Laser cutting method

Abstract

The present invention relates to a laser cutting method. The laser light emitted by a laser focus control device performs multiple laser cuts along the cutting position of an object to be cut. Each laser light cut is at the depth of the object to be cut, and the cutting width of the laser light for each laser cut decreases as the depth of the cutting position increases.

Description

Technical Field

[0001] The present invention relates to a cutting method, and more particularly to a laser cutting method. Background Art

[0002] Laser cutting technology, with characteristics such as precision, flexibility, and non-contact, has been continuously expanding its applications in various fields. The energy density of the laser beam has a maximum value at the exact center of the focal point of the laser beam, and gradually decreases outward from it. Please refer to Figure 1 As shown, in the current laser cutting process, generally, the object to be cut 12 is placed on the carrier substrate 10, and then the focus of the laser spot is adjusted to just fall on the same cutting path 14 of the object to be cut 12. As the number of cutting times increases, the focal depth of the laser spot applied to the object to be cut 12 also gradually increases until the product on the entire cutting path is completely cut off.

[0003] Moreover, many manufacturers have also developed various laser processing technologies. For example, Japanese Patent No. 5096040 (Patent Name: Laser Processing Method and Its Laser Processed Product, hereinafter referred to as Patent Precedent 1), its specification mentions that in the laser processing method of this embodiment, on the one hand, an aspiration nozzle is used to aspirate and remove the decomposition products generated when irradiating the object to be processed with laser light, and on the other hand, laser processing is performed. Regarding aspiration and removal, preferably, it is implemented along the coaxial direction of the irradiation direction of the laser light, or from the rear of the traveling direction (scanning direction) of the laser light processing. The decomposition products tend to fly backward in the scanning direction. Therefore, implementing aspiration and removal from the above directions can improve the removal efficiency.

[0004] Also, for example, in Japanese Patent No. 4361103 (Patent Name: Optical Member Bonding Method and Device Using the Same, hereinafter referred to as Patent Precedent 2), the specification mentions that when cutting the cutting portion of the optical member with the laser optical axis inclined in the vertical direction and from the rear to the front of the traveling direction of the laser, contamination of the optical member, etc. cannot be suppressed under any conditions. However, when cutting in a state where the laser optical axis is inclined from the front to the rear of the traveling direction of the laser, the contamination of the optical member, etc. caused by the generated smoke can be reduced. Specifically, when cutting using this method, the smoke generated flows obliquely upward to the rear from the cutting portion, does not cover the optical member, etc., and does not flow along the surface.

[0005] Furthermore, in the specification of Patent Precedent 2, it is also mentioned that during the process of cutting the above-mentioned optical functional film or protective film and optical functional film, warm air is blown towards the cutting site, and the gas generated during cutting is collected and removed. According to this method invention, warm air is blown onto the cutting site, thereby raising the temperature of its periphery. At the same time, the gas generated when the optical component or protective film and optical component are cut by laser is transported by warm air and the gas is collected and removed. As a result, foreign matter can be prevented from adhering to the cutting site and its periphery.

[0006] Also, for example, in Chinese Patent Publication No. 113732527 (invention title: An ultraviolet picosecond laser cutting method for cutting LCP materials), its abstract mentions that the present invention belongs to the technical field of LCP material processing methods, and specifically relates to an ultraviolet picosecond laser cutting method for cutting liquid crystal polymer (abbreviation: LCP) materials. The ultraviolet picosecond laser cutting method for cutting LCP materials according to the present invention includes: measuring the thickness of the LCP material to be cut; calculating the number of cutting times and the single-cut time according to the thickness of the LCP material to be cut and the output parameters of the laser; controlling the laser to output corresponding laser beams to the LCP material successively according to the set output parameters, number of cutting times, and single-cut time, and after each cutting, moving the focal position of the laser beam towards the center of the LCP material by a corresponding distance; the present invention cuts the LCP material through a laser, cutting a corresponding thickness each time and finishing after multiple cuts. For LCP materials with a relatively thick thickness, after each cut, the focal position is changed, and the focal position gradually moves from the surface of the LCP material towards the center of the LCP material. By changing the single laser pulse width and laser repetition frequency, the generation of soot is suppressed and the soot adhesion on the cutting surface is reduced.

