A packaging module of a MEMS pressure sensor chip

Abstract

The application discloses a kind of encapsulation module of MEMS pressure sensor chip, belong to chip packaging technical field, it includes substrate, the upper surface of the substrate is overlapped with the lower surface of top cover, the middle part of the top cover is equipped with placement hole, the middle part of the inner wall of the substrate is provided with inner seat, the inner seat is provided with pressure sensor chip, the left and right sides of the upper surface of the pressure sensor chip are provided with terminal seat.The application, by setting substrate, inner seat, pressure sensor chip, terminal seat, support assembly and pad, the pad is separated from the pressure sensor chip in this scheme Plastic package, and by inserting seat, column and sleeve, the metal lead is limited and supported, so that the metal lead does not produce deformation and causes distortion after plastic package body is pressed to produce deformation, so that the metal lead does not shift, avoid the fracture of metal lead, pad and terminal due to the frequent pressure of plastic package body, it is favorable to the normal use of MEMS pressure sensor.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to a packaging module for a MEMS pressure sensor chip. Background Art

[0002] A MEMS pressure sensor is a thin-film element that deforms when subjected to pressure. This deformation can be measured using strain gauges (piezoresistive sensing) or by capacitive sensing of the change in distance between two surfaces. Both methods are popular, with tire pressure monitoring systems using the more robust piezoresistive method.

[0003] At present, micro-electromechanical pressure sensors have replaced traditional mechanical pressure sensors and are widely used due to their small size and suitability for surface mounting. In the packaging technology for MEMS pressure sensor chips, traditional pressure sensor packaging uses metal shrapnel, metal base plate, metal cover and mechanical welding process, which are not used in the application of micro-electromechanical pressure sensors, affecting the performance of MEMS pressure sensors.

[0004] In the process of packaging MEMS pressure sensor chips by plastic sealing, the overall packaging form of substrate and shell is mostly adopted, that is, the base body and MEMS pressure sensor chip are packaged as a whole by wrapping the shell. However, during use after plastic sealing, the wiring terminals cannot be effectively protected. After the plastic sealing body is under pressure, the metal leads and wiring terminals are easily twisted due to the deformation of the plastic sealing body, causing their positions to shift or deform. In this way, the metal leads and wiring terminals are easily broken due to the deformation of the plastic sealing body, causing signal transmission failure, which is not conducive to the normal use of the MEMS pressure sensor. Therefore, a packaging module for MEMS pressure sensor chips is needed to solve the above problems. Summary of the Invention

[0005] (1) Technical problems solved

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a packaging module for a MEMS pressure sensor chip, which solves the problem that in the process of packaging the MEMS pressure sensor chip by plastic sealing, a substrate and a shell are mostly used as an integral packaging form, that is, the base body and the MEMS pressure sensor chip are packaged as an integrated whole by wrapping the shell. However, during use after plastic sealing, the wiring terminals cannot be effectively protected. After the plastic sealing body is subjected to pressure, the metal leads and the wiring terminals are easily twisted due to the deformation of the plastic sealing body, causing their positions to be offset or deformed. In this way, the metal leads and the wiring terminals are easily broken due to the deformation of the plastic sealing body, resulting in signal transmission failure, which is not conducive to the normal use of the MEMS pressure sensor.

[0007] The purpose of the present invention is: when packaging the pressure sensor chip, the pressure sensor chip is placed at the bottom of the inner seat, the metal lead is passed through the socket, the column and the sleeve, the terminal on the welding pad is welded to the metal lead, and the other end of the metal lead is welded to the welding head. Then, the socket is plugged into the welding head to complete the loading of the pressure sensor chip, the top cover and the substrate are fixed by self-tapping screws, and the plastic package body is filled into the substrate and the inner seat. This scheme separates the welding pad and the pressure sensor chip into plastic packages, and the metal lead is limited and supported by the socket, the column and the sleeve, so that the metal lead will not be deformed and twisted after the plastic package body is deformed under pressure, and the metal lead will not be offset, thereby avoiding the metal lead and the welding head and terminal from being broken due to frequent pressure on the plastic package body, which is beneficial to the normal use of the MEMS pressure sensor.

