Non-return-to-zero sensing lens

Abstract

The application discloses a non-reflow sensing lens, comprising a circuit board, an optical module fixed on the surface of the circuit board, a sensing chip mounted on the circuit board, a plurality of wires electrically coupled with the sensing chip and the circuit board, a supporting glue layer, and a light-transmitting sheet. The circuit board forms a crystal placement groove on the surface, the sensing chip is located in the crystal placement groove, and the top surface of the sensing chip and the surface of the circuit board form a difference of not more than 10 microns. The supporting glue layer is annular and arranged on the top surface of the sensing chip, and the light-transmitting sheet is arranged on the supporting glue layer and faces the sensing chip. In this way, the non-reflow sensing lens realizes the effect of not needing reflow through the cooperation between the above components, so as to reduce the high-temperature resistance requirement of the components.

Description

TECHNICAL FIELD

[0001] The present application relates to a sensing lens, in particular to a non-reflow sensing lens. BACKGROUND

[0002] The existing sensing lens is fixed on a circuit carrier board by reflow of a sensor packaging structure, and then an optical module is installed on the circuit carrier board. However, the architecture of the existing sensor head is limited by the sensor packaging structure, and it is difficult to be further improved. For example, since the sensor packaging structure in the existing sensing lens needs to be fixed on the circuit carrier board by reflow, the component connection in the sensor packaging structure also needs to meet the requirement of high temperature resistance.

[0003] Therefore, the applicant believes that the above defects can be improved, and after careful research and application of scientific principles, the present application is finally proposed, which is a reasonable and effective design to improve the above defects. SUMMARY

[0004] The embodiment of the present application provides a non-reflow sensing lens which can effectively improve the defects that may be caused by the existing sensing lens.

[0005] The embodiment of the present application discloses a non-reflow sensing lens, which comprises: a circuit carrier board, comprising a first board surface and a second board surface opposite to the first board surface; wherein the circuit carrier board is recessed to form a crystal placement groove on the first board surface, and the circuit carrier board comprises a plurality of solder pads located on the first board surface and adjacent to the crystal placement groove; an optical module, comprising: a frame fixed on the first board surface of the circuit carrier board; at least one lens installed in the frame, and the central axis of the at least one lens is along the crystal placement groove; and a filter installed in the frame and located on the central axis; wherein the frame, the filter and the first board surface collectively form a configuration space, and the crystal placement groove and the plurality of solder pads are located in the configuration space; a sensing chip comprising a sensing area on the top surface and a plurality of connection pads outside the sensing area; wherein the sensing chip is arranged in the crystal placement groove, the sensing area is located on the central axis, and the top surface has a difference of not more than 10 microns compared with the first board surface; a plurality of wires electrically coupled with the plurality of solder pads and the plurality of connection pads; a support glue layer arranged outside the sensing area in a ring shape; and a light transmission sheet arranged on the support glue layer and facing the sensing area, so that the light transmission sheet, the support glue layer and the top surface of the sensing chip collectively form a closed space.

[0006] Optionally, the plurality of connection pads are arranged in a ring shape on the top surface, and inner edges of the plurality of connection pads collectively define a configuration inner edge, and a projection area of the outer surface of the light-transmissive sheet on the first surface of the circuit board is a configuration outer edge.

[0007] Optionally, the support adhesive layer is further disposed on an outer portion of the top surface of the sensing chip and outside the sensing region, and at least a portion of each wire is embedded in the support adhesive layer.

[0008] Optionally, the support adhesive layer is light-transmissive, and the non-reflow sensing lens comprises a light-blocking layer formed on the light-transmissive sheet, wherein the light-blocking layer is annular, and a projection space formed by a normal projection of the light-blocking layer towards the circuit board is outside the sensing region, and the support adhesive layer is inside the projection space.

[0009] Optionally, the support adhesive layer is light-blocking, and the plurality of wires and the plurality of solder pads are embedded in the support adhesive layer.

[0010] Optionally, the support adhesive layer is disposed on the top surface of the sensing chip, and the plurality of connection pads, the plurality of wires, and the plurality of solder pads are outside the support adhesive layer.

[0011] Optionally, the non-reflow sensing lens further comprises a sealing adhesive formed around the support adhesive layer and the outer surface of the light-transmissive sheet, and the plurality of connection pads, the plurality of wires, and the plurality of solder pads are embedded in the sealing adhesive.

