A slide table based on the measurement of the surface roughness of a wafer

Abstract

The present invention relates to the field of precision electronic manufacturing technology, and provides a sliding table based on the measurement of the surface roughness of a wafer, including a sliding table for precise positioning and a floating clamping device on the sliding table. The sliding table includes a base, a first driving component, a second driving component, a first sliding table and a second sliding table. The first driving component and the second driving component are arranged side by side in the base and are rotationally connected to the base. The movable end of the first driving component is provided with the first sliding table, and the first sliding table is slidably connected to the base. The movable end of the second driving component is provided with the second sliding table, and the second sliding table is slidably connected to the base. Floating clamping devices are respectively arranged on the first sliding table and the second sliding table, and the relative movement of the first sliding table and the second sliding table drives the floating clamping device to clamp the wafer. The present invention drives the floating clamping device to clamp and fix the wafer through the relative movement of the first sliding table and the second sliding table, preventing damage to the wafer body due to excessive clamping force.

Description

Technical Field

[0001] The present invention relates to the technical field of precision electronics manufacturing, and more particularly, to a slide table based on the measurement of the surface roughness of a wafer. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed. The silicon wafer is further processed by a CMP device. With the continuous development of integrated circuit manufacturing technology, the chip feature size is getting smaller and smaller, the number of interconnect layers is increasing, the wafer diameter is also increasing continuously, and the requirements for the surface quality of CMP are getting higher and higher. To achieve multi-layer wiring, the wafer surface must have high flatness, smoothness, and cleanliness. Currently, the wafer is picked up by a suction nozzle or a gripper and directly detected by a detection instrument. Due to the large force, it is easy to cause large detection errors. In order to better detect the surface roughness of the wafer and prevent large detection errors caused by the wafer being stressed during the detection process, a special slide table for detecting the surface roughness of the wafer is needed. Summary of the Invention

[0003] The problem solved by the present invention is to prevent large detection errors caused by the wafer being stressed during the detection process. To solve the above problem, the present invention provides a slide table based on the measurement of the surface roughness of a wafer, which includes a slide table for precise positioning and a floating clamping device on the slide table. The slide table includes a base, a first driving component, a second driving component, a first slide table, and a second slide table. The first driving component and the second driving component are arranged in parallel in the base and are rotationally connected to the base. The movable end of the first driving component is provided with the first slide table, and the first slide table is slidably connected to the base. The movable end of the second driving component is provided with the second slide table, and the second slide table is slidably connected to the base. The floating clamping device is respectively arranged on the first slide table and the second slide table. The relative movement of the first slide table and the second slide table drives the floating clamping device to clamp the wafer.

[0004] Optionally, the floating clamping device includes a magnetic levitation base and a floating clamping block. The magnetic levitation bases are respectively arranged on the first slide table and the second slide table. The floating clamping blocks are respectively arranged directly above the magnetic levitation bases. The floating clamping blocks are floatingly connected to the magnetic levitation bases, and the movement of the magnetic levitation bases drives the floating clamping blocks to move.

[0005] Optionally, an electromagnetic levitation unit is arranged inside the magnetic levitation base, and the electromagnetic levitation unit is used to generate a certain magnetic force to make the floating clamping block levitate on the magnetic levitation base.

[0006] Optionally, a permanent magnet adapted to the electromagnetic suspension unit is provided inside the suspension clamping block, and a clamping unit is provided outside the magnetic suspension clamping block, and the clamping unit is used for clamping the wafer.

[0007] Optionally, the clamping unit includes an airbag fixing block and a flexible clamping airbag. The airbag fixing block is installed on the side of the suspension clamping block in contact with the wafer, and the flexible clamping airbag is provided on the airbag fixing block. The flexible clamping airbag is used for clamping the wafer while preventing the wafer from deforming.

[0008] Optionally, the first driving component and the second driving component have the same structure and are arranged side by side inside the base. The first driving component is installed on one side inside the base, and the second driving component is installed side by side on the other side inside the base. The first driving component and the second driving component are used to drive the first sliding table and the second sliding table to move relatively inside the base respectively.