[0008] Before welding the metal lead, the position of the sleeve can be adjusted by pulling the pull rod so that the bottom ends of the sleeve and the metal lead correspond to the wiring terminals on the welding pad, and then the stop block is fixed to the inner seat by the screw rod. The position of the sleeve can be adjusted by adjusting the deflection angle of the pull rod, thereby effectively achieving the purpose of limiting the sleeve and further improving the welding stability of the metal lead.

[0009] When placing the pressure sensor chip, thermal grease is filled at the bottom of the inner seat. After pressing down the pressure sensor chip, it is in contact with multiple temperature sensing contacts. Heat is transferred to the cavity through the heat conduction plate. Furthermore, the baffle effectively separates the plastic package from the thermal grease at the bottom, effectively playing a role in heat insulation and isolation. The raised glue block makes the grease less likely to be squeezed out, thereby improving the thermal conductivity. The temperature sensing contact is set to measure the pressure sensor chip in real time, and the temperature signal and pressure signal are sent to the control end synchronously, effectively compensating for the signal deviation of the MEMS pressure sensor caused by temperature changes and improving product accuracy.

[0010] (2) Technical solution

[0011] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a packaging module for a MEMS pressure sensor chip, comprising a substrate, the upper surface of the substrate overlapping the lower surface of a top cover, a placement hole being opened in the middle of the top cover, an inner seat being provided in the middle of the inner wall of the substrate, a pressure sensor chip being provided in the inner seat, wiring seats being provided on the left and right sides of the upper surface of the pressure sensor chip, two welding heads being provided in the wiring seat, a socket being plugged into the welding head, the top of the socket being fixed to one end of a column through a first bend, and the column being clamped to one side of the inner seat.

[0012] The other end of the column is fixed with one end of the sleeve through a second bending, the bottom of the sleeve is inserted on the terminal of the upper surface of the solder pad, the terminal is welded with the metal lead, the other end of the metal lead is welded with the welding head, the metal lead is sleeved in the socket, the column and the sleeve, the outer wall of the sleeve is provided with a support assembly, one side of the support assembly is overlapped on the inner seat, the lower surface of the solder pad is fixedly connected with the bottom of the inner wall of the base plate, the solder pad is located between the outer side of the inner seat and the inner side of the base plate, and the lower surface of the solder pad is provided with a plurality of pins, and the plurality of pins are clamped on the bottom of the base plate.

[0013] As a further scheme of the present application: the top cover is connected with the upper surface of the base plate through six self-tapping screws, and the bottom of the top cover is embedded in two limiting grooves respectively arranged on the left and right sides of the upper surface of the inner seat.

[0014] As a further scheme of the present application: the left and right sides of the lower surface of the top cover are fixedly connected with the pressing strips, the sides away from each other of the two pressing strips are respectively overlapped with the left and right sides of the inner wall of the base plate, and the sides close to the inner wall of the base plate of the pressing strips are designed to be inclined.

[0015] As a further scheme of the present application: the lower surface of the pressure sensor chip is overlapped with the top of a plurality of temperature sensing contacts and a plurality of glue blocking frames, the top of the temperature sensing contact is flush with the horizontal line of the glue blocking frame, and the glue blocking frame is filled with heat-conducting silicone grease.

[0016] As a further scheme of the present application: the temperature sensing contact is clamped in the heat-conducting plate and the bottom end is clamped with the bottom of the cavity, the heat-conducting plate is clamped in the bottom of the inner seat, and the cavity is arranged below the heat-conducting plate.

[0017] As a further scheme of the present application: the support assembly comprises a pull rod, the top end of the pull rod is hinged with the outer wall of the sleeve through a pin shaft, the bottom end of the pull rod is connected with a stop block, and the stop block is fixed with the right side of the inner seat through a lead screw.

[0018] As a further scheme of the present application: the left and right sides of the upper surface of the top cover are clamped with overflow ports, and the inner seat and the base plate are filled with plastic packages.

[0019] As a further scheme of the present application: the front and back surfaces of the pressure sensor chip are provided with a baffle, and the lower surface of the inner seat is embedded in the bottom of the base plate through a plurality of limiting strips.

