Fixing belt for wearable device, manufacturing method and wearable device

Abstract

A method for manufacturing a fixing strap for a wearable device comprises: providing a flexible circuit board comprising a first region and a second region connected to the first region, the flexible circuit board being provided with at least one solder pad in the first region; laminating an insulating layer onto one surface of the flexible circuit board, the insulating layer being located on the second region; forming an electrically conductive portion in the insulating layer; laminating a first protective layer and a second protective layer onto opposing surfaces of the flexible circuit board, respectively, such that the electrically conductive portion is located between the flexible circuit board and the first protective layer; and mounting electronic components on the solder pad. The present application also provides a fixing strap for a wearable device and a wearable device. The present application is conducive to the development of wearable devices towards multifunctionality.

Description

Technical Field

[0001] The present application relates to the field of wearable devices, and in particular to a fixing strap for a wearable device, a method for manufacturing the fixing strap for a wearable device, and a wearable device. Background Art

[0002] Wearable devices (such as smart bracelets) can record real-time data such as users' exercise, sleep, diet, etc. in daily life, and synchronize this data with terminal devices to guide healthy living through data.

[0003] Nowadays, the functions of smart bracelets are becoming increasingly rich, but due to the size of smart bracelets, the number of functional components integrated in smart bracelets is limited, which restricts the development of smart bracelets towards more multifunctional directions. Summary of the Invention

[0004] In order to solve at least one of the above shortcomings of the prior art, it is necessary to provide a wearable device.

[0005] In addition, it is also necessary to provide a fixing strap for the above-mentioned wearable device and a manufacturing method thereof.

[0006] The present application provides a method for manufacturing a fixing strap for a wearable device, comprising the following steps: providing a flexible circuit board, comprising a first area and a second area connected to the first area, wherein the flexible circuit board is provided with at least one soldering pad in the first area; laminating an insulating layer on one surface of the flexible circuit board, wherein the insulating layer is located on the second area; forming an electrical conductive portion in the insulating layer; laminating a first protective layer and a second protective layer on two opposite surfaces of the flexible circuit board, respectively, such that the electrical conductive portion is located between the flexible circuit board and the first protective layer; and mounting electronic components on the soldering pad to obtain the fixing strap for the wearable device, wherein the fixing strap for the wearable device forms an insertion area in the portion including the second area, wherein the insertion area is used for insertion with a device body, and the electrical conductive portion is provided in the insertion area.

[0007] In some possible implementations, before laminating the first protective layer, the manufacturing method further includes: covering the insulating layer with a support frame, defining an insertion space between the support frame and the insulating layer, and the electrical conductive portion connecting the insertion space.

[0008] In some possible implementations, the flexible circuit board includes a base layer and a first inner circuit layer and a second inner circuit layer respectively arranged on two opposite surfaces of the base layer, a first outer circuit layer and a first covering film are sequentially provided on the first inner circuit layer, and a second outer circuit layer and a second covering film are sequentially provided on the second inner circuit layer, wherein the first protective layer and the second protective layer are respectively located on the first covering film and the second covering film.

[0009] In some possible implementations, at least one of the pads includes a first pad, the first outer circuit layer includes the first pad, the first pad is exposed from the first covering film, and the electronic component includes a first electronic component mounted on the first pad.

[0010] In some possible implementations, the first protective layer is provided with a window for exposing the first electronic component, and a third protective layer is provided in the window.

[0011] In some possible implementations, at least one of the pads includes a second pad and a third pad, the first inner circuit layer includes the second pad, the second outer circuit layer includes the third pad, the second pad and the third pad are both exposed from the second covering film, and the electronic component includes a second electronic component and a third electronic component respectively mounted on the second pad and the third pad.

[0012] In some possible implementations, a groove is provided in a portion of the insulating layer, the electrically conductive portion is provided in the groove, a through hole is provided at the bottom of the groove, the through hole penetrates another portion of the insulating layer and the first cover film, the bottom of the through hole corresponds to the first outer circuit layer, and a conductive portion is provided in the through hole for electrically connecting the electrically conductive portion and the first outer circuit layer.

