PCB Copper Stacking Processing Method, Electronic Device, and Computer-Readable Storage Medium

Abstract

The present invention discloses a PCB copper cladding processing method, an electronic device, and a computer-readable storage medium applied to a CAM software, including: adding corresponding transition layers to each inner layer with blind vias that do not contact the copper skin; copying the pads and blind vias that do not contact the copper skin on each inner layer to the corresponding transition layers; increasing the aperture of all blind vias in all transition layers, and making the pitch between the blind vias be M mil, where 0.1 ≤ M < N and N is the initial pitch between the blind vias; centering and cutting out a negative pitch of L mil in a negative film manner between the pads on all transition layers through an automatic pitch cutting command; surface-treating the negative pitches and pads on all transition layers; and copying all transition layers to the copper skin layers of the corresponding inner layers in a negative film manner. It is not necessary to manually route on each inner layer, which improves the efficiency and avoids the risks of missed connection, multiple connection, connection error, and non-centered routing.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB manufacturing industry, and particularly relates to a PCB copper cladding processing method, an electronic device and a computer-readable storage medium applied to CAM software. Background Art

[0002] Ball Grid Array (BGA) is a packaging method for integrated circuits using an organic carrier board. It has the characteristics of reduced packaging area, enhanced function, increased number of pins, self-centering during PCB soldering, easy tinning, high reliability, good electrical performance, and low overall cost. There are many vias under the PCB with BGA. The size of conventional BGA vias is designed to be 8-12 mil. If the partial vias on the inner layer of the PCB and the copper foil are designed to be isolated, a certain width of copper foil needs to be reserved between two adjacent vias to avoid overlapping and breaking the copper foil and affecting the electrical performance.

[0003] If the distance between the via and the copper foil is too close, the board material will expand and contract after the inner layer is made and laminated, and the drilling process will also deviate. Then, the via is very likely to drill on the copper foil and cause a short circuit. To avoid the via drilling on the copper foil and causing a short circuit, the CAM engineer of the PCB manufacturer will overlap the copper foil around the via with a relatively close distance to the copper foil to increase the distance between the via and the copper foil. An existing technology uses a negative method to overlap the copper foil. After overlapping the copper foil, the CAM engineer manually adds a trace with a certain width between two adjacent vias on the inner layer to ensure the electrical performance of the PCB. However, if it is a multi-layer PCB, it needs to be processed layer by layer. Due to the large number of vias, the manual routing efficiency is low after overlapping the copper foil, and there are risks of missed connection, multi-connection, connection error, and non-centered routing. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a PCB copper cladding processing method, an electronic device and a computer-readable storage medium applied to CAM software, which can solve the problems of low routing efficiency and risks of missed connection, multi-connection, connection error, and non-centered routing.

[0005] The PCB copper cladding processing method applied to CAM software according to the embodiment of the first aspect of the present invention includes: adding a corresponding transition layer to each inner layer with lower vias, where the lower vias are lower vias that do not contact the copper skin; copying the pads and the lower vias of the inner layer to the corresponding transition layer; increasing the aperture of all the lower vias in all the transition layers, and making the distance between the lower vias be M mil, 0.1 ≤ M < N, where N is the initial distance between the lower vias; centering and cutting out a negative distance of L mil in a negative film manner between the pads in all the transition layers through an automatic distance cutting command; surfacing the negative distances and pads in all the transition layers; and copying all the transition layers to the copper cladding layers of the corresponding inner layers in a negative film manner.

