Multi-loop circulating heat dissipation module

Abstract

The present invention provides a multi-loop circulation heat dissipation module, which includes a first tank, a first pipeline, a second tank and a second pipeline. The first pipeline is connected to the first tank to form a first loop, and a first working fluid is filled in the first loop and conducts heat transfer through phase change, and a first high-temperature section and a first low-temperature section are formed in the first pipeline. The second pipeline is connected to the second tank to form a second loop, and a second working fluid is filled in the second loop and conducts heat transfer through phase change, and a second high-temperature section and a second low-temperature section are formed in the second pipeline. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.

Description

Technical Field

[0001] The present invention relates to a heat dissipation module, and more particularly to a multi-loop circulation heat dissipation module. Background Art

[0002] With the progress of technology, portable electronic devices are developing towards being thinner and lighter. For example, thin and light notebook computers, tablet personal computers (Tablet PCs), or smart mobile phones, etc., their thin and light appearance is quite suitable for users to carry and operate with them. Moreover, in order to improve the processing efficiency of tablet personal computers, the performance of the central processing unit on the main board has also been improved, but it is also prone to generate a large amount of heat energy, which often causes the circuits or electronic components of the electronic device to crash due to overheating, which is really inconvenient.

[0003] Generally speaking, the heat dissipation modules configured in electronic devices include air-cooled heat dissipation modules and water-cooled heat dissipation modules such as thin and light notebook computers, tablet personal computers (Tablet PCs), or smart mobile phones. Among them, the water-cooled heat dissipation module has better efficiency. However, in the trend of the aforementioned portable electronic devices towards thinner, lighter, shorter, and smaller designs, how to configure the corresponding heat dissipation module within the limited space of the body while still maintaining its heat dissipation efficiency is actually a topic that relevant personnel need to consider and solve. Summary of the Invention

[0004] The present invention is directed to a multi-loop circulation heat dissipation module, which can improve the overall heat dissipation capacity of the module.

[0005] According to an embodiment of the present invention, the multi-loop circulation heat dissipation module includes a first tank, a first pipeline, a second tank, and a second pipeline. The first pipeline is connected to the first tank to form a first loop. A first working fluid is filled in the first loop and conducts heat transfer through phase change, and a first high-temperature section and a first low-temperature section are formed in the first pipeline. The second pipeline is connected to the second tank to form a second loop. A second working fluid is filled in the second loop and conducts heat transfer through phase change, and a second high-temperature section and a second low-temperature section are formed in the second pipeline. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.

[0006] Based on the above, the heat dissipation module is formed by a multi-loop circulation arrangement and filled with a corresponding working fluid so that these loops are independent single loops. More importantly, for these independent loops, the heat dissipation module of the present invention further combines the high-temperature sections and low-temperature sections of their respective pipelines by means of thermal contact. Accordingly, the high-temperature section of one loop can further transfer heat to the low-temperature section of another loop, and for the overall heat dissipation module, a temperature equalization effect can be provided to effectively improve the overall heat dissipation capacity of the heat dissipation module. In other words, by slowing down the degree of temperature drop of a single loop and providing an additional heat dissipation path, the overall heat dissipation efficiency of the heat dissipation module can be enhanced, so as to more quickly transfer the heat generated by the heat source of the electronic device to the external environment and avoid heat accumulation in a local part of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a schematic diagram of a multi-loop circulation heat dissipation module according to an embodiment of the present invention;

[0008] Figure 2 is Figure 1 a schematic diagram of the internal structure of the tank body of the heat dissipation module;

[0009] Figure 3 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the present invention;

[0010] Figure 4 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0011] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0012] Figure 1 is a schematic diagram of a multi-loop circulation heat dissipation module according to an embodiment of the present invention. Please refer to Figure 1, an arrow beside the circuit is shown here as a simple illustration of the working fluid filled therein. In this embodiment, the multi-loop circulation heat dissipation module 100 includes a first tank 110, a first pipeline 120, a second tank 130, and a second pipeline 140. The first pipeline 120 is connected to the first tank 110 to form a first loop P1. The first working fluid F1 is filled in the first loop P1 and transfers heat through phase change, and a first high-temperature section H1 and a first low-temperature section L1 are formed in the first pipeline 120. The second pipeline 140 is connected to the second tank 130 to form a second loop P2. The second working fluid F2 is filled in the second loop P2 and transfers heat through phase change, and a second high-temperature section H2 and a second low-temperature section L2 are formed in the second pipeline 140, wherein the first high-temperature section H1 is in thermal contact with the second low-temperature section L2, and the first low-temperature section L1 is in thermal contact with the second high-temperature section H2.

