An electronic paper film, a preparation method thereof and an application

Abstract

The present invention provides an electronic paper film, a preparation method thereof and an application. The electronic paper film comprises an aluminum film, a colloid layer, a sealing layer, a capsule layer, a conductive layer and a substrate layer which are sequentially stacked; the capsule layer comprises a capsule frame and electronic ink disposed in the capsule frame. Through the design of the structure of the electronic paper film and by means of a specific preparation method, the present invention prepares an electronic paper film having a relatively high water resistance rate, a relatively low resistance value and a relatively high compressive capacity, which is suitable for preparing an electronic paper film group.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic paper ink screens, and particularly relates to an electronic paper film, a preparation method thereof, and an application thereof. Background Art

[0002] Electronic ink is a new type of display material that can change its own color when powered on, and generally consists of many transparent microcapsules encapsulating electrophoretic liquid. The electrophoretic liquid encapsulated in the microcapsules usually consists of white or black electrophoretic particles, an electrophoretic solvent, and a charge control agent. By controlling the electrophoretic movement of the white or black electrophoretic particles, the color on the surface of the microcapsules can be changed. A large number of electronic ink microcapsules are arranged orderly between the upper and lower electrode substrates of the screen, and the display of characters or images can be realized under the drive of an alternating voltage. Compared with traditional display technologies, electronic ink technology has the advantages of being bendable, low power consumption, shock-resistant, and not easy to cause fatigue during reading, and has become one of the display technologies with great development potential in the future. Due to the above advantages, currently, electronic paper display devices are widely used in the fields of e-readers and wireless electronic tags, and consumers require thin, light, well-displayed, and sensitive and stable touch-functional electronic paper display devices. Currently, best-selling e-readers at home and abroad, such as the Bambook series of Shanda Company and the Kindle series of Amazon Company, etc., all use electronic ink screens produced by E-Ink Company of the United States. However, it is not clear how the electronic paper is prepared. Therefore, how to prepare an electronic paper film with excellent performance has become a research hotspot.

[0003] CN206311871U discloses an electronic paper display device. The electronic paper display device of the present invention relates to an electronic paper display device, including: a substrate having a first surface and a second surface disposed opposite to each other, and a thin-film transistor circuit layer is disposed on the first surface; a touch control circuit layer formed on the second surface; an electronic paper film, the electronic paper film including: a transparent encapsulation protection film layer and an encapsulation protection film layer disposed opposite to each other, the transparent encapsulation protection film layer is disposed on the thin-film transistor circuit layer; an electrode layer disposed on one side of the encapsulation protection film layer close to the transparent encapsulation protection film layer; and an electronic ink layer disposed between the transparent encapsulation protection film layer and the electrode layer. This technical solution does not disclose the preparation method of the electronic paper film.

[0004] CN113741113A discloses a pressure-bearing electronic paper film and its manufacturing process. The manufacturing process of the pressure-bearing electronic paper film includes the following steps: adding support particles with a particle size of 1 to 100 micrometers into electronic ink microcapsules and mixing evenly to obtain a coating solution, coating the coating solution on the surface of electrode substrate 1, and then covering electrode substrate 2 on the coating solution. Electrode substrate 1 and electrode substrate 2 encapsulate the coating solution between the two electrode substrates, and the pressure-bearing electronic paper film can be obtained. In this technical solution, by adding support particles into the electronic ink microcapsules to play a supporting role, the ability of the electronic paper film to resist external pressure can be enhanced, its ability to bend and deform can be improved, the stress caused by thermal expansion and contraction of the electronic paper film can be reduced, and its comprehensive mechanical properties can be improved. However, the prepared electronic paper film has poor water resistance.

[0005] CN213934491U discloses an electronic paper film unit, an electronic paper encapsulation structure and an electronic device. The electronic paper film unit includes: an ink layer, an ITO electrode layer arranged on the ink layer, and a PET barrier film layer arranged on the ITO electrode layer; a waterproof film is provided at least around the ink layer. The pressure resistance of the electronic paper film unit provided by this technical solution is poor.

[0006] As the most important component of the electronic paper display film group, the electronic paper film material has very high requirements for the production process, mainly for the consistency and timeliness of the process; since the electronic paper film is very sensitive to water vapor and the environment, if there are differences in the process or the production rhythm is different, the display colors of the products produced will be different, and the debugging waveform pressure will be very high. Therefore, the electronic paper film is required to have good water resistance.

