A method for preparing a semiconductor

Abstract

The present invention relates to the field of semiconductor production, and more specifically to a method for preparing a semiconductor. The method includes the following steps: Step 1: Extract silicon from sand and purify the silicon into polysilicon; Step 2: Process the polysilicon into a single crystal silicon rod; Step 3: Use a diamond tool to process the single crystal silicon rod into a silicon wafer; Step 4: First, polish the silicon wafers against each other, then etch the silicon wafers and perform polishing to complete the preparation of the semiconductor. The method for preparing the semiconductor is processed using a semiconductor preparation device. The device includes two fixing rings corresponding to the axes for restricting the silicon wafers after cutting. On the fixing rings, a plurality of clamping plates for clamping the silicon wafers are rotated through a plurality of columns fixedly connected to themselves. On the fixing rings, spring plates for pushing the corresponding clamping plates to clamp the silicon wafers are fixedly connected. It can achieve smooth mutual polishing by the relative rotation of the cut wafer slices.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production, and more specifically to a method for preparing semiconductors. Background Art

[0002] Semiconductors are used in fields such as integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. For example, diodes are devices made of semiconductors. Currently, the main semiconductor in electronic components is a silicon wafer prepared from silicon elements with rich content. During the preparation process of the silicon wafer, it needs to be polished before etching. In the prior art, a polishing wheel is used to polish the silicon wafer, and the mutual polishing and smoothing of the wafer cannot be achieved through the relative rotation between the wafers. Summary of the Invention

[0003] To overcome the deficiencies of the prior art, the present invention provides a method for preparing semiconductors, which can achieve mutual polishing and smoothing through the relative rotation of the cut wafers.

[0004] The technical solution adopted by the present invention to solve its technical problems is as follows:

[0005] A method for preparing semiconductors, the method comprising the following steps:

[0006] Step 1: Extract silicon from sand and purify the silicon into polysilicon;

[0007] Step 2: Process the polysilicon into a single-crystal silicon rod;

[0008] Step 3: Use a diamond tool to process the single-crystal silicon rod into a silicon wafer;

[0009] Step 4: First, polish the silicon wafers with each other, and then etch and polish the silicon wafers to complete the preparation of the semiconductor.

[0010] Further, the method for preparing the semiconductor is processed using a semiconductor preparation device. The device includes two fixing rings corresponding to the axes for restricting the cut silicon wafers. On each fixing ring, a plurality of clamping plates for clamping the silicon wafers are rotated through a plurality of upright posts fixedly connected to the fixing ring itself, and a spring plate for pushing the corresponding clamping plate to clamp the silicon wafer is fixedly connected to each fixing ring.

[0011] Further, a plurality of the clamping plates are all hollow, and the inner walls of the plurality of clamping plates are in contact with the corresponding spring plates.

[0012] Further, it further includes a plurality of limiting blocks fixedly connected to the fixing ring, and two limiting rings for restricting the two fixing rings from driving the plurality of limiting blocks to rotate. Description of the Drawings

[0013] The following further describes the present invention in detail with reference to the drawings and specific implementation methods.

[0014] Figure 1 Flow chart of a method for preparing a semiconductor;

[0015] Figure 2 Structural diagram for clamping a semiconductor;

[0016] Figure 3 Part drawing for clamping a semiconductor;

[0017] Figure 4 Cross-sectional view of the part for clamping a semiconductor;

[0018] Figure 5 Structural diagram for the rotation of a wafer;

[0019] Figure 6 Power transmission diagram for the rotation of a wafer;

[0020] Figure 7 Structural diagram of an end face wheel;

[0021] Figure 8 Structural diagram for driving the flipping of a wafer;

[0022] Figure 9 Structural diagram for driving wafers to approach or move away from each other;

[0023] Figure 10 Structural diagram for grinding a wafer.

