An electronic device

Abstract

The present application discloses an electronic device, comprising: a housing; a circuit board, the circuit board is installed inside the housing, the first heating element and the second heating element are installed on the circuit board, the heat generation of the first heating element is greater than the heat generation of the second heating element; the circuit board is fixed to the inner surface of the housing through the fastening device, so that the first heating element is attached to the housing and dissipates heat through the housing, the fastening device comprises: a first fastening device, the first fastening device is adjacent to the first heating element, the first fastening device fixes the circuit board to the inner surface of the housing, and applies pressure to the circuit board in the direction of the inner surface of the housing, so that the part of the circuit board containing the first heating element is locally deformed to attach to the inner surface of the housing; and a second fastening device, the second fastening device is adjacent to the second heating element, the second fastening device fixes the circuit board to the inner surface of the housing.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation of electronic devices, and in particular to an electronic device. BACKGROUND

[0002] With the development of technology and the high integration of equipment, the computing power requirement of a single terminal device is increasing, which leads to higher power consumption of the CPU (Central Processing Unit) inside the device. How to dissipate the heat of the CPU to the environment is an important part of the reliability of the device. For general server terminal devices, the heat inside the device is usually blown to the environment by opening the device and using air cooling, but the protection level of such devices is relatively low, and there are problems such as rain erosion and air corrosion during use in outdoor environments, which reduces the service life of the device. Some experts have proposed that the main heat-generating components of the device, such as the CPU, are directly heat-conducted to the metal shell for direct heat dissipation, but the CPU has a large power consumption. Due to the existence of shell tolerance, when the CPU directly uses heat-conductive silicone grease with small thermal resistance to conduct heat to the shell, there is a risk of overpressure damage to the chip, which directly restricts the reliability of this heat dissipation method. SUMMARY

[0003] Therefore, the purpose of the present application is to provide an electronic device that uses a method of locally deforming the part of the circuit board containing the main heat-generating components to ensure heat dissipation contact between the heat-generating components and the shell.

[0004] One embodiment of the present application provides an electronic device, comprising:

[0005] a shell;

[0006] a circuit board, the circuit board being arranged inside the shell, the circuit board having a first heat-generating component and a second heat-generating component arranged thereon, the first heat-generating component having a greater heat generation than the second heat-generating component;

[0007] the circuit board being fixed to the inner surface of the shell by a fastening device, so that the first heat-generating component is in contact with the shell and dissipates heat through the shell, the fastening device comprising:

[0008] a first fastening device, the first fastening device being adjacent to the first heat-generating component, the first fastening device fixing the circuit board to the inner surface of the shell and applying a pressure to the circuit board in the direction of the inner surface of the shell, so that the part of the circuit board containing the first heat-generating component is locally deformed to fit the inner surface of the shell; and

[0009] a second fastening device, the second fastening device being adjacent to the second heat-generating component, the second fastening device fixing the circuit board to the inner surface of the shell.

[0010] In one embodiment, the inner surface of the housing comprises:

[0011] a first connecting portion protruding from the inner surface of the housing for fastening connection with the first fastening device; and

[0012] a second connecting portion protruding from the inner surface of the housing for fastening connection with the second fastening device;

[0013] wherein the height of the first connecting portion is less than the height of the second connecting portion, so that the circuit board has a first gap with the top end of the first connecting portion.

[0014] In one embodiment, the first fastening device comprises:

[0015] a first screw threadedly connected with the first connecting portion; and

[0016] a first spring disposed around the first screw between the first screw and the first connecting portion, the first spring having a first compression amount when the first screw is connected with the first connecting portion.

[0017] In one embodiment, the first compression amount is less than or equal to the first gap.

[0018] In one embodiment, a heat dissipation module is included, the heat dissipation module comprising:

[0019] a first heat dissipation element disposed on the inner surface of the housing and corresponding to the position of the first heat generating element, the circuit board being fixed to the inner surface of the housing by the fastening device, so that the first heat generating element is attached to the first heat dissipation element and dissipates heat through the first heat dissipation element;

[0020] the local deformation of the circuit board increases the contact force between the first heat generating element and the first heat dissipation element.

