Fully automatic clip assembly method for triodes

Abstract

The application provides a full-automatic triode CLIP assembling method, which comprises the following steps: S1, framework feeding; S2, framework dispensing; S3, chip pasting; S4, chip dispensing; S5, jumper installation; and S6, material collecting, wherein the discharging frame, the dispensing mechanism, the die bonding mechanism, the wafer combining mechanism and the material collecting mechanism are arranged along the conveying track, the dispensing, the die bonding and the jumper installation and other packaging processes can be completed during the movement of the framework along the conveying track, the waiting time of each station is effectively reduced, the work efficiency is improved, meanwhile, the packaging quality is guaranteed, and full-automatic production is realized.

Description

[0001] This application is a divisional application of application number 202111674902X, with an application date of December 31, 2021, and the invention name of "Full-automatic Triode CLIP Assembly Line and Method". TECHNICAL FIELD

[0002] The present application relates to the field of semiconductor packaging, and in particular to a full-automatic triode CLIP assembly line. BACKGROUND

[0003] At present, the semiconductor industry is developing rapidly, and the semiconductor packaging technology is also developing towards small size, narrow pitch and fast heat dissipation. From the development trend of various packaging forms, the development trend of leadless packaging is better than that of leaded packaging, so in the production of semiconductors, most enterprises try to change the soldering method of the chip upper surface from lead bonding to ClipBond (chip bonding) to improve the production efficiency of products, reduce the manufacturing cost, and at the same time solve the problems of virtual welding and neck fracture of lead soldering to improve the product quality. In the packaging process of triodes, in the traditional technology, it is generally completed independently in multiple processes, which causes the transfer cycle and the waiting time of each station to be too long, the production efficiency to be low, and the waste of human resources to be increased. At the same time, multiple processes make the packaging of triodes have more quality risks, and the quality of products cannot be guaranteed. SUMMARY

[0004] The technical problem to be solved by the present application is that in the traditional technology, the packaging process of triodes is generally completed independently in multiple processes, which causes the transfer cycle and the waiting time of each station to be too long, the production efficiency to be low, and the waste of human resources to be increased. At the same time, multiple processes make the packaging of triodes have more quality risks, and the quality of products cannot be guaranteed. The present application provides a full-automatic triode CLIP assembly line to solve the above problems.

[0005] The technical solution adopted by this invention to solve its technical problem is: a fully automatic transistor CLIP assembly line, including a conveyor rail, a feeding rack, a picking arm, and a dispensing mechanism, a die bonding mechanism, a wafer assembly mechanism, and a receiving mechanism arranged along the conveyor rail. The feeding rack holds frames to be packaged. The picking arm can move between the feeding rack and the conveyor rail, transferring the frames from the feeding rack to the conveyor rail. A guide rail parallel to the conveyor rail is provided on one side of the conveyor rail. A voice coil motor capable of moving along the guide rail is mounted on the guide rail. The voice coil motor is equipped with a... The system includes a clamping mechanism for holding the frame; a die bonding mechanism for removing the chip from the blue film on the wafer and mounting it onto the frame; a dispensing mechanism including a frame dispensing mechanism and a chip dispensing mechanism, wherein the frame dispensing mechanism is used to dispense adhesive onto the frame on the transport rail, and the chip dispensing mechanism is used to dispense adhesive onto the chip mounted on the frame; a wafer assembly mechanism for punching strip sheets into jumpers and mounting the jumpers onto the glued chips; and a receiving mechanism for filling the frames with the mounted chips and jumpers into material boxes and arranging multiple full material boxes on a receiving rack.

[0006] Furthermore: the clamping mechanism includes a clamping cylinder and two clamping plates. The cylinder body of the clamping cylinder is fixedly mounted on the voice coil motor. The two clamping plates are symmetrically arranged on the clamping cylinder. The clamping cylinder drives the two clamping plates to move in opposite directions along the vertical direction.