[0009] Optionally, the first driving component includes a first driving motor and a first lead screw. The first driving motor is arranged at the front end of the base, the first lead screw is arranged inside the base and is rotatably connected to the base, and the output end of the first driving motor is fixedly connected to the first lead screw. The second driving component includes a second driving motor and a second lead screw. The second driving motor is arranged at the rear end of the base, the second lead screw is arranged inside the base and is rotatably connected to the base, and the output end of the second driving motor is fixedly connected to the second lead screw. The first driving motor is used to drive the first lead screw to rotate, and the second driving motor is used to drive the second lead screw to rotate.

[0010] Optionally, guide rails are provided at the bottom inside the base, and a first slider and a second slider are respectively arranged on the guide rails. The first slider and the second slider are slidably connected to the guide rails. The first sliding table is arranged on the first slider, and the second sliding table is arranged on the second slider. The first lead screw and the second lead screw penetrate through the first sliding table and the second sliding table side by side, and the first lead screw and the second lead screw are slidably connected to the first sliding table and the second sliding table. By rotating the first lead screw and the second lead screw, the first sliding table and the second sliding table can move relatively.

[0011] Optionally, a first lead screw nut is arranged on the first lead screw, the first lead screw nut is arranged on the first sliding table, a second lead screw nut is arranged on the second lead screw, and the second lead screw nut is arranged on the second sliding table. The rotation of the first lead screw drives the first sliding table to move, and the rotation of the second lead screw drives the second sliding table to move.

[0012] Compared with the prior art, in the present invention, the first driving component drives the first sliding table to move, and the second driving component drives the second sliding table to move, so that the first sliding table drives the suspension clamping device located on the first sliding table and the second sliding table drives the suspension clamping device located on the second sliding table to move relatively, thereby realizing clamping the wafer through the suspension clamping device to prevent large detection errors caused by excessive force. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present invention;

[0014] Figure 2 is a schematic diagram of the detailed breakdown of the overall structure of an embodiment of the present invention;

[0015] Figure 3 is a schematic diagram of the disassembled overall structure of an embodiment of the present invention;

[0016] Figure 4 is a schematic diagram of the internal structure of the sliding table of an embodiment of the present invention;

[0017] Figure 5 is a schematic diagram of the structure of the suspension clamping block of an embodiment of the present invention;

[0018] Figure 6 is a schematic diagram of the structure of the point magnetic levitation unit of an embodiment of the present invention;

[0019] DESCRIPTION OF THE REFERENCE NUMERALS: 1 - base; 2 - first driving component; 3 - second driving component; 4 - suspension clamping device; 21 - first driving motor; 22 - first sliding table; 23 - first magnetic levitation base; 24 - first suspension clamping block; 25 - first sliding table block; 26 - first lead screw; 27 - first lead screw nut; 28 - first slider; 29 - first guide rail; 221 - first sliding table mounting plate; 31 - second driving motor; 32 - second sliding table; 33 - second magnetic levitation base; 34 - second suspension clamping block; 35 - second sliding table block; 36 - second lead screw; 37 - second lead screw nut; 38 - second slider; 39 - second guide rail; 321 - second sliding table mounting plate; 331 - second flexible clamping airbag; 332 - second airbag fixing block; 233 - permanent magnet; 232 - first airbag fixing block; 231 - first flexible clamping airbag; 241 - base housing; 242 - PCB board; 243 - balance magnet; 244 - electromagnetic coil; 245 - Hall element. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] In order to make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention will be given with reference to the accompanying drawings.

[0021] It should be noted that the terms "first", "second", etc. in the description, claims and the above drawings of the present invention are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0023] In the description of this specification, the descriptions referring to terms such as "embodiment", "one embodiment" and "one implementation manner" mean that the specific features, structures, materials or characteristics described in connection with the embodiment or implementation manner are included in at least one embodiment or implementation manner of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or implementation manner. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or implementation manners.

