Electro-actuated shape memory alloy skeleton member

Abstract

This application provides an electrically driven shape memory alloy (SMI) skeleton component, comprising a SMI body, an insulating layer, a heating layer, and a heat insulation layer. The SMI body has a high-temperature phase shape and a low-temperature phase shape. The insulating layer, heating layer, and heat insulation layer are sequentially applied to the surface of the SMI body. The heating layer is electrically connected to an external power source and regulates the temperature of the SMI body to change its shape. The electrically driven SMI body skeleton component provided in this application is applicable to various shapes of SMI components and has a wide range of applications.

Description

Technical Field

[0001] This application relates to the field of shape memory alloy technology, and in particular to an electrically driven shape memory alloy skeleton component. Background Technology

[0002] Shape memory alloys (SMAs) are materials composed of two or more metallic elements that exhibit shape memory effects through thermoelastic martensitic phase transformation and its inverse phase transformation. After special training, SMAs can exhibit different, specific shapes at high and low temperatures, possessing advantages such as high power density and low driving voltage, thus being widely used in the drive field.

[0003] In related technologies, when shape memory alloys are applied to the actuation field, the actuation action is usually accomplished by heating the component made of the alloy. Shape memory alloy components can be heated in various ways, such as self-heating, which is achieved by heating the shape memory alloy itself through its resistance. This method requires the shape memory alloy component to have sufficiently high resistance to generate enough heat to complete the shape transformation.

[0004] However, existing electrically driven shape memory alloy components have high requirements for their own shape when heated, and their application range is small. For example, it is difficult to drive complex-shaped skeleton components using existing heating methods. Summary of the Invention

[0005] This application provides a shape memory alloy component to address the limitation of existing electrically driven shape memory alloy skeleton components in terms of the applicability of their heating methods.

[0006] This application provides an electrically driven shape memory alloy skeleton component, which includes a shape memory alloy body, an insulating layer, a heating layer, and a heat insulation layer;

[0007] The shape memory alloy body has a high-temperature phase shape and a low-temperature phase shape. An insulating layer, a heating layer, and a heat insulation layer are sequentially covered on the surface of the shape memory alloy body. The heating layer is used to electrically connect to an external power source and regulates the temperature of the shape memory alloy body to change its shape.

[0008] The shape memory alloy provided in this application provides heat to the shape memory alloy body by setting a heating layer on the surface of the shape memory alloy body, enabling the shape memory alloy to reach the required temperature and thus change shape. Furthermore, the thickness of the heating layer is adjustable to control its resistance, ensuring that the heating layer can generate sufficient heat. It is suitable for shape memory alloy components of various shapes and has a wide range of applications. In addition, an insulating layer and a heat insulation layer are also provided on the surface of the shape memory alloy body. Specifically, the insulating layer, heating layer, and heat insulation layer are sequentially covered on the surface of the shape memory alloy body. The insulating layer is placed between the shape memory alloy body and the heating layer to prevent current from flowing to the shape memory alloy body, ensuring that the current flows to the heating layer with higher resistance to generate sufficient heat. The heating layer is used for electrical connection with an external power source, converting electrical energy into heat energy to regulate the temperature of the shape memory alloy body, enabling the shape memory alloy body to change between a high-temperature phase shape and a low-temperature phase shape. The heat insulation layer covers the outermost layer, which can greatly slow down the rate of heat loss, allowing as much of the heat generated by the heating layer as possible to flow to the shape memory alloy body.

[0009] In one possible implementation, the heating layer is coated on the surface of the insulating layer.

[0010] In one possible implementation, the heating layer is a graphene coating.

[0011] In one possible implementation, a first electrode and a second electrode are also included, and the heating layer is electrically connected to an external power source through the first electrode and the second electrode.

[0012] In one possible implementation, the shape memory alloy body is a truss structure, with an insulating layer wrapped around the outer wall of the shape memory alloy body, and a heating layer and a heat insulation layer stacked sequentially on the outside of the insulating layer.