[0021] In one embodiment, the first heat dissipation element is adjustably fixed to the inner surface of the housing in a direction perpendicular to the inner surface of the housing, the first heat dissipation element moving towards the inner surface of the housing in response to the contact force exceeding a first threshold value, or moving away from the inner surface of the housing in response to the contact force being less than the first threshold value.

[0022] In one embodiment, the inner surface of the housing comprises a first recess recessed inwardly, the first recess corresponding in position and shape to the first heat dissipation element;

[0023] The first heat dissipation element is fixed in the first recess of the shell by a third fastening device, and a second gap exists between the first heat dissipation element and the bottom surface of the first recess.

[0024] In one embodiment, the third fastening device comprises:

[0025] a third screw threadedly connected with the first recess; and

[0026] a third spring installed around the third screw between the third screw and the first recess, the third spring having a third compression amount less than or equal to the second gap when the third screw is installed in the first recess.

[0027] In one embodiment, the heat dissipation module comprises:

[0028] a second heat dissipation element installed on the inner surface of the shell and connected with the first heat dissipation element to form a heat dissipation path for the first heat generating element in combination with the first heat dissipation element, the second heat dissipation element avoiding the second heat generating element.

[0029] In one embodiment, the shell comprises:

[0030] a boss protruding from the inner surface of the shell and corresponding to the position of the second heat generating element;

[0031] The circuit board is fixed to the inner surface of the shell by a fastening device, and a third gap exists between the second heat generating element and the boss.

[0032] According to the above technical solution, the present embodiment provides a kind of to make the local deformation of circuit board, so that the part that deforms can keep with the fit of the inner surface of shell, especially for the part of main heat generating element-first heat generating element.This embodiment provides a kind of first fastening device that can apply deformation pressure to circuit board, when the part containing first heat generating element of circuit board is fixed to the inner surface of shell by first fastening device, it applies the pressure in the direction of the inner surface of shell to circuit board, so that the part containing first heat generating element of circuit board occurs the deformation in the direction of the fit of the inner surface of shell, to guarantee the fit contact of first heat generating element and the inner surface of shell.

[0033] Further, in order to ensure that overpressure is not formed between the first heat generating element and the first heat dissipating element, which can cause damage to the chip, the first heat dissipating element can have a degree of freedom of movement in a direction perpendicular to the inner surface of the housing, similar to the first heat generating element. Then, when the contact force between the first heat generating element and the first heat dissipating element is too large, it moves towards the inner surface of the housing in response to the contact force exceeding the first threshold value, and when the contact force between the first heat generating element and the first heat dissipating element is too small, it moves away from the inner surface of the housing in response to the contact force being less than the first threshold value, so as to maintain the close fit between the first heat generating element and the first heat dissipating element.

[0034] The electronic device of the present embodiment adopts a dynamic adjustment mode of a double-position, bidirectional spring screw, which ensures good heat conduction of the main chip and prevents damage to the chip. BRIEF DESCRIPTION OF DRAWINGS

[0035] The following drawings are only illustrative and explanatory of the present application, and do not limit the scope of the present application.

[0036] Figure 1 is an exploded schematic view of the electronic device of the present application.

[0037] Figure 2a and Figure 2b is a structural schematic view of the circuit board in the electronic device of the present application.

[0038] Figure 3 is a structural schematic view of the first embodiment of the electronic device of the present application.

[0039] Figure 4 is a structural schematic view of the second embodiment of the electronic device of the present application.

[0040] Figure 5 is a structural schematic view of the heat dissipation module in the third embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0041] In order to have a clearer understanding of the technical features, objectives and effects of the present application, the specific embodiments of the present application will be described with reference to the drawings, in which the same reference numerals represent the same parts.

[0042] In this document, "schematic" means "serves as an example, instance or illustration", and any illustration or embodiment described as "schematic" in this document should not be interpreted as a more preferred or more advantageous technical solution.