[0024] To solve the above problems, as Figure 1 and Figure 2 shown, the present invention provides a stage based on the measurement of the surface roughness of a wafer, including a stage for precise positioning and a floating clamping device on the stage. The stage includes a base 1, a first driving assembly 2, a second driving assembly 3, a first stage 22 and a second stage 32. The first driving assembly 2 and the second driving assembly 3 are arranged in parallel in the base 1 and are rotatably connected to the base 1. The movable end of the first driving assembly 2 is provided with the first stage 22, and the first stage 22 is slidably connected to the base 1. The movable end of the second driving assembly 3 is provided with the second stage 32, and the second stage 32 is slidably connected to the base 1. The floating clamping device 4 is respectively arranged on the first stage 22 and the second stage 32. The relative movement of the first stage 22 and the second stage 32 drives the floating clamping device 4 to clamp the wafer.

[0025] It should be noted that a first driving component 2 and a second driving component 3 are horizontally and juxtaposedly installed inside the base 1. A first sliding table 22 is arranged at the output end of the first driving component 2, and a second sliding table 32 is arranged at the output end of the second driving component 3. By driving the first driving component 2, the first sliding table 22 can slide flexibly inside the base 1. By driving the second driving component 3, the second sliding table 32 can slide flexibly inside the base 1. By simultaneously driving the first driving component 2 and the second driving component 3, the first sliding table 22 and the second sliding table 32 can move relatively. A first floating clamping device is arranged directly above the first sliding table 22, and a second floating clamping device is arranged directly above the second sliding table 32. By moving the first sliding table 22 and the second sliding table 32, the first floating clamping block 24 on the first floating device on the first sliding table 22 and the second floating clamping block 34 on the second floating device on the second sliding table 32 move relatively, thereby clamping and releasing the wafer.

[0026] In an embodiment of the present invention, as Figure 3 、 5 、6 shows, the floating clamping device 4 includes a magnetic levitation base and a floating clamping block. The magnetic levitation bases are respectively arranged on the first sliding table 22 and the second sliding table 32, and the floating clamping blocks are respectively arranged directly above the magnetic levitation bases. The floating clamping blocks are floatingly connected to the magnetic levitation bases, and the movement of the magnetic levitation bases drives the floating clamping blocks to move.

[0027] It should be noted that a first magnetic levitation base 23 is arranged on the first sliding table 22, and a first floating clamping block 24 is correspondingly arranged on the first magnetic levitation base 23. By energizing the first magnetic levitation base 23, the first floating clamping block 24 floats directly above the first magnetic levitation base 23. When the first magnetic levitation base 23 moves, the first floating clamping block 24 moves accordingly. A second floating clamping block 34 is correspondingly arranged on the second magnetic levitation base 33. By energizing the second magnetic levitation base 33, the second floating clamping block 34 floats directly above the second magnetic levitation base 33. When the second magnetic levitation base 33 moves, the second floating clamping block 34 moves accordingly. By changing the relative positions of the first magnetic levitation base 23 and the second magnetic levitation base 33, the positions of the first floating clamping block 23 and the second floating clamping block 34 can be changed.

[0028] In an embodiment of the present invention, as Figure 6 shows, an electromagnetic levitation unit is arranged inside the magnetic levitation base, and the electromagnetic levitation unit is used to generate a certain magnetic field force to make the floating clamping block float on the magnetic levitation base.

