Sensor device

Abstract

An object of the present invention is to further improve the water resistance between the end portion of the wiring member and the resin molding portion. The sensor device includes: a sensor element; a wiring member connected to the sensor element; a first resin molding portion covering the end portion of the wiring member and the sensor element; and a second resin molding portion that is separately molded by a mold outside the first resin molding portion and is integrally combined with the first resin molding portion.

Description

Technical Field

[0001] The present disclosure relates to a sensor device. Background Art

[0002] Patent Document 1 discloses the following: A plurality of output wire portions are connected to a detection element portion, the plurality of output wire portions are gathered as a sheathed wire, and the end portion of the sheathed wire and the detection element portion are buried in a resin molding portion.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2017-096828 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In a structure in which the end portion of a wiring member is buried in a resin molding portion, it is desired to further improve the water resistance between the outer periphery of the wiring member and the resin molding portion.

[0008] Therefore, an object of the present disclosure is to further improve the water resistance between the end portion of a wiring member and a resin molding portion.

[0009] Technical Means for Solving the Problems

[0010] The sensor device of the present disclosure includes: a sensor element; a wiring member connected to the sensor element; a first resin molding portion covering the end portion of the wiring member and the sensor element; and a second resin molding portion that is separately molded by a mold and is integrally combined with the first resin molding portion.

[0011] Advantages of the Invention

[0012] According to the present disclosure, the water resistance between the end portion of a wiring member and a resin molding portion is further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a front view showing the sensor device according to the embodiment.

[0014] Figure 2 is Figure 1 a sectional view taken along line II-II of

[0015] Figure 3 is Figure 1 a sectional view taken along line III-III of

[0016] Figure 4 is an explanatory view showing an example of a process of molding the second resin molding portion by a mold.

[0017] Figure 5 This is a cross-sectional view of the sensor device according to the modified example.

[0018] Figure 6 This is an explanatory view of an example of a process of molding a second resin molding part according to the modified example. Detailed implementation manners

[0019] [Explanation of the embodiments of the present disclosure]

[0020] First, the embodiments of the present disclosure will be listed for explanation.

[0021] The sensor device of the present disclosure is as described below.

[0022] (1) A sensor device includes: a sensor element; a wiring member connected to the sensor element; a first resin molding part covering an end portion of the wiring member and the sensor element; and a second resin molding part that is separately molded by a mold outside the first resin molding part and is integrally combined with the first resin molding part. According to this sensor device, since the first resin molding part and the second resin molding part are respectively molded by a mold, the thermal influence applied to the wiring member becomes smaller. Thus, by suppressing the shrinkage of the wiring member and suppressing sink marks caused by the thinning of the resin part, etc., the water resistance between the end portion of the wiring member and the resin molding part can be further improved. In addition, by combining the first resin molding part and the second resin molding part, the desired shape as a sensor device can be formed.

[0023] (2) In the sensor device of (1), it may be that the first resin molding part and the second resin molding part respectively directly cover different regions in the extending direction of the wiring member of the end portion of the wiring member. The lengths of the end portions of the wiring member directly covered by the first resin molding part and the second resin molding part become shorter. Thus, when molding the first resin molding part and the second resin molding part by a mold, the parts for positioning the wiring member in the mold space can be eliminated or reduced. Thereby, the water resistance is further improved.

[0024] (3) In the sensor device of (2), it may be that the first resin molding part and the second resin molding part continuously cover the end portion of the wiring member. Since the first resin molding part and the second resin molding part continuously cover the end portion of the wiring member, the water resistance is further improved.

[0025] (4) In the sensor device according to any one of (1) to (3), it is also possible that the first resin molding portion has a plurality of resin-blocking annular protrusions, and the second resin molding portion covers a part of the first resin molding portion in a state of being connected to one of the plurality of resin-blocking annular protrusions. The area where the second resin molding portion covers the first resin molding portion can be flexibly adjusted by the plurality of resin-blocking annular protrusions.

[0026] (5) In the sensor device of (4), it is also possible that the plurality of resin-blocking annular protrusions include a first resin-blocking annular protrusion and a second resin-blocking annular protrusion, the second resin-blocking annular protrusion is formed at a position farther from the sensor element than the first resin-blocking annular protrusion, and the second resin molding portion covers a part of the first resin molding portion on the side extending from the second resin-blocking annular protrusion toward the wiring member. It is possible to cover the part far from the sensor element by the second resin molding portion.