[0007] Furthermore, the die bonding mechanism includes a die-expanding disk for placing the blue film on the wafer and a first robotic arm for picking up and placing the chip. The first robotic arm is equipped with a chip-picking nozzle, which can pick up the chip on the blue film on the wafer and install it onto the frame.

[0008] Furthermore: the frame dispensing mechanism is disposed between the material feeder and the die bonding mechanism, and the chip dispensing mechanism is disposed between the die bonding mechanism and the wafer bonding mechanism. Both the frame dispensing mechanism and the chip dispensing mechanism include two dispensing cylinders.

[0009] Further: The sheet-forming mechanism includes a feeding rail, a second robotic arm, and a drive motor. The feeding rail conveys the strip-shaped sheet, and a punch is provided at the end of the feeding rail. The drive motor is located below the feeding rail, and a traction wheel is provided on the output shaft of the drive motor. The axis of rotation of the traction wheel is arranged horizontally and perpendicular to the feeding rail. The strip-shaped sheet is provided with several traction grooves. The traction wheel is provided with traction teeth along its circumference that cooperate with the traction grooves. The traction teeth are inserted into the traction grooves. The rotation of the traction wheel can drive the strip-shaped sheet to move towards the punch. The punch can punch the strip-shaped sheet into the jumper wire. The upper plate of the punch is provided with a material picking hole. The second robotic arm can move between the material picking hole and the conveying rail and transfer the jumper wire in the material picking hole to the conveying rail.

[0010] Furthermore: the receiving mechanism includes forks, a support, and a conveyor belt disposed below the receiving rack. Several material boxes are arranged on the conveyor belt; several compartments are arranged vertically in each material box. The forks are mounted on the support via a vertical adjustment mechanism, and the support is mounted on a fixed frame via a horizontal adjustment mechanism. The forks hold the material boxes and move vertically and horizontally under the drive of the vertical and horizontal adjustment mechanisms. The conveyor belt, the conveyor rail, and the receiving rack are all arranged on the movement trajectory of the forks.

[0011] Further: The vertical adjustment mechanism includes a first guide rail, a first lead screw, a first slider, and a first motor. The first guide rail is vertically mounted on the bracket. The first lead screw is rotatably mounted on the bracket in the vertical direction. The first slider is mounted on the first lead screw and slidably mounted on the first guide rail. The forks are fixedly mounted on the first slider. The first motor is fixedly mounted on the bracket. A first drive wheel is mounted on the output shaft of the first motor. A first driven wheel is mounted on the top of the first lead screw. The first driven wheel and the first drive wheel are connected by a belt.

[0012] Further: The horizontal adjustment mechanism includes a second guide rail, a second lead screw, a second slider, and a second motor. The second guide rail is arranged horizontally on the frame and perpendicular to the conveyor rail. The second lead screw is rotatably mounted on the frame and parallel to the second guide rail. The second slider is mounted on the second lead screw and slidably disposed on the second guide rail. The bracket is fixedly mounted on the second slider. The second motor is fixedly mounted on the frame. A second drive wheel is mounted on the output shaft of the second motor. A second driven wheel is mounted on one end of the second lead screw. The second driven wheel and the second drive wheel are connected by a belt.

[0013] Furthermore, a pressure roller is provided on the side of the conveyor rail away from the guide rail, and the pressure roller presses the frame tightly onto the conveyor rail; the die bonding mechanism, the dispensing mechanism and the lamination mechanism are all equipped with optical inspection devices.

[0014] This invention also relates to a fully automated method for assembling transistor clips, comprising the following steps:

[0015] S1 Frame loading, the picking arm moves to the discharge rack and transfers the frame on the discharge rack to the conveyor rail, the clamping cylinder drives the two clamping plates to clamp the frame, and the voice coil motor drives the frame to move along the conveyor rail;

[0016] S2 Frame Dispensing: The frame moves to the position of the frame dispensing mechanism, and the two dispensing cylinders of the frame dispensing mechanism perform dispensing operations on the frame.

[0017] S3 chip bonding: The frame with glue applied moves to the die bonding mechanism position, the first robotic arm moves, and drives the chip pick-up nozzle to remove the chip from the blue film on the wafer and install it onto the frame where glue has been applied.

