A device and method capable of adjusting plasma jet processing area

By designing a device including a metal shell, an elastic disk and a medium casing, changing the size of the elastic disk and the arrangement of the jet holes, flexible adjustment of the plasma jet treatment area is achieved, solving the problem of difficult processing area adjustment in the prior art, simplifying the operation and expanding the application range.

CN115315054BActive Publication Date: 2025-05-23芜湖市产业创新中心 +1
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Patent Information

Application Number
CN202210876856.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-07-25
Publication Date
2025-05-23
Estimated Expiration
2042-07-25

AI Technical Summary

Technical Problem

The prior art is difficult to achieve flexible adjustment of the atmospheric pressure plasma jet treatment area, and the device structure is complex and operation is cumbersome, making it difficult to achieve online controllable adjustment.

Method used

A device including a metal case, an elastic disk and a media casing is designed to adjust the plasma jet treatment area by changing the size of the elastic disk and the number and arrangement of the jet holes. The media sleeve can be automatically moved up and down, simplifying operation and enabling online adjustment.

Benefits of technology

It realizes a large-scale adjustment of the plasma jet treatment area, the device is simple in structure and easy to operate, and meets the automatic and online adjustment needs of the plasma jet treatment area, and expands the application range of atmospheric pressure plasma jet.

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Abstract

The present invention discloses a device and method for adjusting the plasma jet processing area, which relates to the field of gas discharge and atmospheric pressure low-temperature plasma technology, including an elastic disc, a dielectric sleeve, a metal high-voltage electrode, and a metal shell; the dielectric sleeve is connected to the metal shell and can move up and down. When the power is turned on and the working gas is introduced, plasma is generated in the cavity surrounded by the curved section of the elastic disc and the bottom of the metal shell, and is ejected through a plurality of evenly distributed jet holes to generate a plasma jet; by screwing the dielectric sleeve, the dielectric sleeve drives the elastic disc to compress downward or rebound upward, thereby changing the area of ​​the horizontal section of the elastic disc, realizing the adjustment of the number of jet holes, and finally realizing the controllable adjustment of the plasma jet processing area. The present invention has the advantages of simple structure, easy operation, large adjustable range of plasma jet processing area, and online adjustment, which greatly increases the application range of atmospheric pressure plasma jets.
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Description

Technical Field

[0001] The invention belongs to the technical field of gas discharge and atmospheric pressure low-temperature plasma, and specifically relates to a device and method capable of adjusting a plasma jet processing area. Background Art

[0002] Atmospheric pressure plasma jet is a low-temperature plasma with high electron energy and low ion energy. It has broad application prospects in the fields of material surface treatment due to its advantages such as low temperature, large number of active particles in the plasma, strong activity, and no restrictions on the shape of the treated object. When treating the surface of a material, the plasma jet needs to be able to meet the application requirements of different treatment areas; however, generating an atmospheric pressure plasma jet with an adjustable treatment area is currently a major problem in the field of atmospheric pressure low-temperature plasma.

[0003] Existing methods can be mainly divided into the following two categories:

[0004] First, the plasma jet treatment area can be changed by selecting plasma jet generators of different sizes. However, the range of the plasma jet treatment area that can be adjusted by this method is narrow, the operation is complicated, and the discharge stability is poor.

[0005] Another commonly used method is to assemble multiple single plasma jets together to form a plasma jet array, which can achieve large-area plasma jet treatment; by increasing or decreasing the number of spliced ​​plasma jets, the plasma jet treatment area can be adjusted, but the device has a complex structure and cumbersome operation, making it difficult to achieve online controllable adjustment.

[0006] In view of the above-mentioned defects, the present invention provides a device and method for adjusting the plasma jet processing area. Summary of the invention

[0007] The present invention aims to solve at least one of the technical problems existing in the prior art; to this end, the present invention proposes a device and method capable of adjusting the plasma jet processing area.

