An automatic waxing machine and a waxing method thereof

Abstract

The application relates to the technical field of semiconductor indium phosphide substrate material manufacturing, and discloses an automatic wax feeding machine and a wax feeding method thereof, which comprise a reversible mechanical hand, a rotatable adsorption device, a wax feeding mechanical hand, a wax dripping device, a baking bin, a patch platform, a disk storage rack and a ceramic disk automatic taking and placing device; the reversible mechanical hand comprises a first arm part and a first gripper part; the rotatable adsorption device is installed on the first gripper part, and the rotatable adsorption device can drive the wafer to rotate around the center axis of the wafer when the wafer is adsorbed; the ceramic disk automatic taking and placing device comprises a guide rail and a disk taking mechanical hand; the application can realize the integration and automation of wafer feeding, wax dripping, wax uniformizing, baking, patching and ceramic disk taking and placing, improve production efficiency, reduce production cost and avoid scalding of workers.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor indium phosphide substrate material manufacturing, in particular to an automatic waxing machine and a waxing method thereof. Background Art

[0002] Indium phosphide substrates have an application market in the manufacture of high-frequency and high-power devices, optical fiber communications, wireless transmission, radio astronomy and other radio frequency device fields; at bandwidth levels above 100GHz, the use of indium phosphide-based radio frequency devices has obvious advantages in wireless transmission of backhaul networks and point-to-point communication networks. In the future, in 6G communication and even 7G communication wireless transmission networks, indium phosphide substrates are expected to become the mainstream substrate material for radio frequency devices; however, waxing the indium phosphide substrate wafers before the polishing process is a time-consuming and labor-intensive process.

[0003] Currently, the waxing process of indium phosphide substrate wafers is all done manually. The staff first checks the wafer information and turns on the inspection equipment. After completing the preparation, they will select the program, check the time, speed and pressure of each step, place the wafer on the vacuum suction cup, drip liquid wax, and use centrifugal force to evenly spread the liquid wax on the wafer surface. Then remove the wafer and stick it on the heated ceramic plate before waxing the next wafer. This operation is repeated many times, and the staff then moves the ceramic plate with the wafer attached to the cooling plate. The manual waxing method has problems such as low production efficiency, high production cost, and easy burns to the staff. Summary of the Invention

[0004] The purpose of the present invention is to provide an automatic waxing machine and a waxing method thereof, which can realize the integration and automation of wafer loading, wax dripping, wax spreading, baking, chip mounting, and ceramic plate taking and placing, thereby improving production efficiency, reducing production costs, and avoiding burns to workers.

[0005] In order to achieve the above-mentioned purpose, the present invention provides an automatic waxing machine, which includes a reversible manipulator, a rotatable adsorption device, a waxing manipulator, a baking bin, a patch platform, a disk storage rack and an automatic ceramic disk taking and placing device.

[0006] The reversible robot includes a first arm and a first gripper connected to the first arm; the rotatable adsorption device is used to adsorb the wafer. The rotatable adsorption device is installed on the first gripper, and the rotatable adsorption device can drive the wafer to rotate around its own central axis; the waxing robot includes a second arm and a second gripper connected to the second arm; the wax dripping device is installed on the second gripper; the baking chamber has a heating chamber, and the baking chamber has a first opening, and the first opening is used for the rotatable adsorption device to enter and exit the heating chamber; the patch platform is provided with a heating station and a cooling station; the automatic ceramic disc picking and placing device includes a guide rail and a disc picking robot; the guide rail is provided on the patch platform, and the disc picking robot reciprocates along the guide rail between the heating station and the cooling station; the disc storage rack is located on one side of the patch platform, and the disc storage rack is used to store ceramic discs. The disc picking robot can take out the ceramic disc from the disc storage rack and move it to the heating station, or move the ceramic disc from the cooling station to the disc storage rack.

[0007] Preferably, the first arm portion includes a rotating table, a first movable arm, a second movable arm, a third movable arm, a fourth movable arm and a fifth movable arm connected in sequence; the first movable arm is fixed to the top of the rotating table, and the rotating table is used to drive the first movable arm to rotate around the central axis of the rotating table. A first upper and lower movable joint is provided between the first movable arm and the second movable arm, a second upper and lower movable joint is provided between the second movable arm and the third movable arm, a vertical rotation joint is provided between the third movable arm and the fourth movable arm, and a horizontal rotation joint is provided between the fourth movable arm and the fifth movable arm; the first gripper portion is connected to the fifth movable arm.

[0008] The vertical rotation joint enables the movable arm connected to the vertical rotation joint to form an upward and downward rotation degree of freedom, the horizontal rotation joint enables the movable arm connected to the horizontal rotation joint to form a horizontal rotation degree of freedom, and the vertical rotation joint enables the movable arm connected to the vertical rotation joint to form a vertical rotation degree of freedom; the vertical rotation joint, the horizontal rotation joint and the vertical rotation joint are all existing technologies and will not be described in detail here.

[0009] The fifth movable arm can rotate around the horizontal center axis of the vertical rotation joint through the vertical rotation joint, so that the fifth movable arm can drive the first gripper part to flip 180° up and down, thereby enabling the first gripper part 12 to drive the rotatable adsorption device to flip 180° up and down.

[0010] Preferably, the first gripping part includes a first telescopic device, a support seat and a support rod, the first telescopic device is connected to the fifth movable arm, a first clamping part is fixed to the end face of the first telescopic device, the first telescopic device has a telescopic rod, and the extended end of the telescopic rod passes through the first clamping part; the support seat is connected to the extended end of the telescopic rod; one end of the support rod is connected to the support seat, and the other end of the support rod extends outward from the support seat, and the support rod is provided with a second clamping part, which is used to cooperate with the first clamping part to clamp and fix the rotatable adsorption device.

[0011] By driving the support base away from or close to the fifth movable arm through the first telescopic device, the relative distance between the first clamping part and the second clamping part can be changed accordingly, so that rotatable adsorption devices of various sizes can be clamped and fixed by the first clamping part and the second clamping part, and the application range is wide.

