A movable heat conduction mechanism for semiconductor refrigeration

Abstract

The present invention provides a movable heat-conducting mechanism for semiconductor refrigeration. The present invention includes an equipment housing and a semiconductor refrigeration plate, a movable heat-conducting structure, a drive device, and a heat exchange structure disposed therein. The heat exchange structure is connected to the device load, the movable heat-conducting structure is connected to the heat exchange structure, and the movable heat-conducting structure is connected to the drive device. The drive device allows the movable heat-conducting structure to be in close contact with or separated from the semiconductor refrigeration plate. When the semiconductor refrigeration plate is powered on for cooling, the drive device moves the movable heat-conducting structure upward until it is in close contact with the semiconductor refrigeration plate. When the temperature of the heat exchange structure falls below a certain temperature, the power supply to the semiconductor refrigeration plate is disconnected, and the drive device is controlled to move the movable heat-conducting structure downward, separating it from the semiconductor refrigeration plate, and continue to cool the target space through the heat exchange structure. This achieves a power-off standby operating mode for the semiconductor refrigeration plate, reducing the average power consumption of the refrigeration equipment.

Description

Technical Field

[0001] The present invention relates to semiconductor refrigeration technology, in particular to a movable heat conduction mechanism for semiconductor refrigeration. Background Art

[0002] In 1834, French scientist Peltier discovered the thermoelectric effect: When two dissimilar metals form a closed circuit and a direct current flows through the circuit, a temperature difference is generated between the two joints.

[0003] In the 1950s and 1960s, research in thermoelectric technology advanced rapidly. Through continuous experimentation, researchers discovered that bismuth telluride is a thermoelectric material with excellent performance, making it the primary raw material for semiconductor cooling chips.

[0004] In the 1960s and 1970s, Chinese scientists and engineers conducted many experiments and research to apply thermoelectric technology to the aerospace field, achieved many results, and realized the mass production of semiconductor refrigerators.

[0005] When a semiconductor cooler is powered, the Peltier effect causes some heat to flow with the movement of electrons, creating a temperature difference across the thermoelectric material. When this heat flow offsets the heat flow generated by the temperature difference between the two ends, the temperature difference across the semiconductor cooler becomes constant.

[0006] However, as the temperature difference between the two ends of the semiconductor refrigeration chip becomes larger and larger, the energy consumed by the heat transfer caused by the temperature difference between the two ends of the material will also increase. When the temperature difference between the two ends of the semiconductor refrigeration chip approaches the maximum value, the electrical efficiency of the semiconductor refrigeration chip will also drop to the lowest level.

[0007] Currently, semiconductor refrigeration devices are all powered on to prevent temperature reversal, which shortens the service life of the semiconductor refrigeration devices and increases power consumption. Summary of the Invention

[0008] In accordance with the technical problems raised above, in order to improve the energy efficiency of semiconductor refrigeration equipment and extend the battery life, the present invention cuts off the power supply of the semiconductor refrigeration plate when the refrigeration space reaches or approaches the design temperature. In order to prevent the temperature of the refrigeration space from rising due to the reheating of the semiconductor refrigeration plate, a movable structure is required. When the semiconductor refrigeration plate is powered off, it is separated from the refrigeration structure below to isolate the heat transfer as much as possible. The structure provided by the present invention is to solve the standby energy consumption problem of semiconductor refrigeration equipment. To this end, a movable heat-conducting structure is provided that can reduce the power consumption of semiconductor refrigeration equipment. The technical means adopted by the present invention are as follows:

[0009] A movable heat-conducting structure for semiconductor refrigeration, comprising an equipment housing and a semiconductor refrigeration plate disposed therein, a movable heat-conducting structure, a driving device, and a heat exchange structure, wherein the heat exchange structure is connected to a device load, the movable heat-conducting structure is connected to the heat exchange structure, and the movable heat-conducting structure is connected to the driving device, and the movable heat-conducting structure is brought into close contact with or separated from the semiconductor refrigeration plate by the driving device;

[0010] The driving device includes a cylinder, a piston rod, and a cylinder head. The bottom end of the piston rod can move in the cylinder. The movable heat-conducting structure is connected to the top end of the piston rod by a fastening screw. When the movable heat-conducting structure contacts the semiconductor Peltier, the driving device provides a suitable driving force to make the movable heat-conducting structure tightly adhere to the semiconductor Peltier.

[0011] Furthermore, the movable heat-conducting structure can move in a direction perpendicular to the cooling plane of the semiconductor refrigeration plate.