[0008] According to an embodiment of the first aspect of the present invention, a device capable of adjusting a plasma jet processing area is provided, comprising:

[0009] A metal shell, a plurality of jet holes are opened at the bottom of the metal shell, and the metal shell is grounded;

[0010] An elastic disc installed inside the metal shell;

[0011] A dielectric sleeve, the peripheral side of which is rotatably connected to the metal shell and one end of which is mounted on the elastic disc, and one side of the dielectric sleeve is connected to the gas source;

[0012] A metal high-voltage electrode, one end of which is fixedly mounted on the dielectric casing and the other end is connected to the positive electrode of the power supply;

[0013] The elastic disc includes, from bottom to top, an elastic disc horizontal section, an elastic disc curved section, and an elastic disc vertical section;

[0014] The gas in the gas source enters the metal shell through the dielectric sleeve, generates plasma in the cavity surrounded by the elastic disk bending section and the bottom of the metal shell, and is ejected through multiple uniformly distributed jet holes to generate plasma jets.

[0015] Furthermore, the horizontal section of the elastic disc is a circular ring structure;

[0016] The elastic disc bending section is a trumpet-shaped structure;

[0017] The vertical section of the elastic disc is a barrel-shaped structure.

[0018] Furthermore, the elastic disc also includes an elastic disc through hole penetrating the elastic disc horizontal section, the elastic disc curved section, and the elastic disc vertical section, and the dielectric sleeve is inserted into the elastic disc through hole and fixedly connected to the elastic disc.

[0019] Furthermore, the dielectric sleeve comprises a cavity arranged on the tube wall thereof, and the cavity is coaxially arranged with the central through hole of the dielectric sleeve; the dielectric sleeve is connected with the elastic disc through the cavity.

[0020] Furthermore, an air inlet communicating with the cavity is also provided on the outer wall of the dielectric sleeve, and the air inlet is connected to an air source.

[0021] Furthermore, a top hole matching with the medium sleeve is formed at the upper end of the metal shell, and the medium sleeve is threadedly connected to the top hole and can move up and down.

[0022] Furthermore, the elastic disc is made of elastic silicone.

[0023] According to an embodiment of the second aspect of the present invention, a method for adjusting a plasma jet processing area is provided, wherein the method is implemented based on the device described in the first aspect.

[0024] Further, the following steps are included:

[0025] Steps to reduce the plasma jet treatment area:

[0026] Step S1: rotating the medium sleeve to move it downward, and the medium sleeve drives the elastic disc to compress downward;

[0027] Step S2: the area of ​​the elastic disk horizontal section of the elastic disk is increased, thereby partially covering the jet holes at the bottom of the metal shell, resulting in a reduction in the number of exposed jet holes, thereby achieving the purpose of reducing the plasma jet treatment area;

[0028] Steps to increase the plasma jet treatment area:

[0029] Step X1: The medium sleeve is screwed upward, and the medium sleeve drives the elastic disc to rebound upward;

[0030] Step X2: The area of ​​the horizontal section of the elastic disk is reduced, thereby increasing the number of exposed jet holes, thereby achieving the purpose of increasing the plasma jet treatment area.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] 1. The present invention can achieve a wide range of adjustment of the plasma jet treatment area by changing the size of the elastic disc and increasing or decreasing the number and arrangement of the jet holes, and the device has a simple structure and is easy to operate;

[0033] 2. The device of the present invention can realize automatic control of the up and down movement of the dielectric sleeve in the metal shell through automation transformation, which can meet the automatic and online adjustment of the plasma jet processing area, thereby greatly increasing the application range of the atmospheric pressure plasma jet. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 The structural view of the device capable of adjusting the plasma jet processing area of ​​the present invention;

[0035] Figure 2 It is a structural view of the elastic disc of the present invention;

[0036] Figure 3 This is a structural view of the dielectric sleeve of the present invention;

[0037] Figure 4 It is a structural view of the metal shell of the present invention.