[0013] Furthermore, the multi-loop circulation heat dissipation module 100 is adapted to an electronic device (such as a notebook computer or a tablet computer) to dissipate heat from a heat source 400 (such as a central processing unit or a display chip). In this embodiment, the first tank 110 and the second tank 130 are in thermal contact with the heat source 400 to absorb the heat generated by the heat source 400, and cause the first working fluid F1 and the second working fluid F2 located in the first tank 110 and the second tank 130 respectively to undergo phase change (from the liquid phase to the vapor phase). Then, the first working fluid F1 and the second working fluid F2 in the vapor phase flow out of the first tank 110 and the second tank 130 respectively. Next, during the process of traveling in the first pipeline 120 and the second pipeline 140, they gradually dissipate heat and turn into the liquid phase, and accordingly flow back to the first tank 110 and the second tank 130 respectively to form a phase change cycle. Therefore, whether it is the first loop P1 or the second loop P2, it can provide a heat dissipation effect for the heat source 400. For the first loop P1, the first working fluid F1 in the first high-temperature section H1 is in the vapor phase, and the first working fluid F1 in the first low-temperature section L1 is in the liquid phase, and there is a state of coexistence of liquid and vapor in between. For the second loop P2, the second working fluid F2 in the second high-temperature section H2 is in the vapor phase, and the second working fluid F2 in the second low-temperature section L2 is in the liquid phase, and there is a state of coexistence of liquid and vapor in between.

[0014] It should be noted that if the above first loop P1 and second loop P2 are viewed individually, the temperature in the first low-temperature section L1 and the temperature in the second low-temperature section L2 are substantially close to the ambient temperature. In the case of a small temperature difference, the heat dissipation effect at this place has been significantly reduced. In other words, if there is only the first loop P1 or only the second loop P2, the overall heat dissipation efficiency can only rely on the phase change of the first working fluid F1 in the first pipeline 120 or the phase change of the second working fluid F2 in the second pipeline 140 to achieve heat dissipation, thus creating the efficiency bottleneck of the current loop-type circulation heat dissipation module.

[0015] Due to the above, in this embodiment, the first circuit P1 and the second circuit P2 that are different from each other are further combined to form a heat contact area between the first high-temperature section H1 and the second low-temperature section L2, and another heat contact area between the second high-temperature section H2 and the first low-temperature section L1, so that the first high-temperature section H1 and the second low-temperature section L2 can further perform heat exchange, and the second high-temperature section H2 and the first low-temperature section L1 can also further perform heat exchange. By combining multiple individual circuits through the above means, a temperature equalization effect is provided for the entire multi-circuit circulation heat dissipation module 100, thereby slowing down the temperature drop of individual circuits, and also providing an additional heat dissipation path for the first high-temperature section H1 and the second high-temperature section H2. This further creates a temperature difference between the multi-circuit circulation heat dissipation module 100 and the external environment (which is also equivalent to increasing the temperature difference area between the multi-circuit circulation heat dissipation module 100 and the external environment), making it easier for the multi-circuit circulation heat dissipation module 100 to dissipate the heat generated by the heat source 400 to the external environment.

[0016] In this embodiment, the flow direction of the first working fluid F1 in the first circuit P1 is opposite to the flow direction of the second working fluid F2 in the second circuit P2, and the first circuit P1 and the second circuit P2 are independent of each other and have inner and outer closed contours, so that the high- and low-temperature sections of different circuits can correspond to each other. Furthermore, the multi-circuit circulation heat dissipation module 100 further includes a first heat conduction member 150 and a second heat conduction member 160. The first heat conduction member 150 is connected between the first high-temperature section H1 and the second low-temperature section L2 to transfer the heat of the first high-temperature section H1 to the second low-temperature section L2. The second heat conduction member 160 is connected between the second high-temperature section H2 and the first low-temperature section L1 to transfer the heat of the second high-temperature section H2 to the first low-temperature section L1.

[0017] Here, the first heat conduction member 150 and the second heat conduction member 160 are, for example, heat pipes or components with heat conduction capabilities. For example, when the multi-circuit circulation heat dissipation module 100 is adapted to a laptop computer, the first heat conduction member 150 and the second heat conduction member 160 can be the metal structure of the body or a metal backplane or metal bracket provided on the body. This is beneficial for the formation of the heat contact areas of the above-mentioned high- and low-temperature sections. Of course, in other embodiments not shown, direct heat transfer can also be achieved by directly structurally abutting the first high-temperature section H1 against the second low-temperature section L2, and directly structurally abutting the second high-temperature section H2 against the first low-temperature section L1. Here, the form of making the high- and low-temperature sections in thermal contact with each other is not limited.