[0013] Both the first electrode and the second electrode are truss structures, and the first electrode and the second electrode are respectively disposed at both ends of the shape memory alloy body and electrically connected to the heating layer. The two ends of the heat insulation layer extend to the side wall surface covering the first electrode and the second electrode.

[0014] In one possible implementation, the heating layer completely encloses the insulating layer, and the first electrode and the second electrode are respectively attached to the two end faces of the heating layer.

[0015] In one possible implementation, the heating layer wraps around the sidewall of the insulating layer, and both ends of the heating layer extend to cover the sidewalls of the first electrode and the second electrode, respectively, with the first electrode and the second electrode respectively attached to the two end faces of the insulating layer.

[0016] In one possible implementation, the shape memory alloy body is a plate-like structure, with an insulating layer, a heating layer, and a heat insulation layer sequentially covering at least one side of the shape memory alloy body.

[0017] Both the first electrode and the second electrode are sheet-like structures, and both are electrically connected to the heating layer.

[0018] In one possible implementation, both the first electrode and the second electrode are disposed between the insulating layer and the heating layer; or, both the first electrode and the second electrode are disposed between the heating layer and the insulating layer; or, one of the first electrode and the second electrode is disposed between the insulating layer and the heating layer, and the other is disposed between the heating layer and the insulating layer.

[0019] In one possible implementation, the insulating layer is made of a high-temperature resistant, thermally conductive material.

[0020] The structure of this application, as well as its other inventive objectives and beneficial effects, will become more apparent from the description of the preferred embodiments taken in conjunction with the accompanying drawings. Attached Figure Description

[0021] The above and other objects, features, and advantages of embodiments of this application will become more readily understood through the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application will be described by way of example and non-limitation, wherein:

[0022] Figure 1 This is a schematic diagram of a shape memory alloy skeleton component with a lattice structure.

[0023] Figure 2 A schematic diagram of an electrically driven shape memory alloy skeleton component for a truss structure provided in an embodiment of this application;

[0024] Figure 3 for Figure 2 A schematic diagram of an internal structure at point A in the middle;

[0025] Figure 4 for Figure 2 A schematic diagram of another internal structure at point A in the middle;

[0026] Figure 5 A schematic diagram illustrating the shape change of the electrically driven shape memory alloy skeleton component of the truss structure provided in the embodiments of this application;

[0027] Figure 6 A schematic diagram of an electrically driven shape memory alloy skeleton component with a plate-like structure provided in an embodiment of this application;

[0028] Figure 7 A schematic diagram illustrating the shape change of an electrically driven shape memory alloy skeleton component with a plate-like structure provided in an embodiment of this application;

[0029] Figure 8 This is a schematic diagram illustrating the manufacturing process of an electrically driven shape memory alloy skeleton component provided in an embodiment of this application.

[0030] Figure label:

[0031] 100-Electrically driven shape memory alloy skeleton component;

[0032] 110 - Shape memory alloy body; 120 - Insulating layer; 130 - Heating layer; 140 - Heat insulation layer; 150a - First electrode; 150b - Second electrode. Detailed Implementation

[0033] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0034] Shape memory alloys (SMAs) are materials composed of two or more metallic elements that exhibit shape memory effects through thermoelastic martensitic phase transformation and its inverse phase transformation. After special training, SMAs can exhibit different, specific shapes at high and low temperatures, possessing advantages such as high power density and low driving voltage, thus being widely used in the drive field.

[0035] In related technologies, when shape memory alloys are applied to the actuation field, the actuation action is usually accomplished by heating components made of the alloy. There are two main methods for heating shape memory alloy components: self-heating and external heating.

[0036] Self-heating refers to heating through the resistance of the shape memory alloy itself. This method requires the shape memory alloy component to have sufficiently high resistance to generate enough heat so that the shape memory alloy can reach the required temperature, thereby changing its shape and completing the driving action.

[0037] External heating involves changing the temperature of shape memory alloy components through external heating devices or ambient temperature. However, changing the ambient temperature requires a large amount of energy and is not commonly used. External heating devices are usually heating plates, which can be pasted or wrapped around the outside of the shape memory alloy components. However, because shape memory alloy components have a large deformation range, while heating plates are metal sheets with limited deformation range, the heating plates on the shape memory alloy components are prone to peeling or falling off after multiple shape changes. Furthermore, it is difficult for the heating plates to completely cover the complex shapes of shape memory alloy components.