[0038] Figure 5 It is a schematic diagram showing that the elastic disc of the present invention covers different areas on the surface of the metal shell. DETAILED DESCRIPTION

[0039] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] Embodiment 1:

[0041] See also Figure 1-5 The present application provides a device capable of adjusting the plasma jet treatment area, comprising a metal shell 4, a plurality of jet holes 401 are provided at the bottom of the metal shell 4, and the metal shell 4 is grounded; an elastic disc 1 is installed inside the metal shell 4; a dielectric sleeve 2, a peripheral side of which is rotatably connected to the metal shell 4 and one end of which is installed on the elastic disc 1, and one side of the dielectric sleeve 2 is connected to a gas source 5; a metal high-voltage electrode 3, one end of which is fixedly installed on the dielectric sleeve 2, and the other end is connected to the positive electrode of a power supply 6, and the metal high-voltage electrode 3 is coaxially fixedly connected to the dielectric sleeve 2; the elastic disc 1 includes, from bottom to top, an elastic disc horizontal section 101, an elastic disc curved section 102, and an elastic disc vertical section 103;

[0042] The gas in the gas source enters the metal shell 4 through the dielectric sleeve 2, generates plasma in the cavity surrounded by the elastic disk curved section 102 and the bottom of the metal shell 4, and is ejected through a plurality of uniformly distributed jet holes 401 to generate a plasma jet.

[0043] As an embodiment provided by the present invention, preferably, the horizontal section 101 of the elastic disc is a circular ring structure; the curved section 102 of the elastic disc is a trumpet-shaped structure; the vertical section 103 of the elastic disc is a barrel-shaped structure, and the three parts of the elastic disc 1 are all thin-walled cavity structures to form a plasma formation space.

[0044] As an embodiment provided by the present invention, preferably, the elastic disc 1 also includes an elastic disc through hole 104 that penetrates the elastic disc horizontal section 101, the elastic disc curved section 102, and the elastic disc vertical section 103, and the dielectric sleeve 2 is inserted into the elastic disc through hole 104 and fixedly connected to the elastic disc 1.

[0045] As an embodiment provided by the present invention, preferably, the dielectric sleeve 2 includes a cavity 202 arranged on its tube wall, and the cavity 202 is coaxially arranged with the central through hole 201 of the dielectric sleeve 2; the dielectric sleeve 2 is connected with the elastic disc 1 through the cavity 202; the metal high-voltage electrode 3 is coaxially connected with the central through hole 201 in the center of the dielectric sleeve.

[0046] As an embodiment provided by the present invention, preferably, an air inlet 203 communicating with the cavity 202 is further provided on the outer wall of the dielectric sleeve 2 , and the air inlet 203 is connected to the air source 5 .

[0047] As an embodiment provided by the present invention, preferably, a top hole 402 matching with the medium sleeve 2 is opened at the upper end of the metal shell 4, and the medium sleeve 2 is threadedly connected to the top hole 402 and can move up and down.

[0048] As an embodiment provided by the present invention, preferably, the elastic disc 1 is made of highly elastic silicone.

[0049] Embodiment 2:

[0050] like Figure 5 As shown, according to an embodiment of the second aspect of the present invention, a method for adjusting the plasma jet processing area is proposed, and the method is implemented based on the device described in the first aspect.

[0051] As an embodiment provided by the present invention, preferably, the following steps are included:

[0052] Steps to reduce the plasma jet treatment area:

[0053] Step S1: rotating the medium sleeve 2 to move it downward, and the medium sleeve 2 drives the elastic disc 1 to compress downward;

[0054] Step S2: the area of ​​the elastic disk horizontal section 101 of the elastic disk 1 is increased, thereby partially covering the jet holes 401 at the bottom of the metal shell 4, resulting in a reduction in the number of the jet holes 401, thereby achieving the purpose of reducing the plasma jet processing area;

[0055] Steps to increase the plasma jet treatment area:

[0056] Step X1: The medium sleeve 2 is screwed upward, and the medium sleeve 2 drives the elastic disc 1 to rebound upward;

[0057] Step X2: The area of ​​the elastic disk horizontal section 101 of the elastic disk 1 is reduced, thereby increasing the number of jet holes 401, thereby achieving the purpose of increasing the plasma jet processing area.