[0012] More preferably, the first telescopic device is one of a pneumatic cylinder, a hydraulic cylinder and an electric cylinder.

[0013] Preferably, the structure of the waxing robot is consistent with the structure of the reversible robot.

[0014] Preferably, the rotatable adsorption device includes a first base, a rotating drive member, an adsorption member and a vacuum generating member; the first base is installed on the first gripper part, the first base is provided with a first through hole, the first through hole passes through the first base from top to bottom, and the first through hole is used for passing the air pipe and the wire; the rotating drive member includes a driving motor and a first transmission member, the driving motor is fixed on the first base, and the first transmission member is arranged on the output shaft of the driving motor; the adsorption member includes a vacuum suction cup, a rotating shaft, a second through hole, and a second transmission member; the rotating shaft is arranged at the rotating shaft at the bottom center of the vacuum suction cup, the second through hole passes through the vacuum suction cup and the rotating shaft in sequence from top to bottom, the second transmission member is connected to the rotating shaft, and the second transmission member corresponds to the first transmission member; the vacuum generating member includes a rotary joint, a first connecting pipe, and a first vacuum generator; one end of the first connecting pipe is connected to the rotating shaft through the rotary joint and communicated with the second through hole, and the other end of the first connecting pipe is connected and communicated with the first vacuum generator.

[0015] More preferably, the corresponding cooperation between the first transmission member and the second transmission member is gear transmission, pulley transmission or worm gear transmission.

[0016] More preferably, there are multiple adsorption components, and the multiple adsorption components are evenly distributed above the first base, and one adsorption component adsorbs one wafer accordingly.

[0017] More preferably, there are multiple rotating driving members, and the multiple rotating driving members correspond one-to-one to the multiple adsorption members, and the rotating driving members can drive the adsorption members to rotate around their own central axes.

[0018] More preferably, there are multiple vacuum generating parts, and the vacuum generating parts correspond to the adsorption parts one by one.

[0019] Preferably, the wax dripping device includes a second base plate, a wax storage bottle, a wax dripping tube, a baffle, a solenoid valve and an air pump; the second base plate is installed on the second gripper part, and the lower surface of the second base plate has a plurality of wax dripping areas, and the plurality of wax dripping areas correspond one-to-one to the plurality of adsorbents, and one wax dripping area has a wax dripping hole. When the second base plate is located directly above the first base plate, the positions of the plurality of wax dripping holes correspond one-to-one to the positions of the second through holes of the plurality of vacuum suction cups; the wax storage bottle is provided above the second base plate; there are a plurality of wax dripping tubes, and the upper ends of the plurality of wax dripping tubes are all aligned with the wax storage bottle. The lower part of the liquid bottle is connected, and the lower ends of the multiple wax dripping tubes are connected to the multiple wax dripping holes in a one-to-one correspondence; the baffle is provided between two adjacent wax dripping areas; through the baffle, when the vacuum suction cup drives the chip to rotate, the excess wax thrown out from the surface of the chip can be blocked to avoid splashing onto the surface of other wafers being waxed; the solenoid valve corresponds to the wax dripping tube one-to-one, and the solenoid valve is arranged at the connection between the wax dripping tube and the wax liquid storage bottle; the air pump is connected to the wax liquid storage bottle, and the connection between the air pump and the wax liquid storage bottle is located above the connection between the wax dripping tube and the wax liquid storage bottle.

[0020] Preferably, the wax dripping tube is a hard tube, and the wax storage bottle is fixed above the second base plate through the wax dripping tube.

[0021] More preferably, the vacuum suction cups are distributed in a circular array above the first base; multiple baffles are fixed in a hub shape on the lower surface of the second base, so that multiple wax dripping areas are distributed in a circular array on the lower surface of the second base and correspond one-to-one to the vacuum suction cups.

[0022] Preferably, the baking chamber is a hot nitrogen chamber, as nitrogen has good stability and a hot nitrogen chamber has a good baking effect.

[0023] Preferably, the disk storage rack includes a frame and a lifter; the frame is provided with a plurality of ceramic disk placement slots, and the plurality of ceramic disk placement slots are evenly arranged from top to bottom; the lifter is connected to the frame, and the lifter is used to drive the frame to rise or fall in the vertical direction.

[0024] More preferably, the lifter is one of a pneumatic cylinder, a hydraulic cylinder and an electric cylinder, and the output end of the lifter is fixedly connected to the lower end of the frame.

[0025] Preferably, the disc retrieval robot includes a rotating motor, a second telescopic device and a disc retrieval device; the second telescopic device is fixed to the output end of the rotating motor, and the rotating motor is used to drive the second telescopic device to rotate around the vertical center axis of the rotating motor, and the disc retrieval device is fixed to the output end of the second telescopic device, and the second telescopic device is used to drive the disc retrieval device to move away from or closer to the rotating motor in the horizontal direction.

[0026] More preferably, the rotating motor is a motor with a cam divider

[0027] More preferably, the second telescopic device is one of a pneumatic cylinder, a hydraulic cylinder and an electric cylinder.

[0028] More preferably, a U-shaped groove is provided at one end of the disc remover, the inner diameter E of the U-shaped groove is greater than or equal to the outer diameter D of the ceramic disc, and an adsorption hole is provided at the center of the inner bottom of the U-shaped groove, and the adsorption hole is connected and communicated with the second vacuum generator through a second connecting pipe.

[0029] The automatic waxing machine also includes a waxing bin, which has a waxing cavity, and the waxing bin has a second opening, which is used for the rotatable adsorption device and / or the wax dripping device to enter and exit the waxing cavity; by designing the waxing bin and placing the wax dripping device's waxing operation on the wafer of the rotatable adsorption device in the waxing cavity, it is possible to reduce the odor emitted during the waxing operation and also confine the wax liquid thrown out by the wafer when it rotates at high speed to the waxing cavity.

