Image recognition-based multi-slice diamond substrate detection device and detection method

Abstract

The application discloses a multi-piece diamond substrate detection device and method based on image recognition. A substrate containing cavity is used to place a substrate with multiple diamond pieces attached. A first camera and a second camera are respectively located directly above and below the substrate containing cavity. The first camera photographs the substrate to determine the position that needs to be measured in thickness. The second camera photographs the substrate to identify defects and bubbles in the substrate. A first laser displacement sensor and a second laser displacement sensor are both installed on a displacement transmission mechanism and are respectively located above and below the substrate containing cavity. The displacement transmission mechanism can drive the first laser displacement sensor and the second laser displacement sensor to move synchronously to position and measure the substrate in the substrate containing cavity, and then obtain the thickness information of the multiple diamond pieces. The device is easy to operate, realizes automatic detection of the multiple diamond substrate after the pieces are attached, has high precision and repeatability, and greatly reduces the labor cost and learning cost.

Description

TECHNICAL FIELD

[0001] The present application relates to a multi-piece diamond substrate detection device and detection method based on image recognition. BACKGROUND

[0002] Diamond has very high hardness, good chemical stability, high thermal conductivity, high elastic modulus, large resistance, wide band gap, wide light transmission waveband and very low friction coefficient, and is considered as the most promising engineering material in the 21st century due to its superior physical and chemical, optical and thermal properties. It has wide application prospects in high-tech fields. For example, it is used as a high-power optical lens for megawatt cyclotron oscillation tube in a nuclear fusion reactor, an X-ray optical assembly, a high-power density heat sink, a Raman laser optical lens, a component made of diamond material for scientific research under high pressure conditions, an optoelectronic device on a quantum computer, an optoelectronic device on a quantum computer, a two-pole diamond electronic device, etc.

[0003] In order to improve the processing efficiency of diamond pieces, multiple diamond pieces are used for simultaneous processing. However, if the quality of the diamond piece substrate to be processed is poor, such as the thickness of the diamond piece being too large, it will affect the processing effect, and even the processing may not be possible. If the position of the diamond piece is not accurate, it will cause the quality of the processed diamond piece to be too large, which will increase the processing cost and time cost. If there are defects or bubbles in the bonding of the diamond piece and the substrate, it will cause fragmentation, flying pieces, and even damage to the machine. Therefore, poor quality of the diamond substrate will affect its application in high-tech fields, and therefore, achieving ultra-precision processing of diamond is the key to improving the application of diamond.

[0004] However, the existing multi-piece diamond substrate detection equipment has the following problems:

[0005] 1. The detection of multiple diamond pieces is complex and time-consuming.

[0006] 2. The height difference between the diamond pieces is too large, resulting in waste during processing.

[0007] 3. Manual detection has a large error.

[0008] 4. The repeatability of traditional detection is poor.

[0009] 5. It is difficult to measure the position accuracy of multiple diamond pieces.

[0010] 6. In the firmness detection of the diamond substrate piece, the relevant technical personnel need certain processing experience. SUMMARY

[0011] The application provides a multi-piece diamond substrate detection device and method based on image recognition, which overcomes the shortcomings of the prior art. One of the technical solutions adopted by the application to solve the technical problems is:

[0012] The multi-piece diamond substrate detection device based on image recognition is characterized in that it comprises:

[0013] The substrate fixing mechanism comprises a substrate fixing frame provided with a substrate accommodating cavity penetrating through the substrate fixing frame from top to bottom, and the substrate accommodating cavity is used for placing a substrate with multiple diamond pieces attached thereto.

[0014] The image detection mechanism comprises a first camera and a second camera, and the first camera and the second camera are respectively located directly above and below the substrate accommodating cavity. The first camera is used for photographing the substrate to determine the position requiring thickness measurement, and the second camera is used for photographing the substrate to identify defects and bubbles of the substrate.