[0018] S4 chip dispensing: The frame with the chip installed moves to the position of the chip dispensing mechanism, and the two dispensing tubes of the chip dispensing mechanism perform dispensing operations on the chip installed on the frame.

[0019] S5 jumper installation: The frame moves to the assembly mechanism position, and the second robotic arm installs the punched jumper onto the chip with applied adhesive.

[0020] S6 Receiving Material: The forks move the material box to the end of the conveyor rail. The clamping cylinder releases the frame. The voice coil motor drives the clamping cylinder to move in the opposite direction, causing the clamping plate to move to the rear of the frame. The clamping cylinder drives the two clamping plates to clamp together. The voice coil motor drives the clamping cylinder to move in the forward direction. The clamping plate pushes the frame into the material box. The full material box is conveyed to the receiving rack.

[0021] The beneficial effects of this invention are that the fully automatic transistor CLIP assembly line of this invention, by setting up a material feeding rack, dispensing mechanism, die bonding mechanism, wafer assembly mechanism and receiving mechanism along the conveyor rail, completes the packaging processes such as dispensing, die bonding and jumper wire installation while the frame moves along the conveyor rail, effectively reducing the waiting time of each station, improving work efficiency, and ensuring packaging quality, thus realizing fully automated production. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Figure 1This is a schematic diagram of the fully automated transistor CLIP assembly line of the present invention;

[0024] Figure 2 This is a structural diagram of the discharge rack and conveyor rail;

[0025] Figure 3 This is a schematic diagram of the clamping mechanism;

[0026] Figure 4 This is a schematic diagram of the die-bonding mechanism;

[0027] Figure 5 This is a schematic diagram of the dispensing mechanism;

[0028] Figure 6 This is a schematic diagram of the assembly mechanism;

[0029] Figure 7 This is a schematic diagram of a structure where a traction wheel drives a strip of material to move.

[0030] Figure 8 This is a schematic diagram of the traction groove on the strip material;

[0031] Figure 9 This is a schematic diagram of the material receiving mechanism;

[0032] Figure 10 This is a schematic diagram of the fork installation structure;

[0033] Figure 11 This is a schematic diagram of the vertical adjustment mechanism and the horizontal adjustment mechanism.

[0034] In the diagram: 1. Conveyor rail; 2. Discharge rack; 20. Picking arm; 3. Dispensing mechanism; 31. Frame dispensing mechanism; 32. Chip dispensing mechanism; 33. Dispensing cylinder; 4. Die bonding mechanism; 41. Die expansion disk; 42. First robotic arm; 43. Die picking nozzle; 5. Wafer assembly mechanism; 50. Feeding rail; 51. Second robotic arm; 52. Drive motor; 54. Die; 55. Traction wheel; 56. Traction groove; 57. Traction tooth; 58. Picking hole; 6. Receiving mechanism; 60. Fork; 61. Bracket; 62. Conveyor. 63. Frame, 64. First guide rail, 65. First lead screw, 66. First slider, 67. First motor, 68. First drive wheel, 69. First driven wheel, 7. Frame, 70. Second guide rail, 71. Second lead screw, 72. Second slider, 73. Second motor, 74. Second drive wheel, 75. Second driven wheel, 8. Guide rail, 9. Voice coil motor, 10. Strip material, 11. Material box, 12. Receiving rack, 13. Clamping cylinder, 14. Clamping plate, 15. Pressure roller, 16. Optical inspection device. Detailed Implementation

[0035] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the invention, and should not be construed as limiting the invention. Rather, embodiments of the invention include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.

[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0038] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of the invention includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as will be understood by those skilled in the art to which embodiments of the invention pertain.