[0012] Furthermore, a preset position of the heat exchange structure is covered with a heat insulation material.

[0013] Furthermore, a thermally conductive silicone sticker is attached to the movable heat-conducting structure.

[0014] Furthermore, a guide structure is installed on the shell and the heat exchange structure, and the movable heat-conducting structure moves along the guide structure.

[0015] Furthermore, the driving device may be a hydraulic driving device or an electromagnet.

[0016] The present invention has the following advantages:

[0017] 1. The present invention replaces the thermal balance working mode of the semiconductor refrigeration plate with a power-off standby working mode through a movable heat conduction mechanism, effectively reducing the average power consumption of the semiconductor refrigeration equipment, improving the energy efficiency of the refrigeration equipment, and extending the standby time of the semiconductor refrigeration equipment, which is very important for portable devices.

[0018] 2. This invention uses a movable heat-conducting mechanism to divide the semiconductor cooling chip's operating mode into two modes: cooling and standby. When the semiconductor cooling chip is powered off and in standby mode, the radiator does not need to operate continuously, thereby reducing the noise of the semiconductor cooling device. It also extends the service life of components such as the cooling fan and the semiconductor cooling chip, thereby increasing the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 Schematic diagram of the movable heat conduction mechanism of the present invention.

[0021] Figure 2 A cross-sectional view of the AA section of the air pressure driven movable heat conduction mechanism in Example 1 of the present invention

[0022] Figure 3 1. The top view (a) and isometric view (b) of the air pressure-driven movable heat conduction mechanism in Example 1 of the present invention.

[0023] In the figure: 1. Equipment housing; 2. Semiconductor refrigeration plate; 3. Movable heat-conducting structure; 4. Heat exchange structure; 5. Insulation layer; 6. Radiator; 7. Side guide rod; 8. Fastening screw; 9. Cylinder head; 10. Piston rod; 11. Sealing ring. DETAILED DESCRIPTION

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0025] like Figures 1 to 3 As shown, an embodiment of the present invention discloses a movable heat-conducting structure for semiconductor refrigeration, which can reduce the average power consumption of the device. It includes a device housing 1 and a semiconductor refrigeration plate 2 arranged therein, a movable heat-conducting structure 3, a driving device and a heat exchange structure 4. The heat exchange structure is connected to the device load, the movable heat-conducting structure is connected to the heat exchange structure, and the movable heat-conducting structure is connected to the driving device. The movable heat-conducting structure is pressed against or separated from the semiconductor refrigeration plate through the driving device.

[0026] As a preferred embodiment, Figure 2 As shown, the movable heat-conducting structure can move in the vertical direction of the cooling plane of the semiconductor refrigeration plate. The heat exchange structure includes a heat exchange metal plate and a fixed structure connected above the heat exchange metal plate. When the movable heat-conducting structure is tightly attached to the semiconductor refrigeration plate, the upper surface of the movable heat-conducting structure can be tightly attached to the lower surface of the fixed structure.

[0027] The housing and the heat exchange structure are provided with guide structures, and the movable heat-conducting structure moves along the guide structures. Specifically, the driving device and the fixed structure are provided with a plurality of guide rods 7 passing through the two, and the movable heat-conducting structure can be displaced along the guide rods 7.

[0028] As an optional embodiment, the driving device includes any one of a pneumatic driving device, a hydraulic driving device or an electromagnet.

[0029] In this embodiment, the drive device includes a cylinder, a piston rod 10, and a cylinder head 9. The bottom end of the piston rod is movable within the cylinder, and the movable heat-conducting structure is connected to the top end of the piston rod via a fastening screw 8. When the movable heat-conducting structure contacts the semiconductor Peltier, the drive device provides a suitable driving force to keep the movable heat-conducting structure in close contact with the semiconductor Peltier without damaging the ceramic plate of the semiconductor Peltier.

[0030] In this embodiment, the fixed structure can be a frame structure, as an optional embodiment, such as Figure 3 As shown, the movable heat-conducting structure can be specifically a button type, which includes a plane portion and a raised portion connected to the plane portion, and a hole for the guide rod to pass through is provided on the plane portion. The plane portion is arranged below the top plate of the fixed structure, and the height of the raised portion is less than the stroke of the piston rod. When the piston is pushed to the highest point, the fixed structure limits the plane portion to its highest point. At this time, the movable heat-conducting structure is attached to the semiconductor refrigeration plate. When the piston is pushed downward, the movable heat-conducting structure is separated from the semiconductor refrigeration plate, and the bottom end of the plane portion gradually approaches the cylinder head.

