Crystal grain high-speed positioning method

Abstract

This application provides a high-speed die positioning method, including steps such as preparation, fixing, position adjustment, and transfer. In the fixing step, an adsorption device uses negative pressure to adsorb the area around a main target block, while a pusher moves to the main target block. In the position adjustment step, the adsorption device moves the main target block using negative pressure until the axis of the target die is aligned with the axis of the die placement area. In the transfer step, the pusher pushes the target die towards the substrate using a carrier film until the target die is transferred to the die placement area. Therefore, this application enables precise alignment of the target die's axis with the axis of the die placement area without moving the entire carrier film, significantly reducing the mass required for carrier film movement during position compensation and accelerating the movement speed.

Description

Technical Field

[0001] This application relates to a method for grain positioning, and more particularly to a method for high-speed grain positioning by fixing and moving a main target block within a small range using negative pressure to bring the target grain to a fixed point. Background Technology

[0002] Integrated circuits are fabricated on semiconductor wafers through a large-scale process involving multiple steps. The wafers are then further divided into multiple dies. In other words, a die is a small, unpackaged piece of integrated circuit material made from semiconductor material. The divided dies are neatly attached to a carrier film. A carrier frame then transports the carrier film to a substrate. At least one pusher then transfers at least one target die from the main target area of ​​the carrier film to at least one die placement area on the substrate, facilitating subsequent processing.

[0003] During the die transfer process, since the horizontal position of the pusher is fixed, the entire carrier film must be moved to align one axis of the target die with one axis of the die placement area. Then, the pusher pushes the target die towards the substrate through the carrier film until the target die is transferred to the die placement area.

[0004] However, the known technology has the following problems: First, the mass required to move the entire carrier film is quite large, and the moving speed is very slow; Second, the axis of the target grain is difficult to align with the axis of the grain placement area and there is a slight deviation, which makes it difficult for the target grain to be completely located in the grain placement area, thus affecting the subsequent processing procedures; Third, if some grains are not arranged in a uniform manner, the above two problems will become more serious. Summary of the Invention

[0005] The technical objective of this application is to provide a high-speed grain positioning method that first fixes the area around the main target block with negative pressure in a small range, and then moves the main target block with negative pressure, so that the axis of the target grain can be accurately aligned with the axis of the grain placement area without moving the entire carrier film, which greatly reduces the mass of the carrier film that needs to be moved when compensating for the position and speeds up the movement.

[0006] To address the aforementioned technical problems, embodiments of this application provide a high-speed grain positioning method, comprising the following steps:

[0007] Preparation steps: A first surface of a carrier film faces an adsorption device and at least one pusher; a second surface of the carrier film faces a substrate and has multiple grains; the carrier film is divided into multiple blocks according to the number of the multiple grains; one block is defined as a main target block; the remaining blocks are defined as other target blocks; at least one of the multiple grains in the main target block is defined as at least one target grain; the substrate has at least one grain placement area; the adsorption device is aligned around the main target block; an axis of the at least one target grain is offset from an axis of the at least one grain placement area.

[0008] In the fixed step, the adsorption device moves to the vicinity of the main target area and adsorbs the vicinity of the main target area by a negative pressure, and at least one pusher moves to the main target area.

[0009] In the position adjustment step, the adsorption device moves the main target block by negative pressure until the axis of at least one target grain is aligned with the axis of at least one grain placement area, and then the adsorption device stops moving.

[0010] In the transfer step, at least one pusher pushes at least one target die toward the substrate via a carrier film until at least one target die is transferred to at least one die placement area.

[0011] In some embodiments, in the preparation step, the first surface of the carrier film faces a pusher, one of the plurality of grains in the main target block is defined as a target grain, the substrate has a grain placement area, and the axis of the target grain is offset from the axis of the grain placement area; wherein, in the fixing step, the pusher moves to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by negative pressure until the axis of the target grain is aligned with the axis of the grain placement area; and wherein, in the transfer step, the pusher pushes the target grain towards the substrate through the carrier film until the target grain is transferred to the grain placement area.

[0012] Preferably, during the preparation step, multiple grains within the main target block are arranged either neatly or irregularly.

