Wire bonding device

Abstract

The wire bonding device includes a bonding platform, a bonding head, an XY driving mechanism and a frame, and the XY driving mechanism includes: an X-direction guide member installed on the frame; an X-direction slider supported by the X-direction guide member and moving in the X direction, on which an X-direction movable member is installed; a Y-direction guide member installed on the lower side of the X-direction slider; and a Y-direction slider supported by the Y-direction guide member and moving in the Y direction, on which the bonding head is installed. The XY driving mechanism is installed on the frame above the placement surface of the bonding platform and behind the bonding platform in the Y direction, with a part of the Y-direction guide member overlapping the placement surface. The wire bonding device of the present invention can reduce the vibration of the wire bonding device and achieve high-speed bonding.

Description

Technical Field

[0001] The present invention relates to a structure of a wire bonding device. Background Art

[0002] In the industry, wire bonding devices are being used, which connect electrodes of a semiconductor die and electrodes of a substrate using wires.

[0003] Among these wire bonding devices, the following structure is being used: a bonding stage on which an object to be bonded is placed and an XY drive mechanism that drives a device installed on the upper side in the XY directions are arranged side by side on a stand, and a bonding head that drives the tip of a bonding arm in the Z direction is installed on the XY drive mechanism, and the tip of the bonding arm is driven in the XYZ directions to perform wire bonding or bonding of a semiconductor die (for example, refer to Patent Document 1 Figure 6 ).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent No. 3537890 Specification Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] In the conventional wire bonding device, in order to prevent the XY drive mechanism or the bonding head installed on the XY drive mechanism from interfering with the bonding stage, it is necessary to arrange the XY drive mechanism and the bonding head away from the bonding stage. Therefore, the center of gravity position of the bonding head is far from the thrust center of the XY drive mechanism, and sometimes the vibration of the bonding head when driving the bonding head using the XY drive mechanism becomes large, and the bonding quality deteriorates. In addition, if the bonding speed is set to be high, the vibration becomes large, and there are problems such as the inability to increase the bonding speed.

[0009] Therefore, an object of the present invention is to reduce the vibration of the wire bonding device and achieve high-speed bonding.

[0010] Technical Means for Solving the Problems

[0011] The wire bonding device of the present invention comprises: a bonding platform on which a bonding object is placed on a loading surface; a bonding head on which a bonding arm is installed; an XY drive mechanism for driving the bonding head in a Y direction and an X direction, wherein the Y direction is a length direction of the bonding arm and the X direction is a front-rear direction orthogonal to the Y direction in a horizontal plane; and a frame for supporting the XY drive mechanism, wherein the XY drive mechanism of the wire bonding device comprises: an X-direction guide mounted on the frame; an X-direction slider supported in the up-down direction by the X-direction guide and guided in the X direction so as to move in the X direction, an X-direction movable member having an X-direction motor mounted on the upper side; a Y-direction guide mounted on the lower side of the X-direction slider; and a Y-direction slider supported in the up-down direction by the Y-direction guide and guided in the Y direction so as to move in the Y direction, the bonding head being installed, and the XY drive mechanism being mounted on the frame above the loading surface of the bonding platform and behind the bonding platform in the Y direction so that a portion of the front of the Y-direction guide overlaps with the loading surface of the bonding platform when viewed from above.

[0012] In this way, the Y-direction guide is installed on the frame in a manner that a portion of the front of the Y-direction guide overlaps the loading surface of the bonding platform, so that the position of the X-direction slider on which the Y-direction guide and the movable part of the X-direction motor are installed can be close to the bonding platform. As a result, the center position of the movable part of the X-direction motor, which is the Y-direction position of the thrust center of the X-direction of the XY drive mechanism, can be close to the bonding platform. As a result, the maximum value of the deviation between the center of gravity position of the bonding head and the center position of the movable part of the X-direction motor can be made smaller than that of the wire bonding device of the prior art. Therefore, the yawing moment applied to the bonding head when the bonding head is driven in the X direction by the XY drive mechanism can be further reduced than that of the wire bonding device of the prior art, thereby reducing the vibration of the bonding head around the vertical axis and improving the bonding quality.

[0013] In the wire bonding device of the present invention, the bonding arm can also be installed on the bonding head in a manner such that the rear end portion can be freely rotatably installed around a rotating axis extending along the X direction and the front end can be moved in a direction approaching or away from the loading surface of the bonding platform, and the height of the rotating axis is the same as the bonding surface of the bonding object placed on the loading surface of the bonding platform.

[0014] Thus, the tip of the bonding tool can be moved in a vertical direction relative to the bonding surface during bonding, thereby improving the rigidity of the bonding head. In addition, the wire bonding device can be made faster.

