Method for forming cutout or cut-out portion in printed circuit board by laser processing

Abstract

A method for forming a cutout or cutout portion in a printed circuit board by laser processing, the method comprising: setting a target processing line for showing the shape of the cutout portion that meets the design size at the design position of the printed circuit board, and sequentially setting a plurality of auxiliary processing lines on one side of the cutout portion based on the target processing line, sequentially irradiating the target processing line with laser light from the auxiliary processing line to form a plurality of grooves each having a substantially V-shaped longitudinal section, and setting the range of overlap between adjacent tapered surfaces constituting the grooves to be equal to the translation amount. By repeatedly performing the above-mentioned laser processing sequentially from the position of the auxiliary processing line farthest from the target processing line, and cutting the printed circuit board while discharging processing powder or vapor from the cutout side, the cutout surface of the printed circuit board can be made smooth, and the effect of correctly mounting a semiconductor or the like on the cutout portion of the printed circuit board can be achieved.

Description

Technical Field

[0001] The present invention relates to a method for forming a cutout portion or a removal portion in a printed substrate, and in particular, to a method for forming a cutout portion or a removal portion in a single-layer or multi-layer printed substrate (hereinafter referred to as a "printed substrate") by laser processing for mounting a semiconductor or other electronic component (hereinafter referred to as a "semiconductor, etc.") with a solder ball terminal on the printed substrate. Background Art

[0002] In recent years, electronic products such as mobile phones and personal computers have been increasingly becoming more advanced, thinner, and smaller.

[0003] Therefore, the printed circuit board installed in the electronic product also needs to be high-performance, thin and small. Thus, when the printed circuit board is installed with semiconductors, it is necessary to use a laser processing method that can perform more precise processing to form a cutout or cutout portion (see Patent Document 1: Japanese Patent Publication No. 2003-17828).

[0004] In particular, semiconductors and the like mounted on a printed circuit board affect the thinning and miniaturization of the entire printed circuit board on which the semiconductors and the like are mounted, and therefore the cutout and removed portions require particularly high positional accuracy and dimensional accuracy.

[0005] However, when a cutout or removal portion of a predetermined size is to be formed at a predetermined position in a printed circuit board by laser processing, even if a predetermined cutting line of a predetermined size is set at the predetermined position and a laser with a low energy intensity is irradiated multiple times to form the cutout or removal portion, the processing cannot exceed a certain depth, and thus the cutout or removal portion cannot be formed. Therefore, only a laser with a higher energy intensity can be used.

[0006] However, when laser light with high energy intensity is irradiated, heat from the irradiated laser light explosively generates processed powder or vapor of the base material of the printed circuit board at the cut portion of the printed circuit board.

[0007] Therefore, the cut surface of the cut portion of the printed circuit board becomes rough and loses smoothness, and processing powder or vapor adheres to the surface of the printed circuit board.

[0008] In this way, since the cut surface of the cut portion caused by the above-mentioned laser processing is not smooth, it is difficult to install a semiconductor or the like in the cut portion or the excised portion at the accurate position, resulting in the inability to ensure the high position accuracy or dimensional accuracy required for the semiconductor or the like.

[0009] Furthermore, when laser processing is performed on the printed substrate, if the laser reaches not only the printed substrate but also the lower plate, the processing powder or vapor generated will adhere to the surface of the printed substrate, and may even cause malfunction of the printed substrate or electronic products mounted on the printed substrate. Summary of the invention

[0010] Problems to be solved by the invention:

[0011] The problems to be solved by the present invention are: when a cutout portion or a removal portion for mounting a semiconductor or the like is formed by laser processing in a printed circuit board, the heat of the laser makes the cut surface in the cutout portion uneven, resulting in the inability to ensure the high positional accuracy or dimensional accuracy required when mounting the semiconductor or the like in the cutout portion or the removal portion of the printed circuit board; and the problem that processing powder or vapor generated by the printed circuit board and a lower plate on which the printed circuit board is placed adheres to the surface of the printed circuit board, causing the printed circuit board and the electronic product mounted on the printed circuit board to malfunction.

[0012] An object of the present invention is to provide a method for forming a cutout portion or a removed portion in a printed circuit board by laser processing, which can solve the above-mentioned problems.