[0043] For the sake of simplicity of the drawings, only the parts related to the present application are shown in the drawings, and do not represent the actual structure of the product. In addition, in order to make the drawings simple and easy to understand, in some drawings, only one of the parts having the same structure or function is shown schematically, or only one of them is marked.

[0044] In order to solve the problem that the heat dissipation scheme of the heat generating element in the electronic device in the prior art is easy to cause damage to the element, the present application provides an electronic device which adopts a method of causing the part of the circuit board containing the main heat generating element to be locally deformed to ensure the heat dissipation contact between the heat generating element and the shell.

[0045] Figure 1 is an exploded schematic view of the electronic device of the present application. Figure 2a and Figure 2b is a structural schematic view of the circuit board in the electronic device of the present application. As Figure 1 As shown in FIG. 2, one embodiment of the present application provides an electronic device, comprising:

[0046] a shell 10;

[0047] a circuit board 20, the circuit board 20 is arranged inside the shell 10, the first heat generating element 21 and the second heat generating element 22 are arranged on the circuit board 20, the heat generation of the first heat generating element 21 is greater than that of the second heat generating element 22;

[0048] The circuit board 20 is fixed to the inner surface of the shell 10 by a fastening device, so that the first heat generating element 21 is attached to the shell 10 and dissipates heat through the shell 10, and the fastening device comprises:

[0049] a first fastening device 31, the first fastening device 31 is adjacent to the first heat generating element 21, the first fastening device 31 fixes the circuit board 20 to the inner surface of the shell 10, and applies pressure to the circuit board in the direction of the inner surface of the shell 10, so that the part of the circuit board 20 containing the first heat generating element 21 is locally deformed to attach to the inner surface of the shell 10; and

[0050] a second fastening device 32, the second fastening device 32 is adjacent to the second heat generating element 22, and the second fastening device 32 fixes the circuit board 20 to the inner surface of the shell 10.

[0051] In the embodiment, the circuit board 20 is fixed to the housing 10 by the fastening device, and the purpose of heat dissipation of the heat generating elements through the housing 10 is achieved by the adhesion of the circuit board 20 to the inner surface of the housing 10. The heat generating elements on the circuit board 20 can include a first heat generating element 21 and a second heat generating element 22, and the first heat generating element 21 has a greater heat generation than the second heat generating element 22. For example, the first heat generating element 21 can be a CPU, and the second heat generating element 22 can be a secondary heat generating element such as a memory stick. The first heat generating element 21 needs to be further cooled by the housing 10.

[0052] The embodiment provides a local deformation of the circuit board 20, so that the deformed part can be kept in adhesion with the inner surface of the housing 10, especially for the part of the first heat generating element 21 which is the main heat generating element. A first fastening device 31 is used to apply a deformation pressure to the circuit board 20, and when the part of the circuit board 20 containing the first heat generating element 21 is fixed to the inner surface of the housing 10 by the first fastening device 31, the first fastening device 31 applies a pressure to the circuit board 20 in the direction of the inner surface of the housing 10, so that the part of the circuit board 20 containing the first heat generating element 21 is deformed in the direction of the inner surface of the housing 10, thereby ensuring the adhesion of the first heat generating element 21 with the inner surface of the housing 10.

[0053] Specifically, the first fastening device 31 can be realized in the form of a spring screw. As shown in Figure 2b The first fastening device 31 is arranged around the first heat generating element 21, for example at the four corners thereof. The first fastening device 31 can include a first screw 311 and a first spring 312 surrounding the first screw 311. When the spring screw is fixed, the circuit board 20 can be locally deformed under the action of the spring pressure to drive the first heat generating element 21 (for example, a CPU) to move towards the inner surface of the housing 10, thereby keeping the adhesion with the inner surface of the housing 10.

