Mounting Equipment Testing Method Based on Surface Pressure and Position Accuracy Testing

Abstract

The present invention discloses a testing method for a mounting device based on surface pressure and position accuracy testing, which includes: Step 1: Build a testing platform, which includes impact force testing and position testing; Step 2: Perform impact force testing: Perform surface pressure and impact force testing on the components to be tested of a single module; Step 3: Perform position testing: Perform position testing on the components to be tested after the impact force testing, and calculate the CPK and CMK of the size and position accuracy of the components to be tested; Step 4: The testing of a single module is completed; and a test report of this single module is issued and saved, and it is checked whether it meets the requirements; Step 5: Repeat the process of the above Step 2 - Step 4 until all other modules are completed with testing. Through the above solution, the present application combines the traditional high-precision two-dimensional element and the dynamic pressure testing instrument into one, realizing that a single machine can perform pressure testing and position accuracy testing at the same time, achieving a further breakthrough in the convenience of technology use.

Description

Technical Field

[0001] The present invention relates to the technical field of test instruments for precision mounting equipment, and specifically to an integrated test method for CPK and CMK of precision mounting equipment based on surface pressure and position accuracy testing. Background Art

[0002] Currently, the pace of development of current electronic products towards lightweight and integrated designs is accelerating, and electronic components and parts are becoming increasingly miniaturized. Miniaturization and high integration have put forward higher requirements for various indicators of precision equipment in the manufacturing process. The controllability of the manufacturing process of precision equipment (SMT (Surface Mounting Technology), SIP (System In a Package), semiconductors) and the reliability of long-term use will seriously affect production efficiency and the benefits of enterprises. For example: as electronic components become smaller and chip density increases, silicon wafers and devices are becoming more fragile and more sensitive to stress. In semiconductor and SMT processing, it is necessary to accurately and precisely control the mounting pressure. Therefore, there is a widespread need in the semiconductor and electronics manufacturing industries to inspect and adjust the pressure state and pressure accuracy of high-sensitivity / micro-pressure equipment, which is mainly used for pressure inspection, status monitoring, performance evaluation of precision mounting equipment, and status adjustment after maintenance of the above equipment.

[0003] Currently, for the automatic test equipment (ATE) of precision equipment, it is generally existing general equipment. Users input the corresponding test sequences into a computer for control testing, which is semi-automatic. Moreover, due to the lack of association between the existing automatic test equipment and precision equipment, the time required for testing increases, affecting the efficiency of the production line. Summary of the Invention

[0004] A brief overview of the embodiments of the present invention is given below to provide a basic understanding of certain aspects of the present invention. It should be understood that the following overview is not an exhaustive overview of the present invention. It is not intended to identify the key or important parts of the present invention, nor is it intended to limit the scope of the present invention. Its purpose is merely to present certain concepts in a simplified form as a prelude to the more detailed description to follow.

[0005] According to one aspect of the present application, the present invention provides a test method for a mounting device based on surface pressure and position accuracy testing, including:

[0006] Step 1: Build a test platform, which includes impact force testing and position testing;

[0007] Step 2: Perform impact force test: Conduct surface pressure and impact force tests on the components to be tested of a single module;

[0008] Step 3: Perform position test: Conduct position tests on the components to be tested after the impact force test, and calculate the CPK and CMK of the size and position accuracy of the components to be tested;

[0009] Step 4: The test of a single module is completed; and a test report of this single module is issued and saved, and check whether it meets the requirements;

[0010] Step 5: Repeat the process of the above Step 2 - Step 4 until all other modules are completely tested.

[0011] Furthermore, in the above Step 2, when performing the impact force test, specifically, through a data acquisition card and a pressure sensor array, execute the program according to the preset test requirements, and calculate the corresponding result parameters.

[0012] Furthermore, in the above Step 3, when calculating the CPK and CMK of the size and position accuracy of the components to be tested, it is measured by a large area array CMOS camera in a static measurement method and on the same level as a high-precision microscope scale.

[0013] Among them, the above Step 2 specifically includes the following processes:

[0014] Process 1: Adjust the state of the placement machine to be tested;

[0015] Process 2: Make a program for executing the preset test requirements: The placement program pattern uses a triangle or a rectangle, the number of placement times is the number of nozzles * 25 components, and place them in sequence; during the placement process, it is not allowed to discard components and refill; the device height setting is the same as that of the incoming material to be tested;

[0016] Process 3: Adjust the placement data: Load the components on the placement machine, pay attention that the device thickness is the same as the program setting; place the test instrument in the PCB board track; adjust the nozzle height according to the size of the test instrument so that the height from the nozzle to the test area of the test instrument is the same as the height to the PCB board during normal operation; input the number of nozzles and the number of placement times, which is the same as the placement machine setting;

[0017] Process 4: Start the software and start recording data, and at the same time the placement machine starts to work; after the placement machine finishes placing components, the tester saves the pressure data.