[0039] like Figure 1 and Figure 2As shown, this invention provides a fully automated transistor CLIP assembly line, including a conveyor rail 1, a discharge rack 2, a picking arm 20, and a dispensing mechanism 3, a die bonding mechanism 4, a lamination mechanism 5, and a receiving mechanism 6 arranged along the conveyor rail 1. A frame 7 to be packaged is placed on the discharge rack 2. The picking arm 20 can move between the discharge rack 2 and the conveyor rail 1, transferring the frame 7 from the discharge rack 2 onto the conveyor rail 1. A guide rail 8 parallel to the conveyor rail 1 is provided on one side of the conveyor rail 1. A voice coil motor 9, capable of moving along the guide rail 8, is mounted on the guide rail 8. The voice coil motor 9 is equipped with a clamping mechanism for holding the frame. The frame 7 has a clamping mechanism; the die bonding mechanism 4 is used to remove the chip from the blue film on the wafer and install it onto the frame 7; the dispensing mechanism 3 includes a frame dispensing mechanism 31 and a chip dispensing mechanism 32, the frame dispensing mechanism 31 is used to perform dispensing operation on the frame 7 on the conveyor rail 1, and the chip dispensing mechanism 32 is used to perform dispensing operation on the chip installed on the frame 7; the wafer assembly mechanism 5 is used to punch the strip sheet 10 into jumpers and install the jumpers onto the chip with dispensing; the receiving mechanism 6 is used to fill the frame 7 with the installed chip and jumpers into the material box 11 and arrange multiple full material boxes 11 on the receiving rack 12.

[0040] Combination Figure 3 As shown, the clamping mechanism includes a clamping cylinder 13 and two clamping plates 14. The cylinder body of the clamping cylinder 13 is fixedly mounted on the voice coil motor 9. The two clamping plates 14 are symmetrically arranged on the clamping cylinder 13. The clamping cylinder 13 drives the two clamping plates to move in opposite directions along the vertical direction. The clamping cylinder 13 drives the two clamping plates to clamp one end of the frame 7 from the top and bottom, so that when the voice coil motor 9 moves along the guide rail 8, the frame 7 moves along the conveyor rail 1. This clamping method is stable and reliable, and can ensure the stability of the frame 7 during the processing.

[0041] Combination Figure 4 As shown, the die bonding mechanism 4 includes a die-expanding disk 41 for placing the blue film on the wafer and a first robotic arm 42 for picking up and placing the chip. The first robotic arm 42 is equipped with a chip-picking nozzle 43, which can remove the chip from the blue film on the wafer and install it onto the frame 7. By moving the first robotic arm 42 between the transport rail 1 and the die-expanding disk 41 and picking up and placing the chip through the chip-picking nozzle 43, the die bonding operation can be automated.

[0042] Combination Figure 5As shown, the frame dispensing mechanism 31 is disposed between the material feeder 2 and the die bonding mechanism 4, and the chip dispensing mechanism 32 is disposed between the die bonding mechanism 4 and the wafer bonding mechanism 5. Both the frame dispensing mechanism 31 and the chip dispensing mechanism 32 include two dispensing cylinders 33. By setting two dispensing cylinders 33, two points or two chips on the frame 7 can be dispensed simultaneously, shortening the dispensing cycle and improving dispensing efficiency.

[0043] Combination Figure 6 , Figure 7 and Figure 8 As shown, the sheet-assembly mechanism 5 includes a feeding rail 50, a second robotic arm 51, and a drive motor 52. The feeding rail 50 conveys the strip sheet 10, and a punch 54 is provided at the end of the feeding rail 50. The drive motor 52 is located below the feeding rail 50, and a traction wheel 55 is provided on the output shaft of the drive motor 52. The axis of rotation of the traction wheel 55 is arranged horizontally and perpendicular to the feeding rail 50. The strip sheet 10 is provided with a plurality of traction grooves 56. The upper circumferentially arranged traction teeth 57 are engaged with the traction groove 56. The traction teeth 57 are inserted into the traction groove 56. The rotation of the traction wheel 55 can drive the strip material 10 to move towards the punch 54. The punch 54 can punch the strip material 10 into the jumper wire. The upper pad of the punch 54 is provided with a material picking hole 58. The second robotic arm 51 can move between the material picking hole 58 and the conveying rail 1 and transfer the jumper wire in the material picking hole 58 to the conveying rail 1.