[0007] However, for the object 12 to be cut with a relatively thick thickness, when the same cutting path is repeatedly cut, it often requires repeated cutting more than ten times or even more times, which in turn leads to many drawbacks. The following are several common problems:

[0008] (1) The energy of multiple circles is superimposed at the same position, resulting in an uneven cutting edge and a larger burned area of the object 12 to be cut. Especially for optical products, the uneven cutting edge or larger burned area causes a loss of the area of the effective imaging region and affects the final imaging quality;

[0009] (2) As the number of cutting times increases, the height of the uncut part of the object 12 to be cut is far from the focal position of the laser spot 400 of the laser light 40, resulting in insufficient laser light energy and a decrease in the effective cutting depth of each single circle;

[0010] (3) As the number of cutting times increases, the cutting gap gradually becomes deeper. The soot 16 generated by cutting cannot be discharged smoothly, as Figure 2As shown by the selected area, thus blocking the cutting path 14, preventing the subsequent laser cutting light from penetrating deeply, reducing the cutting effect of subsequent cycles, and causing the cutting position 18 of the object to be cut 12 to be skewed and uneven (as Figure 3 shown).

[0011] In the above-mentioned prior patent cases, different methods are used to remove or suppress the attachment of soot on the object to be cut, but there are still problems. For example, when laser cutting, the inclination of the laser optical axis can easily make the cut surface of the thin film conical, which may affect the processing accuracy of the product, and may even cause the size to not meet the requirements and become defective products. If warm air is blown at the cutting part, additional blowing and heating equipment are required, and attention must be paid to avoiding the blocking of the cutting part by the blowing and heating equipment. And if the method of gradually moving towards the center of the object to be cut 12 is adopted, in fact, each time moving towards the center requires deepening the cutting depth. The soot has nowhere to be discharged at deeper positions, and there is still a high probability of blocking in the cutting gap, preventing the subsequent laser cutting light from penetrating deeply, and reducing the cutting effect of subsequent cycles. Therefore, it is necessary to improve this problem. Summary of the Invention

[0012] In view of the fact that the traditional laser cutting method still has the problem of being unable to effectively discharge soot, the purpose of the present invention is to generate a soot discharge channel during the laser cutting of the object to be cut, so that the soot can be discharged, facilitating the continuous deep cutting of the object to be cut, and then completing the cutting operation.

[0013] According to the purpose of the present invention, a laser cutting method is provided. The method operates a laser focus control device in the following steps. The laser light emitted by the laser focus control device performs multiple laser cuts along the cutting position of the object to be cut. The laser light for each laser cut respectively corresponds to different depths of the cutting position, and the cutting width of the laser light for each laser cut decreases as the depth of the cutting position increases.

[0014] Among them, the laser focus control device controls the size of the cutting width with different numbers of laser lights.

[0015] Among them, when the laser light for each laser cut is respectively at the cutting position of the same depth, the size of the laser spot of each laser light is the same.

[0016] Among them, when the laser focus control device controls each laser light at the same depth of the cutting position, it simultaneously controls the energy of the overlapping area of each laser spot to tend to be consistent.

[0017] Among them, after the laser focus control device completes each laser cut, the horizontal height of the laser light for the next laser cut decreases less than the cutting depth formed by the laser light for melting the object to be cut.

[0018] Among them, the laser focus control device controls different cutting widths by gradually reducing the output of 1 + N laser beams to one laser beam. The laser spots of the 1 + N laser beams partially overlap each other to form the cutting width of the initial laser beam, and the laser spot of a single laser beam is the cutting width of the last laser beam.

[0019] Among them, when the laser focus control device outputs 1 + N laser beams, the spacing distance between each laser beam is less than the diameter of the laser spot.

[0020] Among them, the cutting position of the laser focus control device when outputting 1 + N laser beams is between the cutting position of the object to be cut and the cutting waste area of the object to be cut.