[0013] Specifically, in the high-speed grain positioning method described above, in the preparation step, the first surface of the carrier film faces multiple pushers, multiple grains within the main target block are arranged neatly, the multiple grains within the main target block are defined as multiple target grains, the substrate has multiple grain placement areas, and the multiple axes of the multiple target grains are respectively offset from the multiple axes of the multiple grain placement areas; wherein, in the fixing step, the multiple pushers move to the main target block; and wherein, in the position adjustment step, the adsorption device moves the main target block by negative pressure until the multiple axes of the multiple target grains are respectively aligned with the multiple axes of the multiple grain placement areas.

[0014] Preferably, in the high-speed grain positioning method described above, during the transfer step, the plurality of pushers respectively push the plurality of target grains toward the direction closer to the substrate through the carrier film, until the plurality of target grains are transferred sequentially or together to the plurality of grain placement areas.

[0015] Specifically, in the high-speed grain positioning method described above, in the preparation step, the first surface of the carrier film faces multiple pushing members, multiple grains in the main target block are arranged irregularly, the multiple grains in the main target block are defined as multiple target grains, the substrate has multiple grain placement areas, and the multiple axes of the multiple target grains are respectively offset from the multiple axes of the multiple grain placement areas; wherein, in the fixing step, the multiple pushing members move to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by negative pressure until the axis of one of the multiple target grains is aligned with the axis of one of the multiple grain placement areas; wherein, in the transfer step, one of the multiple pushing members pushes one of the multiple target grains towards the substrate through the carrier film until one of the multiple target grains is transferred to one of the multiple grain placement areas; and wherein, the position adjustment step and the transfer step are repeated until the multiple target grains are sequentially transferred to the multiple grain placement areas.

[0016] Furthermore, in the high-speed positioning method for grains as described above, in the fixing step, an image capture device acquires an image of at least one target grain, at least one pusher, and at least one grain placement area to obtain first image information, and sends the first image information to a control device. The control device determines a distance and an orientation between the axis of at least one target grain and the axis of at least one grain placement area based on the first image information to obtain adjustment information. In the position adjustment step, the control device controls the adsorption device to move the main target block by negative pressure according to the adjustment information until the axis of at least one target grain is aligned with the axis of at least one grain placement area. The control device then controls the adsorption device to stop moving and further begins to execute the transfer step, so that the control device further controls at least one pusher to move towards the carrier film.

[0017] Preferably, in the high-speed grain positioning method described above, during the position adjustment step, as multiple grains within the main target block move along the second surface of the carrier film, the image capture device acquires an image of at least one target grain, at least one pusher, and at least one grain placement area to obtain second image information, and sends the second image information to the control device. The control device determines whether the axis of the at least one target grain is aligned with the axis of the at least one grain placement area based on the second image information. When the control device determines that the axis of the at least one target grain is aligned with the axis of the at least one grain placement area based on the second image information, the control device controls the adsorption device to stop moving and further initiates the transfer step, thereby controlling the adsorption device to stop moving. The device further controls at least one pusher to move toward the carrier film; and wherein, when the control device determines, based on the second image information, that the axis of at least one target grain is not yet aligned with the axis of at least one grain placement area, the control device determines, based on the second image information, a gap and a position between the axis of at least one target grain and the axis of at least one grain placement area to obtain a correction information, and the control device controls the adsorption device to move the main target block by negative pressure according to the correction information until the axis of at least one target grain is aligned with the axis of at least one grain placement area, the control device controls the adsorption device to stop moving, and further begins to execute the transfer step, so that the control device further controls at least one pusher to move toward the carrier film.

[0018] Preferably, in the high-speed grain positioning method described above, in the preparation step, an axis of at least one pusher is aligned with the axis of at least one grain placement area; and in the position adjustment step, the adsorption device moves the main target block by negative pressure until the axis of at least one target grain is simultaneously aligned with the axis of at least one pusher and the axis of at least one grain placement area, and the adsorption device stops moving.