[0015] The thickness detection mechanism comprises a displacement transmission mechanism, a first laser displacement sensor and a second laser displacement sensor. The first laser displacement sensor and the second laser displacement sensor are both mounted on the displacement transmission mechanism and are respectively located above and below the substrate accommodating cavity. The displacement transmission mechanism can drive the first laser displacement sensor and the second laser displacement sensor to move synchronously, so as to position and measure the substrate in the substrate accommodating cavity, and then obtain the thickness information of the multiple diamond pieces.

[0016] In a preferred embodiment, the cavity wall of the substrate accommodating cavity is provided with a stepped surface, and the substrate is placed around the stepped surface.

[0017] In a preferred embodiment, the substrate fixing mechanism further comprises an adjusting plate, which is placed around the stepped surface, and the adjusting plate is provided with a substrate accommodating sub-cavity penetrating through the adjusting plate from top to bottom.

[0018] In a preferred embodiment, the image detection mechanism further comprises a ring-shaped lamp, which is located above the substrate accommodating cavity and is arranged concentrically with the substrate accommodating cavity, and the light-emitting surface of the ring-shaped lamp faces the substrate accommodating cavity.

[0019] In a preferred embodiment, the image detection mechanism further comprises a camera support rod, a first horizontal frame and a second horizontal frame. The first horizontal frame and the second horizontal frame are both fixedly connected to the camera support rod and are arranged in an upper and lower spaced manner. The first camera and the second camera are respectively fixedly connected to the first horizontal frame and the second horizontal frame.

[0020] In a preferred embodiment, the displacement transmission mechanism comprises a first guide rail, a first guide rail frame, a first drive motor, a second guide rail, a second guide rail frame and a second drive motor, the first guide rail extends in the front-rear direction, the first guide rail frame is slidingly connected to the first guide rail and is drivingly connected to the first drive motor, the second guide rail is fixedly connected to the first guide rail frame and extends in the left-right direction, the second guide rail frame is slidingly connected to the second guide rail and is drivingly connected to the second drive motor, and the first and second laser displacement sensors are both mounted on the second guide rail frame.

[0021] In a preferred embodiment, the substrate loading and unloading mechanism comprises a rotary electric cylinder, a swing arm, an ejection cylinder, an ejection seat, an annular rubber pad and a quick connection valve through which negative pressure can be introduced, the swing arm is connected to the rotary electric cylinder and can rotate horizontally, the ejection cylinder is mounted on the swing arm, the ejection seat is connected to the ejection cylinder and can move up and down and extend upward into the substrate accommodating cavity, the annular rubber pad is fixedly connected to the ejection seat and a negative pressure cavity is formed therebetween, and the quick connection valve is mounted on the ejection seat and communicates with the negative pressure cavity.

[0022] In a preferred embodiment, the display screen is connected to the image detection mechanism and the thickness detection mechanism.

[0023] The second technical solution adopted by the present application to solve the technical problem is:

[0024] The detection method of the multi-piece diamond substrate detection device based on image recognition, which applies the multi-piece diamond substrate detection device based on image recognition, comprises:

[0025] Step 10, place the substrate with multiple diamond pieces attached in the substrate accommodating cavity;

[0026] Step 20, the first camera takes a picture of the substrate, calculates the positions where the thickness needs to be measured, and the second camera takes a picture of the substrate, calculates and draws the positions of defects and bubbles of the substrate through processing;

[0027] Step 30, the displacement transmission mechanism drives the first and second laser displacement sensors to move to the corresponding positions according to the calculated thickness measurement positions, so as to position and measure the substrate, and then obtain the thickness information of the multiple diamond pieces;

[0028] Step 40, analyze the positions, defects, bubbles and thickness of the diamond pieces on the substrate as a whole, and judge the qualification of the substrate;

[0029] Step 50, take out the substrate from the substrate accommodating cavity for the next action.