[0013] In order to solve the above problems, the first feature of the present invention is:

[0014] When a cutout portion or a removed portion (hereinafter referred to as a "cutout portion, etc.") is formed by laser processing in the printed substrate, a processing line (hereinafter referred to as a "target processing line S1") for the cutout portion, etc. showing the design size is set at the design position on the printed substrate.

[0015] Based on the target processing line S1, multiple processing lines (hereinafter referred to as "auxiliary processing lines S2, ..., Sn", n is the total number of the target processing lines and the auxiliary processing lines) are set on the opposite side of the side that becomes the product after laser processing.

[0016] Among the target processing line S1 and the auxiliary processing lines S2, ..., Sn, there is a spacing distance (hereinafter referred to as "displacement") between the adjacent target processing line S1 and the auxiliary processing lines S2, ..., Sn-1, Sn, and the laser is sequentially irradiated from the auxiliary processing lines Sn, Sn-1, ..., S2 to the target processing line S1 to form a plurality of grooves with a roughly V-shaped longitudinal cross-section, and the grooves with adjacent roughly V-shaped longitudinal cross-sections are formed by a plurality of conical surfaces, and the spacing distance is set to be equal to the overlapping range between the adjacent conical surfaces.

[0017] By repeatedly performing laser processing from the position of the auxiliary processing line Sn which is farthest from the target processing line S1 among the auxiliary processing lines S2, ..., Sn-1, Sn, and sequentially toward the position of the target processing line S1 (hereinafter referred to as "one processing cycle"), the printed substrate is finally cut at the position of the target processing line S1 to form the cut portion, etc.

[0018] Thus, when laser processing is performed sequentially starting from the position of the auxiliary processing line Sn farthest from the target processing line S1, the energy intensity at the center of the irradiated laser is the highest, so that the groove having a roughly V-shaped longitudinal cross section is formed at the position of the auxiliary processing line Sn.

[0019] Next, the next auxiliary processing line Sn-1 is set at a translation amount, and the translation amount is equivalent to the overlapping range of the adjacent conical surfaces of the groove with a roughly V-shaped longitudinal cross-section formed by the laser irradiation at the auxiliary processing line Sn-1 and the conical surface of the groove with a roughly V-shaped longitudinal cross-section formed by the previous laser irradiation at the auxiliary processing line Sn.

[0020] Therefore, when the laser is irradiated to the position of the auxiliary processing line Sn-1, the conical surface of the groove with a roughly V-shaped longitudinal cross-section formed by irradiating the position of the auxiliary processing line Sn-1 with the laser will overlap and merge with the adjacent conical surfaces in the groove with a roughly V-shaped longitudinal cross-section formed by irradiating the position of the auxiliary processing line Sn with the laser. Although they have continuous vertices (repeated vertices) at approximately the same depth position, by repeating multiple of the above-mentioned processing cycles, a groove that is roughly flat and has a roughly inverted trapezoidal longitudinal cross-section can be formed on the bottom surface of the printed substrate. Furthermore, the laser is irradiated in the same sequence from the position of the auxiliary processing line Sn-2 to the position of the target processing line S1, thereby sequentially forming the grooves with vertices having a roughly inverted trapezoidal longitudinal section at approximately the same depth position, and the conical surface on the side opposite to the auxiliary processing line Sn-1 at the auxiliary processing line Sn and the conical surface on the side opposite to the auxiliary processing line S2 at the target processing line S1 form a wide groove with a roughly inverted trapezoidal longitudinal section.

[0021] Since this wide groove having a substantially inverted trapezoidal longitudinal section is formed, by repeatedly performing a plurality of the above-mentioned laser processing cycles starting from the position of the auxiliary processing line Sn to the position of the target processing line S1, the groove having a substantially V-shaped longitudinal section formed at the position of each processing line Sn, ..., S1 is deepened, and the printed substrate can be finally cut at the position of the target processing line S1. In this case, the printed substrate may sometimes be cut at the position of the auxiliary processing lines Sn, ..., S2, but these cut positions will cause the cut portion, etc. to have unnecessary parts. Therefore, by finally cutting the printed substrate at the position of the target processing line S1, the cut portion, etc. that meets the design size can be formed at the predetermined design position of the printed substrate.

