Method, device, storage medium and equipment for monitoring temperature sampling circuit of chip

Abstract

The application provides a method, device, storage medium and equipment for monitoring temperature sampling circuit of a chip, wherein the method comprises the following steps: obtaining a temperature sampling voltage; judging whether the temperature sampling voltage is located in a set interval; when the temperature sampling voltage is located in the set interval, pulling up the inside of the chip; when the pulling up duration reaches a set duration, ending the pulling up, jumping to the step of obtaining the temperature sampling voltage and repeating the above steps. The device is used for implementing the method. The application only needs to judge whether the temperature sampling voltage is in the set interval, and only needs to pull up once in each monitoring period, so that the process is simple, and the detection duration is short.

Description

Technical Field

[0001] This invention relates to the field of chip testing, and more specifically to a method, apparatus, storage medium, and device for monitoring the temperature sampling circuit of a chip. Background Technology

[0002] In automotive software, functional safety testing requires fault diagnosis of the chip's data acquisition circuits. For example, monitoring the chip's temperature acquisition circuit is necessary to detect open circuits in the temperature sampling circuit. Traditional open-circuit fault detection circuits for temperature sampling circuits are extremely cumbersome to implement. This results in a very long diagnostic time, impacting the overall individual cell voltage update cycle. Summary of the Invention

[0003] In view of the shortcomings of the prior art, the present invention provides a method, apparatus, storage medium and device for monitoring the temperature sampling circuit of a chip, so as to realize real-time monitoring of the temperature sampling circuit and improve the problem of the particularly long diagnosis time of open circuit faults in the existing temperature sampling circuit.

[0004] To achieve the above and other related objectives, a method for a temperature sampling circuit for monitoring a chip includes:

[0005] Obtain the temperature sampling voltage;

[0006] Determine whether the temperature sampling voltage is within the set range;

[0007] When the temperature sampling voltage is within the set range, the chip is pulled up internally;

[0008] Once the pull-up duration reaches the set duration, the pull-up ends, and the process jumps to the step of acquiring the temperature sampling voltage and repeats the above steps.

[0009] In one embodiment of the present invention, the set interval is less than or equal to a first threshold and greater than or equal to a second threshold.

[0010] In one embodiment of the present invention, the temperature sampling circuit includes a first branch, a second branch, and a third branch, wherein a capacitor is disposed between the first branch and the second branch, and the step of determining whether the temperature sampling voltage is within a set range includes:

[0011] Determine whether the temperature sampling voltage is greater than the first threshold;

[0012] If so, output the result of opening the first or second branch;

[0013] If not, determine whether the temperature sampling voltage is less than the second threshold.

[0014] If so, output the result of opening the third branch;

[0015] If not, the temperature sampling voltage is within the set range.

[0016] In one embodiment of the present invention, a fault alarm is triggered when the result of the first branch or the second branch being open is output, or the result of the third branch being open is output.

[0017] In one embodiment of the present invention, the pull-up duration is 10-20ms.

[0018] The present invention also provides an apparatus for monitoring the temperature sampling circuit of a chip, comprising: a voltage acquisition module, a processing module, a pull-up module, an output module, and a delay module, wherein the voltage acquisition module is used to acquire a temperature sampling voltage; the processing module is used to determine whether the temperature sampling voltage is within a set range; when the temperature sampling voltage is within the set range, the pull-up module pulls up the chip internally; the output module is used to output the result; and the delay module is used to end the pull-up when the pull-up time reaches the set time, jump to the step of acquiring the temperature sampling voltage, and repeat the above steps.

[0019] In one embodiment of the present invention, it further includes a display module, which is used to display the output result.

[0020] In one embodiment of the present invention, it further includes an alarm module, which is used to perform fault alarm.

[0021] The present invention also provides a storage medium disposed within an electronic device, wherein processor-readable instructions are stored thereon, and when the processor executes the readable instructions, the electronic device executes the method of the temperature sampling circuit of the monitoring chip.