[0013] In some possible implementations, the electrical conductive portion is a gold finger.

[0014] The present application also provides a fixing strap for a wearable device, comprising a flexible circuit board, an insulating layer, a first protective layer, a second protective layer, and electronic components. The flexible circuit board comprises a first area and a second area connected to the first area, and the flexible circuit board is provided with at least one soldering pad in the first area. The insulating layer is provided on the second area, and an electrical conductive portion is provided in the insulating layer. The first protective layer and the second protective layer are respectively provided on two opposite surfaces of the flexible circuit board, and the electrical conductive portion is located between the flexible circuit board and the first protective layer. Electronic components are mounted on the soldering pads. The fixing strap for a wearable device forms a plug-in area in the portion including the second area, and the plug-in area is used for plugging with the device body, and the electrical conductive portion is provided in the plug-in area.

[0015] In some possible implementations, the insulating layer is further covered with a support frame, an insertion space is defined between the support frame and the insulating layer, and the electrical conductive portion is connected to the insertion space.

[0016] In some possible implementations, the flexible circuit board includes a base layer and a first inner circuit layer and a second inner circuit layer respectively arranged on two opposite surfaces of the base layer, a first outer circuit layer and a first covering film are sequentially provided on the first inner circuit layer, and a second outer circuit layer and a second covering film are sequentially provided on the second inner circuit layer, wherein the first protective layer and the second protective layer are respectively located on the first covering film and the second covering film.

[0017] In some possible implementations, at least one of the pads includes a first pad, the first outer circuit layer includes the first pad, the first pad is exposed from the first covering film, and the electronic component includes a first electronic component mounted on the first pad.

[0018] In some possible implementations, the first protective layer is provided with a window for exposing the first electronic component, and a third protective layer is provided in the window.

[0019] In some possible implementations, at least one of the pads includes a second pad and a third pad, the first inner circuit layer includes the second pad, the second outer circuit layer includes the third pad, the second pad and the third pad are both exposed from the second covering film, and the electronic component includes a second electronic component and a third electronic component respectively mounted on the second pad and the third pad.

[0020] In some possible implementations, a groove is provided in a portion of the insulating layer, the electrically conductive portion is provided in the groove, a through hole is provided at the bottom of the groove, the through hole penetrates another portion of the insulating layer and the first cover film, the bottom of the through hole corresponds to the first outer circuit layer, and a conductive portion is provided in the through hole for electrically connecting the electrically conductive portion and the first outer circuit layer.

[0021] The present application also provides a wearable device, comprising a device body, the wearable device further comprising the wearable device fixing belt as described above, the device body being plugged into the plug-in area of ​​the wearable device fixing belt and electrically connected to the electrical conductive portion.

[0022] Compared to existing technologies, the wearable device strap of this application can integrate the required electronic components in the portion containing the first region, while the portion containing the second region is used for removable connection with the device body. Therefore, the wearable device strap can not only be used to fix to a part of the body but also to install the required electronic components, which is conducive to the development of multifunctional wearable devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A cross-sectional view of a flexible substrate provided in accordance with one embodiment of the present application.

[0024] Figure 2 For etching Figure 1 The copper foil layer of the flexible substrate is shown as a cross-sectional view after obtaining the inner circuit layer.

[0025] Figure 3 For Figure 2 A cross-sectional view of the inner circuit layer after the insulation layer and the copper foil layer are laminated.

[0026] Figure 4 For etching Figure 3 The copper foil layer shown is a cross-sectional view after obtaining the outer circuit layer.

[0027] Figure 5 For Figure 4 The cross-sectional view of the flexible circuit board obtained after laminating the cover film on the outer circuit layer is shown.

[0028] Figure 6 For the general Figure 5 The cross-sectional view of the flexible circuit board after lamination of the rigid copper clad board is shown.