[0012] Optionally, the top surface of the sensing chip is coplanar with the first surface of the circuit board.

[0013] Optionally, when a light passes through at least one lens, the filter allows a wavelength band corresponding to the light of the sensing region to pass through.

[0014] Optionally, the non-reflow sensing lens comprises at least one passive electronic component in the configuration space, wherein the at least one passive electronic component is mounted on the first surface of the circuit board.

[0015] In summary, the non-reflow sensing lens disclosed in the embodiments of the present application, through the cooperation between the above-mentioned components, realizes the effect of not needing reflow, thereby reducing the high-temperature resistance requirement of the components (such as the sensing chip, the plurality of wires, the support adhesive layer, and the light-transmissive sheet) in the configuration space, and further reducing the material cost of the non-reflow sensing lens and improving the yield of the product.

[0016] Further, the non-reflow sensing lens disclosed in the embodiments of the present application does not need to go through the corresponding test process because it does not need to go through the reflow process, thereby effectively simplifying the entire production process to improve the production efficiency of the non-reflow sensing lens.

[0017] For a more complete understanding of the features and technical content of the present application, please refer to the following detailed description of the present application and the accompanying drawings. However, these descriptions and drawings are only used to illustrate the present application, and do not limit the scope of protection of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A perspective view of the non-reflow sensing lens of Embodiment One of the present application.

[0019] Figure 2 An exploded view of Figure 1

[0020] Figure 3 A partial top view of Figure 2

[0021] Figure 4 A sectional view of Figure 1

[0022] Figure 5 An enlarged view of part V in Figure 4

[0023] Figure 6 An enlarged view of the changing state of part V in Figure 4

[0024] Figure 7 A sectional view of another form of the non-reflow sensing lens of Embodiment One of the present application.

[0025] Figure 8 A sectional view of another form of the non-reflow sensing lens of Embodiment One of the present application.

[0026] Figure 9 A sectional view of the non-reflow sensing lens of Embodiment Two of the present application.

[0027] Figure 10 A sectional view of the non-reflow sensing lens of Embodiment Three of the present application. DETAILED DESCRIPTION

[0028] ​​​​​The following embodiments of the disclosed non-reflow sensing lens are explained with reference to specific embodiments. One skilled in the art will be able to appreciate the disclosure and scope of the present application upon reading the detailed description of the application. The present application can be implemented or applied in other different embodiments and the detailed description of the application in this disclosure can be modified in various ways based on different views and applications without departing from the spirit and scope of the present application. In addition, the drawings of the present application are only simple schematic illustrations and are not actual size depictions. The following embodiments will further illustrate the relevant technical content of the present application, but the disclosed content is not intended to limit the scope of protection of the present application.

[0029] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items.

[0030] [Embodiment One]

[0031] Please refer to Figures 1 to 8 , which is embodiment one of the present application. As shown in Figure 1 and Figure 2 , the present embodiment discloses a non-reflow sensing lens 100, which does not contain any packaging structure; that is, any sensing lens with packaging structure or any sensing lens that needs to be made by reflow is different from the non-reflow sensing lens 100 referred to in the present embodiment.

[0032] As shown in Figures 3 to 5 , the non-reflow sensing lens 100 includes a circuit board 1, an optical module 2 fixed to the circuit board 1, at least one passive electronic component 3 mounted on the circuit board 1, a sensing chip 4 mounted on the circuit board 1, a plurality of wires 5 electrically coupled between the sensing chip 4 and the circuit board 1, a support glue layer 6 disposed on the sensing chip 4, a light transmission sheet 7 disposed on the support glue layer 6, and a light shielding layer 8 formed on the light transmission sheet 7.

[0033] Among them, the non-reflow sensing lens 100 in the present embodiment is described as including the above components, but the non-reflow sensing lens 100 can be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present application, the non-reflow sensing lens 100 can omit at least one passive electronic component 3.

