Circuit boards, circuit board assemblies, and electronic devices

Abstract

This application provides a circuit board, a circuit board assembly, and an electronic device. The circuit board includes a substrate, a first pad, and a second pad; the first pad and the second pad are arranged at intervals along a first direction, the number of first pads is less than the number of second pads, and at least two second pads are arranged at intervals along a second direction, the second direction being different from the first direction; the first pad includes a first sub-pad with a recess, the bottom end of the recess being located within the first sub-pad, and the opening of the recess facing the second pad; and / or, the second pad includes a second sub-pad with a protrusion, the protrusion being located near the first pad and extending towards the first pad. By optimizing the structure of the pads, the circuit board of this application can increase the holding force on the side with fewer pads and / or decrease the holding force on the side with more pads, thereby making the forces applied to the pads on both sides relatively balanced, ensuring reliable mounting of electronic devices on the circuit board.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to a circuit board, a circuit board assembly, and an electronic device. Background Technology

[0002] Electronic components are typically soldered onto circuit boards to form circuit board assemblies. Specifically, the pins of the electronic components correspond one-to-one with the pads on the circuit board, and then each pin is fixed and made conductive by soldering to its corresponding pad.

[0003] The number and position of pins vary for different specifications of electronic devices. For example, some electronic devices with an odd number of pins are difficult to arrange symmetrically. When such electronic devices are mounted on a circuit board, the asymmetry of soldering stress may lead to uneven adhesion and frequent desoldering failures. Summary of the Invention

[0004] This application provides a circuit board, a circuit board assembly, and an electronic device. By optimizing the structure of the pads on the circuit board, the bonding effect of the circuit board on electronic devices is improved. Specifically, this application includes the following technical solutions:

[0005] In a first aspect, this application provides a circuit board, including a substrate and a first pad and a second pad supported on the same outer surface of the substrate; the first pad and the second pad are arranged at intervals along a first direction, and the number of the first pads is less than the number of the second pads, and at least two second pads are arranged at intervals along a second direction, the second direction being different from the first direction; the first pad includes a first sub-pad, the first sub-pad having a recess, the bottom end of the recess being located inside the first sub-pad, and the opening of the recess facing the second pad along the first direction; and / or, the second pad includes a second sub-pad, the second sub-pad having a protrusion located near the first pad and extending towards the first pad along the first direction.

[0006] The first and second pads of the circuit board in this application are both located on the same outer surface of the substrate and can be used to mount the same electronic device. The first and second pads are spaced apart in one direction, and the number of first pads is relatively small. At least two second pads are also spaced apart in another direction. This results in an asymmetrical arrangement of the first and second pads.

[0007] The circuit board of this application can have a recessed portion on the first sub-pad of the first pad, wherein the opening of the recessed portion faces the direction of the second pad. When the pins of the corresponding electronic device are soldered to the recessed portion, a horizontal tension away from the direction of the second pad can be generated, thereby increasing the holding force of the circuit board on the electronic device on the side closer to the first pad. This reduces the difference in holding force between the asymmetrically arranged pad structures and can better prevent the unsatisfactory phenomenon of uneven adhesion of electronic devices and frequent desoldering failure.

[0008] The circuit board of this application can also have a protrusion on the second sub-pad of the second pad. The shape of the protrusion is close to that of the first pad. When the protrusion is soldered to the pin of the corresponding electronic device, it can generate a horizontal tension in the direction of the first pad, thereby reducing the holding force of the circuit board on the electronic device on the side close to the second pad. This also reduces the difference in holding force between the asymmetrically arranged pad structures, and can better prevent the unbalanced adhesion of electronic devices and frequent desoldering failure.

[0009] In one possible implementation, the first direction is perpendicular to the second direction.

[0010] In one possible implementation, the recess is axially symmetric, and the axis of symmetry of the recess passes through the geometric center of the first sub-disk along a first direction.

[0011] In this implementation, the recess is set to an axisymmetric shape. When the recess is welded to its corresponding pin, the horizontal tension along the second direction is equal in magnitude and opposite in direction, so that the recess only provides horizontal tension along the first direction, avoiding the phenomenon of asymmetrical holding force in the second direction.

[0012] In one possible implementation, the recessed portion is triangular, arc-shaped, or trapezoidal in shape.

[0013] In one possible implementation, the first sub-pad has a first width W1 along a first direction, and the first sub-pad also includes a first side away from the second pad, and the distance D1 from the bottom of the recess to the first side satisfies the condition: 0.25W1≤D1≤0.5W1.

[0014] In one possible implementation, the first sub-disk has a first height H1 along the second direction, and the opening length L1 of the recess satisfies the condition: L1≥0.5H1.

[0015] In both of the above implementation methods, the distance D1 between the bottom end of the recess and the first side, and the opening length L1 of the recess, can both affect the area of ​​the recess and simultaneously affect the structural strength of the first sub-disc. Limiting the distance D1 and the opening length L1 can ensure that the horizontal tension formed by the recess meets the preset requirements and at the same time ensure the structural strength of the first sub-disc.

[0016] In one possible implementation, in the second direction, the first pad is flush with a second pad; or, the first pad is located between two second pads.

[0017] In this implementation, corresponding to the pin arrangement structure in different electronic devices, the first pad can be flush with a second pad in the second direction, or it can be located between two second pads. Both arrangement methods can achieve the effect of relatively reducing the difference in holding force in the first direction, thus forming a better bond between the circuit board and the electronic device.

[0018] In one possible implementation, in the second direction, the first pad is located between the two second pads, and the distance between the first pad and the two second pads is equal.

[0019] In this implementation, the two second pads are arranged symmetrically with respect to the central axis of the first pad, and the first pad is subjected to relatively balanced forces in the second direction, which can avoid the formation of differences in holding forces in the second direction.

[0020] In one possible implementation, the protrusion is axially symmetric, and the axis of symmetry of the protrusion passes through the geometric center of the second sub-disk along a first direction.

[0021] In this implementation, the protrusion is set to an axisymmetric shape. When the protrusion is welded to its corresponding pin, the horizontal tension along the second direction is ensured to be equal in magnitude and opposite in direction. This ensures that the protrusion only provides horizontal tension along the first direction, avoiding the phenomenon of asymmetrical holding force in the second direction.

[0022] In one possible implementation, the protrusion is triangular, arc-shaped, or trapezoidal in shape.

[0023] In one possible implementation, the second sub-pad further includes a main body portion located on the side of the protrusion away from the first pad in a first direction, and the main body portion having a second width W2, wherein the distance D2 from the top of the protrusion portion to the main body portion satisfies the condition: 0.25W2≤D2≤0.5W2.

[0024] In one possible implementation, in the second direction, the second sub-disk has a second height H2, and the length L2 of the protrusion satisfies the condition: L2≥0.5H2.

[0025] In both of the above implementation methods, the distance D2 from the protrusion to the main body and the length L2 of the protrusion can both affect the area of ​​the protrusion, and thus affect the change in the holding force of the second sub-disc. Limiting the distance D2 and the length L2 can ensure that the change in horizontal tension formed by the protrusion meets the preset requirements.

[0026] In one possible implementation, the area of ​​the first sub-pad is greater than or equal to the area of ​​the second pad.

[0027] In this implementation, setting the area of ​​the first pad to be larger allows for a larger contact surface between the first pad and its corresponding pin, thereby increasing its surface tension and further increasing the holding force on the first pad side; conversely, setting the area of ​​the second pad to be smaller reduces the holding force on the second pad side, thus narrowing the difference in holding force between the two sides.

[0028] In one possible implementation, multiple second pads are arranged in two rows spaced apart along a first direction, with the same number of second pads in each row.

[0029] In this implementation, multiple second pads are arranged in two rows, and the number of second pads in each row is the same, so that the second pads are symmetrical to each other in the second direction, avoiding differences in holding force.