[0030] In a preferred embodiment, the detection device further comprises a substrate loading and unloading mechanism, which comprises a rotary electric cylinder, a swing arm, an ejector cylinder, an ejector seat, an annular rubber pad and a quick connection valve through which negative pressure can be introduced, the swing arm is connected to the rotary electric cylinder and can rotate horizontally, the ejector cylinder is installed on the swing arm, the ejector seat is connected to the ejector cylinder and can move up and down and can extend upward into the substrate containing cavity, the annular rubber pad is fixed to the ejector seat and a negative pressure cavity is formed therebetween, and the quick connection valve is installed on the ejector seat and communicates with the negative pressure cavity;

[0031] In step 10, the substrate is placed on the annular rubber pad by the mechanical arm, and negative pressure is introduced into the negative pressure cavity through the quick connection valve to firmly adsorb the substrate on the annular rubber pad; then the ejector seat is driven by the ejector cylinder to move downward along the substrate containing cavity, and when the substrate is about to contact the inner wall of the substrate containing cavity, the negative pressure supply is stopped, at which time the substrate is stably placed in the substrate containing cavity.

[0032] Compared with the background art, the technical scheme has the following advantages:

[0033] 1. The device designed by the present application is simple and easy to operate, can solve the automatic detection of multiple diamond substrate patches, has high precision and repeatability, can greatly reduce the labor cost and learning cost, and has high use value in the preparation stage of semiconductor ultra-precision machining.

[0034] 2. The substrate is placed around the step surface, and the step surface supports the four sides of the substrate to prevent the substrate from falling out of the substrate containing cavity.

[0035] 3. The adjusting plate can be placed around the step surface, and the adjusting plate is provided with a substrate containing sub-cavity penetrating upward and downward, in order to detect substrates of different sizes, the adjusting plate is provided to adapt to smaller substrates and has stronger universality.

[0036] 4. The annular lamp is located above the substrate containing cavity and is arranged concentrically with the substrate containing cavity, and the light emitting surface of the annular lamp faces the substrate containing cavity, during the detection process, the annular lamp can uniformly light the diamond surface to highlight the defects and bubbles of the substrate.

[0037] 5. The displacement transmission mechanism comprises a first guide rail, a first guide rail frame, a first drive motor, a second guide rail, a second guide rail frame and a second drive motor, so that the first laser displacement sensor and the second laser displacement sensor can move freely in the horizontal plane, and the positioning is more accurate.

[0038] 6. The design of the substrate loading and unloading mechanism can be adapted to the mechanical arm, so that the substrate is placed more accurately and is not prone to misplacement.

[0039] 7. The display screen is arranged to display the information of the defect and bubble position of the substrate, and whether the substrate is qualified or not, so as to facilitate the timely checking of the state of the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0040] The application will be further described below in conjunction with the drawings and embodiments.

[0041] Figure 1 Fig. 1 shows a perspective view of a multi-piece diamond substrate detection device based on image recognition according to a preferred embodiment.

[0042] Figure 2 Fig. 2 shows a front view of a multi-piece diamond substrate detection device based on image recognition according to a preferred embodiment.

[0043] Figure 3 Fig. 3 shows another perspective view of a multi-piece diamond substrate detection device based on image recognition according to a preferred embodiment.

[0044] Figure 4 Fig. 4 shows a third perspective view of a multi-piece diamond substrate detection device based on image recognition according to a preferred embodiment.

[0045] Figure 5 Fig. 5 shows a fourth perspective view of a multi-piece diamond substrate detection device based on image recognition according to a preferred embodiment.

[0046] Figure 6 Fig. 6 shows a perspective view of a substrate loading and unloading mechanism according to a preferred embodiment.

[0047] Figure 7 Fig. 7 shows an assembly view of an adjusting plate and a substrate accommodating cavity according to a preferred embodiment. DETAILED DESCRIPTION

[0048] In the claims, specification, and above drawings of the present application, unless otherwise expressly specified, all of the terms used herein are to be interpreted in their broadest reasonable manner.

[0049] In the claims, specification, and above drawings of the present application, unless otherwise expressly specified, all of the terms used herein are to be interpreted in their broadest reasonable manner.