[0029] It should be noted that electromagnetic levitation units are respectively arranged inside the first magnetic levitation base 23 and the second magnetic levitation base 33. The electromagnetic levitation unit includes a PCB board 242, a balance magnet 243, an electromagnetic coil 244, and a Hall element 245. The PCB board 242 is installed on the base housing 241. The Hall element 245 is arranged in the middle of the PCB board 242. Four electromagnetic coils 244 are arranged concentrically on the periphery of the Hall element 245. Six balance magnets 243 are arranged concentrically on the periphery of the electromagnetic coils 244. Through the principle of like poles repelling and opposite poles attracting, the permanent magnet 233 inside the suspension clamping block is suspended directly above the magnetic field formed by the six balance magnets 243. Then, by energizing the PCB board 242, the electromagnetic coils 244 and the Hall element 245 are powered on, so that the permanent magnet 233 can obtain better balance force on the electromagnetic levitation unit, and thus the magnetic levitation clamping block can be stably suspended directly above the magnetic levitation base.

[0030] In an embodiment of the present invention, as Figure 5 shown, a permanent magnet 233 adapted to the electromagnetic levitation unit is arranged inside the suspension clamping block, and a clamping unit is arranged outside the magnetic levitation clamping block. The clamping unit is used for clamping the wafer.

[0031] It should be noted that a permanent magnet capable of providing sufficient levitation force for the suspension clamping block is installed inside the suspension clamping block. The first clamping unit and the second clamping unit are respectively installed on the opposite inner side surfaces of the suspension clamping block. Through the relative movement of the first sliding table 22 and the second sliding table 32, the relative movement of the first magnetic levitation base 23 and the second magnetic levitation base 33 is driven, so that the first suspension clamping block 24 suspended on the first magnetic levitation base 23 and the second suspension clamping block 34 suspended on the second magnetic levitation base 33 move relatively. Then, the first clamping unit on the first suspension clamping block 24 and the second clamping unit on the second suspension clamping block 34 move relatively to clamp and release the side surface of the wafer. By suspending and clamping the wafer, the force on the wafer can be made uniform, effectively preventing deformation and also preventing damage to the wafer.

[0032] In an embodiment of the present invention, as Figure 5 shown, the clamping unit includes an airbag fixing block and a flexible clamping airbag. The airbag fixing block is installed on the side of the suspension clamping block in contact with the wafer, and the flexible clamping airbag is arranged on the airbag fixing block. The flexible clamping airbag is used for clamping the wafer while preventing the wafer from deforming.

[0033] It should be noted that first airbag fixing blocks 232 and second airbag fixing blocks 332 are symmetrically arranged on the relative inner sides of the first floating clamping block 24 and the second floating clamping block 34 respectively. A first flexible clamping airbag 231 is arranged on the first airbag fixing block 232, and a second flexible clamping airbag 331 is arranged on the second airbag fixing block 332. By driving the first driving assembly 2 and the second driving assembly 3, the first sliding table 22 and the second sliding table 32 move relatively, driving the relative movement of the first magnetic levitation base 23 and the second magnetic levitation base 33, so that the first floating clamping block 24 floating on the first magnetic levitation base 23 and the second floating clamping block 34 on the second magnetic levitation base 33 move relatively. The first floating clamping block 24 drives the first flexible clamping airbag 231 and the second floating clamping block 34 drives the second flexible clamping airbag 331 to move relatively, so that the first flexible clamping airbag 231 and the second flexible clamping airbag 331 clamp and release the side of the wafer. Clamping by the first flexible clamping airbag 231 and the second flexible clamping airbag 331 can effectively prevent the wafer from deforming during clamping, thus affecting the detection accuracy.

[0034] In an embodiment of the present invention, as Figure 3 shown, the first driving assembly 2 and the second driving assembly 3 have the same structure and are arranged in parallel inside the base 1. The first driving assembly 2 is installed on one side inside the base 1, and the second driving assembly 3 is arranged in parallel on the other side inside the base 1. The first driving assembly 2 and the second driving assembly 3 are used to drive the first sliding table 22 and the second sliding table 32 to move relatively inside the base 1 respectively.