[0019] Preferably, the high-speed grain positioning method described above further includes a target conversion step after the transfer step. The adsorption device stops adsorbing the area around the main target block by negative pressure. At least one of the multiple grains in the main target block is defined as at least another target grain. The entire carrier film and the substrate are moved until an axis of the at least another target grain is aligned with an axis of the at least another grain placement area. The transfer step is performed after the target conversion step is completed. The target conversion step and the transfer step are repeated until all grains in the main target block are transferred to the substrate.

[0020] Compared with the prior art, the high-speed grain positioning method provided in this application has at least the following beneficial effects:

[0021] The high-speed grain positioning method of this application can first fix the area around the main target block in a small range by negative pressure, and then move the main target block by negative pressure, so that the axis of the target grain can be accurately aligned with the axis of the grain placement area. There is no need to move the entire carrier film, which greatly reduces the mass that the carrier film needs to move when compensating for the position and speeds up the movement. Attached Figure Description

[0022] Figure 1 This is a flowchart illustrating the high-speed grain positioning method of this application.

[0023] Figures 2A to 2E This is a schematic diagram of the preparation steps of the first embodiment of this application.

[0024] Figure 3 This is a bottom view of the adsorption device and the pusher of the first embodiment of this application.

[0025] Figure 4 This is a schematic diagram of the adsorption device, pushing member, image capture device, and control device according to the first embodiment of this application.

[0026] Figure 5 This is a schematic diagram of the fixed steps in the first embodiment of this application.

[0027] Figure 6 This is a schematic diagram illustrating the transmission of first image information and adjustment information according to the first embodiment of this application.

[0028] Figure 7 This is a bottom view of the carrier film of the first embodiment of this application, wherein multiple grains in the target block are arranged neatly, and an axis of one target grain is offset from an axis of one pusher and an axis of one grain placement area.

[0029] Figure 8A This is a perspective view of the adsorption device moving the main target block according to the first embodiment of this application.

[0030] Figure 8B This is a bottom view of the carrier film of the first embodiment of this application, wherein multiple grains in the target block are arranged neatly, and an axis of a target grain is aligned with an axis of a pusher and an axis of a grain placement area.

[0031] Figure 9 This is a schematic diagram illustrating the transmission of second image information and correction information according to the first embodiment of this application.

[0032] Figure 10 This is a schematic diagram of the transfer steps in the first embodiment of this application.

[0033] Figure 11 This is a schematic diagram showing the position change of the image capture device according to the first embodiment of this application.

[0034] Figure 12 This is a schematic diagram of the preparation steps of the second embodiment of this application.

[0035] Figure 13 This is a schematic diagram of the fixed steps in the second embodiment of this application.

[0036] Figure 14 This is a bottom view of the carrier film of the second embodiment of this application, wherein multiple grains in the target block are arranged neatly, and multiple axes of the multiple target grains are simultaneously offset from multiple axes of multiple pushers and multiple axes of multiple grain placement areas.

[0037] Figure 15 This is a bottom view of the carrier film of the second embodiment of this application, wherein multiple grains in the target block are arranged neatly, and multiple axes of the multiple target grains are simultaneously aligned with multiple axes of multiple pushers and multiple axes of multiple grain placement areas.

[0038] Figures 16A to 16E This is a schematic diagram of the transfer steps in the second embodiment of this application.

[0039] Figure 17 This is a schematic diagram of the conversion target steps in the second embodiment of this application.

[0040] Figure 18 This is a bottom view of the carrier film of the third embodiment of this application, wherein the multiple grains in the target block are arranged irregularly, and the multiple axes of the multiple target grains are simultaneously offset from the multiple axes of the multiple pushers and the multiple axes of the multiple grain placement areas.

[0041] Figure 19 This is a bottom view of the carrier film of the second embodiment of this application, wherein multiple grains in the target block are arranged irregularly, wherein the axis of one target grain is aligned with the axis of one pusher and the axis of one grain placement area, and the multiple axes of the remaining target grains are respectively offset from the multiple axes of the remaining pushers and the multiple axes of the remaining grain placement areas.

[0042] Figure 20 This is a schematic diagram of the transfer steps in the third embodiment of this application.