[0022] Thus, the cutting of the cut portion of the printed substrate is achieved by sequentially irradiating the auxiliary processing lines Sn, ..., S2 and the target processing line S1 with laser, and repeating this processing cycle. Therefore, the smoothness of the tapered surface of the printed substrate as the cut surface can be ensured by reducing the energy intensity of the laser irradiated at a single time.

[0023] The laser processing at the position of the target processing line S1 is performed by performing laser processing at the positions of the auxiliary processing lines Sn to S2, so that the tapered surface of the groove having a substantially inverted trapezoidal shape in the longitudinal section is formed on the printed substrate, and the processing is performed within the range overlapping with the adjacent tapered surface. At this time, the continuous grooves having a substantially V-shaped longitudinal section formed by irradiating the positions of the processing lines Sn to S1 constitute the grooves having a substantially inverted trapezoidal shape in the longitudinal section, and the grooves having the inverted trapezoidal shape are opened in the direction of the auxiliary processing line Sn when viewed from the side of the target processing line S1. Therefore, the processing powder or vapor generated in the printed substrate due to the irradiation of the laser is mostly discharged from the side of the auxiliary processing line Sn (that is, the side of the cut portion of the printed substrate that is not a product), and less on the side of the printed substrate that is a product, so that the side of the printed substrate that is a product is not prone to undercutting, and the processing powder or vapor can be prevented from adhering to the surface of the printed substrate.

[0024] In addition, although the number of the auxiliary processing lines will change with the thickness and material of the printed substrate, the total number (including the target processing line) is more appropriately 5 to 10, mainly considering the balance between the operating time and energy required for laser processing.

[0025] That is, when the target processing line and the auxiliary processing lines are less than 5 in total, the operation time of laser processing will be shortened, but the position of the vertex in the groove whose longitudinal cross-section is roughly V-shaped when the laser is irradiated sequentially from the auxiliary processing line Sn to the target processing line S1 must be deeper, that is, the energy intensity of the laser must be increased, which will reduce the quality of the cut surface and cause failure of the printed circuit board as a product.

[0026] In contrast, if the target processing line and the auxiliary processing line total more than 10, the translation amount between the target processing line and the auxiliary processing line will be smaller. In this way, although the energy intensity of the laser in laser processing can be reduced, there will be a disadvantage of increasing the number of repetitions of the processing cycle and extending the operation time.

[0027] Furthermore, in order to make the bottom surface of the groove having a roughly inverted trapezoidal shape in longitudinal section formed by sequentially irradiating the laser from the position of the auxiliary processing line Sn to the position of the target processing line S1 become approximately flat due to repeated multiple processing cycles, the translation amount must be set to be equivalent to: the range of overlap between adjacent conical surfaces of the grooves having a roughly V-shaped longitudinal section, among the grooves having a roughly V-shaped longitudinal section formed by sequentially irradiating the laser from the auxiliary processing lines Sn, Sn-1, ..., S2 to the target processing line S1.

[0028] That is, if the translation amount of each processing line Sn to S1 is outside the overlapping range between adjacent conical surfaces of the conical surfaces constituting the grooves with roughly V-shaped longitudinal sections formed by sequentially irradiating laser from the auxiliary processing lines Sn, Sn-1, ..., S2 to the target processing line S1, then even if the laser is irradiated to each position of the auxiliary processing line and the target processing line in sequence, the laser is simply irradiated to each processing line position on the surface of the printed substrate, and a groove with roughly V-shaped longitudinal section of the same shape and depth is processed at each processing line position. In this way, the printed substrate cannot be cut by irradiating laser.

[0029] In addition, the shift amount is based on the spot diameter of the laser, which accounts for 86% of the laser energy intensity, and is equivalent to a value of about ±30%. Here, the shift amount changes with the material of the processing material. For example, if the material of the processing material is harder, the shift amount is adjusted to be narrower (negative adjustment), and if it is softer, the shift amount is adjusted to be wider (positive adjustment).

[0030] Moreover, although the processing cycle in laser processing varies with the thickness or material of the printed substrate, 20 to 100 cycles are more appropriate, considering the balance of factors such as the energy required for laser processing, the operation time, and the quality of the cut surface of the printed substrate.