[0038] Figure 1 This is a schematic diagram of a shape memory alloy skeleton component with a lattice structure. Figure 1As shown, the lattice structure is a very important skeleton structure. Besides being lightweight, it also possesses excellent specific stiffness / strength, damping and vibration reduction, buffering and energy absorption, sound absorption and noise reduction, and heat and magnetic insulation properties, making it widely used in aerospace, shipbuilding, automotive, sports, and medical industries. The shape memory alloy skeleton component 01 of the lattice structure can return to its original shape after energy absorption deformation by heating, and is reusable. Although the cross-sectional area of ​​each thin rod in the shape memory alloy skeleton component 01 is small, the cross-sectional area of ​​the entire structure is large, resulting in low electrical resistance, making self-heating impossible. Furthermore, the complex shape of the shape memory alloy skeleton component 01 makes it difficult for the heating element to completely cover the entire structure, hindering heating using existing external heating methods.

[0039] It is evident that existing electrically driven shape memory alloy skeleton components have high requirements for their own shape when heated, and their applicable range is relatively small.

[0040] In view of this, the present application provides an electrically driven shape memory alloy skeleton component. By providing a heating layer on the surface of the shape memory alloy body, heat is provided to the shape memory alloy body, enabling the shape memory alloy to reach the required temperature and thus change shape. Moreover, the thickness of the heating layer can be adjusted to control the resistance of the heating layer, ensuring that the heating layer can generate sufficient heat. It is applicable to shape memory alloy components of various shapes and has a wide range of applications.

[0041] The electrically driven shape memory alloy skeleton component provided in the embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0042] Figure 2 A schematic diagram of an electrically driven shape memory alloy skeleton component for a truss structure provided in an embodiment of this application; Figure 3 for Figure 2 A schematic diagram of an internal structure at point A. (Example) Figure 2 and Figure 3 As shown, this application embodiment provides an electrically driven shape memory alloy skeleton component 100, which includes a shape memory alloy body 110, an insulating layer 120, a heating layer 130, and a heat insulation layer 140.

[0043] The shape memory alloy body 110 possesses both a high-temperature phase shape and a low-temperature phase shape. The shape memory alloy body 110 exhibits deformation recovery capability due to the thermoelastic martensitic phase transformation that occurs within the material during deformation. The shape memory alloy contains two phases: a high-temperature austenitic phase and a low-temperature martensitic phase. The shape memory alloy can remember different shapes in different phases and recover the high-temperature phase shape upon heating and the low-temperature phase shape upon cooling. Therefore, depending on different thermodynamic loading conditions, the shape memory alloy can exhibit two shapes; this is known as the shape memory effect or two-way memory effect.

[0044] like Figure 3 As shown, an insulating layer 120, a heating layer 130, and a heat insulation layer 140 are sequentially covered on the surface of the shape memory alloy body 110. The insulating layer 120 is disposed between the shape memory alloy body and the heating layer 130, which can prevent current from flowing to the shape memory alloy body and ensure that the current flows to the heating layer 130 with higher resistance to generate sufficient heat. The heating layer 130 is used to connect to an external power source to convert electrical energy into heat energy to regulate the temperature of the shape memory alloy body 110, so that the shape memory alloy body can change between a high-temperature phase shape and a low-temperature phase shape. Moreover, the thickness of the heating layer 130 can be adjusted to control the resistance of the heating layer 130, ensuring that the heating layer 130 can generate sufficient heat. It is suitable for shape memory alloy components of various shapes and has a wide range of applications. The heat insulation layer 140 covers the outermost layer, which can greatly slow down the rate of heat loss and allow as much of the heat generated by the heating layer 130 as possible to flow to the shape memory alloy body.