[0043] [Explanation of Labels in the Attached Image]

[0044] 10: Supporting membrane

[0045] 11: First Surface

[0046] 12: Second Surface

[0047] 13: Main target block

[0048] 14: Other target blocks

[0049] 20: Adsorption device

[0050] 21: Shaft hole

[0051] 22: Stomata

[0052] 30: Pushing component

[0053] 31: Axis

[0054] 40: Substrate

[0055] 41: Grain Placement Area

[0056] 411: Axis

[0057] 50: Grain size

[0058] 51: Target grain

[0059] 511: Axis

[0060] 60: Vacuum device

[0061] 601: Negative Pressure

[0062] 70: Image capture device

[0063] 71: First Image Information

[0064] 72: Second image information

[0065] 80: Control device

[0066] 81: Adjust information

[0067] 82: Calibration Information

[0068] 90: Load-bearing frame

[0069] S1: Preparation Steps

[0070] S2: Fixed Steps

[0071] S3: Position Adjustment Steps

[0072] S4: Transfer Steps

[0073] S5: Target Conversion Steps Detailed Implementation

[0074] To make the technical problems, technical solutions, and advantages of this application clearer, a detailed description will be provided below in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as particular configurations and components are provided merely to aid in a comprehensive understanding of the embodiments of this application. Therefore, those skilled in the art should understand that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this application. Furthermore, for clarity and brevity, descriptions of known functions and structures have been omitted.

[0075] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0076] In the various embodiments of this application, it should be understood that the sequence number of each process described below does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0077] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0078] In the embodiments provided in this application, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean that B is determined solely based on A; B can also be determined based on A and / or other information.

[0079] Please see Figures 1 to 10 The first embodiment of this application provides a high-speed grain positioning method, comprising the following steps:

[0080] Preparation step S1, such as Figure 1 and Figures 2A to 2EAs shown, a first surface 11 of a carrier film 10 faces an adsorption device 20 and a pusher 30, and a second surface 12 of the carrier film 10 faces a substrate 40 and has a plurality of grains 50. The carrier film 10 is divided into a plurality of blocks according to the number of the plurality of grains 50. One block is defined as a main target block 13, and the remaining blocks are defined as other target blocks 14. The plurality of grains 50 in the main target block 13 are arranged in a neat manner, and one of the plurality of grains 50 in the main target block 13 is defined as a target grain 51. The substrate 40 has a grain placement area 41. The adsorption device 20 is aligned with the periphery of the main target block 13. An axis 31 of the pusher 30 is aligned with an axis 411 of the grain placement area 41. The axis 511 of the target grain 51 is offset from both the axis 31 of the pusher 30 and the axis 411 of the grain placement area 41.

[0081] Specifically, the two ends of the carrier film 10 are respectively located on a carrier frame 90, two clamps (not shown) clamp the carrier frame 90, and a control device 80 controls the carrier frame 90 to move the entire carrier film 10 until the adsorption device 20 is aligned with the area around the main target block 13.

[0082] Preferably, such as Figure 2C , Figure 3 and Figure 4 As shown, the adsorption device 20 is annular to form a shaft hole 21 and has multiple air holes 22. These air holes 22 are connected to a vacuum device 60, and a pusher 30 is movably located within the shaft hole 21. Figure 2E and Figure 4 As shown, an image capture device 70 is located on the side of the substrate 40 opposite to the carrier film 10.

[0083] Fixed step S2, such as Figure 1 and Figure 5 As shown, a control device 80 controls the adsorption device 20 to move around the main target area 13, a vacuum device 60 evacuates the plurality of air holes 22 to create a vacuum and provides a negative pressure 601, the adsorption device 20 adsorbs around the main target area 13 through the negative pressure 601, and the control device 80 controls the pusher 30 to move to the main target area 13. Figures 5 to 7 As shown, the image capture device 70 acquires an image of the target die 51, the pusher 30, and the die placement area 41 to obtain a first image information 71, and sends the first image information 71 to the control device 80. The control device 80 determines the distance and position between the axis 511 of the target die 51, the axis 31 of the pusher 30, and the axis 411 of the die placement area 41 based on the first image information 71, so as to obtain an adjustment information 81.