[0027] (6) In the sensor device of (4), it is also possible that the plurality of resin-blocking annular protrusions include a first resin-blocking annular protrusion and a second resin-blocking annular protrusion, the second resin-blocking annular protrusion is formed at a position farther from the sensor element than the first resin-blocking annular protrusion, and the second resin molding portion covers a part of the first resin molding portion on the side extending from the first resin-blocking annular protrusion toward the wiring member. It is possible to cover the part close to the sensor element by the second resin molding portion.

[0028] [Details of Embodiments of the Present Disclosure]

[0029] Hereinafter, a specific example of the sensor device of the present disclosure will be described with reference to the drawings. In addition, the present disclosure is not limited to these examples, but is shown by the scope of claims, and is intended to include all changes within the meaning and scope equivalent to the scope of claims.

[0030] [Embodiment]

[0031] Hereinafter, the sensor device according to the embodiment will be described. Figure 1 It is a front view showing the sensor device 10. Figure 2 It is Figure 1 a cross-sectional view taken along line II-II. Figure 3 It is Figure 1 a cross-sectional view taken along line III-III. In Figure 2 , for the sensor element 20, the internal holding member portion 40, and the wiring member 30, the outer shapes are shown instead of the cross-sections.

[0032] The sensor device 10 includes a sensor element 20, a wiring member 30, a first resin molding portion 50, and a second resin molding portion 60. The sensor element 20 is connected to the wiring member 30. The first resin molding portion 50 covers the end portion of the wiring member 30 and the sensor element 20. The second resin molding portion 60 is a portion formed by mold molding separately from the first resin molding portion 50. The second resin molding portion 60 is integrally combined with the first resin molding portion 50. The first resin molding portion 50 and the second resin molding portion 60 are respectively mold molded to form an integral resin molding portion, which covers the end portion of the wiring member 30 and the sensor element 20.

[0033] More specifically, the sensor element 20 is an element that detects physical quantities such as magnetism, light, temperature, or the change amounts thereof. Here, the sensor element 20 includes an element main body portion 22 and a lead portion 24. The element main body portion 22 is formed in a square shape, for example. The lead portion 24 is an elongated portion formed of metal or the like. The lead portion 24 extends outward from the element main body portion 22. The output signal of the sensor element 20 is output to the outside via the lead portion 24. This sensor device 10 is used as a sensor for detecting the rotational speed of a wheel in a vehicle, for example. More specifically, this sensor device 10 can be used as a sensor for an ABS (antilock braking system).

[0034] The wiring member 30 is connected to the sensor element 20. The wiring member 30 includes at least one linear conductor. Here, the wiring member 30 includes a plurality of (two in this case) electric wires 32. The electric wire 32 includes a core wire 32a as a conductor and an insulating coating layer 32b covering the outer periphery of the core wire 32a. The plurality of electric wires 32 are covered by a sheath 34 in a bundled state. The sheath 34 is a coating layer formed of resin or the like. The plurality of electric wires 32 extend from the end portion of the sheath 34. The core wire 32a is exposed at the end portions of the plurality of electric wires 32. The core wire 32a at the end portion of each of the plurality of electric wires 32 is connected to the above-mentioned lead portion 24. The connection between the core wire 32a and the lead portion 24 can be performed by welding, crimping, for example. The wiring member may be one electric wire. The wiring member may also be a member formed by bundling a plurality of electric wires in a state where they are exposed without being covered by a sheath.

[0035] The first resin molding portion 50 covers the end portion of the wiring member 30 and the sensor element 20. Here, the sensor element 20 and the connection portion between the sensor element 20 and the wiring member 30 are held in a constant posture by the internal holding member portion 40. The internal holding member portion 40 is, for example, a resin molding portion formed by molding the sensor element 20 and the connection portion between the lead portion and the core wire 32a as an insert portion. The member in which the sensor element 20 and the connection portion between the sensor element 20 and the wiring member 30 are held by the internal holding member portion 40 can also be understood as the intermediate member 40M. By molding the first resin molding portion 50 with this intermediate member 40M as an insert portion, the sensor element 20 is buried in the correct position within the first resin molding portion 50. In addition, by molding the first resin molding portion 50 to cover the internal holding member portion 40, the water resistance to the sensor element 20 can be improved. In addition, the internal holding member portion 40 does not have to be a member formed by molding the sensor element 20 or the like as an insert portion. For example, the internal holding member portion 40 can also be molded into a shape into which the sensor element 20 or the like can be inserted, and the sensor element 20 or the like can be inserted into the internal holding member portion 40. In addition, the sensor device 10 does not have to include the internal holding member portion 40. The first resin molding portion 50 can also directly cover the sensor element 20.

