 and the plurality of light-shielding blocks 0211 can be as shown inFigure 13 As shown. In this case, if Figure 12 the connection line 0212 in region B in Figure 14 is segmented as shown Figure 13 then a part within region B of the crack detection trace shown can be formed.

[0138] Furthermore, there are multiple implementable ways for the peripheral circuit provided in the embodiments of the present application. The following will take some implementable ways of the peripheral circuit as examples for explanation.

[0139] (1) The first implementable way of the peripheral circuit.

[0140] As Figure 15 shown, the peripheral circuit 03 includes: a first control unit 031, a first input unit 032, and a first switch unit 033 corresponding to each crack detection line 021. The display component 0 further includes: a plurality of data lines D located on the substrate 01. The first control unit 031 can be referred to as a lighting test control switch (Cell Test Switch, CTSW) unit.

[0141] Among them, the first control unit 031 is connected to the control end 0331 of the first switch unit 033. The first control unit 031 is used to provide a first conduction signal and a first cut-off signal for the switch unit (such as the first switch unit 033). Exemplarily, when the first control unit 031 provides the first conduction signal for the switch unit, the first switch unit 033 conducts. When the first control unit 031 provides the first cut-off signal for the switch unit, the first switch unit 033 cuts off.

[0142] The first input unit 032 is connected to one end of the crack detection line 021. The first input unit 032 is used to provide a crack detection signal when the first switch unit 033 conducts. Exemplarily, when the first control unit 031 provides the first conduction signal for the switch unit, the first switch unit 033 conducts; then, the first input unit 032 provides a crack detection signal so that the crack detection signal is input into the crack detection line 021 from one end of the crack detection line 021.

[0143] For a first switch unit 033 corresponding to a crack detection line 021, a first end 0332 of the first switch unit 033 is connected to the other end of the crack detection line 021, and a second end 0333 of the first switch unit 033 is connected to a data line D. Exemplarily, after a crack detection signal is input into the crack detection line 021, if the crack detection line 021 is not broken, the crack detection signal will be input into the first end 0332 of the first switch unit 033 from the other end of the crack detection line 021, and then transmitted from the second end 0333 of the first switch unit 033 to the data line D connected to the second end 0333. If the crack detection line 021 is broken, the crack detection signal cannot be transmitted to the data line D via the first switch unit 033.

[0144] The crack detection signal is used to drive the sub-pixels connected to the data line D to be in a bright state or a dark state.

[0145] If the crack detection signal is used to drive the sub-pixels connected to the data line D to be in a bright state, after the first switch unit 033 corresponding to a crack detection line 021 transmits the crack detection signal to the connected data line D, the sub-pixels connected to the data line D are in a bright state. If the crack detection line 021 is broken, the crack detection signal cannot be transmitted to the data line D via the first switch unit 033, and the sub-pixels connected to the data line D are in a dark state.

[0146] If the crack detection signal is used to drive the sub-pixels connected to the data line D to be in a dark state, after the first switch unit 033 corresponding to a crack detection line 021 transmits the crack detection signal to the connected data line D, the sub-pixels connected to the data line D are in a dark state. If the crack detection line 021 is broken, the crack detection signal cannot be transmitted to the data line D via the first switch unit 033, and the sub-pixels connected to the data line D are in a bright state.

[0147] In this way, it is possible to determine whether the crack detection line 021 is broken by the state of the sub-pixels connected to the data line D connected to the first switch unit 033 corresponding to the crack detection line 021. When it is determined that the crack detection line 021 is broken, it can be determined that there is a crack in the area where the crack detection line is located in the display component.

[0148] It should be noted that Figure 15Taking the example that a first switch unit 033 is connected by a crack detection line 021, it can be understood that a crack detection line 021 can also connect multiple first switch units 033. Moreover, different first switch units 033 can be connected to different data lines D. When a crack detection line 021 connects multiple first switch units 033, if the crack detection line 021 is not broken, multiple columns of sub-pixels connected by multiple data lines D connected to the multiple first switch units 033 can all be in the bright state or the dark state under the drive of the crack detection signal. In this way, it is more convenient to judge whether the crack detection line is broken according to the states of multiple columns of sub-pixels.

[0149] In addition, Figure 15 Taking the example that the first control unit 031 in [[ ]] is connected to the control terminals 0331 of all the first switch units 033. Optionally, it can also be that the first control unit 031 includes multiple first control sub-units ( Figure 15 not shown in [[ ]], such as two first control sub-units), and multiple first switch units 033 can include multiple groups of first switch units 033 corresponding one-to-one to the multiple first control sub-units. The control terminal of each group of first switch units 033 is connected to the first control sub-unit corresponding to this group of first switch units 033.

[0150] Taking the example that the peripheral circuit includes two first control sub-units and two groups of first switch units 033 corresponding one-to-one to the two first control sub-units. The two first control sub-units can be symmetrically distributed about an axis of symmetry of the display area, and the two groups of first switch units 033 can also be symmetrically distributed about the axis of symmetry. Moreover, each first control sub-unit and the corresponding group of first switch units 033 are located on the same side of the axis of symmetry.

[0151] The above-mentioned first switch unit 033 can be any kind of switch, such as a thin film transistor (TFT) or a mechanical switch, etc.