[0021] Among them, during the process that the laser focus control device controls the output of 1 + N laser beams to gradually reduce to one laser beam, the laser beam closest to the cutting position remains at the cutting position. In other words, the cutting width change of the laser focus control device gradually becomes narrower from the cutting waste area towards the cutting position.

[0022] Among them, before the laser cutting starts, after determining the surface height of the object to be cut through the height measurement module, the laser focus control device controls and sets the cutting horizontal height of the laser beam for the initial laser cutting.

[0023] Among them, the laser focus control device controls and sets the foci of the 1 + N laser beams to fall between the cutting position and the cutting waste area of the object to be cut, and performs the cutting of the laser beam.

[0024] Among them, the laser focus control device outputs a single laser beam, and uses the size and energy of the laser spot of the single laser beam to control the cutting depth and cutting width at different depth positions.

[0025] To sum up, during each laser cutting process, at the position of the last laser cutting, the laser cutting gap is widened from the cutting position towards the cutting waste area, facilitating the smooth discharge of the smoke and dust generated by the cutting, which is beneficial for the next laser cutting. Furthermore, it enables the laser cutting of the object to be cut to be evenly, stably, and thoroughly cut throughout the entire cutting path, and the cutting edge is flat, which is also beneficial for the subsequent assembly of the product. Description of the Drawings

[0026] Figure 1 It is a schematic diagram of placing the object to be cut on the carrier substrate of the prior art.

[0027] Figure 2 It is a schematic diagram of an electron micrograph of the object to be cut accumulating smoke and dust of the prior art.

[0028] Figure 3 It is a schematic diagram of an electron micrograph of the object to be cut after cutting in the prior art.

[0029] Figure 4 It is a front schematic view of the laser cutting of the present invention.

[0030] Figure 5 It is a top view action schematic view of the laser cutting of the present invention.

[0031] Figure 6 It is a schematic view of the cutting depth of the laser cutting of the present invention.

[0032] Figure 7 It is a schematic view of the size of a single laser spot of the laser cutting of the present invention.

[0033] Figure 8 It is a schematic view of the sizes of two laser spots of the laser cutting of the present invention.

[0034] Figure 9 It is a schematic view of the cutting position, cutting waste area and cutting reserved area of the object to be cut of the present invention.

[0035] Figure 10 It is a schematic view of one embodiment of the laser cutting of the present invention.

[0036] Figure 11 It is a schematic view of another embodiment of the laser cutting of the present invention.

[0037] Figure 12 It is a schematic view of an electron micrograph after the object to be cut of the present invention is cut.

[0038] The reference numerals are:

[0039] 10, 3: Carrier substrate

[0040] 12, 2: Object to be cut

[0041] 14: Cutting path

[0042] 20: Cutting position

[0043] 4: Laser focus control device

[0044] 40: Laser beam

[0045] 400: Laser spot

[0046] 5: Altitude measurement module

[0047] 6: Cutting control module

[0048] W: Cutting width

[0049] S: Horizontal height of cutting

[0050] H: Cutting depth Detailed implementation manners

[0051] Embodiments of the present invention will be further described below in conjunction with the relevant drawings. As much as possible, in the drawings and the specification, the same reference numerals represent the same or similar components. In the drawings, for the sake of simplicity and convenience of labeling, the shapes and thicknesses may be exaggerated. It can be understood that the elements not specifically shown in the drawings or described in the specification are in the forms known to those of ordinary skill in the art. Those of ordinary skill in the art can make various changes and modifications according to the content of the present invention.

[0052] When an element is referred to as being "on" another element, it can generally mean that the element is directly on the other element, or there can be other elements between the two. Conversely, when an element is referred to as being "directly on" another element, there cannot be other elements between the two. As used herein, the term "and / or" includes any combination of one or more of the listed related items.

[0053] The description of "an embodiment" or "one embodiment" hereinafter refers to a specific element, structure, or feature related to at least one embodiment. Therefore, the multiple descriptions of "an embodiment" or "one embodiment" that appear in multiple places hereinafter are not directed to the same embodiment. Furthermore, the specific components, structures, and features in one or more embodiments can be combined in a suitable manner.