[0015] In the wire bonding device of the present invention, the Y-direction position of the center of gravity of the load body when the front end of the bonding arm is located at the Y-direction center of the bonding platform and the Y-direction distance from the Y-direction position of the center of the X-direction movable part can also be smaller than 1 / 10 of the Y-direction stroke of the bonding arm, and the load body is a collection of parts moved in the X-direction by the X-direction movable part of the X-direction motor.

[0016] Thus, the center-of-gravity position of the load body can be made close to the center position of the movable member of the X-direction motor, reducing the vibration of the bonding head about the vertical axis when the bonding head is driven in the X direction by the XY drive mechanism, improving the bonding quality, and enabling high-speed bonding.

[0017] In the wire bonding device of the present invention, the Y-direction position of the center of gravity of the load body when the front end of the bonding arm is at the center in the Y direction of the bonding platform can also be set to the same position as the Y-direction position of the center of the X-direction movable member, or to a position more rearward in the Y direction than the Y-direction position of the center of the X-direction movable member.

[0018] In this way, by setting the Y-direction position of the center of gravity of the load body when the front end of the bonding arm is at the center in the Y direction of the bonding platform to the same position as the Y-direction position of the center of the X-direction movable member, the deviation amount between the center-of-gravity position of the load body and the center position of the movable member of the X-direction motor can be minimized. Therefore, the vibration of the bonding head about the vertical axis when the bonding head is driven in the X direction by the XY drive mechanism can be further reduced, improving the bonding quality, and enabling high-speed bonding.

[0019] In addition, by setting the Y-direction position of the center of gravity of the load body when the front end of the bonding arm is at the center in the Y direction of the bonding platform to a position more rearward in the Y direction than the Y-direction position of the center of the X-direction movable member, the vibration of the bonding head about the vertical axis when the front end of the bonding arm is near the front end of the bonding platform can be further reduced, and the bonding quality can be further improved.

[0020] In the wire bonding device of the present invention, the load body may also include a Y-direction guide, a Y-direction slider, a bonding head, and a bonding arm.

[0021] In the wire bonding device of the present invention, a camera device and a lens barrel for guiding light from the object to be bonded to the camera device may also be installed on the bonding head, and the load body includes a Y-direction guide, a Y-direction slider, a bonding head, a bonding arm, a camera device, and a lens barrel.

[0022] In the wire bonding device of the present invention, the Y-direction slider may also move in the Y direction above the placement surface of the bonding platform, the bonding arm is installed on the bonding head so as to extend forward in the Y direction from the bonding head, and the bonding head is installed on the lower side of the Y-direction slider so that the bonding arm moves in the Y direction above the placement surface of the bonding platform.

[0023] In the wire bonding device of the present invention, the rear end portion of the bonding arm may also be rotatably installed on the bonding head through a cross leaf spring formed by crossing two leaf springs in a cross shape, and the rotation axis is set to an axis along the line where the two leaf springs cross.

[0024] The bonding arm is rotationally supported by a leaf spring around a rotation axis, so there is no frictional resistance like that of a rotary bearing or the like, and almost no resistance to rotation is generated. Therefore, a small bonding load can be applied to the lead wire and the bonding object to improve the bonding accuracy.

[0025] Effects of the Invention

[0026] The wire bonding device of the present invention can reduce the vibration of the wire bonding device and achieve high-speed bonding. Description of the Drawings

[0027] Figure 1 It is a side view of the wire bonding device showing an embodiment, and is a view showing a state where the front end of the bonding arm is located at the center in the Y direction of the bonding platform.

[0028] Figure 2 It is a perspective view showing an XY drive mechanism, a bonding head mounted on the XY drive mechanism, and a bonding arm and a lens barrel mounted on the bonding head.

[0029] Figure 3 It is a perspective view showing a slider in the Y direction of the XY drive mechanism and a bonding head mounted on the slider in the Y direction.

[0030] Figure 4 It is a perspective view showing a movable member in the Y direction of the XY drive mechanism and a sliding mechanism of the movable member in the Y direction.

[0031] Figure 5 It is a perspective view showing a cross roller guide connecting the slider in the Y direction of the XY drive mechanism and a base of the movable member in the Y direction.

[0032] Figure 6 For Figure 1 A perspective view of the bonding arm of the wire bonding device shown.

[0033] Figure 7 It is a perspective view showing the structure of a leaf spring for mounting the bonding arm on the bonding head.

[0034] Figure 8 For Figure 1 A side view of the wire bonding device shown, and is a view showing a state where the front end of the bonding arm is located near the front end of the bonding platform.

[0035] Figure 9 For Figure 1 A side view of the wire bonding device shown, and is a view showing a state where the front end of the bonding arm is located near the rear end of the bonding platform.