[0050] In the claims, the specification, and the drawings of the present application, terms such as "fixedly connected", "connected" are to be construed in a broad sense, meaning any connection or attachment, either direct or indirect, between or among two or more elements, wherein the elements have any connection whatsoever.

[0051] In the claims, the specification, and the drawings of the present application, terms such as "including" and "having" are intended to be broad and encompass the terms "consisting of" and "consisting essentially of".

[0052] Please refer to Figures 1 to 7 A preferred embodiment of the image recognition-based multi-diamond wafer detection device includes a wafer fixing mechanism 100, an image detection mechanism 200, and a thickness detection mechanism 300.

[0053] In order to be more integrated, a frame 10 can be provided, and the wafer fixing mechanism 100, the image detection mechanism 200, and the thickness detection mechanism 300 are all concentrated in the frame 10. As shown in Figure 5 The frame 10 is a square body with an open top end.

[0054] The wafer fixing mechanism 100 includes a wafer fixing frame provided with a wafer accommodating cavity 110 that penetrates from top to bottom and is used to place a wafer 20 on which a plurality of diamond pieces are attached. Specifically, the wafer fixing frame includes two fixing legs 120 and a fixing plate 130, the two ends of the fixing plate 130 are fixedly connected with the two fixing legs 120, and the wafer accommodating cavity 110 is opened on the fixing plate 130.

[0055] In this embodiment, as shown in Figure 7 The cavity wall of the wafer accommodating cavity 110 is provided with a stepped surface 111, and the wafer 20 is placed around the stepped surface 111. At this time, the wafer accommodating cavity 110 can adapt to a 4-inch wafer.

[0056] In this embodiment, the wafer fixing mechanism 100 further includes an adjusting plate 140, which can be placed around the stepped surface 111, and the adjusting plate 140 is provided with a wafer accommodating sub-cavity 141 that penetrates from top to bottom. The structure of the wafer accommodating sub-cavity 141 is the same as that of the wafer accommodating cavity 110, and thus the wafer accommodating sub-cavity 141 can adapt to a 2-inch wafer.

[0057] In order to facilitate the taking out of the substrate 20, the first and second accommodating cavities 110 and 141 are respectively provided with first and second recesses 112 and 142 for facilitating the hand insertion. When the substrate needs to be placed or taken out by hand, the first and second recesses 112 and 142 can greatly facilitate the placing or taking out of the substrate.

[0058] The image detecting mechanism 200 includes a first camera 210 and a second camera 220, which are respectively located above and below the substrate accommodating cavity 110, i.e., the first and second cameras 210 and 220 are oppositely arranged, and the lenses of the two cameras are both directed towards the substrate accommodating cavity 110. The first camera 210 is used to take pictures of the substrate 20 to determine the positions where the thickness needs to be measured, and the second camera 220 is used to take pictures of the substrate 20 to identify the defects and bubbles of the substrate 20.

[0059] Specifically, as shown in Figure 2 and Figure 3 The image detecting mechanism 200 further includes a camera support rod 230, a first horizontal frame 240 and a second horizontal frame 250, the first and second horizontal frames 240 and 250 are both fixedly connected to the camera support rod 230 and oppositely arranged, and the first and second cameras 210 and 220 are respectively fixedly connected to the first and second horizontal frames 240 and 250.

[0060] In this embodiment, the image detecting mechanism 200 further includes a ring-shaped lamp 260, which is located above the substrate accommodating cavity 110 and concentrically arranged with the substrate accommodating cavity 110, and the light emitting surface of the ring-shaped lamp 260 is directed towards the substrate accommodating cavity 110. As shown in Figure 3 The first horizontal frame 240 is provided with a lamp holder 241 at the lower end thereof, and the ring-shaped lamp 260 is fixedly connected to the lamp holder 241, and the lens of the first camera 210 is opposite to the center of the ring-shaped lamp 260.