[0045] For example, the heating layer 130 can be a coating layer applied to the surface of the insulation layer 120. The heating layer 130 is attached to the surface of the insulation layer 120 by coating, ensuring a tight bond and preventing it from easily falling off. This avoids localized areas of poor adhesion. Furthermore, compared to pasting or wrapping heating elements, applying a coating layer is more convenient, especially at corners and transitions. Therefore, in this embodiment, using a coating layer for the heating layer 130 can effectively improve the installation efficiency of the external heating device.

[0046] Specifically, the heating layer 130 can be a graphene coating. Graphene can be mechanically dispersed by grinding, ultrasonication, or by dispersing it in a solvent with a surfactant, then a curing agent is added, and finally coated onto the surface of the insulating layer 120 to obtain a graphene coating. In practical applications, the solvent for the graphene coating is mostly a non-metallic material such as water-based resin. After the water evaporates, it usually has good flexibility. Even after the shape memory alloy body 110 undergoes multiple shape changes, the graphene coating is not easy to crack or peel off, resulting in a long service life.

[0047] In other examples, the heating layer 130 may also be other coatings such as a metal ion conductive coating or a metal fiber conductive coating, as long as the coating can convert electrical energy into heat energy.

[0048] To rapidly conduct the heat generated by the heating layer 130 to the shape memory alloy body 110, the insulating layer 120 can be made of a high-temperature resistant thermally conductive material to reduce heat loss and save energy. For example, the insulating layer 120 can be formed by coating or spraying with materials such as silicone rubber insulating coating, ceramic insulating coating, or impregnation varnish; alternatively, the insulating layer 120 can also be made of one or more polymer materials selected from polyurethane, polyimide, and polytetrafluoroethylene.

[0049] When using silicone rubber insulating coating to make insulating layer 120, silicon nitride, aluminum oxide and thermally conductive materials can be mixed, and epoxy modified silicone resin as the matrix is ​​combined with other auxiliary materials to make silicone rubber insulating coating. As the amount of thermally conductive material increases, the thermal conductivity of the coating gradually increases.

[0050] When using impregnating varnish to make insulation layer 120, inorganic powder can be added to modified epoxy resin, followed by dispersant, peroxide initiator, and reactive diluent to prepare the impregnating varnish. After the above materials are mixed evenly, they can be cured at 25-150℃. The components and weight proportions of the impregnating varnish are as follows: 30 parts inorganic powder; 120 parts modified epoxy resin; 80 parts reactive diluent; 1 part dispersant; 2 parts initiator.

[0051] Understandably, to prevent electrical leakage, the insulation layer 140 can be made of insulating and waterproof material to seal and isolate the heating layer 130 within the insulation layer 140, ensuring electrical safety. For example, the insulation layer 140 can be made of silicone resin DC-805, epoxy resin E-51, and low molecular weight polyurethane.

[0052] In addition, the metal shape memory alloy component may also include a first electrode 150a and a second electrode 150b. The heating layer 130 is electrically connected to an external power source through the first electrode 150a and the second electrode 150b. The first electrode 150a can be connected to a positive power source and the second electrode 150b can be connected to a negative power source. Alternatively, the first electrode 150a can also be connected to a negative power source and the second electrode 150b can be connected to a positive power source. Specifically, the first electrode 150a and the second electrode 150b can extend into the heat insulation layer 140 and extend to the external power source to conduct electricity between the heating layer 130 and the external power source, thereby supplying power to the heating layer 130.

[0053] In one specific embodiment, the shape memory alloy body 110 can be a truss structure, with an insulating layer 120 wrapped around the outer wall of the shape memory alloy body 110. The heating layer 130 and the heat insulation layer 140 are sequentially stacked on the outside of the insulating layer 120. Correspondingly, the first electrode 150a and the second electrode 150b can also be truss structures, and the first electrode 150a and the second electrode 150b are respectively disposed at both ends of the shape memory alloy body 110 and electrically connected to the heating layer 130. The two ends of the heat insulation layer 140 extend to cover part of the side wall of the first electrode 150a and the second electrode 150b.