[0020] (Three) beneficial effects

[0021] Compared with the prior art, the present application has the beneficial effects that:

[0022] 1. In the present invention, a substrate, an inner seat, a pressure sensor chip, a terminal block, a support assembly and a welding pad are provided. When the pressure sensor chip is packaged, the pressure sensor chip is placed at the bottom of the inner seat, the metal lead is passed through the socket, the column and the sleeve, the terminal on the welding pad is welded to the metal lead, and the other end of the metal lead is welded to the welding head. Then, the socket is plugged into the welding head to complete the loading of the pressure sensor chip. The top cover is fixed to the substrate by self-tapping screws, and the plastic package body is filled into the substrate and the inner seat. This scheme separates the welding pad and the pressure sensor chip from the plastic package, and the metal lead is limited and supported by the socket, the column and the sleeve, so that the metal lead will not be deformed and twisted after the plastic package body is deformed under pressure, and the metal lead will not be offset, thereby avoiding the metal lead and the welding head and terminal from breaking due to frequent pressure on the plastic package body, which is beneficial to the normal use of the MEMS pressure sensor.

[0023] 2. In the present invention, by arranging a socket, a column, a sleeve, a metal lead, a pull rod, a screw and a block, before welding the metal lead, the position of the sleeve can be adjusted by pulling the pull rod so that the bottom ends of the sleeve and the metal lead correspond to the wiring terminals on the welding pad, and then the block is fixed to the inner seat by the screw, and the position of the sleeve is adjusted by adjusting the deflection angle of the pull rod, thereby effectively achieving the purpose of limiting the sleeve and further improving the welding stability of the metal lead.

[0024] 3. In the present invention, by setting temperature sensing contacts, heat conducting plates, cavities, glue blocking frames and inner seats, when placing the pressure sensor chip, thermal grease is filled at the bottom of the inner seat, and the pressure sensor chip is pressed down to make it contact with multiple temperature sensing contacts. Heat is transferred to the cavity through the heat conducting plate. Furthermore, the blocking piece effectively separates the plastic package from the thermal grease at the bottom, effectively playing a role of heat insulation and isolation, and the raised glue blocking frame makes the grease not easily squeezed out, thereby improving the thermal conductivity effect. The setting of the temperature sensing contact measures the pressure sensor chip in real time, and sends the temperature signal and the pressure signal to the control end synchronously, effectively compensating for the signal deviation of the MEMS pressure sensor caused by temperature changes, thereby improving product accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0026] Figure 2 This is a schematic structural diagram of the three-dimensional inner seat of the present invention;

[0027] Figure 3 Schematic diagram of the three-dimensional cross-sectional structure of the substrate of the present invention;

[0028] Figure 4 It is a structural schematic diagram of the inner seat cross section of the present invention;

[0029] Figure 5 It is a structural schematic diagram of the wiring base and the support assembly of the present invention;

[0030] Figure 6 For the present invention Figure 5 A schematic diagram of the structure enlarged in the middle;

[0031] In the figure: 1. Base plate; 2. Top cover; 3. Inner seat; 4. Limiting strip; 5. Pressure sensor chip; 6. Terminal block; 7. Temperature sensor contact; 8. Heat conducting plate; 9. Cavity; 10. Glue retaining frame; 11. Welding head; 12. Connector; 13. First bend; 14. Post; 15. Second bend; 16. Sleeve; 17. Metal lead; 18. Support assembly; 181. Block; 182. Screw rod; 183. Pull rod; 19. Limiting groove; 20. Pad; 21. Pin; 22. Pressure strip; 23. Overflow port; 24. Placement hole; 25. Block. DETAILED DESCRIPTION

[0032] The technical solution of this patent is further described in detail below in conjunction with specific implementation methods.

[0033] like Figure 1-6 As shown, the present invention provides a technical solution: a packaging module for a MEMS pressure sensor chip, comprising a substrate 1, the upper surface of the substrate 1 overlaps the lower surface of the top cover 2, a placement hole 24 is opened in the middle of the top cover 2, an inner seat 3 is provided in the middle of the inner wall of the substrate 1, a pressure sensor chip 5 is provided in the inner seat 3, and a wiring seat 6 is provided on the left and right sides of the upper surface of the pressure sensor chip 5, two welding heads 11 are provided in the wiring seat 6, a socket 12 is plugged into the welding head 11, the top of the socket 12 is fixed to one end of the column 14 through a first bend 13, and the column 14 is clamped on one side of the inner seat 3.