[0031] That is, if the processing cycle is less than 20 cycles, the operation time required for laser processing will be shortened, but the energy intensity of the laser must be increased, and increasing the energy intensity of the laser will reduce the quality of the cut surface, which will cause the printed circuit board as a product to fail. In contrast, if the processing cycle exceeds 100, the energy intensity of the laser can be reduced, and although it can prevent the quality of the cut surface from being reduced, it has the disadvantage of excessively increasing the operation time and increasing the manufacturing cost.

[0032] According to the first feature, its second feature is:

[0033] A drain groove is provided on the surface of the lower plate on which the printed circuit board is placed. The drain groove is provided just below the positions of the target processing line S1 and the auxiliary processing lines S2, ..., Sn-1, Sn set on the printed circuit board.

[0034] As described above, the discharge groove is provided on the surface of the lower plate on which the printed substrate is placed, just below the target processing line S1 and the auxiliary processing lines S2, ..., Sn of the printed substrate. Therefore, when the laser finally cuts the printed substrate at the target processing line S1, or when the printed substrate is also cut at the auxiliary processing lines Sn, ..., S2, a large amount of processing powder or vapor generated by irradiating the lower plate can be contained in the discharge groove, and can be suppressed from being ejected from the cut portion of the printed substrate.

[0035] In this way, the processing powder or vapor can be prevented from adhering to the surface of the printed circuit board, so that the printed circuit board and the electronic products mounted on the printed circuit board can be prevented from malfunctioning.

[0036] Here, regarding the depth and width of the drain groove provided on the surface of the lower plate, it is more appropriate to have dimensions of about 1 mm each, taking into account the balance between factors such as interference with the suction port for adsorbing and fixing the printed substrate placed on the lower plate, the amount of processing powder or vapor generated on the lower plate due to laser irradiation, and errors occurring when the printed substrate is placed on the lower plate.

[0037] That is, if the depth and width of the discharge groove are much smaller than 1 mm, the interference with the suction port for adsorbing and fixing the printed substrate placed on the lower plate will be small, and the degree of freedom in designing the discharge groove can be increased, but there will be a situation where the processing powder or vapor cannot be reliably contained, and it is difficult to cope with the error between the printed substrate and the lower plate when the printed substrate is placed on the lower plate. In contrast, if the depth and width of the discharge groove are much larger than 1 mm, although the processing powder or vapor can be reliably contained and the error between the printed substrate and the lower plate can be reliably coped with, the interference with the suction port for adsorbing and fixing the printed substrate placed on the lower plate will increase, and there is a disadvantage of reducing the degree of freedom in designing the discharge groove.

[0038] In addition, the width or depth of the discharge groove arranged on the lower plate can be regarded as a large space relative to the translation amount of the target processing line and the auxiliary processing line set on the printed substrate. Therefore, it is possible to fully accommodate the processing powder or vapor generated on the lower plate due to the laser irradiation, so there is no need to actively set up a special mechanism for discharging the processing powder or vapor to the outside.

[0039] However, when the cut-out portion is formed on the printed substrate, the surface of the cut-out portion will also become the end surface of the printed substrate, so openings will inevitably be formed at both ends of the discharge groove, so that the processing powder or steam contained in the discharge groove can be naturally discharged to the outside from the openings at both ends of the discharge groove.

[0040] The beneficial effects of the present invention are:

[0041] In the present invention, when cutting a printed substrate, the tapered surface of the groove with a V-shaped longitudinal section generated by laser processing at the position of the target processing line is combined with the groove with a V-shaped longitudinal section formed continuously by irradiating the laser at the positions of multiple auxiliary processing lines, and as a result, it forms a part of the groove with a roughly inverted trapezoidal longitudinal section. Therefore, by irradiating the laser with low energy intensity multiple times, the cut-out part of the printed substrate can be formed by laser, and a smooth cut surface can be obtained. In addition, the processing powder or vapor generated from the printed substrate by irradiating the laser at the position of each processing line is mostly discharged from the side that is not a product, that is, the auxiliary processing line side. Therefore, the tapered surface formed on the cut surface of the printed substrate as a product side can be maintained smooth, and the processing powder or vapor can be prevented from adhering to the surface of the printed substrate. Therefore, the cut-out part of the printed substrate can be formed at the designed position in accordance with the design, thereby preventing the printed substrate from malfunctioning. In this way, semiconductors can be mounted with high positional accuracy and high dimensional accuracy, and there is an excellent effect of improving the yield of the cut-out part formed by laser processing in the printed substrate.

