Optoelectronic transmission composite module

Abstract

An optical-electric transmission composite module has: an optical-electric hybrid substrate (5) configured to be optically connected to an optical-electric conversion unit (6), the optical-electric hybrid substrate (5) sequentially including an optical waveguide (51) and a circuit substrate (52) toward one side in a thickness direction; a printed circuit board (4) electrically connected to the circuit substrate (52); a heat dissipation layer (3); and a metal housing (2) accommodating the optical-electric hybrid substrate (5), the printed circuit board (4), and the heat dissipation layer (3), the housing (2) including a first wall (21). The first wall (21), the heat dissipation layer (3), a portion of the printed circuit board (4), and the optical-electric hybrid substrate (5) are sequentially arranged toward one side in the thickness direction. The heat dissipation layer (3) is in contact with the first wall (21) and the printed circuit board (4).

Description

TECHNICAL FIELD

[0001] The present application relates to an optical-electric transmission composite module. BACKGROUND

[0002] In the past, there has been known an optical module which sequentially includes, toward a lower side, a photoelectric converter, an FPC (Flexible Printed Circuit), an optical waveguide, a heat sink, a printed circuit board, and a lower wall of a housing (for example, refer to Patent Literature 1). In the optical module of Patent Literature 1, heat generated from the photoelectric converter is mainly dissipated to the lower wall of the housing via the heat sink.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Publication No. 2015-22129 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] However, heat generated from the photoelectric converter itself can cause damage to the photoelectric converter or have an influence on the working performance, and thus a further higher heat dissipation is required for the optical module. However, in the optical module described in Patent Literature 1, there is a disadvantage that the above requirement cannot be satisfied.

[0008] The present application provides an optical-electric transmission composite module which can efficiently dissipate heat from a photoelectric conversion section.

[0009] SOLUTION TO THE PROBLEM

[0010] The present application (1) provides an optical-electric transmission composite module including: a photoelectric mixed substrate configured to be optically connected to a photoelectric conversion section, the photoelectric mixed substrate sequentially including an optical waveguide and a circuit substrate toward one side in a thickness direction; a printed circuit board electrically connected to the circuit substrate; a heat dissipation member; and a housing made of metal which houses a part of the printed circuit board, the photoelectric mixed substrate, and the heat dissipation member, the housing including a first wall, the first wall, the heat dissipation member, the printed circuit board, and the photoelectric mixed substrate being sequentially arranged toward one side in the thickness direction, and the heat dissipation member being in contact with the first wall and the printed circuit board.

[0011] In the optical-electric transmission composite module, since the heat dissipation member is in contact with the first wall and the printed circuit board, the heat generated in the photoelectric conversion section and reaching the heat dissipation member via the photoelectric mixed substrate and the printed circuit board can be efficiently dissipated to the first wall. Therefore, the photoelectric conversion section can efficiently work, and further, the heat from the photoelectric conversion section can be efficiently dissipated to the housing.

[0012] The present application (2) is based on the optoelectronic transmission composite module described in (1), and the Asker-C hardness of the heat dissipation member at 23°C is 75 or less.

[0013] Since the Asker-C hardness of the heat dissipation member is 75 or less, the heat dissipation member can be tightly attached to the first wall and the printed circuit board. Therefore, the heat generated in the optoelectronic conversion section can be further efficiently dissipated to the case.

[0014] The present application (3) is based on the optoelectronic transmission composite module described in (1) or (2), and the thermal conductivity of the heat dissipation member in the thickness direction is 5 W / m·K or more.

[0015] In the optoelectronic transmission composite module, since the thermal conductivity of the heat dissipation member is 5 W / m·K or more, the heat generated in the optoelectronic conversion section can be further efficiently dissipated.

[0016] The present application (4) is based on the optoelectronic transmission composite module described in any one of (1) to (3), and the optoelectronic transmission composite module further includes an optoelectronic conversion section optically connected to the optoelectronic hybrid substrate, and a second heat dissipation member in contact with the optoelectronic conversion section, and the case further includes a second wall disposed on the opposite side of the first wall with respect to the optoelectronic conversion section in the thickness direction, and the second heat dissipation member is in contact with the second wall.

[0017] Since the optoelectronic transmission composite module further includes a second heat dissipation member in contact with the second wall, the heat generated in the optoelectronic conversion section can be further efficiently dissipated. That is, the heat generated in the optoelectronic conversion section can be efficiently dissipated to the case by both the heat dissipation member and the second heat dissipation member.

[0018] The present application (5) is based on the optoelectronic transmission composite module described in any one of (1) to (4), and the Asker-C hardness of the second heat dissipation member at 23°C is 55 or less.

[0019] In the optoelectronic transmission composite module, since the Asker-C hardness of the second heat dissipation member is 55 or less, the second heat dissipation member can be softly in contact with the optoelectronic conversion section. Thus, the damage to the optoelectronic conversion section can be suppressed.