[0030] In one possible implementation, the second pad includes a second sub-pad, and at least two second sub-pads are aligned along a second direction.

[0031] In one possible implementation, there are two second pads in each row and one first pad.

[0032] In this implementation, the four second pads and one first pad can correspond to the pin arrangement of the five-pin filter.

[0033] In one possible implementation, there are three second pads, which are spaced apart along a second direction, and there are two first pads, which are also spaced apart along a second direction.

[0034] In one possible implementation, the spacing between the two first pads is equal to the spacing between the two second pads that are farther apart among the three second pads.

[0035] In a second aspect, this application provides a circuit board assembly, including electronic devices and the circuit board provided in the first aspect of this application, wherein the electronic devices are mounted on the circuit board via a first pad and a second pad.

[0036] The circuit board assembly provided in the second aspect of this application, because it uses the circuit board provided in the first aspect of this application, has a more secure connection with electronic devices, which can avoid the adverse phenomena of uneven adhesion of electronic devices and frequent desoldering failure.

[0037] In one possible implementation, the electronic device includes a first pin that is correspondingly connected to a first pad, and the first pin covers at least 80% of the area of ​​the recess in the first pad.

[0038] In this implementation, the coverage area between the first pin and the recess is set to be large, which can ensure that the recess achieves the preset effect of increasing the holding force of the first pad.

[0039] Thirdly, this application provides an electronic device, including a housing and a circuit board assembly as provided in the second aspect of this application, the circuit board assembly being disposed within the housing.

[0040] It is understandable that the electronic devices provided in the third aspect of this application all have the same effect of more stable internal structure and avoidance of desoldering of internal electronic components because they include the circuit board assembly provided in the second aspect of this application. Attached Figure Description

[0041] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the working scenario of the electronic device of this application;

[0043] Figure 2 A structural schematic diagram of the circuit board assembly from one side view;

[0044] Figure 3 for Figure 2 A schematic diagram showing the exploded structure of the circuit board assembly in the implementation shown;

[0045] Figure 4 for Figure 2 A schematic diagram of the electronic device from one side of the implementation method shown, with the circuit board hidden.

[0046] Figure 5 for Figure 2 A schematic diagram of the planar structure of a pad area on the circuit board when electronic components are hidden in the implementation shown;

[0047] Figure 6 for Figure 5A schematic diagram of the planar structure of the first pad in the implementation shown;

[0048] Figure 7 This is a schematic diagram of the planar structure of the first pad in one implementation.

[0049] Figure 8 This is a schematic diagram of the planar structure of the first pad in one implementation.

[0050] Figure 9 This is a schematic diagram of the planar structure of the first pad in one implementation.

[0051] Figure 10 This is a schematic diagram of the exploded structure of a circuit board from one side in one implementation.

[0052] Figure 11 for Figure 10 A schematic diagram of the planar structure of the pad area in the implementation shown;

[0053] Figure 12 for Figure 10 A schematic diagram of the planar structure of the second sub-disk in the implementation shown;

[0054] Figure 13 This is a schematic diagram of the planar structure of the second sub-disk in one implementation.

[0055] Figure 14 This is a schematic diagram of the planar structure of the second pad in one implementation.

[0056] Figure 15 This is a schematic diagram of the planar structure of the second pad in one implementation.

[0057] Figure 16 This is a schematic diagram of the exploded structure of a circuit board from one side in one implementation.

[0058] Figure 17 for Figure 16 A schematic diagram of the planar structure of the pad area in the implementation shown;

[0059] Figure 18 This is a schematic diagram of the exploded structure of a circuit board from one side in one implementation.

[0060] Figure 19 for Figure 18 A schematic diagram of the planar structure of the pad area in the implementation shown;

[0061] Figure 20a This is a schematic diagram of the planar structure of the first and second pads in one implementation within the pad area;

[0062] Figure 20bThis is a schematic diagram of the planar structure of the first and second pads in one implementation within the pad area;

[0063] Figure 20c This is a schematic diagram of the planar structure of the first and second pads in one implementation within the pad area;

[0064] Figure 20d This is a schematic diagram of the planar structure of the first and second pads in one implementation within the pad area;

[0065] Figure 21 This is a schematic diagram of the exploded structure of a circuit board from one side in one implementation.

[0066] Figure 22 for Figure 21 A schematic diagram of the planar structure of the pad area in the implementation shown;

[0067] Figure 23a This is a schematic diagram of the planar structure of the first and second pads in one implementation within the pad area;

[0068] Figure 23b This is a schematic diagram of the planar structure of the first and second pads in one implementation within the pad area;

[0069] Figure 24 This is a structural schematic diagram of a circuit board assembly from one side view in a comparative embodiment;

[0070] Figure 25 for Figure 24 Analysis diagram of the holding force when the pads are connected to their corresponding pins in the implementation shown;

[0071] Figure 26 This is a diagram showing the holding force generated when the first sub-disk proposed in this application is connected to its corresponding pins.

[0072] Figure 27 This is a diagram showing the holding force generated when the first sub-disk is connected to its corresponding pin in one implementation.

[0073] Figure 28 This is a diagram showing the holding force generated when the second sub-disk proposed in this application is connected to its corresponding pins.

[0074] Figure 29 This is a diagram illustrating the holding force generated when the second sub-disk is connected to its corresponding pin in one implementation. Detailed Implementation

[0075] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are merely some, and not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection claimed in this application.

[0076] Please see Figure 1 , Figure 1 This is a schematic diagram illustrating the working scenario of the electronic device 200 of this application. For example... Figure 1 As shown, the electronic device 200 of this application includes a circuit board assembly 100 and a housing 201. The circuit board assembly 100 is disposed inside the housing 201 and is used to realize the preset functions of the electronic device 200, such as data processing, data storage, signal transmission and reception, data acquisition, data output, and realizing specific mechanism actions.

[0077] The housing 201 is used to support and fix the circuit board assembly and can protect the circuit board assembly 100, such as preventing moisture, impurities, dust and other external environmental factors from corroding the circuit board assembly 100, thereby improving the service life and working stability of the circuit board assembly 100 and improving the user experience of the electronic device 200 of this application.

[0078] It should be noted that, in Figure 1 In the implementation shown, the electronic device 200 is a tablet. In other implementations of this application, the electronic device 200 may also be a computer, smart home appliance, vehicle or other customer terminal device, or a router, base station or other customer premise equipment (CPE), or any other electronic device 200. This application embodiment does not specifically limit the type of electronic device 200.

[0079] For ease of description, in the subsequent embodiments of this application, the electronic device 200 is taken as a tablet as an example for illustrative purposes. Furthermore, it will be understood that... Figure 1 The implementation shown is only an example of the structure and position of the housing 201 and the circuit board assembly 100, and does not represent a limitation on the specific structure and position of the housing 201 and the circuit board assembly 100.

[0080] Please also refer to Figure 2 and Figure 3 , Figure 2 This is a structural schematic diagram of the circuit board assembly 100 from one side. Figure 3 for Figure 2The diagram shows an exploded view of the circuit board assembly 100 in the illustrated implementation. The circuit board assembly 100 provided in this application includes a circuit board 10 and an electronic device 20. The circuit board 10 includes a substrate 11 and pads 12, with the pads 12 protruding from the same outer surface of the substrate 11. The electronic device 20 has pins 21, which are correspondingly connected to the pads 12, allowing the electronic device 20 to be mounted on the circuit board 10. Through the electrical connection between the pins 21 and the pads 12, the electronic device 20 can be powered on, enabling it to function normally and perform its functions.

[0081] Understandable, Figure 2 In the implementation shown, the number of electronic devices 20 mounted on the circuit board 10 can be one or more, and their number and arrangement can be adjusted according to actual needs. Figure 2 The example description uses only one electronic device 20 as an example and does not limit the number of electronic devices 20 mounted on the circuit board 10 of this application to only one.