[0152] (2) The second implementation manner of the peripheral circuit.

[0153] Based on the first implementation manner of the above-mentioned peripheral circuit, the peripheral circuit further includes: multiple third switch units. As Figure 16 shown, based on the peripheral circuit shown in [[ ]], the peripheral circuit further includes multiple third switch units 034. Figure 15 shown in [[ ]], the peripheral circuit further includes multiple third switch units 034.

[0154] The first control unit 031 is also connected to the control terminal 0341 of the third switch unit 034. The first end 0342 of the third switch unit 034 is connected to the first input unit 032, and the second end 0343 of the third switch unit 034 is connected to a data line D.

[0155] Different switching units in the peripheral circuit are connected to different data lines D. For example, different first switching units 033 are connected to different data lines D, and different third switching units 034 are also connected to different data lines D. Moreover, any first switching unit 033 and any third switching unit 034 are connected to different data lines D.

[0156] The above-mentioned multiple third switching units 034 are connected to the data lines D that are not connected to the first switching units 033 among the multiple data lines D. It can be seen that a part of the data lines in the display component are connected to the first switching units 033, and another part of the data lines are connected to the third switching units 034.

[0157] The crack detection signal can be used to drive the sub-pixels connected to the data lines to be in the dark state. In this way, after the first control unit 031 controls both the first switching unit 033 and the third switching unit 034 to be turned on, the first input unit 032 can sequentially input the crack detection signal to the data line D through the crack detection line 021 and the first switching unit 033, and input the crack detection signal to the data line D through the third switching unit 034. If there is no crack in the display component, all the sub-pixels connected to the data lines D are in the dark state. If there is a crack in the area where a certain crack detection line 021 is located in the display component, the crack detection signal cannot be sequentially transmitted to the data line D through the crack detection line 021 and the first switching unit 033 connected thereto, and the column of sub-pixels connected to the data line D is in the bright state. By observing the sub-pixels in the bright state, the area where the crack appears in the display component can be determined.

[0158] Of course, the crack detection signal can also be used to drive the sub-pixels connected to the data lines to be in the bright state. At this time, by observing the sub-pixels in the dark state, the area where the crack appears in the display component can be determined.

[0159] Optionally, Figure 16 the first input unit 032 in Figure 16 can also include a first type of input sub-unit and a second type of input sub-unit (

[0160] this situation is not shown in

[0161] The second input subunit includes: two second input subunits, and all the third switch units 034 in the peripheral circuit include two groups of third switch units 034. These two second input subunits correspond one-to-one with these two groups of third switch units 034. Each of the two second input subunits is connected to the first end of the corresponding third switch unit 034, and is used to provide the above-mentioned crack detection signal when the corresponding third switch unit 034 is turned on. These two second input subunits can be symmetrically distributed about the above-mentioned axis of symmetry, and these two groups of third switch units 034 can also be symmetrically distributed about this axis of symmetry. Moreover, each second input subunit and the corresponding group of third switch units 034 are located on the same side of the axis of symmetry.

[0162] (3) The third implementable manner of the peripheral circuit.

[0163] Based on the first implementable manner or the second implementable manner of the above-mentioned peripheral circuit, the above-mentioned peripheral circuit includes: a first input unit and a signal receiving unit. Exemplarily, as Figure 17 shown, based on the peripheral circuit shown in Figure 16 the peripheral circuit includes a first input unit 032 and a signal receiving unit 035.

[0164] The first input unit 032 is connected to one end of the crack detection line 021, and the first input unit 032 is used to provide a crack detection signal.

[0165] The signal receiving unit 035 is connected to the other end of the crack detection line 021. The signal receiving unit 035 is used to receive the crack detection signal passing through the crack detection line 021, and determine whether there is a crack in the display component according to the received signal.

[0166] For example, assume that when the crack detection line 021 is not broken, after the first input unit 032 inputs a crack detection signal to one end of the crack detection line 021, the signal received by the signal receiving unit 035 from the other end of the crack detection line 021 should be the target signal. The signal receiving unit 035 can determine whether the crack detection line is broken by comparing whether the crack detection signal passing through the crack detection line 021 is the same as the target signal, and further determine whether there is a crack in the area of the display component where the crack detection line is located. Exemplarily, if the crack detection signal passing through the crack detection line 021 received by the signal receiving unit 035 is the same as the target signal, the signal receiving unit 035 determines that there is no crack in the area of the display component where the crack detection line is located. If the crack detection signal passing through the crack detection line 021 received by the signal receiving unit 035 is different from the target signal, the signal receiving unit 035 determines that there is a crack in the area of the display component where the crack detection line is located.

[0167] For another example, assume that when the crack detection line 021 is not broken, after the first input unit 032 inputs a crack detection signal to one end of the crack detection line 021, the signal received by the signal receiving unit 035 from the other end of the crack detection line 021 should be the target signal. Moreover, based on the crack detection signal and this target signal, the signal receiving unit 035 can determine that the resistance of the crack detection line 021 is the target resistance. After the first input unit 032 inputs a crack detection signal to one end of the crack detection line 021, the signal receiving unit 035 can determine the resistance on the crack detection line 021 based on this crack detection signal and the received signal, and compare the determined resistance with the target resistance to determine whether the crack detection line is broken, and further determine whether there is a crack in the area of the display component where the crack detection line is located. By way of example, if the resistance determined by the signal receiving unit 035 is the same as the target resistance, the signal receiving unit 035 determines that there is no crack in the area of the display component where this crack detection line is located. If the resistance determined by the signal receiving unit 035 is different from the target resistance (for example, the determined resistance is infinite), the signal receiving unit 035 determines that there is a crack in the area of the display component where this crack detection line is located.