[0024] Fixed ring 11; Limit block 12; Column 13; Spring plate 14; Clamping plate 21; Limit ring 31; Flipping shaft 32; Flipping wheel 33; Auxiliary frame 34; Extension plate 41; End face wheel 42; Driving wheel 43; Protection frame 51; Driving wheel 52; Lead screw sleeve 53; Bracket 61; Round rod 62; Lead screw 63. Detailed implementation method

[0025] Refer to Figure 1 for a detailed description of the implementation process of manufacturing a semiconductor:

[0026] A method for preparing a semiconductor, the method comprising the following steps:

[0027] Step 1: Extract silicon from sand and purify the silicon into polysilicon; The commonly used semiconductors are mainly composed of two materials, silicon and germanium. Since silicon is abundantly contained in sand, it has low cost and rich resources. Therefore, the commonly used semiconductor materials are obtained from sand. The required silicon is obtained from sand, and the silicon prepared from sand under normal conditions exists in the form of polysilicon;

[0028] Step 2: Process polysilicon into single-crystal silicon rods. Commonly used semiconductors, the material of single-crystal silicon is far superior to that of polysilicon. Therefore, processing polysilicon material into rod-shaped single-crystal silicon facilitates the subsequent production and processing of wafer sheets.

[0029] Step 3: Use a diamond tool to process the single-crystal silicon rod into silicon wafers, and process the single-crystal silicon rod into the required wafer sheets, which facilitates subsequent grinding, etching, and polishing.

[0030] Step 4: First, grind the silicon wafers against each other. The common method is to directly grind the silicon wafers with a grinding wheel. Grinding one side of the silicon wafer with one side as the reference surface is likely to cause the two sides of the silicon wafer to be parallel, but both ground planes are not perpendicular to the axis of the cylindrical surface. It is more likely to be damaged during use and the grinding wheel is also used more frequently, reducing the life of the grinding wheel. Therefore, first grind the cut silicon wafers against each other, clamp them using the cylindrical surface of the silicon wafer to ensure that the axes of the two silicon wafers coincide. After grinding is completed, then use a grinding wheel for grinding, and then etch and polish the ground silicon wafers to complete the preparation of the semiconductor.

[0031] Combined with the above embodiments, the following functions can also be achieved;

[0032] Reference Figure 2 、 3 And 4, describe in detail the implementation process of clamping the silicon wafers for mutual grinding:

[0033] The preparation method of the semiconductor is processed using a semiconductor preparation device. The device includes two upper and lower corresponding fixing rings 11 that limit the cut silicon wafers. Commonly used semiconductor wafer sheets have the same size. As a general product for electronic products, it is not easy to change the size and mass production is required. Therefore, for the diameter of the wafer sheet to be processed, a fixing ring 11 with an appropriate size is set. A plurality of windows are processed on both of the two upper and lower corresponding fixing rings 11. One side of each of the plurality of windows is fixedly connected with a column 13. A clamping plate 21 is rotatably connected to each column 13 through a bearing. A plurality of clamping plates 21 can rotate around the columns 13 to which they are connected and clamp the corresponding wafer sheet in the middle under the push of an external force. The other side of each of the plurality of windows on the fixing ring 11 is fixedly connected with a spring plate 14. A plurality of spring plates 14 push the corresponding clamping plates 21 to rotate towards the center line of the fixing ring 11 to clamp the wafer sheet, and the clamped part is the outer circular surface of the wafer sheet. It can ensure that the axes of the upper and lower corresponding wafer sheets coincide, the two wafer sheets can rotate on their own axes, and the two wafer sheets can approach each other and cooperate with each other's rotation to achieve mutual grinding of the wafer sheets.

[0034] Combined with the above embodiments, the following functions can also be achieved;

[0035] ReferenceFigure 2 , 3 and 4, the implementation process of multiple spring plates pushing the corresponding clamping plates to clamp the wafer is described in detail:

[0036] Multiple of the said clamping plates 21 are all hollow, realizing the light weight of the device, and at the same time providing space for the pushing of multiple spring plates 14. Multiple spring plates 14 are all in contact with the inner walls of the corresponding hollow clamping plates 21. Without external force applied, multiple spring plates 14 push multiple clamping plates 21 to be located inside the inner walls of the corresponding fixing rings 11, capable of clamping the objects placed on the inner walls of the fixing rings 11, facilitating the mutual grinding of the wafers.

[0037] Combined with the above embodiments, the following functions can also be achieved;

[0038] Refer to Figure 5 , the implementation process of the rotation of the wafer is described in detail:

[0039] Multiple limiting blocks 12 are fixedly connected to both of the two fixing rings 11. The multiple equally distributed limiting blocks 12 on each fixing ring 11 are all rotatably connected to the corresponding limiting rings 31. Both of the two limiting rings 31 are circular rotating bodies, and each limiting block 12 is provided with a circular rotating groove that matches the limiting ring 31. The circular rotating grooves are all open grooves, capable of facilitating the addition of lubricating oil that reduces friction into the circular rotating grooves, reducing the wear of the parts. And multiple limiting blocks 12 rotate on the corresponding circular rotating body limiting rings 31, capable of rotating more smoothly, with less friction, which is more conducive to the grinding of the wafers.

