Substrate processing machine

Abstract

A substrate working machine includes: a holding device that holds a substrate on which a plurality of through holes are formed; an insertion device that inserts a plurality of terminals of an element into the plurality of through holes of the substrate held by the holding device; and a camera device that simultaneously captures images of a pair of pins and a pair of through holes of the plurality of through holes. A position of the pair of through holes and the images of the pair of pins is calculated based on image data captured by the camera device.

Description

Technical Field

[0001] The present invention relates to a substrate fitting machine for inserting multiple terminals of an element into multiple through holes formed in a substrate. Background Technology

[0002] The following patent document describes a substrate insertion machine for inserting multiple terminals of an element into multiple through holes formed on a substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 1-238197 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The subject of this specification is to properly insert multiple terminals of an element into multiple through holes formed in a substrate.

[0008] Technical solutions for solving the problem

[0009] To address the aforementioned issues, this specification discloses a substrate processing machine comprising: a holding device for holding a substrate having multiple through holes; an insertion device for inserting multiple terminals of an element into the multiple through holes of the substrate held by the holding device; and an imaging device for simultaneously capturing images of a pair of pins and a pair of through holes, and calculating the positions of the pair of through holes and the pair of pins based on the image data captured by the imaging device.

[0010] Invention Effects

[0011] In the substrate processing machine disclosed herein, images of a pair of pins and a pair of through holes are captured simultaneously, and the positions of the pair of through holes and the pair of pins are calculated based on the captured image data. Thus, for example, by calculating the positions of the pair of through holes and the pair of pins based on their positions, multiple terminals can be appropriately inserted into multiple through holes. Attached Figure Description

[0012] Figure 1 It is a three-dimensional diagram showing a component mounting machine.

[0013] Figure 2 It is a three-dimensional diagram showing the component assembly.

[0014] Figure 3 This is a diagram showing the component retainer.

[0015] Figure 4It is a perspective view showing the cutting and bending unit and the unit moving device.

[0016] Figure 5 This is a three-dimensional diagram representing the cutting and bending unit.

[0017] Figure 6 This is a schematic diagram of a cutting and bending unit that represents the cutting and bending of the pins of a pin element.

[0018] Figure 7 This is a block diagram representing the control device.

[0019] Figure 8 This is a schematic diagram of a through-hole with the pin inserted, captured by a camera.

[0020] Figure 9 This is an image of a through-hole with the pins inserted.

[0021] Figure 10 This is an image of a through-hole with the pins inserted.

[0022] Figure 11 This is an image of a through-hole with the pins inserted.

[0023] Figure 12 This is a three-dimensional diagram representing the cutting and bending unit.

[0024] Figure 13 This is a three-dimensional diagram representing the cutting and bending unit.

[0025] Figure 14 This is a schematic diagram of inserting the pins of a leaded element into a through-hole in a circuit substrate using a cutting and bending unit.

[0026] Figure 15 This is a schematic diagram of the through hole with the guide pin inserted, captured by a camera. Detailed Implementation

[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, as examples of implementing the present invention.

[0028] Figure 1 This refers to component mounting machine 10. Component mounting machine 10 is a device for performing component mounting operations relative to circuit substrate 12. Component mounting machine 10 includes a device body 20, a substrate handling and holding device 22, a component assembly device 24, a marking camera 26, a component camera 28, a component supply device 30, a bulk component supply device 32, and a cutting and bending unit (see reference). Figure 5 34. Unit moving device (refer to) Figure 4 36. Control device (refer to) Figure 738. It should be noted that, as a circuit substrate 12, examples include circuit boards, three-dimensional substrates, etc., and as a circuit substrate, examples include printed wiring boards, printed circuit boards, etc.

[0029] The main body 20 of the device consists of a frame 40 and beams 42 mounted on the frame 40. A substrate handling and holding device 22 is disposed at the center of the frame 40 in the front-rear direction and includes a handling device 50 and a clamping device 52. The handling device 50 is used to handle the circuit substrate 12, and the clamping device 52 is used to hold the circuit substrate 12. Thus, the substrate handling and holding device 22 handles the circuit substrate 12 and holds it fixedly in a predetermined position. It should be noted that in the following description, the direction of handling the circuit substrate 12 is referred to as the X-direction, the horizontal direction perpendicular to this direction is referred to as the Y-direction, and the vertical direction is referred to as the Z-direction. In other words, the width direction of the component mounting machine 10 is the X-direction, and the front-rear direction is the Y-direction.

[0030] The component assembly device 24 is mounted on the beam 42 and includes two working heads 60 and 62 and a working head moving device 64. The working head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. Furthermore, the X-direction moving device 68 and the Y-direction moving device 70 allow the two working heads 60 and 62 to move as a unit to any position on the frame 40. Additionally, each working head 60 and 62 is positioned and assembled onto the sliding members 74 and 76 in a manner that allows the operator to assemble and disassemble them without tools. The Z-direction moving device 72 allows the sliding members 74 and 76 to move independently in the vertical direction. In other words, the working heads 60 and 62 move independently in the vertical direction via the Z-direction moving device 72.

[0031] In addition, such as Figure 2 As shown, component retainers 77 are mounted on the lower end faces of each working head 60, 62. Component retainers 77 are so-called chucks, such as... Figure 3 As shown, the device includes a main body 78 and a pair of claws 79. The pair of claws 79 are configured to extend downward from the lower surface of the main body 78 and slide linearly in a manner of approaching and separating from each other. Thus, the component holder 77 holds the component by bringing the pair of claws 79 closer together and releases the component from between the pair of claws 79 by separating them. In addition, each working head 60, 62 is provided with a rotation device (not shown) that allows the component holder 77 to rotate about a vertical axis. By operating the rotation device, the posture of the component held by the component holder 77 can be changed.