[0168] Optionally, Figure 17 the signal receiving unit 035 in Figure 17 can also include a plurality of receiving sub-units corresponding one-to-one to the above-mentioned multiple sub-regions (

[0169] this situation is not shown in

[0170] (4) The fourth implementable manner of the peripheral circuit.

[0171] When the conductive layer is multiplexed with the BSM layer, based on the first implementable manner of the above-mentioned peripheral circuit, the first input unit 032 can also provide a shielding signal when the first switch unit 033 is turned off. In this way, the peripheral circuit 03 can not only provide a crack detection signal to the crack detection line 021, but also provide a shielding signal to the crack detection line 021 when no crack detection signal is provided to the crack detection line 021.

[0172] Moreover, when the first input unit 032 provides a shielding signal, the first switch unit 033 is turned off. Therefore, the shielding signal will not be transmitted to the data line D through the first switch unit 033. Thus, the shielding signal will not affect the display of the display component.

[0173] In the fourth implementation manner, the peripheral circuit can have two working phases, namely a detection phase and a shielding phase, and the peripheral circuit can sequentially switch between these two working phases.

[0174] In the detection phase, the first control unit 031 can provide a first conduction signal for the switch unit (such as the first switch unit 033); at this time, the first input unit 032 provides a crack detection signal, thereby realizing the detection of cracks. Among them, the detection process of cracks after the first input unit 032 provides a crack detection signal can refer to the first implementation manner, and this application embodiment will not elaborate here.

[0175] In the shielding phase, the first control unit 031 can provide a first turn-off signal for the switch unit (such as the first switch unit 033); at this time, the first input unit 032 provides a shielding signal, thereby realizing signal shielding for the thin film transistor.

[0176] (5) The fifth implementation manner of the peripheral circuit.

[0177] When the conductive layer is multiplexed with the BSM layer, based on the fourth implementation manner of the above peripheral circuit, the above peripheral circuit further includes: a second control unit, a second input unit, and a second switch unit corresponding to each crack detection line.

[0178] As Figure 18 shown, based on the peripheral circuit shown in Figure 15 shown, the peripheral circuit further includes a second control unit 036, a second input unit 037, and a second switch unit 038 corresponding to each crack detection line. Among them, the second control unit 036 is connected to the control end 0381 of the second switch unit 038, and the second control unit 036 is used to provide a second conduction signal and a second turn-off signal for the switch unit. The first switch unit 033 and the second switch unit 038 are not simultaneously conductive; the second input unit 037 is connected to the first end 0382 of the second switch unit 038, and the second end 0383 of the second switch unit 038 is connected to the other end of the crack detection line 021. The second input unit 037 is used to provide a shielding signal when the second switch unit 038 is conductive.

[0179] In the fifth implementation manner, the peripheral circuit can have two working phases, namely a detection phase and a shielding phase, and the peripheral circuit can sequentially switch between these two working phases.

[0180] The detection stage can refer to the detection stage in the fourth implementation manner. Moreover, in this detection stage, the second control unit 036 provides a second turn-off signal for the switching unit to turn off the second switching unit 038.

[0181] The shielding stage can refer to the shielding stage in the fourth implementation manner. Moreover, in this shielding stage, the second control unit 036 provides a second conduction signal for the switching unit to turn on the second switching unit 038. Additionally, the second input unit 037 provides a shielding signal to transmit the shielding signal to the other end of the crack detection line 021 through the second switching unit 038.

[0182] In this fifth implementation manner, the first input unit 032 can input a shielding signal to one end of the crack detection line 021, and the second input unit 037 can input a shielding signal to the other end of the crack detection line 021 through the second switching unit. In this way, even if there is a break in the crack detection line 021, the shielding signal can still be transmitted to the entire crack detection line 021, achieving signal shielding for all thin film transistors passed by the crack detection line 021. If there are multiple breaks in the crack detection line 021, the shielding signal can still be transmitted to most areas of the entire crack detection line 021, achieving signal shielding for more thin film transistors passed by the crack detection line 021.

[0183] Optionally, Figure 18 all the second switching units 038 in Figure 18 can include multiple groups of second switching units 038, and the second input unit 037 can include multiple second input subunits corresponding one-to-one to the multiple groups of second switching units 038 ( this situation is not shown in

[0184] ). Among them, for a second input subunit and its corresponding group of second switching units 038, the second input subunit is connected to the first end 0382 of the group of second switching units 038, and the second input subunit is used to provide a shielding signal when the connected second switching unit 038 is turned on. Figure 18 Figure 18 Taking the example that the second control unit 036 in

[0185] Taking the peripheral circuit including two second control sub-units, two groups of second switch units 038 corresponding to the two second control sub-units one by one, and two second input sub-units corresponding to the two groups of second switches as an example. The two second control sub-units can be symmetrically distributed about an axis of symmetry of the display area, and the two groups of second switch units 038 can also be symmetrically distributed about the axis of symmetry. The two second input sub-units can also be symmetrically distributed about the axis of symmetry, and each group of second switch units, the corresponding second control sub-unit and the second input sub-unit are all on the same side of the axis of symmetry.