[0036] [Description of Reference Numerals]

[0037] 11: Stand

[0038] 12: Bonding platform

[0039] 12a: Placing surface

[0040] 12d: Rear end surface in Y direction

[0041] 13: Y-direction motor support base

[0042] 20: Bonding head

[0043] 20a: Structural member

[0044] 21: Bonding arm

[0045] 21a: Body

[0046] 21b: Ultrasonic horn

[0047] 21c: Rib for installation

[0048] 21d: Mounting seat

[0049] 21f: Front end

[0050] 21m: Z-direction movable part mounting plate

[0051] 21r: Rear end part

[0052] 22: Welding needle

[0053] 23: Lens barrel

[0054] 23a: Arm

[0055] 25: Center of gravity position

[0056] 26: Cross leaf spring

[0057] 27: Horizontal spring plate

[0058] 27a, 28a: Screw

[0059] 27b, 28b: Screw hole

[0060] 28: Vertical spring plate

[0061] 29: Rotation axis

[0062] 30: XY drive mechanism

[0063] 31: X-direction guide

[0064] 32: X-direction slider

[0065] 32a: X-direction sliding member

[0066] 32b: X-direction sliding plate

[0067] 33: Y-direction guide

[0068] 33a: Y-direction guiding member

[0069] 33b: Y-direction guiding frame

[0070] 34: Y-direction slider

[0071] 35: Guide rail

[0072] 36: Y-direction movable member base

[0073] 36a: Slider

[0074] 37: Linear guide

[0075] 37a: Driven-side guide

[0076] 37b: Driving-side guide

[0077] 40: X-direction motor

[0078] 41: X-direction movable member

[0079] 42: X-direction stator

[0080] 43: Center

[0081] 45: Y-direction movable member

[0082] 46: Y-direction stator

[0083] 47: Y-direction motor

[0084] 48: Z-direction movable member

[0085] 50: Frame

[0086] 51: Column

[0087] 52: Girder

[0088] 53: Support arm

[0089] 100: Wire bonding device

[0090] 311, 331, 372: Ridge portion

[0091] 321, 341, 371: Receiving groove Detailed implementation manner

[0092] Hereinafter, on the one hand, with reference to the attached Figure 1 The wire bonding device 100 of the embodiment will be described. In the following description, it is assumed that the wire bonding device 100 is a wire bonding device that connects the electrodes of a semiconductor die and the electrodes of a substrate using a lead wire. As Figure 1As shown, the wire bonding apparatus 100 includes a stage 11, a bonding platform 12, a frame 50, an XY drive mechanism 30, a bonding head 20, a bonding arm 21, and a lens barrel 23. Furthermore, in the following description, as Figure 1 shown, the length direction of the bonding arm 21 from the bonding platform 12 toward the bonding head 20 is defined as the Y direction, which is the front-rear direction, the direction orthogonal to the Y direction in the horizontal plane is defined as the X direction, which is the conveyance direction of the object to be bonded, and the up-down direction is defined as the Z direction for explanation. In addition, the direction toward the bonding platform 12 on the negative side of the Y direction is defined as the front, the opposite positive side of the Y direction is defined as the rear, the positive side of the X direction is defined as the conveyance direction, the positive side of the Z direction is defined as the upper side, and the negative side of the Z direction is defined as the lower side for explanation.

[0093] The stage 11 is fixed to the base of the wire bonding apparatus 100 (not shown). The bonding platform 12 is mounted on the upper side in front of the stage 11. The upper surface of the bonding platform 12 serves as a placement surface 12a for placing objects to be bonded such as substrates or semiconductor chips. In addition, objects to be bonded such as substrates are conveyed in the positive X direction on the placement surface 12a by a conveyance device (not shown).

[0094] The frame 50 is a support structure mounted on the upper surface of the stage 11 and suspending the XY drive mechanism 30 from above. The frame 50 includes columns 51 fixed to the stage 11, girders 52 connecting between the columns 51, and two support arms 53 extending downward from the girders 52 and having X-direction guides 31 mounted at their lower ends.

[0095] The XY drive mechanism 30 is suspended and supported from the frame 50 and drives the bonding head 20 mounted on the lower side in the XY directions. The XY drive mechanism 30 includes an X-direction guide 31, an X-direction slider 32, a Y-direction guide 33, a Y-direction slider 34, an X-direction motor 40, and a Y-direction motor 47.

[0096] The X-direction guide 31 is a square bar-shaped member extending in the X direction and having one mounted at each of the lower ends of the two support arms 53 of the frame 50, and a ridge portion 311 with a mountain-shaped cross section extending in the length direction is provided on the side surface.