[0034] The circuit carrier 1 in the present embodiment can be a printed circuit board (PCB) or a flexible printed circuit (FPC), but the present application is not limited thereto. The circuit carrier 1 has a first board surface 11 and a second board surface 12 opposite to the first board surface 11. The circuit carrier 1 has a crystal placement groove 13 formed on the first board surface 11. The circuit carrier 1 includes a plurality of solder pads 14 on the first board surface 11 and adjacent to the crystal placement groove 13. In the present embodiment, the plurality of solder pads 14 are arranged in a ring shape outside the crystal placement groove 13. Each of the plurality of solder pads 14 is spaced apart from the crystal placement groove 13 by a spacing distance D of not greater than 100 micrometers (μm), but the present application is not limited thereto.

[0035] In addition, the circuit carrier 1 can further be provided with an electrical connector 15. The circuit carrier 1 can be detachably connected to an electronic device (not shown) through the electrical connector 15, so that the non-reflow sensing lens 100 can be mounted and electrically connected to the electronic device.

[0036] The optical module 2 includes a frame 21, at least one lens 22 mounted in the frame 21, and a filter 23 mounted in the frame 21. The frame 21 is fixed to the first board surface 11 of the circuit carrier 1. The center axis L of at least one lens 22 passes through the crystal placement groove 13. The filter 23 is located on the center axis L. At least one passive electronic component 3 is mounted on the first board surface 11 of the circuit carrier 1 and adjacent to the frame 21. In addition, the number of at least one passive electronic component 3 can be adjusted according to design requirements. In the present embodiment, the outer edge of the circuit carrier 1 can be partially (e.g., three edges) trimmed to the frame 21, but the present application is not limited thereto.

[0037] In more detail, the number of at least one lens 22 in the present embodiment is a plurality. The center axes L of the plurality of lenses 22 substantially overlap each other. The filter 23 is located between the plurality of lenses 22 and the crystal placement groove 13. The frame 21, the filter 23, and the first board surface 11 of the circuit carrier 1 collectively form a configuration space 24. The crystal placement groove 13, the plurality of solder pads 14, at least one passive electronic component 3, the sensing chip 4, the plurality of wires 5, the support adhesive layer 6, the light-transmitting sheet 7, and the light-shielding layer 8 are located in the configuration space 24.

[0038] The sensing chip 4 is illustrated by an image sensing chip in the present embodiment, but the present application is not limited thereto. The sensing chip 4 is disposed in the crystal placement groove 13 of the circuit board 1 (e.g., the bottom surface 42 of the sensing chip 4 faces the groove bottom of the crystal placement groove 13) and located on the central axis L. Further, the top surface 41 of the sensing chip 4 forms a step difference G of not greater than 10 micrometers (pm) compared to the first board surface 11; that is, the step difference G can be not greater than 5 micrometers, and the step difference G is preferably 0 (e.g., the top surface 41 of the sensing chip 4 is coplanar with the first board surface 11 of the circuit board 1). Figure 6 As shown, the top surface 41 of the sensing chip 4 is coplanar with the first board surface 11 of the circuit board 1.

[0039] It should be additionally noted that the non-reflow sensing lens 100 includes a heat-conducting adhesive 10 disposed in the crystal placement groove 13 in the present embodiment, and the sensing chip 4 is fixed in the crystal placement groove 13 through the heat-conducting adhesive 10 (e.g., the bottom surface 42 of the sensing chip 4 and the groove bottom of the crystal placement groove 13 are adhesively fixed to each other through the heat-conducting adhesive 10), but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the heat-conducting adhesive 10 can be omitted or replaced by other components.

[0040] Further, the top surface 41 of the sensing chip 4 includes a sensing region 411 and a plurality of connection pads 412 located outside the sensing region 411. The selection of the filter 23 must correspond to the sensing region 411 of the sensing chip 4. For example, when a light passes through at least one lens 22, the filter 23 is used to allow the wavelength of the light corresponding to the sensing region 411 to pass through.

[0041] In the present embodiment, the positions of the plurality of connection pads 412 are preferably respectively corresponding to the positions of the plurality of solder pads 14, and the outer edge of each connection pad 412 falls on the outer side surface 43 of the sensing chip 4 and is separated from the corresponding solder pad 14 by a distance of not greater than 100 micrometers, which is substantially equal to the interval distance D, but the present application is not limited thereto.

[0042] For example, in other embodiments not shown in the present application, the outer edge of each connection pad 412 can be inside the outer side surface 43 of the sensing chip 4, so that the distance between the outer edge of each connection pad 412 and the corresponding solder pad 14 is greater than the interval distance D.