[0084] Position adjustment step S3, such as Figure 1 , Figure 8A and Figure 8B As shown, the control device 80 controls the adsorption device 20 to move the main target block 13 by negative pressure 601 according to the adjustment information 81, until the axis 511 of the target grain 51 is simultaneously aligned with the axis 31 of the pusher 30 and the axis 411 of the grain placement area 41, and the control device 80 controls the adsorption device 20 to stop moving. Further, as... Figure 9 As shown, during the movement of multiple grains 50 within the main target block 13 along the second surface 12 of the carrier film 10, the image capture device 70 acquires an image of the target grain 51, the pusher 30, and the grain placement area 41 to obtain a second image information 72, and sends the second image information 72 to the control device 80. The control device 80 determines, based on the second image information 72, whether the axis 511 of the target grain 51 is simultaneously aligned with the axis 31 of the pusher 30 and the axis 411 of the grain placement area 41. When the control device 80 determines, based on the second image information 72, that the axis 511 of the target grain 51 is simultaneously aligned with the axis 31 of the pusher 30 and the axis 411 of the grain placement area 41, the control device 80 controls the adsorption device 20 to stop moving. When the control device 80 determines, based on the second image information 72, that the axis 511 of the target grain 51 is not simultaneously aligned with the axis 31 of the pusher 30 and the axis 411 of the grain placement area 41, the control device 80 determines, based on the second image information 72, a distance and a position between the axis 511 of the target grain 51 and the axis 31 of the pusher 30 and the axis 411 of the grain placement area 41, thereby obtaining a correction information 82. Based on the correction information 82, the control device 80 controls the negative pressure 601 of the adsorption device 20 to move the main target block 13 until the axis 511 of the target grain 51 is simultaneously aligned with the axis 31 of the pusher 30 and the axis 411 of the grain placement area 41.

[0085] Transfer step S4, such as Figure 1 and Figure 10 As shown, the control device 80 controls the pusher 30 to move toward the carrier film 10. The pusher 30 pushes the target die 51 toward the substrate 40 through the carrier film 10 until the target die 51 is transferred to the die placement area 41.

[0086] Furthermore, such as Figures 2A to 2E As shown, prior to the implementation of the method of this application, in preparation step S1, the adsorption device 20 and the pusher 30 do not contact the first surface 11 of the carrier film 10, therefore, as Figure 5 As shown, in the fixing step S2, the control device 80 needs to first control the adsorption device 20 and the pusher 30 to move along a vertical direction to the first surface 11 of the carrier film 10.

[0087] The preparation step S1, fixing step S2, position adjustment step S3, and transfer step S4 are repeated until all the grains 50 on the first main target block 13 are transferred to the multiple grain placement areas 41. After all the grains 50 on the first main target block 13 are transferred to the multiple grain placement areas 41, one of the other target blocks 14 is selected as the next main target block 13. At this time, the process returns to the preparation step S1, and the adsorption device 20 and the pusher 30 remain against the first surface 11 of the carrier film 10. In the fixing step S2, there are two ways in which the adsorption device 20 and the pushing member 30 move to the next main target block 13: First, the carrier membrane 10 remains stationary, and the control device 80 controls the adsorption device 20 and the pushing member 30 to move directly along the first surface 11 of the carrier membrane 10 to the next main target block 13; Second, the adsorption device 20 and the pushing member 30 remain stationary, and the control device 80 controls the carrier membrane 10 to move, so that the adsorption device 20 and the pushing member 30 move indirectly to the next main target block 13. The subsequent position adjustment step S3 and transfer step S4 are as described above.

[0088] After all the grains 50 have been transferred to the substrate 40, the control device 80 controls the adsorption device 20 and the pusher 30 to move away from the carrier film 10.

[0089] Please see Figure 11 , Figure 11 This is a schematic diagram showing a change in the position of the image capture device 70 according to the first embodiment of this application. The position of the image capture device 70 can also be changed to be located on the side of the adsorption device 20 and the pusher 30 relative to the carrier film 10.

[0090] It is worth mentioning that in the preparation step S1 of the first embodiment, even if the multiple dies 50 in the main target block 13 are arranged unevenly (not shown), the purpose of transferring the target die 51 to the die placement area 41 can be achieved through the fixing step S2, the position adjustment step S3 and the transfer step S4 of the first embodiment.