[0029] Figure 7 For Figure 6 A cross-sectional view of the cover film after being covered with a mask is shown.

[0030] Figure 8 For Figure 7 A cross-sectional view of an insulating layer after an electrical conductive portion is made.

[0031] Figure 9 To remove Figure 8 Cross-sectional view after masking and surface treatment on the pads is shown.

[0032] Figure 10 For Figure 9 Cross-sectional view of the solder pads after mounting electronic components.

[0033] Figure 11 For Figure 10 A cross-sectional view of a fixing strap for a wearable device obtained by laminating a protective layer onto a cover film is shown.

[0034] Figure 12 For Figure 11 The cross-sectional view of the wearable device obtained after the wearable device fixing belt is plugged into the device body is shown.

[0035] Description of main component symbols

[0036] Wearable devices 1

[0037] Equipment body 2

[0038] Flexible substrate 10

[0039] Grassroots 11

[0040] First copper foil layer 12

[0041] Second copper foil layer 13

[0042] First inner circuit layer 14

[0043] Second inner circuit layer 15

[0044] First insulating layer 16

[0045] The third copper foil layer 17

[0046] Second insulating layer 18

[0047] Fourth copper foil layer 19

[0048] Flexible circuit board 20

[0049] First outer circuit layer 21

[0050] Second outer circuit layer 22

[0051] First cover film 23

[0052] Second cover film 24

[0053] The first hard copper clad laminate 30

[0054] The third insulating layer 31

[0055] Fifth copper foil layer 32

[0056] Second hard copper clad plate 40

[0057] Fourth insulating layer 41

[0058] Sixth copper foil layer 42

[0059] First mask 50

[0060] Second mask 51

[0061] Electrically conductive portion 60

[0062] Fourth surface treatment layer 61

[0063] First electronic component 71

[0064] Second electronic component 72

[0065] The third electronic component 73

[0066] Protective glue 74

[0067] First protective layer 80

[0068] Second protective layer 81

[0069] Support frame 82

[0070] Fixed belt 100

[0071] First through hole 101

[0072] Second through hole 102

[0073] Second pad 150

[0074] Second surface treatment layer 151

[0075] First pad 210

[0076] First surface treatment layer 211

[0077] The third pad 220

[0078] The third surface treatment layer 221

[0079] Adhesive layer 231

[0080] Covering layer 232

[0081] Groove 301

[0082] The third through hole 302

[0083] Seed layer 303

[0084] Window 800

[0085] The third protective layer 801

[0086] Plug-in space 820

[0087] First conductive portion 1011

[0088] The second conductive portion 1021

[0089] The third conductive portion 3021

[0090] First area A

[0091] Second area B

[0092] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0093] In order to more clearly understand the above-mentioned purposes, features and advantages of the embodiments of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, in the absence of conflict, the features in the implementation methods of the present application can be combined with each other.

[0094] In the following description, many specific details are set forth to facilitate a full understanding of the embodiments of the present application. The described implementation methods are only part of the implementation methods of the present application, rather than all the implementation methods.

[0095] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present application. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of this application.

[0096] One embodiment of the present application provides a method for manufacturing a fixing strap 100 for a wearable device (hereinafter referred to as the fixing strap 100 ), comprising the following steps:

[0097] S1, see Figure 1 A flexible substrate 10 is provided, comprising a base layer 11 and a first copper foil layer 12 and a second copper foil layer 13 respectively disposed on two opposite surfaces of the base layer 11.

[0098] In some embodiments, the material of the base layer 11 is an insulating resin. Specifically, the material of the base layer 11 can be selected from one of resins such as epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET) and polyethylene naphthalate (PEN).

[0099] S2, see Figure 2 The first copper foil layer 12 and the second copper foil layer 13 are etched to form a first inner circuit layer 14 and a second inner circuit layer 15 respectively.

[0100] S3, see Figure 3The first insulating layer 16 and the third copper foil layer 17 are laminated on the first inner circuit layer 14 , and the second insulating layer 18 and the fourth copper foil layer 19 are laminated on the second inner circuit layer 15 .