[0032] like Figure 2As shown, the marking camera 26 is mounted on the slider 74 with its vertical orientation downwards, and moves together with the working head 60 along the X, Y, and Z directions. Thus, the marking camera 26 can capture images of any position on the frame 40. Figure 1 As shown, the part camera 28 is positioned vertically upwards between the substrate handling and holding device 22 and the component supply device 30 on the frame 40. Thus, the part camera 28 captures images of the components held by the component holder 77 of the working heads 60 and 62.

[0033] The component supply device 30 is disposed at one end of the frame 40 in the front-rear direction. The component supply device 30 includes a tray-type component supply device 86 and a feeder-type component supply device (see reference). Figure 6 88. The tray-type component supply device 86 is a device for supplying components that are placed on a tray. The feeder-type component supply device 88 is a device for supplying components via a belt feeder or a rod feeder (not shown).

[0034] The bulk component supply device 32 is disposed at the end of the frame 40 on the other side in the front-rear direction. The bulk component supply device 32 is a device that arranges multiple components that are scattered in a neat manner and supplies the components in a neat manner. In other words, it is a device that arranges multiple components in a predetermined posture in a predetermined posture and supplies components in a predetermined posture.

[0035] It should be noted that the components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, structural components of solar cells, and structural components of power modules. Furthermore, electronic circuit components may include components with leads or components without leads.

[0036] The cutting and bending unit 34 and the unit moving device 36 are disposed below the transport device 50. Furthermore, the cutting and bending unit 34 can be moved to any position below the transport device 50 via the unit moving device 36. The cutting and bending unit 34 is designed to be inserted into a through hole formed in the circuit substrate 12 (see reference). Figure 6 )104 pin components (refer to Figure 6 )106 pins (refer to Figure 6 108. A device for cutting and bending. (e.g.) Figure 5 As shown, the cutting and bending unit 34 has a pair of sliding bodies 112. The pair of sliding bodies 112 are supported by a sliding guide 116 arranged to extend in the X direction, allowing them to slide. Thus, the pair of sliding bodies 112 approach and separate in the X direction. Furthermore, the distance between the pair of sliding bodies 112 can be controlled by an electromagnetic motor (see reference...). Figure 7 The driving and control method of )118 has changed.

[0037] Furthermore, each pair of sliders 112 includes a fixed portion 120 and a movable portion 122. The fixed portion 120 holds the slider 1122 so that it can slide along the sliding guide rail 116. The movable portion 122 is held by the fixed portion 120 so that it can slide in the X direction. Moreover, the movable portion 122 can be moved by an electromagnetic motor (see reference...). Figure 7 The 128 is driven and controlled to slide in the X direction relative to the fixed part 120.

[0038] In addition, such as Figure 6 As shown, the upper end of the fixing part 120 is tapered at the front end, and a first insertion hole 130 is formed therethrough in the vertical direction. Furthermore, the opening edge of the first insertion hole 130 facing the upper end face forms a fixing blade 131. On the other hand, the upper end of the movable part 122 is also tapered at the front end, and an L-shaped bent portion 133 is formed thereat. The bent portion 133 extends upward toward the upper end face of the fixing part 120. The first insertion hole 130, which opens at the upper end face of the fixing part 120, is covered by the bent portion 133, but a second insertion hole 136 is formed in the bent portion 133 facing the first insertion hole 130. It should be noted that the opening edge of the second insertion hole 136 facing the lower end face of the bent portion 133 forms a movable blade 138.

[0039] In addition, such as Figure 4 As shown, the unit moving device 36 includes an X-direction moving device 150, a Y-direction moving device 152, a Z-direction moving device 154, and a rotation device 156. The X-direction moving device 150 includes a sliding guide rail 160 and an X-slider 162. The sliding guide rail 160 is configured to extend along the X direction, and the X-slider 162 is held so as to be able to slide along the sliding guide rail 160. Moreover, the X-slider 162 is connected by an electromagnetic motor (see reference). Figure 7 Driven by an electromagnetic motor (see reference 164), the X-axis slider 162 moves along the X direction. The Y-axis moving device 152 includes a sliding guide rail 166 and a Y-axis slider 168. The sliding guide rail 166 is disposed on the X-axis slider 162 in a manner extending along the Y direction, and the Y-axis slider 168 is held so as to be able to slide along the sliding guide rail 166. Furthermore, the Y-axis slider 168 is driven by an electromagnetic motor (see reference 164). Figure 7 Driven by an electromagnetic motor, the Z-axis moving device 170 moves along the Y direction. The Z-axis moving device 154 includes a sliding guide rail 172 and a Z-slider 174. The sliding guide rail 172 is disposed on the Y-slider 168 extending along the Z direction, and the Z-slider 174 is held so as to slide along the sliding guide rail 172. Furthermore, the Z-slider 174 is driven by an electromagnetic motor (see reference...). Figure 7 Driven by 176, it moves along the Z direction.

[0040] Additionally, the rotation device 156 has a generally disc-shaped rotary table 178. The rotary table 178 is supported on the Z-slider 174 in a manner that allows it to rotate around its vertical axis, and is powered by an electromagnetic motor (see reference). Figure 7 Driven by the rotation of 180, the cutting and bending unit 34 is positioned on the rotary table 178 in a way that allows the operator to disassemble and assemble the circuit substrate 12 with a single touch without the use of tools. With this configuration, the cutting and bending unit 34 can be moved to any position between a pair of transport channels of the circuit substrate 12 provided in the transport substrate transport and holding device 22 via the X-direction moving device 150, the Y-direction moving device 152, and the Z-direction moving device 154, and can rotate at any angle via the rotation device 156. Thus, the cutting and bending unit 34 can be positioned at any position below the circuit substrate 12 held by the clamping device 52.