[0034] The other end of the column 14 is fixed to one end of the sleeve 16 through the second bend 15. The bottom of the sleeve 16 is plugged into the terminal on the upper surface of the pad 20. The terminal is welded to the metal lead 17. The other end of the metal lead 17 is welded to the welding head 11. The metal lead 17 is sleeved in the socket 12, the column 14 and the sleeve 16. Through the mutual cooperation between the socket 12, the column 14 and the sleeve 16, the metal lead 17 is welded to the socket 12, the column 14 and the sleeve 16. The limiting support is provided so that the metal lead 17 will not be deformed and twisted after the plastic package body is deformed under pressure, and the metal lead 17 will not be offset. The outer wall of the sleeve 16 is provided with a support component 18, and one side of the support component 18 is overlapped on the inner seat 3. The lower surface of the soldering pad 20 is fixedly connected to the bottom of the inner wall of the substrate 1. The soldering pad 20 is located between the outer side of the inner seat 3 and the inner side of the substrate 1. A plurality of pins 21 are provided on the lower surface of the soldering pad 20, and the plurality of pins 21 are all clamped on the bottom of the substrate 1.

[0035] Specifically, such as Figure 1 、 Figure 2 and Figure 4 As shown, the top cover 2 is connected to the upper surface of the base plate 1 by six self-tapping screws, and the bottom of the top cover 2 is embedded in two limit grooves 19. By setting the limit grooves 19, the stability of the inner seat 3 is improved when loading, and it is not easy to shake. The two limit grooves 19 are respectively opened on the left and right sides of the upper surface of the inner seat 3, and the left and right sides of the lower surface of the top cover 2 are fixedly connected with pressure strips 22. The sides of the two pressure strips 22 away from each other are overlapped with the left and right side surfaces of the inner wall of the base plate 1 respectively, and the side of the pressure strip 22 close to the inner wall of the base plate 1 is inclined. Through the inclined pressure strip 22, when the top cover 2 moves downward, the two pressure strips 22 effectively support the inner sides of the base plate 1, so that the top cover 2 is not easy to shake. , to improve the loading stability of the top cover 2, the lower surface of the pressure sensor chip 5 is overlapped with the top of several temperature sensing contacts 7 and several glue blocking frames 10, the temperature sensing contacts 7 are level with the top horizontal line of the glue blocking frames 10, and the glue blocking frames 10 are filled with thermal grease, the temperature sensing contacts 7 are clamped in the heat conducting plate 8 and the bottom end is clamped with the bottom of the cavity 9. By setting the temperature sensing contacts 7, the setting of the temperature sensing contacts 7 measures the pressure sensor chip 5 in real time, and sends the temperature signal and the pressure signal to the control end synchronously, effectively compensating for the signal deviation of the MEMS pressure sensor caused by temperature changes, the heat conducting plate 8 is clamped at the inner bottom of the inner seat 3, and the cavity 9 is set below the heat conducting plate 8.

[0036] Specifically, such as Figure 3 、 Figure 5 and Figure 6 As shown, the support assembly 18 includes a pull rod 183. By setting the support assembly 18, the position of the sleeve 16 is adjusted by pulling the pull rod 183, so that the bottom ends of the sleeve 16 and the metal lead 17 correspond to the terminal on the welding pad 20, and then the stopper 181 is fixed to the inner seat 3 by the screw rod 182. The position of the sleeve 16 is adjusted by adjusting the deflection angle of the pull rod 183, which effectively achieves the purpose of limiting the sleeve 16 and further improves the welding stability of the metal lead 17. The top end of the pull rod 183 is hinged to the outer wall of the sleeve 16 through a pin shaft, and the bottom end of the pull rod 183 is connected to the stopper 181. 181 is fixed to the right side of the inner seat 3 through a screw rod 182, and overflow ports 23 are clamped on the left and right sides of the upper surface of the top cover 2. The setting of the overflow port 23 prevents the liquid plastic sealant from overflowing from the base after being pressurized. The inner seat 3 and the space between the inner seat 3 and the substrate 1 are filled with a plastic sealant. The front and back sides of the pressure sensor chip 5 are provided with baffles 25. The baffles 25 effectively separate the plastic sealant from the bottom thermal grease, effectively playing a role of heat insulation and isolation, and the raised glue blocking frame 10 makes it difficult for the silicone grease to be squeezed out, thereby improving the thermal conductivity effect. The lower surface of the inner seat 3 is embedded in the bottom of the substrate 1 through a number of limit strips 4.