[0082] Among them, the electronic device 20 can be a filter, capacitor, resistor, chip and other electronic devices used to realize one or more preset functions of the above-mentioned electronic device 200. Through the interaction between the various electronic devices 20 mounted on the circuit board 10, one or more preset functions of the above-mentioned electronic device 200 can be realized.

[0083] like Figure 3 As shown, each electronic device 20 has multiple pins 21, and the number and arrangement of each pin 21 can be different. In other words, the number and arrangement of pins 21 of electronic devices 20 used to achieve different functions can be adjusted according to actual needs.

[0084] It should be noted that the number of pins 21 of the electronic device 20 can be an odd number, such as 3, 5, 7, or other odd numbers. The odd number of pins 21 can be arranged asymmetrically. In other implementations of this application, the number of pins 21 of the electronic device 20 can also be an even number, such as 4, 6, or other even numbers. When the number of pins 21 of the electronic device 20 is an even number, the pins 21 may also be arranged asymmetrically.

[0085] In this application Figure 3 The implementation shown is only an example of the position and structure of the electronic device 20 and the circuit board 10, and does not represent the actual position and structure of the electronic device 20 and the circuit board 10.

[0086] For example, in one possible implementation, please refer to Figure 4 , Figure 4 for Figure 2 This is a schematic diagram of the electronic device 20 from one side, with the circuit board 10 hidden in the implementation shown. Figure 4 In the implementation shown, the electronic device 20 is a five-pin filter, which means that the filter has 5 pins 21.

[0087] like Figure 4 As shown, the pins 21 of the electronic device 20 include a first pin 211 and a second pin 212. There is one first pin 211 and four second pins 212. The second pins 212 are arranged in two columns along a first direction 001 and in two rows along a second direction 002. The first pins 211 are spaced apart on one side of the second pins 212 along the first direction 001 and are located between the two rows of second pins 212 along the second direction 002.

[0088] In other words, in Figure 4 In the implementation shown, the number of second pins 212 is greater than the number of first pins 211, and the first pins 211 and second pins 212 are arranged at intervals along the first direction 001. That is, the pins 21 of the five-pin filter form an asymmetrical arrangement in the first direction 001.

[0089] The first direction 001 and the second direction 002 are different. Figure 4 In the implementation shown, the first direction 001 and the second direction 002 are perpendicular to each other. This is understandable. Figure 4 The example described is based solely on the first direction 001 being the direction opposite to the first pin 211 and the second pin 212. In other implementations of this application, the directions of the first direction 001 and the second direction 002 can be interchanged, or the first direction 001 and the second direction 002 can be other directions. This application does not limit these directions.

[0090] For further information, please refer to [link / reference]. Figure 3 .like Figure 3 As shown, for multiple electronic devices 20, multiple pad areas A are provided on the substrate 11, each pad area A corresponding to one electronic device 20. The number of pins 21 of the corresponding electronic devices 20 is different, and each pad area A has a different number of pads 12. Each pin 21 of the electronic device 20 is connected to a pad 12, so that the electronic device 20 is powered on through the connection between the pin 21 and the pad 12, and the electronic device 20 can work normally.

[0091] The number and position of the pads 12 on the substrate 11 correspond to the number and position of the pins 21 on each electronic device 20. That is, for each electronic device 20, the number and arrangement of the pads 12 in the pad area A on the substrate 11 correspond to the pins 21 of the corresponding electronic device 20.

[0092] For example, in one possible implementation, such as Figure 3 As shown, when the electronic device 20 has 5 pins 21, the number of pads 12 in the corresponding pad area A is also 5. Furthermore, the arrangement of the pads 12 in pad area A is the same as the arrangement of the pins 21 of the electronic device 20. In other words, the pads 12 in pad area A correspond one-to-one with each pin 21 of the corresponding electronic device 20, ensuring that the electronic device 20 can be accurately and reliably mounted on the circuit board 10, thereby guaranteeing the operational stability of the electronic device 20.

[0093] Please see Figure 5 , Figure 5 for Figure 2 The diagram shows a planar structure of a pad area A on the circuit board 10 when the electronic device 20 is hidden. In the circuit board 10 proposed in this application, the pads 12 supported on the substrate 11 include first pads 121 and second pads 122. The first pads 121 and second pads 122 are arranged at intervals along a first direction 001, and the number of first pads 121 is less than the number of second pads 122. At least two second pads 122 are arranged at intervals along a second direction 002.

[0094] like Figure 5 As shown, by setting the first pad 121 and the second pad 122 to be arranged at intervals along the first direction 001, and the number of the first pad 121 is less than the number of the second pad 122, and setting at least two second pads 122 to be arranged at intervals along the second direction 002, an asymmetrical arrangement of pads 12 can be formed in the pad area A, which can then correspond to the asymmetrical arrangement of pins 21 of the electronic device 20.

[0095] For example, in one possible implementation, such as Figure 5 As shown, the number and arrangement of pads 12 within pad area A correspond to... Figure 4 The number and arrangement of pins 21 in the five-pin filter shown in the implementation are configured.

[0096] Specifically, in Figure 5In the implementation shown, within pad area A, there are 5 pins 21 corresponding to the 5-pin filter, and the number of pads 12 within pad area A is 5. The 5 pads 12 consist of 1 first pad 121 and 4 second pads 122, with the first pad 121 and second pads 122 arranged alternately along a first direction 001. The 4 second pads 122 are arranged in two alternate columns along the first direction 001 and in two alternate rows along the second direction 002. Each row of second pads 122 contains 2 pads, and each column of second pads 122 also contains 2 pads.

[0097] like Figure 5 As shown, a first pad 121 is located between two rows of second pads 122 along the second direction 002, and the first pad 121 is equidistant from the two rows of second pads 122 in the second direction 002. That is, the two rows of second pads 122 are equidistant from the axis of symmetry of the first pad 121 in the second direction 002.

[0098] In other words, the five pads 12 in pad area A corresponding to the five-pin filter are asymmetrically arranged in the first direction 001 and symmetrically arranged in the second direction 002. The pads 12 in pad area A form a multi-pad side composed of second pads 122 and a few-pad side composed of first pads 121 in the first direction 001, respectively. The second pads 122 in the multi-pad side correspond to the second pin 212 of the electronic device 20, and the first pads 121 in the few-pad side correspond to the first pin 211 of the electronic device 20.

[0099] Understandably, the second pads 122 are arranged in two rows at intervals along the first direction 001, and the number of second pads 122 in each row is the same. Multiple second pads 122 are arranged in two rows, and the number of second pads 122 in each row is the same, so that the second pads 122 are symmetrical to each other in the second direction 002. This avoids the difference in holding force between the electronic device 20 and the circuit board 10 in the second direction 002, thereby improving the connection reliability between the electronic device 20 and the circuit board 10, and thus improving the working stability of the electronic device 20.

[0100] exist Figure 5In the illustrated implementation, the first pad 121 and the second pad 122 are both located on the same outer surface of the substrate 11 and can be used to mount the same electronic device 20. The first pad 121 and the second pad 122 are arranged at intervals along one direction, and the number of first pads 121 is less than the number of second pads 122. At least two second pads 122 are also arranged at intervals along another direction. Thus, an asymmetrical arrangement of the first pads 121 and the second pads 122 is formed on the substrate 11 corresponding to one electronic device 20, allowing for a one-to-one correspondence between the asymmetrically arranged pins 21 on the corresponding electronic device 20. This enables the pins 21 to accurately connect to the pads 12, improving the reliability of the circuit board 10.

[0101] It should be noted that, Figure 5 This example only illustrates one possible arrangement and number of pads 12 within a single pad area A, and does not limit the arrangement and number of pads 12 in a single pad area A to this embodiment. In other implementations of this application, the number and position of pads 12 within pad area A vary depending on the number and position of pins 21 of the electronic device 20. That is, the number and position of pads 12 on the substrate 11 differ depending on the number and position of pins 21 of the electronic device 20. The number and position of pads 12 can be adjusted according to actual needs and settings.