[0018] Further, the CPK and CMK calculations for the size and position accuracy of the device under test in step 3 specifically include the following process: Move the test instrument to the center of the coordinate measuring instrument, and use a three-dimensional device or a third-party detection device to measure the equipment accuracy: 0.001 - 0.003 mm, and measure and record the values. Use Minitab Capability Sixpack for calculation; if Cpk ≥ 1.33, the result is qualified.

[0019] Further, the test platform includes impact force testing and position testing. Specifically, the test platform includes a mechanized test platform and a data acquisition system. The mechanized test platform includes a test bench and an impact force testing unit placed on the test bench. The data acquisition system includes a large area array CMOS camera, a high-precision microscope scale, a data acquisition card, and a computer. The computer is used to process the data collected by the large area array CMOS camera, the high-precision microscope scale, and the data acquisition card, and perform surface pressure and impact force testing, typical component testing and analysis, and stress analysis.

[0020] Further, the impact force testing unit includes an impact force testing area installed on the test bench. The upper part of the impact force testing area is used to place the device under test, and a pressure sensor array is provided below the impact force testing area. The pressure sensor array establishes a communication connection with the data acquisition card.

[0021] Further, the pressure sensor array includes one or more highly sensitive dynamic pressure sensors.

[0022] Further, the data acquisition card is implemented by a 4 - 8 channel analog-to-digital acquisition card, and the 4 - 8 channel analog-to-digital acquisition card is a high-speed analog-to-digital acquisition card with a frequency greater than 1000 HZ.

[0023] Further, the large area array CMOS camera has 50 million - 100 million pixels.

[0024] Through the above solution, this application combines the traditional high-precision two-dimensional instrument with a dynamic pressure (impact force) test instrument into one, realizing the simultaneous pressure testing and position accuracy testing on one machine, and can achieve further breakthroughs in the convenience of technical use. At the same time, the newly designed instrument in this application is small, convenient to move and execute, and has a good software interface, which will greatly shorten the time for enterprises to test this project. In summary, the CPK and CMK integrated tester for precision mounting equipment developed in this application is a precision equipment for inspecting the state of high-sensitivity / micro-pressure equipment, and can be widely used in fields such as semiconductors, SMT chip mounting, solar equipment manufacturing, precision device packaging, and military industry. Specific embodiments

[0025] The embodiments of the present invention will be described below. In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0026] The field developed by this application is the intelligent manufacturing equipment field that China is currently focusing on breaking through. The technology market has been monopolized by German and Japanese companies for nearly 50 years. The successful development of this integrated test equipment will play a positive role in the improvement of China's industry. In terms of the standardization of equipment acceptance indicators and equipment maintenance, the project can output standardized test methods and test instruments. The standards and test instruments generated by this application can also be used as training instruments and systems for various professional colleges and universities.

[0027] The instrument currently developed by this application integrates various means such as optoelectronics, vision, impact force, and pressure, which can fill the domestic gap in the current field. In the field involved in this application, the global technology leader is the CETIQ instrument of Germany. The instrument model FMB-04 developed by its company is designated for use by equipment manufacturers. However, due to its high price and inconvenient service, it cannot be widely promoted. Moreover, this instrument only performs surface pressure testing and does not have the measurement and calibration of XYQ accuracy.

[0028] For surface pressure testing and XYQ position accuracy testing, the existing technology operation solution is to test in Workshop A for impact force accuracy and maintain the current situation; then take the test board to Workshop B to measure the position accuracy, resulting in an increase in the time required for testing and affecting the efficiency of the production line.

[0029] The main objectives of the precision mounting equipment CPK (Process Capability Index), CMK (CMK, Machine Capability Index), and integrated tester developed by this application are to complete the pressure testing and position accuracy testing of precision mounting equipment in the semiconductor and SMT industries under high-speed working conditions. On the one hand, it completes the impact force testing of components and substrates, and on the other hand, it measures and evaluates the accuracy of position coordinates at the same time, so as to output a complete operation status report of the precision mounting equipment at one time, ensuring that the stress and accuracy of the precision mounting equipment are in a controllable state and guaranteeing the reliability and accuracy of mounting.

[0030] Specifically, the present invention provides an integrated testing device for a precision mounting device that can simultaneously perform pressure testing and position accuracy testing, including a mechanical testing platform and a data acquisition system.