[0054] The present invention is particularly described by the following examples, which are only for illustrative purposes. Because for those skilled in the art, without departing from the spirit and scope of the present disclosure, various changes and modifications can be made. Therefore, the protection scope of the present invention shall be subject to that defined by the appended claims. Throughout the specification and the claims, unless the content clearly specifies otherwise, the meanings of "a" and "the" include such descriptions including "one or at least one" of the element or component. In addition, unless it is clearly visible from a specific context that multiple elements are excluded, the singular article also includes the description of multiple elements or components. Moreover, when applied in this description and the following claims, unless the content clearly specifies otherwise, the meaning of "in which" can include "in which" and "on which". The terms used throughout the specification and the claims, unless otherwise noted, generally have their ordinary meanings in the art, in the context of the present invention, and in the specific context. Some of the terms used to describe the present invention will be discussed below or elsewhere in this specification to provide additional guidance to practitioners regarding the description of the present invention. The use of examples anywhere in the specification, including the use of examples of any of the terms discussed herein, is only for illustrative purposes and does not limit the present invention or the scope and meaning of any illustrative term. Similarly, the present invention is not limited to the various embodiments presented in this specification.

[0055] As used herein, terms such as "comprising", "including", "having", "containing", "involving", etc. are open-ended, meaning including but not limited to. Additionally, any embodiment or claim of the present invention does not have to achieve all the purposes, advantages, or features disclosed in the present invention. Furthermore, the abstract part and the title are only used to assist in searching patent documents and are not used to limit the claims of the invention.

[0056] Unless otherwise specified, some conditional clauses or words, such as "can", "could", "might", or "may", generally attempt to express that embodiments of the present case have features, elements, or steps that, however, can also be interpreted as possibly not being required. In other embodiments, these features, elements, or steps may not be required.

[0057] Please refer to Figure 4 and Figure 5 As shown, the present invention is a laser cutting method, which includes the following steps: the object to be cut 2 is placed on the supporting substrate 3, and the laser beam 40 emitted by the laser focus control device 4 performs multiple laser cuts along the cutting position 20 of the object to be cut 2, wherein the laser beams of each laser cut respectively correspond to different depths of the cutting position, and the cutting width of the laser beam of each laser cut decreases as the depth of the cutting position increases.

[0058] In other words, the laser beam 40 of each laser cut cuts at different horizontal height positions of the object to be cut 2, and the cutting width W of the laser beam 40 of each laser cut on the object to be cut 2 is smaller at lower horizontal cutting heights. Also, during any two laser cuts of the laser focus control device 4 on the object to be cut 2, the horizontal height of the laser beam 40 of the previous laser cut on the object to be cut 2 is higher than the horizontal height of the laser beam 40 of the subsequent laser cut on the object to be cut 2, and the width of the previous laser cut on the object to be cut 2 is greater than the width of the subsequent laser cut on the object to be cut 2.

[0059] To further understand the present case, the following is an example to illustrate the steps of laser cutting:

[0060] (S201) Determine the surface height of the object to be cut 2 by the height measurement module 5, where the height measurement module 5 is an infrared height gauge, an ultrasonic height gauge, a laser rangefinder, etc., and its purpose is to confirm that the laser beam 40 output by the laser focus control device 4 can be emitted to the surface of the object to be cut 2 to start cutting;

[0061] (S202) The cutting control module 6 calculates the number of laser cutting times required for the object to be cut 2 at the cutting position 20 and the horizontal height positions of each cutting based on the thickness, material composition of the object to be cut 2, and the control parameters of the cutting depth of the laser light 40 for various materials. The object to be cut 2 can be a single-layer plastic optical lens, a multi-layer lens module, or a multi-layer stacked display, but is not limited to this in actual implementation. The control parameters of the cutting depth of the laser light 40 for various materials can be obtained through experimental verification for the laser focus control device 4, and the cutting control module 6 can be a computer or an electronic device similar to a computer with computing functions.