[0022] The present invention also provides an electronic device, comprising: one or more processors and a storage device, wherein the storage device is used to store one or more programs, and when the one or more programs are executed by the one or more processors, the electronic device enables the electronic device to implement the method of the temperature sampling circuit of the monitoring chip.

[0023] The method of the temperature sampling circuit of the monitoring chip of the present invention only needs to determine whether the temperature sampling voltage is within a set range, and only needs to be pulled up once in each cycle. Therefore, the process is simple and the detection time is short. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A flowchart of a method for a temperature sampling circuit to monitor a chip in one embodiment;

[0026] Figure 2 A schematic diagram of a method for monitoring the temperature of a chip in one embodiment;

[0027] Figure 3 A block diagram of the temperature sampling circuit for monitoring the chip;

[0028] Figure 4 The circuit diagram of the temperature sampling circuit for monitoring the chip.

[0029] Label Explanation

[0030] 1. First branch; 2. Second branch; 3. Third branch; 4. First current source; 5. Second current source; 6. Third current source; 7. Fourth current source; 100. Voltage acquisition module; 200. Processing module; 300. Pull-up module; 400. Output module; 500. Delay module; 600. Display module; 700. Alarm module; 800. Pull-down module. Detailed Implementation

[0031] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features can be combined with each other. It should also be understood that the terminology used in the embodiments of the present invention is for describing specific implementation schemes and not for limiting the scope of protection of the present invention. Test methods in the following embodiments that do not specify specific conditions are generally performed under conventional conditions or according to the conditions recommended by the respective manufacturers.

[0032] It should be noted that the terms such as "upper", "lower", "left", "right", "middle" and "one" used in this specification are only for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered as part of the scope of the invention.

[0033] Please see Figures 1 to 4 This invention provides a method for monitoring the temperature sampling circuit of a chip. The method is applicable to the LTC6815 chip and other electronic devices having the same temperature acquisition circuit as the LTC6815 chip. The temperature sampling circuit includes a first branch 1, a second branch 2, and a third branch 3. A capacitor R is disposed between the first branch 1 and the second branch 2. NTC The branch road it is located on is the first branch road 1, R. FTR The branch road it is located on is the second branch road 2, R. pu The branch it is located on is the third branch, 3; the method includes:

[0034] S1. Set the period for acquiring the temperature sampling voltage. The period can be set or adjusted according to the performance parameters of the chip under test. Taking LTC6815 as an example, the period can be 0.3-3 seconds, for example, 3 seconds. It should be noted that the period for acquiring the temperature sampling voltage can be regarded as the monitoring period.

[0035] Perform the following steps within the current period:

[0036] S2. Obtain the temperature sampling voltage Vgpio, which is the voltage across the temperature sensor.

[0037] S3. Determine whether the temperature sampling voltage is within a set range; the set range is less than or equal to a first threshold and greater than or equal to a second threshold.

[0038] In step S3, the specific steps for determining whether the temperature sampling voltage is within the set range include:

[0039] Determine whether the temperature sampling voltage is greater than the first threshold;

[0040] If the temperature sampling voltage is greater than the first threshold, the result of the first branch or the second branch being open is output and a fault alarm is triggered.

[0041] If the temperature sampling voltage is not greater than the first threshold, determine whether the temperature sampling voltage is less than the second threshold.

[0042] If the temperature sampling voltage is less than the second threshold, the result of the third branch being open is output and a fault alarm is triggered.

[0043] If the temperature sampling voltage is not less than the second threshold, then the temperature sampling voltage is within the set range.

[0044] S4. When the temperature sampling voltage is within the set range, the chip internally pulls it up through a current source;

[0045] S5. When the pull-up duration of the current source reaches the set duration, the pull-up ends, and after the current cycle ends, the next cycle begins, repeating steps S2 to S5. The set duration of the pull-up of the current source is 10-20 milliseconds, for example, 15ms. Steps S2 to S5 are repeated by periodically acquiring the temperature sampling voltage, thereby achieving real-time monitoring of the temperature sampling circuit. When there is no open circuit in the temperature sampling circuit, the first branch 1, the second branch 2, and the third branch 3 are in the conducting state, forming an RC circuit. At this time, the temperature sampling voltage value is the voltage across the temperature sensor, and the temperature sampling voltage is between the first threshold and the second threshold (including the endpoints). Therefore, under normal conditions of the temperature sampling circuit, pulling up the chip internally in each monitoring cycle will not affect the voltage value of the temperature sampling voltage.