[0030] Based on the above invention object, the present invention also provides a waxing method for an automatic waxing machine, comprising the following steps:

[0031] Adsorbing wafers: After the reversible manipulator moves the rotatable adsorption device to the wafer storage area to adsorb the wafer, the reversible manipulator flips the rotatable adsorption device upwards by 180°;

[0032] Waxing the wafer: The waxing robot moves the wax dripping device above the wafer, which drips wax liquid onto the wafer surface. The rotatable adsorption device drives the wafer to rotate around its own central axis so that the wax liquid evenly covers the surface of the wafer.

[0033] Melting the wax layer: The wafer can be moved to a baking chamber by a flip robot, and heated to melt the wax layer on the surface of the wafer;

[0034] Chip placement: The reversible manipulator turns the rotatable adsorption device downward 180 degrees, and attaches the wafer adsorbed by the rotatable adsorption device to the ceramic plate of the heating station;

[0035] After waxing is completed, the rotatable adsorption device releases the wafer, and the disc-taking robot moves the ceramic disc with the wafer attached thereto from the heating station to the cooling station for cooling.

[0036] The specific operation of the wafer waxing step is as follows: first, the rotatable adsorption device is moved into the waxing bin by the reversible manipulator, and the driving motor drives the vacuum suction cup to rotate around its own central axis through the first transmission member and the second transmission member, and the vacuum suction cup drives the wafer to rotate at a first speed; then, the wax dripping device is moved into the waxing bin by the waxing manipulator, and the wax dripping device is located directly above the rotatable adsorption device. At this time, the wax dripping hole of the wax dripping device corresponds one-to-one to the wafer of the rotatable adsorption device; the wax dripping device turns on the air pump and the solenoid valve, increases the air pressure in the wax liquid storage bottle, and drips the wax liquid onto the surface of the rotating wafer, and the rotation of the wafer makes the wax liquid evenly cover the surface of the wafer; the first speed of the vacuum suction cup is 120r / min.

[0037] The specific operation of the wax layer melting step is as follows: first, the wax dripping device is moved out of the waxing chamber by the waxing robot; then, the rotatable adsorption device is moved out of the waxing chamber and into the baking chamber by the reversible robot, and the vacuum suction cup drives the wafer to rotate at a second speed, and the wax layer on the surface of the wafer melts; the second speed of the vacuum suction cup is 60r / min.

[0038] The specific operations in the patch step are: the disc-taking robot takes the empty ceramic disc from the disc storage rack and places it on the heating station of the patch platform, and the heating station heats the empty ceramic disc to the patch temperature; the reversible robot moves the rotatable adsorption device out of the baking chamber, and the vacuum suction cup stops rotating. The reversible robot flips the rotatable adsorption device up and down 180° so that the vacuum suction cup faces downward, and the reversible robot moves the rotatable adsorption device to the top of the heating station and moves it downward to stick the chip on the ceramic disc, and starts to pressurize continuously for a certain time; the patch temperature is 75℃-85℃; the pressurization pressure of the reversible robot is 60N-80N, and the pressurization time is 20S-30S.

[0039] The specific operations for completing the waxing step are as follows: the pressurization time of the reversible manipulator ends, the vacuum suction cup releases the chip, and the reversible manipulator moves the rotatable adsorption device from above the chip mounting platform; the disc-taking manipulator moves the ceramic disc with the chip attached from the heating station to the cooling station along the guide rail, and places the ceramic disc in the cooling station for a certain period of time; after the cooling is completed, the disc-taking manipulator takes the ceramic disc with the chip attached from the cooling station and places it in the disc storage rack; the temperature of the cooling station is 5-15°C, and the ceramic disc is placed in the cooling station for 3min-5min.

[0040] It should be noted that the wafer is an indium phosphide substrate wafer.

[0041] Compared with the prior art, the automatic waxing machine according to the embodiment of the present invention has the following beneficial effects: by respectively installing the rotatable adsorption device and the wax dripping device to the reversible manipulator and the waxing manipulator, the automatic loading, automatic wax dripping, automatic wax spreading, automatic baking and automatic chip mounting of the wafer can be completed on the reversible manipulator. Through the guide rail and the disc-taking manipulator, the ceramic disc can be transferred between the disc storage rack and the chip mounting platform, and the ceramic disc can be transferred between the heating station and the cooling station to complete the automatic taking and placing of the ceramic disc. Therefore, the present invention can realize the integration and automation of wafer loading, wax dripping, wax spreading, baking, chip mounting, and ceramic disc taking and placing, thereby improving production efficiency, reducing production costs, and avoiding burns to staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 This is a structural diagram of an automatic waxing machine provided by an embodiment of the present invention;

[0043] Figure 2 is a structural diagram of a first manipulator provided by an embodiment of the present invention;

[0044] Figure 3 is a structural schematic diagram of a first grip portion provided by an embodiment of the present invention;

[0045] Figure 4 is a top view of a rotatable adsorption device provided by an embodiment of the present invention;

[0046] Figure 5 yes Figure 4 AA cross-sectional view;

[0047] Figure 6 1 is a schematic structural diagram of a wax dripping device provided in an embodiment of the present invention;

[0048] Figure 7 yes Figure 6 Bottom view of

[0049] Figure 8 1 is a schematic structural diagram of a baking bin provided by an embodiment of the present invention;

[0050] Figure 9 It is a structural schematic diagram of a disk storage rack provided by an embodiment of the present invention;

[0051] Figure 10 1 is a top view of a patch platform and an automatic ceramic plate pick-and-place device provided in an embodiment of the present invention;

[0052] Figure 11is a side sectional view of a disk-removing robot provided by an embodiment of the present invention;

[0053] Figure 12 1 is a schematic structural diagram of a disk remover provided by an embodiment of the present invention;

[0054] Figure 13 is a top view of a plate remover and a ceramic plate provided in an embodiment of the present invention;

[0055] Figure 14 It is a structural schematic diagram of a waxing bin provided in an embodiment of the present invention.