[0054] As Figure 3 shown, the inner surface of the housing 10 includes:

[0055] a first connecting portion 11 protruding from the inner surface of the housing 10 for fastening connection with the first fastening device 31; and

[0056] a second connecting portion 12 protruding from the inner surface of the housing 10 for fastening connection with the second fastening device 32;

[0057] The height of the first connecting portion 11 is less than the height of the second connecting portion 12, so that the circuit board 20 has a first gap with the top end of the first connecting portion 11.

[0058] The first connecting part 11 and the second connecting part 12 can be realized in the form of studs for supporting the circuit board 20. When the circuit board 20 is fixed to the inner surface of the shell 10 by the fastening device, the height of the second connecting part 12 determines the position of the circuit board 20, and the bottom surface of the circuit board 20 is attached to the top end of the second connecting part 12, but has a first gap L with the top end of the first connecting part 11. The existence of the first gap provides a deformation space for the partial deformation of the circuit board 20 towards the inner surface of the shell 10, so that the circuit board 20 has the possibility of partial deformation. Then under the pressure of the first spring 312 of the first fastening device 31, the circuit board 20 can be deformed towards the direction of reducing the first gap.

[0059] Specifically, the first fastening device 31 comprises:

[0060] a first screw 311, which is threadedly connected with the first connecting part 11; and

[0061] a first spring 312, which is arranged around the first screw 311 between the first screw 311 and the first connecting part 11, and has a first compression amount when the first screw 311 is connected with the first connecting part 11. The first compression amount is less than or equal to the first gap, so as to avoid the circuit board 20 from being excessively pressed against the first connecting part 11 and being broken.

[0062] The second fastening device 32 can be realized as a common screw, which only plays a role of fixed connection and does not additionally apply pressure to the circuit board 20. Then the circuit board 20 can only be partially deformed at the position connected by the first connecting part 11 and the first fastening device 31.

[0063] Figure 4 is a structural schematic diagram of a second embodiment of the electronic device of the present application. As shown in the figure, the electronic device of the present embodiment comprises: Figure 4

[0064] a shell 10;

[0065] a circuit board 20, which is arranged inside the shell 10, and on which a first heat-generating element 21 and a second heat-generating element 22 are arranged, the heat-generating amount of the first heat-generating element 21 being greater than that of the second heat-generating element 22;

[0066] The circuit board 20 is fixed to the inner surface of the shell 10 by a fastening device, so that the first heat-generating element 21 is attached to the shell 10 and dissipates heat through the shell 10. The fastening device comprises:

[0067] ​a first fastening device 31 adjacent to the first heat generating element 21, the first fastening device 31 fixing the circuit board 20 to the inner surface of the housing 10 and applying a pressure to the circuit board in a direction towards the inner surface of the housing 10 to cause a local deformation of the portion of the circuit board 20 containing the first heat generating element 21 to conform to the inner surface of the housing 10; and

[0068] a second fastening device 32 adjacent to the second heat generating element 22, the second fastening device 32 fixing the circuit board 20 to the inner surface of the housing 10;

[0069] a heat dissipation module 40, the heat dissipation module 40 comprising:

[0070] a first heat dissipation element 41 arranged on the inner surface of the housing 10 and corresponding to the position of the first heat generating element 21, the circuit board 20 being fixed to the inner surface of the housing 10 by the fastening device so that the first heat generating element 21 conforms to the first heat dissipation element 41 and dissipates heat through the first heat dissipation element 41;

[0071] The local deformation of the circuit board 20 increases the contact force between the first heat generating element 21 and the first heat dissipation element 41.

[0072] The first heat dissipation element 41 can be implemented by a metal, such as a copper sheet, having a high thermal conductivity.

[0073] In a preferred embodiment, the first heat dissipation element 41 is adjustably fixed to the inner surface of the housing 10 in a direction perpendicular to the inner surface of the housing 10, the first heat dissipation element 41 moving towards the inner surface of the housing 10 in response to a contact force exceeding a first threshold value, or moving away from the inner surface of the housing 10 in response to a contact force less than the first threshold value.