[0043] Further, the plurality of connection pads 412 are arranged in a ring shape on the top surface 41 and surround the sensing region 411 in the embodiment. However, the present application is not limited thereto. For example, in another embodiment not shown in the present application, the plurality of connection pads 412 are arranged in two rows and distributed on opposite sides of the sensing region 411, and the plurality of solder pads 14 are also arranged in two rows and distributed on opposite sides of the die receiving groove 13, and the positions of the plurality of connection pads 412 correspond to the positions of the plurality of solder pads 14 respectively.

[0044] The plurality of wires 5 electrically couple the plurality of solder pads 14 to the plurality of connection pads 412 respectively; that is, each wire 5 is formed in a wire bonding manner so that both ends thereof are connected to a solder pad 14 and a corresponding connection pad 412 respectively.

[0045] Accordingly, the non-reflow sensing lens 100 disclosed in the embodiment can help shorten the distance between any solder pad 14 and a corresponding connection pad 412, by arranging the sensing chip 4 in a specific condition (e.g., the step difference G is not greater than 10 microns) in the die receiving groove 13, so that the formation of each wire 5 is no longer limited by the height of the sensing chip 4.

[0046] The support adhesive layer 6 is arranged in a ring shape on the first surface 11 of the circuit board 1 (and part of the top surface 41 of the sensing chip 4) and surrounds the outside of the sensing region 411. The light-transmissive sheet 7 is arranged on the support adhesive layer 6 and faces the sensing region 411 (i.e., the support adhesive layer 6 is clamped between the first surface 11 of the circuit board 1 and the inner surface 71 of the light-transmissive sheet 7), so that the light-transmissive sheet 7, the support adhesive layer 6, and the top surface 41 of the sensing chip 4 together form a closed space S. The sensing region 411 is located in the closed space S and faces the light-transmissive sheet 7.

[0047] Accordingly, the non-reflow sensing lens 100 can make the support adhesive layer 6 applicable to a larger configuration area by arranging the sensing chip 4 in a specific condition (e.g., the step difference G is not greater than 10 microns) in the die receiving groove 13, so that the support adhesive layer 6 can have different configuration modes according to design requirements.

[0048] More specifically, the inner edges of the plurality of connecting pads 412 arranged in a ring shape collectively define a configuration inner edge E1, and a projection area formed by the outer surface 73 of the light-transmitting sheet 7 projected onto the first plate surface 11 is defined as a configuration outer edge E2. The supporting adhesive layer 6 may be disposed in at least a partial area between the configuration inner edge E1 and the configuration outer edge E2.

[0049] In other words, provided that the supporting adhesive layer 6 is located between the inner edge E1 and the outer edge E2 of the configuration, the specific position and volume of the supporting adhesive layer 6 can be adjusted and varied according to design requirements. For example, such as Figure 7 As shown, the supporting adhesive layer 6 may be disposed only on the circuit board 1, and at least partially embedded in the supporting adhesive layer 6 for each of the conductors 5; as Figure 4 As shown, the supporting adhesive layer 6 may be disposed on the first plate surface 11 and further disposed on the outer side of the top surface 41 of the sensing chip 4, and located outside the sensing area 411, while at least a portion of each solder pad 14 and at least a portion of each wire 5 are embedded in the supporting adhesive layer 6; Figure 8 As shown, the edge of the supporting adhesive layer 6 can be cut flush with the inner edge of the plurality of connecting pads 412 (e.g.: Figure 3 The inner edge E1 of the configuration shown is related to the outer surface 73 of the light-transmitting sheet 7 (e.g., ...). Figure 3 The outer edge of the configuration shown is such that multiple wires 5 and multiple solder pads 14 are embedded within the support adhesive layer 6.

[0050] In addition, such as Figures 3 to 5 As shown, the supporting adhesive layer 6 in this embodiment is light-transmitting, and the light-shielding layer 8 is formed on the outer surface 72 of the light-transmitting sheet 7. The light-shielding layer 8 is annular and has an opening 81, which is located above the sensing area 411. In other words, the projection space formed by the light-shielding layer 8 projecting onto the circuit board 1 is located outside the sensing area 411, while the supporting adhesive layer 6 (and the plurality of wires 5) are located within the projection space. Accordingly, the non-reflow sensing lens 100 effectively reduces the glare generated by the plurality of wires 5 embedded in the supporting adhesive layer 6 by forming the light-shielding layer 8 on the light-transmitting sheet 7.