[0102] For further details, please refer to Figure 6 , Figure 6 for Figure 5 A schematic diagram of the planar structure of the first pad 121 in the implementation shown. (See attached diagram.) Figure 6 As shown, the first pad 121 includes a first sub-pad 1211, and the first sub-pad 1211 is provided with a recess 1212. The recess 1212 has an opening 1212a and a bottom end 1212b disposed opposite to each other along a first direction 001, and the opening 1212a faces the second pad 122 along the first direction 001, and the bottom end 1212b faces away from the second pad 122 along the first direction 001 and is located within the first sub-pad 1211.

[0103] And such as Figure 6 As shown, the first pad 121 has an axisymmetric structure, and its axis of symmetry extends along the first direction 001. The recess 1212 and the first sub-pad 1211 are both symmetrically arranged along the axis of symmetry of the first pad 121, which is also the axis of symmetry of the recess 1212 and the first sub-pad 1211.

[0104] The recessed portion 1212 is the area of ​​the first pad 121 where no pad material is applied, that is, the first sub-pad 1211 is concave or recessed.

[0105] By providing a recess 1212 on the first pad 121 and providing an opening 1212a of the recess 1212 facing the second pad 122, a first tension F1 away from the second pad 122 can be generated at the bottom end 1212b of the recess 1212 in the direction along the plane of the substrate 11 when the first pad 121 is soldered to the pin 21 of its corresponding electronic device 20.

[0106] Understandably, the first tension F1 has a first component force FR along the first direction 001 and a second component force FL along the second direction 002. Since the recess 1212 is symmetrical along the first direction 001, the second component forces FL located on both sides of the axis of symmetry of the first pad 121 are opposite in direction and equal in magnitude, thus canceling each other out. The first component force FR is located on the same side of the recess 1212, and all the first component forces FR are equal in magnitude and the same in direction. The first component force FR is also the horizontal tension F0 along the first direction 001 away from the direction of the second pad 122.

[0107] By having the recessed portion 1212 generate a second component force FL in the second direction 002 that cancels each other out, the holding force of the electronic device 20 in the second direction 002 can be balanced when it is connected to the circuit board 10, thus ensuring the stable connection of the electronic device 20 in the second direction 002. By having the recessed portion 1212 generate a horizontal tension F0 away from the second pad 122 in the first direction 001, the holding force of the electronic device 20 on the side with fewer pads can be improved, thereby increasing the connection reliability of the electronic device 20 on the side with fewer pads.

[0108] That is, by setting the recessed portion 1212, the adsorption force of the first pad 121 and its corresponding pin 21 during soldering can be improved, thereby offsetting the difference in holding force caused by the asymmetrical structure of the pad 12 in the pad area A, and preventing the connection between the electronic device 20 and the circuit board 10 from being unstable due to the uneven holding force caused by the asymmetrical arrangement of the first pad 121 and the second pad 122 in the first direction 001.

[0109] By providing a recess 1212 on the first pad 121 and providing the recess 1212 to generate a horizontal tension F0 in the direction away from the second pad 122, the holding force of the circuit board 10 on the electronic device 20 on the side near the first pad 121 is increased. This reduces the difference in holding force between the asymmetrically arranged pads 12 in the first direction 001, and can better prevent the undesirable phenomenon of uneven adhesion of the electronic device 20 and frequent desoldering failure.

[0110] Optionally, such as Figure 6As shown, the recess 1212 has an axisymmetric shape, and the axis of symmetry of the recess 1212 (not shown in the figure) passes through the geometric center of the first sub-disk 1211 along the first direction 001.

[0111] Specifically, in Figure 6 In the implementation shown, the first pad 121 has a rectangular structure and extends along the first direction 001. The intersection of the diagonals of the first pad 121 is the geometric center of the first sub-pad 1211.

[0112] The recess 1212 has an isosceles triangular structure and is symmetrically distributed along the first direction 001. The axis of symmetry of the recess 1212 passes through the geometric center of the first sub-disk 1211 along the first direction 001.

[0113] Understandably, in this implementation, the recess 1212 is set to an axisymmetric shape. When the recess 1212 is soldered to its corresponding pin 21, it can be ensured that the second component force FL along the second direction 002 is equal in magnitude and opposite in direction. Since the second component force FL generated by the recess 1212 is symmetrically distributed about the axis of symmetry, they can cancel each other out in the second direction 002, thus avoiding the phenomenon of asymmetrical holding force in the second direction 002. This allows the recess 1212 to only provide a horizontal tension F0 along the first direction 001 away from the second pad 122.

[0114] Optionally, such as Figure 6 As shown, the first sub-pad 1211 has a first width W1 along the first direction 001, and the first sub-pad 1211 also has a first side 1211a that is opposite to the second pad 122 in the first direction 001.

[0115] exist Figure 6 In the implementation shown, the distance D1 from the bottom end 1212b of the recess 1212 to the first side 1211a satisfies the condition: 0.25W1≤D1≤0.5W1.

[0116] Understandably, the distance D1 between the bottom end 1212b of the recess 1212 and the first side 1211a will affect the area of ​​the recess 1212, and thus affect the magnitude of the horizontal tension F0 generated by the first sub-pad 1211 on the substrate 11 away from the second pad 122. That is, the distance D1 will affect the structural strength of the first sub-pad 1211, and affect the adsorption force and connection reliability between the first pad 121 and the pin 21 of its corresponding electronic device 20.

[0117] In other words, by defining the relationship between the distance D1 between the bottom end 1212b of the recess 1212 and the first side 1211a and the first width W1 of the first sub-pad 1211 along the first direction 001, the magnitude of the horizontal tension F0 generated by the recess 1212 can be defined so that the magnitude of the horizontal tension F0 can meet the preset requirements of the adsorption force between the first pad 121 and its corresponding pin 21.

[0118] Optionally, please refer to Figure 7 , Figure 7 This is a schematic diagram of the planar structure of the first pad 121 in this implementation. Figure 7 As shown, the first sub-disk 1211 has a first height H1 along the second direction 002, which is the extension length of the first sub-disk 1211 in the second direction 002. The opening 1212a of the recess 1212 has a length L1 in the second direction 002, and the length L1 of the opening 1212a of the recess 1212 satisfies the condition: L1≥0.5H1.

[0119] Understandably, the length L1 of the opening 1212a of the recess 1212 in the second direction 002 will affect the area of ​​the recess 1212, and thus affect the magnitude of the horizontal tension F0 generated by the first sub-pad 1211 on the substrate 11 away from the second pad 122. That is, the size of L1 will affect the structural strength of the first sub-pad 1211, and affect the adsorption force and connection reliability between the first pad 121 and the pin 21 of its corresponding electronic device 20.

[0120] exist Figure 6 and Figure 7 In the illustrated implementation, the distance D1 between the bottom end 1212b of the recess 1212 and the first side 1211a, and the length L1 of the opening 1212a of the recess 1212, both affect the area of ​​the recess 1212 and the structural strength of the first sub-disc 1211. Limiting the distance D1 and the opening length L1 ensures that the horizontal tension F0 formed by the recess 1212 meets preset requirements and simultaneously guarantees the structural strength of the first sub-disc 1211.

[0121] Alternatively, in one possible implementation, the first pin 211 covers at least 80% of the area of ​​the recess 1212 in the first pad 121.

[0122] Specifically, the first pin 211 of the electronic device 20 is connected to the first pad 121, and when the first pin 211 is connected to the first pad 121, the projection of the first pin 211 on the substrate 11 covers at least 80% of the projected area of ​​the recess 1212 in the first pad 121 on the substrate 11.

[0123] Understandably, in this implementation, setting the area of ​​the first pin 211 covering the recess 1212 to be at least 80% can ensure the reliability of the connection between the recess 1212 and the first pin 211, and achieve the preset effect of increasing the holding force between the first pad 121 and the first pin 211.