[0031] The mechanical testing platform includes a test bench and an impact force testing unit placed on the test bench. The impact force testing unit includes an impact force testing area installed on the test bench. The upper part of the impact force testing area is used to place the components to be tested. A pressure sensor array is provided below the impact force testing area. The pressure sensor array establishes a communication connection with a data acquisition card. Of course, the impact force testing unit also includes an impact device for performing impact force testing on the components to be tested placed in the upper part of the impact force testing area. Among them, the pressure sensor array includes one or more highly sensitive dynamic pressure sensors.

[0032] The data acquisition system includes a large area array CMOS camera, a highly accurate microscope scale, a data acquisition card, and a computer. The computer is used to process the data collected by the large area array CMOS camera, the highly accurate microscope scale, and the data acquisition card, and perform surface pressure and impact force testing, typical component testing and analysis, and stress analysis. Among them, the impact force testing unit realizes pressure testing, and the large area array CMOS camera, the highly accurate microscope scale, and the data acquisition card realize position accuracy testing, so that a single machine can simultaneously perform pressure testing and position accuracy testing, greatly facilitating the testing performance, shortening the testing time, and improving the efficiency of the production line.

[0033] As a feasible solution, the impact force testing area is designed to be 80*80 mm, on which 600 tiny components to be tested can be mounted. The impact device is used to perform impact testing on the components to be tested in this area. The pressure sensor array collects the pressure and sends it to the computer through the data acquisition card for processing, and generates an impact force testing report. The pressure sensor array can be provided with one or more pressure sensors.

[0034] In this embodiment, the data acquisition card is implemented by a 4-8 channel analog-to-digital acquisition card, and the 4-8 channel analog-to-digital acquisition card is a high-speed analog-to-digital acquisition card with a frequency greater than 1000 HZ. The large area array CMOS camera meets 50 million - 100 million pixels.

[0035] The present invention also provides an integrated testing method for a precision mounting device, including:

[0036] Step 1: Perform surface pressure and impact force testing on the components to be tested of a single module; through the data acquisition card and the pressure sensor array, execute the program according to the preset test requirements, and calculate the corresponding result parameters;

[0037] Step 2: Calculate the CPK and CMK of the size and position accuracy of the components to be tested in Step 1, which can be measured by a 2.5D measuring instrument.

[0038] Step 3: The testing of a single module is completed; a test report of this single module is issued and saved, and it is checked whether it meets the requirements; the time taken for a single module is approximately 3.5 - 6 hours.

[0039] Step 4: Repeat the process of the above Step 1 - Step 3 until all other modules are completely tested.

[0040] Specifically, in the testing of a single module, all tests can be performed, or random selection tests can be carried out. When performing random selection tests, multiple parts of the same type are first divided into multiple groups of parts; after the surface mount equipment completes the mounting of multiple parts, at least one part is selected from each group of parts for testing.

[0041] Among them, Step 1 specifically includes the following process:

[0042] Process 1: The mounter to be tested is adjusted to the proper state (it is recommended to use a new mounting head, a new nozzle, the flatness of the track is adjusted OK, and a new feeder).

[0043] Process 2: Make a preset test requirement execution program: The mounting program pattern is a triangle or a rectangle, the number of mounting times is the number of nozzles * 25 devices, and they are mounted in sequence; during the mounting process, no component dropping and component replenishment are allowed; the device height setting is the same as that of the incoming material to be tested.

[0044] Process 3: Adjust the placement data: Load the components onto the mounter, and pay attention that the thickness of the device is the same as the program setting; place the test instrument into the PCB board track; adjust the height of the nozzle according to the size of the test instrument so that the height from the nozzle to the test area of the test instrument is the same as the height to the PCB board during normal operation (the thickness of the PCB board on the mounter is set to 2MM); input the number of nozzles and the number of mounting times, which is the same as the mounter setting (for example, for NXT H24, input 24 for the number of nozzles and 600 for the number of mounting times for testing; for Panasonic D3, input 16 for the number of nozzles and 400 for the number of mounting times for testing).

[0045] Process 4: Start the software and start recording data, and at the same time the mounter starts to work; after the mounter finishes placing components, the tester saves the pressure data.

[0046] For the calculation of CPK and CMK of the size and position accuracy of the components to be tested in Step 2, it specifically includes the following process: Move the test instrument to the center of the coordinate measuring instrument, and use a three - coordinate measuring device or a third - party inspection device to measure the device accuracy: 0.001 - 0.003mm, measure and record the values. Use Minitab Capability Sixpack for calculation; Cpk ≥ 1.33, and the result is qualified.

[0047] This application is an integrated innovation that combines traditional high-precision two-dimensional elements with dynamic pressure (impact force) testing instruments into one. It is expected to achieve further breakthroughs in the convenience of technology use. At the same time, the newly designed instrument is small, convenient to move and execute, and has a good software interface, which will greatly shorten the time for enterprises to test this project. It is estimated that the testing time of a single device will be reduced from 24 hours of traditional foreign devices to 15 minutes.