[0051] As described above, the non-reflow sensing lens 100 in the present embodiment is configured by the above-mentioned components, so that the overall structure of the non-reflow sensing lens 100 can achieve the effect of not needing to be reflowed, thereby reducing the high-temperature resistance requirement of the components (such as the connection between the sensing chip 4, the plurality of conductive wires 5, the support adhesive layer 6, and the light-transmitting sheet 7) in the configuration space 24, thereby reducing the material cost of the non-reflow sensing lens 100 and improving the yield of the product. Further, since the non-reflow sensing lens 100 does not need to go through the reflow process, it also does not need to go through the corresponding test process, thereby effectively simplifying the entire production process to improve the production efficiency of the non-reflow sensing lens 100.

[0052] It should be additionally noted that the sealing effect can be achieved based on the joint between the frame 21 and the circuit carrier 1, so the non-reflow sensing lens 100 in the present embodiment can not need to use any packaging structure, so of course it is not necessary to form any package on the outside of the support adhesive layer 6 and the light-transmitting sheet 7.

[0053] [Embodiment Two]

[0054] Please refer to Figure 9 , which is embodiment two of the present application. Since the present embodiment is similar to the above-mentioned embodiment one, the same parts of the two embodiments will not be described again (such as the circuit carrier 1, the optical module 2, and the passive electronic component 3), and the differences between the present embodiment and the above-mentioned embodiment one are generally described as follows:

[0055] In the present embodiment, the non-reflow sensing lens 100 does not have the light-shielding layer 8 carried by embodiment one, the support adhesive layer 6 is opaque, and the plurality of conductive wires 5, the plurality of solder pads 14, and the local part of each connection pad 412 are all embedded in the support adhesive layer 6. Alternatively, as shown in Figure 9 , the plurality of conductive wires 5, the plurality of solder pads 14, and the plurality of connection pads 412 are all embedded in the support adhesive layer 6, so as to avoid the generation of glare phenomenon of the sensing area 411 of the sensing chip 4 due to the above-mentioned components.

[0056] [Embodiment Three]

[0057] Please refer to Figure 10 , which is embodiment three of the present application. Since the present embodiment is similar to the above-mentioned embodiments one and two, the same parts of the two embodiments will not be described again (such as the circuit carrier 1, the optical module 2, and the passive electronic component 3), and the differences between the present embodiment and the above-mentioned embodiments one and two are generally described as follows:

[0058] In this embodiment, the non-reflow sensing lens 100 does not have the light shielding layer 8 in the first embodiment, and the support adhesive layer 6 can be light-transmissive or light-blocking, but the support adhesive layer 6 is arranged on the top surface 41 of the sensing chip 4, and the plurality of connection pads 412, the plurality of conductive wires 5, and the plurality of solder pads 14 are located outside the support adhesive layer 6, so as to avoid the sensing area 411 of the sensing chip 4 from generating glare phenomenon due to the above components.

[0059] Furthermore, the non-reflow sensing lens 100 further comprises a sealing adhesive 9 formed around the outside of the support adhesive layer 6 and the light-transmissive sheet 7 in this embodiment, and the plurality of connection pads 412, the plurality of conductive wires 5, and the plurality of solder pads 14 are embedded in the sealing adhesive 9, so as to avoid being damaged by external force.

[0060] [Technical effects of the embodiments of the present application]

[0061] In summary, the non-reflow sensing lens disclosed in the embodiments of the present application, through the cooperation between the above components, realizes the effect of not needing reflow, so as to reduce the high-temperature resistance requirement of the components (such as the connection between the sensing chip, the plurality of conductive wires, the support adhesive layer, and the light-transmissive sheet) located in the arrangement space, thereby reducing the material cost of the non-reflow sensing lens and improving the yield of the product.

[0062] Furthermore, the non-reflow sensing lens disclosed in the embodiments of the present application does not need to go through the corresponding test process because it does not need to go through the reflow process, thereby effectively simplifying the entire production process to improve the production efficiency of the non-reflow sensing lens.