[0044] The drive motor 52 drives the traction wheel 55 to rotate, causing the strip material 10 to move along the feeding rail 50 and enter the die 54 to be punched into jumpers. The second robotic arm 51 then removes the punched jumpers from the pick-up hole 58 and installs them onto the chip to complete the wafer assembly operation. This drive method, which uses the traction teeth 57 inserted into the traction groove 56, allows for precise control of the speed at which the strip material 10 enters the die 54 by controlling the rotation of the drive motor 52. It also has good self-locking capability, effectively maintaining the current position of the strip material 10 and preventing cross-movement that could affect the punching accuracy. At the same time, the structural design of the traction wheel 55 located below the strip material 10 prevents interference with the movement of the second robotic arm 51.

[0045] Combination Figure 9As shown, the receiving mechanism 6 includes a fork 60, a bracket 61, and a conveyor belt 62 disposed below the receiving rack 12. A plurality of material boxes 11 are arranged on the conveyor belt 62. A plurality of compartments are arranged in the vertical direction in the material boxes 11. The fork 60 is mounted on the bracket 61 by a vertical adjustment mechanism. The bracket 61 is mounted on a fixed frame 63 by a horizontal adjustment mechanism. The fork 60 holds the material box 11 and moves vertically and horizontally under the drive of the vertical adjustment mechanism and the horizontal adjustment mechanism. The conveyor belt 62, the conveyor rail 1, and the receiving rack 12 are all arranged on the moving trajectory of the fork 60.

[0046] The fork 60 first moves the empty bin 11 to the end of the conveyor rail 1. The assembled frame 7 on the conveyor rail 1 is then loaded into the bin of the bin 11 under the drive of the clamping mechanism. Each time a frame 7 is loaded, the bin in the bin 11 moves up one grid until all bins are filled. Then the fork 60 places the filled bin 11 onto the receiving rack 12.

[0047] Combination Figure 10 and Figure 11 As shown, the vertical adjustment mechanism includes a first guide rail 64, a first lead screw 65, a first slider 66, and a first motor 67. The first guide rail 64 is vertically mounted on the bracket 61. The first lead screw 65 is rotatably mounted on the bracket 61 in the vertical direction. The first slider 66 is mounted on the first lead screw 65 and slidably mounted on the first guide rail 64. The fork 60 is fixedly mounted on the first slider 66. The first motor 67 is fixedly mounted on the bracket 61. A first drive wheel 68 is mounted on the output shaft of the first motor 67. A first driven wheel 69 is mounted on the top of the first lead screw 65. The first driven wheel 69 and the first drive wheel 68 are connected by a belt.

[0048] The horizontal adjustment mechanism includes a second guide rail 70, a second lead screw 71, a second slider 72, and a second motor 73. The second guide rail 70 is horizontally mounted on the frame 63 and perpendicular to the conveyor rail 1. The second lead screw 71 is rotatably mounted on the frame 63 and parallel to the second guide rail 70. The second slider 72 is mounted on the second lead screw 71 and slidably mounted on the second guide rail 70. The bracket 61 is fixedly mounted on the second slider 72. The second motor 73 is fixedly mounted on the frame 63. A second drive wheel 74 is mounted on the output shaft of the second motor 73. A second driven wheel 75 is mounted on one end of the second lead screw 71. The second driven wheel 75 and the second drive wheel 74 are connected by a belt.

[0049] The combination of guide rails and sliders, along with the motor drive, results in a simple, stable, and reliable drive structure. When using servo motors or stepper motors, the adjustment step size is small, allowing for high-precision control during operation. This drive method also has a certain degree of self-locking, effectively maintaining the current position of the material box 11 and preventing misalignment that could affect production. Furthermore, this drive method has high repeatability, enabling automated production.