[0037] The working principle of the present application is:

[0038] In the process of placing the pressure sensor chip 5, the inner seat 3 is filled with heat-conducting silicone grease at the bottom, and the pressure sensor chip 5 is contacted with the plurality of temperature sensing contacts 7 after being pressed down. The metal lead 17 is inserted through the plug-in seat 12, the column 14 and the sleeve 16. Before welding the metal lead 17, the position of the sleeve 16 can be adjusted by pulling the pull rod 183, so that the bottom end of the sleeve 16 and the metal lead 17 corresponds to the wiring terminal on the solder pad 20. Then the stop block 181 is fixed on the inner seat 3 by the lead screw 182, and the position of the sleeve 16 is adjusted by adjusting the deflection angle of the pull rod 183. The wiring terminal on the solder pad 20 is welded with the metal lead 17, and the other end of the metal lead 17 is welded with the welding head 11. Then the plug-in seat 12 is inserted into the welding head 11, and the loading work of the pressure sensor chip 5 is completed. The top cover 2 is fixed with the base plate 1 by self-tapping screws, and the plastic package is filled into the base plate 1 and the inner seat 3.

[0039] In summary:

[0040] By setting the base plate 1, the inner seat 3, the pressure sensor chip 5, the wiring seat 6, the support assembly 18 and the solder pad 20, when the pressure sensor chip 5 is packaged, the pressure sensor chip 5 is placed at the bottom of the inner seat 3, the metal lead 17 is inserted through the plug-in seat 12, the column 14 and the sleeve 16, the wiring terminal on the solder pad 20 is welded with the metal lead 17, and the other end of the metal lead 17 is welded with the welding head 11. Then the plug-in seat 12 is inserted into the welding head 11, and the loading work of the pressure sensor chip 5 is completed. The top cover 2 is fixed with the base plate 1 by self-tapping screws, and the plastic package is filled into the base plate 1 and the inner seat 3. This scheme separates the solder pad 20 and the pressure sensor chip 5 for plastic packaging, and limits and supports the metal lead 17 through the plug-in seat 12, the column 14 and the sleeve 16, so that the metal lead 17 does not deform and twist when the plastic package deforms under pressure, the metal lead 17 does not shift, and the metal lead 17 and the welding head 11 and the wiring terminal are not broken due to frequent pressure on the plastic package. It is beneficial to the normal use of the MEMS pressure sensor.

[0041] By setting the plug-in seat 12, the column 14, the sleeve 16, the metal lead 17, the pull rod 183, the lead screw 182 and the stop block 181, before welding the metal lead 17, the position of the sleeve 16 can be adjusted by pulling the pull rod 183, so that the bottom end of the sleeve 16 and the metal lead 17 corresponds to the wiring terminal on the solder pad 20. Then the stop block 181 is fixed on the inner seat 3 by the lead screw 182, and the position of the sleeve 16 is adjusted by adjusting the deflection angle of the pull rod 183. The purpose of limiting the sleeve 16 is effectively achieved, and the welding stability of the metal lead 17 is further improved.

[0042] By setting the temperature sensing contact 7, the heat conducting plate 8, the cavity 9, the glue blocking frame 10 and the inner seat 3, when placing the pressure sensor chip 5, the bottom of the inner seat 3 is filled with thermal grease, and the pressure sensor chip 5 is pressed down to make it contact with multiple temperature sensing contacts 7. The heat is transferred to the cavity 9 through the heat conducting plate 8. Furthermore, the blocking piece 25 effectively separates the plastic package from the bottom thermal grease, effectively playing a role of heat insulation and isolation, and the raised glue blocking frame 10 makes the grease not easily squeezed out, thereby improving the thermal conductivity effect. The setting of the temperature sensing contact 7 measures the pressure sensor chip 5 in real time, and sends the temperature signal and the pressure signal to the control end synchronously, effectively compensating for the signal deviation of the MEMS pressure sensor caused by temperature changes, thereby improving product accuracy.