[0040] Combined with the above embodiments, the following functions can also be achieved;

[0041] Refer to Figure 5 , 6 and 8, the implementation process of the flipping of the silicon wafer is described in detail:

[0042] Both ends of the two limiting rings 31 are fixedly connected with flipping shafts 32. The flipping shafts 32 are rotatably connected to the corresponding protective frames 51 through bearings. By driving the flipping shafts 32 to rotate 180 degrees by an external force, the flipping of the two end faces of the silicon wafer is realized, facilitating the grinding of the unground face.

[0043] Combined with the above embodiments, the following functions can also be achieved;

[0044] Refer to Figure 8 , the implementation process of driving the flipping of the two limiting rings is described in detail:

[0045] On the rotation shafts 32, there are flip wheels 33 fixedly connected thereto. On the protective frames 51, there are driving wheels 52 rotatably connected through bearings. A plurality of driving wheels 52 are fixedly connected to the output shafts of the first reduction motors through bolts. A plurality of the first reduction motors are fixedly connected to the corresponding protective frames 51 through bolts. Start the plurality of the first reduction motors. The plurality of the first reduction motors drive the plurality of driving wheels 52 to rotate. The plurality of driving wheels 52 meshingly drive the corresponding flip wheels 33 to rotate, thereby realizing the flipping of the two wafers and grinding the remaining two unground end faces. By grinding the two wafers against each other, the loss of the grinding wheels is saved and the service life of the grinding wheels is extended.

[0046] Combined with the above embodiments, the following functions can also be realized;

[0047] Refer to Figure 6 、 7 and 8, and describe in detail the implementation process of driving the wafer to rotate:

[0048] On the end faces of the rotation shafts 32, there are auxiliary frames 34 fixedly connected thereto. On a plurality of auxiliary frames 34, there are driving wheels 43 rotatably connected through bearings. A plurality of driving wheels 43 are fixedly connected to the output shafts of the second reduction motors through bolts. A plurality of the second reduction motors are fixedly connected to the corresponding auxiliary frames 34 through bolts. On both fixing rings 11, there are extension plates 41 fixedly connected through bolts. On both extension plates 41, there are end face wheels 42 fixedly connected thereto. Both end face wheels 42 are in meshing transmission with the corresponding driving wheels 43. Start the plurality of the second reduction motors. The plurality of the second reduction motors drive the corresponding driving wheels 43 to rotate. The plurality of driving wheels 43 meshingly drive the two end face wheels 42 to rotate. The two end face wheels 42 drive the two extension plates 41 to rotate. The two extension plates 41 drive the two fixing rings 11 to rotate, thereby driving the two wafers to grind against each other. The rotation directions of the two end face wheels 42 are opposite, so as to drive the rotation directions of the two wafers to be opposite, which can avoid relative static state between the two wafers and can grind the wafers more effectively.

[0049] Combined with the above embodiments, the following functions can also be realized;

[0050] Refer to Figure 9 and 10 and describe in detail the implementation process of driving the two wafers to approach each other for grinding or move away from each other for flipping:

[0051] The bracket 61 is fixedly connected with a round rod 62. A lead screw 63 is rotatably connected to the bracket 61 through a bearing. The lead screw 63 is fixedly connected to the output shaft of the third reduction motor through a bolt. The third reduction motor is fixedly connected to the bracket 61 through a bolt. Both protective frames 51 are slidably connected to the round rod 62. Both protective frames 5 are fixedly connected with lead screw sleeves 53 through bolts. Both lead screw sleeves 53 are connected to the lead screw 63. Starting the third reduction motor drives the lead screw 63 to rotate. The lead screw 63 drives the two lead screw sleeves 53 through the thread to drive the two protective frames 51 to slide on the round rod 62, realizing the mutual approach and separation of the two wafers.

[0052] Combined with the above embodiments, the following functions can also be realized;

[0053] Refer to Figure 10 , and the implementation process of the synchronous reverse movement of the two lead screw sleeves is described in detail:

[0054] The thread directions at both ends of the lead screw 63 are opposite. Therefore, when the lead screw 63 rotates, the threads at both ends can drive the two lead screw sleeves 53 to approach or separate from each other.