[0050] On the conveyor rail 1, a pressure roller 15 is also provided on the side away from the guide rail 8. The pressure roller 15 presses the frame 7 firmly onto the conveyor rail 1. The die bonding mechanism 4, the dispensing mechanism 3, and the lamination mechanism 5 are all equipped with optical inspection devices 16. The pressure roller 15 can cooperate with the clamping cylinder 13 to fix the frame 7 when it moves to each station, ensuring the stability of the frame 7 during processing. The optical inspection device 16 can perform inspection after each process to detect defects in a timely manner.

[0051] A fully automated transistor clip assembly method includes the following steps:

[0052] S1 frame 7 is loaded, the picking arm 20 moves to the discharge rack 2 and transfers the frame 7 on the discharge rack 2 to the conveyor rail 1. The clamping cylinder 13 drives the two clamping plates to clamp the frame 7, and the voice coil motor 9 drives the frame 7 to move along the conveyor rail 1.

[0053] S2 Frame 7 dispensing glue, Frame 7 moves to the position of Frame Dispensing Mechanism 31, and the two dispensing tubes 33 of Frame Dispensing Mechanism 31 dispensing glue to Frame 7.

[0054] S3 chip pasting: The frame 7 with glue applied moves to the die bonding mechanism 4, the first robotic arm 42 moves, and drives the chip picker 43 to remove the chip from the blue film on the wafer and install it onto the glued position on the frame 7.

[0055] S4 chip dispensing: The frame 7 with the chip installed moves to the position of the chip dispensing mechanism 32, and the two dispensing tubes 33 of the chip dispensing mechanism 32 dispense the chip installed on the frame 7.

[0056] S5 jumper installation: Frame 7 moves to the assembly mechanism 5 position, and the second robotic arm 51 installs the punched jumper onto the chip with applied adhesive.

[0057] S6 receiving: the forks 60 move the material box 11 to the end of the conveyor rail 1, the clamping cylinder 13 releases the frame 7, the voice coil motor 9 drives the clamping cylinder 13 to move in the reverse direction, and causes the clamping plate to move to the rear of the frame 7. The clamping cylinder 13 drives the two clamping plates to clamp together, the voice coil motor 9 drives the clamping cylinder 13 to move in the forward direction, and the clamping plate pushes the frame 7 into the material box 11. The full material box 11 is conveyed to the receiving rack 12.

[0058] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0059] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A fully automated method for assembling transistor clips, characterized in that: The fully automated transistor clip assembly line includes the following steps: The S1 frame (7) is loaded, the picking arm (20) moves to the discharge rack (2) and transfers the frame (7) on the discharge rack (2) to the conveyor rail (1). The clamping cylinder (13) drives the two clamping plates to clamp the frame (7), and the voice coil motor (9) drives the frame (7) to move along the conveyor rail (1). S2 frame (7) is glued, frame (7) moves to the position of frame glue dispensing mechanism (31), and the two glue dispensing tubes (33) of frame glue dispensing mechanism (31) perform glue dispensing operation on frame (7); S3 chip pasting, the frame (7) with glue applied moves to the die bonding mechanism (4) position, the first robotic arm (42) moves, drives the chip picker (43) to take out the chip on the blue film of the wafer and install it on the frame (7) where glue has been applied; S4 chip dispensing: The frame (7) with the chip installed moves to the position of the chip dispensing mechanism (32), and the two dispensing tubes (33) of the chip dispensing mechanism (32) dispense the chip installed on the frame (7). S5 jumper installation: The frame (7) moves to the position of the assembly mechanism (5), and the second robotic arm (51) installs the punched jumper onto the chip with glue applied. S6 receiving, the forks (60) move the empty box (11) to the end of the conveyor rail (1), the clamping cylinder (13) releases the frame (7), the voice coil motor (9) drives the clamping cylinder (13) to move in the opposite direction, and the clamping plate moves to the rear of the frame (7), the clamping cylinder (13) drives the two clamping plates to clamp together, the voice coil motor (9) drives the clamping cylinder (13) to move in the forward direction, the clamping plate pushes the frame (7) into the empty box (11), and the full box (11) is conveyed to the receiving rack (12).

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