[0062] (S203) The laser focus control device 4 performs each laser cutting according to the control parameters. The cutting horizontal height of the laser light 40 for the first laser cutting is on the surface of the object to be cut 2, and the foci of the 1 + N laser lights 40 controlled by the laser focus control device 4 fall between the cutting position 20 and the cutting waste area 22 of the object to be cut 2. The laser light 40 for the last laser cutting is only a single laser light 40, and the cutting width W gradually decreases during the other cutting times between the first laser cutting and the last laser cutting. Here, N is an integer greater than or equal to 0. When the laser focus control device 4 controls the size of the cutting width W with different numbers of laser lights 40, it is better that the size of the laser spot 400 of the laser lights 40 for laser cutting at the same horizontal height is the same. When the overlapping area of the laser spot 400 and the middle part, the laser focus control device 4 controls the energy to be consistent so that the cutting depths of the laser cutting at the same horizontal height are the same. Or the laser focus control device 4 outputs a single laser light 40, and controls the cutting depth H and the cutting width W at different horizontal positions with the size and energy of the laser spot of the laser light.

[0063] Please refer to Figure 5 As shown, in the present invention, the cutting width W of the laser light 40 for the first laser cutting is the widest among all cutting times, and the cutting horizontal position of the laser light 40 for the first laser cutting is the closest to the top surface of the object to be cut 2 among all cutting times. The cutting width W of the laser light 40 for the last laser cutting is the narrowest among all cutting times, and the cutting depth of the laser light 40 for the last laser cutting is to cut off the object to be cut 2. Thus, during the cutting process of the laser light 40 for the first laser cutting, the object to be cut 2 is open to the outside, so the soot does not accumulate in the cutting gap. During the cutting process of the laser lights 40 for the subsequent laser cuttings, since the cutting gaps of the laser lights 40 are wider, the soot can be discharged from the cutting gaps.

[0064] To avoid the problem that each time the laser light 40 cuts the object to be cut 2 at the maximum cutting depth, but due to precision errors, it fails to be completely cut off. Please refer toFigure 6 As shown, in the present invention, after the laser focus control device 4 completes each laser cutting, the horizontal height S of the laser light 40 descending for the next laser cutting is less than the cutting depth H of the laser light 40 for ablating the object 2 to be cut. For example, the depth of the laser light 40 for ablating the object 2 to be cut is 5 mm, and the horizontal height of each descending cutting does not exceed or is equal to 5 mm, for example, the horizontal height of each descending cutting is 4.5 mm or 4 mm.

[0065] See also Figure 4 , 5 As shown, in the present invention, the laser focus control device 4 controls different cutting widths W by outputting 1+N laser lights 40 and gradually reducing to one laser light 40, wherein the laser spots 400 of the 1+N laser lights 40 partially overlap with each other to form the initial cutting width W of the laser light 40, and the laser spot 400 of a single laser light 40 is the last cutting width W of the laser light 40. For example: the first laser cutting is 5 laser spots 400 of the laser lights 40 irradiating the surface of the object 2 to be cut, the next laser cutting is 3 laser spots 400 of the laser lights 40 irradiating the next level of the object 2 to be cut, and the last laser cutting is 1 laser spot 400 of the laser light 40 irradiating the last level of the object 2 to be cut. However, the actual implementation of the present invention is not limited to this.

[0066] See also Figure 7 and Figure 8 As shown, in the present invention, when the laser focus control device 4 outputs 1+N laser lights 40, the interval D1 of each laser light 40 is smaller than the diameter D0 of the laser spot 400. For example, the size of the laser spot 400 of the laser light 40 is 5 microns in diameter, and the laser cutting is irradiated with 5 laser spots 400 of the laser light 40 onto the surface of the object 2 to be cut. The distance between the center points of any two laser spots 400 of the laser light 40 is 4 microns, but the present invention is not limited to this when it is actually implemented.

[0067] See also Figure 9 As shown, in the present invention, the cutting position 20 at which the laser focus control device 4 outputs 1+N laser beams is between the cutting position 20 of the object 2 to be cut and the cutting waste area 22 of the object 2 to be cut. For example, the object 2 to be cut is a rectangle of 11 cm×11 cm and is to be cut into a rectangle of 10 cm×10 cm. The rectangular position where the edges of the object 2 to be cut are retracted 1 cm inward is the cutting position 20, and the cutting waste area 22 is from the cutting position 20 to the edge of the object 2 to be cut, and the area within the cutting position 20 is the cutting reserve area 24.