[0091] Alternatively, in the preparation step S1 of other embodiments, the axis 31 of the pusher 30 may also be offset from the axis 411 of the grain placement area 41. Therefore, in the position adjustment step S3, the adsorption device 20 moves the main target block 13 by negative pressure until the axis 511 of the target grain 51 is aligned with the axis 411 of the grain placement area 41, and the adsorption device 20 stops moving.

[0092] Please see Figures 12 to 1 6. The difference between the second embodiment and the first embodiment is as follows: Figure 12As shown, in preparation step S1, the first surface 11 of the carrier film 10 faces the plurality of pushers 30, the plurality of grains 50 in the main target block 13 are arranged neatly, and the plurality of grains 50 in the main target block 13 are defined as a plurality of target grains 51. The substrate 40 has a plurality of grain placement areas 41, the plurality of axes 31 of the plurality of pushers 30 are respectively aligned with the plurality of axes 411 of the plurality of grain placement areas 41, and the plurality of axes 511 of the plurality of target grains 51 are simultaneously offset from the plurality of axes 31 of the plurality of pushers 30 and the plurality of axes 411 of the plurality of grain placement areas 41. Figure 13 and Figure 14 As shown, in the fixing step S2, the control device 80 controls the plurality of jacking members 30 to move to the main target block 13. Figure 6 and Figure 15 As shown, in the position adjustment step S3, the control device 80 controls the adsorption device 20 to move the main target block 13 by negative pressure 601 according to the adjustment information 81, until the multiple axes 511 of the multiple target grains 51 are simultaneously aligned with the multiple axes 31 of the multiple pushers 30 and the multiple axes 411 of the multiple grain placement areas 41. Figures 16A to 16E As shown, in the transfer step S4, the plurality of pushers 30 sequentially push the plurality of target dies 51 toward the substrate 40 through the carrier film 10 until the plurality of target dies 51 are sequentially transferred to the plurality of die placement areas 41. In other words, the control device 80 can also control one pusher 30 to push one target die 51 through the carrier film 10 at a time.

[0093] It is worth mentioning that, in another operating mode of the transfer step S4 in the second embodiment, the control device 80 controls the plurality of pushers 30 to push the plurality of target dies 51 toward the substrate 40 through the carrier film 10, until the plurality of target dies 51 are transferred together to the plurality of die placement areas 41. In other words, the control device 80 can control all pushers 30 to simultaneously push all target dies 51 through the carrier film 10 at one time.

[0094] Please see Figure 1 and Figure 17Following the transfer step S4, a target conversion step S5 is also included. The control device 80 controls the vacuum device 60 to stop pumping air, causing the adsorption device 20 to stop adsorbing the area around the main target block 13 through negative pressure 601. Several other grains within the main target block 13 are defined as multiple target grains 51. The control device 80 controls the carrier frame 90 to move the entire carrier film 10 and controls the substrate 40 to move until the multiple axes 511 of the multiple target grains 51 are aligned with the multiple axes 31 of the multiple pushers 30 and the multiple axes 411 of the other grain placement areas 41, respectively. After the target conversion step S5 ends, the transfer step S4 is performed. The target conversion step S5 and the transfer step S4 are repeated until all grains 50 within the main target block 13 are transferred to the substrate 40.

[0095] Please see Figure 18 and Figure 19 The difference between the third embodiment and the second embodiment is as follows: Figure 18 As shown, in preparation step S1, the multiple grains 50 within the main target block 13 are arranged irregularly. For example... Figure 19 As shown, in the position adjustment step S3, the control device 80 controls the adsorption device 20 to move the main target block 13 by negative pressure 601 according to the adjustment information 81, until the axis 511 of one of the plurality of target grains 51 is simultaneously aligned with the axis 31 of one of the plurality of pushers 30 and the axis 411 of one of the plurality of grain placement areas 41. Figure 20 As shown, in transfer step S4, one of the plurality of pushers 30 pushes one of the plurality of target dies 51 toward the substrate 40 via the carrier film 10, until one of the plurality of target dies 51 is transferred to one of the plurality of die placement areas 41. Figure 1 As shown, the position adjustment step S3 and the transfer step S4 are repeated until the plurality of target dies 51 are sequentially transferred to the plurality of die placement areas 41.