[0031] As an optional embodiment, sealing rings 11 are provided between the piston and the cylinder, between the piston rod and the piston cover, and between the piston cover and the piston.

[0032] As a preferred embodiment, the preset positions of the heat exchange structure and the fixed structure are covered with insulation materials as the insulation layer 5. Specifically, the insulation layer is added to the positions on the fixed part that do not affect the movement of the mechanism.

[0033] As a preferred embodiment, a thermally conductive silicone patch is affixed to the upper surface of the movable thermally conductive structure. When the movable thermally conductive structure is pressed against the semiconductor Peltier by the driving device, the thermally conductive silicone patch undergoes elastic deformation, thereby buffering and reducing surface thermal resistance.

[0034] The semiconductor refrigeration plate 2 is connected to a radiator 6 for dissipating heat.

[0035] Figure 1The figure shows a refrigeration mechanism. The output end side of the heat exchange structure is the internal space of the refrigeration equipment, which exchanges heat with the air in the air space. When the semiconductor refrigeration plate is powered on for cooling, a pneumatic device pushes the movable heat-conducting structure upward until it is in close contact with the semiconductor refrigeration plate, and then the heat exchange metal plate is cooled through the fixed structure. When the temperature of the heat exchange structure is lower than a certain temperature, the power supply of the semiconductor refrigeration plate is disconnected, and the pneumatic device is controlled to pull the movable heat-conducting structure downward to separate it from the semiconductor refrigeration plate, and the heat exchange metal plate continues to cool the target space. This realizes the power-off standby working mode of the semiconductor refrigeration plate and reduces the average power consumption of the refrigeration equipment. When the temperature of the heat exchange component returns to a certain temperature, the semiconductor pal is started again, and the semiconductor pal is made to be in close contact with the movable heat-conducting structure through the driving device for cooling. This reciprocating operation keeps the temperature in the equipment space at the target operating temperature.

[0036] As an optional implementation, the movable heat-conducting structure can be automatically controlled by providing a temperature sensor and a controller.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A movable heat-conducting structure for semiconductor refrigeration, characterized in that: The device comprises a housing and a semiconductor refrigeration plate, a movable heat-conducting structure, a driving device and a heat exchange structure arranged therein, wherein the heat exchange structure is connected to the device load, the movable heat-conducting structure is connected to the heat exchange structure, and the movable heat-conducting structure is connected to the driving device, and the movable heat-conducting structure is pressed against or separated from the semiconductor refrigeration plate by the driving device; The driving device includes a cylinder, a piston rod, and a cylinder head. The bottom end of the piston rod is movable in the cylinder. The movable heat-conducting structure is connected to the top end of the piston rod by a fastening screw. When the movable heat-conducting structure contacts the semiconductor Peltier, the driving device provides a suitable driving force to make the movable heat-conducting structure and the semiconductor Peltier tightly contact. The movable heat-conducting structure can move in the vertical direction of the cooling plane of the semiconductor refrigeration plate. The heat exchange structure includes a heat exchange metal plate and a fixed structure connected above the heat exchange metal plate. When the movable heat-conducting structure is tightly attached to the semiconductor refrigeration plate, the upper surface of the movable heat-conducting structure can be tightly attached to the lower surface of the fixed structure. The movable heat-conducting structure is specifically a button-type structure. The button-type structure includes a plane portion and a raised portion connected to the plane portion. A hole for the guide rod to pass through is provided on the plane portion. The plane portion is arranged below the top plate of the fixed structure. The height of the raised portion is less than the stroke of the piston rod. When the piston is pushed to the highest point, the fixed structure limits the plane portion to its highest point. At this time, the movable heat-conducting structure is attached to the semiconductor refrigeration plate. When the piston is pushed downward, the movable heat-conducting structure is separated from the semiconductor refrigeration plate, and the bottom end of the plane portion gradually approaches the cylinder head.

2. The movable heat-conducting structure for semiconductor refrigeration according to claim 1, characterized in that: The preset position of the heat exchange structure is covered with a heat insulation material.

3. The movable heat-conducting structure for semiconductor refrigeration according to claim 1, characterized in that: The movable heat-conducting structure is affixed with a heat-conducting silica gel patch.

4. The movable heat-conducting structure for semiconductor refrigeration according to claim 1, characterized in that: A guide structure is installed on the equipment housing and the heat exchange structure, and the movable heat-conducting structure moves along the guide structure.

5. The movable heat-conducting structure for semiconductor refrigeration according to claim 1, characterized in that: The drive device is replaced by a hydraulic drive device.

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