[0101] S4, see Figure 4 , the third copper foil layer 17 and the fourth copper foil layer 19 are etched to form a first outer wiring layer 21 and a second outer wiring layer 22, respectively.

[0102] In some embodiments, before etching the third copper foil layer 17 and the fourth copper foil layer 19, a first through-hole 101 is first formed in the third copper foil layer 17 and the first insulating layer 16. The bottom of the first through-hole 101 corresponds to the first inner circuit layer 14. Furthermore, a second through-hole 102 is formed in the fourth copper foil layer 19 and the second insulating layer 18. The bottom of the second through-hole 102 corresponds to the second inner circuit layer 15. Then, copper is plated on the third copper foil layer 17 and the fourth copper foil layer 19, respectively. Part of the plated copper also fills the first through-hole 101 and the second through-hole 102 to form a first conductive portion 1011 and a second conductive portion 1021, respectively. The first outer circuit layer 21 is obtained by etching the copper-plated layer on the third copper foil layer 17 and the third copper foil layer 17, and the second outer circuit layer 22 is obtained by etching the copper-plated layer on the fourth copper foil layer 19 and the fourth copper foil layer 19. The first conductive portion 1011 is used to electrically connect the first outer circuit layer 21 and the first inner circuit layer 14 , and the second conductive portion 1021 is used to electrically connect the second outer circuit layer 22 and the second inner circuit layer 15 .

[0103] In some embodiments, the first through hole 101 and the second through hole 102 may be formed by punching or laser drilling.

[0104] In other embodiments, before forming the first outer circuit layer 21 and the second outer circuit layer 22, at least one intermediate circuit layer (not shown) may be formed on the first inner circuit layer 14 and the second inner circuit layer 15 by a build-up technique, i.e., the final fixing tape 100 (see FIG. Figure 11 ) is not limited to four layers.

[0105] S5, see Figure 5 The first cover film 23 and the second cover film 24 are respectively laminated on the first outer circuit layer 21 and the second outer circuit layer 22 to obtain a flexible circuit board 20. The flexible circuit board 20 includes a first area A and a second area B connected to the first area A.

[0106] In some embodiments, the first outer wiring layer 21 includes a first pad 210 located in the first area A. The second inner wiring layer 15 includes a second pad 150 located in the first area A. The second outer wiring layer 22 includes a third pad 220 located in the first area A. The first pad 210 is exposed from the first cover film 23. The second pad 150 and the third pad 220 are both exposed from the second cover film 24. The first pad 210, the second pad 150, and the third pad 220 are all used for subsequent mounting of electronic components.

[0107] In some embodiments, at least one of the first cover film 23 and the second cover film 24 includes a glue layer 231 and a cover layer 232 disposed on the glue layer 231. The glue layer 231 is disposed between the cover layer 232 and the first outer wiring layer 21 or the second outer wiring layer 22. The glue layer 231 also fills the gaps between the circuits of the first outer wiring layer 21 or the second outer wiring layer 22.

[0108] S6, see Figure 6 The first rigid copper clad laminate 30 and the second rigid copper clad laminate 40 are respectively laminated on the first cover film 23 and the second cover film 24. The first rigid copper clad laminate 30 and the second rigid copper clad laminate 40 are both located on the second area B. That is, the first cover film 23 located on the first area A is not covered by the first rigid copper clad laminate 30, and the second cover film 24 located on the first area A is not covered by the second rigid copper clad laminate 40.

[0109] The first rigid copper clad laminate 30 includes a third insulating layer 31 and a fifth copper foil layer 32 disposed on the third insulating layer 31 . The second rigid copper clad laminate 40 includes a fourth insulating layer 41 and a sixth copper foil layer 42 disposed on the fourth insulating layer 41 .