[0097] The X-direction slider 32 includes two X-direction sliding members 32a and an X-direction sliding plate 32b. Each X-direction sliding member 32a is a square bar-shaped member extending in the X direction, and a receiving groove 321 is provided on the side surface. The receiving groove 321 extends in the length direction and is a V-shaped groove for the protruding strip portion 311 of the X-direction guide 31 to be inserted into. The X-direction sliding plate 32b is a plate-shaped member connecting between the two X-direction sliding members 32a, and a flange portion is provided at the side end. The flange portion is mounted with the X-direction sliding member 32a on the upper side. The two X-direction sliding members 32a are firmly fixed to the flange portions at both side ends through screws. If the protruding strip portion 311 of the X-direction guide 31 is inserted into the receiving groove 321 of the X-direction sliding member 32a of the X-direction slider 32, the X-direction slider 32 is supported by the X-direction guide 31 in the up and down directions and is guided by the X-direction guide 31 to move in the X direction.

[0098] On the upper side of the X-direction sliding plate 32b of the X-direction slider 32, an X-direction movable member 41 constituting the X-direction motor 40 is mounted. In addition, on one side of the X-direction movable member 41 of each support arm 53 of the frame 50, X-direction stators 42 are respectively fixed in a manner facing the X-direction movable member 41. The X-direction movable member 41 and the X-direction stator 42 constitute the X-direction motor 40 that drives the X-direction slider 32 in the X direction. In addition, the center 43 of the X-direction movable member 41 becomes the thrust center of the X-direction motor 40 in the X direction.

[0099] As Figure 2 shown, the Y-direction guide 33 includes two Y-direction guiding members 33a and a Y-direction guiding frame 33b on which the two Y-direction guiding members 33a are mounted. The Y-direction guiding frame 33b is a groove-shaped cross-section member that is open at the lower side and extends in the Y direction, and the upper convex portion is mounted on the lower side of the X-direction sliding plate 32b of the X-direction slider 32.

[0100] The Y-direction guiding member 33a is a square bar-shaped member extending in the Y direction, and a protruding strip portion 331 with a mountain-shaped cross-section extending in the length direction is provided on the side surface. The two Y-direction guiding members 33a are respectively fixed to the two side end portions at the lower side of the Y-direction guiding frame 33b through screws with the respective protruding strip portions 331 facing each other. The Y-direction front end surface of the Y-direction guiding member 33a protrudes slightly more forward in the Y direction than the Y-direction front end surface of the Y-direction guiding frame 33b. Moreover, the Y-direction front end surface of the Y-direction guiding member 33a protrudes forward in the Y direction by a distance d from the Y-direction rear end surface 12d of the placement surface 12a of the joint platform 12.

[0101] Thus, when viewed from above, the Y-direction guide member 33 is mounted on the lower side of the X-direction slide plate 32b in such a manner that a front portion thereof overlaps the placement surface 12a of the joining platform 12 by a distance d. Further, the X-direction slide plate 32b is mounted on the frame 50 via the X-direction guide member 31. Accordingly, when viewed from above, the Y-direction guide member 33 is mounted on the frame 50 in such a manner that a front portion in the Y direction overlaps the placement surface 12a of the joining platform 12.

[0102] As Figure 3 shown, the Y-direction slider 34 is a member in the shape of a quadrangular rod extending in the Y direction, and a receiving groove 341 is provided on a side surface thereof. The receiving groove 341 is a V-shaped groove extending in the longitudinal direction and adapted to receive the protruding strip portion 331 of the Y-direction guiding member 33a. As Figure 3 shown, the Y-direction slider 34 is fixed to both side surfaces in the Y direction at the upper end of the joining head 20 by screws in such a manner that the receiving groove 341 faces outward. Accordingly, as Figure 2 shown, when the Y-direction slider 34 and the Y-direction guide member 33 are assembled in such a manner that the protruding strip portion 331 of the Y-direction guiding member 33a of the Y-direction guide member 33 is inserted into the receiving groove 341 of the Y-direction slider 34, the Y-direction slider 34 is supported by the Y-direction guide member 33 in the vertical direction and moves in the Y direction. Further, the joining head 20 mounted on the Y-direction slider 34 and the Y-direction slider 34 are particularly supported by the Y-direction guide member 33 in the vertical direction and move in the Y direction.

[0103] Returning to Figure 1 , behind the joining head 20, a Y-direction motor support base 13, a Y-direction stator 46, a Y-direction movable member 45, and a Y-direction movable member base 36 are arranged. The Y-direction motor support base 13 is a support structure fixed to the gantry 11, and the Y-direction stator 46 is mounted on the upper side of the central portion thereof. Further, on the upper ends of the front end and the rear end in the Y direction of the Y-direction motor support base 13, guide rails 35 for guiding the slider 36a of the Y-direction movable member base 36 in the Y direction are mounted. On the Y-direction movable member base 36, the Y-direction movable member 45 is mounted so as to face the Y-direction stator 46. Further, the Y-direction movable member base 36 and the rear end of the joining head 20 are connected by a linear guide member 37. Furthermore, as for the linear guide member 37, for example, a crossed roller guide member or a needle guide member can be used.