[0096] In summary, the high-speed die positioning method of this application can first fix the area around the main target block 13 in a small range by using negative pressure 601, and then move the main target block 13 by using negative pressure 601, so that the axis 511 of the target die 51 can be accurately aligned with the axis 411 of the die placement area 41, without having to move the entire carrier film 10, which greatly reduces the mass required to move the carrier film 10 when compensating for the position and speeds up the movement.

[0097] Furthermore, regardless of whether the multiple dies 50 within the main target block 13 are arranged neatly or unevenly, the high-speed die positioning method of this application can ensure that the axis 511 of the target die 51 is precisely aligned with the axis 411 of the die placement area 41.

[0098] Furthermore, the high-speed die positioning method of this application can be applied to a single pusher 30 or multiple pushers 30, and provides different operating modes depending on whether the multiple dies 50 in the main target block 13 are arranged neatly or unevenly.

[0099] Furthermore, the high-speed positioning method for the target die 51 can accurately determine the relative position of the target die 51 and the die placement area 41 through the image capture device 70 and the control device 80. This helps the control device 80 to accurately control the adsorption device 20 to move the target die 51 to the correct position, so that the axis 511 of the target die 51 can be aligned with the axis 411 of the die placement area 41, ensuring that the pusher 30 can accurately transfer the target die 51 to the die placement area 41.

[0100] In addition, during the movement of multiple dies 50 within the main target block 13 along the second surface 12 of the carrier film 10, the high-speed die positioning method of this application can continuously correct the relative position of the target die 51 and the die placement area 41 through the image capture device 70 and the control device 80, so that the final position of the target die 51 has zero error from the correct position.

[0101] Furthermore, if the axis 31 of the pusher 30 is aligned with the axis 411 of the die placement area 41, the pusher 30 can transfer the target die 51 to the die placement area 41 at the most precise angle.

[0102] Furthermore, reference numerals and / or letters may be repeated in different examples within this application. Such repetition is for the purpose of simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or settings discussed.

[0103] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion.

[0104] The above description is the preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principles described in this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A high-speed grain positioning method, characterized in that, Includes the following steps: Preparation steps: A first surface of a carrier film faces an adsorption device and at least one pushing member; a second surface of the carrier film faces a substrate and has a plurality of grains; the carrier film is divided into a plurality of blocks according to the number of the plurality of grains; one block is defined as a main target block; the remaining blocks are defined as other target blocks; at least one of the plurality of grains in the main target block is defined as at least one target grain; the substrate has at least one grain placement area; the adsorption device is aligned around the main target block; an axis of the at least one target grain is offset from an axis of the at least one grain placement area. In the fixed step, the adsorption device moves to the vicinity of the main target block and adsorbs the vicinity of the main target block by a negative pressure, and the at least one pushing member moves to the main target block; In the position adjustment step, the adsorption device moves the main target block by the negative pressure until the axis of the at least one target grain is aligned with the axis of the at least one grain placement area, at which point the adsorption device stops moving; and In the transfer step, the at least one pusher pushes the at least one target die toward the substrate via the carrier film until the at least one target die is transferred to the at least one die placement area.

2. The high-speed grain positioning method as described in claim 1, characterized in that, In the preparation step, the first surface of the carrier film faces a pusher, one of the plurality of grains in the main target block is defined as a target grain, the substrate has a grain placement area, and the axis of the target grain is offset from the axis of the grain placement area; wherein, in the fixing step, the pusher moves to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the axis of the target grain is aligned with the axis of the grain placement area; and wherein, in the transfer step, the pusher pushes the target grain towards the substrate through the carrier film until the target grain is transferred to the grain placement area.

3. The high-speed grain positioning method as described in claim 2, characterized in that, In the preparation step, multiple grains within the main target block are arranged either neatly or irregularly.

4. The high-speed grain positioning method as described in claim 1, characterized in that, In the preparation step, the first surface of the carrier film faces the plurality of pushing members, the plurality of grains in the main target block are arranged neatly, the plurality of grains in the main target block are defined as a plurality of target grains, the substrate has a plurality of grain placement areas, and the plurality of axes of the plurality of target grains are respectively offset from the plurality of axes of the plurality of grain placement areas; wherein, in the fixing step, the plurality of pushing members move to the main target block; and wherein, in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the plurality of axes of the plurality of target grains are respectively aligned with the plurality of axes of the plurality of grain placement areas.