[0007] In summary, how to provide a simple and convenient preparation method for preparing an electronic paper film with a high water resistance rate, a low resistance value and a high pressure resistance has become a technical problem to be solved urgently at present. Summary of the Invention

[0008] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide an electronic paper film, its preparation method and application. In the present invention, through the design of the electronic paper film structure and further through a specific preparation method, an electronic paper film with a high water resistance rate, a low resistance value and a high pressure resistance is prepared, which is suitable for preparing an electronic paper film group.

[0009] To achieve this purpose, the present invention adopts the following technical solutions:

[0010] In the first aspect, the present invention provides an electronic paper film, which includes an aluminum film, a colloid layer, a sealing layer, a capsule layer, a conductive layer and a substrate layer stacked in sequence;

[0011] The capsule layer includes a capsule frame and electronic ink arranged in the capsule frame.

[0012] In the present invention, through the design of the electronic paper film structure and further through the design of the sealing layer, the electronic paper film has good water resistance, low resistance, and high compressive strength.

[0013] The following are the preferred technical solutions of the present invention, but do not limit the technical solutions provided by the present invention. Through the following preferred technical solutions, the objectives and beneficial effects of the present invention can be better achieved.

[0014] In the present invention, there is no special limitation on the material of the colloid layer, as long as it can form a transparent colloid layer (the transparency of the colloid layer ≥ 92%). Commonly used adhesives in the art are applicable to prepare the colloid layer, and double-sided tape can also be used to prepare the colloid layer. Exemplary ones include, but are not limited to, transparent adhesives or transparent double-sided tapes. At the same time, there is no special limitation on the thickness of the colloid layer in the present invention, as long as it can satisfy the lamination of the aluminum film and the sealing layer.

[0015] As a preferred technical solution of the present invention, the sealing layer includes a silicon oxide layer and a silicon nitride layer that are laminated together;

[0016] The silicon oxide layer is laminated on the side of the colloid layer away from the aluminum film, and the silicon nitride layer is laminated on the side of the capsule layer away from the conductive layer.

[0017] In the present invention, through the design of the sealing layer structure, the electronic paper film can have a high water resistance rate and good compressive strength. Silicon oxide has a high water resistance rate, and silicon nitride has good compressive strength. By using the two together, the water resistance rate and compressive strength of the electronic paper film can be further improved.

[0018] As a preferred technical solution of the present invention, the thicknesses of the silicon oxide layer and the silicon nitride layer are each independently selected from 0.5 to 5 μm, for example, they can be 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, or 5 μm, etc.

[0019] Preferably, the thickness of the sealing layer is 1 to 10 μm, for example, it can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm, etc.

[0020] In the present invention, by controlling the thickness of the sealing layer within a specific range, the prepared electronic paper film not only has good water resistance and compressive strength but also has the characteristics of being thin and light. If its thickness is small, the water resistance and compressive strength of the prepared electronic paper film are poor; if its thickness is too large, the thickness of the prepared electronic paper film is large, which is not conducive to its subsequent use.

[0021] As a preferred technical solution of the present invention, the material of the capsule layer includes positive photoresist.

[0022] As a preferred technical solution of the present invention, the material of the conductive layer is selected from any one of ITO or transparent alloy.

[0023] Preferably, the ITO is selected from conventional ITO or high-temperature ITO.

[0024] Preferably, the resistance of the transparent alloy is 5-200 Ω, for example, it can be 5 Ω, 10 Ω, 20 Ω, 40 Ω, 60 Ω, 80 Ω, 100 Ω, 120 Ω, 140 Ω, 160 Ω, 180 Ω or 200 Ω, etc.

[0025] Preferably, the transparent alloy includes magnesium-silver alloy.

[0026] It should be noted that in the present invention, there is no special limitation on the mass ratio of metallic magnesium and metallic silver in the magnesium-aluminum alloy, as long as the transmittance of the magnesium-aluminum alloy is ≥ 50%.

[0027] It should be noted that in the present invention, according to the actual application of the electronic paper film, different materials of the conductive layer can be selected to prepare the conductive layer. For example, if the electronic paper film is used in a higher temperature situation, high-temperature ITO can be selected to prepare the conductive layer; if the electronic paper film needs to have low-resistance characteristics, a transparent alloy can be selected to prepare the conductive layer.