[0054] This configuration ensures the integrity of the truss structure and prevents the first electrode 150a and the second electrode 150b from affecting the movement and deformation of the electrically driven shape memory alloy skeleton component 100. Furthermore, from the first electrode 150a to the second electrode 150b, the lengths of each branch of the electrically driven shape memory alloy skeleton component 100 are almost identical, the resistance of the covered heating layer 130 is almost identical, the heat generation rate is almost identical, and each branch can change from a low-temperature phase shape to a high-temperature phase shape almost simultaneously.

[0055] See again Figure 3 In some examples, the heating layer 130 can completely cover the insulating layer 120, and the first electrode 150a and the second electrode 150b are respectively attached to the two end faces of the heating layer 130 to achieve electrical connection between the first electrode 150a and the second electrode 150b and the heating layer 130.

[0056] In actual manufacturing, the heating layer 130 can be made by impregnating it with graphene coating, which is simple to manufacture and can improve production efficiency. Furthermore, before the moisture in the heating layer 130 has completely evaporated, the first electrode 150a and the second electrode 150b can be respectively attached to both ends of the heating layer 130. After the moisture in the heating layer 130 has completely evaporated, the first electrode 150a and the second electrode 150b can be fixed to both ends of the heating layer 130, ensuring good contact between the first electrode 150a and the second electrode 150b and the heating layer 130, improving the reliability of the electrical connection between the first electrode 150a and the second electrode 150b and the heating layer 130, and facilitating the subsequent installation of the heat insulation layer 140.

[0057] Figure 4 for Figure 2 A schematic diagram of another internal structure at point A. (See diagram below.) Figure 4As shown, in some other examples, the heating layer 130 may wrap around the sidewall of the insulating layer 120, and both ends of the heating layer 130 extend to cover the sidewall of the first electrode 150a and the second electrode 150b. The first electrode 150a and the second electrode 150b are respectively attached to the two end faces of the insulating layer 120 to achieve electrical connection between the first electrode 150a and the second electrode 150b and the heating layer 130.

[0058] For example, the first electrode 150a and the second electrode 150b can be fixed to both sides of the insulating layer 120 by means of adhesive or other methods. The fixing method is simple and reliable, and facilitates the subsequent installation of the heat insulation layer 140. The two ends of the heating layer 130 extend to cover the sidewalls of the first electrode 150a and the second electrode 150b, which can increase the contact area between the first electrode 150a and the second electrode 150b and the heating layer 130, and improve the reliability of the electrical connection between the first electrode 150a and the second electrode 150b and the heating layer 130.

[0059] Figure 5 This is a schematic diagram illustrating the shape change of the electrically driven shape memory alloy skeleton component of the truss structure provided in an embodiment of this application. Figure 5 As shown, shape memory alloys can remember phases at low temperatures. Figure 5 The compressed shape shown above is remembered at high temperature. Figure 5 The elongated shape shown below recovers to the high-temperature phase shape after being heated by electricity and to the low-temperature phase shape after being cooled by electricity, thereby completing the driving action or returning to the original shape after energy absorption deformation.

[0060] In practical applications, Figure 5 The provided electrically driven shape memory alloy skeleton component 100 with a truss structure can be part of medical devices such as coronary artery stents. This electrically driven shape memory alloy skeleton component 100 can move within a blood vessel or other channel in a narrower, high-temperature phase, and be fixed in a segment of the channel in a wider, low-temperature phase. Alternatively, Figure 5 The electrically driven shape memory alloy skeleton component 100 of the provided truss structure may also be part of some drive device or some damping structure.

[0061] Figure 6 This is a schematic diagram of an electrically driven shape memory alloy skeleton component with a plate-like structure provided in an embodiment of this application. Figure 6As shown, in another specific embodiment, the shape memory alloy body 110 can be a plate structure, with the insulating layer 120, the heating layer 130 and the heat insulation layer 140 sequentially covering at least one side of the plate surface of the shape memory alloy body 110. Correspondingly, the first electrode 150a and the second electrode 150b can also be sheet structures, and both the first electrode 150a and the second electrode 150b are electrically connected to the heating layer 130, so that the heating method of the insulating layer 120, the heating layer 130 and the heat insulation layer 140 can be applied to more structures.