[0104] The linear guide member 37 includes upper and lower driven side guide members 37a mounted on the rear end of the joining head 20 as Figure 3 shown, and Figure 4The driving-side guide member 37b fixed to the front end in the Y direction of the Y-direction movable member base 36 as shown. The driving-side guide member 37b is a rod-shaped length member, and ridge portions 372 with a mountain-shaped cross-section are provided on the upper and lower surfaces. The driven-side guide member 37a is a columnar length member, and a V-shaped receiving groove 371 for embedding the ridge portion 372 of the driving-side guide member 37b is provided on the upper surface or the lower surface.

[0105] If they are combined in such a way that the ridge portion 372 of the driving-side guide member 37b engages with the receiving groove 371 of the driven-side guide member 37a, then as Figure 5 shown, the driven-side guide member 37a slides in the X direction with respect to the driving-side guide member 37b and moves in the Y direction following the movement of the driving-side guide member 37b in the Y direction. Therefore, if the Y-direction movable member base 36 moves in the Y direction due to the Y-direction movable member 45, the driven-side guide member 37a moves in the X direction and causes the connected joint head 20 to move followingly in the Y direction. Thus, the joint head 20 is driven in the XY direction by the X-direction movable member 41 of the X-direction motor 40 and the Y-direction movable member 45 of the Y-direction motor 47.

[0106] As described above, the X-direction guide member 31, the X-direction slider 32, the Y-direction guide member 33, and the Y-direction slider 34 constituting the XY drive mechanism 30 are installed on the frame 50 above the placement surface 12a of the bonding platform 12 and on the rear side in the Y direction of the bonding platform 12.

[0107] As Figure 6 shown, the bonding arm 21 includes a main body 21a and an ultrasonic horn 21b installed in front of the main body 21a in the Y direction. A welding needle 22 as a bonding tool is installed at the front end 21f of the ultrasonic horn 21b. An opening for installing an ultrasonic oscillator is provided at the center in the length direction of the main body 21a.

[0108] At the rear end portion 21r of the main body 21a, widened triangular mounting ribs 21c are provided on the positive and negative sides in the X direction. At the rear end of the mounting rib 21c, a mounting seat 21d for installing the cross leaf spring 26 is provided, and the rear end portion 21r of the bonding arm 21 is installed on the structural member 20a in front of the joint head 20 in the Y direction through the cross leaf spring 26 installed on the mounting seat 21d. In addition, a plate-shaped Z-direction movable member mounting plate 21m of the Z-direction motor extends rearward in the Y direction from the rear end portion 21r of the main body 21a. A Z-direction movable member 48 is installed on the Z-direction movable member mounting plate 21m. The Z-direction movable member mounting plate 21m and the Z-direction movable member 48 are housed inside the joint head 20.

[0109] As Figure 7As shown, the cross plate spring 26 is formed by combining a horizontal spring plate 27 provided with screw holes 27b and 28b and a vertical spring plate 28 in a cross-shaped manner. As Figure 6 shown, the rear end (positive side in the Y direction) of the horizontal spring plate 27 is fixed to the structural member 20a of the joint head 20 by a screw 27a, and the top end (negative side in the Y direction) is fixed to the lower surface of the mounting seat 21d of the joint arm 21 by a screw. In addition, the upper end of the vertical spring plate 28 is fixed to the vertical surface at the rear end of the mounting seat 21d of the joint arm 21 by a screw 28a, and the lower end is fixed to the structural member 20a of the joint head 20 by a screw. Moreover, the line extending in the X direction where the horizontal spring plate 27 and the vertical spring plate 28 cross becomes the rotation axis 29 of the joint arm 21, and the cross plate spring 26 rotatably supports the joint arm 21 around the rotation axis 29.

[0110] In this way, regarding the joint arm 21, the rear end portion 21r is rotatably mounted around the rotation axis 29 extending in the X direction. In addition, on both sides of the Z-direction movable member 48 housed inside the joint head 20, Z-direction stators (not shown) are installed. The Z-direction stators drive the Z-direction movable member 48 to rotate around the rotation axis 29, and drive in the direction of the lower end of the welding needle 22 mounted at the front end 21f of the ultrasonic welding head 21b approaching or departing from the placement surface 12a of the joint platform 12.

[0111] The joint arm 21 is mounted on the joint head 20 in such a way that the height of the rotation axis 29 is the same as the joint surface of the joint object placed on the placement surface 12a of the joint platform 12. Therefore, the lower end of the welding needle 22 approaches or departs from the joint surface of the joint object in the vertical direction.

[0112] In this way, the joint arm 21 extends forward in the Y direction from the joint head 20, and is mounted on the joint head 20 in such a way that it moves in the Y direction above the placement surface 12a of the joint platform 12.