[0056] In the figure, 1, reversible manipulator; 12, first gripper; 111, rotating platform; 112, first movable arm; 113, second movable arm; 114, third movable arm; 115, fourth movable arm; 116, fifth movable arm; 121, first telescopic device; 122, support base; 123, support rod; 1211, first clamping part; 1212, telescopic rod; 1231, second clamping part;

[0057] 2. Rotatable suction device; 21. First base plate; 211. First through hole; 221. Drive motor; 222. First drive member; 231. Vacuum suction cup; 232. Rotating shaft; 233. Second through hole; 234. Second transmission member; 241. Rotary joint; 242. First connecting pipe;

[0058] 3. Waxing robot;

[0059] 4. Wax dripping device; 41. Second base plate; 42. Wax liquid storage bottle; 43. Wax dripping tube; 44. Baffle; 411. Wax dripping hole; 441. Wax dripping area;

[0060] 5. Baking chamber; 51. First opening;

[0061] 6. Patch platform; 61. Heating station; 62. Cooling station;

[0062] 7. Storage rack; 71. Rack body; 72. Lifter; 73. Bottom frame; 711. Ceramic disc placement slot;

[0063] 8. Automatic ceramic disc pick-and-place device; 81. Guide rail; 82. Disc pick-up manipulator; 821. Rotating motor; 822. Second retractor; 823. Disc pick-up device; 8231. U-shaped groove; 8232. Adsorption hole; 8233. Second connecting pipe; 8234. Second vacuum generator;

[0064] 100. Ceramic plate. DETAILED DESCRIPTION

[0065] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0066] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0067] The terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features.

[0068] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0069] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0070] like Figure 1-2 As shown, an automatic waxing machine preferably according to an embodiment of the present invention includes a reversible manipulator 1, a rotatable adsorption device 2, a waxing manipulator 3, a wax dripping device 4, a baking bin 5, a patch platform 6, a disk storage rack 7 and an automatic ceramic disk taking and placing device 8.

[0071] Preferably, the baking chamber 5 is a hot nitrogen chamber.

[0072] The reversible robot 1 includes a first arm and a first gripper 12 connected to the first arm; the rotatable adsorption device 2 is installed on the first gripper 12, and the rotatable adsorption device 2 is used to adsorb the chip, and the rotatable adsorption device 2 can drive the chip to rotate around its own central axis when adsorbing the chip; the waxing robot 3 includes a second arm and a second gripper connected to the second arm; the wax dripping device 4 is installed on the second gripper.

[0073] The first arm portion includes a rotating table 111, a first movable arm 112, a second movable arm 113, a third movable arm 114, a fourth movable arm 115 and a fifth movable arm 116 connected in sequence; the first movable arm 112 is fixed to the top of the rotating table 111, and the rotating table 111 is used to drive the first movable arm 112 to rotate around the central axis of the rotating table 111. A first upper and lower movable joint is provided between the first movable arm 112 and the second movable arm 113, a second upper and lower movable joint is provided between the second movable arm 113 and the third movable arm 114, a vertical rotation joint is provided between the third movable arm 114 and the fourth movable arm 115, and a horizontal rotation joint is provided between the fourth movable arm 115 and the fifth movable arm 116; the first gripper portion 12 is connected to the fifth movable arm 116.

[0074] The fifth movable arm 116 can rotate around the horizontal center axis of the vertical rotation joint through the vertical rotation joint, so that the fifth movable arm 116 can drive the first gripper part 12 to flip up and down 180°, thereby enabling the first gripper part 12 to drive the rotatable adsorption device to flip up and down 180°.

[0075] See also Figure 1 and Figure 3 The first gripping portion 12 provided in an embodiment of the present invention includes a first telescopic device 121, a support seat 122 and a support rod 123; the first telescopic device 121 is connected to the fifth movable arm 116, and a first clamping portion 1211 is fixed to the end face of the first telescopic device, and the first telescopic device 121 has a telescopic rod 1212, and the extended end of the telescopic rod 1212 passes through the first clamping portion 1211; the support seat 122 is connected to the extended end of the telescopic rod 1212; one end of the support rod 123 is connected to the support seat 122, and the other end of the support rod 123 extends outward from the support seat 122, and the support rod 123 is provided with a second clamping portion 1231, and the second clamping portion 1231 is used to correspond with the first clamping portion 1211 to clamp and fix the rotatable adsorption device 2.

[0076] By driving the support seat 122 away from or close to the fifth movable arm 116 through the first telescopic device 121, the relative distance between the first clamping part 1211 and the second clamping part 1231 can be changed accordingly, so that the first clamping part 1211 and the second clamping part 1231 can be used to clamp and fix rotatable adsorption devices 2 of various sizes, which has a wide range of applications.

[0077] Preferably, the number of the first gripping parts 12 is three, and the three first gripping parts 12 respectively clamp and fix the rotatable adsorption devices 2 of three different sizes;

[0078] Preferably, there are two support rods 123, and the rotatable adsorption device 2 can be clamped at three points by the second clamping parts 1231 respectively provided on the two support rods 123 and the first clamping part 1211 provided on the end surface of the first telescope 121.

[0079] Preferably, the structure of the waxing robot 3 is consistent with that of the flippable robot 1 , that is, the structure of the second arm portion is consistent with that of the first arm portion, and the structure of the second gripper portion is consistent with that of the first gripper portion 12 .

[0080] See also Figure 3 and Figure 4 The rotatable adsorption device 2 provided in the embodiment of the present invention includes a first base plate 21, a rotation driving component, an adsorption component and a vacuum generating component.

[0081] The first base plate 21 is mounted on the first grip portion 12 . The first base plate 21 is provided with a first through hole 211 . The first through hole 211 penetrates the first base plate 21 from top to bottom. The first through hole 211 is used for passing an air pipe and an electric wire.

[0082] The rotary driving member includes a driving motor 221 and a first transmission member 222 . The driving motor 221 is fixed on the first base plate 21 , and the first transmission member 222 is provided on the output shaft of the driving motor 221 .