[0062] Furthermore, the sheet-like first electrode 150a and second electrode 150b can be bonded together with the plate-like shape memory alloy body 110 surface to surface, improving the reliability of the electrical connection between the first electrode 150a and second electrode 150b and the heating layer 130.

[0063] The first electrode 150a and the second electrode 150b can both be disposed between the insulating layer 120 and the heating layer 130. The first electrode 150a and the second electrode 150b can be fixed to the surface of the insulating layer 120 by means of adhesive or other methods. The fixing method is simple and reliable, which facilitates the subsequent installation of the heat insulation layer 140 and avoids the position of the first electrode 150a and the second electrode 150b shifting when the heat insulation layer 140 is installed.

[0064] Alternatively, the first electrode 150a and the second electrode 150b can both be disposed between the heating layer 130 and the insulating layer 120. During manufacturing, before the moisture in the heating layer 130 has completely evaporated, the first electrode 150a and the second electrode 150b can be attached to the surface of the heating layer 130. After the moisture in the heating layer 130 has completely evaporated, the first electrode 150a and the second electrode 150b can be fixed, ensuring good contact between the first electrode 150a and the second electrode 150b and the heating layer 130, improving the reliability of the electrical connection between the first electrode 150a and the second electrode 150b and the heating layer 130, and facilitating the subsequent installation of the heat insulation layer 140.

[0065] Alternatively, one of the first electrode 150a and the second electrode 150b may be disposed between the insulating layer 120 and the heating layer 130, and the other may be disposed between the heating layer 130 and the insulating layer 120. That is, the first electrode 150a and the second electrode 150b may be disposed between different coating layers. As long as the first electrode 150a and the second electrode 150b can contact the heating layer 130, this embodiment does not impose any restrictions.

[0066] For example, when the shape memory alloy body 110 can be a thin plate structure, the insulating layer 120, the heating layer 130 and the heat insulation layer 140 can be sequentially covered on one side of the shape memory alloy body 110 to save materials; when the shape memory alloy body 110 can be a thick plate structure, the insulating layer 120, the heating layer 130 and the heat insulation layer 140 can be sequentially covered on both sides of the shape memory alloy body 110 to improve heating efficiency and accelerate the shape transformation of the electrically driven shape memory alloy skeleton component 100.

[0067] Figure 7 This is a schematic diagram illustrating the shape change of an electrically driven shape memory alloy skeleton component with a plate-like structure, as provided in an embodiment of this application. Figure 7 As shown, shape memory alloys can remember phases at low temperatures. Figure 7 The curved shape shown above is remembered at high temperatures. Figure 7 The flat plate shape shown below recovers to the high-temperature phase shape after being heated by electricity and to the low-temperature phase shape after being cooled by power-off, thus completing the driving action or returning to the original shape after energy absorption deformation.

[0068] In practical applications, Figure 7 The provided plate-shaped electrically driven shape memory alloy skeleton component 100 can be part of some driving device or part of some damping structure.

[0069] It should be noted that the truss structure and plate structure of the electrically driven shape memory alloy skeleton component 100 given in this embodiment are only for illustrative purposes and do not represent that the electrically driven shape memory alloy skeleton component 100 must be the shape shown in the figure or have a variation of the shape shown in the figure. In practical applications, the insulating layer 120, heating layer 130 and heat insulation layer 140 provided in this embodiment can also be disposed on the surface of other structures or simple or complex shape memory alloy bodies 110. For example, the insulating layer 120, heating layer 130 and heat insulation layer 140 can also be disposed on the surface of the lattice structure shape memory alloy body 110.

[0070] Figure 8 This is a schematic diagram illustrating the manufacturing process of the electrically driven shape memory alloy skeleton component provided in an embodiment of this application. Figure 8 As shown, this embodiment provides a method for manufacturing an electrically driven shape memory alloy skeleton component 100, used to manufacture the aforementioned electrically driven shape memory alloy skeleton component 100. The specific process of this manufacturing method is as follows:

[0071] First, the shape memory alloy body 110 is trained to have a two-way memory effect, so that it has a two-way memory effect.