[0018] In addition, the first tank 110 and the second tank 130 of this embodiment are of an integrated structure, that is, different chambers within the same structural member, and the different chambers are independent of each other and not connected.

[0019] Figure 2 is Figure 1Schematic diagram of the internal structure of the slot of the heat dissipation module. Here, the first slot 110 is taken as an example, and the second slot 130 has the same internal structure and is thus omitted. In this embodiment, the first slot 110 has a chamber 111 and a plurality of flow guiding members 112 disposed in the chamber 111. The chamber 111 has an inlet E1 and an outlet E2. The flow guiding members 112 have a tapered profile from the inlet E1 towards the outlet E2, or the flow guiding members 112 form a plurality of flow channels 113 that taper from the inlet E1 towards the outlet E2 in the chamber 111, so as to correspondingly control the flow of the first working fluid F1 and the second working fluid F2 from the inlet E1 to the outlet E2. In other words, the configuration of the flow guiding members 112 in the chamber 111 will affect the flow direction of the working fluid (taking the first working fluid F1 as an example) in the loop. Therefore, in this case, by adjusting the first slot 110 and the second slot 130, the first loop P1 and the second loop P2 are formed into the configuration state as shown in Figure 1 to achieve the corresponding effects required for the high and low temperature sections.

[0020] Figure 3 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the present invention. Please refer to Figure 3 , in this embodiment, the multi-loop circulation heat dissipation module 200 includes a first slot 210, a first pipeline 220, a second slot 230, a second pipeline 240, a third slot 250, and a third pipeline 260. The first slot 210 is connected to the first pipeline 220 to form a first loop P11, the second slot 230 is connected to the second pipeline 240 to form a second loop P21, and the third slot 250 is connected to the third pipeline 260 to form a third loop P31. The first working fluid F11 is filled in the first loop P11, the second working fluid F21 is filled in the second loop P21, and the third working fluid F31 is filled in the third loop P31.

[0021] Following the same logic as the previous embodiment, in this embodiment, different individual loops are also combined, and a state of thermal contact is present between the high and low temperature sections to facilitate heat transfer. Accordingly, the first high temperature section H11 of the first pipeline 220 is in thermal contact with the third low temperature section L31 of the third pipeline 260, the first low temperature section L11 of the first pipeline 220 is in thermal contact with the second high temperature section H21 of the second pipeline 240, and the third high temperature section H31 of the third pipeline 260 is in thermal contact with the second low temperature section L21 of the second pipeline 240. In other words, as shown in Figure 3 , the first loop P11, the second loop P21, and the third loop P31 form three thermal contact zones 271 - 273. Similar to the above embodiment, these thermal contact zones 271 - 273 can adopt a direct structural contact or be connected through a heat conduction member to achieve the effect of transferring the heat of the high temperature section to the low temperature section.

[0022] Here, the first tank 210, the second tank 230, and the third tank 250 are of an integral structure. The flow direction of the first working fluid F11 in the first circuit P11 is opposite to the flow direction of the second working fluid F21 in the second circuit P21, and the flow direction of the first working fluid F11 in the first circuit P11 is opposite to the flow direction of the third working fluid F31 in the third circuit P31, thus forming a state where the second circuit P21 and the third circuit P31 are independent and separated from each other, and both are surrounded by the first circuit P11.

[0023] Figure 4 It is a schematic diagram of a multi-circuit circulation heat dissipation module according to another embodiment of the present invention. Different from the foregoing embodiment, in the multi-circuit circulation heat dissipation module 300 of this embodiment, the first tank 310 and the second tank 330 are separate structures, and the first pipeline 320 and the second pipeline 340 are also separate and juxtaposed at the same time, and the flow directions of the working fluid in the different circuits shown are the same as each other. In other words, the first tank 310, the first pipeline 320, and the working fluid filled therein in this embodiment are for dissipating heat from the heat source 410, while the second tank 330, the second pipeline 340, and the working fluid filled therein are for dissipating heat from the heat source 420. At the same time, the first tank 310 and the second tank 330 are also connected through the third conduction member 350 to achieve the heat transfer effect between the two. More importantly, there are also heat contact areas 360 and 370 for high and low temperature sections between the first pipeline 320 and the second pipeline 340. Briefly speaking, the independent circuits shown in the multi-circuit circulation heat dissipation module 300 of this embodiment can smoothly achieve heat exchange through the third conduction member 350 and the heat contact areas 360 and 370, and can also achieve the aforementioned temperature equalization effect and overall heat dissipation capacity.