[0083] The adsorption part includes a vacuum suction cup 231, a rotating shaft 232, a second through hole 233, and a second transmission part 234; the rotating shaft 232 is arranged at the bottom center of the vacuum suction cup 231, and the second through hole 233 passes through the vacuum suction cup 231 and the rotating shaft 232 from top to bottom in sequence. The second transmission part 234 is connected to the rotating shaft 232, and the second transmission part 234 corresponds to the first transmission part 222.

[0084] The vacuum generating part includes a rotary joint 241, a first connecting tube 242, and a first vacuum generator; one end of the first connecting tube 242 is connected to the rotating shaft 232 through the rotary joint 241 and communicates with the second through hole 233, and the other end of the first connecting tube 242 is connected to and communicates with the first vacuum generator.

[0085] Preferably, the number of the adsorption components is five, and the five adsorption components are evenly distributed above the first base plate 21 , and one adsorption component adsorbs one wafer accordingly.

[0086] More preferably, the five vacuum suction cups 231 are distributed above the first base plate 21 in a circular array.

[0087] Preferably, the number of the rotary driving members is five, and the five rotary driving members correspond one to one to the five adsorption members, and the rotary driving members can drive the adsorption members to rotate around their own central axes.

[0088] Preferably, the number of the vacuum generating parts is five, and the vacuum generating parts correspond to the adsorption parts one by one.

[0089] Preferably, the first transmission member 222 is a driving gear, which is sleeved on the output shaft of the drive motor 221 , and the second transmission member 234 is a transmission gear, which is sleeved on the outer side wall of the rotating shaft 232 .

[0090] See also Figure 6-7 The wax dripping device 4 provided in the embodiment of the present invention includes a second base plate 41, a wax liquid storage bottle 42, a wax dripping tube 43, a baffle 44, a solenoid valve and an air pump.

[0091] The second base plate 41 is installed on the second gripper portion. The lower surface of the second base plate 41 has five wax dripping areas 441 . The five wax dripping areas 441 correspond to the five adsorption parts one by one. Each wax dripping area 441 has a wax dripping hole 411 .

[0092] The wax liquid storage bottle 42 is disposed above the second base plate 41 .

[0093] There are five wax dripping tubes 43 , the upper ends of the five wax dripping tubes 43 are connected to the lower part of the wax storage bottle 42 , and the lower ends of the five wax dripping tubes 43 are connected to the five wax dripping holes 411 one by one;

[0094] Five baffles 44 are located between adjacent wax dripping areas 441. Each baffle 44 is fixed to the lower surface of the second base plate 41, and two adjacent baffles 44 form a V-shaped wax dripping area on the lower surface of the second base plate 41. When the second base plate 41 is directly above the first base plate 21, the positions of the plurality of wax dripping holes 411 correspond one-to-one with the positions of the plurality of second through holes 233 of the vacuum chucks 231. The baffles 44 block excess wax from the wafer surface when the vacuum chucks 231 rotate the wafer, preventing it from splashing onto other wafers being waxed.

[0095] The solenoid valve corresponds to the wax dripping tube 43 one by one, and the solenoid valve is provided at the connection point between the wax dripping tube 43 and the wax storage bottle 42;

[0096] The air pump is connected to the wax liquid storage bottle 42 , and the connection point between the air pump and the wax liquid storage bottle 42 is located above the connection point between the wax dripping tube 43 and the wax liquid storage bottle 42 .

[0097] Preferably, the wax dripping tube 43 is a hard PVC tube, and the wax storage bottle 42 is fixed above the second base plate 41 through the wax dripping tube 43 .

[0098] Preferably, the five baffles 44 are fixed in a hub shape on the lower surface of the second base plate 41, so that the five wax dripping areas 441 are distributed in a circular array on the lower surface of the second base plate 41 and correspond one-to-one to the vacuum suction cups.

[0099] See also Figure 1 and Figure 8 The baking chamber 5 provided in the embodiment of the present invention has a heating chamber, and the baking chamber 5 has a first opening 51, and the first opening 51 is used for the rotatable adsorption device 2 to enter and exit the heating chamber.

[0100] See also Figure 1 and Figure 9 The disk storage rack 7 provided in the embodiment of the present invention is located on one side of the patch platform 6. The disk storage rack 7 is used to store ceramic disks 100. The disk retrieval robot 82 can take out the ceramic disk 100 from the disk storage rack 7 and move it to the heating station 61, or move the ceramic disk 100 from the cooling station 62 to the disk storage rack 7. The disk storage rack 7 includes a frame 71 and a lifter 72. The frame 71 is provided with a plurality of ceramic disk placement slots 711, and the plurality of ceramic disk placement slots 711 are evenly arranged from top to bottom. The lifter 72 is connected to the frame 71, and the lifter 72 is used to drive the frame 71 to rise or fall in the vertical direction.

[0101] Preferably, the disk storage rack 7 further includes a bottom frame 73 , which is in the shape of a semi-enclosed rectangular parallelepiped, and the lifter 72 is fixedly mounted on the bottom frame.

[0102] Preferably, the lifter 72 is an electric cylinder. The output end of the lifter 72 is fixedly connected to the lower end of the frame; in this embodiment, the output end of the lifter 72 is fixedly connected to the lower end of the frame 71, and the output end of the electric cylinder is fixedly connected to the lower end of the frame 71.

[0103] See also Figure 10 The upper surface of the patch platform 6 provided in the embodiment of the present invention is provided with a heating station 61 and a cooling station 62. The heating station 61 is equipped with a heating disk, and the cooling station 62 is equipped with a cooling disk.

[0104] See also Figure 10 The ceramic disc automatic picking and placing device 8 provided in an embodiment of the present invention includes a guide rail 81 and a disc picking robot 82; the guide rail 81 is arranged on the top of the patch platform 6, and the disc picking robot 82 performs a linear reciprocating motion along the guide rail 81 between the heating station 61 and the cooling station 62.

[0105] See also Figure 11-13 The disk-removing robot 82 provided in the embodiment of the present invention includes a rotating motor 821 , a second telescoping device 822 and a disk-removing device 823 .