[0061] The thickness detecting mechanism 300 includes a displacement transmission mechanism, a first laser displacement sensor 310 and a second laser displacement sensor 320, which are both mounted on the displacement transmission mechanism and respectively located above and below the substrate accommodating cavity 110. The displacement transmission mechanism can drive the first and second laser displacement sensors 310 and 320 to move synchronously to measure the position of the substrate 20 in the substrate accommodating cavity 110, and thus obtain the thickness information of the plurality of diamond pieces.

[0062] In the embodiment, the displacement transmission mechanism comprises a first guide rail 330, a first guide rail frame 340, a first driving motor 350, a second guide rail 360, a second guide rail frame 370 and a second driving motor 380, the first guide rail 330 extends in the forward-backward direction, the first guide rail frame 340 is slidingly connected to the first guide rail 330 and is drivingly connected with the first driving motor 350, the second guide rail 360 is fixedly connected to the first guide rail frame 340 and extends in the left-right direction, the second guide rail frame 370 is slidingly connected to the second guide rail 360 and is drivingly connected with the second driving motor 380, and the first laser displacement sensor 310 and the second laser displacement sensor 320 are both mounted on the second guide rail frame 370.

[0063] Specifically, as shown in the figure, Figure 4 the first driving motor 350 is drivingly connected with the first guide rail frame 340 through a first screw rod 351, and the second driving motor 380 is drivingly connected with the second guide rail frame 370 through a second screw rod 381. As shown in the figure, Figure 3 the second guide rail frame 370 comprises a second guide rail base 371, two second guide rail rods 372, a third cross frame 373 and a fourth cross frame 374, the two second guide rail rods 372 are both fixedly connected to the second guide rail base 371 and are arranged at intervals, the third cross frame 373 and the fourth cross frame 374 are both fixedly sleeved on the two second guide rail rods 372 and are arranged at intervals in the up-down direction, and the first laser displacement sensor 310 and the second laser displacement sensor 320 are respectively fixedly connected to the third cross frame 373 and the fourth cross frame 374.

[0064] In the embodiment, as shown in the figure, Figure 6 the detection device further comprises a substrate loading and unloading mechanism 400, the substrate loading and unloading mechanism 400 comprises a rotary electric cylinder 410, a swing arm 420, an ejection air cylinder 430, an ejection seat 440, an annular rubber pad 450 and a quick connection valve 460 through which negative pressure can be introduced, the swing arm 420 is connected to the rotary electric cylinder 410 and can rotate horizontally, the ejection air cylinder 430 is mounted on the swing arm 420, the ejection seat 440 is connected to the ejection air cylinder 430, the ejection seat 440 can move up and down and can extend upward into the substrate containing cavity 110, the annular rubber pad 450 is fixedly connected to the ejection seat 440 and a negative pressure cavity is formed therebetween, and the quick connection valve 460 is mounted on the ejection seat 440 and is in communication with the negative pressure cavity.

[0065] In the embodiment, a display screen 500 is further included, which is connected with the image detection mechanism 200 and the thickness detection mechanism 300. As shown in the figure, Figure 5 the display screen 500 is mounted on the outside of the frame 10.

[0066] The detection method of the multi-piece diamond substrate detection device based on image recognition comprises:

[0067] Step 10, place the substrate 20 with multiple diamond pieces attached to the substrate 20 into the substrate accommodating cavity 110;

[0068] In this embodiment, in step 10, the substrate is placed on the annular rubber pad 450 by the mechanical arm, and the negative pressure cavity is connected to the negative pressure by the quick connection valve 460 to firmly adsorb the substrate 20 on the annular rubber pad 450; then the ejector seat 440 is driven by the ejector cylinder 430 to move downward along the substrate accommodating cavity 110, and when the substrate 20 is about to contact the inner wall of the substrate accommodating cavity 110, the negative pressure is stopped, at this time the substrate 20 is stably placed in the substrate accommodating cavity 110. The size of the negative pressure connected by the quick connection valve 460 is between-0.05 and-0.5 Mpa, which can ensure the installation of the substrate 20 and prevent the fragments.