[0124] It should be noted that, in Figure 7 In the implementation shown, the recess 1212 is only illustrated as an isosceles triangle, and the shape of the recess 1212 is not limited to an isosceles triangle. In other implementations of this application, the shape of the recess 1212 may also include, but is limited to, an equilateral triangle, an arc, or a trapezoid, or, alternatively, a shape formed by a combination of one or more of the following shapes: triangle, arc, or trapezoid.

[0125] For example, in one possible implementation, please refer to Figure 8 , Figure 8 This is a schematic diagram of the planar structure of the first pad 121 in this implementation. Figure 8 In the implementation shown, the recess 1212 of the first pad 121 is arc-shaped, that is, the bottom end 1212b of the recess 1212 is arc-shaped, and its opening 1212a is set towards the second pad 122 along the first direction 001.

[0126] For example, in one possible implementation, please refer to Figure 9 , Figure 9 This is a schematic diagram of the planar structure of the first pad 121 in this implementation. Figure 9 In the implementation shown, the recess 1212 of the first pad 121 is trapezoidal, and the axis of symmetry of the recess 1212 passes through the geometric center of the first sub-pad 1211 along the first direction 001.

[0127] Please also refer to Figure 10 and Figure 11 , Figure 10 This is an exploded view of the circuit board 10 from one side in this implementation. Figure 11 for Figure 10 The diagram shows the planar structure of pad area A in the implementation shown. Figure 10 In the implementation shown, the number of first pads 121 and the number of second pads 122 are related to... Figure 3 In the embodiment shown, the number of first pads 121 and the number of second pads 122 are the same, and their arrangement can also be the same.

[0128] exist Figure 10In the implementation shown, the first pad 121 has a cuboid structure, and the second pad 122 includes at least two second sub-pads 1221, and the at least two second sub-pads 1221 are aligned along the second direction 002.

[0129] like Figure 11 As shown, the second pad 122 includes four second sub-pads 1221, and the four second sub-pads 1221 are arranged in two columns along the first direction 001 and in two rows along the second direction 002, respectively, and the number of second sub-pads 1221 in each row and each column is equal.

[0130] For details, please refer to Figure 12 , Figure 12 for Figure 10 A schematic diagram of the planar structure of the second sub-disk 1221 in the implementation shown. (See attached diagram.) Figure 12 As shown, each second sub-pad 1221 has a protrusion 12211 and a main body 12212 that are disposed opposite to each other along the first direction 001. The protrusion 12211 of each second sub-pad 1221 is located on the side close to the first pad 121 along the first direction 001 and extends toward the first pad 121 along the first direction 001. The main body 12212 is located on the side of the protrusion 12211 opposite to the first pad 121 in the first direction 001.

[0131] The second sub-disc 1221 has an axisymmetric structure, with its axis of symmetry extending along the first direction 001. The protrusion 12211 and the main body 12212 are both symmetrically arranged along the axis of symmetry of the second sub-disc 1221, which is also the axis of symmetry of the protrusion 12211 and the main body 12212.

[0132] Understandably, the protrusion 12211 extends and protrudes toward the first pad 121 along the first direction 001, such that when the protrusion 12211 of the second sub-pad 1221 is soldered to the pin 21 of its corresponding electronic device 20, the protrusion 12211 can generate a second tension F2 away from the main body 12212 in the plane direction along the substrate 11. The second tension F2 has a third component force FT extending along the first direction 001 and a fourth component force FS extending along the second direction 002.

[0133] Since the protrusion 12211 is symmetrical along the first direction 001, the fourth component force FS located on both sides of the axis of symmetry of the protrusion 12211 is opposite in direction and equal in magnitude, thus canceling each other out. The third component force FT is located on the same side of the protrusion 12211, and each third component force FT is equal in magnitude and the same in direction. The third component force FT is also the horizontal tension F0 along the first direction 001 toward the first pad 121.

[0134] In other words, the protrusion 12211 generates a horizontal tension F0 in the direction of the first pad 121, which will reduce the adsorption force of the second sub-pad 1221 on its corresponding pin 21, thereby reducing the holding force of the circuit board 10 on the electronic device 20 on the side closer to the second pad 122, that is, reducing the holding force of the electronic device 20 on the side with more pads 12 in the pad area A.

[0135] By providing protrusions 12211 on each of the second sub-pads 1221, the difference between the holding force between the fewer first pads 121 and their corresponding first pins 211 and the more numerous second pads 122 and their corresponding second pins 212 in the asymmetrically arranged pad 12 structure is relatively reduced. This can better prevent the unbalanced adhesion of electronic components 20 on the circuit board 10 and the problem of frequent desoldering failure.

[0136] Optionally, such as Figure 12 As shown, the protrusion 12211 is axially symmetric, and the axis of symmetry P of the protrusion 12211 passes through the geometric center of the second sub-disk 1221 along the first direction 001. Specifically, the cross-sectional shape of the main body 12212 along the plane of the substrate 11 is rectangular, and the intersection of its diagonals is the geometric center of the main body 12212. The cross-sectional shape of the protrusion 12211 in the plane of the substrate 11 is arc-shaped, and the axis of symmetry P of the protrusion 12211 is the diameter segment passing through the center of the arc along the first direction 001.

[0137] Understandably, in this implementation, the protrusion 12211 is set to an axisymmetric shape, and when the protrusion 12211 is soldered to its corresponding pin 21, it can be ensured that the fourth component force FS along the second direction 002 is equal in magnitude and opposite in direction, thus canceling each other out. This allows the protrusion 12211 to provide only the fourth component force FS along the first direction 001, avoiding the phenomenon of asymmetrical holding force in the second direction 002, and reducing the holding force formed by the pad 12 on the multi-pad side in the pad area A on the pin 21.

[0138] Alternatively, in one possible implementation, please refer to [the relevant documentation / reference]. Figure 12 The main body 12212 has a second width W2 along the first direction 001, and the distance D2 from the top end Q of the protrusion 12211 to the main body 12212 satisfies the condition: 0.25W2≤D2≤0.5W2.

[0139] Specifically, such as Figure 12 As shown, the top end Q of the protrusion 12211 is the end point of the protrusion 12211 closest to the first pad 121 along the first direction 001. Moreover, the top end Q is located on the axis of symmetry P of the protrusion 12211 in the first direction 001.

[0140] Understandably, in this implementation, the distance D2 between the top tip Q of the protrusion 12211 and the main body 12212 will affect the area of ​​the protrusion 12211, and consequently affect the magnitude of the horizontal tension F0 generated by the second sub-pad 1221 along the substrate 11 towards the first pad 121. That is, the magnitude of distance D2 will affect the structural strength of distance D2, and influence the adhesion force and connection reliability between the second pad 122 and the pin 21 of its corresponding electronic device 20.

[0141] Alternatively, in one possible implementation, please refer to Figure 13 , Figure 13 This is a schematic diagram of the planar structure of the second sub-disk 1221 in this implementation. (See diagram below.) Figure 13 As shown, in the second direction 002, the main body 12212 of the second sub-disk 1221 has a second height H2, and the length L2 of the protrusion 12211 satisfies the condition: L2≥0.5H2.

[0142] Understandably, the second height H2 is the extension length of the main body 12212 of the second sub-disc 1221 in the second direction 002, and the length L2 is the extension length of the protrusion 12211 in the second direction 002, that is, the length of the protrusion 12211 on the side near the main body 12212 along the first direction 001 along the second direction 002.

[0143] In this implementation, the length L2 of the protrusion 12211 in the second direction 002 affects the area of ​​the protrusion 12211. By limiting the relationship between the second height H2 and the length L2, the area of ​​the protrusion 12211 can be limited to ensure that the magnitude of the horizontal tension F0 generated by the second sub-pad 1221 along the substrate 11 toward the first pad 121 can meet the preset connection requirements between the second pad 122 and its corresponding pin 21, that is, to meet the connection reliability requirements between the circuit board 10 and the electronic device 20.