[0046] The advantage of this invention is that only one current source pull-up action is required within the chip during each monitoring cycle. Therefore, this invention provides a simple and efficient method to monitor the operation of the temperature sampling circuit, enabling timely acquisition of open-circuit fault information and ensuring that the software meets both functional safety requirements and its basic functions. Furthermore, this step is implemented with simple and clear code execution logic, ensuring the normal operation of other functions.

[0047] Please see Figure 3 The present invention also provides an apparatus for monitoring the temperature sampling circuit of a chip, comprising: a voltage acquisition module 100, a processing module 200, a pull-up module 300, an output module 400, and a delay module 500, wherein the voltage acquisition module 100 is used to acquire the temperature sampling voltage Vgpio; the processing module 200 is used to determine whether the temperature sampling voltage is within a set range; when the temperature sampling voltage is within the set range, the pull-up module 300 pulls up the chip internally; the output module 400 is used to output the result; and the delay module 500 is used to end the pull-up when the pull-up time reaches the set time, jump to the step of acquiring the temperature sampling voltage, and repeat the above steps.

[0048] In one embodiment of the present invention, it further includes a display module 600, which is used to display the output results. The display module can be a display screen. When there is an open circuit fault in the temperature sampling circuit, the fault is displayed on the display screen so that the staff can know the location of the fault and sample the temperature in a timely manner.

[0049] In one embodiment of the present invention, the invention further includes an alarm module 700, which is used to trigger a fault alarm. While the processing module outputs the fault result (i.e., the result of the first branch or the second branch being open, or the result of the third branch being open), it sends a start command to the alarm module, causing the alarm module to sound an alarm to prompt personnel to perform timely maintenance and inspection. The alarm module can be an audible and visual alarm.

[0050] In one embodiment of the present invention, the device further includes a pull-down module 800, which is used to perform a pull-down operation.

[0051] A storage medium disposed within an electronic device, having stored processor-readable instructions thereon, wherein when the processor executes the readable instructions, the electronic device executes the temperature sampling circuit of the monitoring chip.

[0052] An electronic device includes: one or more processors and a storage device, the storage device being used to store one or more programs, which, when executed by the one or more processors, cause the electronic device to implement a method for a temperature sampling circuit of a monitoring chip.

[0053] The specific working process of this invention is as follows: A 1-second task cycle is set, and the voltage value Vgpio of the temperature acquisition line is read periodically. After acquiring the temperature sample Vgpio, an upper and lower limit is determined for the voltage value. Figure 4 When the first branch is open-circuited, the ground wire is disconnected, and the temperature sampling line is essentially directly connected to the power supply. The temperature voltage value is very large, close to the 3.3V reference voltage. At this time, the temperature sampling voltage will be greater than the specified first threshold.

[0054] when Figure 4 When an open circuit occurs on the second branch, the temperature and voltage values ​​collected will be close to the actual values ​​because there is a capacitor under the second branch. The threshold method mentioned above cannot detect this during the current temperature sampling voltage acquisition cycle. However, when the chip internally pulls the capacitor up via a pull-up module, the 5V current source charges the capacitor. After the preset charging time, the capacitor is fully charged, and the voltage across it is nearly 5V. At this point, the pull-up current source is disconnected. Because the capacitor has no way to discharge, the voltage acquired in the next monitoring cycle will be greater than the first threshold.

[0055] when Figure 4 When the third branch is open, the sampling line is essentially directly connected to V- (ground), and the temperature sampling voltage is very small, close to 0. At this time, the temperature sampling voltage is less than the specified second threshold.