[0028] Preferably, the thickness of the conductive layer is 0.1-30 nm, for example, it can be 0.1 nm, 0.5 nm, 1 nm, 2 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm or 30 nm, etc.

[0029] As a preferred technical solution of the present invention, an OCA layer and a protective film are sequentially arranged on the side of the substrate layer away from the conductive layer.

[0030] Preferably, the material of the OCA layer includes OCA optical adhesive.

[0031] Preferably, the protective film is selected from PET film.

[0032] It should be noted that in the present invention, there is no special limitation on the specific selection and thickness of the substrate layer material, and the substrate layer materials commonly used in the art are all applicable.

[0033] At the same time, it should be noted that in the present invention, there is no special limitation on the thickness of the OCA layer, as long as it can bond the substrate layer and the protective film.

[0034] In the second aspect, the present invention provides a method for preparing an electronic paper film as described in the first aspect, and the preparation method includes the following steps:

[0035] (1) Evaporate the conductive layer material on either side of the substrate layer to obtain a substrate layer and a conductive layer that are bonded together;

[0036] (2) Coat a positive photoresist on the side of the conductive layer away from the substrate layer, and perform photolithography using an exposure machine through the photolithography forming method to obtain a capsule frame;

[0037] Set the electronic ink in the capsule frame by inkjet printing to obtain a capsule layer;

[0038] (3) Set a sealing layer on the side of the capsule layer away from the conductive layer by means of thin-film encapsulation for sealing;

[0039] (4) Set a colloid layer on the side of the sealing layer away from the capsule layer, and then place an aluminum film on the side of the colloid layer away from the sealing layer for lamination to obtain the electronic paper film.

[0040] In the present invention, an electronic paper film is prepared through a specific preparation method. The preparation method is simple and convenient; moreover, the prepared electronic paper film has a low cost and a high product yield, and is suitable for industrial production.

[0041] As a preferred technical solution of the present invention, the evaporation rate in step (1) is For example, it can be or etc.

[0042] Preferably, the accuracy of the exposure machine in step (2) is ≥1 μm.

[0043] Preferably, the resolution of the exposure machine for the positive photoresist in step (2) is ≤1 μm.

[0044] In the present invention, a CVD device can be used to prepare the sealing layer by means of thin-film encapsulation.

[0045] As a preferred technical solution of the present invention, a post-treatment step is further included after the lamination in step (4).

[0046] Preferably, the post-treatment method is: coat an OCA optical adhesive on the side of the substrate layer away from the conductive layer, and then place a protective film on the side of the OCA optical adhesive away from the substrate layer for lamination.

[0047] In the present invention, the preparation method of the electronic paper film includes the following steps:

[0048] (1) Evaporate the conductive layer material on either side of the substrate layer to obtain a substrate layer and a conductive layer that are bonded together;

[0049] (2) Coating a positive photoresist on the side of the conductive layer away from the substrate layer, and performing photolithography using an exposure machine through the photolithography forming method to obtain a capsule frame; wherein, the accuracy of the exposure machine is ≥ 1 μm, and the resolution of the exposure machine for the positive photoresist is ≤ 1 μm;

[0050] By inkjet printing, electronic ink is set in the capsule frame to obtain a capsule layer;

[0051] (3) Through the method of thin-film encapsulation, a sealing layer material is sealed on the side of the capsule layer away from the conductive layer to obtain a sealing layer;

[0052] (4) A colloidal layer is set on the side of the sealing layer away from the capsule layer, and then an aluminum film is placed on the side of the colloidal layer away from the sealing layer for lamination;

[0053] OCA optical glue is coated on the side of the substrate layer away from the conductive layer, and then a protective film is placed on the side of the OCA optical glue away from the substrate layer for lamination to obtain the electronic paper film.

[0054] In a third aspect, the present invention provides an application of the electronic paper film as described in the first aspect in an electronic paper film group.