[0035] It should be noted that the first driving assembly 2 is arranged on the right side inside the U-shaped base 1, the second driving assembly 3 is arranged in parallel on the left side inside the U-shaped base 1. A first sliding table 22 is arranged at the output end of the first driving assembly 2 to enable the first sliding table 22 to slide flexibly inside the base 1. A second sliding table 32 is arranged at the output end of the second driving assembly 3 to enable the second sliding table 32 to slide flexibly inside the base 1. The first sliding table 22 and the second sliding table 32 can slide relatively. By driving the first driving assembly 2, the first sliding table 22 slides flexibly inside the base 1. By driving the second driving assembly 3, the second sliding table 32 slides flexibly inside the base 1. By driving the first driving assembly 2 and the second driving assembly 3 simultaneously, the first sliding table 22 and the second sliding table 32 move relatively.

[0036] In an embodiment of the present invention, as Figure 3 、 4As shown, the first driving assembly 2 includes a first driving motor 21 and a first lead screw 26. The first driving motor 21 is arranged at the front end of the base 1. The first lead screw 26 is arranged inside the base 1 and is rotatably connected to the base 1. The output end of the first driving motor 21 is fixedly connected to the first lead screw 26. The second driving assembly 3 includes a second driving motor 31 and a second lead screw 36. The second driving motor 31 is arranged at the rear end of the base 1. The second lead screw 36 is arranged inside the base 1 and is rotatably connected to the base 1. The output end of the second driving motor 31 is fixedly connected to the second lead screw 36. The first driving motor 21 is used to drive the first lead screw 26 to rotate, and the second driving motor 31 is used to drive the second lead screw 36 to rotate.

[0037] Among them, the driving motor is a servo motor capable of providing precise positioning.

[0038] It should be noted that the first driving assembly 2 includes a first driving motor 21 and a first lead screw 26, and the second driving assembly 3 includes a second driving motor 31 and a second lead screw 36. The first driving motor 21 is horizontally and longitudinally installed on the right side of the front end of the base 1. The first lead screw 26 is horizontally and longitudinally installed inside the base 1. The first lead screw 26 penetrates the base 1 and is rotatably connected to the base 1. The output end of the first driving motor 21 is fixedly connected to the driving end of the first lead screw 26. The second driving motor 31 is horizontally and longitudinally installed on the left side of the rear end of the base 1. The second lead screw 36 is horizontally and longitudinally installed inside the base 1. The second lead screw 36 penetrates the base 1 and is rotatably connected to the base 1. The output end of the second driving motor 31 is fixedly connected to the driving end of the second lead screw 36. The first lead screw 26 and the second lead screw 36 are installed side by side inside the base 1. Driving the first driving motor 21 enables the first lead screw 26 to rotate flexibly inside the base 1, and driving the second driving motor 31 enables the second lead screw 36 to also rotate flexibly inside the base 1.

[0039] In an embodiment of the present invention, as Figure 3 、 4 shown, a guide rail is provided at the bottom of the inner side of the base 1. A first slider 28 and a second slider 38 are respectively arranged on the guide rail. The first slider 28, the second slider 38 are slidably connected to the guide rail. The first slide table 22 is arranged on the first slider 28, and the second slide table 32 is arranged on the second slider 38. The first lead screw 26 and the second lead screw 36 penetrate through the first slide table 22 and the second slide table 32 side by side. The first lead screw 26 and the second lead screw 36 are slidably connected to the first slide table 22 and the second slide table 32. By rotating the first lead screw 26 and the second lead screw 36, the first slide table 22 and the second slide table 32 can move relative to each other.