[0036] The first resin molding portion 50 covers the sensor element 20 with the internal holding member portion 40 interposed therebetween. In addition, the first resin molding portion 50 covers the end portion of the wiring member 30, and here, the end portion of the sheath 34. That is, the first resin molding portion 50 covers the portion from the sensor element 20 to the end portion of the sheath 34. The first resin molding portion 50 is a member that covers the sensor element 20 and the end portion of the wiring member 30 connected to the sensor element 20 in a manner that maintains a constant positional relationship.

[0037] The second resin molding portion 60 is a portion molded separately from the first resin molding portion 50 and is integrally combined with the first resin molding portion 50. In addition, since the first resin molding portion 50 and the second resin molding portion 60 are molded separately, it is considered that even if they are formed of the same material, a boundary will appear between the first resin molding portion 50 and the second resin molding portion 60.

[0038] The first resin molding portion 50 and the second resin molding portion 60 directly cover different regions in the extending direction of the wiring member 30 among the ends of the wiring member 30, respectively. Here, the second resin molding portion 60 covers a part of the first resin molding portion 50 on the side where the wiring member 30 extends. Moreover, the second resin molding portion 60 extends toward the side where the wiring member 30 extends with respect to the first resin molding portion 50, and also covers the sheath 34 of the wiring member 30 extending from the first resin molding portion 50. That is, the part of the end of the wiring member 30 closer to the sensor element 20 among the ends of the wiring member 30 connected to the sensor element 20 is directly covered by the first resin molding portion 50, and the part farther from the sensor element 20 is directly covered by the second resin molding portion 60.

[0039] The first resin molding portion 50 and the second resin molding portion 60 do not necessarily directly cover the ends of the wiring member 30, respectively. For example, the second resin molding portion may also be formed on the outer peripheral side of the first resin molding portion without directly covering the wiring member. In addition, the second resin molding portion 60 does not necessarily cover the first resin molding portion 50. For example, the second resin molding portion may also be connected to the end of the first resin molding portion on the side where the wiring member extends.

[0040] The first resin molding portion 50 continuously covers the end of the wiring member 30 along its extending direction, and the second resin molding portion 60 also continuously covers the end of the wiring member 30 along its extending direction. Here, the so-called first resin molding portion 50 or second resin molding portion 60 continuously covering the end of the wiring member 30 means that the end of the wiring member 30 is covered by the first resin molding portion 50 or the second resin molding portion 60 without exposing the wiring member 30 in the middle. That is, there is no trace of the positioning pin for positioning the wiring member 30 during the die molding of the first resin molding portion 50 and the second resin molding portion 60 in the middle of the first resin molding portion 50 and the second resin molding portion 60.

[0041] The fixing portion 38 is fixed to the second resin molding portion 60. Here, the fixing portion 38 is fixed to the middle portion in the longitudinal direction of the second resin molding portion 60. The fixing portion 38 includes: a sensor-side fixing portion 38a fixed to the periphery of the second resin molding portion 60; and a vehicle-body-side fixing portion 38b protruding outward from the sensor-side fixing portion 38a. A through-hole 38ah for disposing the second resin molding portion 60 is formed in the sensor-side fixing portion 38a. A threaded fixing hole 38bh is formed in the vehicle-body-side fixing portion 38b. In a state where the fixing portion 38 is positioned in the mold, it is preferable to perform mold molding on the second resin molding portion 60. Thus, the fixing portion 38 is fixed to the outer peripheral portion of the second resin molding portion 60. It is also possible to fix the fixing portion 38 to the second resin molding portion 60 by fitting the second resin molding portion 60 into the through-hole 38ah of the fixing portion 38. In this way, the second resin molding portion 60 can also be understood as a portion forming a shape portion for fixing the fixing portion 38.