[0068] To prevent the laser cutting position from exceeding the cutting position 20 and entering the cutting reserve area 24, please refer toFigure 4 As shown, in the present invention, during the process that the laser focus control device 4 controls the output of 1 + N laser beams 40 to gradually decrease to one laser beam 40, each time the laser beam 40 closest to the cutting position 20 during laser cutting remains at the cutting position 20. In other words, the cutting width W of the laser focus control device 4 gradually narrows from the cutting waste area 22 towards the cutting position 20.

[0069] Please refer to Figure 10 As shown, for example, assume that the object to be cut 2 is a single material with a thickness of 20 mm, and the size of the laser spot 400 of the laser beam 40 is 5 microns in diameter, and the cutting depth each time is 5 mm. In order to ensure that the cutting can be completed, the descending level height after each laser cutting is 4 mm. After calculation, the object to be cut 2 needs to be laser cut five times.

[0070] Assume that during the cutting process, the first laser cutting irradiates the object to be cut 2 with the laser spots 400 of five laser beams 40, the second laser cutting irradiates the object to be cut 2 with the laser spots 400 of four laser beams 40, the third laser cutting irradiates the object to be cut 2 with the laser spots 400 of three laser beams 40, the fourth laser cutting irradiates the object to be cut 2 with the laser spots 400 of two laser beams 40, and the fifth laser cutting irradiates the object to be cut 2 with the laser spot 400 of one laser beam 40. Moreover, during each laser cutting process, there is one laser beam 40 at the cutting position 20, and the other laser beams 40 are located in the cutting waste area 22.

[0071] Furthermore, in terms of the horizontal height of each laser cutting, the horizontal height of the first laser cutting is on the surface of the object to be cut 2, and the object to be cut 2 is ablated by more than 4.5 - 5 mm. The horizontal height of the second laser cutting is at a position 4 mm below the surface of the object to be cut 2, and the object to be cut 2 is ablated by more than 4.5 - 5 mm. The horizontal height of the third laser cutting is at a position 8 mm below the surface of the object to be cut 2, and the object to be cut 2 is ablated by more than 4.5 - 5 mm. The horizontal height of the fourth laser cutting is at a position 12 mm below the surface of the object to be cut 2, and the object to be cut 2 is ablated by more than 4.5 - 5 mm. The horizontal height of the fifth laser cutting is at a position 16 mm below the surface of the object to be cut 2, and the object to be cut 2 is ablated by more than 4.5 - 5 mm. In other words, the height that the laser beam 40 can ablate is 20.5 - 21 mm, exceeding the 20 mm of the object to be cut 2.

[0072] Please refer to Figure 11As shown, for example, assume that the object to be cut 2 is a composite material composed of three different layers. The thicknesses of the first and third layers are 10 mm. The size of the laser spot 400 of the laser beam 40 for cutting this layer is 5 μm in diameter, and the cutting depth per time is 4 mm. To ensure that the cutting can be completed, the descending height after each laser cutting is 3 mm. After calculation, the first and third layers of the object to be cut 2 each require 3 laser cuttings. The thickness of the second layer is 6 mm. The size of the laser spot 400 of the laser beam 40 for cutting this layer is 5 μm in diameter, and the cutting depth per time is 2 mm. To ensure that the cutting can be completed, the descending height after each laser cutting is 1.5 mm. After calculation, the second layer of the object to be cut 2 requires 4 laser cuttings. In total, 10 laser cuttings are required above.

[0073] Assume that during the cutting process, the laser spots 400 of all the laser beams 40 in the first laser cutting overlap with each other to form a cutting width W of about 14 μm. The width is reduced by 1 μm each time. Then, the laser spots 400 of all the laser beams 40 in the fifth laser cutting overlap with each other to form a cutting width W of about 10 μm. The cutting width W of the laser spot 400 of a single laser beam 40 in the tenth laser cutting is 5 μm. However, during each laser cutting process, it is better that the laser energy in the cutting width W formed by the overlapping of the laser spots 400 of the laser beam 40 is as uniform as possible.