[0058] In other embodiments, the adjustment range of the plasma jet processing area can be increased by increasing or decreasing the number and arrangement of the jet holes 401 .

[0059] The present invention can achieve wide-range adjustment of the plasma jet processing area by changing the size of the elastic disc and increasing or decreasing the number and arrangement of the jet holes, and the device has a simple structure and is easy to operate. The device of the present invention can achieve automatic control of the up and down movement of the dielectric sleeve in the metal shell through automated transformation, which can meet the automatic and online adjustment of the plasma jet processing area, thereby greatly increasing the application range of the atmospheric pressure plasma jet.

[0060] The above embodiments are only used to illustrate the technical method of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A device for adjusting the processing area of a plasma jet, characterized in that, it includes: A metal shell (4) with a plurality of jet holes (401) opened at its bottom, and the metal shell (4) is grounded; An elastic disc (1) installed inside the metal shell (4); A dielectric sleeve (2) whose periphery is rotatably connected to the metal shell (4) and one end is installed on the elastic disc (1), and one side of the dielectric sleeve (2) is connected to a gas source; a top hole (402) matching the dielectric sleeve (2) is opened at the upper end of the metal shell (4), and the dielectric sleeve (2) is threadedly connected to the top hole (402); A metal high-voltage electrode (3) with one end fixedly installed on the dielectric sleeve (2) and the other end connected to the positive pole of the power supply; The elastic disc (1) sequentially includes an elastic disc horizontal section (101), an elastic disc bending section (102), and an elastic disc vertical section (103) from bottom to top; The elastic disc horizontal section (101) is a circular ring structure; The elastic disc bending section (102) is a horn-shaped structure; The elastic disc vertical section (103) is a barrel-shaped structure; All three parts of the elastic disc (1) have a thin-walled cavity structure inside to form a plasma formation space.

2. The device for adjusting the processing area of a plasma jet according to claim 1, characterized in that, The elastic disc (1) further includes an elastic disc through hole (104) penetrating through the elastic disc horizontal section (101), the elastic disc bending section (102), and the elastic disc vertical section (103), and the dielectric sleeve (2) is inserted into the elastic disc through hole (104) and fixedly connected to the elastic disc (1).

3. The device for adjusting the processing area of a plasma jet according to claim 1, characterized in that, The dielectric sleeve (2) includes a cavity (202) provided on its tube wall, and the cavity (202) is coaxially arranged with the central through hole (201) of the dielectric sleeve (2); the dielectric sleeve (2) is communicated with the elastic disc (1) through the cavity (202).

4. The device for adjusting the processing area of a plasma jet according to claim 3, characterized in that, An air inlet (203) communicated with the cavity (202) is further provided on the outer wall of the dielectric sleeve (2), and the air inlet (203) is connected to a gas source (5).

5. The device for adjusting the processing area of a plasma jet according to claim 1, characterized in that, The elastic disc (1) is made of elastic silica gel.

6. A method for adjusting the processing area of a plasma jet, characterized in that, The method is implemented based on the device according to any one of claims 1-5.

7. The method for adjusting the processing area of a plasma jet according to claim 6, characterized in that, It includes the following steps: Step of reducing the plasma jet processing area: Step S1: Rotate the dielectric sleeve (2) to move it downward, and the dielectric sleeve (2) drives the elastic disc (1) to be compressed downward; Step S2: the area of ​​the elastic disk horizontal section (101) of the elastic disk (1) is increased, thereby partially covering the jet holes (401) at the bottom of the metal shell (4), resulting in a reduction in the number of exposed jet holes (401), thereby achieving the purpose of reducing the plasma jet treatment area; Steps to increase the plasma jet treatment area: Step X1: The dielectric sleeve (2) is screwed upward, and the dielectric sleeve (2) drives the elastic disc (1) to rebound upward; Step X2: The area of ​​the elastic disk horizontal section (101) of the elastic disk (1) is reduced, thereby increasing the number of leaking jet holes (401), thereby achieving the purpose of increasing the plasma jet treatment area.

Citation Information

Patent Citations

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