[0186] (6) The sixth implementable manner of the peripheral circuit.

[0187] Based on the fourth and fifth implementable manners of the foregoing peripheral circuit, the peripheral circuit further includes: a plurality of third switch units. The plurality of third switch units can refer to the second implementable manner of the foregoing peripheral circuit, and the embodiments of the present application will not elaborate herein. By way of example, as Figure 19 shown, on the basis of the peripheral circuit shown in Figure 18 the peripheral circuit further includes: a plurality of third switch units 034.

[0188] (7) The seventh implementable manner of the peripheral circuit.

[0189] Based on the fourth and fifth implementable manners of the foregoing peripheral circuit, the peripheral circuit further includes: a first input unit and a signal receiving unit. The first input unit and the signal receiving unit can refer to the third implementable manner of the foregoing peripheral circuit, and the embodiments of the present application will not elaborate herein. By way of example, as Figure 20 shown, on the basis of the peripheral circuit shown in Figure 18 the peripheral circuit includes: a first input unit 031 and a signal receiving unit 035.

[0190] (8) The eighth implementable manner of the peripheral circuit.

[0191] The peripheral circuit only includes the first input unit and the signal receiving unit in the third or seventh implementable manner described above. The first input unit and the signal receiving unit can refer to the third implementable manner of the foregoing peripheral circuit, and the embodiments of the present application will not elaborate herein. By way of example, as Figure 21 shown, the peripheral circuit includes: a first input unit 031 and a signal receiving unit 035.

[0192] According to the eight implementable ways of the peripheral circuit described above, the fourth to seventh implementable ways of the peripheral circuit can be applied to the scenario where the conductive layer multiplexes the BSM layer. The first, second, third, and eighth implementable ways of the peripheral circuit can be used in the scenario where the conductive layer does not multiplex the BSM layer, such as the scenario where the conductive layer multiplexes the film layer for implementing touch control.

[0193] It should be noted that in the embodiments of the present application, the crack detection of the display component does not affect the display, and the detection stage (the stage for detecting cracks) of the display component can be different from the display stage.

[0194] For example, when the conductive layer multiplexes the film layer for touch control, the peripheral circuit can have two working stages, namely the detection stage and the display stage, and the peripheral circuit can switch between these two working stages in sequence. In the detection stage, each switch unit in the peripheral circuit is turned on, and the peripheral circuit provides a crack detection signal to the crack detection line. In the display stage, each switch unit in the peripheral circuit is turned off to avoid the influence of the peripheral circuit on the image displayed by the display component.

[0195] For another example, when the conductive layer multiplexes the BSM layer, the peripheral circuit can have two working stages, namely the detection stage and the shielding stage, and the peripheral circuit can switch between these two working stages in sequence. These two stages can refer to the explanations in the fourth to seventh implementable ways of the aforementioned peripheral circuit. Moreover, the display component can also display an image in this shielding stage.

[0196] In addition, in the embodiments of the present application, at least some units in the peripheral circuit can be implemented by at least one of Electric Test (ET), Flexible Printed Circuit (FPC), and Integrated Circuit Chip (IC). For example, the above-mentioned first control unit 031, first input unit 032, signal receiving unit 035, second control unit 036, and second input unit 037 in the peripheral circuit can all be implemented by ET or FPC, and each of the other switch units is implemented by TFT; alternatively, it can also be that some of the above-mentioned units in the peripheral circuit are implemented by ET, some are implemented by FPC, and some are implemented by IC. For example, the first control unit 031, first input unit 032, second control unit 036, and second input unit 037 are all implemented by ET or FPC, and the signal receiving unit 035 is implemented by IC.

[0197] In addition, each part in the peripheral circuit (such as each unit, each subunit, etc. mentioned above) can be integrated, or each part can be physically independent of each other, or two or more parts can be integrated.

[0198] For example, based on the second implementable manner of the peripheral circuit, the above-mentioned peripheral circuit includes the first input unit and the signal receiving unit in the third implementable manner of the above-mentioned peripheral circuit. Exemplarily, the above-mentioned multiple sub-regions include two groups of sub-regions symmetrically distributed about an axis of symmetry of the display region. The peripheral circuit includes: two first control subunits symmetrically distributed about the axis of symmetry; two groups of first switch units symmetrically distributed about the axis of symmetry and corresponding to the two first control subunits one by one; two groups of receiving subunits symmetrically distributed about the axis of symmetry and corresponding to the two groups of sub-regions one by one; two groups of third switch units symmetrically distributed about the axis of symmetry, a first type of input subunit whose orthographic projection on the substrate substrate passes through the axis of symmetry, and two second type of input subunits symmetrically distributed about the axis of symmetry and corresponding to the two groups of third switch units one by one. Among them, each first control subunit and the corresponding group of first switch units are located on the same side of the axis of symmetry, each sub-region and the corresponding group of receiving subunits are located on the same side of the axis of symmetry, and each second type of input subunit and the corresponding group of third switch units are located on the same side of the axis of symmetry. The above-mentioned first type of input subunit and the above-mentioned two groups of receiving subunits can be integrated, one second type of input subunit and one first control subunit can be integrated, and the other second type of input subunit and the other first control subunit can be integrated.