[0074] In summary, in each laser cutting process of the present invention, the cutting control module 6 uses the parameters such as the material, thickness of the object to be cut 2, the cutting depth, cutting energy, and laser spot of the laser beam 40 to experiment and calculate the number of laser cuttings and the size of the cutting width W of the laser focus control device 4 in advance. However, the actual implementation is not limited to this. All parameter conditions that can calculate the number of laser cuttings and the size of the cutting width W of the laser focus control device 4 fall within the scope claimed by the present invention. And the cutting widths W in each cutting before the last laser cutting are widened from the cutting position 20 towards the cutting waste area 22, facilitating the smooth discharge of the smoke and dust generated by the cutting, which is beneficial for the next laser cutting, and further enabling the laser cutting of the object to be cut 2 to be cut thoroughly, evenly, and stably along the entire cutting path, and the cutting edge is flat (please refer to Figure 12 ), which is also beneficial for the subsequent assembly of the product.

[0075] Furthermore, regarding the energy of the laser beam 40 for each laser cutting, the cutting depth, the size of the laser spot, etc., experiments and calculations can be carried out with reference to the parameter conditions of various existing laser cutting machines. There are also many public documents on how to calculate the laser cutting depth, the cutting energy, and the laser spot. For example, in the invention patent TWI504463B (invention title: Method and apparatus for controlling the focal spot size of a laser beam), many formulas regarding the relationship between the laser wavelength and the laser spot (focal spot) are mentioned.

[0076] The above is only an example to illustrate the preferred implementation of this creation, and does not limit the scope of implementation. Any simple substitution and equivalent change made according to the claims of this creation and the content of the patent specification belong to the scope of the patent application of this creation.

Claims

1. A laser cutting method, characterized in that, the method is to control the laser light emitted by the laser focus control device to perform multiple laser cuts along the cutting position of the object to be cut, wherein the laser light of each laser cut respectively corresponds to different depths of the cutting position, and the cutting width of the laser light of each laser cut decreases as the depth of the cutting position increases; wherein, the laser focus control device controls the size of the cutting width with different numbers of the laser light; the laser light of each laser cut respectively corresponds to the same depth of the cutting position, and the sizes of the laser spots of each laser light are the same; the laser focus control device controls different cutting widths by gradually reducing the output of 1 + N laser lights to one laser light, wherein the overlapping laser spot of the 1 + N laser lights is the cutting width of the initial laser light, and the laser spot of a single laser light is the cutting width of the last laser light, wherein, N is an integer greater than or equal to 0.

2. The laser cutting method according to claim 1, characterized in that, wherein the horizontal height of each laser light cut by the laser focus control device each time is less than the cutting depth formed by the laser light for ablating the object to be cut.

3. The laser cutting method according to claim 1, characterized in that, wherein in the state where the laser focus control device outputs 1 + N laser lights, the spacing distance between each laser light is less than the diameter of the laser spot of each laser light.

4. The laser cutting method according to claim 1, characterized in that, wherein the cutting positions of the 1 + N laser lights of the laser focus control device are between the cutting position of the object to be cut and the cutting waste area of the object to be cut.

5. The laser cutting method according to claim 1, characterized in that, wherein during the process of the laser focus control device controlling the output of 1 + N laser lights to gradually reduce to one laser light, the laser light closest to the cutting position remains at the cutting position.

6. The laser cutting method according to claim 1, characterized in that, wherein when the laser focus control device controls each laser light to be at the same depth of the cutting position, the energy of the partially overlapping areas of each laser spot is simultaneously controlled to be consistent.

7. The laser cutting method according to claim 1, characterized in that, wherein when the laser focus control device outputs a single laser light, the cutting depth and cutting width at different depth positions are controlled by the size and energy of the laser spot of the laser light.

8. The laser cutting method according to claim 1, characterized in that, wherein before the laser focus control device starts laser cutting, after determining the surface height of the object to be cut via the height measurement module, the laser focus control device controls and sets the cutting horizontal height of the laser light for the initial laser cut.

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