[0020] Effects of the Invention

[0021] In the optoelectronic transmission composite module of the present application, the heat generated in the optoelectronic conversion section can be further efficiently dissipated. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a cross-sectional view of an embodiment of the optoelectronic transmission composite module of the present application.

[0023] Figure 2 is Figure 1 a cross-sectional view of a modification of the optoelectric transmission composite module shown in

[0024] Figure 3 is Figure 1 a cross-sectional view of a modification of the optoelectric transmission composite module shown in

[0025] Figure 4 is Figure 3 a cross-sectional view of a further modification of the optoelectric transmission composite module shown in

[0026] Figure 5 is Figure 4 a cross-sectional view of a further modification of the optoelectric transmission composite module shown in

[0027] Figure 6 is a cross-sectional view of the optoelectric transmission composite module of Comparative Example 1. DETAILED DESCRIPTION

[0028] <One Embodiment>

[0029] Referring to Figure 1 and describing one embodiment of the optoelectric transmission composite module of the present application.

[0030] The optoelectric transmission composite module 1 has a predetermined thickness and has a shape extending in a length direction. The optoelectric transmission composite module 1 converts and transmits light transmitted thereto, and converts and transmits electricity transmitted thereto. The optoelectric transmission composite module 1 is provided with a case 2, a heat dissipation layer 3 which is one example of a heat dissipation member, a printed circuit board 4, an optoelectric hybrid substrate 5, and an optoelectric conversion section 6.

[0031] The case 2 has a substantially flat box shape in which a length in a thickness direction is shorter than a length in a width direction (a direction orthogonal to the thickness direction and the length direction). The case 2 has at least a first wall 21, a second wall 22, a connecting wall 23, a second connecting wall not shown, and two side walls not shown, integrally.

[0032] The first wall 21 has a flat plate shape extending in the length direction.

[0033] The second wall 22 is disposed opposite to the first wall 21 at an interval in the thickness direction of the first wall 21. The second wall 22 has the same shape as the first wall 21.

[0034] The connecting wall 23 connects one end edge in the length direction of the first wall 21 and one end edge in the length direction of the second wall 22 in the thickness direction. The connecting wall 23 has a flat plate shape extending in the width direction. Further, in the thickness direction middle portion of the connecting wall 23, a hole 7 into which one end portion of the printed circuit board 4 is inserted is formed. The hole 7 penetrates the connecting wall 23 in the length direction.

[0035] A second connecting wall, not shown, connects the other end edge in the length direction of the first wall 21 and the other end edge in the length direction of the second wall 22 in the thickness direction. The second connecting wall extends in the width direction, and the outer shape of the second connecting wall is the same as the outer shape of the connecting wall 23.

[0036] Two side walls, not shown, connect one end edge in the width direction of the first wall 21 and one end edge in the width direction of the second wall 22 in the thickness direction, and connect the other end edge in the width direction of the first wall 21 and the other end edge in the width direction of the second wall 22 in the thickness direction. Further, the two side walls, not shown, are continuous with the width direction both end edges of the connecting wall 23 and the width direction both end edges of the second connecting wall, not shown. The two side walls extend in the length direction, respectively.

[0037] Further, the housing 2 can be constituted of two members, a first member 91 including the first wall 21, the connecting wall 23, the second connecting wall, and a part (the other side portion in the thickness direction) of the two side walls, and a second member 92 including the second wall 22, the second connecting wall, and the remaining part (the one side portion in the thickness direction) of the two side walls.

[0038] The housing 2 is made of metal. That is, the material of the housing 2 is metal. As the metal, for example, aluminum, copper, silver, zinc, nickel, chromium, titanium, tantalum, platinum, gold, alloys thereof (brass, bronze, stainless steel, etc.), and the like can be cited. It is preferable to be an alloy, and more preferably brass (an alloy of copper and zinc) is cited.

[0039] The heat dissipation layer 3 has a predetermined thickness and has a shape extending in the longitudinal direction. The heat dissipation layer 3 is housed in the housing 2. Specifically, the heat dissipation layer 3 is in contact with the surface of one side in the thickness direction of the first wall 21. In detail, the heat dissipation layer 3 is in contact with the entire surface of one side in the thickness direction of the first wall 21. The heat dissipation layer 3 contains, for example, a heat dissipation sheet, a heat dissipation grease, a heat dissipation plate, or the like. As a material of the heat dissipation sheet, a filler resin composition in which a filler is dispersed in a resin can be given. As the filler, for example, aluminum oxide, boron nitride, zinc oxide, aluminum hydroxide, fused silica, magnesium oxide, aluminum nitride, carbon fiber, or the like can be given. As the resin, for example, a silicone resin, an epoxy resin, an acrylic resin, a polyurethane resin, or the like can be given, and an epoxy resin is preferably given. In addition, in the epoxy resin, a curing agent can be added. In order to obtain higher thermal conductivity, the heat dissipation sheet contains, for example, a material in which an anisotropic filler such as boron nitride or carbon fiber is oriented in the thickness direction. In the heat dissipation sheet, for example, the filler can be oriented in the thickness direction with respect to the resin. In addition, the resin contains a thermosetting resin, and is B-stage or C-stage. Furthermore, the resin can contain a thermoplastic resin. The proportions of the filler and the resin can be appropriately adjusted so as to be the Asker-C hardness and the thermal conductivity coefficient described later.