[0113] The lens barrel 23 is an optical member that guides light from the joint object placed on the placement surface 12a of the joint platform 12 to the imaging device installed inside the joint head 20. The lens barrel 23 is mounted at the front end of the mounting arm 23a and is disposed above the front end 21f of the joint arm 21. The mounting arm 23a is mounted on the joint head 20 and extends forward in the Y direction. In addition, inside the joint head 20, an imaging device (not shown) that acquires light from the joint object in the form of an image is installed from the lens barrel 23.

[0114] In the wire bonding apparatus 100 configured as described above, when the Y-direction movable member 45 moves in the Y direction, the bonding head 20 connected to the Y-direction movable member 45 and the Y-direction slider 34 mounted on the bonding head 20 move in the Y direction. Further, when the X-direction movable member 41 moves in the X direction, the Y-direction guide member 33 provided below the X-direction slider 32, the Y-direction slider 34 supported in the vertical direction by the Y-direction guide member 33 and moving in the Y direction, and the bonding head 20 mounted on the Y-direction slider 34 move integrally in the X direction. Thus, the XY drive mechanism 30 drives the bonding head 20 in the XY directions.

[0115] Here, when the X-direction movable member 41 moves in the X direction, the Y-direction guide member 33, the Y-direction slider 34, the bonding head 20, the bonding arm 21 mounted on the bonding head 20, the lens barrel 23, and the imaging device that move together with the X-direction movable member 41 in the X direction constitute a load body, and the load body is an aggregate of parts that move in the X direction by the X-direction movable member 41. Figure 1 In, the center-of-gravity mark indicates the center-of-gravity position 25 of the entire load body. Further, the dashed line 20c is a line that passes through the center-of-gravity position 25 of the load body and extends in the vertical direction. Further, Figure 1 , Figure 8 , Figure 9 In, the dashed line 40c is a line that passes through the center 43 of the X-direction movable member 41 where the thrust center in the X direction of the X-direction motor 40 is located and extends in the vertical direction, and the dashed line 12c is a line that passes through the Y-direction center of the bonding stage 12 and extends in the vertical direction.

[0116] As Figure 1 shown, the front end 21f of the bonding arm 21 is located at the center in the Y direction of the bonding stage 12. That is, as Figure 1 shown, when the center of the bonding needle 22 is located on the dashed line 12c, the Y-direction position of the center-of-gravity position 25 of the load body becomes approximately the same position as the Y-direction position of the center 43 of the X-direction movable member 41.

[0117] Further, as Figure 8 shown, when the bonding head 20 moves a distance L1 in the negative Y direction from the position shown in Figure 1 and the front end 21f of the bonding arm 21 moves near the front end of the bonding stage 12, the Y-direction slider 34 moves in the Y direction above the mounting surface 12a of the bonding stage 12, and the bonding arm 21 moves in the Y direction above the mounting surface 12a of the bonding stage 12. Moreover, the Y-direction position of the center-of-gravity position 25 of the load body deviates forward in the Y direction from the Y-direction position of the center 43 of the X-direction movable member 41 by a distance L1.

[0118] Conversely, as Figure 9 shown, when the bonding head 20 moves from the position shown in Figure 1When the position shown moves a distance L1 in the positive Y direction and the front end 21f of the bonding arm 21 moves near the rear end of the bonding stage 12, the Y-direction position of the center of gravity position 25 of the load body deviates rearward in the Y direction from the Y-direction position of the center 43 of the X-direction movable member 41 by the distance L1.

[0119] Thus, when Figure 8 , Figure 9 shows that when the front end 21f of the bonding arm 21 is located at the front end or the rear end in the Y direction of the bonding stage 12, the deviation amount between the Y-direction position of the center of gravity position 25 of the load body and the Y-direction position of the center 43 of the X-direction movable member 41 reaches the maximum.

[0120] The wire bonding apparatus 100 of the embodiment is mounted on the frame 50 such that a part in front of the Y-direction guide 33 overlaps the mounting surface 12a of the bonding stage 12, and the Y-direction position of the X-direction slider 32 on which the Y-direction guide 33 and the X-direction movable member 41 are mounted is arranged close to the bonding stage 12. Thus, it is configured such that the center of gravity position 25 of the load body moves in the Y direction before and after near the center 43 of the X-direction movable member 41. Thereby, the maximum value of the deviation amount between the center of gravity position 25 of the load body and the center 43 of the X-direction movable member 41 can be made smaller than that of the prior art wire bonding apparatus described in Patent Document 1. Therefore, the yaw moment applied to the bonding head 20 when the bonding head 20 is driven in the X direction by the XY drive mechanism 30 can be further reduced compared to the prior art wire bonding apparatus, and the vibration of the bonding head 20 about the vertical axis can be reduced. Moreover, by reducing the vibration of the bonding head 20 about the vertical axis, the amplitude of the vibration of the bonding head 20 about the vertical axis can be reduced. In addition, by reducing the yaw moment applied to the bonding head 20, the natural vibration frequency of the bonding head 20 about the vertical axis can be increased, and the amplitude of the vibration of the bonding head 20 about the vertical axis can be reduced.