[0199] In summary, the display component provided by the embodiment of the present application includes a conductive layer, and at least one crack detection line is provided in the conductive layer. At least a part of the at least one crack detection line is located in the flat area of the display region of the substrate substrate and is connected to the peripheral circuit located in the non-display region of the substrate substrate. By sending a crack detection signal to the crack detection line through the peripheral circuit, crack detection of the display component can be realized. In this way, it is possible to detect whether there is a crack in the display component, and then screen out the display components with cracks during factory production to avoid the display components with cracks from flowing into the market and improve the reliability of the display components in the market.

[0200] Based on the display component provided by the embodiment of the present application, the embodiment of the present application also provides a manufacturing method of a display component for manufacturing any display component provided by the embodiment of the present application. As Figure 22 shown, the method includes:

[0201] Step 101, provide a substrate substrate.

[0202] Step 102: Form a conductive layer and a peripheral circuit on the substrate; wherein, the conductive layer includes at least one crack detection line located in the display area of the substrate, and at least a part of the at least one crack detection line is located in the flat display area of the substrate; the peripheral circuit is located in the non-display area of the substrate, and the peripheral circuit is electrically connected to the crack detection line for providing a crack detection signal for crack detection of the display component to the crack detection line.

[0203] Take the OLED panel of FMLOC shown as an example for the display component. Figure 1 shown.

[0204] In step 101, a PI layer, a barrier layer, and a buffer layer can be provided respectively. After that, the PI layer, the barrier layer, and the buffer layer are laminated by processes such as BPF, u-film, and SCF to obtain the substrate 11.

[0205] In step 102, first, a BSM layer 12, a pixel circuit layer 13, a pixel defining layer 141 in the OLED layer 14, a support layer 15, an OLED 142 in the OLED layer 14, and a flat layer 16 can be sequentially formed on the buffer layer in the substrate 11 to obtain a structure as Figure 23 shown. And, a second touch electrode layer 19, an insulating layer 18, and a first touch electrode layer 17 are sequentially formed on the cover plate 20 to obtain a structure as Figure 24 shown. After that, the whole of the first touch electrode layer 17, the insulating layer 18, the second touch electrode layer 19, and the cover plate 20 is laminated on the surface of the flat layer 16 away from the substrate 11 to form the Figure 1 OLED panel of FMLOC shown.

[0206] The conductive layer can be realized by reusing the above-mentioned BSM layer. Therefore, forming the BSM layer in step 102 is equivalent to forming the conductive layer. Alternatively, the conductive layer can also be realized by reusing the first touch electrode layer 17. Therefore, forming the first touch electrode layer 17 in step 102 is equivalent to forming the conductive layer.

[0207] The peripheral circuit can be on the same layer as the above-mentioned pixel circuit layer 13. Therefore, when forming the pixel circuit layer 13 in step 102, the peripheral circuit can be formed simultaneously.

[0208] In summary, the display component manufactured by the method provided in the embodiments of the present application includes a conductive layer, and at least one crack detection line is provided in the conductive layer. At least a part of the at least one crack detection line is located in the flat area of the display area of the substrate, and is connected to the peripheral circuit located in the non-display area of the substrate. By delivering a crack detection signal to the crack detection line through the peripheral circuit, crack detection of the display component can be achieved. In this way, it is possible to detect whether there is a crack in the display component, and then screen out the display components with cracks during factory production to prevent the display components with cracks from entering the market and improve the reliability of the display components in the market.

[0209] Based on the display component provided in the embodiments of the present application, the embodiments of the present application further provide a method for detecting cracks in a display component, and the display component can be any display component provided in the embodiments of the present application. As Figure 25 shown, the method includes:

[0210] Step 201, in the detection stage, the peripheral circuit provides a crack detection signal for detecting cracks in the display panel to the crack detection line.

[0211] It should be noted that if the crack detection line is broken, the crack detection signal cannot be effectively transmitted on the crack detection line. By detecting whether the crack detection signal can be effectively transmitted on the crack detection line, it can be determined whether the crack detection line is broken. When it is determined that the crack detection line is broken, it can be determined that there is a crack in the area where the crack detection line passes in the display component, thereby realizing crack detection of the display component.

[0212] In summary, the display component to be detected by the crack detection method provided in the embodiments of the present application includes a conductive layer, and at least one crack detection line is provided in the conductive layer. At least a part of the at least one crack detection line is located in the flat area of the display area of the substrate, and is connected to the peripheral circuit located in the non-display area of the substrate. By delivering a crack detection signal to the crack detection line through the peripheral circuit, crack detection of the display component can be achieved. In this way, it is possible to detect whether there is a crack in the display component, and then screen out the display components with cracks during factory production to prevent the display components with cracks from entering the market and improve the reliability of the display components in the market.

[0213] Based on the display component provided in the embodiments of the present application, the embodiments of the present application further provide another method for detecting cracks in a display component.