[0055] Combined with the above embodiments, the following functions can also be realized;

[0056] Refer to Figure 9 and 10 , and the implementation process of the synchronous equidistant movement of the two lead screw sleeves is described in detail:

[0057] The pitches of the threads at both ends of the lead screw 63 are equal. Therefore, when the lead screw 63 rotates one week, the distances that the two lead screw sleeves 53 move are equal, and the grinding thickness of the two wafers can be controlled more accurately.

Claims

1. A method for preparing a semiconductor, characterized in that: The method comprises the following steps: Step 1: Extract silicon from sand and purify the silicon into polysilicon; Step 2: Process the polysilicon into a single-crystal silicon rod; Step 3: Process the single-crystal silicon rod into silicon wafers using a diamond tool; Step 4: First, polish the silicon wafers against each other, then use a polishing wheel for polishing, and then etch and polish the silicon wafers to complete the preparation of the semiconductor. The preparation method of the semiconductor is processed using a semiconductor preparation device. The device includes two fixing rings (11) corresponding to the axes for restricting the silicon wafers after cutting. A plurality of clamping plates (21) for clamping the silicon wafers are rotatably mounted on the fixing rings (11) through a plurality of upright columns (13) fixedly connected to the fixing rings themselves. Spring plates (14) for pushing the corresponding clamping plates (21) to clamp the silicon wafers are fixedly connected to the fixing rings (11). A plurality of the clamping plates (21) are all hollow, and the inner walls of the plurality of clamping plates (21) are in contact with the corresponding spring plates (14). It also includes a plurality of limit blocks (12) fixedly connected to the fixing rings (11), and two limit rings (31) for restricting the two fixing rings (11) from driving the plurality of limit blocks (12) to rotate. It further includes turning shafts (32) fixedly connected to both ends of the limit rings (31), and a protective frame (51) for supporting the rotation of the turning shafts (32). It also includes turning wheels (33) fixedly connected to the turning shafts (32), and driving wheels (52) rotatably mounted on the protective frame (51) for driving the corresponding turning wheels (33) to rotate. A plurality of the driving wheels (52) are all fixedly connected to the output shafts of the first reduction motors through bolts, and a plurality of the first reduction motors are all fixedly connected to the corresponding protective frames (51) through bolts. Start the plurality of first reduction motors, and the plurality of first reduction motors drive the plurality of driving wheels (52) to rotate. The plurality of driving wheels (52) meshingly drive the corresponding turning wheels (33) to rotate, thereby realizing the flipping of the two wafers. It also includes auxiliary frames (34) fixedly connected to the end faces of the turning shafts (32), and extension plates (41) fixedly connected to the fixing rings (11). End face wheels (42) are fixedly connected to the extension plates (41). Driving wheels (43) for driving the corresponding end face wheels (42) to rotate are rotatably mounted on a plurality of the auxiliary frames (34). The two end face wheels (42) are both in meshing transmission with the corresponding driving wheels (43). Start the plurality of second reduction motors, and the plurality of second reduction motors drive the corresponding driving wheels (43) to rotate. The plurality of driving wheels (43) meshingly drive the two end face wheels (42) to rotate. The two end face wheels (42) drive the two extension plates (41) to rotate. The two extension plates (41) drive the two fixing rings (11) to rotate, thereby driving the two wafers to polish against each other. The rotation directions of the two end face wheels (42) are opposite, thereby driving the rotation directions of the two wafers to be opposite. It also includes lead screw sleeves (53) fixedly connected to the protective frames (51), a round rod (62) for supporting the sliding of the two protective frames (51), and a bracket (61) fixedly connected to the round rod (62). A lead screw (63) for driving the two lead screw sleeves (53) is rotatably mounted on the bracket (61). The thread directions at both ends of the lead screw (63) are opposite. The lead screw (63) is fixedly connected to the output shaft of the third reduction motor through bolts, and the third reduction motor is fixedly connected to the bracket (61) through bolts. The two protective frames (51) are both slidably connected to the round rod (62).On both of the two protective frames (51), a lead screw sleeve (53) is fixedly connected by bolts. Both of the two lead screw sleeves (53) are connected to a lead screw (63). Starting the third reduction motor drives the lead screw (63) to rotate. The lead screw (63) drives the two lead screw sleeves (53) through the thread to drive the two protective frames (51) to slide on the round rod (62), realizing the mutual approach and separation of the two wafers.

2. The manufacturing method of the semiconductor according to claim 1, wherein: The pitches of the threads at both ends of the lead screw (63) are equal.

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