[0074] To prevent overpressure between the first heat generating element 21 and the first heat dissipation element 41, which can cause damage to the chip, the first heat dissipation element 41 can have a degree of freedom of movement in a direction perpendicular to the inner surface of the housing 10, similar to the first heat generating element 21. When the contact force between the first heat generating element 21 and the first heat dissipation element 41 is too large, the first heat dissipation element 41 moves towards the inner surface of the housing 10 in response to the contact force exceeding the first threshold value, and when the contact force between the first heat generating element 21 and the first heat dissipation element 41 is too small, the first heat dissipation element 41 moves away from the inner surface of the housing 10 in response to the contact force being less than the first threshold value, to maintain close contact between the first heat generating element 21 and the first heat dissipation element 41.

[0075] In particular, as shown in Figure 4 the inner surface of the housing 10 comprises a first recess 13 recessed inwardly, the first recess 13 corresponding in position and shape to the first heat dissipation element 41;

[0076] The first heat-dissipating element 41 is fixed in the first recess 13 of the housing 10 by the third fastening device 33, and the first heat-dissipating element 41 has a second gap with the bottom surface of the first recess 13.

[0077] The fixing mode of the first heat-dissipating element 41 is similar to that of the circuit board 20 around the first heat-generating element 21, and it provides a deformation space through the gap in the local deformation direction of the circuit board 20. And the movement of the first heat-dissipating element 41 is driven by the first heat-generating element 21 which presses it, in order to unload the excessive pressure applied by the first heat-generating element 21, so as to avoid the fracture of the circuit board 20 due to the overpressure caused by the need for heat dissipation.

[0078] Similarly, the third fastening device 33 comprises:

[0079] A third screw 331 which is screwed with the first recess 13; and

[0080] A third spring 332 which is installed around the third screw 331 between the third screw 331 and the first recess 13, and the third spring 332 has a third compression amount when the third screw 331 is installed in the first recess 13, and the third compression amount is less than or equal to the second gap.

[0081] Therefore, the first threshold of the contact force can be determined by the spring force, yield strength coefficient and other parameters of the third spring 332. For example, when the pressure applied by the first heat-generating element 21 to the first heat-dissipating element 41 is greater than the spring force of the third spring 332, the equilibrium state of the third spring 332 changes, the third spring 332 is further compressed, and thereby drives the first heat-dissipating element 41 to move in the direction that makes the second gap smaller, that is, drives the first heat-dissipating element 41 to move in the direction of adhering to the inner surface of the housing 10, and thereby reduces the pressure applied by the first heat-generating element 21 to the first heat-dissipating element 41. However, the movement of the first heat-dissipating element 41 in the direction of adhering to the inner surface of the housing 10 does not make the first heat-dissipating element 41 out of contact with the first heat-generating element 21, but it is a way of dynamically adjusting the contact force.

[0082] Similarly, when the pressure applied by the first heat-generating element 21 to the first heat-dissipating element 41 is less than the spring force of the third spring 332, the equilibrium state of the third spring 332 changes, the spring force of the third spring 332 is released, and thereby drives the first heat-dissipating element 41 to move in the direction that makes the second gap larger, that is, drives the first heat-dissipating element 41 to move in the direction of moving away from the inner surface of the housing 10, and thereby increases the pressure applied by the first heat-generating element 21 to the first heat-dissipating element 41, so as to maintain the contact force with the first heat-generating element 21.

[0083] The electronic device of the embodiment adopts a dynamic adjustment mode of a double-position and double-direction spring screw, so that the good heat conduction capacity of the main chip is ensured, and the chip is prevented from being damaged.

[0084] Figure 5 FIG. 3 is a structural schematic diagram of a heat dissipation module in a third embodiment of the electronic device of the present application. As shown in FIG. 3, an outer shell 10 is provided. Figure 5

[0085] A circuit board 20 is arranged inside the outer shell 10, and a first heat generating element 21 and a second heat generating element 22 are arranged on the circuit board 20. The heat generating amount of the first heat generating element 21 is greater than that of the second heat generating element 22.