[0106] The second retractor 822 is fixed to the upper end of the rotary motor 821. The rotary motor 821 is used to drive the second retractor 822 to rotate around the vertical center axis of the rotary motor 821. The tray remover 823 is fixed to the output end of the second retractor 822. The second retractor 822 is used to drive the tray remover 823 to move horizontally away from or toward the rotary motor 821.

[0107] A U-shaped groove 8231 is provided at one end of the disc remover 823, and the inner diameter E of the U-shaped groove 8231 is larger than the outer diameter D of the ceramic disc 100. An adsorption hole 8232 is provided at the center of the inner bottom of the U-shaped groove, and the adsorption hole 8232 is connected and communicated with the second vacuum generator 8234 through a second connecting pipe 8233.

[0108] Preferably, the rotary motor 821 is a servo motor with a cam divider.

[0109] Preferably, the second retractor 822 is an electric cylinder.

[0110] In one embodiment, see Figure 14The automatic waxing machine further includes a waxing chamber 9 having a waxing cavity and a second opening 91 for the rotatable suction device 2 and / or the wax dripping device 4 to enter and exit the waxing cavity. By designing the waxing chamber 9 and placing the wax dripping device 4 within the waxing cavity for waxing the wafers attached to the rotatable suction device 2, odor emission during the waxing operation can be reduced, and wax liquid ejected from the wafers during high-speed rotation can be confined to the waxing cavity.

[0111] Combine Figure 1-14 It is understood that the present invention also provides a waxing method for an automatic waxing machine, comprising the following steps:

[0112] Adsorbing wafers: After the reversible manipulator moves the rotatable adsorption device to the wafer storage area to adsorb the wafer, the reversible manipulator flips the rotatable adsorption device upwards by 180°;

[0113] Waxing the wafer: The waxing robot moves the wax dripping device above the wafer, which drips wax liquid onto the wafer surface. The rotatable adsorption device drives the wafer to rotate around its own central axis so that the wax liquid evenly covers the surface of the wafer.

[0114] Melting the wax layer: The wafer can be moved to a baking chamber by a flip robot, and heated to melt the wax layer on the surface of the wafer;

[0115] Chip placement: The reversible manipulator turns the rotatable adsorption device downward 180 degrees, and attaches the wafer adsorbed by the rotatable adsorption device to the ceramic plate of the heating station;

[0116] After waxing is completed, the rotatable adsorption device releases the wafer, and the disc-taking robot moves the ceramic disc with the wafer attached thereto from the heating station to the cooling station for cooling.

[0117] The specific operation of the wafer waxing step is as follows: first, the rotatable adsorption device is moved into the waxing bin by the reversible manipulator, and the driving motor drives the vacuum suction cup to rotate around its own central axis through the first transmission member and the second transmission member, and the vacuum suction cup drives the wafer to rotate at a first speed; then, the wax dripping device is moved into the waxing bin by the waxing manipulator, and the wax dripping device is located directly above the rotatable adsorption device. At this time, the wax dripping hole of the wax dripping device corresponds one-to-one to the wafer of the rotatable adsorption device; the wax dripping device turns on the air pump and the solenoid valve, increases the air pressure in the wax liquid storage bottle, and drips the wax liquid onto the surface of the rotating wafer, and the rotation of the wafer makes the wax liquid evenly cover the surface of the wafer; the first speed of the vacuum suction cup is 120r / min.

[0118] The specific operation of the wax layer melting step is as follows: first, the wax dripping device is moved out of the waxing chamber by the waxing robot; then, the rotatable adsorption device is moved out of the waxing chamber and into the baking chamber by the reversible robot, and the vacuum suction cup drives the wafer to rotate at a second speed, and the wax layer on the surface of the wafer melts; the second speed of the vacuum suction cup is 60r / min.

[0119] In the specific operation of the patch: the disc-taking robot takes the empty ceramic disc from the disc storage rack and places it on the heating station of the patch platform, and the heating station heats the empty ceramic disc to the patch temperature; the reversible robot moves the rotatable adsorption device out of the baking chamber, and the vacuum suction cup stops rotating. The reversible robot flips the rotatable adsorption device up and down 180° so that the vacuum suction cup faces downward. The reversible robot moves the rotatable adsorption device to the top of the heating station and moves it downward to stick the chip on the ceramic disc, and starts to pressurize continuously for a certain time; the patch temperature is 75℃-85℃; the pressurization pressure of the reversible robot is 60N-80N, and the pressurization time is 20S-30S.

[0120] The specific operations for completing the waxing step are as follows: the pressurization time of the reversible manipulator ends, the vacuum suction cup releases the chip, and the reversible manipulator moves the rotatable adsorption device from above the chip mounting platform; the disc-taking manipulator moves the ceramic disc with the chip attached from the heating station to the cooling station along the guide rail, and places the ceramic disc in the cooling station for a certain period of time; after the cooling is completed, the disc-taking manipulator takes the ceramic disc with the chip attached from the cooling station and places it in the disc storage rack; the temperature of the cooling station is 5-15°C, and the ceramic disc is placed in the cooling station for 3min-5min.

[0121] The specific operation of the plate-taking robot to take the empty ceramic plate from the plate storage rack and place it on the heating station of the patch platform:

[0122] The lifter 72 drives the frame 71 to rise or fall, so that the ceramic disc placement slot 711 containing the empty ceramic disc is at the same height as the disc-taking robot 82; the rotary motor 821 drives the second retractor 822 and the disc-taking device 823 to rotate 180 degrees, so that the opening of the U-shaped groove 8231 of the disc-taking device 823 faces the empty ceramic disc; the output end of the second retractor 822 is extended to drive the disc-taking device 823 to move from the patch platform 6 toward the empty ceramic disc, and the ceramic disc is stuck in the U-shaped groove 8231, and the second vacuum generator 8 234 starts to provide negative pressure until the outer wall of the ceramic disc closes the adsorption hole 8232, so that the adsorption hole 8232 of the U-shaped groove 8231 can adsorb and fix the ceramic disc; the output end of the second telescopic device 822 is shortened to drive the disc remover 823 to return to the patch platform 6; the rotary motor 821 drives the disc remover 823 to rotate 180° through the second telescopic device 822, so that the empty ceramic disc is located directly above the heating station 61, and the second vacuum generator 8234 stops providing negative pressure to release the empty ceramic disc to the heating station 61.