[0048] In addition, the method of the present invention is not limited to being executed in the chronological order described in the specification, and can also be executed in other chronological orders, in parallel or independently. Therefore, the execution order of the method described in this specification does not limit the technical scope of the present invention.

[0049] Although the present invention has been disclosed above through the description of specific embodiments of the present invention, it should be understood that all the above embodiments and examples are exemplary, not restrictive. Those skilled in the art can design various modifications, improvements or equivalents to the present invention within the spirit and scope of the appended claims. These modifications, improvements or equivalents should also be considered to be included within the protection scope of the present invention.

Claims

1. A method for testing a mounting device based on surface pressure and position accuracy testing, characterized in that: Including: Step 1: Build a test platform, which includes impact force testing and position testing; Step 2: Perform impact force testing: Conduct surface pressure and impact force testing on the components to be tested of a single module; This step 2 specifically includes the following processes: Process 1: Adjust the placement machine to be tested to the proper state; Process 2: Make a preset test requirement execution program: The placement program pattern is a triangle or a rectangle, the number of placement times is the number of nozzles * 25 components, and place them in sequence; During the placement process, no component rejection or replenishment is allowed; The device height setting is the same as that of the incoming material to be tested; Process 3: Adjust the placement data: Load the components onto the placement machine, and the device thickness is the same as the program setting; Place the test instrument into the PCB board track; Adjust the nozzle height according to the size of the test instrument so that the height from the nozzle to the test area of the test instrument is the same as the height to the PCB board during normal operation; Input the number of nozzles and the number of placement times, which is the same as the placement machine setting; Process 4: Start the software and begin to record data, and at the same time the placement machine starts to work; After the placement machine finishes placing components, the tester saves the pressure data; Step 3: Perform position testing: Conduct position testing on the components to be tested after the impact force testing, and calculate the CPK and CMK of the size and position accuracy of the components to be tested; Step 4: The testing of a single module is completed; Issue and save the test report of this single module, and check whether it meets the requirements; Step 5: Repeat the processes of step 2 - step 4 above until all other modules are completely tested.

2. The method for testing a placement device based on surface pressure and position accuracy testing according to claim 1, wherein: In step 2, the impact force testing is specifically carried out through a data acquisition card and a pressure sensor array, and according to the preset test requirement execution program, the corresponding result parameters are calculated.

3. The method for testing a mounting device based on surface pressure and position accuracy testing according to claim 1, characterized in that: In step 3, the calculation of CPK and CMK for the size and position accuracy of the components to be tested is carried out by a large area array CMOS camera in a static measurement mode, and is measured on the same level as a high-precision microscope scale.

4. The method for testing a placement device based on surface pressure and position accuracy testing according to claim 1, characterized in that: The calculation of CPK and CMK for the size and position accuracy of the components to be tested in step 3 specifically includes the following processes: Move the test instrument to the center of the coordinate measuring instrument, use a three-coordinate device or a third-party detection device, and the measurement accuracy of the device is 0.001 - 0.003 mm, measure and record the values; Use Minitab Capability Sixpack for calculation; Cpk ≥ 1.33, and the result is qualified.

5. The method for testing a mounting device based on surface pressure and position accuracy testing according to claim 1, characterized in that: The test platform includes impact force testing and position testing. Specifically, the test platform includes a mechanical test platform and a data acquisition system. The mechanical test platform includes a test bench and an impact force testing unit placed on the test bench. The data acquisition system includes a large area array CMOS camera, a high-precision microscope scale, a data acquisition card, and a computer. The computer is used to process the data collected by the large area array CMOS camera, the high-precision microscope scale, and the data acquisition card, and perform surface pressure and impact force testing, typical component test analysis, and stress analysis.

6. The method for testing a mounting device based on surface pressure and position accuracy testing according to claim 5, wherein: The impact force testing unit includes an impact force testing area installed on the test bench. The upper part of the impact force testing area is used to place the device under test, and a pressure sensor array is provided below the impact force testing area. The pressure sensor array is communicatively connected to the data acquisition card.

7. The method for testing a placement device based on surface pressure and position accuracy testing according to claim 6, characterized in that: The pressure sensor array includes one or more highly sensitive dynamic pressure sensors.

8. The method for testing a mounting device based on surface pressure and position accuracy testing according to claim 5, characterized in that: The data acquisition card is implemented by a 4-8 channel analog-to-digital acquisition card, and the 4-8 channel analog-to-digital acquisition card is a high-speed analog-to-digital acquisition card with a frequency greater than 1000HZ.

9. The method for testing a mounting device based on surface pressure and position accuracy testing according to claim 5, characterized in that: The large area array CMOS camera meets the requirement of 50 million - 100 million pixels.