[0043] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0044] The above describes in detail the preferred embodiments of this patent, but this patent is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in this field without departing from the purpose of this patent.

Claims

1. A packaging module for a MEMS pressure sensor chip, comprising a substrate (1), characterized in that: The upper surface of the substrate (1) is overlapped with the lower surface of the top cover (2), and a placement hole (24) is opened in the middle of the top cover (2). An inner seat (3) is provided in the middle of the inner wall of the substrate (1), and a pressure sensor chip (5) is provided in the inner seat (3). A wiring seat (6) is provided on both the left and right sides of the upper surface of the pressure sensor chip (5), and two welding heads (11) are provided in the wiring seat (6). A socket (12) is plugged into the welding head (11), and the top of the socket (12) is fixed to one end of the column (14) through a first bend (13), and the column (14) is clamped on one side of the inner seat (3); The other end of the column (14) is fixed to one end of the sleeve (16) through the second bend (15), the bottom of the sleeve (16) is plugged into the terminal on the upper surface of the pad (20), the terminal is welded to the metal lead (17), the other end of the metal lead (17) is welded to the welding head (11), the metal lead (17) is sleeved in the socket (12), the column (14) and the sleeve (16), the outer wall of the sleeve (16) is provided with a support assembly (18), one side of the support assembly (18) is overlapped on the inner seat (3), the pad (20 ) is fixedly connected to the bottom of the inner wall of the substrate (1), the soldering pad (20) is located between the outer side of the inner seat (3) and the inner side of the substrate (1), the lower surface of the soldering pad (20) is provided with a plurality of pins (21), and the plurality of pins (21) are all clamped on the bottom of the substrate (1), the support assembly (18) includes a pull rod (183), the top end of the pull rod (183) is hinged to the outer wall of the sleeve (16) through a pin shaft, the bottom end of the pull rod (183) is connected to a stopper (181), and the stopper (181) is fixed to the right side of the inner seat (3) through a screw rod (182).

2. The packaging module of a MEMS pressure sensor chip according to claim 1, characterized in that: The top cover (2) is connected to the upper surface of the base plate (1) by six self-tapping screws. The bottom of the top cover (2) is embedded in two limiting grooves (19). The two limiting grooves (19) are respectively opened on the left and right sides of the upper surface of the inner seat (3).

3. The packaging module of a MEMS pressure sensor chip according to claim 1, characterized in that: The left and right sides of the lower surface of the top cover (2) are fixedly connected with pressure strips (22), and the sides of the two pressure strips (22) that are away from each other are overlapped with the left and right side surfaces of the inner wall of the base plate (1), and the side of the pressure strip (22) close to the inner wall of the base plate (1) is inclined.

4. The packaging module of a MEMS pressure sensor chip according to claim 1, characterized in that: The lower surface of the pressure sensor chip (5) overlaps with the tops of a plurality of temperature sensing contacts (7) and a plurality of adhesive retaining frames (10), the temperature sensing contacts (7) are aligned with the top horizontal lines of the adhesive retaining frames (10), and the adhesive retaining frames (10) are filled with thermal conductive silicone grease.

5. The packaging module of a MEMS pressure sensor chip according to claim 4, characterized in that: The temperature sensing contact (7) is clamped in the heat conducting plate (8) and the bottom end is clamped with the bottom of the cavity (9). The heat conducting plate (8) is clamped to the bottom of the inner seat (3). The cavity (9) is arranged below the heat conducting plate (8).

6. The packaging module of a MEMS pressure sensor chip according to claim 1, characterized in that: Overflow ports (23) are clamped on both left and right sides of the upper surface of the top cover (2), and a plastic sealing body is filled inside the inner seat (3) and between the inner seat (3) and the base plate (1).

7. The packaging module of a MEMS pressure sensor chip according to claim 1, characterized in that: Blocking pieces (25) are provided on the front and back sides of the pressure sensor chip (5), and the lower surface of the inner seat (3) is embedded in the inner bottom of the substrate (1) via a plurality of limiting bars (4).

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