[0040] The Asker-C hardness of the heat dissipation layer 3 is, for example, 75 or less, preferably 55 or less, more preferably 50 or less, further preferably 40 or less, and, for example, 1 or more. The Asker-C hardness of the heat dissipation layer 3 can be found by an Asker rubber hardness tester type C. If the Asker-C hardness of the heat dissipation layer 3 is the upper limit or less, the heat dissipation layer 3 can be tightly attached to the first wall 21 and the printed circuit board 4, and thus the heat dissipation property of the heat dissipation layer 3 can be improved.

[0041] The thermal conductivity coefficient in the thickness direction of the heat dissipation layer 3 is, for example, 1 W / m·K or more, preferably 5 W / m·K or more, more preferably 8 W / m·K or more, further preferably 10 W / m·K or more, and, for example, 200 W / m·K or less. The thermal conductivity coefficient of the heat dissipation layer 3 is found by a steady state method based on ASTM-D5470 or a hot disk method based on ISO-22007-2. If the thermal conductivity coefficient of the heat dissipation layer 3 is the lower limit or more, heat generated by the photoelectric conversion section 6 can be efficiently dissipated via the heat dissipation layer 3.

[0042] The thickness of the heat dissipation layer 3 is, for example, 100 μm or more, preferably 300 μm or more, and, for example, 3000 μm or less, preferably 1000 μm or less.

[0043] For the heat dissipation layer 3, a commercially available product can be used.

[0044] The printed circuit board 4 has a predetermined thickness and has a shape extending in the length direction. A portion (one example of a portion) of the printed circuit board 4 other than a later-described protruding end portion 76 is housed in the case 2.

[0045] Specifically, the printed circuit board 4 has a substantially rectangular outer shape in plan view. The printed circuit board 4 is in contact with the face of one side in the thickness direction of the heat dissipation layer 3. The printed circuit board 4 includes a support plate 71 and a conductor circuit 72.

[0046] The support plate 71 is parallel to the first wall 21 and has a shape extending in the length direction. The support plate 71 includes the protruding end portion 76. The protruding end portion 76 is provided at the end portion of one side in the length direction of the support plate 71 and protrudes from the coupling wall 23 toward one side in the length direction. As a material of the support plate 71, for example, a hard material such as glass fiber reinforced epoxy resin can be cited. The Shore A hardness of the support plate 71 is, for example, 80 or more, further 90 or more, and also, for example, 200 or less. If the Shore A hardness of the support plate 71 is the above lower limit or more, the strength of the protruding end portion 76 can be reliably ensured, and the optoelectronic hybrid substrate 5 and the photoelectric conversion portion 6 can be reliably supported. As for the Shore A hardness, a durometer (spring-type rubber hardness tester) can be used and measured based on Japanese Industrial Standards JIS K 6253-3 (2012).

[0047] The conductor circuit 72 is disposed on the face of one side in the thickness direction of the support plate 71. The conductor circuit 72 has a third terminal 73, a fourth terminal 74, and a wiring not shown.

[0048] The third terminal 73 is housed in the case 2. The third terminal 73 is disposed apart from the coupling wall 23 on the other side in the length direction of the coupling wall 23.

[0049] The fourth terminal 74 is disposed on the face of one side in the thickness direction of the protruding end portion 76.

[0050] The wiring not shown links the third terminal 73 and the fourth terminal 74.

[0051] As a material of the conductor circuit 72, for example, a conductor such as copper can be cited.

[0052] The thickness of the printed circuit board 4 is, for example, 100 μm or more, preferably 500 μm or more, more preferably 1000 μm or more, and also, for example, 10000 μm or less.

[0053] The optoelectronic hybrid substrate 5 is housed in the housing 2 and is mounted to the printed circuit board 4. The optoelectronic hybrid substrate 5 has a predetermined thickness and has a flat plate shape extending in the length direction. Specifically, the optoelectronic hybrid substrate 5 is in contact with the side surface in the thickness direction of the printed circuit board 4. The optoelectronic hybrid substrate 5 has the optical waveguide 51 and the circuit substrate 52 in this order toward the side in the thickness direction.