[0069] According to the needs, the substrate 20 can also be placed in the substrate accommodating cavity 110 directly by hand, which is not limited.

[0070] Step 20, the first camera 210 takes a picture of the substrate 20, calculates the position where the thickness needs to be measured by processing, and the second camera 220 takes a picture of the substrate 20, calculates and draws the position of the defects and bubbles of the substrate 20 by processing;

[0071] Specifically, the surface of the diamond piece is uniformly illuminated by the annular lamp 260, the image is photographed by the first camera 210, the outer periphery of the substrate 20 is identified by processing the photographed image, the feature points are drawn, the corner points and the center of the diamond piece are identified, the distance between the center of the diamond piece and the outer periphery of the substrate is calculated and marked by conversion, and then the specific position of the required thickness measurement is calculated according to the identified corner points and center.

[0072] The defects and bubbles of the diamond piece are highlighted by the lighting of the annular lamp 260, the second camera 220 takes a picture, and the size of the defects and bubbles at the bottom of the diamond piece is calculated after processing the picture.

[0073] Step 30, the displacement transmission mechanism drives the first laser displacement sensor 310 and the second laser displacement sensor 320 to move to the corresponding position according to the calculated thickness measurement position, to position and measure the substrate 20, and then obtain the thickness information of the multiple diamond pieces;

[0074] Step 40, analyze the position, defects, bubbles and thickness of the diamond pieces on the substrate 20 as a whole, and judge the qualification of the substrate 20;

[0075] Step 50, take out the substrate 20 from the substrate accommodating cavity 110 for the next action.

[0076] When judged as qualified, the diamond substrate will be marked as qualified and displayed on the display screen 500; when judged as unqualified, the substrate 20 will be marked as unqualified and displayed on the display screen 500.

[0077] The device designed by the application is simple and convenient to operate, can help us solve the automatic detection of multiple diamond substrates 20 after patching, has high precision and repeatability, can greatly reduce the labor cost and learning cost, and has high use value in the preparation stage of semiconductor ultra-precision machining.

[0078] The above is only a preferred embodiment of the application, and therefore cannot limit the scope of the application. Equivalent changes and modifications made in accordance with the scope and content of the application should still be within the scope of the application.

Claims

1. A multi-slice diamond substrate inspection apparatus based on image recognition, characterized by: It comprises: a substrate fixing mechanism comprising a substrate fixing frame provided with a substrate accommodating cavity penetrating up and down, which is used for placing a substrate with multiple diamond sheets attached thereto; an image detection mechanism comprising a first camera and a second camera, which are respectively located directly above and below the substrate accommodating cavity, the first camera is used for shooting the substrate to determine the positions requiring thickness measurement, and the second camera is used for shooting the substrate to identify defects and bubbles of the substrate; a thickness detection mechanism comprising a displacement transmission mechanism, a first laser displacement sensor and a second laser displacement sensor, the first laser displacement sensor and the second laser displacement sensor are both mounted on the displacement transmission mechanism and are respectively located above and below the substrate accommodating cavity, the displacement transmission mechanism can drive the first laser displacement sensor and the second laser displacement sensor to move synchronously to measure the position of the substrate in the substrate accommodating cavity, thereby obtaining the thickness information of the multiple diamond sheets; the cavity wall of the substrate accommodating cavity is provided with a step surface, and the substrate is placed around the step surface; the substrate fixing mechanism further comprises an adjusting plate, which can be placed around the step surface, and the adjusting plate is provided with a substrate accommodating sub-cavity penetrating up and down; further comprising a substrate loading and unloading mechanism, which comprises a rotary electric cylinder, a swing arm, an ejection cylinder, an ejection seat, an annular rubber pad and a quick connection valve through which negative pressure can be introduced, the swing arm is connected to the rotary electric cylinder and can rotate horizontally, the ejection cylinder is mounted on the swing arm, the ejection seat is connected to the ejection cylinder, the ejection seat can move up and down and can extend into the substrate accommodating cavity, the annular rubber pad is fixed to the ejection seat and a negative pressure cavity is formed therebetween, and the quick connection valve is mounted on the ejection seat and communicates with the negative pressure cavity.