[0041] like Figure 7 As shown, the control device 38 includes a controller 190, multiple drive circuits 192, and an image processing device 196. The multiple drive circuits 192 are connected to the aforementioned conveying device 50, clamping device 52, working heads 60 and 62, working head moving device 64, pallet-type component supply device 86, feeder-type component supply device 88, bulk component supply device 32, and electromagnetic motors 118, 128, 164, 170, 176, and 180. The controller 190 includes a CPU, ROM, RAM, etc., and is based on a computer; it is also connected to the multiple drive circuits 192. Thus, the operation of the substrate conveying and holding device 22, component assembly device 24, etc., is controlled by the controller 190. Furthermore, the controller 190 is also connected to the image processing device 196. The image processing device 196 processes the image data obtained by the marking camera 26 and the part camera 28, and the controller 190 obtains various information from the image data.

[0042] In the component mounting machine 10, the above-described structure is used to assemble components onto the circuit substrate 12 held by the substrate transport and holding device 22. The component mounting machine 10 can assemble various components onto the circuit substrate 12, but the following description focuses on assembling the lead element 106 onto the circuit substrate 12.

[0043] Specifically, the circuit substrate 12 is transported to the working position by the transport device 50 of the substrate transport and holding device 22, and is fixedly held in this position by the clamping device 52. Next, the marking camera 26 moves above the circuit substrate 12 and photographs the circuit substrate 12. This obtains information related to the holding position of the circuit substrate 12. Additionally, the component supply device 30 or the bulk component supply device 32 supplies the lead element 106 to the working heads 60, 62 at a predetermined supply position. Furthermore, one of the working heads 60, 62 moves above the component supply position and holds the component body of the lead element 106 (see reference 77) by a pair of claws 79. Figure 6 )200.

[0044] Next, the working heads 60 and 62, holding the lead element 106, move above the part camera 28 and capture images of the lead element 106 held by the pair of claws 79 of the component holder 77. This obtains information related to the component's holding position. Then, the working heads 60 and 62, holding the lead element 106, move above the circuit substrate 12 to correct errors in the holding position of the circuit substrate 12 and the holding position of the component. Furthermore, the leads 108 of the lead element 106 held by the component holder 77 are inserted into the through-hole 104 formed in the circuit substrate 12. At this time, the cutting and bending unit 34 moves below the circuit substrate 12.

[0045] Specifically, in the cutting and bending unit 34, the distance between the second insertion holes 136 of the pair of sliders 112 is made the same as the distance between the two through holes 104 formed in the circuit substrate 12. The electromagnetic motor 118 is used to move and position the distance between the pair of sliders 112. In addition, the rotation device 156 operates to position the pair of sliders 112 so that the arrangement direction of the two through holes 104 in the circuit substrate 12 is aligned with the arrangement direction of the two second insertion holes 136 of the pair of sliders 112.

[0046] Furthermore, through the operation of the X-direction moving device 150 and the Y-direction moving device 152, the cutting and bending unit 34 is moved and positioned such that the XY-direction coordinates of the second insertion hole 136 are aligned with the XY-direction coordinates of the through hole 104 of the circuit substrate 12. Thus, the cutting and bending unit 34 moves along the XY direction, thereby positioning the second insertion hole 136 of the slider 112 and the through hole 104 of the circuit substrate 12 in a vertically overlapping state.

[0047] Next, the cutting and bending unit 34 is positioned by the operation of the Z-direction moving device 154, with the upper surface of the movable part 122 contacting the lower surface of the circuit substrate 12 or positioned slightly below the lower surface of the circuit substrate 12. Thus, by controlling the operation of the X-direction moving device 150, Y-direction moving device 152, Z-direction moving device 154, and rotation device 156, the cutting and bending unit 34 is positioned below the circuit substrate 12 with the second insertion hole 136 of the sliding body 112 overlapping the through hole 104 of the circuit substrate 12.

[0048] Moreover, such as Figure 6 As shown, if the pin 108 of the pin element 106 held by the element holder 77 is inserted into the through hole 104 of the circuit substrate 12, the front end of the pin 108 is inserted into the first insertion hole 130 of the fixing part 120 via the second insertion hole 136 of the movable part 122 of the cutting and bending unit 34. Next, if the front end of the pin 108 is inserted into the first insertion hole 130 of the fixing part 120, the movable parts 122 of the pair of sliders 112 slide in the separation direction by the operation of the electromagnetic motor 128. As a result, the pin 108 is cut by the fixing blade 131 of the first insertion hole 130 and the movable blade 138 of the second insertion hole 136.

[0049] Furthermore, after the pins 108 are cut off, the pair of movable parts 122 slide further in the separation direction. As a result, the new leading ends of the pins 108 produced by the cutting off bend along with the sliding of the movable parts 122. Thus, with the pair of pins 108 bend in the direction of separation and the pins 108 preventing them from detaching from the through hole 104, the pin element 106 is assembled onto the circuit substrate 12.

[0050] Thus, for the component mounting machine 10, the pin 108 of the lead element 106 is inserted into the through hole 104 of the circuit substrate 12. The tip of the pin 108 is cut and bent by the cutting and bending unit 34. Therefore, it is desirable to properly insert the pin 108 into the through hole 104 of the circuit substrate 12, but in existing component mounting machines, no method has been established to improve the insertion accuracy. Here, for the component mounting machine 10, a fixture with pins is used to insert the pins of the fixture held by the working heads 60, 62 into the through hole of the circuit substrate 12. Based on the imaging data of the through hole with the pins inserted, the accuracy of the insertion of the lead element's pin into the through hole of the circuit substrate is improved.