[0054] The optical waveguide 51 has a predetermined thickness and has a shape extending in the length direction. The optical waveguide 51 is in contact with the side surface in the thickness direction of the printed circuit board 4. The optical waveguide 51 has the lower clad layer 53, the core layer 54, and the upper clad layer 55.

[0055] The lower clad layer 53 has the same shape as the optical waveguide 51 in plan view.

[0056] The core layer 54 is disposed at the central portion in the width direction of the side surface in the thickness direction of the lower clad layer 53. The width of the core layer 54 is narrower than the width of the lower clad layer 53 in plan view.

[0057] The upper clad layer 55 is disposed on the side surface in the thickness direction of the lower clad layer 53 so as to cover the core layer 54. The upper clad layer 55 has the same shape as the outer shape of the lower clad layer 53 in plan view. Specifically, the upper clad layer 55 is disposed on the side surface in the thickness direction and the side surfaces in the width direction of the core layer 54 and on the side surface in the thickness direction of the portion of the lower clad layer 53 located outside the core layer 54 in the width direction. In addition, the upper clad layer 55 is in contact with the side surface in the thickness direction of the printed circuit board 4.

[0058] In addition, the mirror 16 is formed at one end portion in the length direction of the core layer 54.

[0059] As the material of the optical waveguide 51, for example, a transparent material such as an epoxy resin can be given. The refractive index of the core layer 54 is higher than the refractive index of the lower clad layer 53 and the refractive index of the upper clad layer 55. The thickness of the optical waveguide 51 is, for example, 20 μm or more and, for example, 200 μm or less.

[0060] The circuit substrate 52 has the same shape as the optoelectronic hybrid substrate 5 in plan view. That is, the circuit substrate 52 has a predetermined thickness and has a flat plate shape extending in the length direction. The circuit substrate 52 is disposed on the side in the thickness direction of the optical waveguide 51.

[0061] The circuit substrate 52 has the metal support layer 56, the base insulating layer 57, the conductor layer 58, and a not-shown cover insulating layer.

[0062] The metal support layer 56 has the same outer shape as the optoelectronic hybrid substrate 5 in plan view. The optical waveguide 51 is a portion of the optoelectronic hybrid substrate 5 on the other side in the thickness direction. Therefore, the metal support layer 56 is in contact with the lower cladding layer 53. As the material of the metal support layer 56, for example, a metal such as stainless steel can be given. The thickness of the metal support layer 56 is, for example, 3 μm or more, and for example, 100 μm or less. Further, the metal support layer 56 includes a through-hole 8 that penetrates the metal support layer 56 in the thickness direction. The through-hole 8 overlaps the mirror 16 when projected in the thickness direction.

[0063] The base insulating layer 57 has the same outer shape as the metal support layer 56 in plan view. The base insulating layer 57 is disposed on the side face of the metal support layer 56 in the thickness direction. Specifically, the base insulating layer 57 is in contact with the entire side face of the metal support layer 56 in the thickness direction. Further, the base insulating layer 57 closes the end edge of the through-hole 8 in the thickness direction. As the material of the base insulating layer 57, for example, a resin such as polyimide can be given. The thickness of the base insulating layer 57 is, for example, 5 μm or more, and for example, 40 μm or less.

[0064] The conductor layer 58 is disposed on the side face of the base insulating layer 57 in the thickness direction. The conductor layer 58 includes the first terminal 27, the second terminal 28, and a wiring not shown.

[0065] The first terminal 27 is disposed corresponding to the photoelectric conversion section 6 described later. The first terminal 27 is disposed with a plurality of first terminals 27 spaced apart from each other.

[0066] The second terminal 28 is disposed on the side of the first terminal 27 in the length direction of the first terminal 27, spaced apart from the first terminal 27. The second terminal 28 is electrically connected to the third terminal 73 via a lead 65.

[0067] The wiring not shown links the first terminal 27 and the second terminal 28.

[0068] As the material of the conductor layer 58, for example, a conductor such as copper can be given. The thickness of the conductor layer 58 is, for example, 3 μm or more, and for example, 20 μm or less.

[0069] The cover insulating layer not shown covers the wiring not shown. The cover insulating layer not shown is disposed on the side face of the base insulating layer 57 in the thickness direction. The material and the thickness of the cover insulating layer are the same as those of the base insulating layer 57.

[0070] The thickness of the optoelectronic hybrid substrate 5 is, for example, 20 μm or more, and for example, 200 μm or less.

[0071] The photoelectric conversion section 6 is housed in the housing 2 and is mounted to the photoelectric hybrid substrate 5. The photoelectric conversion section 6 is disposed on one side in the thickness direction of the first terminal 27 so as to face the first terminal 27. The photoelectric conversion section 6 includes a light-receiving / emitting member 61 and a bump 62.