2. The image recognition based multi-sawn diamond substrate detection apparatus of claim 1, wherein: The image detection mechanism further comprises a ring-shaped lamp, which is located above the substrate accommodating cavity and is arranged concentrically with the substrate accommodating cavity, and the light emitting surface of the ring-shaped lamp faces the substrate accommodating cavity.

3. The image recognition based multi-sawn diamond substrate detection apparatus of claim 2, wherein: The image detection mechanism further comprises a camera support rod, a first crossbar and a second crossbar, the first crossbar and the second crossbar are both fixed to the camera support rod and are arranged vertically, and the first camera and the second camera are respectively fixed to the first crossbar and the second crossbar.

4. The image recognition based multi-sawn diamond substrate detection apparatus of claim 1, wherein: The displacement transmission mechanism comprises a first guide rail, a first guide rail frame, a first drive motor, a second guide rail, a second guide rail frame and a second drive motor, the first guide rail extends in the forward and backward direction, the first guide rail frame is slidingly connected to the first guide rail and is in transmission connection with the first drive motor, the second guide rail is fixed to the first guide rail frame and extends in the left and right direction, the second guide rail frame is slidingly connected to the second guide rail and is in transmission connection with the second drive motor, and the first laser displacement sensor and the second laser displacement sensor are both mounted on the second guide rail frame.

5. The image recognition based multi-slab diamond substrate detection apparatus of claim 1, wherein: Further comprising a display screen connected to the image detection mechanism and the thickness detection mechanism.

6. A detection method of the image recognition-based multi-piece diamond substrate detection apparatus, which applies the image recognition-based multi-piece diamond substrate detection apparatus according to any one of claims 1 to 5, characterized by, It comprises: Step 10, placing the substrate with multiple diamond sheets attached thereto in the substrate accommodating cavity; Step 20, the first camera takes a picture of the substrate, and the position where the thickness needs to be measured is calculated by processing; the second camera takes a picture of the substrate, and the position of the defects and bubbles of the substrate is calculated and drawn by processing; Step 30, the displacement transmission mechanism drives the first laser displacement sensor and the second laser displacement sensor to move to the corresponding positions according to the calculated thickness measurement positions, so as to positionally measure the substrate and further obtain the thickness information of the multiple diamond pieces; Step 40, the positions, defects, bubbles and thickness of the diamond pieces on the substrate are analyzed as a whole, and the qualification of the substrate is judged; Step 50, the substrate is taken out from the substrate accommodating cavity for the next action.

7. The detection method of the image recognition-based multi-sawn diamond substrate detection apparatus according to claim 6, characterized in that: The detection device further comprises a substrate loading and unloading mechanism, which comprises a rotary electric cylinder, a swing arm, an ejection cylinder, an ejection seat, an annular rubber pad and a quick connection valve through which negative pressure can be introduced, the swing arm is connected to the rotary electric cylinder and can rotate horizontally, the ejection cylinder is installed on the swing arm, the ejection seat is connected to the ejection cylinder, the ejection seat can move up and down and can extend into the substrate accommodating cavity upward, the annular rubber pad is fixed to the ejection seat and a negative pressure cavity is formed therebetween, and the quick connection valve is installed on the ejection seat and communicates with the negative pressure cavity; In step 10, the substrate is placed on the annular rubber pad by the mechanical arm, and negative pressure is introduced into the negative pressure cavity through the quick connection valve to firmly adsorb the substrate on the annular rubber pad; then the ejection seat is driven by the ejection cylinder to move downward along the substrate accommodating cavity, and when the substrate is about to contact the inner wall of the substrate accommodating cavity, the supply of negative pressure is stopped, at this time the substrate is stably placed in the substrate accommodating cavity.

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