[0051] Specifically, such as Figure 8As shown, the assistive device 200 consists of a component body 202 and a pair of pins 204. The component body 202 is generally block-shaped, and the pair of pins 204 extend vertically and in a straight line from the bottom surface of the component body 202 in the same direction. The pair of pins 204 are standardized, with predetermined dimensions such as the spacing, outer diameter, and length of the pins 204. In other words, the standardized pair of pins 204 extend vertically with high precision from the surface of the component body 202, thereby ensuring its accuracy. Furthermore, the component body 202 of the assistive device 200 is held by a pair of jaws 79 of the component holder 77, thereby holding the assistive device 200 by the component holder 77.

[0052] Additionally, a base plate 220 is also prepared as a clamp for the auxiliary tool 200. For example... Figure 9 As shown, four through holes 222 (222a, 222b, 222c, 222d) are formed on the substrate 220, arranged in a 2x2 row configuration. The four through holes 222 are also standardized and precisely machined to pre-determine the spacing between adjacent through holes 222, the inner diameter of each through hole 222, and other dimensions. It should be noted that the spacing between adjacent through holes 222 is the same as the spacing between a pair of pins 204 of the fixture 200. Incidentally, the spacing between two through holes 222 is the distance between the center of one through hole 222 and the center of the other through hole 222, and the spacing between a pair of pins 204 is the distance between the center of the front end face of one pin 204 and the center of the front end face of the other pin 204. In addition, the inner diameter of the through hole 222 is about three times the outer diameter of the pin 204.

[0053] The substrate 220 with this structure is transported to the working position by the transport device 50 and clamped at the working position by the clamping device 52. Furthermore, the positioned and fixed substrate 220 is photographed by the marking camera 26, and the position of each through-hole 222 is calculated based on the photographed data. Additionally, the fixture 200 held by the component holder 77 is photographed by the component camera 28, and the position of a pair of pins is calculated based on the photographed data. Moreover, the working heads 60 and 62 are moved by the working head moving device 64 so that the pair of pins 204 are aligned vertically with two of the four through-holes 222; in other words, so that the XY coordinates of the pair of pins 204 are aligned with the XY coordinates of the two through-holes 222. Then, the working heads 60 and 62 are lowered by the working head moving device 64, thereby... Figure 8As shown, a pair of pins 204 are inserted into two through holes 222. At this time, the working heads 60 and 62 descend so that the front end face of the pin 204 is aligned with the lower surface of the substrate 220 in the vertical direction. In other words, the front end face of the pin 204 and the lower surface of the substrate 220 become the same plane.

[0054] Additionally, on the lower surface of the substrate 220, a camera 230 is installed on the rotary table 178 of the unit moving device 36, replacing the previously installed cutting and bending unit 34. As described above, the cutting and bending unit 34 can be positioned and removed from the rotary table 178 by the operator without using tools using a single touch. Similarly, the camera 230 can be detached and installed on the rotary table 178 after the cutting and bending unit 34 has been removed, positioned vertically upwards. Furthermore, through the operation of the unit moving device 36, the camera 230 mounted on the rotary table 178 is moved to below the through hole 222 of the substrate 220.

[0055] Therefore, the pair of pins 204 inserted into the two through holes 222 of the substrate 220 are captured by the imaging device 230. In other words, the pair of pins 204 and the two through holes 222 with the pair of pins inserted are captured simultaneously by the imaging device 230. It should be noted that the imaging device 230 is a two-dimensional imaging device with imaging elements arranged in a two-dimensional unit, which captures a three-dimensional object as a two-dimensional image. Therefore, the depth of field of the imaging device 230 is relatively narrow. Here, as described above, by making the lower end face of the pin 204 inserted into the through hole 222 coplanar with the lower surface of the substrate 220 and located within the depth of field of the imaging device, a suitable image of the lower end face of the pin 204 and the through hole 222 is obtained.

[0056] Thus, when the standardized pins 204 are inserted into the standardized through holes 222, the ideal insertion state is when a pair of pins 204 are inserted precisely in the middle of the two through holes 222. In other words, as described above, if a camera 230 captures images of the two through holes 222 with a pair of pins 204 inserted, then for the captured data, such as... Figure 9 As shown, ideally, the centers of a pair of pins 204 should align with the centers of the two through holes 222 without misalignment. However, as... Figure 10 As shown, due to the slight differences in the precision of each component mounting machine and the decrease in insertion precision caused by the long-term use of the component mounting machine 10, sometimes the center of a pair of pins 204 is misaligned with the center of the two through holes 222.

[0057] Here, for each component mounting machine, the control device can calculate the positions of a pair of through holes and a pair of pins based on their image positions, obtain correction values ​​for properly inserting the terminals of the component held by the working head into multiple through holes of the circuit substrate, and can properly insert multiple terminals into multiple through holes based on the obtained correction values. Here, for component mounting machine 10, based on the captured data of two through holes 222 with a pair of pins 204 inserted, the misalignment between the inserted pins 204 and the through holes 222 is calculated, and based on the calculated misalignment, a correction value is obtained for inserting a pair of pins into a pair of through holes. In other words, for example, as... Figure 10 As shown, when the centers of a pair of pins 204a and b are misaligned with the centers of two through holes 222a and b, the misalignment amounts (ΔX1, ΔY1) in the XY direction between the center of one pin 204a and the center of one through hole 222a, and the misalignment amounts (ΔX2, ΔY2) in the XY direction between the center of the other pin 204b and the center of the other through hole 222b are calculated. Additionally, the misalignment angle (θ1) formed by the straight line connecting the center of one pin 204a to the center of the other pin 204b and the straight line connecting the center of one through hole 222a to the center of the other through hole 222b is also calculated.