[0056] Therefore, when the temperature sampling voltage is greater than the first threshold, the open circuit location can be presumed to be in the first or second branch, and the fault result is output: the first or second branch is open. Workers can then troubleshoot and repair the circuit based on the reported fault location. When the temperature sampling voltage is less than the second threshold, the open circuit location can be presumed to be in the third branch, and the fault result is output: the third branch is open.

[0057] Please see Figure 4 The pull-up and pull-down modules of the present invention include four current sources: a first current source 4, a second current source 5, a third current source 6, and a fourth current source 7. The first current source 4 and the fourth current source 7 are connected in series via a first switch S1 and a third switch S3, and the second current source 5 and the third current source 6 are connected in series via a second switch S2 and a fourth switch S4.

[0058] Specifically, the first switch S1 is linked with the second switch S2, and the third switch S3 is linked with the fourth switch S4. That is, the first current source 4 and the second current source 5 are used together, and the third current source 6 and the fourth current source 7 are used together to realize the pull-up and pull-down of relevant voltages inside the chip. At most one of the first switch (or the second switch) and the third switch (or the fourth switch) can be in the on state, that is, they cannot be on at the same time.

[0059] The method for monitoring the temperature sampling circuit of the chip in this invention only requires determining whether the temperature sampling voltage is within a set range, and only requires one pull-up operation. Therefore, the process is simple and the detection time is short. Thus, this invention effectively overcomes some practical problems in the prior art, and therefore has high utilization value and practical significance.

[0060] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for monitoring a temperature sampling circuit of a chip, characterized in that, The method comprises: acquiring a temperature sampling voltage; judging whether the temperature sampling voltage is within a set interval; when the temperature sampling voltage is within the set interval, pulling up the inside of a chip; when the pulling up duration reaches a set duration, ending the pulling up and jumping to the step of acquiring the temperature sampling voltage; wherein the set interval is less than or equal to a first threshold and greater than or equal to a second threshold; the temperature sampling circuit comprises a first branch, a second branch and a third branch, a capacitor is arranged between the first branch and the second branch, and the step of judging whether the temperature sampling voltage is within the set interval comprises: judging whether the temperature sampling voltage is greater than the first threshold; if yes, outputting a result of the first branch or the second branch being open; if no, judging whether the temperature sampling voltage is less than the second threshold; if yes, outputting a result of the third branch being open; if no, the temperature sampling voltage is within the set interval.

2. The method for monitoring temperature sampling circuit of a chip according to claim 1, wherein, when the result of the first branch or the second branch being open or the result of the third branch being open is outputted, fault alarm is performed.

3. The method for monitoring temperature sampling circuit of a chip according to claim 1, wherein, the pulling up duration is 10-20 ms.

4. An apparatus for monitoring a temperature sampling circuit of a chip, the apparatus being configured to implement the method of any one of claims 1 to 3, characterized in that The method comprises: a voltage acquiring module for acquiring a temperature sampling voltage; a processing module for judging whether the temperature sampling voltage is within a set interval; a pulling up module for pulling up the inside of a chip when the temperature sampling voltage is within the set interval; an output module for outputting a result; a delay module for ending the pulling up when the pulling up duration reaches a set duration and continuing to execute the voltage acquiring module.

5. The apparatus for monitoring temperature sampling circuits of a chip according to claim 4, wherein, The method further comprises: a display module for displaying the output result.

6. The apparatus for monitoring temperature sampling circuits of a chip of claim 4, wherein, The method further comprises: an alarm module for performing fault alarm.

7. A storage medium disposed in an electronic device, comprising: A processor readable instruction is stored on the electronic device, and when the readable instruction is executed by a processor, the electronic device performs the method for monitoring a temperature sampling circuit of a chip according to any one of claims 1-3.

8. An electronic device, comprising: The electronic device comprises: one or more processors and a storage device for storing one or more programs, when the one or more programs are executed by the one or more processors, the electronic device implements the method for monitoring a temperature sampling circuit of a chip according to any one of claims 1-3.

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