[0072] The light-receiving / emitting member 61 has a substantially flat rectangular shape extending in the length direction and the width direction. The light-receiving / emitting member 61 includes light-receiving / emitting ports 63. The light-receiving / emitting ports 63 are provided in a plurality of (for example, four) at intervals on the side in the thickness direction of the light-receiving / emitting member 61. The light-receiving / emitting ports 63 overlap the through-hole 8 when projected in the thickness direction. Thus, the optical waveguide 51 of the photoelectric hybrid substrate 5 is optically connected to the photoelectric conversion section 6. Further, the light-receiving / emitting member 61 is offset to the other side in the length direction without overlapping the second terminal 28 when projected in the thickness direction. As the light-receiving / emitting member 61, for example, a light-emitting element that converts electricity into light, specifically, a surface-emitting type light-emitting diode (VECSEL) can be cited. In addition, as the light-receiving / emitting member 61, for example, a light-receiving element that converts light into electricity, specifically, a photodiode (PD) or the like can be cited. They can be used alone or in combination. Further, in the light-receiving / emitting member 61, a light-emitting drive element (specifically, a Driver IC) can be provided in the vicinity of the light-emitting element, and a light-receiving drive element (specifically, a TIA) can be provided in the vicinity of the light-receiving element.

[0073] The bump 62 is provided so as to protrude from the side in the thickness direction of the light-receiving / emitting member 61 toward the other side in the thickness direction. The bump 62 is positioned around the light-receiving / emitting ports 63. The length (thickness direction length, that is, thickness) of the bump 62 is, for example, 1 μm or more, and, for example, 100 μm or less. As the material of the bump 62, for example, a conductor such as copper, gold, or solder can be cited. The bump 62 is in contact with the first terminal 27. Thus, the light-receiving / emitting member 61 of the photoelectric conversion section 6 is electrically connected to the circuit substrate 52 of the photoelectric hybrid substrate 5.

[0074] Further, the light-receiving / emitting member 61, the bump 62, and the mounting portion of the photoelectric hybrid substrate 5 are reinforced by being fixed with an adhesive.

[0075] In this photoelectric transmission composite module 1, the first wall 21, the heat dissipation layer 3, the printed circuit board 4, the photoelectric hybrid substrate 5, and the photoelectric conversion section 6 are disposed in this order toward one side in the thickness direction.

[0076] Next, a manufacturing method of the photoelectric transmission composite module 1 will be described.

[0077] First, the heat dissipation layer 3 is disposed on the first wall 21 of the housing 2.

[0078] Next, the heat dissipation layer 3 is arranged on the side surface of the first wall 21 in the thickness direction. Specifically, the heat dissipation layer 3 is attached to the side surface of the first wall 21 in the thickness direction. Further, in the case where the housing 2 is composed of two members (the first member 91 and the second member 92), the end surface of the heat dissipation layer 3 in the longitudinal direction is brought into contact with the inner surfaces of the connecting wall 23 and the two side walls of the first member 91.

[0079] Next, the printed circuit board 4 is arranged on the side surface of the heat dissipation layer 3 in the thickness direction. Specifically, in the case where the first wall 21 is included in the first member 91, the printed circuit board 4 is arranged with respect to the housing 2 (the first member 91) and the heat dissipation layer 3 in such a manner that the printed circuit board 4 is attached to the heat dissipation layer 3 with the exception of the portion of the support plate 71 other than the protruding end portion 76, and the protruding end portion 76 is protruded from the connecting wall 23.

[0080] The optoelectronic hybrid substrate 5 and the photoelectric conversion section 6 are prepared separately.

[0081] In order to prepare the optoelectronic hybrid substrate 5, the optical waveguide 51 is provided to the circuit substrate 52 by a known method. Further, the bump 62 is arranged to the first terminal 27, and then the light receiving and emitting member 61 is connected to the bump 62, whereby the photoelectric conversion section 6 is mounted to the optoelectronic hybrid substrate 5. Thus, the optoelectronic hybrid substrate 5 on which the photoelectric conversion section 6 is mounted is prepared.

[0082] Next, the optoelectronic hybrid substrate 5 on which the photoelectric conversion section 6 is mounted is mounted to the printed circuit board 4. Specifically, the optical waveguide 51 is fixed (adhered by an adhesive not shown) to the printed circuit board 4, and the second terminal 28 and the third terminal 73 are connected via the lead wire 65.

[0083] Subsequently, the second member 92 including the second wall 22 is arranged to the first member 91. Specifically, the connecting wall 23, the second connecting wall not shown, and the two side walls not shown of the second member are joined to the connecting wall 23, the second connecting wall not shown, and the two side walls not shown of the first member 91, respectively. Thus, the housing 2 is fabricated.

[0084] Thus, the optoelectronic transmission composite module 1 provided with the housing 2, the heat dissipation layer 3, the printed circuit board 4, the optoelectronic hybrid substrate 5, and the photoelectric conversion section 6 is fabricated.