[0055] Compared with the prior art, the present invention has the following beneficial effects:

[0056] In the present invention, through the design of the structure and materials of the electronic paper film, and further through a specific preparation method, an electronic paper film with a high water resistance rate, a low resistance value, and a high compressive capacity is prepared, which is suitable for preparing an electronic paper film group, and its water resistance rate is ≤ 8×10 -3 g / m 2 / day, specifically 2×10 -5 ~8×10 -3 g / m 2 / day, and the resistance value is 8 - 12 Ω. At the same time, the preparation method provided by the present invention is simple and convenient, and the product yield is relatively high, which is suitable for the industrial production and preparation of electronic paper films. Description of the Drawings

[0057] Figure 1 is a schematic structural diagram of the electronic paper film provided by the present invention;

[0058] Among them, 1 - aluminum film, 2 - colloidal layer, 3 - sealing layer, 4 - capsule layer, 5 - conductive layer, 6 - substrate layer, 7 - OCA layer, 8 - protective film, 31 - silicon oxide layer, 32 - silicon nitride layer, 41 - capsule frame, 42 - electronic ink. Detailed Embodiments

[0059] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings and through specific embodiments. Those skilled in the art should understand that the embodiments are only for helping to understand the present invention and should not be regarded as specific limitations on the present invention.

[0060] The sources of some components in the following examples and comparative examples are as described below:

[0061] Aluminum film: 3M of the United States, thickness 125 μm;

[0062] Double-sided adhesive: 3M of the United States;

[0063] Positive photoresist: Shin-Etsu Chemical;

[0064] PET film: 3M of the United States, thickness 50 μm;

[0065] OCA optical adhesive: 3M of the United States;

[0066] Hot melt adhesive: 3M of the United States.

[0067] Example 1

[0068] This example provides an electronic paper film and a preparation method thereof. The structural schematic diagram of the electronic paper film is as Figure 1 shown, which includes an aluminum film 1, a colloid layer 2, a sealing layer 3, a capsule layer 4, a conductive layer 5, a substrate layer 6, an OCA layer 7, and a protective film 8 stacked in sequence;

[0069] Among them, the colloid layer 2 is prepared from a double-sided adhesive, and the thickness is 10 μm;

[0070] The sealing layer 3 includes a silicon oxide layer 31 and a silicon nitride layer 32, and the thickness of both is 2 μm;

[0071] The capsule layer 4 includes a capsule frame 41 and electronic ink 42 disposed in the capsule frame 41. The capsule layer 4 is prepared from a positive photoresist;

[0072] The conductive layer 5 is prepared from a magnesium-silver alloy;

[0073] Both the substrate layer 6 and the protective film 8 are PET film layers, and the thickness is 50 μm;

[0074] The OCA layer 7 is prepared from OCA optical adhesive, and the thickness is 25 μm.

[0075] The preparation method of the above-mentioned electronic paper film is as follows:

[0076] (1) Evaporate a magnesium-silver alloy on any one side of the substrate layer 6 to obtain a substrate layer 6 and a conductive layer 5 that are adhered to each other;

[0077] (2) A positive photoresist is coated on the side of the conductive layer 5 away from the substrate layer 6. Through the photolithography forming method, photolithography is performed using an exposure machine to obtain the capsule frame 41. Among them, the accuracy of the exposure machine is ≥ 1 μm, and the resolution of the exposure machine for the positive photoresist is ≤ 1 μm;

[0078] Through inkjet printing, the electronic ink 42 is set in the capsule frame 41 to obtain the capsule layer 4;

[0079] (3) Through the method of thin-film encapsulation, a silicon nitride 32 layer and a silicon oxide layer 31 are sequentially set on the side of the capsule layer 4 away from the conductive layer, and sealed to obtain the sealing layer 3;

[0080] (4) A double-sided adhesive is set on the side of the sealing layer 3 away from the capsule layer 4, and then the aluminum film 1 is placed on the side of the double-sided adhesive away from the sealing layer 3 for lamination;

[0081] An OCA optical adhesive is coated on the side of the substrate layer 6 away from the conductive layer 5, and then the protective film 8 is placed on the side of the OCA optical adhesive away from the substrate layer 6 for lamination to obtain the electronic paper film.

[0082] Example 2

[0083] This example provides an electronic paper film and a preparation method thereof. The structural schematic diagram of the electronic paper film is as Figure 1 shown. The difference from Example 1 is that the thicknesses of the silicon oxide layer 31 and the silicon nitride layer 32 are 0.5 μm respectively, and other conditions are the same as those in Example 1.

[0084] Example 3

[0085] This example provides an electronic paper film and a preparation method thereof. The structural schematic diagram of the electronic paper film is as Figure 1 shown. The difference from Example 1 is that the thicknesses of the silicon oxide layer 31 and the silicon nitride layer 32 are 5 μm respectively; other conditions are the same as those in Example 1.