[0042] Furthermore, when the lower plate is irradiated with laser, even if a large amount of processing powder or steam is generated on the lower plate, the large amount of processing powder or steam will be contained in the discharge groove of the lower plate, thereby preventing the processing powder or steam from being ejected from the cut portion of the printed substrate. In this way, the processing powder or steam can be prevented from adhering to the cut surface of the printed substrate or the surface of the printed substrate, thereby having an excellent effect of preventing the printed substrate or electronic products from malfunctioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a front view of a printed circuit board undergoing cutting processing;

[0044] Figure 2 It is a front view of a printed circuit board undergoing a cutting process;

[0045] Figure 3 yes Figure 1 A partially enlarged cross-sectional view at the AA line;

[0046] Figure 4 is a schematic diagram showing a processing cycle of the printed substrate; and

[0047] Figure 5 It is a schematic diagram showing the final processing cycle for forming a cut portion on the printed substrate. DETAILED DESCRIPTION

[0048] Before the present invention is described in detail, it should be noted that similar elements are denoted by the same reference numerals in the following description.

[0049] Embodiments of the invention:

[0050] The present invention is to form a cutout or removal portion for mounting a semiconductor or the like on a printed substrate by laser processing, with a target processing line for forming a cutout or the like that meets the design size set as a reference at the design position of the printed substrate, and each groove (laser action area) having a substantially V-shaped longitudinal section formed by sequentially irradiating the laser from the auxiliary processing line to the target processing line on the opposite side of the product portion after the above laser processing is formed by a conical surface, and the adjacent conical surfaces of the adjacent grooves having a substantially V-shaped longitudinal section have an overlapping range, and a plurality of auxiliary processing lines are set with the overlapping range as a translation amount. Then, by repeatedly performing laser processing sequentially from the auxiliary processing line farthest from the target processing line to the target processing line, and discharging processing powder or vapor generated by the laser processing to the auxiliary processing side, the printed substrate is finally cut at the target processing line, so that a cutout or removal portion that meets the design size is formed at the design position of the printed substrate.

[0051] Example:

[0052] See also Figure 1 , Figure 3 and Figure 4 , Figure 1 The method of forming a cutout portion or a cut-away portion by laser processing in a printed circuit board according to the present invention is described. A cutout portion 2 for mounting a semiconductor or the like is formed on a printed circuit board 1 made of glass fiber reinforced epoxy resin with a thickness of 0.8 mm.

[0053] When the present invention is implemented on the printed substrate 1, the printed substrate 1 is placed and fixed on a lower plate 9 on a processing table (not shown) in a laser processing machine (not shown) before being irradiated with laser light.

[0054] In addition, on the surface of the above-mentioned lower plate 9, directly below a target processing line S1 set on the printed substrate 1 and set to a rectangular shape described later and multiple auxiliary processing lines S2, ..., S5, there are corresponding discharge grooves 10 with the same shape and a width and depth of 1 mm.

[0055] When implementing the method of forming a cutout portion or a cutout portion by laser processing in a printed circuit board of the present invention to form the cutout portion 2 conforming to the designed size at the designed position of the printed circuit board 1, the following procedures must be performed:

[0056] First, the target processing line S1 is set on the printed substrate 1 , and the target processing line S1 indicates a shape of the cut portion 2 that meets the design dimensions.

[0057] Next, based on the target processing line S1, four auxiliary processing lines S2, ..., S5 are set on the side where the cut portion 2 is cut out by laser processing, that is, the side of the printed substrate 1 that is not used as a product. At this time, the target processing line S1, which is a total of 5, and the auxiliary processing lines S2, ..., S5 have an interval distance (that is, a value of a translation amount); the grooves 3, 4, 5, 6, 7 (laser action areas) described later, which are roughly V-shaped in longitudinal sections and formed by sequentially irradiating the laser from the auxiliary processing lines S5, S4, ..., S2 to the target processing line S1, are formed by a plurality of tapered surfaces 3a', 3a", ..., 7a', 7a", and the overlapping range of the adjacent tapered surfaces 3a" and 4a', 4a" and 5a', ..., 6a" and 7a' in the adjacent grooves 3, 4, 5, 6, 7, which are roughly V-shaped in longitudinal sections, is set to be consistent with the above-mentioned interval distance. In other words, the value of the translation amount is set to be equal to the above-mentioned overlapping range. In this embodiment, the translation amount is set to 7μm. In addition, the translation amounts can all be the same value or different values, but in this embodiment, they are all the same.