[0085] <Effects of One Embodiment>

[0086] Further, in the optoelectronic transmission composite module 1, since the heat dissipation layer 3 is in contact with the first wall 21 and the printed circuit board 4, heat generated in the photoelectric conversion section 6 and reaching the heat dissipation layer 3 via the optoelectronic hybrid substrate 5 and the printed circuit board 4 can be dissipated efficiently to the first wall 21. Thus, the photoelectric conversion section 6 can operate efficiently, and further, heat of the photoelectric conversion section 6 can be dissipated efficiently to the housing 2.

[0087] As described above, the material of the heat dissipation layer 3 is the filler resin composition containing the resin, and the heat dissipation layer 3 has moderate softness, so the heat dissipation layer 3 can softly contact both the first wall 21 and the printed circuit board 4. Specifically, if the Asker-C hardness of the heat dissipation layer 3 is as low as 75 or less, the heat dissipation layer 3 can be reliably tightly attached to the first wall 21 and the printed circuit board 4, so the heat dissipation property can be improved.

[0088] On the other hand, in the optical module described in Patent Document 1, even if the heat dissipation fin is soft, the heat dissipation fin does not contact the housing but contacts the printed circuit board and the optical waveguide, so the above-described excellent effect cannot be exerted.

[0089] In addition, in the optoelectric transmission composite module 1, if the thermal conductivity of the heat dissipation layer 3 is 5 W / m-K or more, the heat generated in the optoelectric conversion section 6 can be further efficiently dissipated.

[0090] <Modification Examples>

[0091] In each of the following modification examples, the same reference numerals are assigned to the same members and processes as those of the above-described embodiment, and detailed description thereof is omitted. In addition, the embodiment and each modification example can be appropriately combined. Furthermore, each modification example can exert the same functional effects as the embodiment except for those specifically described.

[0092] Figure 2 The optoelectric transmission composite module 1 illustrated further includes a second heat dissipation layer 80 as one example of a second heat dissipation member.

[0093] The second heat dissipation layer 80 is interposed between the optoelectric conversion section 6 and the second wall 22 and contacts them. In addition, the second heat dissipation layer 80 contacts at least the side surface of the light-receiving / emitting member 61 in the thickness direction. In addition, as illustrated by a virtual line of Figure 2 The second heat dissipation layer 80 can also contact the peripheral surface (both the lengthwise side surfaces and the widthwise side surfaces) of the light-receiving / emitting member 61, as illustrated by a virtual line of

[0094] The physical properties of the second heat dissipation layer 80 are the same as those of the heat dissipation layer 3. In particular, if the Asker-C hardness of the second heat dissipation layer 80 is as low as the above-described upper limit or less (preferably 50 or less), the second heat dissipation layer 80 can softly contact the light-receiving / emitting member 61 of the optoelectric conversion section 6. Damage to the optoelectric conversion section 6 due to contact with the second heat dissipation layer 80 can be suppressed.

[0095] In particular, when the first member 91 is engaged with the second member 92, the second heat dissipation layer 80 is easily damaged by the photoelectric conversion section 6 in the case where the second wall 22 is pressed against the second heat dissipation layer 80.

[0096] However, in this modification, since the second heat dissipation layer 80 has the above-described low Asker-C hardness (for example, 55 or less), damage to the photoelectric conversion section 6 can be efficiently suppressed.

[0097] To provide the second heat dissipation layer 80 to the photoelectric transmission composite module 1, for example, the heat dissipation layer 3 is provided to the first wall 21, the printed circuit board 4 is provided to the heat dissipation layer 3, the opto-electric hybrid substrate 5 on which the photoelectric conversion section 6 is mounted is provided to the printed circuit board 4, and then the second heat dissipation layer 80 is provided to the photoelectric conversion section 6. The second heat dissipation layer 80 is formed in a sheet shape from the same material as the heat dissipation layer 3.

[0098] Then, the second member 92 including the second wall 22 is connected to the first member 91. At this time, the second wall 22, for example, presses the second heat dissipation layer 80 of the B stage into the other side in the thickness direction. As a result, the second heat dissipation layer 80 is deformed, and comes into contact with the peripheral side surface of the light receiving / emitting member 61 and the surface on the side in the thickness direction of the portion of the opto-electric hybrid substrate 5 located around the light receiving / emitting member 61.

[0099] Thus, the photoelectric transmission composite module 1 provided with the housing 2, the heat dissipation layer 3, the printed circuit board 4, the opto-electric hybrid substrate 5, the photoelectric conversion section 6, and the second heat dissipation layer 80 is obtained.

[0100] The photoelectric transmission composite module 1 further includes the second heat dissipation layer 80 that is in contact with the second wall 22, and thus heat generated in the photoelectric conversion section 6 can be further efficiently dissipated. That is, heat of the photoelectric conversion section 6 can be efficiently dissipated to the housing 2 by both the heat dissipation layer 3 and the second heat dissipation layer 80.