[0058] Next, the through-holes 222 at the insertion destination of a pair of pins 204 are changed to capture images of another pair of through-holes 222. For example, the component holder 77 of the retaining device is rotated 90 degrees by a rotation device. Then, according to the steps described above, a pair of pins 204 are inserted into the two through-holes 222. For the component holder 77, which has rotated 90 degrees by the rotation device, the pair of pins 204 of the retaining device 200 also rotate 90 degrees, therefore, as Figure 11 As shown, one pin 204a is inserted into one through-hole 222a, and the other pin 204b is inserted into another through-hole 222c. Then, a pair of pins 204a and b, and the two through-holes 222a and c into which the pins are inserted, are simultaneously photographed by an imaging device 230, and the misalignment between each pin 204 and the through-hole 222 is calculated. In other words, the misalignment (ΔX3, ΔY3) in the XY direction between the center of one pin 204a and the center of one through-hole 222a, and the misalignment (ΔX4, ΔY4) in the XY direction between the center of the other pin 204b and the center of the other through-hole 222c are calculated. Additionally, the misalignment angle (θ2) formed by the straight line connecting the centers of the pair of pins 204a and 204b, and the straight line connecting the centers of the pair of through-holes 222a and 222c are also calculated.

[0059] Furthermore, the through-holes 222 at the insertion destination of a pair of pins 204 are changed to capture images of another pair of through-holes 222. For example, the component holder 77 holding the accessory 200 is further rotated 90 degrees by a rotation device. Then, according to the above steps, a pair of pins 204 are inserted into the two through-holes 222. For the component holder 77, which has been further rotated 90 degrees by the rotation device, the pair of pins 204 of the accessory 200 held therein is also further rotated 90 degrees. Therefore, the figure is omitted, but one pin 204a is inserted into one through-hole 222b, and the other pin 204b is inserted into the other through-hole 222a. Moreover, a shooting device 230 simultaneously captures images from below of a pair of pins 204a, b and the two through-holes 222a, c with the pair of pins inserted, and calculates the misalignment between each pin 204 and the through-hole 222. In other words, the misalignment in the XY direction between the center of pin 204a and the center of through hole 222b, and the misalignment in the XY direction between the center of pin 204b and the center of through hole 222a are calculated. Furthermore, the angle formed by the straight line connecting the centers of a pair of pins 204a and pin 204b, and the straight line connecting the centers of a pair of through holes 222a and through hole 222b are also calculated.

[0060] Furthermore, similarly, the misalignment amount and misalignment angle between the inserted pin 204 and the through hole are calculated, and based on the calculated misalignment amount and misalignment angle, a correction value is obtained when a pair of pins is inserted into a pair of through holes. By using this correction value, for example, when a pair of pins 204a and b are inserted into two through holes 222a and b, such as Figure 9 As shown, a pair of pins 204a and b can be inserted into the center of two through holes 222a and b. In other words, a pair of pins 204 can be inserted into the two through holes 222 with the pin misalignment being zero. This improves the actual insertion operation; in other words, it improves the insertion accuracy when the component mounting machine inserts a pair of pins 108 of the leaded component 106, with the component body held by the working head, into a pair of through holes 104 of the circuit substrate 12 positioned at the working position of the substrate transport device.

[0061] It should be noted that the following procedures are performed when inspecting the accuracy of the component mounting machine 10, maintaining it, and inspecting it after it has been installed at the user's destination: taking pictures of the pair of through holes 222 with a pair of pins 204 inserted; calculating the misalignment amount and misalignment angle based on the acquired data; and obtaining the correction value for inserting the pair of pins into the pair of through holes based on the calculated misalignment amount and misalignment angle. This allows for the stabilization of the component mounting machine 10's quality, the avoidance of malfunctions, and the maintenance of insertion accuracy based on regular maintenance.

[0062] Alternatively, in the component mounting machine 10, a lead-receiving type cut-and-bend unit that positions and mounts the leaded component inserted into the insertion hole of the circuit substrate on the rotary table 178 of the unit moving device 36 in a detachable manner can replace the cut-and-bend unit 34. The lead-receiving type cut-and-bend unit 300 is a conventional device; therefore, it will be described briefly as follows... Figure 12 and Figure 13 As shown, it has four guide pins 302 that can be controllably extended from the upper end of the cutting and bending unit 300.

[0063] Four guide pins 302 are arranged to extend vertically and are equally spaced in a straight line. The length of each of the four guide pins 302 can be controlled to extend or retract, and in its most retracted state, it is housed inside the cutting and bending unit 300. Furthermore, the cutting and bending unit 300 contains a cutting device (not shown) for cutting the pins of the lead element and a bending device (not shown) for bending the pins. With this configuration, the cutting and bending unit 300 can also cut the pins of the lead element inserted into the through-hole 104 of the circuit substrate 12 and bend those pins.

[0064] Specifically, the rotation device 156 is controlled to align the arrangement direction of the two through holes 104 of the circuit substrate 12 with the arrangement direction of the four guide pins 302. Furthermore, the X-direction moving device 150 and the Y-direction moving device 152 are used to align the XY-direction coordinates of the two through holes 104 of the circuit substrate 12 with the XY-direction coordinates of the tips of the two guide pins 302 inserted into the two through holes, causing the cutting and bending unit 300 to move below the circuit substrate 12 and stop. Thus, the cutting and bending unit 300 moves along the XY direction, positioning the two through holes 104 of the circuit substrate 12 and the tips of the two guide pins 302 in a vertically overlapping state.

[0065] Next, the bending unit 300 is cut off, causing two of the four guide pins 302 that overlap with the two through holes 104 of the circuit substrate in the vertical direction to extend. Thus, as... Figure 14As shown, the two guide pins 302 are inserted through the two through holes 104 from below to above, and the upper ends of the two guide pins 302 protrude from the upper surface of the circuit substrate 12. Additionally, a recess 306 is formed on the upper end face of each guide pin, and the operation of the working head moving device 64 is controlled such that the lower ends of the pins 108 of the lead element 106 are inserted into these recesses 306. In other words, the operation of the X-direction moving device 68 and the Y-direction moving device 70 is controlled such that the XY coordinates of the lower ends of the pair of pins 108 of the lead element 106 held by the component holder 77 are aligned with the XY coordinates of the recesses of the two guide pins 302 exposed on the upper surface of the circuit substrate 12. Furthermore, by controlling the operation of the Z-direction moving device 72, the working heads 60 and 62 descend, and the lower ends of the pair of pins 108 of the lead element 106 held by the component holder 77 are inserted into the recesses 306 of the two guide pins 302 protruding from the upper surface of the circuit substrate 12.