[0110] S7, see Figure 7 The first mask 50 is covered on the first cover film 23 located on the first area A, that is, the first hard copper clad laminate 30 is exposed from the first mask 50. The second mask 51 is covered on the second hard copper clad laminate 40 and the second cover film 24 located on the first area A.

[0111] S8, please refer to Figure 7 and Figure 8 , in the third insulating layer 31, a layer for electrically connecting the device body 2 (see Figure 12 ) of the electrical conducting portion 60.

[0112] In some embodiments, the electrical conductive portion 60 is a gold finger.

[0113] In some embodiments, as Figure 7As shown, first, a groove 301 and a third through hole 302 are opened in the first rigid copper clad plate 30. The groove 301 penetrates the fifth copper foil layer 32 and a portion of the third insulating layer 31. The third through hole 302 is provided at the bottom of the groove 301 and further penetrates another portion of the third insulating layer 31 and the first covering film 23. The bottom of the third through hole 302 corresponds to the first outer circuit layer 21. Then, a seed layer 303 is formed on the inner sidewall and bottom of the groove 301 and the inner sidewall and bottom of the third through hole 302. Figure 8 As shown, copper is then plated in the groove 301 and third through-hole 302 having the seed layer 303. The copper in the groove 301 forms the electrical via 60, and the copper in the third through-hole 302 forms the third conductive portion 3021 for electrically connecting the electrical via 60 to the first outer wiring layer 21. The seed layer 303 is used to improve the adhesion between the electrical via 60 or the third conductive portion 3021 and the third insulating layer 31.

[0114] S9, see Figure 9 The first mask 50 and the second mask 51 are removed, and the fifth copper foil layer 32 and the sixth copper foil layer 42 are removed by copper reduction treatment. In addition, surface treatment is performed on the first pad 210, the second pad 150, the third pad 220, and the conductive portion 60 to form a first surface treatment layer 211, a second surface treatment layer 151, a third surface treatment layer 221, and a fourth surface treatment layer 61, respectively.

[0115] The first surface treatment layer 211, the second surface treatment layer 151, the third surface treatment layer 221, and the fourth surface treatment layer 61 are used to prevent oxidation of the surfaces of the corresponding solder pads or conductive portions 60, which could affect their electrical properties. The surface treatment layers can be chemically plated layers formed by methods such as chemical gold plating or chemical nickel plating, or can also be organic solder resist (OSP).

[0116] S10, see Figure 10 A first electronic component 71 , a second electronic component 72 and a third electronic component 73 are mounted on the first pad 210 , the second pad 150 and the third pad 220 , respectively.

[0117] It is understandable that the number and type of electronic components can be set according to the functions required by the wearable device, and this application does not impose any restrictions.

[0118] In some embodiments, protective glue 74 may be further provided between the first electronic component 71 and the first soldering pad 210 , between the second electronic component 72 and the second soldering pad 150 , and between the third electronic component 73 and the third soldering pad 220 , so as to further fix the first electronic component 71 , the second electronic component 72 and the third electronic component 73 .

[0119] S11, see Figure 11The first protective layer 80 and the second protective layer 81 are respectively pressed on the first cover film 23 and the second cover film 24 , and the electrical conductive portion 60 is located between the first cover film 23 and the first protective layer 80 , thereby obtaining the fixing tape 100 .

[0120] The portion of the strap 100 encompassing the first region A forms the wearable area. This wearable area, comprised primarily of a flexible printed circuit board 200, is relatively soft, allowing the strap 100 to be wrapped around and secured to a specific body part. The portion encompassing the second region B forms the insertion area. Because this area is provided with a third insulating layer 31 and a fourth insulating layer 41, it can function as a rigid board area for insertion into the device body 2.

[0121] In some embodiments, before laminating the first protective layer 80 and the second protective layer 81, a support frame 82 may be covered on the third insulating layer 31. A plug-in space 820 is defined between the support frame 82 and the third insulating layer 31, and the electrical conductive portion 60 is connected to the plug-in space 820. That is, the plug-in area is provided with a plug-in space 820. Please refer to Figure 12 When it is necessary to assemble the device body 2 with the wearable device, the device body 2 can be plugged into the plug-in space 820 so that the device body 2 is electrically connected to the electrical conductive portion 60, and the wearable device can be obtained at this time.