[0042] According to the sensor device 10 configured as described above, since the first resin molding portion 50 and the second resin molding portion 60 are respectively subjected to mold molding, the thermal influence applied to the wiring member 30 is reduced. For example, when a portion corresponding to the first resin molding portion 50 and the second resin molding portion 60 is molded into one resin molding portion, a corresponding amount of heated and molten resin of the first resin molding portion 50 and the second resin molding portion 60 is supplied around the wiring member 30. Therefore, the thermal influence applied to the wiring member 30 may become large. In contrast, when the first resin molding portion 50 and the second resin molding portion 60 are respectively subjected to mold molding, the heated and molten resin corresponding to the first resin molding portion 50 and the heated and molten resin corresponding to the second resin molding portion 60 are supplied around the wiring member 30 in a subdivided manner. Therefore, the temperature applied to the wiring member 30 becomes smaller, and the time maintained at a high temperature is also shorter. Thus, the thermal influence applied to the wiring member 30 is reduced. As a result, the thermal expansion of the wiring member 30 is suppressed, and the subsequent shrinkage of the wiring member 30 is also suppressed. In addition, by subdividing, the first resin molding portion 50 can be made thinner, thereby suppressing sink marks. As a result, the adhesion between the wiring member 30 and the first resin molding portion 50 is improved, and the water resistance between the end portion of the wiring member 30 and the first resin molding portion 50 is further improved. Similarly, the adhesion between the wiring member 30 and the second resin molding portion 60 is improved, and the water resistance between the end portion of the wiring member 30 and the second resin molding portion 60 is further improved. In addition, by combining the first resin molding portion 50 and the second resin molding portion 60, a desired shape as the sensor device 10 is formed. For example, a shape is realized in which the shape of the wiring member 30 extending from the sensor element 20 is maintained constant by the first resin molding portion 50, and the fixing portion 38 is held at a specified position in a specified posture by the second resin molding portion 60.

[0043] In addition, the first resin molding portion 50 and the second resin molding portion 60 directly cover different regions in the extending direction of the wiring member 30 among the end portions of the wiring member 30, respectively. As a result, the lengths of the end portions of the wiring member 30 directly covered by the first resin molding portion 50 and the second resin molding portion 60 are shortened. Thus, when the first resin molding portion 50 and the second resin molding portion 60 are molded by a mold, the portions for positioning the wiring member 30 in the mold space can be eliminated or reduced. Thereby, the water resistance is further improved.

[0044] In addition, in this case, a cylindrical elastic member, a tape, or the like may be externally mounted on the end portion of the wiring member, and the externally mounted member becomes a part of the wiring member. In this case, at least one of the first resin molding portion 50 and the second resin molding portion 60 directly covers the wiring member by directly covering the externally mounted member.

[0045] As described above, in the first resin molding portion 50 and the second resin molding portion 60, if the holding length of the wiring member 30 is shortened and positioning pins are not required, as in the above-described embodiment, the first resin molding portion 50 and the second resin molding portion 60 can easily achieve a structure in which the end portions of the wiring member 30 are continuously covered. Thereby, the water resistance between the first resin molding portion 50 and the second resin molding portion 60 and the wiring member 30 is further improved.

[0046] In addition, in the above-described sensor device 10, the first resin molding portion 50 has a plurality of resin-blocking annular protrusions 56, 58. Here, the plurality of resin-blocking annular protrusions 56, 58 include a first resin-blocking annular protrusion 56 and a second resin-blocking annular protrusion 58. In the direction in which the wiring member 30 extends from the sensor element 20, the distances of the first resin-blocking annular protrusion 56 and the second resin-blocking annular protrusion 58 from the sensor element 20 are different. The second resin-blocking annular protrusion 58 is formed at a position farther from the sensor element 20 than the first resin-blocking annular protrusion 56.

[0047] Here, the first resin-blocking annular protrusion 56 is formed in a portion of the first resin molding portion 50 where the element main body portion 22 is buried. The first resin-blocking annular protrusion 56 is formed in an annular protrusion shape protruding outward along the outer peripheral direction of the first resin molding portion 50. The surface of the first resin-blocking annular protrusion 56 on the side where the wiring member 30 extends is formed as a sealing surface 56f that gradually moves away from the wiring member 30 in the outward direction (outer peripheral side) of the protruding direction. The sealing surface 56f is also provided in an annular shape along the circumferential direction of the first resin-blocking annular protrusion 56.

[0048] The annular protrusion 58 for blocking the second resin is provided at a position in the first resin molded portion 50 that is far from the sensor element 20 on the side where the wiring member 30 extends. Here, the annular protrusion 58 for blocking the second resin is formed at the middle portion in the longitudinal direction of the first resin molded portion 50. The annular protrusion 58 for blocking the second resin is formed in an annular protrusion shape that protrudes outward along the outer peripheral direction of the first resin molded portion 50. The surface of the annular protrusion 58 for blocking the second resin on the side where the wiring member 30 extends is formed as a sealing surface 58f that gradually moves away from the wiring member 30 in the direction of the outer side (outer peripheral side) of the protruding direction. The sealing surface 58f is also provided in an annular shape along the circumferential direction of the annular protrusion 58 for blocking the second resin.