[0040] It should be noted that the sliding table includes a sliding table block and a sliding table mounting plate. Inside the U-shaped base 1, a first guide rail 29 and a second guide rail 39 are horizontally and longitudinally arranged. A first slider 28 and a second slider 38 are horizontally and transversely arranged on the first guide rail 29 and the second guide rail 39, and the first slider 28 and the second slider 38 can slide flexibly on the first guide rail 29 and the second guide rail 39. A first sliding table block 25 is horizontally and transversely arranged on the first slider 28. Through holes are arranged in parallel at positions corresponding to the first lead screw 26 and the second lead screw 36 on the first sliding table block 25. The first lead screw 26 and the second lead screw 36 pass through the first sliding table block 25 through the through holes, so that the first sliding table block 25 can slide flexibly inside the base 1. A second sliding table block 35 is horizontally and transversely arranged on the second slider 38. Through holes are arranged in parallel at positions corresponding to the first lead screw 26 and the second lead screw 36 on the second sliding table block 35. The first lead screw 26 and the second lead screw 36 pass through the second sliding table block 35 through the through holes, so that the second sliding table block 35 can slide flexibly inside the base 1. Thus, the first sliding table block 25 and the second sliding table block 35 can slide flexibly inside the base 1 where the first lead screw 26 and the second lead screw 36 are installed. A first sliding table mounting plate 221 is arranged directly above the first sliding table block 25, and a second sliding table mounting plate 321 is arranged directly above the second sliding table block 35. A first magnetic levitation base 23 is arranged directly above the first sliding table block 25, and a second magnetic levitation base 33 is installed directly above the second sliding table block 35. The movement of the first sliding table block 25 and the second sliding table block 35 drives the movement of the first magnetic levitation base 23 and the second magnetic levitation base 33.

[0041] In an embodiment of the present invention, as Figure 4 shown, a first lead screw nut 27 is arranged on the first lead screw 26. The first lead screw nut 27 is arranged on the first sliding table 22. A second lead screw nut 37 is arranged on the second lead screw 36. The second lead screw nut 37 is arranged on the second sliding table 32. The rotation of the first lead screw 26 drives the movement of the first sliding table 22, and the rotation of the second lead screw 36 drives the movement of the second sliding table 32.

[0042] It should be noted that two identical first lead screw nuts 27 are provided on the first lead screw 26, and the first lead screw nuts 27 are installed on the through holes on the right side of the second slide block 35. Through the cooperation of the first lead screw 26 and the first lead screw nuts 27, when the first lead screw 26 rotates, the first slide block 25 linearly reciprocates inside the base 1. Two identical second lead screw nuts 37 are provided on the second lead screw 36, and the second lead screw nuts 37 are installed on the through holes on the left side of the first slide block 25. Through the cooperation of the second lead screw 36 and the second lead screw nuts 37, when the second lead screw 36 rotates, the second slide block 35 linearly reciprocates inside the base 1. By precisely controlling the clockwise or counterclockwise rotation of the first drive motor 21 and the second drive motor 31, the clockwise or counterclockwise rotation of the first lead screw 26 and the second lead screw 36 is realized, so that the first slide block 25 and the second slide block 35 move relatively and towards each other, realizing the relative displacement of the first slide block 25 and the second slide block 35 on the base 1, and can also realize precise positioning on the base 1 and the clamping of the wafer by the magnetic levitation device on the slide table.

[0043] Basic working principle: By energizing the magnetic levitation base in the suspension clamping device, the suspension clamping block is suspended relatively stably directly above the magnetic levitation base. Then, by precisely controlling the clockwise or counterclockwise rotation of the first drive motor and the second drive motor, the clockwise or counterclockwise rotation of the first lead screw and the second lead screw is realized, so that the first slide block and the second slide block move relatively and towards each other, enabling the suspension clamping block on the slide table to clamp and release the wafer, and can also realize the relative displacement of the first slide block and the second slide block on the base through the rotation of the first drive motor and the second drive motor to achieve precise positioning.

[0044] Although the present disclosure is disclosed as above, the protection scope of the present disclosure is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, and these changes and modifications will all fall within the protection scope of the present invention.