[0086] Example 4

[0087] This example provides an electronic paper film and a preparation method thereof. The structural schematic diagram of the electronic paper film is as Figure 1 shown. The difference from Example 1 is that the thicknesses of the silicon oxide layer 31 and the silicon nitride layer 32 are 0.2 μm respectively; other conditions are the same as those in Example 1.

[0088] Example 5

[0089] This example provides an electronic paper film and a preparation method thereof. The structural schematic diagram of the electronic paper film is as Figure 1 shown. The difference from Example 1 is only that the thicknesses of the silicon oxide layer 31 and the silicon nitride layer 32 are 7 μm respectively; other conditions are the same as those in Example 1.

[0090] Comparative Example 1

[0091] This comparative example provides an electronic paper film and its preparation method, which includes an aluminum film, a hot melt adhesive layer, a capsule layer, a conductive layer, a substrate layer, an OCA layer, and a protective film that are sequentially stacked and arranged;

[0092] Among them, the capsule layer includes a capsule frame and electronic ink disposed within the capsule frame;

[0093] The thickness of the hot melt adhesive layer is 10 μm;

[0094] The materials and thicknesses of each layer in the aluminum film, capsule layer, conductive layer, substrate layer, OCA layer, and protective film are the same as those in Example 1.

[0095] The preparation method of the above-mentioned electronic paper film is as follows:

[0096] (1) Evaporate a magnesium-silver alloy on any one side of the substrate layer to obtain a substrate layer and a conductive layer that are bonded together;

[0097] (2) Coat a positive photoresist on the side of the conductive layer away from the substrate layer, and use a lithography machine to perform lithography through the lithography forming method to obtain a capsule frame; among them, the accuracy of the lithography machine is ≥1 μm, and the resolution of the lithography machine for the positive photoresist is ≤1 μm;

[0098] Set electronic ink within the capsule frame through inkjet printing to obtain a capsule layer;

[0099] (3) Coat a hot melt adhesive on the side of the capsule layer away from the conductive layer, and then place the aluminum film on the side of the hot melt adhesive away from the capsule layer for lamination;

[0100] Coat an OCA optical adhesive on the side of the substrate layer away from the conductive layer, and then place the protective film on the side of the OCA optical adhesive away from the substrate layer for lamination to obtain the electronic paper film.

[0101] Comparative Example 2

[0102] This comparative example provides an electronic paper film purchased from E-Ink Corporation in the United States.

[0103] The performance of the electronic paper films provided in the above examples and comparative examples was tested, and the test method is as follows:

[0104] Water resistance: Tested using a Mocon instrument under the conditions of 40 °C / 90% RH;

[0105] Resistance value: Tested using a four-probe resistivity / sheet resistance tester.

[0106] The performance test results of the electronic paper films provided in the above examples and comparative examples are shown in Table 1 below:

[0107] Table 1

[0108]

[0109]

[0110] As can be seen from the content of Table 1, in the present invention, through the design of the electronic paper film structure and materials, and further through a specific preparation method, an electronic paper film with a high water resistance rate and a low resistance value is prepared, which is suitable for preparing an electronic paper film group, and its water resistance rate ≤ 8×10 -3 g / m 2 / day, and the resistance value is 8 - 12 Ω.

[0111] Compared with Example 1, if the thickness of the sealing layer is too small (Example 4), the water resistance and compressive capacity of the prepared electronic paper film are poor; if the thickness of the sealing layer is too large (Example 5), the production cost of the electronic paper film will be increased, which is not conducive to industrial production, and the thickness of the prepared electronic paper film is too large, which may affect the subsequent use of the electronic paper film.

[0112] Compared with Example 1, if no sealing layer is provided in the electronic paper film (Comparative Example 1), the water resistance and compressive capacity of the prepared electronic paper film are poor.

[0113] Through the comparison of the relevant data of Example 1 and Comparative Example 2, it can be seen that in the present invention, through the design of the electronic paper film structure and materials, and through a specific preparation method, an electronic paper film with excellent performance is prepared, and the preparation method provided by the present invention is simple and convenient, and the product yield is high, which is suitable for industrial production preparation.

[0114] In summary, in the present invention, through the design of the electronic paper film structure and materials, and further through a specific preparation method, an electronic paper film with a high water resistance rate and a low resistance value is prepared, and the preparation method provided by the present invention is simple and convenient, and the product yield is high, which is suitable for the industrial production preparation of electronic paper films.