[0058] Under this premise, laser processing is performed in sequence from the position of the auxiliary processing line S5 farthest from the target processing line S1 to the position of the target processing line S1 among the five target processing lines S1 and the auxiliary processing lines S2, ..., S5 set on the printed substrate 1. In addition, the irradiated laser is a UV (Ultraviolet) laser (not shown), and the irradiation conditions are that the laser spot diameter is 15μm, the laser frequency is 50kHz, the energy is 100μj, the processing pitch is 10μm, and the processing cycle is set to 50.

[0059] Therefore, at the position of the auxiliary processing line S5, processing powder or vapor is generated from the printed substrate 1 due to the heat of the laser. In addition, since the center of the laser energy intensity with the highest intensity, that is, the laser center, reaches the deepest position of the printed substrate 1, a groove 3 having a substantially V-shaped longitudinal section is formed, and the groove 3 is composed of two conical surfaces 3a' and 3a" with the reached laser center as the vertex.

[0060] After that, the positions of the auxiliary processing lines S4, S3, S2 and the target processing line S1 are sequentially laser processed. Since the positions of the auxiliary processing lines S4, S3, S2 and the target processing line S1 are irradiated with laser light, the centers of the laser light reach approximately the same depth position, and a plurality of grooves 4, 5, 6, 7 having a substantially V-shaped longitudinal cross section are similarly formed with the centers of the laser light reaching the points as the apex. At this time, the grooves 3, 4, 5, 6, 7 having a V-shaped longitudinal section formed by sequentially irradiating the laser from the auxiliary processing lines S5, S4, S3, S2 toward the target processing line S1 are formed by the tapered surfaces 3a', 3a", ..., 7a', 7a", and the respective translation amounts between the auxiliary processing lines S5 to S2 and the target processing line S1 are set to be equal to the range of overlap between the adjacent tapered surfaces 3a" and 4a', 4a" and 5a', ..., 6a" and 7a' of the adjacent grooves 3, 4, 5, 6, 7 having a V-shaped longitudinal section. In this way, the grooves 4, ..., 7 having a V-shaped longitudinal section formed by irradiating the laser are combined with the adjacent grooves. As viewed from the target processing line S1 side, by executing a plurality of processing cycles, a groove 8 having a substantially flat bottom surface and an inverted trapezoidal longitudinal section is formed, which is widely opened toward the auxiliary processing line S5 side.

[0061] When the cut portion 2 is cut from the printed substrate 1, the auxiliary processing lines S5, ..., S2 and the target processing line S1 are repeatedly subjected to 50 processing cycles of sequential laser irradiation. Therefore, the smoothness of the cut surface (that is, the tapered surface 7a") of the printed substrate 1 to be a product can be ensured by reducing the energy intensity of a single laser irradiation.

[0062] Furthermore, most of the processing powder or vapor generated by irradiating the printed substrate 1 with laser light will be discharged from the auxiliary processing line S5 side, and the amount on the opposite side will be reduced. In this way, when laser processing is sequentially performed from the position of the auxiliary processing line S5 to the position of the target processing line S1, the processing powder or vapor generated by irradiating the printed substrate 1 with laser light will be mainly discharged from the auxiliary processing line S5 side, that is, mainly from the side of the cut portion 2 of the printed substrate 1 that will not be used as a product, and there will be very little on the side of the printed substrate 1 that will be used as a product. Therefore, the cutting surface or surface of the printed substrate 1 on the side used as a product will not be attached with processing powder or vapor, and the biting edge 12 of the tapered surface generated by it is also mostly formed on the tapered surface 3a' on the side that will not be used as a product. Therefore, when the printed substrate 1 is finally cut at the position of the target processing line S1, the cut portion 2 having the tapered surface 7a" as a cutting surface and conforming to the designed size can be formed at the designed position of the printed substrate 1, and the printed substrate 1 itself or the semiconductor mounted thereon can be prevented from malfunctioning.