[0086] The circuit board 20 is fixed to the inner surface of the outer shell 10 by a fastening device, so that the first heat generating element 21 is attached to the outer shell 10 and dissipates heat through the outer shell 10. The fastening device includes:

[0087] A first fastening device 31 is arranged adjacent to the first heat generating element 21. The first fastening device 31 fixes the circuit board 20 to the inner surface of the outer shell 10 and applies a pressure to the circuit board in the direction of the inner surface of the outer shell 10, so that the portion of the circuit board 20 containing the first heat generating element 21 is locally deformed to attach to the inner surface of the outer shell 10; and

[0088] A second fastening device 32 is arranged adjacent to the second heat generating element 22. The second fastening device 32 fixes the circuit board 20 to the inner surface of the outer shell 10.

[0089] A heat dissipation module 40 includes:

[0090] A first heat dissipation element 41 is arranged on the inner surface of the outer shell 10 and corresponds to the position of the first heat generating element 21. The circuit board 20 is fixed to the inner surface of the outer shell 10 by the fastening device, so that the first heat generating element 21 is attached to the first heat dissipation element 41 and dissipates heat through the first heat dissipation element 41.

[0091] A second heat dissipation element 42 is arranged on the inner surface of the outer shell 10 and connected to the first heat dissipation element 41 to form a heat dissipation path for the first heat generating element 21 in combination with the first heat dissipation element 41. The second heat dissipation element 42 avoids the second heat generating element 22.

[0092] The second heat dissipation element 42 can be realized in the form of a heat pipe, which can be one or more, and can be bent, wound, or the like to increase the length of extension and the surface area for heat dissipation as much as possible.

[0093] In a preferred embodiment, the outer shell 10 includes:

[0094] ​The boss 14 protrudes from the inner surface of the housing 10 and corresponds to the position of the second heat generating element 22;

[0095] The circuit board 20 is fixed to the inner surface of the housing 10 by the fastening device, and the second heat generating element 22 has a third gap with the boss 14.

[0096] According to the above technical solution, the embodiment provides a kind of to make the partial deformation of circuit board, to make the part of deformed portion can keep with the adhesion of the inner surface of shell, especially for the part of main heat generating element-first heat generating element.This embodiment provides a kind of first fastening device that can apply deformation pressure to circuit board, when the part of circuit board containing first heat generating element is fixed to the inner surface of shell by first fastening device, it applies the pressure in the direction of the inner surface of shell to circuit board, so that the part of circuit board containing first heat generating element occurs the deformation in the direction of the adhesion of the inner surface of shell, to guarantee the adhesion contact of first heat generating element and the inner surface of shell.

[0097] Further, to guarantee that first heat generating element and first heat dissipating element do not form overpressure, leading to chip damage, first heat dissipating element can be similar to first heat generating element with the moving freedom degree along the direction perpendicular to the inner surface of shell. Then when the contact force between first heat generating element and first heat dissipating element is too large, it moves towards the inner surface of shell in response to the contact force exceeding first threshold value, and when the contact force between first heat generating element and first heat dissipating element is small, it moves in the direction away from the inner surface of shell in response to the contact force less than first threshold value, to keep the close adhesion of first heat generating element and first heat dissipating element.

[0098] The electronic device of the embodiment adopts the dynamic adjustment mode of double-position and bidirectional spring screw, guarantees the good heat conduction capacity of main chip, and also guarantees that chip will not be damaged.

[0099] In this document, "one" does not mean to limit the number of relevant parts of the application to "only one", and "one" does not mean to exclude the case that the number of relevant parts of the application is "more than one".

[0100] Unless otherwise stated, the numerical range in this document includes not only the entire range between the two endpoints, but also several sub-ranges contained therein.

[0101] The series of detailed descriptions listed above are only specific descriptions of feasible implementation modes of the present application, and are not used to limit the protection scope of the present application, and equivalent implementation schemes or changes made without departing from the spirit of the present application, such as combination, division or repetition of features, should be included in the protection scope of the present application.