[0101] In the photoelectric transmission composite module 1, if the Asker-C hardness of the second heat dissipation layer 80 is as low as 55 or less, the second heat dissipation layer 80 can be in soft contact with the photoelectric conversion section 6. Thus, damage to the photoelectric conversion section 6 can be suppressed.

[0102] In addition, the photoelectric transmission composite module 1 can have only the first terminal 27 and the second terminal 28 that are electrically connected to the photoelectric conversion section 6, and the opto-electric hybrid substrate 5 can not yet have the photoelectric conversion section 6 mounted thereto.

[0103] As shown in FIG. 6, the arrangement in the thickness direction of the optical waveguide 51, the circuit substrate 52, and the photoelectric conversion section 6 can be reversed. Figures 3-5

[0104] Figure 3 ​​As shown, in the optoelectronic transmission composite module 1, the optical waveguide 51, the circuit substrate 52, and the optoelectronic conversion section 6 are arranged in this order toward the other side in the thickness direction.

[0105] The printed circuit board 4 has a through-hole 41 that penetrates the printed circuit board 4 in the thickness direction. The optoelectronic conversion section 6 is arranged inside the through-hole 41. The 3rd terminal 73 is arranged on one side in the length direction of the through-hole 41 and is in the vicinity of the through-hole 41. In addition, the circuit substrate 52 is fixed to the face on one side in the thickness direction of the portion of the optoelectronic conversion section 6 that is around the through-hole 41 by means of the adhesive 42.

[0106] In Figure 3 the modification, the heat dissipation layer 3 contacts the face on the other side in the thickness direction of the printed circuit board 4 and the inner side face of the through-hole 41, the face on the other side in the thickness direction of the optoelectronic conversion section 6 and the outer peripheral face, and the face on the other side in the thickness direction of the portion of the circuit substrate 52 that is around the optoelectronic conversion section 6.

[0107] In Figure 4 the modification, a 2nd heat dissipation layer 80 is arranged between the 2nd wall 22 and the optical waveguide 51. The 2nd heat dissipation layer 80 contacts the 2nd wall 22 and the optical waveguide 51.

[0108] In Figure 5 the modification, the 1st wall 21 has a 1st protruding portion 25. The 2nd wall 22 has a 2nd protruding portion 26.

[0109] The 1st protruding portion 25 protrudes from the 1st wall 21 toward one side in the thickness direction. The 1st protruding portion 25 contacts the heat dissipation layer 3.

[0110] The 2nd protruding portion 26 protrudes from the 2nd wall 22 toward the other side in the thickness direction. The 2nd protruding portion 26 contacts the 2nd heat dissipation layer 80.

[0111] Embodiment

[0112] The following production examples, embodiments, and comparative examples further specifically explain the present application. Furthermore, the present application is not limited by any of the production examples, embodiments, and comparative examples. In addition, the specific numerical values of the compounding ratio (proportion), physical property values, parameters, and the like used in the following description can be replaced by the upper limit (numerical value defined by "or less," "below") or lower limit (numerical value defined by "or more," "greater than") of the compounding ratio (proportion), physical property values, parameters, and the like described in the above "DETAILED DESCRIPTION" that correspond to these.

[0113] Production Example 1

[0114] PK95 manufactured by LiPOLY Co., Ltd. was used as the heat dissipation sheet (heat dissipation sheet A).

[0115] Production Example 2

[0116] A clear varnish was prepared by mixing appropriate amounts of alumina (DAM-70 manufactured by Denka Co., Ltd.) as filler, epoxy resin (jER828 manufactured by Mitsubishi Chemical Co., Ltd.) as resin, and curing agents (SI-60 and SI-S manufactured by Sanshin Chemical Co., Ltd.). Then, the clear varnish was applied to a film thickness of approximately 1 mm using an applicator, and the film was heated in an oven at 80°C for 30 minutes to produce heat sink B.

[0117] Preparation Example 3

[0118] Except for reducing the amount of alumina mixed to make the thermal conductivity lower than that of heat sink B in Preparation Example 2, heat sink C was produced by processing in the same way as in Preparation Example 2.

[0119] <Physical Properties of Heatsinks>

[0120] The physical properties of the heat sink and the second heat sink are recorded in Table 1.

[0121] Examples 1 to 3

[0122] Manufactured Figure 1 The photoelectric transmission composite module 1 is shown as one embodiment.

[0123] In Example 1, heat sink A is used in the fabrication of heat dissipation layer 3.

[0124] In Example 2, heat sink B is used in the fabrication of heat dissipation layer 3.

[0125] In Example 3, heat sink C is used in the fabrication of heat dissipation layer 3.