[0122] The support frame 82 can be made of a material with a relatively high hardness, so as to play an effective supporting role. For example, the support frame 82 can be made of metal.

[0123] In other embodiments, an insertion space (not shown) may also be provided on the device body 2 , and in this case, the fixing belt 100 may also be inserted into the insertion space of the device body 2 .

[0124] In some embodiments, when the user wears the wearable device on a predetermined body part (such as the wrist, in which case the wearable device is a bracelet and the fixing strap 100 is specifically a wristband), one side of the first protective layer 80 faces the body part, that is, the first side faces the body part. One side of the second protective layer 81 faces the outside world, that is, the second electronic component 72 and the third electronic component 73 face the body part. In this case, the first electronic component 71 is a sensor for detecting physiological parameters of the body part (such as pulse, heart rate, skin temperature, etc.). The second electronic component 72 and the third electronic component 73 are sensors for detecting environmental information (such as light and ambient noise levels).

[0125] Furthermore, if Figure 11As shown, the first protective layer 80 has a window 800 for exposing the first electronic component 71. Therefore, the first electronic component 71 can detect physiological parameters of a body part through the window 800. In some embodiments, after the first protective layer 80 is laminated, a third protective layer 801 can be further placed within the window 800 to prevent damage to the first electronic component 71 from external forces. The first protective layer 80 is made of a transparent material, allowing the first electronic component 71 to detect physiological parameters of a body part through the window 800. For example, the first protective layer 80 can be made of plastic or glass.

[0126] See also Figure 11 One embodiment of the present application further provides a wearable device fixing strap 100 manufactured by the above-described manufacturing method, comprising a flexible circuit board 20. The flexible circuit board 20 comprises a base layer 11 and a first inner circuit layer 14 and a second inner circuit layer 15, respectively disposed on opposite surfaces of the base layer 11. A first insulating layer 16, a first outer circuit layer 21, and a first cover film 23 are sequentially disposed on the first inner circuit layer 14. A second insulating layer 18, a second outer circuit layer 22, and a second cover film 24 are sequentially disposed on the second inner circuit layer 15. The flexible circuit board 20 comprises a first region A and a second region B connected to the first region A.

[0127] The wearable device fixing strap 100 further includes a third insulating layer 31 and a fourth insulating layer 41, respectively disposed on the first cover film 23 and the second cover film 24. Both the third insulating layer 31 and the fourth insulating layer 41 are located on the second region B. That is, the first cover film 23 located on the first region A is not covered by the third insulating layer 31, and the second cover film 24 located on the first region A is not covered by the fourth insulating layer 41. An electrical conductive portion 60 is provided in the third insulating layer 31. In some embodiments, the electrical conductive portion 60 is specifically a gold finger.

[0128] The wearable device strap 100 also includes a first protective layer 80 and a second protective layer 81, respectively disposed on the first cover film 23 and the second cover film 24. The portion of the strap 100 encompassing the first region A constitutes a wearable area. This wearable area comprises a flexible printed circuit board 200, which is relatively soft, allowing the strap 100 to be wrapped around and secured to a specific body part. The portion encompassing the second region B constitutes an insertion area. Because this area is provided with a third insulating layer 31 and a fourth insulating layer 41, it can function as a rigid board area for insertion into the device body 2.

[0129] In some embodiments, a support frame 82 is further provided on the third insulating layer 31 and is located between the first cover film 23 and the first protective layer 80. An insertion space 820 is defined between the support frame 82 and the third insulating layer 31. Specifically, the insertion area is provided with an insertion space 820. The device body 2 can be inserted into the insertion space 820 and electrically connected to the electrical conductive portion 60.