[0121] Moreover, by reducing the amplitude of the vibration of the bonding head 20 about the vertical axis, the amplitude of the vibration of the bonding head 20 about the vertical axis can be reduced, and the amplitude of the X-direction vibration of the bonding needle 22 mounted at the front end 21f of the bonding arm 21 due to the vibration can be reduced, and the bonding quality can be improved.

[0122] In addition, the wire bonding apparatus 100 of the present embodiment makes the Y-direction position of the center of gravity position 25 of the load body when the front end 21f of the bonding arm 21 is located at the center in the Y direction of the bonding stage 12 the same as the Y-direction position of the center 43 of the X-direction movable member 41, so that the center of gravity position 25 of the load body moves in the Y direction before and after the center 43 of the X-direction movable member 41. Thereby, Figure 8 , Figure 9The shown distance L1 becomes 1 / 2 of the stroke of the bonding head 20 in the Y direction, and can minimize the maximum deviation amount between the center of gravity position 25 of the load body and the center 43 of the X-direction movable member 41. Therefore, the yaw moment applied to the bonding head 20 when driving the bonding head 20 in the X direction by the XY driving mechanism 30 can be further reduced, the vibration around the vertical axis can be further reduced, and the bonding quality can be further improved.

[0123] In addition, in the wire bonding device 100 of the embodiment, the Y-direction slider 34 moves in the Y direction above the placement surface 12a of the bonding platform 12. The bonding arm 21 is attached to the bonding head 20 so as to extend forward in the Y direction from the bonding head 20. The bonding head 20 is attached to the lower side of the Y-direction slider 34 so that the bonding arm 21 moves in the Y direction above the placement surface 12a of the bonding platform 12. Thereby, the moving stroke of the front end 21f of the bonding arm 21 in the Y direction can be extended, and a large substrate can be bonded.

[0124] Furthermore, in the wire bonding device 100 of the embodiment, the bonding arm 21 is attached to the bonding head 20 such that the height of the rotation shaft 29 is the same as the bonding surface of the object to be bonded placed on the placement surface 12a of the bonding platform 12. Thereby, the lower end of the bonding needle 22 can be moved in the vertical direction with respect to the bonding surface during bonding, and the bonding quality can be improved.

[0125] In addition, since the bonding arm 21 is rotatably attached to the bonding head 20 by the cross leaf spring 26 in the wire bonding device 100 of the embodiment, there is no frictional resistance such as a rotary bearing, and almost no resistance to rotation is generated. Therefore, a minute bonding load can be applied to the lead and the bonded object, and the bonding accuracy can be improved.

[0126] In the wire bonding device 100 described above, it has been described that the Y-direction position of the center of gravity position 25 of the load body when the front end 21f of the bonding arm 21 is at the center in the Y direction of the bonding platform 12 and the Y-direction position of the center 43 of the X-direction movable member 41 are set to the same position. However, it is not limited thereto, and the Y-direction distance between the Y-direction position of the center of gravity position 25 of the load body and the Y-direction position of the center 43 of the X-direction movable member 41 may also be in a range smaller than 1 / 10 of the stroke of the bonding arm 21 in the Y direction. Thereby, the center of gravity position 25 of the load body can be made close to the center 43 of the X-direction movable member 41, the vibration of the bonding head 20 around the vertical axis when driving the bonding head 20 in the X direction can be reduced, the bonding quality can be improved, and the high-speed bonding can be realized.

[0127] Alternatively, the XY drive mechanism 30 may be configured in the following manner, i.e., the Y-direction position of the center of gravity 25 of the load body when the front end 21f of the bonding arm 21 is located at the center in the Y direction of the bonding stage 12 is set to be more rearward in the Y direction than the Y-direction position of the center 43 of the X-direction movable member 41.

[0128] When the bonding head 20 is driven in the X direction, the vibration of the bonding head 20 about the vertical axis reaches the maximum in the following case, i.e., as Figure 8 shown, the front end 21f of the bonding arm 21 is located near the front end of the bonding stage 12. The reason is that the distance between the front end 21f of the bonding arm 21 on which the bonding needle 22 is mounted and the center 43 of the X-direction movable member 41, which is the thrust center in the X direction, reaches the maximum. Therefore, by slightly offsetting the position of the XY drive mechanism 30 toward the front side in the Y direction and setting the Y-direction position of the center of gravity 25 of the load body when the front end 21f of the bonding arm 21 is located at the center in the Y direction of the bonding stage 12 to be more rearward in the Y direction than the Y-direction position of the center 43 of the X-direction movable member 41, the deviation amount between the Y-direction position of the center of gravity 25 of the load body and the Y-direction position of the center 43 of the X-direction movable member 41 in the case where the front end 21f of the bonding arm 21 is located near the front end of the bonding stage 12 can be reduced. Thereby, the vibration of the bonding head 20 about the vertical axis in the case where the front end 21f of the bonding arm 21 is located near the front end of the bonding stage 12 can be further reduced, and the bonding quality can be further improved.