[0126] Examples 4 to 6

[0127] Manufactured Figure 2 The photoelectric transmission composite module 1 shown is a modified example. This photoelectric transmission composite module 1 also includes a second heat dissipation layer 80.

[0128] In Example 4, two heat sinks A are used in the fabrication of heat dissipation layer 3 and the second heat dissipation layer 80.

[0129] In Example 5, two heat sinks B are used in the fabrication of heat dissipation layer 3 and the second heat dissipation layer 80.

[0130] In Example 6, two heat sinks C are used in the fabrication of heat dissipation layer 3 and the second heat dissipation layer 80.

[0131] Comparative Example 1

[0132] Except for swapping the thickness orientation of the printed circuit board 4 and the heat dissipation layer 3, it was manufactured in the same manner as in Embodiment 1. Figure 6The photoelectric transmission composite module 1 shown.

[0133] In the photoelectric transmission composite module 1 of Comparative Example 1, the first wall 21, the printed circuit board 4, the heat dissipation layer 3, the photoelectric hybrid substrate 5, and the photoelectric conversion section 6 are arranged in this order toward one side in the thickness direction, and the heat dissipation layer 3 is not in contact with the first wall 21.

[0134] < Evaluation >

[0135] The following items were evaluated.

[0136] (1) Heat dissipation of the photoelectric conversion section

[0137] The photoelectric conversion section 6 was driven, and the heat dissipation was evaluated based on the following criteria.

[0138] The temperature of the light emitting element at the time of driving was calculated by simulation, and the heat dissipation was evaluated. In addition, in the simulation, as a model in which the photoelectric conversion section 6 including the light emitting element, the light emitting driving element, the light receiving element, and the light receiving driving element was provided, an environment in which cooling was performed at a wind speed of 0.1 m / s was set.

[0139] ◎: The temperature of the light emitting element was lower than 50°C.

[0140] O: The temperature of the light emitting element was 50°C or higher and lower than 55°C.

[0141] Δ: The temperature of the light emitting element was 55°C or higher and lower than 60°C.

[0142] X: The temperature of the light emitting element was 60°C or higher.

[0143] (2) Damage to the photoelectric conversion section

[0144] The photoelectric conversion section 6 was observed, and the damage was evaluated based on the following criteria.

[0145] ◎: No damage to the photoelectric conversion section 6 was observed at all.

[0146] O: Slight damage to the photoelectric conversion section 6 was observed.

[0147] [Table 1]

[0148]

[0149] In addition, the above-described application is provided as an example of an embodiment of the present application, but this is merely an example and is not to be limitatively interpreted. Modification examples of the present application that are obvious to those skilled in the art are included in the claims.

[0150] Industrial Applicability

[0151] The photoelectric transmission composite module is used for signal transmission.

[0152] Explanation of reference numerals in the attached figures

[0153] 1. Optoelectronic transmission composite module; 2. Housing; 3. Heat dissipation layer; 4. Printed circuit board; 5. Optoelectronic hybrid substrate; 6. Optoelectronic conversion unit; 21. First wall; 22. Second wall; 51. Optical waveguide; 52. Circuit board; 80. Second heat dissipation layer.

Claims

1. A photoelectric transmission composite module, characterized in that, This optoelectronic transmission composite module has the following features: An optoelectronic hybrid substrate is configured to be optoelectronically connected to a photoelectric conversion unit. The optoelectronic hybrid substrate includes an optical waveguide and a circuit board sequentially on one side facing the thickness direction. A printed circuit board electrically connected to the circuit board substrate; A heat dissipation component, wherein the Asker-C hardness of the heat dissipation component at 23°C is below 75; and A metal housing that houses a portion of the printed circuit board, the optoelectronic hybrid substrate, and the heat dissipation component, the housing comprising a first wall and sidewalls connected to the first wall. The first wall, the heat dissipation component, the printed circuit board, and the optoelectronic hybrid substrate are arranged sequentially on one side facing the thickness direction. The heat dissipation component physically contacts the surface of the first wall and the printed circuit board at a position on the opposite side of the printed circuit board in the thickness direction, and... The support plate of the printed circuit board has a Shore A hardness of 80 or higher.

2. The optoelectronic transmission composite module according to claim 1, characterized in that, The thermal conductivity of the heat dissipation component in the thickness direction is above 5 W / m·K.

3. The optoelectronic transmission composite module according to claim 1 or 2, characterized in that, This optoelectronic transmission composite module also features: A photoelectric conversion unit, which is photoelectrically connected to the photoelectric hybrid substrate; and The second heat dissipation component is in contact with the photoelectric conversion unit. The housing further includes a second wall, which is disposed in the thickness direction on the side opposite to the first wall relative to the photoelectric conversion section. The second heat dissipation component is in contact with the second wall.

4. The optoelectronic transmission composite module according to claim 3, characterized in that, The second heat dissipation component has an Asker-C hardness of less than 55 at 23°C.

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