[0115] The applicant declares that the present invention uses the above embodiments to illustrate the detailed process flow of the present invention, but the present invention is not limited to the above detailed process flow, that is, it does not mean that the present invention must rely on the above detailed process flow to be implemented. Those skilled in the art should understand that any improvement of the present invention, the equivalent replacement of each raw material of the product of the present invention, the addition of auxiliary components, and the selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. An electronic paper film, characterized in that, The electronic paper film includes an aluminum film, a colloid layer, a sealing layer, a capsule layer, a conductive layer, and a substrate layer which are sequentially stacked and arranged; The electronic paper film is prepared by the following method, and the method includes the following steps: (1) Evaporate and deposit a conductive layer material on any one side of the substrate layer to obtain a substrate layer and a conductive layer that are adhered to each other; (2) Coat a positive photoresist on the side of the conductive layer away from the substrate layer, and through a photolithography forming method, use an exposure machine to perform photolithography to obtain a capsule frame; Set electronic ink in the capsule frame by inkjet printing to obtain a capsule layer; The capsule layer includes a capsule frame and electronic ink disposed in the capsule frame; The material of the capsule layer includes positive photoresist; (3) By means of thin film encapsulation, set a sealing layer on the side of the capsule layer away from the conductive layer and perform sealing; (4) Set a colloid layer on the side of the sealing layer away from the capsule layer, and then place the aluminum film on the side of the colloid layer away from the sealing layer and perform lamination to obtain the electronic paper film; The sealing layer includes a silicon oxide layer and a silicon nitride layer that are adhered to each other; The silicon oxide layer is adhered to the side of the colloid layer away from the aluminum film, and the silicon nitride layer is adhered to the side of the capsule layer away from the conductive layer.

2. The electronic paper film according to claim 1, characterized in that, The thicknesses of the silicon oxide layer and the silicon nitride layer are each independently selected from 0.5 to 5 μm.

3. The electronic paper film according to claim 1, wherein The thickness of the sealing layer is 1 to 10 μm.

4. The electronic paper film according to claim 1, wherein The material of the conductive layer is selected from any one of ITO or a transparent alloy.

5. The electronic paper film according to claim 4, characterized in that, The resistance of the transparent alloy is 5 to 200 Ω.

6. The electronic paper film according to claim 4, characterized in that, The transparent alloy includes a magnesium-silver alloy.

7. The electronic paper film according to claim 1, wherein The thickness of the conductive layer is 0.1 to 30 nm.

8. The electronic paper film according to claim 1, characterized in that, An OCA layer and a protective film are sequentially provided on the side of the substrate layer away from the conductive layer.

9. The electronic paper film according to claim 8, wherein, The material of the OCA layer includes OCA optical adhesive.

10. The electronic paper film according to claim 8, characterized in that, The protective film is selected from a PET film.

11. A method for preparing an electronic paper film according to any one of claims 1-10, characterized in that, The preparation method includes the following steps: (1) Evaporate and deposit a conductive layer material on any one side of the substrate layer to obtain a substrate layer and a conductive layer that are adhered to each other; (2) Coat a positive photoresist on the side of the conductive layer away from the substrate layer, and through a photolithography forming method, use an exposure machine to perform photolithography to obtain a capsule frame; Set electronic ink in the capsule frame by inkjet printing to obtain a capsule layer; (3) By means of thin film encapsulation, set a sealing layer on the side of the capsule layer away from the conductive layer and perform sealing; (4) Set a colloid layer on the side of the sealing layer away from the capsule layer, and then place the aluminum film on the side of the colloid layer away from the sealing layer and perform lamination to obtain the electronic paper film.

12. The preparation method according to claim 11, characterized in that, The evaporation rate described in step (1) is 13. The preparation method according to claim 11, wherein, The accuracy of the exposure machine in step (2) is ≥1 μm.

14. The preparation method according to claim 11, wherein, The resolution of the exposure machine for the positive photoresist in step (2) is ≤1 μm.

15. The preparation method according to claim 11, characterized in that, After the lamination in step (4), a post-treatment step is further included.

16. The preparation method according to claim 15, characterized in that, The method of the post-treatment is: coat OCA optical adhesive on the side of the substrate layer away from the conductive layer, and then place the protective film on the side of the OCA optical adhesive away from the substrate layer and perform lamination.

17. Application of an electronic paper film according to any one of claims 1-10 in an electronic paper film group.

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