[0129] Regarding how much the Y-direction position of the center of gravity 25 of the load body when the front end 21f of the bonding arm 21 is located at the center in the Y direction of the bonding stage 12 should be offset rearward in the Y direction compared to the Y-direction position of the center 43 of the X-direction movable member 41, it can be set according to the mass of the bonding head 20 or the mass and length of the bonding arm 21. For example, it can be offset rearward in the Y direction by 1 / 50 to 1 / 10 of the stroke of the bonding arm 21 in the Y direction.

[0130] In addition, in the wire bonding apparatus 100 of the embodiment, it has been described as the following case, i.e., the Y-direction guide 33, the Y-direction slider 34, the bonding head 20, the bonding arm 21, and the lens barrel 23 constitute the load body, and the load body is an aggregate of parts that are moved in the X direction by the X-direction movable member 41, but it is not limited thereto.

[0131] For example, in a case where an optical element such as an extremely lightweight optical fiber is mounted on the joint head 20 to send light from the object to be joined to the imaging device, and the lens barrel 23 is not included, the load body may also include the Y-direction guide 33, the Y-direction slider 34, the joint head 20, the joint arm 21, and the imaging device without the lens barrel 23. In a case where the imaging device is not mounted on the joint head 20, the load body may also include the Y-direction guide 33, the Y-direction slider 34, the joint head 20, and the joint arm 21 without the lens barrel 23 and the imaging device.

Claims

1. A wire bonding device, comprising: A bonding platform on which an object to be bonded is placed on the placement surface; A bonding head with a bonding arm mounted thereon; An XY drive mechanism that drives the bonding head in the Y direction and the X direction, where the Y direction is the length direction of the bonding arm, and the X direction is the front-rear direction orthogonal to the Y direction in the horizontal plane; And A frame that supports the XY drive mechanism, and the wire bonding device is characterized in that The XY drive mechanism includes: An X-direction guide member mounted on the frame; An X-direction slider supported in the up-down direction by the X-direction guide member and guided in the X direction to move in the X direction, and an X-direction movable member with an X-direction motor mounted on the upper side; A Y-direction guide member mounted on the lower side of the X-direction slider; and A Y-direction slider supported in the up-down direction by the Y-direction guide member and guided in the Y direction to move in the Y direction, with the bonding head mounted thereon, The XY drive mechanism is mounted on the frame above the placement surface of the bonding platform and behind the bonding platform in the Y direction, such that a part of the front of the Y-direction guide member overlaps the placement surface of the bonding platform when viewed from above; The bonding arm is rotatably mounted at its rear end around a rotation axis extending in the X direction and is mounted on the bonding head such that its front end can move in a direction approaching or departing from the placement surface of the bonding platform; The height of the rotation axis is the same as the bonding surface of the object to be bonded placed on the placement surface of the bonding platform.

2. The wire bonding device according to claim 1, characterized in that The Y-direction distance between the Y-direction position of the center of gravity of the load body when the front end of the bonding arm is at the center of the bonding platform in the Y direction and the Y-direction position of the center of the X-direction movable member is less than 1 / 10 of the Y-direction stroke of the bonding arm, and the load body is an aggregate of parts that move in the X direction by the X-direction movable member of the X-direction motor.

3. The wire bonding device according to claim 2, characterized in that The Y-direction position of the center of gravity of the load body when the front end of the bonding arm is at the center of the bonding platform in the Y direction is the same as the Y-direction position of the center of the X-direction movable member, or is more rearward in the Y direction than the Y-direction position of the center of the X-direction movable member.

4. The wire bonding device according to claim 2 or 3, characterized in that The load body includes the Y-direction guide member, the Y-direction slider, the bonding head, and the bonding arm.

5. The wire bonding device according to claim 2 or 3, characterized in that A camera device and a lens barrel for guiding light from the object to be bonded to the camera device are mounted on the bonding head, The load body includes the Y-direction guide member, the Y-direction slider, the bonding head, the bonding arm, the camera device, and the lens barrel.

6. The wire bonding device according to any one of claims 1 to 3, characterized in that The Y-direction slider moves in the Y direction above the placement surface of the bonding platform, The bonding arm is mounted on the bonding head so as to extend forward in the Y direction from the bonding head. The bonding head is mounted on the lower side of the Y-direction slider so that the bonding arm moves in the Y direction above the placement surface of the bonding platform.

7. The wire bonding apparatus according to claim 1, wherein The rear end portion of the bonding arm is rotatably mounted on the bonding head by a cross leaf spring formed by crossing two leaf springs in a cross shape, and the rotation axis is an axis along the line where the two leaf springs cross.

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