[0130] In some embodiments, the first protective layer 80 is provided with a window 800 for exposing the first electronic component 71. Therefore, the first electronic component 71 can detect physiological parameters of a body part through the window 800.

[0131] In some embodiments, a groove 301 and a third through-hole 302 are defined in the third insulating layer 31. The groove 301 partially penetrates the third insulating layer 31. The third through-hole 302 is located at the bottom of the groove 301 and further penetrates another portion of the third insulating layer 31 and the first cover film 23. The bottom of the third through-hole 302 corresponds to the first outer wiring layer 21. An electrical conductive portion 60 is disposed within the groove 301, and a third conductive portion 3021 is disposed within the third through-hole 302 for electrically connecting the electrical conductive portion 60 to the first outer wiring layer 21.

[0132] In some embodiments, the first outer wiring layer 21 includes a first pad 210 located in the first area A. The first inner wiring layer 14 includes a second pad 150 located in the first area A. The second outer wiring layer 22 includes a third pad 220 located in the first area A. The first pad 210 is exposed from the first cover film 23. The second pad 150 and the third pad 220 are both exposed from the second cover film 24. The first electronic component 71, the second electronic component 72, and the third electronic component 73 are mounted on the first pad 210, the second pad 150, and the third pad 220, respectively.

[0133] In some embodiments, a first through-hole 101 is defined in the first outer wiring layer 21 and the first insulating layer 16. The bottom of the first through-hole 101 corresponds to the first inner wiring layer 14. A first conductive portion 1011 is defined within the first through-hole 101 for electrically connecting the first outer wiring layer 21 and the first inner wiring layer 14. A second through-hole 102 is defined in the second outer wiring layer 22 and the second insulating layer 18. The bottom of the second through-hole 102 corresponds to the second inner wiring layer 15. A second conductive portion 1021 is defined within the second through-hole 102 for electrically connecting the second outer wiring layer 22 and the second inner wiring layer 15.

[0134] See also Figure 12 One embodiment of the present application further provides a wearable device 1, comprising a device body 2 and the aforementioned fixing belt 100. The device body 2 is plugged into the plug-in area of ​​the fixing belt 100 and electrically connected to the electrical conductive portion 60.

[0135] The portion of the strap 100 of the present application comprising the first region A can be integrated with the required electronic components, while the portion comprising the second region B is used for detachable connection with the device body 2. Therefore, the strap 100 can not only be fixed to a part of the body but can also be used to accommodate the required electronic components, facilitating the development of multifunctional wearable device 1.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for manufacturing a fixing strap for a wearable device, characterized in that: The steps include: Providing a flexible circuit board, comprising a first area and a second area connected to the first area, wherein the flexible circuit board is provided with at least one solder pad in the first area; Laminating an insulating layer on one surface of the flexible circuit board, wherein the insulating layer is located on the second area; making an electrical conductive portion in the insulating layer; Laminating a first protective layer and a second protective layer on two opposite surfaces of the flexible circuit board, respectively, so that the electrically conductive portion is located between the flexible circuit board and the first protective layer; Electronic components are mounted on the pad to obtain the wearable device fixing strap, wherein the wearable device fixing strap comprises a plug-in area in a portion including the second area, the plug-in area is used for plugging with the device body, and the electrical conductive portion is provided in the plug-in area. Before laminating the first protective layer, the manufacturing method further includes: A support frame is covered on the insulating layer, an inserting space is defined between the support frame and the insulating layer, and the electrical conductive portion is connected to the inserting space.

2. The method for manufacturing a fixing strap for a wearable device according to claim 1, wherein: The flexible circuit board includes a base layer and a first inner circuit layer and a second inner circuit layer respectively arranged on two opposite surfaces of the base layer, a first outer circuit layer and a first covering film are sequentially arranged on the first inner circuit layer, and a second outer circuit layer and a second covering film are sequentially arranged on the second inner circuit layer, wherein the first protective layer and the second protective layer are respectively located on the first covering film and the second covering film.