[0123] The plate-taking robot 82 takes the ceramic plate 100 with the wafer attached from the cooling station 62 and places it into the plate storage rack 7.

[0124] The lifter 72 drives the frame 71 to rise or fall, so that the empty ceramic disc placement slot 711 and the disc removal robot 82 are at the same height; the second vacuum generator 8234 provides negative pressure, so that the adsorption hole 8232 of the U-shaped groove 8231 can adsorb and fix the ceramic disc with the wafer attached, and the rotary motor 821 drives the second retractor 822 and the disc remover 823 to rotate 180 degrees, so that the opening of the U-shaped groove 8231 of the disc remover 823 faces the empty ceramic disc placement slot 711; the output end of the second retractor 822 is extended to drive the ceramic disc to be fixed. The dynamic disk remover 823 moves toward the empty ceramic disk placement slot 711 so that the ceramic disk with the chip attached is placed in the ceramic disk placement slot 711, and the second vacuum generator 8234 stops providing negative pressure to release the ceramic disk with the chip attached into the disk storage rack 7; the output end of the second telescopic device 822 is shortened to drive the disk remover 823 to return to the chip placement platform 6; the rotating motor 821 drives the second telescopic device 822 and the disk remover 823 to rotate 180°, and the disk removing robot 82 moves along the guide rail 81 from the cooling station 62 to the heating station 61.

[0125] In summary, the protective head cover provided by the embodiment of the present invention has the following beneficial effects:

[0126] 1. By installing the rotatable adsorption device 2 and the wax dripping device 4 to the reversible robot 1 and the waxing robot 3 respectively, the automatic loading, automatic wax dripping, automatic wax spreading, automatic baking and automatic chip mounting of the wafer can be completed on the reversible robot 1.

[0127] 2. The guide rail 81 and the disc retrieval robot 82 can be used to transfer the ceramic disc 100 between the disc storage rack 7 and the patch platform 6, and can also be used to transfer the ceramic disc 100 between the heating station 61 and the cooling station 62, thereby completing the automatic placement of the ceramic disc 100.

[0128] 3. The first telescopic device 121, the support seat 122 and the support rod 123 are used, and the first clamping portion 1211 and the second clamping portion 1231 are respectively set on the first telescopic device 121 and the support rod 123. The relative distance between the first clamping portion 1211 and the second clamping portion 1231 can be changed accordingly so that the first clamping portion 1211 and the second clamping portion 1231 can clamp and fix the rotatable adsorption device 2 of corresponding size, which has a wide range of applications.

[0129] 4. A driving motor 221, a first transmission member 222, a rotating shaft 232 and a second transmission member 234 are used so that the rotating driving member can drive the vacuum suction cup 231 to rotate around its own central axis, so that the vacuum suction cup 231 can drive the wafer it adsorbs and fixes to rotate, thereby completing the wax uniformity of the wafer.

[0130] 5. The rotary joint 241 is used so that the first connecting tube 242 does not need to rotate along with the vacuum suction cup 231 .

[0131] 6. By using multiple adsorption members 23 evenly distributed above the first base plate 21, and providing multiple wax dripping holes 411 corresponding to the multiple adsorption members on the second base plate 41, automatic wax dripping and automatic wax distribution of multiple wafers can be completed at one time, thereby improving production efficiency.

[0132] 7. Use the baffle 44 and fix multiple baffles 44 on the lower surface of the second base 41, so that the area enclosed by two adjacent baffles 44 on the lower surface of the second base 41 is a wax dripping area 441. When the vacuum suction cup 231 drives the chip to rotate, the excess wax thrown out from the surface of the chip can be blocked to avoid splashing onto the surface of other chips being waxed.

[0133] 8. The lifter 72 is used to achieve the ascent or descent of the frame 71 , so that the disk-taking robot 82 can take out or put in the ceramic disk from the corresponding ceramic disk placement slot 711 .

[0134] 9. By using the rotating motor 821, the second telescopic device 822 and the disk remover 823, an empty ceramic disk can be taken out from the disk storage rack 7 to the heating station 61, and a ceramic disk with wafers attached can be placed from the cooling station 62 into the disk storage rack 7.

[0135] 10. The U-shaped groove 8231 is used and the adsorption hole 8232 is set at the center of the bottom of the U-shaped groove 8231. The ceramic disc can be closed under the guiding effect of the U-shaped groove 8231 and the suction effect of the adsorption hole 8232, so that the disc remover 823 can adsorb and fix the ceramic disc.

[0136] 11. The waxing chamber 9 can reduce the odor emitted during the waxing operation and confine the wax liquid thrown out by the wafer during high-speed rotation to the waxing chamber.

[0137] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. An automatic waxing machine, characterized in that: include: A reversible manipulator, comprising a first arm portion and a first gripper portion connected to the first arm portion; a rotatable adsorption device for adsorbing a wafer, the rotatable adsorption device being mounted on the first gripper portion and capable of driving the wafer to rotate around its own central axis; A waxing robot, comprising a second arm portion and a second gripper portion connected to the second arm portion; a wax dripping device, the wax dripping device being mounted on the second gripping portion; A baking chamber, wherein the baking chamber has a heating chamber and a first opening, wherein the first opening is used for the rotatable adsorption device to enter and exit the heating chamber; A patch platform, wherein the patch platform is provided with a heating station and a cooling station; An automatic ceramic disc pick-up and placement device, comprising a guide rail and a disc-taking manipulator; the guide rail is provided on the patch platform, and the disc-taking manipulator reciprocates along the guide rail between the heating station and the cooling station; A disk storage rack, the disk storage rack is located on one side of the patch platform, and the disk retrieval robot can take out the ceramic disk from the disk storage rack and move it to the heating station, or move the ceramic disk from the cooling station to the disk storage rack; The first arm portion includes a rotating platform, a first movable arm, a second movable arm, a third movable arm, a fourth movable arm and a fifth movable arm connected in sequence; the first movable arm is fixed to the top of the rotating platform, and the rotating platform is used to drive the first movable arm to rotate around the central axis of the rotating platform. A first vertical movable joint is provided between the first movable arm and the second movable arm, a second vertical movable joint is provided between the second movable arm and the third movable arm, a vertical rotation joint is provided between the third movable arm and the fourth movable arm, and a horizontal rotation joint is provided between the fourth movable arm and the fifth movable arm; The first gripping portion is connected to the fifth movable arm; The first gripping portion comprises: a first telescopic device connected to the fifth movable arm, a first clamping portion being fixed to an end surface of the first telescopic device, the first telescopic device comprising a telescopic rod, an extending end of the telescopic rod passing through the first clamping portion; a support base connected to the extended end of the telescopic rod; A support rod, one end of which is connected to the support seat, and the other end of which extends outward from the support seat, and the support rod is provided with a second clamping portion, which is used to correspond with the first clamping portion to clamp and fix the rotatable adsorption device.