[0063] Furthermore, the non-reflow sensing lens disclosed in the embodiments of the present application, by arranging the sensing chip in the crystal placement groove under specific conditions (such as the height difference being not greater than 10 microns), so that the formation of each conductive wire is no longer limited by the height of the sensing chip, thereby being helpful to shorten the distance between any one of the solder pads and the corresponding connection pad, and facilitating the reduction of the overall size of the non-reflow sensing lens.

[0064] The above disclosed content is only the preferred feasible embodiments of the present application, and does not limit the patent scope of the present application, so any equivalent technical changes made according to the content of the specification and drawings of the present application are included in the patent scope of the present application.

Claims

1. A non-reflow sensing lens characterized by, The non-reflow sensing lens comprises: a circuit board comprising a first board surface and a second board surface opposite to the first board surface; wherein the circuit board is recessed to form a die slot on the first board surface, and the circuit board comprises a plurality of solder pads on the first board surface and adjacent to the die slot; an optical module comprising: a frame fixed on the first board surface of the circuit board; at least one lens mounted in the frame, and a central axis of at least one of the lenses is along the die slot; and a filter mounted in the frame and located on the central axis; wherein the frame, the filter, and the first board surface collectively form a configuration space, and the die slot and the plurality of solder pads are located in the configuration space; a sensing chip comprising a sensing area on a top surface thereof and a plurality of connection pads outside the sensing area; wherein the sensing chip is disposed in the die slot, the sensing area is located on the central axis, and the top surface has a step difference of no more than 10 microns compared to the first board surface; a plurality of wires electrically coupled to the plurality of solder pads and the plurality of connection pads, respectively; a support adhesive layer arranged outside the sensing area in a ring shape; a light-transmitting sheet arranged on the support adhesive layer and facing the sensing area, so that the light-transmitting sheet, the support adhesive layer, and the top surface of the sensing chip collectively form an enclosed space; and a light-blocking layer formed on the light-transmitting sheet; wherein the light-blocking layer is in a ring shape, and a projection space formed by a normal projection of the light-blocking layer towards the circuit board is located outside the sensing area, and the support adhesive layer is located in the projection space.

2. The non-return-to-reference type sensing lens according to claim 1, characterized by The plurality of connection pads are arranged in a ring shape on the top surface, and the inner edges of the plurality of connection pads collectively define a configuration inner edge, and a projection area formed by a normal projection of the outer surface of the light-transmitting sheet on the first board surface defines a configuration outer edge; wherein the support adhesive layer is arranged in at least a partial region between the configuration inner edge and the configuration outer edge.

3. The non-return-to-reference type sensing lens according to claim 2, characterized in that, The support adhesive layer is further arranged on the outer part of the top surface of the sensing chip and outside the sensing area, and at least part of each wire is embedded in the support adhesive layer.

4. The non-return-to-reference type sensing lens according to claim 3, characterized by The support adhesive layer is light-transmitting.

5. The non-return-to-reference type sensing lens according to claim 3, wherein The support adhesive layer is light-blocking, and the plurality of wires and the plurality of solder pads are embedded in the support adhesive layer.

6. The non-return-to-reference type sensing lens according to claim 1, characterized by The support adhesive layer is arranged on the top surface of the sensing chip, and the plurality of connection pads, the plurality of wires, and the plurality of solder pads are located outside the support adhesive layer.

7. The non-return-to-reference type sensing lens according to claim 6, characterized in that, The non-reflow sensing lens further comprises a sealing adhesive layer formed around the outside of the support adhesive layer and the light-transmitting sheet, and the plurality of connection pads, the plurality of wires, and the plurality of solder pads are embedded in the sealing adhesive layer.

8. The non-return-to-reference type sensing lens according to claim 1, characterized by, The top surface of the sensing chip is coplanar with the first board surface of the circuit board.

9. The non-return-to-reference type sensing lens according to claim 1, characterized by, The filter is configured to allow a wavelength band of light corresponding to the sensing region to pass through when a light ray passes through at least one of the lenses.

10. The non-return-to-reference type sensing lens according to claim 1, characterized by, The non-reflow sensing lens includes at least one passive electronic component located in the configuration space; wherein at least one of the passive electronic components is mounted on the first plate surface of the circuit carrier board.

Images