[0006] The PCB copper cladding processing method applied to CAM software according to the embodiment of the first aspect of the present invention has at least the following beneficial effects:

[0007] By adding a corresponding transition layer to each inner layer with lower vias that do not contact the copper skin, copying the pads and the lower vias that do not contact the copper skin to the transition layer, increasing the aperture of the lower vias in the transition layer, and making the distance between the lower vias be M mil, centering and cutting out a negative distance with a width of L mil between the pads in the transition layer through an automatic distance cutting command, surfacing the negative distances and pads in all the transition layers, and copying all the transition layers to the copper cladding layers of the corresponding inner layers in a negative film manner, only copper wires with a width of L mil between the pads are left on the copper cladding layer, completing the copper cladding processing on the copper cladding layers of multiple inner layers, ensuring the electrical performance of the PCB. Through the automatic distance cutting command, there is no need to manually route on each inner layer, improving the efficiency and avoiding the risks of missed connection, multiple connection, connection error, and non-centered routing.

[0008] According to some embodiments of the present invention, when centering and cutting out a negative distance of L mil in a negative film manner between the pads in all the transition layers through an automatic distance cutting command, where L = D + W, D is the thickness of the copper cladding layer, and W is the line width requirement of the PCB after etching.

[0009] According to some embodiments of the present invention, when increasing the aperture of all the lower vias in all the transition layers and making the distance between the lower vias be M mil, where M is 0.1 mil.

[0010] The electronic device according to the embodiment of the second aspect of the present invention includes:

[0011] At least one processor;

[0012] At least one memory for storing at least one program;

[0013] When at least one of the programs is executed by at least one of the processors, the above-mentioned PCB copper stacking processing method applied to CAM software is implemented.

[0014] The electronic device according to the second aspect embodiment of the present invention has at least the following beneficial effects:

[0015] By adding corresponding transition layers to each inner layer with blind vias that do not touch the copper skin, copying the pads and blind vias that do not touch the copper skin to the transition layers, increasing the aperture of the blind vias in the transition layers, and making the pitch between the blind vias be M mil, by using the automatic pitch trimming command, a negative pitch with a width of L mil is centered and trimmed between the pads in the transition layer, surfacing the negative pitches and pads of all the transition layers, and copying all the transition layers to the copper skin layers of the corresponding inner layers in a negative film manner, only leaving copper wires with a width of L mil between the pads on the copper skin layer, completing the copper stacking processing of the copper skin layers on multiple inner layers, ensuring the electrical performance of the PCB, and by using the automatic pitch trimming command, there is no need to manually route on each inner layer, improving the efficiency and avoiding the risks of missed connections, multiple connections, connection errors, and non-centered routing.

[0016] The computer-readable storage medium according to the third aspect embodiment of the present invention stores a program executable by a processor, and when the program executable by the processor is executed by the processor, it is used to implement the above-mentioned PCB copper stacking processing method applied to CAM software.

[0017] The computer-readable storage medium according to the third aspect embodiment of the present invention has at least the following beneficial effects:

[0018] By adding corresponding transition layers to each inner layer with blind vias that do not touch the copper skin, copying the pads and blind vias that do not touch the copper skin to the transition layers, increasing the aperture of the blind vias in the transition layers, and making the pitch between the blind vias be M mil, by using the automatic pitch trimming command, a negative pitch with a width of L mil is centered and trimmed between the pads in the transition layer, surfacing the negative pitches and pads of all the transition layers, and copying all the transition layers to the copper skin layers of the corresponding inner layers in a negative film manner, only leaving copper wires with a width of L mil between the pads on the copper skin layer, completing the copper stacking processing of the copper skin layers on multiple inner layers, ensuring the electrical performance of the PCB, and by using the automatic pitch trimming command, there is no need to manually route on each inner layer, improving the efficiency and avoiding the risks of missed connections, multiple connections, connection errors, and non-centered routing.

[0019] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0020] The present invention will be further described below in conjunction with the accompanying drawings and embodiments, where:

[0021] Figure 1 It is a flowchart of the PCB copper stacking processing method provided in the first aspect embodiment of the present invention;

[0022] Figure 2 It is a PCB effect diagram of step S200 of the PCB copper stacking processing method provided in the first aspect embodiment of the present invention;

[0023] Figure 3 It is a PCB effect diagram of step S300 of the PCB copper stacking processing method provided in the first aspect embodiment of the present invention;

[0024] Figure 4 It is a PCB effect diagram of step S400 of the PCB copper stacking processing method provided in the first aspect embodiment of the present invention;

[0025] Figure 5 It is a PCB effect diagram of step S600 of the PCB copper stacking processing method provided in the first aspect embodiment of the present invention;

[0026] Figure 6 It is a PCB effect diagram after the PCB copper stacking processing method provided in the first aspect embodiment of the present invention.