[0049] The second resin molded portion 60 covers a part of the first resin molded portion 50 in a state of being connected to one of the plurality of annular protrusions 56, 58 for blocking the resin. In the present embodiment, the second resin molded portion 60 covers the portion of the first resin molded portion 50 on the side extending from the annular protrusion 58 for blocking the second resin toward the wiring member 30, and further covers the end portion of the wiring member 30 extending from the first resin molded portion 50.

[0050] The above-mentioned annular protrusion 58 for blocking the second resin can function as follows: when the second resin molded portion 60 is molded by the mold, it separates the mold space from the external space and suppresses the leakage of the heated and molten resin filled in the mold space to the outside. Figure 4 It is an explanatory diagram showing an example of the process of molding the second resin molded portion 60 by the mold.

[0051] As shown in this figure, when molding the second resin molded portion 60 by the mold, it is necessary to position the first resin molded portion 50 covering the intermediate member 40M, etc. with respect to the mold 90. In this case, a part of the first resin molded portion 50 is disposed in the mold space of the mold 90, and another part of the first resin molded portion 50 is disposed in the external space outside the mold space. In the portion of the first resin molded portion 50 that comes out of the mold space, it is preferable to block the gap through which the resin in the mold space leaks as much as possible. Therefore, the annular protrusion 58 for blocking the second resin is disposed outside the mold 90, and the sealing surface 58f of the annular protrusion 58 for blocking the second resin is pressed against the mold 90 (refer to arrow P). Thereby, the gap between the mold 90 and the first resin molded portion 50 is blocked as much as possible.

[0052] The above-mentioned plurality of annular protrusions 56, 58 for blocking the resin contribute to forming the second resin molded portion with different shapes. That is, as described above, by combining the first resin molded portion 50 and the second resin molded portion 60, the desired shape of the sensor device 10 is formed. For example, the holding position of the fixing portion 38 is determined by the second resin molded portion 60. As Figure 5As in the case of the sensor device 110 shown, consider changing the holding position of the fixing portion 38, etc. by changing the second resin molding portion 60 to another-shaped second resin molding portion 160. In Figure 5 In the example shown, the first resin molding portion 50 is formed into a structure common to the first resin molding portion 50 in the sensor device 10 described above. The second resin molding portion 160 corresponding to the second resin molding portion 60 covers a portion of the first resin molding portion 50 on the side extending from the first resin blocking annular protrusion 56 toward the wiring member 30, and further covers an end portion of the wiring member 30 extending from the first resin molding portion 50. The second resin blocking annular protrusion 58 is buried in the second resin molding portion 160. The fixing portion 38 is fixed to the intermediate portion in the longitudinal direction of the second resin molding portion 160. More specifically, the sensor-side fixing portion 38a of the fixing portion 38 is fixed between the first resin blocking annular protrusion 56 and the second resin blocking annular protrusion 58. For example, when the second resin molding portion 160 is formed by die molding, the second resin molding portion 160 is formed by die molding in a state where the sensor-side fixing portion 38a is positioned in the die 190, whereby the sensor-side fixing portion 38a is fixed to the second resin molding portion 160. The fixing portion 38 of the sensor device 110 may be the same as or different from the fixing portion 38 of the sensor device 10.

[0053] The above-described first resin blocking annular protrusion 56 functions to separate the die space from the external space when the second resin molding portion 160 is formed by die molding, and suppresses the case where the heat-melted resin filled in the die space leaks to the outside. Figure 6 It is an explanatory diagram showing an example of the process of forming the second resin molding portion 160 by die molding.