[0214] The display component can be any display component provided by the embodiments of the present application that satisfies the following first condition. The first condition includes: the peripheral circuit includes a first control unit and a first input unit, and a first switch unit corresponding to each crack detection line. The display component further includes: a plurality of data lines located on the substrate; the first control unit is connected to the control end of the first switch unit, the first input unit is connected to one end of the crack detection line. For the first switch unit corresponding to the crack detection line, the first end of the first switch unit is connected to the other end of the crack detection line, and the second end of the first switch unit is connected to a data line; the crack detection signal is used to drive the sub-pixels connected to the data line to be in a bright state or a dark state. The first condition may further include an additional condition: the peripheral circuit includes a signal receiving unit, the first input unit is connected to one end of the crack detection line, and the signal receiving unit is connected to the other end of the crack detection line.

[0215] As Figure 26 shown, the method includes:

[0216] Step 301, in the detection stage, the first control unit provides a first conduction signal for the switch unit.

[0217] The first control unit is connected to the control end of the first switch unit. When the first control unit provides the first conduction signal for the switch unit, the first switch unit is turned on.

[0218] Step 302, when the first switch unit is turned on, the first input unit provides a crack detection signal.

[0219] The first input unit is connected to one end of the crack detection line. The first input unit can provide a crack detection signal to one end of the crack detection line after the first control unit provides the first conduction signal for the switch unit. At this time, the crack detection signal can be transmitted from the first input unit through the crack detection line and the first switch unit to the data line to drive a column of pixels connected to the data line to be in a bright state or a dark state.

[0220] Through the above step 301 and the above step 302, the peripheral circuit can provide a crack detection signal for crack detection of the display panel to the crack detection line.

[0221] Step 303, in the detection stage, the signal receiving unit receives the crack detection signal passing through the crack detection line.

[0222] The signal receiving unit is connected to the other end of the crack detection line. When the first input unit provides a crack detection signal to one end of the crack detection line, the crack detection signal can be transmitted from the first input unit through the crack detection line to the signal receiving unit.

[0223] Step 304, the signal receiving unit determines whether there is a crack in the display component according to the received signal.

[0224] After the end of the detection phase, the first control unit can also provide a first turn-off signal for the switching unit, so that the switching unit whose control terminal receives the first turn-off signal is turned off.

[0225] Based on the display component provided in the embodiments of the present application, the embodiments of the present application also provide another method for detecting cracks in the display component.

[0226] The display component can be any display component provided in the embodiments of the present application that satisfies the following second conditions. The second conditions include: the display component further includes a pixel circuit layer located on the substrate; the conductive layer is located between the pixel circuit layer and the substrate, and the conductive layer shields light; for the active layer of at least one thin film transistor in the pixel circuit layer, the orthographic projection of the active layer on the substrate is located within the orthographic projection of the conductive layer on the substrate; the peripheral circuit includes: a first control unit and a first input unit, and a first switching unit corresponding to each crack detection line. The display component further includes: a plurality of data lines located on the substrate; the first control unit is connected to the control terminal of the first switching unit, the first input unit is connected to one end of the crack detection line, for the first switching unit corresponding to the crack detection line, the first end of the first switching unit is connected to the other end of the crack detection line, and the second end of the first switching unit is connected to a data line; the crack detection signal is used to drive the sub-pixels connected to the data line to be in a bright state or a dark state.

[0227] The second condition can further include the above additional condition: the peripheral circuit includes a signal receiving unit, the first input unit is connected to one end of the crack detection line, and the signal receiving unit is connected to the other end of the crack detection line.

[0228] As Figure 27 shown, the method includes:

[0229] Step 401, in the detection phase, the first control unit provides a first conduction signal for the switching unit.

[0230] Step 401 can refer to Step 301, and the embodiments of the present application will not elaborate here.

[0231] Step 402, when the first switching unit is turned on, the first input unit provides a crack detection signal.

[0232] Step 402 can refer to Step 302, and the embodiments of the present application will not elaborate here.

[0233] Step 403, in the detection phase, the signal receiving unit receives the crack detection signal passing through the crack detection line.

[0234] Step 403 can refer to Step 303, and the embodiments of the present application will not elaborate here.

[0235] Step 404: The signal receiving unit determines whether there is a crack in the display component according to the received signal.

[0236] Step 404 may refer to Step 304, and details are not described herein again in the embodiments of the present application.

[0237] Step 405: In the shielding stage, the first control unit provides a first turn-off signal to the switching unit.

[0238] The shielding stage is different from the detection stage. In the shielding stage, the switching unit (such as the first switching unit) connected to the first control unit needs to be turned off. Therefore, the first control unit provides a first turn-off signal to the switching unit.

[0239] Step 406: When the first switching unit is turned off, the first input unit provides a shielding signal, which is used for Masked thin film transistor the charges outside the thin film transistor on the side close to the substrate.

[0240] Optionally, when the peripheral circuit further includes a second switching unit, a second control unit, and a second input unit, the crack detection method further includes: in the shielding stage, the second control unit provides a second conduction signal to the switching unit to turn on the second switching unit; then, the second input unit provides the above-mentioned shielding signal so that the shielding signal enters the other end of the crack detection line through the second switching unit. In addition, in the detection stage, the second control unit may further provide a second turn-off signal to the switching unit to turn off the second switching unit whose control terminal receives the second turn-off signal.