[0066] Next, the cutting and bending unit 300 retracts the two guide pins 302 that protrude and extend from the upper surface of the circuit substrate 12. At this time, the working heads 60 and 62 also descend at the same speed as the retraction speed of the guide pins 302 through the operation of the Z-direction moving device 72. As a result, with the lower ends of a pair of pins 108 inserted into the recesses 306 of the two guide pins 302, the two guide pins 302 retract. Moreover, along with the retraction of the guide pins 302, the upper end face of the guide pins 302, in other words, the recesses 306, pass through the through holes 104 of the circuit substrate 12 and are housed inside the cutting and bending unit 300. At this time, the lower ends of the pair of pins 108 inserted into the recesses 306 also pass through the pair of through holes 104 of the circuit substrate 12 and are housed inside the cutting and bending unit 300. In other words, the lower ends of a pair of pins 108 of the lead element 106, guided by a pair of guide pins 302, are inserted into a pair of through holes 104 in the circuit substrate 12, and the lower ends of the pair of pins 108 are housed inside the cutting and bending unit 300. Moreover, the lower ends of the pair of pins 108 housed inside the cutting and bending unit 300 are cut off by a cutting device and bent. Thus, the lead element 106 is assembled to the circuit substrate 12 without the pins 108 disengaging from the through holes 104.

[0067] Thus, in the cutting and bending unit 300, the guide pins 302 extend and are inserted into a pair of through holes 104 from below the circuit substrate 12, with the front ends of the pair of guide pins 302 protruding from the upper surface of the circuit substrate 12. Furthermore, with the lower ends of a pair of pins 108 of the lead element 106 inserted into the recess 306 at the front end of the guide pins 302, the guide pins 302 retract, so that the lower ends of the pair of pins 108 are housed inside the cutting and bending unit 300, performing cutting and bending of the pair of pins. Therefore, it is desirable to properly insert the guide pins 302 into the through holes 104 of the circuit substrate 12, but in existing component mounting machines, a method for improving the insertion accuracy of the guide pins 302 has not yet been established. Here, in the component mounting machine 10, similar to the method for improving the insertion accuracy of the pins 108 into the through holes 104, the insertion accuracy of the guide pins 302 is improved using captured data.

[0068] Specifically, firstly, replacing one of the working heads 60 and 62, a shooting device 230 is installed on one of the sliding members 74 and 76 after the working heads have been removed, using the assembly mechanism for the working heads 60 and 62. As described above, each working head 60 and 62 is positioned and assembled on the sliding members 74 and 76 in a one-touch detachable manner, and the shooting device 230 is positioned and installed on one of the sliding members 74 and 76 after the working heads 60 and 62 have been removed, with the shooting device facing downwards on a vertical line. It should be noted that, as described above, the shooting device 230 can also be positioned and assembled on the rotary table 178 in a detachable manner, and is interchangeably positioned and detachably assembled on the rotary table 178 and one of the sliding members 74 and 76.

[0069] In addition, similar to the substrate 220 into which the pair of pins 204 of the auxiliary tool 200 are inserted, a substrate into which a pair of guide pins 302 of the cutting and bending unit 300 are also prepared. Here, the case where the substrate 220 is used not only for the auxiliary tool 200 but also for the guide pins 302 of the cutting and bending unit 300 will be described. In other words, the spacing between two adjacent through holes 222 of the four through holes 222 formed in the substrate 220 is the same as the spacing between two adjacent guide pins 302 of the four guide pins 302 of the cutting and bending unit. Incidentally, the spacing between two guide pins 302 is the distance between the center of the tip of one guide pin 302 and the center of the tip of the other guide pin 302. Furthermore, the inner diameter of one through hole 222 is approximately three times the outer diameter of one guide pin 302.

[0070] The substrate 220 with this structure is transported to the working position by the transport device 50 and clamped in the working position by the clamping device 52. Furthermore, the imaging device 230 mounted on the sliders 74 and 76 captures images of the adjacent through holes on the substrate 220 from above, and calculates the XY coordinates of two adjacent through holes 222 out of the four through holes 222 based on the captured data. Meanwhile, the cutting and bending unit 300 located below the substrate 220 moves and positions itself according to the above steps, such that the tips of two of the four guide pins 302 inserted into the two through holes whose coordinates have been calculated are aligned with the calculated XY coordinates of the two adjacent through holes 222 on the substrate. The cutting and bending unit 300 then extends the two guide pins 302. As a result, the two guide pins 302 are inserted from below into the two through holes 104 with aligned coordinates. At this time, as... Figure 15 As shown, the guide pin 302 is elongated by cutting and bending the unit 300 so that the upper end face of the guide pin 302 is aligned with the upper surface of the substrate 220 in the vertical direction. In other words, the upper end face of the guide pin 302 is made to be on the same plane as the upper surface of the substrate 220.

[0071] Furthermore, the pair of guide pins 302 inserted into the two through holes 222 of the substrate 220, which are located within the depth of field of the imaging device, are captured by the imaging device 230. In other words, the pair of guide pins 302 of the cutting and bending unit and the two through holes 222 of the substrate with the pair of guide pins 302 inserted are simultaneously captured from above by one imaging device 230. It should be noted that, as described above, the imaging device 230 is a two-dimensional imaging device with a relatively narrow depth of field. Therefore, by positioning the upper end of the guide pin 302 inserted into the through hole 222 in a manner that is coplanar with the upper surface of the substrate 220, an appropriate image of the upper end of the guide pin 302 and the through hole 222 is obtained.