3. The method for manufacturing a fixing strap for a wearable device according to claim 2, wherein: At least one of the pads includes a first pad, the first outer circuit layer includes the first pad, the first pad is exposed from the first cover film, and the electronic component includes a first electronic component mounted on the first pad.

4. The method for manufacturing a fixing strap for a wearable device according to claim 3, wherein: The first protective layer is provided with a window for exposing the first electronic component, and a third protective layer is provided in the window.

5. The method for manufacturing a fixing strap for a wearable device according to claim 2, wherein: At least one of the pads includes a second pad and a third pad, the first inner circuit layer includes the second pad, the second outer circuit layer includes the third pad, the second pad and the third pad are both exposed from the second covering film, and the electronic component includes a second electronic component and a third electronic component respectively mounted on the second pad and the third pad.

6. The method for manufacturing a fixing strap for a wearable device according to claim 2, wherein: A groove is provided in part of the insulating layer, and the electrical conducting portion is provided in the groove; A through hole is provided at the bottom of the groove, and the through hole passes through another part of the insulating layer and the first covering film. The bottom of the through hole corresponds to the first outer circuit layer. A conductive part for electrically connecting the electrically conductive part and the first outer circuit layer is provided in the through hole.

7. The method for manufacturing a fixing strap for a wearable device according to claim 1, wherein: The electrical conducting portion is a gold finger.

8. A fixing belt for a wearable device, characterized in that: include: A flexible circuit board comprising a first area and a second area connected to the first area, wherein the flexible circuit board is provided with at least one solder pad in the first area; an insulating layer, disposed on the second region, wherein the insulating layer is provided with an electrical conducting portion; A first protective layer and a second protective layer are respectively provided on two opposite surfaces of the flexible circuit board, and the electrical conductive portion is located between the flexible circuit board and the first protective layer; The electronic component is mounted on the pad, wherein the wearable device fixing belt forms a plug-in area in the portion including the second area, the plug-in area is used to be plugged into the device body, and the electrical conductive portion is provided in the plug-in area. The insulating layer is further covered with a support frame, an insertion space is defined between the support frame and the insulating layer, and the electrical conductive portion is connected to the insertion space.

9. The wearable device fixing belt according to claim 8, wherein: The flexible circuit board includes a base layer and a first inner circuit layer and a second inner circuit layer respectively arranged on two opposite surfaces of the base layer, a first outer circuit layer and a first covering film are sequentially arranged on the first inner circuit layer, and a second outer circuit layer and a second covering film are sequentially arranged on the second inner circuit layer, wherein the first protective layer and the second protective layer are respectively located on the first covering film and the second covering film.

10. The wearable device fixing belt according to claim 9, wherein: At least one of the pads includes a first pad, the first outer circuit layer includes the first pad, the first pad is exposed from the first cover film, and the electronic component includes a first electronic component mounted on the first pad.

11. The wearable device fixing belt according to claim 10, wherein: The first protective layer is provided with a window for exposing the first electronic component, and a third protective layer is provided in the window.

12. The wearable device fixing strap according to claim 9, wherein: At least one of the pads includes a second pad and a third pad, the first inner circuit layer includes the second pad, the second outer circuit layer includes the third pad, the second pad and the third pad are both exposed from the second covering film, and the electronic component includes a second electronic component and a third electronic component respectively mounted on the second pad and the third pad.

13. The wearable device fixing belt according to claim 9, wherein: A groove is provided in part of the insulating layer, and the electrical conducting portion is provided in the groove; A through hole is provided at the bottom of the groove, and the through hole passes through another part of the insulating layer and the first covering film. The bottom of the through hole corresponds to the first outer circuit layer. A conductive part for electrically connecting the electrically conductive part and the first outer circuit layer is provided in the through hole.

14. A wearable device, comprising a device body, characterized in that: The wearable device further comprises a wearable device fixing belt according to any one of claims 8 to 13, and the device body is plugged into the plug-in area of ​​the wearable device fixing belt and electrically connected to the electrical conductive portion.

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