[0072] Then, the surface of the shape memory alloy body 110 is pretreated by grinding, polishing or cleaning to ensure that the surface of the shape memory alloy body 110 is smooth and free of adhering substances.

[0073] Next, an insulating layer 120 is applied. Specifically, a silicone rubber insulating coating can be sprayed onto the pretreated shape memory alloy body 110, and the insulating layer 120 is allowed to cure and solidify.

[0074] After the insulating layer 120 is formed, the heating layer 130 is then set, along with the first electrode 150a and the second electrode 150b. Specifically, the first electrode 150a and the second electrode 150b can be adhered to the surface of the insulating layer 120. Thickener, dispersant, defoamer, and pH adjuster are pre-stirred, mixed, and dissolved evenly. Graphene is then added, and the mixture is vibrated and ground using a vibrating mixer to obtain a graphene coating. This coating is then evenly applied to the insulating layer 120 and part of the surface of the first electrode 150a and the second electrode 150b, and the heating layer 130 is allowed to cure and form.

[0075] Alternatively, graphene coating can be first applied to the surface of the insulating layer 120, and then the first electrode 150a and the second electrode 150b can be placed on the surface of the heating layer 130 to make full contact with it, and the heating layer 130 can be allowed to solidify and form.

[0076] After the heating layer 130 is formed, the heat insulation layer 140 is then set. Specifically, silicone resin DC-805 and epoxy resin E-51 can be polymerized in a 4:6 ratio, and then cured with 50% by mass of low molecular weight polyurethane to obtain an insulating and heat-insulating coating. The coating is then applied to the surface of the heating layer 130 and cured to obtain the heat insulation layer 140, thus completing the manufacturing of the electrically driven shape memory alloy skeleton component 100.

[0077] Finally, functional testing is required. The graphene coating is energized and heated uniformly through the first electrode 150a and the second electrode 150b, inducing the electric-driven shape memory alloy skeleton component 100 to exhibit a high-temperature phase shape, thus completing the heating-driven action; after power is turned off, it cools naturally, inducing the electric-driven shape memory alloy skeleton component 100 to exhibit a low-temperature phase shape, thus completing the cooling-driven action.

[0078] In the description of this application, it should be understood that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0079] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electrically driven shape memory alloy skeleton component, characterized in that, It includes a shape memory alloy body, an insulating layer, a heating layer, a heat insulation layer, a first electrode, and a second electrode; wherein, the insulating layer is coated on the surface of the shape memory alloy body, the heating layer is wetted and coated on the surface of the insulating layer, and the heat insulation layer is coated on the surface of the heating layer; The shape memory alloy body has a high-temperature phase shape and a low-temperature phase shape. The insulating layer, the heating layer and the heat insulation layer are sequentially covered on the surface of the shape memory alloy body. The heating layer is electrically connected to an external power supply through the first electrode and the second electrode. The heating layer adjusts the temperature of the shape memory alloy body to change the shape of the shape memory alloy body. The shape memory alloy body has a truss structure, the insulating layer is wrapped around the outer wall of the shape memory alloy body, and the heating layer and the heat insulation layer are stacked sequentially on the outside of the insulating layer; Both the first electrode and the second electrode are truss structures, and the first electrode and the second electrode are respectively disposed at both ends of the shape memory alloy body and electrically connected to the heating layer. Both ends of the heat insulation layer extend to cover part of the side wall surface of the first electrode and the second electrode. The heating layer completely encloses the insulating layer, and the first electrode and the second electrode are respectively attached to the two end faces of the heating layer; or... The heating layer wraps around the sidewall of the insulating layer, and both ends of the heating layer extend to cover the sidewalls of the first electrode and the second electrode. The first electrode and the second electrode are respectively attached to the two end faces of the insulating layer.

2. The electrically driven shape memory alloy skeleton component according to claim 1, characterized in that, The heating layer is a graphene coating.

3. The electrically driven shape memory alloy skeleton component according to any one of claims 1-2, characterized in that, The insulating layer is made of a high-temperature resistant and thermally conductive material.

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