[0072] Furthermore, based on the captured data of the two through holes 222 with a pair of guide pins 302 inserted, the misalignment between the inserted guide pins 302 and the through holes 222 is calculated. In other words, for example, as... Figure 10As shown, when one guide pin 302a is inserted into one through hole 222a and the other guide pin 302b is inserted into the other through hole 222b, the misalignment (ΔX1, ΔY1) between the center of one guide pin 302a and the center of one through hole 222a in the XY direction and the misalignment (ΔX2, ΔY2) between the center of the other guide pin 302b and the center of the other through hole 222b in the XY direction are calculated. Additionally, the misalignment angle (θ1) formed by the straight line connecting the center of one guide pin 302a and the center of the other guide pin 302b and the straight line connecting the center of one through hole 222a and the center of the other through hole 222b is also calculated.

[0073] Next, the insertion destinations of the two guide pins 302 are changed to the through holes 222 to perform imaging on another pair of through holes 222. For example, by operating the rotation device 156 of the unit moving device 36, the cutting and bending unit 300 is rotated 90 degrees. Then, according to the steps described above, the two guide pins 302 are inserted into the two through holes 222. At this time, as... Figure 11 As shown, one guide pin 302a is inserted into one through hole 222a, and the other guide pin 302b is inserted into the other through hole 222c. Furthermore, the misalignment (ΔX3, ΔY3) in the XY direction between the center of one guide pin 302a and the center of one through hole 222a, and the misalignment (ΔX4, ΔY4) in the XY direction between the center of the other guide pin 302b and the center of the other through hole 222c are calculated. Additionally, the misalignment angle (θ2) formed by the straight line connecting the center of one guide pin 302a and the center of the other guide pin 302b, and the straight line connecting the center of one through hole 222a and the center of the other through hole 222c are also calculated.

[0074] Furthermore, the insertion destination of the two guide pins 302 is changed to the through hole 222 to capture images of another pair of through holes 222. For example, the cutting and bending unit 300 is further rotated 90 degrees by the rotation device 156. Moreover, according to the above steps, the two guide pins 302 are inserted into the two through holes 222. Although the illustration at this time is omitted, one guide pin 302a is inserted into one through hole 222b, and the other guide pin 302b is inserted into the other through hole 222a. Furthermore, the misalignment in the XY direction between the center of one guide pin 302a and the center of one through hole 222b, and the misalignment in the XY direction between the center of the other guide pin 302b and the center of the other through hole 222a are calculated. In addition, the angle between the straight line connecting the center of one guide pin 302a to the center of the other guide pin 302b and the straight line connecting the center of one through hole 222a to the center of the other through hole 222b is also calculated.

[0075] Furthermore, based on the calculated misalignment amount and misalignment angle, a correction value is obtained when inserting a pair of guide pins 302 into a pair of through holes. Using this correction value, for example, when inserting two guide pins 302a and b into two through holes 222a and b, such as... Figure 9 As shown, two guide pins 302a and b can be inserted into the center of two through holes 222a and b. In other words, two guide pins 302 can be inserted into two through holes 222 with the misalignment and misalignment angle both being zero. This improves the insertion accuracy when inserting the guide pins 302 into the through holes 104 of the circuit substrate 12.

[0076] It should be noted that the methods for photographing the pair of through holes 222 with a pair of guide pins 302 inserted, calculating the misalignment amount and misalignment angle based on the photographic data obtained through this method, and obtaining the correction value for inserting the pair of guide pins into the pair of through holes based on the calculated misalignment amount and misalignment angle, are performed in the same way as when using the auxiliary fixture 200, during the inspection of the component mounting machine 10's accuracy, maintenance, and inspection after the component mounting machine 10 has been delivered to the user's destination. This enables the stabilization of the component mounting machine 10's quality, the avoidance of malfunctions, and the maintenance of insertion accuracy based on regular maintenance.

[0077] It should be noted that the component mounting machine 10 is an example of a substrate handling apparatus. The circuit substrate 12 is an example of a substrate. The component assembly apparatus 24 is an example of an insertion apparatus. The clamping device 52 is an example of a holding device. The through-hole 104 is an example of a through-hole. The lead element 106 is an example of a component. The lead 108 is an example of a terminal. The fixture 200 is an example of a fixture. The component body 202 is an example of a body. The pin 204 is an example of a pin. The substrate 220 is an example of a substrate. The through-hole 222 is an example of a through-hole. The imaging device 230 is an example of an imaging device. The cutting and bending unit 300 is an example of an insertion apparatus. The guide pin 302 is an example of a pin.

[0078] Furthermore, the present invention is not limited to the above embodiments and can be implemented in various ways with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiments, a pair of pins 204 and two through holes 222 with the pins inserted are simultaneously photographed from below the vertical axis by a single imaging device 230. Additionally, a pair of guide pins 302 and two through holes 222 with the guide pins inserted are simultaneously photographed from above the vertical axis by a single imaging device 230. On the other hand, if a pair of pins 204 and two through holes 222 are photographed simultaneously by the imaging device 230, the relative position, arrangement angle (in other words, positional offset), and misalignment angle of the pair of pins and the pair of through holes can be calculated. Furthermore, if a pair of guide pins 302 and two through holes 222 are photographed simultaneously by the imaging device 230, the relative position, arrangement angle (in other words, positional offset), and misalignment angle of the pair of guide pins and the two through holes can be calculated. In other words, it is also possible to acquire images simultaneously captured by the imaging device 230 of a pair of pins 204 and two through holes 222 in a state where the pair of pins are not inserted, or to acquire images simultaneously captured by the imaging device 230 of a pair of guide pins 302 and two through holes 222 in a state where the pair of guide pins are not inserted. However, the front ends of the pair of pins 204 or guide pins 302 and the two through holes 222 need to be in a state where they can be captured simultaneously from the viewpoint of a fixedly configured imaging device 230, and none of them need to be obstructed.