[0241] Optionally, both the first condition and the second condition may not include the above-mentioned additional condition. In this case, Figure 26 the shown crack detection method does not include Step 303 and Step 304, Figure 27 the shown crack detection method does not include Step 403 and Step 404.

[0242] Optionally again, both the first condition and the second condition include the additional condition. And, the first condition and the second condition do not include conditions other than the additional condition. In this case, Figure 26 the shown crack detection method includes Step 303 and Step 304, and does not include Step 301 and Step 302; Figure 27 the shown crack detection method includes Step 403, Step 404, Step 405, and Step 406, and does not include Step 401 and Step 402.

[0243] In the present application, "at least one" means one or more, and "a plurality" means two or more. Terms such as "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0244] It should be noted that in the accompanying drawings, the dimensions of some or all of the layers, or the dimensions of some or all of the regions, may be exaggerated for the sake of clarity of illustration. Moreover, it can be understood that when a structure is said to be "on" another structure, it can be directly on that other structure, or there may be an intermediate structure.

[0245] It should be noted that the embodiments of the display component, the manufacturing method of the display component, and the crack detection method provided in the embodiments of the present application can be referred to each other, and the embodiments of the present application do not limit this. The order of the steps in the method embodiments provided in the embodiments of the present application can be appropriately adjusted, and the steps can also be increased or decreased accordingly according to the situation. Any method that can be easily thought of by any person skilled in the art within the technical scope disclosed in the present application should be covered within the protection scope of the present application, and thus will not be elaborated herein.

[0246] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A display component, characterized in that, Comprising: a substrate, and a conductive layer and a peripheral circuit located on the substrate; the conductive layer includes at least one crack detection line located in the display area of the substrate, and at least a part of the at least one crack detection line is located in a flat area in the display area; the peripheral circuit is located in the non-display area of the substrate, and the peripheral circuit is electrically connected to the crack detection line for providing a crack detection signal for crack detection of the display component to the crack detection line; wherein, the display component satisfies at least one of the following conditions: the display component further includes: a support layer located on the substrate; the support layer includes a plurality of support pillars, the conductive layer is located on a side of the support layer away from the substrate, and a positive projection of the at least one crack detection line on the substrate passes through a positive projection of at least one of the support pillars on the substrate; and, a positive projection of the crack detection line on the substrate is located between sub-pixel areas in the display area.

2. The display component according to claim 1, wherein the at least one crack detection line includes a plurality of crack detection lines; the display area of the substrate includes a plurality of sub-areas corresponding to the plurality of crack detection lines one by one, and the crack detection line is located in the corresponding sub-area.

3. The display component according to claim 1 or 2, characterized in that, the display component further includes: an insulating layer and a touch electrode layer located on the substrate; the touch electrode layer, the insulating layer and the conductive layer are stacked in sequence; the touch electrode layer includes: touch electrode bars, a first touch electrode block and a second touch electrode block; the first touch electrode block and the second touch electrode block are respectively located on two sides of the touch electrode bar, and there is a gap between them and the touch electrode bar; the conductive layer further includes: a conductive bridge connecting the first touch electrode block and the second touch electrode block; the crack detection line is insulated from the touch electrode layer; the insulating layer includes: insulating blocks, and the insulating blocks are located between the touch electrode bar and the conductive bridge for insulating the conductive bridge and the touch electrode bar.

4. The display component according to claim 1, wherein the peripheral circuit includes: a first control unit and a first input unit, and a first switch unit corresponding to each crack detection line, and the display component further includes: a plurality of data lines located on the substrate; the first control unit is connected to the control end of the first switch unit, and the first control unit is used for providing a first conduction signal and a first turn-off signal of the switch unit; the first input unit is connected to one end of the crack detection line, and the first input unit is used for providing the crack detection signal when the first switch unit is turned on; for the first switch unit corresponding to one crack detection line, a first end of the first switch unit is connected to the other end of the crack detection line, and a second end of the first switch unit is connected to one data line; the crack detection signal is used for driving the sub-pixels connected to the data line to be in a bright state or a dark state.

5. The display component according to claim 1 or 2, characterized in that, the display component further includes: a pixel circuit layer located on the substrate; the conductive layer is located between the pixel circuit layer and the substrate, and the conductive layer blocks light; For the active layer of at least one thin film transistor in the pixel circuit layer, the orthographic projection of the active layer on the substrate is located within the orthographic projection of the conductive layer on the substrate; The peripheral circuit is further configured to provide a shielding signal to the crack detection line when the crack detection signal is not provided to the crack detection line, and the shielding signal is used to shield the charges outside the thin film transistor on the side of the thin film transistor close to the substrate.

6. The display component according to claim 5, characterized in that, The peripheral circuit includes: a first control unit and a first input unit, and a first switch unit corresponding to each crack detection line. The display component further includes: a plurality of data lines located on the substrate; The first control unit is connected to the control end of the first switch unit, and the first control unit is configured to provide a first conduction signal and a first cut-off signal for the switch unit; The first input unit is connected to one end of the crack detection line, and the first input unit is configured to provide the crack detection signal when the first switch unit is turned on, and provide the shielding signal when the first switch unit is turned off; For the first switch unit corresponding to one crack detection line, the first end of the first switch unit is connected to the other end of the crack detection line, and the second end of the first switch unit is connected to one data line; the crack detection signal is used to drive the sub-pixel connected to the data line to be in a bright state or a dark state.