[0027] Reference numerals:

[0028] Lower via hole 100;

[0029] Pad 200;

[0030] Copper skin layer 300;

[0031] Optimized distance 400. Detailed implementation manners

[0032] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0033] In the description of the present invention, it should be understood that the orientation or positional relationship involved, such as up, down, etc., indicates the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0034] In the description of the present invention, "a plurality of" means more than two. If the first and second are described only for the purpose of distinguishing technical features, they should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features or implicitly specifying the sequence relationship of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as "arrangement", "installation", and "connection" should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0036] As Figure 1 shown, the PCB copper cladding processing method applied to the CAM software according to the first aspect embodiment of the present invention includes the following steps:

[0037] S100. Add a corresponding transition layer to each inner layer with a via 100 below, and the via 100 below is a via 100 that does not contact the copper foil;

[0038] S200. As Figure 2 shown, copy the pads 200 and vias 100 of each inner layer to the corresponding transition layer;

[0039] S300. As Figure 3 shown, increase the aperture of all vias 100 in all transition layers, and make the distance between the vias 100 be M mil, where 0.1 ≤ M < N, and N is the initial distance between the vias 100;

[0040] S400. As Figure 4 shown, use the automatic spacing reduction command to centrally cut out a negative spacing of L mil in a negative film manner between the pads 200 in all transition layers;

[0041] S500. Surface the negative spacing and the pads 200 in all transition layers;

[0042] S600. As Figure 5 shown, copy all transition layers to the copper cladding layer 300 of the corresponding inner layer in a negative film manner.

[0043] By adding corresponding transition layers to each inner layer with the blind via 100 that does not touch the copper clad, copying the pads 200 and the blind via 100 that does not touch the copper clad to the transition layer, increasing the aperture of the blind via 100 in the transition layer, and making the spacing between the vias 100 be M mil, using the automatic spacing trimming command, trimming a negative spacing with a width of L mil in the center between the pads 200 in the transition layer, surfacing all the negative spacings and the pads 200 in the transition layer, and copying all the transition layers to the corresponding copper clad layer 300 of the inner layer in a negative film manner. Only the copper wire with a width of L mil between the pads 200 is left on the copper clad layer 300, completing the copper cladding process on the multi-layer inner layer, ensuring the electrical performance of the PCB. Using the automatic spacing trimming command, there is no need to manually route on each inner layer, improving the efficiency and avoiding the risks of missed connections, multiple connections, connection errors, and non-centered routing.

[0044] As Figure 6 shown, Figure 6 Figure 0000105 is the PCB effect diagram after applying the PCB copper cladding process method of the first aspect embodiment of the present invention to the CAM software. The distance between the blind via 100 and the copper clad is increased by the optimized distance 400, increasing the distance between the blind via 100 and the copper clad, making it not easy to short circuit during later drilling processing, and the copper wire between the blind vias 100 will not be broken by overlapping, ensuring the electrical performance of the PCB.

[0045] In step S400, L = D + W, where D is the thickness of the copper clad layer 300, and W is the line width requirement of the PCB after etching. It can calculate the width of the negative spacing between the pads 200 according to the thickness of the copper clad layer 300 and the line width requirement of the PCB after etching the copper clad layer 300, which is applicable to PCBs with different thicknesses of the copper clad layer 300, ensuring that the etched copper wire meets the line width requirement.

[0046] The following introduces the specific application process of the PCB copper cladding process method in the CAM software Genesis.