[0079] In the above embodiment, the component assembly device 24 for inserting the pin 204 into the through-hole 222 and the imaging device 230 for photographing the through-hole 222 with the pin inserted are positioned on opposite sides of the substrate 220. Similarly, the cutting and bending unit 300 for inserting the guide pin 302 into the through-hole 222 and the imaging device 230 for photographing the through-hole 222 with the guide pin inserted are positioned on opposite sides of the substrate 220. Alternatively, the component assembly device 24 and the imaging device 230 may both be positioned above the substrate 220, or both may be positioned below the substrate 220. In other words, when the pin 204 is inserted from above the substrate 220, the through-hole 222 with the pin 204 inserted may be photographed from above the substrate 220 at an angle deviating from the vertical axis. Alternatively, when the guide pin 302 is inserted from below the substrate 220, the through hole 222 is photographed below the substrate 220 at an angle deviating from the vertical axis, showing the state in which the guide pin 302 is inserted.

[0080] Additionally, in the above embodiments, the pins 204 of the auxiliary tool 200 may extend vertically from the component body 202 in a straight line. However, if the standardized pins, or in other words, the positions of the pins, are known in advance, they may extend at an angle from the component body even when bent. Furthermore, in the above embodiments, the component holder 77 holds the component body 202 of the auxiliary tool 200, but it may also hold the pins. Moreover, an auxiliary tool without a component body may also be used. For example, a rod-shaped component may be bent in a U-shape, with its two ends serving as a pair of pins, held by the component holder and used in a clamp. The correction value obtained when the component holder holds the pins as described above is used as the correction value when the component holder holds the pins of the component and inserts the pins into the through-holes of the circuit board. Furthermore, an auxiliary tool with non-standardized pins may also be used. However, when using an auxiliary tool with non-standardized pins, it is necessary to photograph the pins with an imaging device and identify their positions. In other words, commercially available pin components 106 can be used as auxiliary components 200 without the use of standardized auxiliary components.

[0081] Furthermore, in the above embodiment, the through-hole 222 is photographed with the physical pin 204 inserted into it. However, non-physical pins, such as those printed on the fixture or holes machined into the fixture, can also be used as substitutes for the fixture's pins. Alternatively, in such cases, for example, an illustration mimicking the shape of a line or rod of a pin or lead can be printed on the component body of the auxiliary fixture, or a pair of holes can be formed in the component body of the auxiliary fixture, and the illustration, holes, and through-hole 222 can be photographed simultaneously to obtain a correction value. In other words, the shape of the pin is known regardless of whether there is a physical pin or not; that is, the image of the pin and the through-hole 222 can be photographed simultaneously by the photographing device 230. In this way, the fixture can adopt various shapes of structures. Moreover, depending on the shape of the fixture, the type of component holder can also adopt various structures such as a suction nozzle of the suction body.

[0082] Furthermore, in the above embodiment, the misalignment between the center of pin 204 or guide pin and the center of through hole 222 is calculated. However, if the relative position of pin 204 or guide pin and through hole 222 is known, the misalignment is not limited to the center; various values ​​based on the captured data can also be calculated. For example, the distance between the inner wall of through hole 222 and the outline of the lower end face of pin 204 can also be calculated. It should be noted that the same applies to the relative position of guide pin 302 and through hole 222.

[0083] Furthermore, in the above embodiments, a two-dimensional image data captured by a single two-dimensional imaging device is used. However, imaging data captured by other types of imaging devices, such as stereo cameras, video cameras, 3D cameras, or multiple imaging devices, can also be used. Alternatively, imaging data captured by stereo cameras, video cameras, or 3D cameras can be intentionally converted into two-dimensional imaging data and used.

[0084] Furthermore, while the assembly operation of radial elements was described in the above embodiment as pin element 106, the present invention can be applied to axial elements. Moreover, the invention is not limited to pin elements; it can also be applied to elements having terminals inserted into the through hole 222.

[0085] Explanation of reference numerals in the attached figures

[0086] 10... Component mounting machine (substrate handling machine) 12... Circuit substrate (substrate) 24... Component assembly device (insertion device) 52... Clamping device (holding device) 104... Through hole 106... Lead component (component) 108... Lead (terminal) 200... Fixture 202... Component body (body) 204... Pin 220... Substrate 222... Through hole 230... Imaging device 300... Cutting and bending unit (insertion device) 302... Guide pin (pin)

Claims

1. A substrate processing machine, comprising: A holding device for positioning and holding a substrate with multiple through holes; An insertion device for inserting multiple pins of an element into multiple through holes in a substrate held by the holding device; and The imaging device, with a standardized pair of pins inserted into a pair of through holes among the plurality of through holes, simultaneously captures images of the pair of pins and the pair of through holes. Based on the image data captured by the imaging device, the positions of the pair of through holes and the pair of pins are calculated, and based on the position offset of the pair of through holes and the pair of pins, a correction value for inserting the pair of pins into the pair of through holes is obtained, and a correction value for properly inserting the plurality of pins into the plurality of through holes of the substrate is obtained.

2. The substrate processing machine according to claim 1, wherein, The image data is two-dimensional image data.

3. The substrate processing machine according to claim 1 or 2, wherein, The insertion device holds the accessory having the form of a main body and the pair of tubes. The imaging device simultaneously captures images of the pair of pins and the pair of through holes of the accessory held in the insertion device.

4. The substrate processing machine according to claim 3, wherein, The image of the pair of pins extends from the surface of the body.

Images