Claims

1. An electronic device, characterized by comprising: The application relates to a heat dissipation device. The heat dissipation device comprises: a housing (10); a circuit board (20) arranged in the housing (10), wherein a first heat generating element (21) and a second heat generating element (22) are arranged on the circuit board (20), and the first heat generating element (21) generates more heat than the second heat generating element (22); the circuit board (20) is fixed to the inner surface of the housing (10) by a fastening device, so that the first heat generating element (21) is attached to the inner surface of the housing (10) and dissipates heat through the housing (10), and the fastening device comprises: a first fastening device (31) adjacent to the first heat generating element (21), which fixes the circuit board (20) to the inner surface of the housing (10) and applies pressure to the circuit board (20) towards the inner surface of the housing (10), so that the part of the circuit board (20) containing the first heat generating element (21) is locally deformed to attach to the inner surface of the housing (10); and a second fastening device (32) adjacent to the second heat generating element (22), which fixes the circuit board (20) to the inner surface of the housing (10); the inner surface of the housing (10) comprises: a first connecting part (11) protruding from the inner surface of the housing (10) and used for fastening connection with the first fastening device (31); and a second connecting part (12) protruding from the inner surface of the housing (10) and used for fastening connection with the second fastening device (32); 2.The electronic device of claim 1, wherein, wherein the height of the first connecting part (11) is less than the height of the second connecting part (12), so that the circuit board (20) has a first gap with the top end of the first connecting part (11). The first fastening device (31) comprises: a first screw (311) threadedly connected with the first connecting part (11); and 3.The electronic device of claim 2, wherein, a first spring (312) arranged between the first screw (311) and the first connecting part (11) around the first screw (311), wherein the first spring (312) has a first compression amount when the first screw (311) is connected with the first connecting part (11). 4.The electronic device of claim 1, wherein, The first compression amount is less than or equal to the first gap. The heat dissipation device further comprises a heat dissipation module (40), which comprises: a first heat dissipation element (41) arranged on the inner surface of the housing (10) and corresponding to the position of the first heat generating element (21), wherein the circuit board (20) is fixed to the inner surface of the housing (10) by a fastening device, so that the first heat generating element (21) is attached to the first heat dissipation element (41) and dissipates heat through the first heat dissipation element (41). The local deformation of the circuit board (20) increases the contact force between the first heat generating element (21) and the first heat dissipating element (41). 5.The electronic device of claim 4, wherein, The first heat dissipating element (41) is adjustably fixed to the inner surface of the housing (10) along a direction perpendicular to the inner surface of the housing (10), and moves towards the inner surface of the housing (10) in response to the contact force exceeding a first threshold, or moves away from the inner surface of the housing (10) in response to the contact force being less than the first threshold. 6.The electronic device of claim 5, wherein, The inner surface of the housing (10) comprises a first recess (13) recessed inwardly, the first recess (13) corresponding in position and shape to the first heat dissipating element (41); The first heat dissipating element (41) is fixed in the first recess (13) of the housing (10) by a third fastening device (33), and has a second gap with the bottom surface of the first recess (13). 7.The electronic device of claim 6, wherein, The third fastening device (33) comprises: a third screw (331) threadedly connected with the first recess (13); and a third spring (332) installed between the third screw (331) and the first recess (13) around the third screw (331), the third spring (332) having a third compression amount less than or equal to the second gap when the third screw (331) is installed in the first recess (13). 8.The electronic device of claim 4, wherein, The heat dissipation module (40) comprises: a second heat dissipating element (42) installed on the inner surface of the housing (10) and connected with the first heat dissipating element (41) to form a heat dissipation path for the first heat generating element (21) in combination with the first heat dissipating element (41), the second heat dissipating element (42) avoiding the second heat generating element (22). 9.The electronic device of claim 1, wherein, The housing (10) comprises: a boss (14) protruding from the inner surface of the housing (10) and corresponding in position to the second heat generating element (22); The circuit board (20) is fixed to the inner surface of the housing (10) by a fastening device, and has a third gap between the second heat generating element (22) and the boss (14).

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