Claims

1. A sliding table based on the measurement of the surface roughness of a wafer, characterized in that, It includes a slide table for precise positioning and a suspension clamping device on the slide table. The slide table includes a base (1), a first driving component (2), a second driving component (3), a first slide table (22), and a second slide table (32). The first driving component (2) and the second driving component (3) are arranged in parallel in the base (1) and are rotatably connected to the base (1). The movable end of the first driving component (2) is provided with the first slide table (22), and the first slide table (22) is slidably connected to the base (1). The movable end of the second driving component (3) is provided with the second slide table (32), and the second slide table (32) is slidably connected to the base (1). The suspension clamping devices (4) are respectively arranged on the first slide table (22) and the second slide table (32). The relative movement of the first slide table (22) and the second slide table (32) drives the suspension clamping device (4) to clamp the wafer. The suspension clamping device (4) includes a magnetic levitation base and a suspension clamping block. The magnetic levitation bases are respectively arranged on the first slide table (22) and the second slide table (32). The suspension clamping blocks are respectively arranged directly above the magnetic levitation bases. The suspension clamping blocks are floatingly connected to the magnetic levitation bases, and the movement of the magnetic levitation bases drives the suspension clamping blocks to move. An electromagnetic levitation unit is arranged inside the magnetic levitation base. The electromagnetic levitation unit is used to generate a certain magnetic field force to make the suspension clamping block levitate on the magnetic levitation base. A permanent magnet (233) adapted to the electromagnetic levitation unit is arranged inside the suspension clamping block. A clamping unit is arranged outside the suspension clamping block. The clamping unit is used to clamp the wafer. The clamping unit includes an airbag fixing block and a flexible clamping airbag. The airbag fixing block is installed on the side of the suspension clamping block in contact with the wafer. The flexible clamping airbag is arranged on the airbag fixing block. The flexible clamping airbag is used to clamp the wafer while preventing the wafer from deforming.

2. The slide table according to claim 1 for measuring the surface roughness of a wafer, characterized in that, The first driving component (2) and the second driving component (3) have the same structure and are arranged in parallel inside the base (1). The first driving component (2) is installed on one side inside the base (1), and the second driving component (3) is arranged in parallel on the other side inside the base (1). The first driving component (2) and the second driving component (3) are used to respectively drive the relative movement of the first slide table (22) and the second slide table (32) inside the base (1).

3. A slide table based on wafer surface roughness measurement according to claim 2, characterized in that, The first driving assembly (2) includes a first driving motor (21) and a first lead screw (26). The first driving motor (21) is arranged at the front end of the base (1), and the first lead screw (26) is arranged inside the base (1) and rotatably connected to the base (1). The output end of the first driving motor (21) is fixedly connected to the first lead screw (26). The second driving assembly (3) includes a second driving motor (31) and a second lead screw (36). The second driving motor (31) is arranged at the rear end of the base (1), and the second lead screw (36) is arranged inside the base (1) and rotatably connected to the base (1). The output end of the second driving motor (31) is fixedly connected to the second lead screw (36). The first driving motor (21) is used to drive the first lead screw (26) to rotate, and the second driving motor (31) is used to drive the second lead screw (36) to rotate.

4. A slide table based on the measurement of the surface roughness of a wafer according to claim 3, characterized in that, A guide rail is provided at the bottom inside the base (1). A first slider (28) and a second slider (38) are respectively arranged on the guide rail. The first slider (28) and the second slider (38) are slidably connected to the guide rail. A first slide table (22) is arranged on the first slider (28), and a second slide table (32) is arranged on the second slider (38). The first lead screw (26) and the second lead screw (36) penetrate through the first slide table (22) and the second slide table (32) in parallel. The first lead screw (26) and the second lead screw (36) are slidably connected to the first slide table (22) and the second slide table (32). The relative movement of the first slide table (22) and the second slide table (32) can be realized by the rotation of the first lead screw (26) and the second lead screw (36).

5. A slide table based on wafer surface roughness measurement according to claim 4, characterized in that, A first lead screw nut (27) is arranged on the first lead screw (26), and the first lead screw nut (27) is arranged on the first slide table (22). A second lead screw nut (37) is arranged on the second lead screw (36), and the second lead screw nut (37) is arranged on the second slide table (32). The rotation of the first lead screw (26) drives the first slide table (22) to move, and the rotation of the second lead screw (36) drives the second slide table (32) to move.

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