[0144] exist Figure 12 and Figure 13 In the illustrated implementation, the distance D2 from the top Q of the protrusion 12211 to the main body 12212, and the length L2 of the protrusion 12211, both affect the area of ​​the protrusion 12211, and thus affect the holding force of the second sub-disc 1221 on its corresponding pin 21. By limiting the distance D2 and the length L2, it can be ensured that the change in the horizontal tension F0 formed by the protrusion 12211 can meet the preset requirements.

[0145] It should be noted that, in Figure 12 and Figure 13In the implementation shown, the example only uses the arc-shaped cross-section of the protrusion 12211 along the plane of the substrate 11 as an example, and does not mean that the cross-sectional shape of the protrusion 12211 along the plane of the substrate 11 in this application is limited to an arc shape. In other implementations of this application, the cross-sectional shape of the protrusion 12211 along the plane of the substrate 11 can also be other shapes, such as an arc shape, or it can also be, but is not limited to, a triangular, trapezoidal, or rectangular shape protruding towards the first pad 121 along the first direction 001, or it can be a combination of one or more of the shapes of triangle, arc, trapezoid, and rectangle.

[0146] For example, in one possible implementation, please refer to Figure 14 , Figure 14 This is a schematic diagram of the planar structure of the second pad 122 in this implementation. Figure 14 In the implementation shown, the protrusion 12211 of the second pad 122 has a triangular cross-sectional shape along the plane of the substrate 11.

[0147] like Figure 14 As shown, the protrusions 12211 are symmetrically distributed about the axis of symmetry P extending in the first direction 001. Furthermore, the geometric center of the main body 12212 of the second pad 122 passes through the axis of symmetry P of the protrusions 12211, thereby making the second pad 122 symmetrically distributed about the axis of symmetry P.

[0148] For example, in one possible implementation, please refer to Figure 15 , Figure 15 This is a schematic diagram of the planar structure of the second pad 122 in this implementation. Figure 15 In the implementation shown, the protrusion 12211 of the second pad 122 has a trapezoidal cross-sectional shape along the plane of the substrate 11.

[0149] It should be noted that, in Figure 10 This description only exemplifies the case where each second pad 122 has a protrusion 12211, and does not represent that all implementations of this application have a protrusion 12211 on the second pad 122. In other implementations of this application, the number of protrusions 12211 can be adjusted according to actual needs.

[0150] For example, in one possible implementation, please refer to [the relevant documentation / reference]. Figure 16 and Figure 17 , Figure 16 This is an exploded view of the circuit board 10 from one side in this implementation. Figure 17 for Figure 16 The diagram shows the planar structure of pad area A in the implementation shown. Figure 16In the implementation shown, two columns of second pads B are arranged at intervals along the first direction 001. Each column of second pads B contains two second pads 122, and the two second pads 122 in each column are arranged at intervals along the second direction 002.

[0151] Specifically, such as Figure 17 As shown, the two columns of second pads B are respectively the first column of second pads B1 and the second column of second pads B2, which are arranged at intervals along the first direction 001. Specifically, the two second pads 122 in the first column of second pads B1 are both second sub-pads 1221, that is, both second pads 122 in the first column of second pads B1 are provided with a protrusion 12211 and a main body 12212.

[0152] like Figure 17 As shown, the two second sub-pads 1221 in the first column of the second pad B1 are provided with protrusions 12211, while the two second pads 122 in the second column of the second pad B2 are not provided with protrusions 12211.

[0153] For example, in one possible implementation, both second pads 122 in the second column of second pads B2 are second sub-pads 1221, that is, both second pads 122 in the second column of second pads B2 are provided with protrusions 12211, while neither of the two second pads 122 in the first column of second pads B1 are provided with protrusions 12211.

[0154] In one possible implementation, the area of ​​the first sub-pad 1211 is greater than or equal to the area of ​​the second pad 122.

[0155] Understandably, in this implementation, setting the area of ​​the first sub-pad 1211 to be larger than the area of ​​the second pad 122 allows for a larger contact surface between the first sub-pad 1211 and its corresponding pin 21, thereby increasing the surface tension of the first sub-pad 1211 and further enhancing the holding force on the first sub-pad 1211 side. Conversely, setting the area of ​​the second pad 122 to be smaller than the area of ​​the first sub-pad 1211 correspondingly reduces the holding force on the second pad 122 side, thus narrowing the difference in holding force between the first sub-pad 1211 side and the second pad 122 side.

[0156] In other words, by setting and balancing the difference in holding force between the electronic device 20 on the first pad 121 side and the second pad 122 side, and increasing the area of ​​the first pad 1211 to be larger than the area of ​​the second pad 122, or the area of ​​the second pad 122 to be smaller than the area of ​​the first pad 1211, the difference in holding force between the side with more pads 12 and the side with fewer pads 12 when the electronic device 20 has asymmetrical pin arrangement 21 is connected to its corresponding pad 12 is reduced, thereby improving the connection reliability and working stability between the electronic device 20 and the circuit board 10.

[0157] It should be noted that in the above implementation methods, the electronic device 20 is only used as an example of a five-pin filter to illustrate the possible implementation methods of the first pad 121 and the second pad 122 in the pads 12 on the circuit board 10. It does not mean that the electronic device 20 proposed in this application is limited to a five-pin filter, nor does it mean that the number and arrangement of the first pad 121 and the second pad 122 proposed in this application are limited to this.

[0158] In other implementations of this application, the arrangement of the five pins 21 of the five-pin filter may be different from that in the above embodiment, or the electronic device 20 may be another filter with five pins 21, or the electronic device 20 may have other odd numbers of pins 21, such as three, seven, or other values.

[0159] In other words, this application does not limit the number and arrangement of pins 21 of electronic device 20, and the number and arrangement of pads 12 in circuit board 10 are different for different numbers and arrangements of pins 21 of electronic device 20.

[0160] For example, in one possible implementation, please refer to [the relevant documentation / reference]. Figure 18 and Figure 19 , Figure 18 This is an exploded view of the circuit board 10 from one side in this implementation. Figure 19 for Figure 18 The diagram shows the planar structure of pad area A in the implementation shown. Figure 18 In the implementation shown, the electronic device 20 has 5 pins 21, including 2 first pins 211 and 3 second pins 212. The first pins 211 and the second pins 212 are arranged alternately along the first direction 001, and the two first pins 211 and the three second pins 212 are arranged alternately along the second direction 002. In the second direction 002, one first pin 211 and one second pin 212 are aligned.

[0161] The arrangement of the pads 12 in the pad area A on the circuit board 10 corresponding to the electronic device 20 corresponds to the arrangement of the pins 21.

[0162] Specifically, such as Figure 19 As shown, there are two first sub-palettes 1211 corresponding to the first pin 211, and three second sub-palettes 1221 corresponding to the second pin 212. The first sub-palettes 1211 and the second sub-palettes 1221 are arranged alternately along the first direction 001, and the two first sub-palettes 1211 and the three second sub-palettes 1221 are arranged alternately along the second direction 002. In the second direction 002, one first sub-palette 1211 and one second sub-palette 1221 are flush.

[0163] It should be noted that, Figure 19 The example provided is based solely on the premise that all three second pads 122 are second sub-pads 1221, and does not imply that all three second pads 122 must be second sub-pads 1221. In other implementations of this application, two second pads 122 that are far apart from each other can also be designated as second sub-pads 1221.

[0164] Alternatively, in one possible implementation, please refer to [the relevant documentation / reference]. Figure 19 .like Figure 19 As shown, the spacing between the two first pads 121 is equal to the spacing between the two second pads 122 that are farther apart among the three second pads 122.