[0063] In this way, when the printed substrate 1 is finally cut at the position of the target processing line S1, the cut portion 2 that meets the design dimensions and has the conical surface 7a" as the cutting surface can be formed at the designed position of the printed substrate 1, and the cut surface of the cut portion 2 is still maintained smooth, so the semiconductor can be correctly installed in this cut portion 2.

[0064] Furthermore, when the printed substrate 1 is cut by laser irradiation, even if the laser irradiates the lower plate 9 and generates a large amount of processing powder or vapor, since the surface of the lower plate 9 is provided with the discharge groove 10, this discharge groove 10 is arranged directly below the target processing line S1 and the auxiliary processing lines S2, ..., S5, which are five in total.

[0065] Therefore, the processing powder or vapor is contained in the discharge groove 10 and does not spray out from the cut portion of the printed substrate 1 , so that it is possible to reliably prevent the processing powder or vapor from being attached to the cut portion or surface of the printed substrate 1 .

[0066] In addition, the width and depth of the discharge groove 10 arranged on the lower plate 9 are 1 mm, which is much larger than the width of the target processing line S1 and the auxiliary processing lines S2 to S5, which are five in total. Therefore, the discharge groove 10 itself can be regarded as a large space, so there is no need to add a mechanism for discharging processing powder or steam to the outside.

[0067] See also Figure 2When a cutout portion 2' is formed on the printed substrate 1, two exhaust ports 11 opening to the outside are inevitably formed at both ends of a exhaust groove 10' provided on a lower plate 9', so that the processing powder or steam contained in the exhaust groove 10' can be naturally discharged to the outside from the exhaust port 11.

[0068] Possible industrial applications:

[0069] By repeatedly performing a processing cycle of laser processing in sequence from the auxiliary processing line set on the printed substrate toward the target processing line, the printed substrate can be cut, and a cut portion of the correct size can be formed at the correct position, and the tapered surface of the cut portion can be ensured to be smooth. Therefore, a cut portion and a cut-out portion that meet the designed size can be formed at the designed position of a printed substrate of any material, so a semiconductor can be correctly installed in the cut portion and the cut-out portion, so it can be applied to a device for laser processing of a printed substrate installed on any electronic product.

[0070] In summary, the method of forming a cutout portion or a removed portion by laser processing in a printed circuit board of the present invention can indeed achieve the purpose of the present invention.

[0071] The above are merely embodiments of the present invention and should not be used to limit the scope of the present invention. That is, any simple equivalent changes and modifications made according to the claims and description of the present invention still fall within the scope of the present invention.

Claims

1. A method for forming a cutout portion or a cutout portion in a printed circuit board by laser processing, characterized in that: When a cutout portion or a cutout portion is formed by laser processing in the printed substrate, a target processing line S1 for indicating the cutout portion or the cutout portion of the designed size is set at a designed position on the printed substrate; Taking the target processing line S1 as a reference, a plurality of auxiliary processing lines S2, ..., Sn are set on the opposite side of the side that becomes the product after laser processing, where n is the total number of the target processing line S1 and the auxiliary processing lines S2, ..., Sn; Among the target processing line S1 and the auxiliary processing lines S2, ..., Sn, there is a spacing distance between the mutually adjacent target processing line S1 and the auxiliary processing lines S2, ..., Sn-1, Sn, and the laser is sequentially irradiated from the auxiliary processing lines Sn, Sn-1, ..., S2 to the target processing line S1 to form a plurality of grooves with a substantially V-shaped longitudinal section, and the adjacent grooves with a substantially V-shaped longitudinal section are formed by a plurality of tapered surfaces, and the spacing distance is set to be equal to the overlapping range between the adjacent tapered surfaces; By repeatedly performing laser processing in sequence from the position of the auxiliary processing line Sn which is farthest from the target processing line S1 among the auxiliary processing lines S2, ..., Sn-1, Sn, toward the position of the target processing line S1, and finally cutting the printed substrate at the position of the target processing line S1, the cut portion or the excision portion is formed.

2. The method for forming a cutout portion or a removed portion in a printed circuit board by laser processing according to claim 1, characterized in that: A drain groove is provided on the surface of the lower plate on which the printed circuit board is placed. The drain groove is provided just below the positions of the target processing line S1 and the auxiliary processing lines S2, ..., Sn-1, Sn set on the printed circuit board.

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