2. The automatic waxing machine according to claim 1, characterized in that: The rotatable adsorption device comprises: A first base plate is mounted on the first grip portion, the first base plate is provided with a first through hole, and the first through hole penetrates the first base plate from top to bottom; A rotary driving member, comprising a driving motor and a first transmission member, wherein the driving motor is fixed to the first base plate, and the first transmission member is provided on an output shaft of the driving motor; The adsorption component includes a vacuum suction cup, a rotating shaft, a second through hole, and a second transmission component; the rotating shaft is provided at the bottom center of the vacuum suction cup, the second through hole passes through the vacuum suction cup and the rotating shaft in sequence from top to bottom, the second transmission component is connected to the rotating shaft, and the second transmission component corresponds to and cooperates with the first transmission component; a vacuum generating member, the vacuum generating member comprising a rotary joint, a first connecting tube, and a first vacuum generator; one end of the first connecting tube is connected to the rotating shaft through the rotary joint and communicates with the second through hole, and the other end of the first connecting tube is connected to and communicates with the first vacuum generator; There are multiple adsorption members, and the multiple adsorption members are evenly distributed above the first base, and one adsorption member adsorbs one wafer correspondingly; There are multiple rotating drive members, and each of the rotating drive members corresponds to each of the adsorption members. The rotating drive members are used to drive the adsorption members to rotate around their own central axes. There are multiple vacuum generating parts, and the multiple vacuum generating parts correspond to the multiple adsorption parts in a one-to-one manner.

3. The automatic waxing machine according to claim 2, characterized in that: The wax dripping device comprises: a second base plate, the second base plate being mounted on the second gripper portion, the lower surface of the second base plate having a plurality of wax dripping areas, the plurality of wax dripping areas corresponding one to one with the plurality of adsorbents, and each wax dripping area having a wax dripping hole; A wax liquid storage bottle, the wax liquid storage bottle being arranged above the second base plate; A wax dripping tube, wherein the number of the wax dripping tubes is multiple, the upper ends of the multiple wax dripping tubes are connected to the lower part of the wax storage bottle, and the lower ends of the multiple wax dripping tubes are connected to the multiple wax dripping holes in a one-to-one correspondence; A baffle is provided between two adjacent wax dripping areas; A solenoid valve, the solenoid valve corresponding to the wax dripping tube one-to-one, the solenoid valve being arranged at the connection point between the wax dripping tube and the wax liquid storage bottle; An air pump is connected to the wax storage bottle, and the connection between the air pump and the wax storage bottle is located above the connection between the wax dripping tube and the wax storage bottle.

4. The automatic waxing machine according to claim 1, characterized in that: The storage rack includes: A frame body, wherein the frame body is provided with a plurality of ceramic disc placement slots, and the plurality of ceramic disc placement slots are evenly arranged from top to bottom; A lifter is connected to the frame, and is used to drive the frame to rise or fall in a vertical direction.

5. The automatic waxing machine according to claim 4, characterized in that: The plate-taking robot comprises: Rotating electric machines; The second retractor is fixed to the output end of the rotary motor, and the rotary motor is used to drive the second retractor to rotate around the vertical center axis of the rotary motor. A disc remover is fixed to the output end of the second telescopic device, and the second telescopic device is used to drive the disc remover to move away from or approach the rotating motor in the horizontal direction.

6. The automatic waxing machine according to claim 5, characterized in that: A U-shaped groove is provided at one end of the disc remover, the inner diameter E of the U-shaped groove is greater than or equal to the outer diameter D of the ceramic disc, and an adsorption hole is provided at the center of the inner bottom of the U-shaped groove, and the adsorption hole is connected and communicated with the second vacuum generator through a second connecting pipe.

7. The automatic waxing machine according to any one of claims 1 to 6, characterized in that: It also includes a waxing bin, which has a waxing cavity. The waxing bin has a second opening, and the second opening is used for the rotatable adsorption device and / or the wax dripping device to enter and exit the waxing cavity.

8. A waxing method for an automatic waxing machine according to any one of claims 1 to 7, characterized in that: The following steps are involved: Adsorbing wafers: After the reversible manipulator moves the rotatable adsorption device to the wafer storage area to adsorb the wafer, the reversible manipulator flips the rotatable adsorption device upwards by 180°; Waxing the wafer: The waxing robot moves the wax dripping device above the wafer, which drips wax liquid onto the wafer surface. The rotatable adsorption device drives the wafer to rotate around its own central axis so that the wax liquid evenly covers the surface of the wafer. Melting the wax layer: The wafer can be moved to a baking chamber by a flip robot, and heated to melt the wax layer on the surface of the wafer; Chip placement: The reversible manipulator turns the rotatable adsorption device downward 180 degrees, and attaches the wafer adsorbed by the rotatable adsorption device to the ceramic plate of the heating station; Waxing is completed: the rotatable adsorption device releases the wafer, and the disc-taking robot moves the ceramic disc with the wafer attached thereto from the heating station to the cooling station for cooling.

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