[0165] Alternatively, in one possible implementation, please refer to [the relevant documentation / reference]. Figures 20a-20d , Figure 20a This is a schematic diagram of the planar structure of the first pad 121 and the second pad 122 within pad area A in one implementation. Figure 20b This is a schematic diagram of the planar structure of the first pad 121 and the second pad 122 within pad area A in one implementation. Figure 20c This is a schematic diagram of the planar structure of the first pad 121 and the second pad 122 within pad area A in one implementation. Figure 20d This is a schematic diagram of the planar structure of the first pad 121 and the second pad 122 within pad area A in one implementation. Figures 20a-20d In the implementation shown, the number of the first sub-pad 1211 in the first pad 121 and the number of the second sub-pad 1221 in the second pad 122 can be adjusted according to actual needs to meet the preset requirements of the holding force between the pad 12 in the pad area A and its corresponding electronic device 20.

[0166] For example, in one possible implementation, please refer to [the relevant documentation / reference]. Figure 21 and Figure 22 , Figure 21This is an exploded view of the circuit board 10 from one side in this implementation. Figure 22 for Figure 21 The diagram shows the planar structure of pad area A in the implementation shown. Figure 21 In the implementation shown, the electronic device 20 has three pins 21, with one first pin 211 and two second pins 212. The first pins 211 and the second pins 212 are arranged alternately along a first direction 001, and one first pin 211 and two second pins 212 are arranged alternately along a second direction 002. In the second direction 002, one first pin 211 is located between two second pins 212.

[0167] The arrangement of the pads 12 in the pad area A on the circuit board 10 corresponding to the electronic device 20 corresponds to the arrangement of the pins 21.

[0168] Specifically, such as Figure 22 As shown, there is one first sub-pad 1211 corresponding to the first pin 211, and two second pads 122 corresponding to the second pin 212. The first sub-pad 1211 and the second pads 122 are arranged alternately along the first direction 001, and the one first sub-pad 1211 and the two second pads 122 are arranged alternately along the second direction 002. In the second direction 002, the one first pad 121 is located between the two second pads 122.

[0169] Understandably, corresponding to the arrangement of pins 21 in different electronic devices 20, the first pad 121 can be flush with a second pad 122 in the second direction 002, or it can be located between two second pads 122. Both arrangements can reduce the difference in holding force in the first direction 001, thus forming a better bond between the circuit board 10 and the electronic device 20.

[0170] Optionally, please refer to the following as well. Figure 23a and Figure 23b , Figure 23a This is a schematic diagram of the planar structure of the first pad 121 and the second pad 122 within pad area A in one implementation. Figure 23b This is a schematic diagram of the planar structure of the first pad 121 and the second pad 122 within pad area A in one implementation. Figure 23a and Figure 23b In the implementation shown, the number of the first sub-pad 1211 in the first pad 121 and the number of the second sub-pad 1221 in the second pad 122 can be adjusted according to actual needs to meet the preset requirements of the holding force between the pad 12 in the pad area A and its corresponding electronic device 20.

[0171] Alternatively, in one possible implementation, please refer to [the relevant documentation / reference]. Figure 22 .like Figure 22 As shown, in the second direction 002, the first pad 121 is located between the two second pads 122, and the distance between the first pad 121 and the two second pads 122 is equal.

[0172] Understandably, in this implementation, the two second pads 122 are arranged symmetrically with respect to the central axis of the first pad 121, and the first pad 121 is subjected to relatively balanced forces in the second direction 002, which can avoid the formation of differences in holding force in the second direction 002.

[0173] Please also refer to Figure 24 and Figure 25 , Figure 24 This is a structural schematic diagram of the circuit board assembly 100' from one side in a comparative embodiment. Figure 25 for Figure 24 The diagram shows the holding force analysis when pad 12' is connected to its corresponding pin 21 in the implementation shown. Figure 24 As shown, electronic devices 20 are typically soldered onto circuit boards 10' to form circuit board assembly 100'. Specifically, the pins 21 of electronic devices 20 correspond one-to-one with the pads 12' on circuit boards 10', and each pin 21 is fixed and connected to its corresponding pad 12' by soldering.

[0174] For electronic devices 20 of different specifications, the number and position of their pins 21 are also different. For example, for some electronic devices 20 with an odd number of pins 21, it is difficult to arrange the pins 21 symmetrically. When such electronic devices 20 are mounted on the circuit board 10', the asymmetry of soldering stress may lead to uneven adhesion of the electronic devices 20 and frequent solder joint failure.

[0175] Specifically, such as Figure 24 As shown, multiple pads 12' are provided on the substrate 11' of the circuit board 10', each pad 12' corresponding to a pin 21, and the shape and size of each pad 12' are identical. Figure 24 In the implementation shown, each pad 12' is rectangular along the plane of the substrate 11', with an area of ​​5 mm². 2 .

[0176] like Figure 25 As shown, when each rectangular pad 12' is connected to its corresponding pin 21, the maximum holding force between the pad 12' and the pin 21 is 0.9512 MPa.

[0177] However, the number of pins 21 of electronic device 20 is odd, and their arrangement is asymmetrical. Therefore, the arrangement of pads 12' corresponding to the asymmetrically arranged pins 21 is also asymmetrical.

[0178] The pads 12' on the substrate 11' corresponding to the electronic device 20 are arranged asymmetrically. When the electronic device 20 is connected to the circuit board 10', the holding force of the pads 12' on the side with more pads to the pin 21 is greater than that on the side with fewer pads. This leads to uneven adhesion of the electronic device 20 and frequent desoldering failure, which reduces the connection reliability of the electronic device 20 and reduces the working stability of the electronic device 20.

[0179] Please see Figure 26 , Figure 26 This is an analysis diagram of the holding force generated when the first sub-pad 1211 of this application is connected to its corresponding pin 21. The circuit board 10 proposed in this application has a recess 1212 on the first sub-pad 1211 of the first pad 121, wherein the opening 1212a of the recess 1212 faces the direction of the second pad 122. When the recess 1212 is soldered to the pin 21 of its corresponding electronic device 20, it can generate a horizontal tension away from the direction of the second pad 122, thereby increasing the holding force of the circuit board 10 on the side near the first pad 121 for the electronic device 20. This reduces the difference in holding force between the asymmetrically arranged pads 12, and can better prevent the undesirable phenomenon of uneven adhesion of the electronic device 20 and frequent desoldering failure.

[0180] For example, in one possible implementation, such as Figure 26 As shown, the area of ​​the first sub-disk 1211 in the circuit board 10 proposed in this application is 5 mm². 2 When the first sub-disk 1211 is connected to its corresponding pin 21, the maximum holding force between them is 1.05 MPa. Compared to Figure 25 In the comparative embodiment shown, the rectangular structure of the pad 12' increases the holding force of the first sub-pad 1211 with the recess 1212 by 10.39% in the circuit board 10 proposed in this application, with the same area.

[0181] For example, in one possible embodiment, the holding force between the first sub-pad 1211 and its corresponding pin 21 in the circuit board 10 of this application can be increased by increasing the area of ​​the first sub-pad 1211, thereby further improving the connection reliability between the circuit board 10 of this application and the electronic device 20, and improving the working stability of the electronic device 20.

[0182] For details, please refer to Figure 27 , Figure 27This is an analysis diagram of the holding force generated when the first sub-disk 1211 is connected to its corresponding pin 21 in this implementation. Figure 27 The first pad 121 in the implementation shown is... Figure 25 In the implementation shown, the first pad 121 has a consistent shape and size in terms of the recess 1212 along the plane of the substrate 11. The difference between the two is that... Figure 27 The area of ​​the first sub-disk 1211 in the implementation shown is compared to Figure 25 In the illustrated embodiment, the area of ​​the first sub-disk 1211 is reduced to 4.375 mm². 2 .