7. The display component according to claim 6, characterized in that, The peripheral circuit further includes: a second control unit and a second input unit, and a second switch unit corresponding to each crack detection line; The second control unit is connected to the control end of the second switch unit, and the second control unit is configured to provide a second conduction signal and a second cut-off signal for the switch unit; the first switch unit and the second switch unit are not turned on simultaneously; The second input unit is connected to the first end of the second switch unit, and the second end of the second switch unit is connected to the other end of the crack detection line. The second input unit is configured to provide the shielding signal when the second switch unit is turned on.

8. The display component according to claim 4, 6 or 7, characterized in that The peripheral circuit further includes: a plurality of third switch units; The first control unit is further connected to the control end of the third switch unit; The first end of the third switch unit is connected to the first input unit, and the second end of the third switch unit is connected to one data line; Different switch units in the peripheral circuit are connected to different data lines, and the plurality of third switch units are connected to the data lines among the plurality of data lines that are not connected to the first switch unit; the crack detection signal is used to drive the sub-pixel connected to the data line to be in a dark state.

9. The display component according to claim 1 or 2, characterized in that The peripheral circuit includes: a first input unit and a signal receiving unit; The first input unit is connected to one end of the crack detection line, and the first input unit is configured to provide the crack detection signal; The signal receiving unit is connected to the other end of the crack detection line, and the signal receiving unit is configured to receive the crack detection signal passing through the crack detection line, and determine whether there is a crack in the display component according to the received signal.

10. A manufacturing method of a display component, characterized in that, For manufacturing the display component according to any one of claims 1 to 9, the method includes: Providing a substrate; Forming a conductive layer and a peripheral circuit on the substrate; Wherein, the conductive layer includes at least one crack detection line located in the display area of the substrate, and at least a part of the at least one crack detection line is located in the flat display area of the substrate; The peripheral circuit is located in the non-display area of the substrate, and the peripheral circuit is electrically connected to the crack detection line for providing a crack detection signal for crack detection of the display component to the crack detection line.

11. A method for crack detection of a display component, characterized in that, The display component is the display component according to any one of claims 1 to 9, and the method includes: In the detection stage, the peripheral circuit provides a crack detection signal for crack detection of the display component to the crack detection line.

12. The method according to claim 11, characterized in that, The peripheral circuit includes: a first control unit and a first input unit, and a first switch unit corresponding to each crack detection line. The display component further includes: a plurality of data lines located on the substrate; the first control unit is connected to the control end of the first switch unit, the first input unit is connected to one end of the crack detection line. For the first switch unit corresponding to the crack detection line, the first end of the first switch unit is connected to the other end of the crack detection line, and the second end of the first switch unit is connected to one of the data lines; the crack detection signal is used to drive the sub-pixels connected to the data line to be in a bright state or a dark state; The peripheral circuit provides a crack detection signal for crack detection of the display component to the crack detection line, including: The first control unit provides a first conduction signal of the switch unit; When the first switch unit is turned on, the first input unit provides the crack detection signal.

13. The method according to claim 11, wherein The display component further includes: a pixel circuit layer located on the substrate; the conductive layer is located between the pixel circuit layer and the substrate, and the conductive layer shields light; for the active layer of at least one thin film transistor in the pixel circuit layer, the orthographic projection of the active layer on the substrate is located within the orthographic projection of the conductive layer on the substrate; The peripheral circuit includes: a first control unit and a first input unit, and a first switch unit corresponding to each crack detection line. The display component further includes: a plurality of data lines located on the substrate; the first control unit is connected to the control end of the first switch unit, the first input unit is connected to one end of the crack detection line. For the first switch unit corresponding to the crack detection line, the first end of the first switch unit is connected to the other end of the crack detection line, and the second end of the first switch unit is connected to one of the data lines; the crack detection signal is used to drive the sub-pixels connected to the data line to be in a bright state or a dark state; The peripheral circuit provides a crack detection signal for crack detection of the display component to the crack detection line, including: The first control unit provides a first conduction signal of the switch unit; When the first switch unit is turned on, the first input unit provides the crack detection signal; The method further includes: In the shielding stage, the first control unit provides a first turn-off signal for the switch unit; When the first switch unit is turned off, the first input unit provides a shielding signal for shielding charges located on the side of the thin film transistor close to the substrate outside the thin film transistor.

14. The method according to any one of claims 11 to 13, characterized in that, The peripheral circuit includes: a first input unit and a signal receiving unit; the first input unit is connected to one end of the crack detection line, and the signal receiving unit is connected to the other end of the crack detection line; The peripheral circuit provides a crack detection signal for detecting cracks in the display component to the crack detection line, including: The first input unit provides the crack detection signal; The method further includes: In the detection stage, the signal receiving unit receives the crack detection signal passing through the crack detection line; The signal receiving unit determines whether there is a crack in the display component according to the received signal.

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