[0054] As shown in this figure, when the second resin molding portion 160 is formed by die molding, it is necessary to position the first resin molding portion 50 covering the intermediate member 40M, etc. relative to the die 190. In this case, a part of the first resin molding portion 50 is disposed in the die space of the die 190, and another part of the first resin molding portion 50 is disposed in the external space outside the die space. The second resin molding portion 160 covers the first resin molding portion 50 in a larger area than the above-described second resin molding portion 60. Therefore, a larger part of the first resin molding portion 50 is disposed in the die 190. In the portion of the first resin molding portion 50 that comes out of the die space, it is preferable to block the gap through which the resin in the die space leaks as much as possible, but the position where the first resin molding portion 50 comes out of the die space and Figure 4The positions shown are different. When the second resin molding part 160 is molded by the mold, the annular protrusion 56 for blocking the first resin is disposed outside the mold 190, and the sealing surface 56f of the annular protrusion 56 for blocking the first resin is pressed against the mold 190 (refer to arrow P). Thus, the gap between the mold 190 and the first resin molding part 50 is blocked as much as possible. As a result, the resin for molding the second resin molding part 160 by the mold is less likely to leak from the mold 190 to the outside.

[0055] In this way, by having a plurality of annular protrusions 56 and 58 for blocking the first resin in the first resin molding part 50, the regions where the second resin molding parts 60 and 160 cover the first resin molding part 50 can be flexibly adjusted. As a result, it is possible to easily form the second resin molding parts 60 and 160 having different shapes with respect to the common first resin molding part 50. The second resin molding parts 60 and 160 having different shapes can contribute to, for example, changing the fixing position of the fixing part 38.

[0056] In particular, by being formed by changing the distance with respect to the sensor element 20 by the annular protrusion 56 for blocking the first resin and the annular protrusion 58 for blocking the second resin, it is possible to selectively mold by the mold the second resin molding part 60 that covers the portion of the first resin molding part 50 that is far from the sensor element 20, and the second resin molding part 160 that covers the portion of the first resin molding part 50 that is close to the sensor element 20. By making the formation regions of the second resin molding parts 60 and 160 different, the fixing position of the fixing part 38 can be set near the sensor element 20 or far from the sensor element 20.

[0057] In addition, the respective structures described in the above embodiments and each modification can be appropriately combined as long as they do not contradict each other.

[0058] Reference Numeral Explanation

[0059] 10, 110 Sensor Device

[0060] 20 Sensor Element

[0061] 22 Element Main Body Part

[0062] 24 Lead Part

[0063] 30 Wiring Member

[0064] 32 Electric Wire

[0065] 32a Core Wire

[0066] 32b Insulation Coating Layer

[0067] 34 Sheath

[0068] 38 Fixing Part

[0069] 38a Sensor-side fixing part

[0070] 38ah Through-hole

[0071] 38b Body-side fixing part

[0072] 38bh Threaded fixing hole

[0073] 40 Inner holding part

[0074] 40M Intermediate part

[0075] 50 First resin molding part

[0076] 56 First resin-blocking annular protrusion

[0077] 56f, 58f Sealing surface

[0078] 58 Second resin-blocking annular protrusion

[0079] 60, 160 Second resin molding part

[0080] 90, 190 Mold

Claims

1. A sensor device comprising: a sensor element; a wiring member connected to the sensor element; a first resin molding portion covering an end portion of the wiring member and the sensor element; and a second resin molding portion that is separately molded by a mold outside the first resin molding portion and is integrally combined with the first resin molding portion, wherein the first resin molding portion has a plurality of resin-blocking annular protrusions, the second resin molding portion covers a part of the first resin molding portion while being connected to one of the plurality of resin-blocking annular protrusions, and the plurality of resin-blocking annular protrusions have a sealing surface that is pressed against the outside of the mold when the second resin molding portion is molded by the mold.

2. The sensor device according to claim 1, wherein the first resin molding portion and the second resin molding portion directly cover different regions in the extending direction of the wiring member of the end portion of the wiring member, respectively.

3. The sensor device according to claim 2, wherein the first resin molding portion and the second resin molding portion continuously cover the end portion of the wiring member.

4. The sensor device according to claim 1, wherein the plurality of resin-blocking annular protrusions include a first resin-blocking annular protrusion and a second resin-blocking annular protrusion, and the second resin-blocking annular protrusion is formed at a position farther from the sensor element than the first resin-blocking annular protrusion, and the second resin molding portion covers a part of the first resin molding portion extending from the second resin-blocking annular protrusion toward the wiring member.

5. The sensor device according to claim 1, wherein the plurality of resin-blocking annular protrusions include a first resin-blocking annular protrusion and a second resin-blocking annular protrusion, and the second resin-blocking annular protrusion is formed at a position farther from the sensor element than the first resin-blocking annular protrusion, and the second resin molding portion covers a part of the first resin molding portion extending from the first resin-blocking annular protrusion toward the wiring member.

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