[0047] For a PCB with a blind via 100 diameter of 8 mil, a distance between the blind via 100 and the copper clad of 6.8 mil, a distance between the blind vias 100 of 17.6 mil, a copper clad layer 300 thickness of 1 oz (1 oz = 1.38 mil), and an etched copper wire reaching 2.76 mil:

[0048] S100. Add corresponding transition layers to each inner layer with the blind via 100 that does not touch the copper clad;

[0049] S200. Copy the pads 200 and the blind via 100 that does not touch the copper clad on each inner layer to the corresponding transition layer;

[0050] S300. Increase the diameter of all the vias 100 in all the transition layers to 16.75 mil, and make the spacing between the vias 100 be 0.1 mil;

[0051] S400. Centrally cut out a negative spacing of L mil in a negative film manner between the pads 200 in all the transition layers through the automatic spacing cutting command; L = 1.38 + 2.76 = 4.14 mil;

[0052] S500. Surface the negative spacing and the pads 200 in all the transition layers;

[0053] S600. Copy all the transition layers to the corresponding inner - layer copper skin layers 300 in a negative film manner.

[0054] An embodiment of the second aspect of the present invention also discloses an electronic device, including: at least one processor; at least one memory for storing at least one program; when the at least one program is executed by the at least one processor, the above - mentioned PCB copper - stacking processing method is implemented.

[0055] An embodiment of the third aspect of the present invention also discloses a computer - readable storage medium, in which computer - executable instructions are stored, and the computer - executable instructions are used to execute the above - mentioned PCB copper - stacking processing method.

[0056] In addition, an embodiment of the fourth aspect of the present invention also discloses a computer program product, including a computer program or computer instructions, the computer program or computer instructions are stored in a computer - readable storage medium, a processor of a computer device reads the computer program or computer instructions from the computer - readable storage medium, and the processor executes the computer program or computer instructions, so that the computer device executes the above - mentioned PCB copper - stacking processing method.

[0057] Those of ordinary skill in the art will understand that all or some of the steps and systems disclosed above can be implemented as software, firmware, hardware, and their appropriate combinations. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include a computer storage medium (or non-transitory medium) and a communication medium (or transitory medium). As is well known to those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information, such as computer-readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, it is well known to those of ordinary skill in the art that communication media typically includes computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transmission mechanism, and can include any information delivery medium.

[0058] The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those of ordinary skill in the art to which the present invention pertains.

Claims

1. A PCB copper stacking processing method applied to CAM software, characterized in that, Including: Adding a corresponding transition layer to each inner layer with a blind via (100), where the blind via (100) is a blind via (100) that does not contact the copper foil; Copying the pads (200) and the blind vias (100) of the inner layer to the corresponding transition layer; Increasing the aperture of all the blind vias (100) in all the transition layers and setting the pitch between the blind vias (100) to be M mil, where 0.1 ≤ M < N and N is the initial pitch between the blind vias (100); Centrally cutting out a negative pitch of L mil in a negative film manner between the pads (200) and the pads (200) in all the transition layers through an automatic pitch cutting command, where L = D + W, D is the thickness of the copper layer (300), and W is the line width requirement of the PCB after etching; Surfacing the negative pitches and the pads (200) of all the transition layers; Copying all the transition layers to the copper layer (300) of the corresponding inner layer in a negative film manner.

2. The PCB copper stacking processing method applied to the CAM software according to claim 1, wherein: Increasing the aperture of all the blind vias (100) in all the transition layers and setting the pitch between the blind vias (100) to be M mil, where M is 0.1 mil.

3. An electronic device, characterized in that, Including: At least one processor; At least one memory for storing at least one program; When at least one of the programs is executed by at least one of the processors, implementing the PCB copper cladding processing method applied to CAM software as described in any one of claims 1 to 2.

4. A computer-readable storage medium, characterized in that, Wherein there is a program executable by the processor, and when the program executable by the processor is executed by the processor, it is used to implement the PCB copper cladding processing method applied to CAM software as described in any one of claims 1 to 2.

Images