[0183] like Figure 27 As shown, when the area of ​​the first sub-disk 1211 is reduced to 4.375 mm² 2 When connected to its corresponding pin 21, the maximum holding force generated is 0.8793 MPa, compared to Figure 26 In the implementation shown, the area of ​​the first sub-disk 1211 is reduced to 4.375 mm². 2 hour, Figure 27 In the implementation shown, the holding force generated by the first sub-disk 1211 is reduced by 13.08%. Meanwhile, compared to... Figure 25 Pad 12' in the comparative embodiment shown, Figure 27 The holding force generated by the first sub-disk 1211 in the implementation shown is reduced by 2.69%.

[0184] Meanwhile, the circuit board 10 of this application can also have a protrusion 12211 provided on the second sub-pad 1221 of the second pad 122. The shape of the protrusion 12211 is close to that of the first pad 121. When the protrusion 12211 is soldered to the pin 21 of the corresponding electronic device 20, it can generate a horizontal tension in the direction of the first pad 121, thereby reducing the holding force of the circuit board 10 on the side close to the second pad 122. This also reduces the difference in holding force between the asymmetrically arranged pad 12 structures, and can better prevent the unbalanced adhesion of the electronic device 20 and frequent desoldering failure.

[0185] For example, in one possible implementation, please refer to Figure 28 , Figure 28 This is an analysis diagram of the holding force generated when the second sub-disk 1221 proposed in this application is connected to its corresponding pin 21. (See diagram for reference.) Figure 28 As shown, the area of ​​the second sub-disk 1221 in the circuit board 10 proposed in this application is 5 mm². 2 When the second sub-disk 1221 is connected to its corresponding pin 21, the maximum holding force between them is 0.8977 MPa. Compared to Figure 25In the comparative embodiment shown, the rectangular structure of the pad 12' reduces the holding force of the second sub-pad 1221 with the protrusion 12211 in the circuit board 10 proposed in this application by 5.62% under the same area.

[0186] For example, in one possible embodiment, the holding force between the second sub-pad 1221 and its corresponding pin 21 in the circuit board 10 of this application can be weakened by reducing the area of ​​the second sub-pad 1221, thereby further reducing the difference in holding force between the asymmetrically arranged pad 12 structures.

[0187] For details, please refer to Figure 29 , Figure 29 This is an analysis diagram of the holding force generated when the second sub-disk 1221 is connected to its corresponding pin 21 in this implementation. Figure 29 The second sub-disk 1221 in the implementation shown Figure 28 In the second sub-disk 1221 of the illustrated implementation, the protrusion 12211 has the same shape and size along the plane of the substrate 11. The difference between the two is that... Figure 29 The area of ​​the second sub-disk 1221 in the implementation shown is compared to Figure 28 In the illustrated embodiment, the area of ​​the second sub-disk 1221 is reduced to 4.375 mm². 2 .

[0188] like Figure 29 As shown, when the area of ​​the second sub-disk 1221 is reduced to 4.375 mm² 2 When connected to its corresponding pin 21, the maximum holding force generated is 0.8793 MPa, compared to Figure 28 In the implementation shown, the area of ​​the second sub-disk 1221 is reduced to 4.375 mm². 2 At that time, Figure 29 In the implementation shown, the holding force generated by the second sub-disk 1221 is reduced by 1.94%. Meanwhile, compared to... Figure 25 Pad 12' in the comparative embodiment shown, Figure 29 The holding force generated by the second sub-disk 1221 in the implementation shown is reduced by 7.56%.

[0189] That is, by reducing the area of ​​the second sub-pad 1221, the holding force between the second sub-pad 1221 and its corresponding pin 21 can be further weakened, and the difference in holding force between the asymmetrically arranged pads 12 structures can be relatively reduced.

[0190] The circuit board assembly 100 provided in this application, because it uses the circuit board 10 provided in this application, has a more secure connection with the electronic device 20, which can avoid the undesirable phenomenon of uneven adhesion of the electronic device 20 and frequent desoldering failure.

[0191] In other words, because the circuit board assembly 100 of this application uses the circuit board 10 provided in the above embodiments, the circuit board assembly 100 of this application has all the beneficial effects that the circuit board 10 may have.

[0192] Furthermore, the electronic device 200 provided in this application, because it includes the circuit board assembly 100 provided in this application, also has the effect of more stable internal structure and avoids the desoldering of internal electronic components 20.

[0193] In other words, because the electronic device 200 of this application uses the circuit board assembly 100 provided in the above embodiments, the electronic device 200 of this application has all the beneficial effects that the circuit board assembly 100 may have.

[0194] Of course, the above-described embodiments can be applied individually or in combination. The above description is the preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. A circuit board, characterized in that, It includes a substrate, and a first pad and a second pad supported on the same outer surface of the substrate, wherein the first pad and the second pad are used to mount electronic devices located on the same side of the outer surface; The first pad and the second pad are arranged at intervals along a first direction, and the number of the first pads is less than the number of the second pads. At least two second pads are arranged at intervals along a second direction, which is different from the first direction. The first pad includes a first sub-pad, the first sub-pad having a recessed portion, the bottom end of the recessed portion being located within the first sub-pad, and the opening of the recessed portion facing the second pad along the first direction; and / or, the second pad includes a second sub-pad, the second sub-pad having a protrusion, the protrusion being located near the first pad and extending towards the first pad along the first direction.

2. The circuit board according to claim 1, characterized in that, The recessed portion is axially symmetric, and the axis of symmetry of the recessed portion passes through the geometric center of the first sub-disk along the first direction.

3. The circuit board according to claim 1, characterized in that, The first sub-pad has a first width W1 along the first direction. The first sub-pad also includes a first side away from the second pad. The distance D1 from the bottom of the recess to the first side satisfies the condition: 0.5W1≤D1≤0.75W1.

4. The circuit board according to claim 1, characterized in that, The first sub-disc has a first height H1 along the second direction, and the opening length L1 of the recess satisfies the condition: L1≥0.5H1.

5. The circuit board according to claim 1, characterized in that, In the second direction, the first sub-pad is flush with one of the second pads; or, the first sub-pad is located between two second pads.

6. The circuit board according to claim 5, characterized in that, In the second direction, the first sub-pad is located between the two second pads, and the distance between the first sub-pad and the two second pads is equal.

7. The circuit board according to any one of claims 1-6, characterized in that, The protrusion is axially symmetrical, and the axis of symmetry of the protrusion passes through the geometric center of the second sub-disk along the first direction.

8. The circuit board according to any one of claims 1-6, characterized in that, The second sub-pad also includes a main body portion. In the first direction, the main body portion is located on the side of the protrusion away from the first pad, and the main body portion has a second width W2. The distance D2 from the top of the protrusion portion to the main body portion satisfies the condition: 0.25W2≤D2≤0.5W2.

9. The circuit board according to any one of claims 1-6, characterized in that, In the second direction, the second sub-disc has a second height H2, and the length L2 of the protrusion satisfies the condition: L2≥0.5H2.

10. The circuit board according to any one of claims 1-6, characterized in that, The area of ​​the first sub-pad is greater than or equal to the area of ​​the second pad.

11. The circuit board according to any one of claims 1-6, characterized in that, The second pads are arranged in two rows at intervals along the first direction, and the number of second pads in each row is the same.

12. The circuit board according to claim 11, characterized in that, There are two second pads in each row, and one first pad in each row.

13. The circuit board according to any one of claims 1-6, characterized in that, The number of second pads is three, and the three second pads are arranged at intervals along the second direction. The number of first pads is two, and the two first pads are also arranged at intervals along the second direction.

14. A circuit board assembly, characterized in that, The invention includes electronic devices and a circuit board as described in any one of claims 1-13, wherein the electronic devices are mounted on the circuit board via the first pad and the second pad of the circuit board.

15. An electronic device, characterized in that, It includes a housing and a circuit board assembly as described in claim 14, the circuit board assembly being disposed within the housing.

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