5. The high-speed grain positioning method as described in claim 4, characterized in that, In the transfer step, the plurality of pushers push the plurality of target dies sequentially or together through the carrier film to move them toward the substrate until the plurality of target dies are transferred sequentially or together to the plurality of die placement areas.

6. The high-speed grain positioning method as described in claim 1, characterized in that, In the preparation step, the first surface of the carrier film faces the plurality of pushing members, the plurality of grains in the main target block are arranged irregularly, the plurality of grains in the main target block are defined as a plurality of target grains, the substrate has a plurality of grain placement areas, and the plurality of axes of the plurality of target grains are respectively offset from the plurality of axes of the plurality of grain placement areas; wherein, in the fixing step, the plurality of pushing members move to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the axis of one of the plurality of target grains is aligned with the axis of one of the plurality of grain placement areas; wherein, in the transfer step, one of the plurality of pushing members pushes one of the plurality of target grains toward the substrate by the carrier film until one of the plurality of target grains is transferred to one of the plurality of grain placement areas; and wherein, the position adjustment step and the transfer step are repeated until the plurality of target grains are sequentially transferred to the plurality of grain placement areas.

7. The high-speed grain positioning method as described in claim 1, characterized in that, In the fixing step, an image capture device acquires an image of the at least one target grain, the at least one pusher, and the at least one grain placement area to obtain first image information, and sends the first image information to a control device. The control device determines a distance and an orientation between the axis of the at least one target grain and the axis of the at least one grain placement area based on the first image information to obtain adjustment information. In the position adjustment step, the control device controls the adsorption device to move the main target block by the negative pressure according to the adjustment information until the axis of the at least one target grain is aligned with the axis of the at least one grain placement area. The control device then controls the adsorption device to stop moving and further begins to execute the transfer step, so that the control device further controls the at least one pusher to move towards the carrier film.

8. The high-speed grain positioning method as described in claim 7, characterized in that, In the position adjustment step, as multiple grains within the main target block move along the second surface of the carrier film, the image capture device acquires an image of the at least one target grain, the at least one pusher, and the at least one grain placement area to obtain second image information, and sends the second image information to the control device. The control device determines whether the axis of the at least one target grain is aligned with the axis of the at least one grain placement area based on the second image information. When the control device determines that the axis of the at least one target grain is aligned with the axis of the at least one grain placement area based on the second image information, the control device controls the adsorption device to stop moving and further begins the transfer step, causing the control device to further control the at least one grain placement area. A pusher moves toward the carrier film; and wherein, when the control device determines, based on the second image information, that the axis of the at least one target grain is not yet aligned with the axis of the at least one grain placement area, the control device determines, based on the second image information, a distance and a position between the axis of the at least one target grain and the axis of the at least one grain placement area, to obtain correction information; the control device controls the adsorption device to move the main target block by the negative pressure according to the correction information until the axis of the at least one target grain is aligned with the axis of the at least one grain placement area; the control device controls the adsorption device to stop moving and further begins to execute the transfer step, so that the control device further controls the at least one pusher to move toward the carrier film.

9. The high-speed grain positioning method as described in claim 1, characterized in that, In the preparation step, an axis of the at least one pusher is aligned with the axis of the at least one grain placement area; and in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the axis of the at least one target grain is simultaneously aligned with the axis of the at least one pusher and the axis of the at least one grain placement area, and the adsorption device stops moving.

10. The high-speed grain positioning method as described in claim 1, characterized in that, The process includes a target conversion step following the transfer step, whereby the adsorption device stops adsorbing the area around the main target block by the negative pressure, at least one of the plurality of grains within the main target block is defined as at least another target grain, and the entire carrier film and the substrate are moved until an axis of the at least another target grain is aligned with an axis of the at least another grain placement area; wherein the transfer step is performed after the target conversion step is completed; and wherein the target conversion step and the transfer step are repeated until all grains within the main target block are transferred to the substrate.

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