[0024] It should also be mentioned that whether Figure 1 、 Figure 3 or Figure 4 the embodiments shown, the tanks can all use the flow guiding member 112 as shown in Figure 2 to make the flow direction of the working fluid in the circuit meet the requirements.

[0025] In summary, the heat dissipation module of the present invention is formed by a multi-loop circulation setting, and a corresponding working fluid is filled so that these loops are independent single loops. More importantly, for these independent loops, the heat dissipation module of the present invention further combines the high-temperature section and the low-temperature section of each pipeline by means of thermal contact. Accordingly, the high-temperature section of one loop can further transfer heat to the low-temperature section of another loop. In addition to serving as an additional heat dissipation path, it can also provide an even temperature effect for the overall heat dissipation module, so as to effectively improve the overall heat dissipation capacity of the heat dissipation module. In other words, by slowing down the temperature drop of a single loop and providing an additional heat dissipation path, the overall heat dissipation efficiency of the heat dissipation module can be improved, so as to more quickly transfer the heat generated by the heat source of the electronic device to the external environment and avoid heat accumulation in a local area of the electronic device.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-loop circulating heat dissipation module, characterized in that, Comprising: A first tank body; A first pipeline, connecting the first tank body to form a first loop, a first working fluid is filled in the first loop, and heat transfer is carried out through phase change, and a first high-temperature section and a first low-temperature section are formed in the first pipeline; A second tank body; And A second pipeline, connecting the second tank body to form a second loop, a second working fluid is filled in the second loop, and heat transfer is carried out through phase change, and a second high-temperature section and a second low-temperature section are formed in the second pipeline, wherein the first high-temperature section is in thermal contact with the second low-temperature section, the first low-temperature section is in thermal contact with the second high-temperature section, and the multi-loop circulation heat dissipation module further includes a third tank body and a third pipeline, the third pipeline connects the third tank body to form a third loop, a third working fluid is filled in the third loop, and heat transfer is carried out through phase change, and a third high-temperature section and a third low-temperature section are formed in the third pipeline, wherein the first high-temperature section is in thermal contact with the third low-temperature section, the first low-temperature section is in thermal contact with the second high-temperature section, and the third high-temperature section is in thermal contact with the second low-temperature section.

2. The multi-loop circulation heat dissipation module according to claim 1, wherein The flow direction of the first working fluid in the first loop and the flow direction of the second working fluid in the second loop are opposite to each other.

3. The multi-loop circulation heat dissipation module according to claim 1, characterized in that, The first loop and the second loop are independent of each other and have inner and outer closed contours.

4. The multi-loop circulation heat dissipation module according to claim 1, wherein The first tank body and the second tank body are of an integral structure.

5. The multi-loop circulation heat dissipation module according to claim 1, wherein The first tank body, the second tank body and the third tank body are of an integral structure.

6. The multi-loop circulation heat dissipation module according to claim 1, wherein The flow direction of the first working fluid in the first loop and the flow direction of the second working fluid in the second loop are opposite to each other, and the flow direction of the first working fluid in the first loop and the flow direction of the third working fluid in the third loop are opposite to each other.

7. The multi-loop circulation heat dissipation module according to claim 1, wherein The second loop and the third loop are independent and separated from each other, and are both surrounded by the first loop.

8. The multi-loop circulation heat dissipation module according to claim 1, characterized in that The first tank body, the second tank body and the third tank body each have a chamber and a plurality of flow guiding members arranged in the chamber, the chamber has an inlet and an outlet, the plurality of flow guiding members have a tapered profile from the inlet to the outlet, or the plurality of flow guiding members form a plurality of tapered flow channels from the inlet to the outlet in the chamber, so as to correspondingly control the flow of the first working fluid, the second working fluid and the third working fluid from the inlet to the outlet.

9. The multi-loop circulation heat dissipation module according to claim 1, wherein, The first tank body and the second tank body each have a chamber and a plurality of flow guiding members arranged in the chamber, the chamber has an inlet and an outlet, the plurality of flow guiding members have a tapered profile from the inlet to the outlet, or the plurality of flow guiding members form a plurality of tapered flow channels from the inlet to the outlet in the chamber, so as to correspondingly control the flow of the first working fluid and the second working fluid from the inlet to the outlet.

Images