Micro-component structure and display device

Abstract

The present invention provides a micro-component structure, which includes a component and a fixing structure. The component has an upper surface, a lower surface and a first side surface. The lower surface is opposite to the upper surface. The first side surface connects the upper surface and the lower surface. The fixing structure includes a connecting portion and a first turning portion. The connecting portion extends from at least the upper surface of the component to the first side surface. The first turning portion contacts to connect the first end of the connecting portion and extends outward from the first side surface to be away from the first side surface. The first end of the connecting portion is located on the first side surface between the upper surface and the lower surface.

Description

Technical Field

[0001] The present invention relates to a component structure and a display device, and in particular to a micro-component structure and a display device with a protruding structure. Background Art

[0002] With the advancement of technology, the size of many electronic components is gradually miniaturized. Miniaturized electronic components may need to be transferred and configured on corresponding circuit boards for subsequent consumer applications. Therefore, how to efficiently transfer miniaturized electronic components during the manufacturing or application process (e.g., to increase the speed or yield of the extraction process) has become a hot topic in current research. Summary of the invention

[0003] The present invention provides a micro-component structure or display device, the components of which can be efficiently transferred during the manufacturing or application process.

[0004] According to one embodiment of the present invention, a micro-component structure includes a component and a fixing structure. The component has an upper surface, a lower surface and a first side surface. The lower surface is opposite to the upper surface. The first side surface connects the upper surface and the lower surface. The fixing structure includes a connecting portion and a first transition portion. The connecting portion extends from at least the upper surface of the component to the first side surface. The first transition portion contacts to connect the first end of the connecting portion and extends outward from the first side surface to be away from the first side surface. The first end of the connecting portion is located on the first side surface between the upper surface and the lower surface.

[0005] According to one embodiment of the present invention, a display device includes a micro-light-emitting component and a fixing structure. The micro-light-emitting component has an upper surface, a lower surface and a first side surface. The lower surface is opposite to the upper surface. The first side surface connects the upper surface and the lower surface. The fixing structure includes a connecting portion and a first turning portion. The connecting portion extends from at least the upper surface of the micro-light-emitting component to the first side surface. The first turning portion contacts to connect the first end of the connecting portion and extends outward from the first side surface to be away from the first side surface. The first end of the connecting portion is located on the first side surface between the upper surface and the lower surface. The end of the first turning portion away from the first side surface is suspended.

[0006] In order to make the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figures 1A to 1H is a partial cross-sectional schematic diagram of a partial manufacturing method of a micro-component structure according to an embodiment of the present invention;

[0008] Fig. 1I is a partial top view schematic diagram of a micro-module structure according to an embodiment of the present invention;

[0009] Figures 2A to 2G is a partial top view schematic diagram of a micro-module structure according to another embodiment of the present invention;

[0010] FIG. 3A to FIG. 3C is a partial cross-sectional schematic diagram of a partial manufacturing method of a display device according to an embodiment of the present invention;

[0011] Figure 4 is a partial cross-sectional schematic diagram of a micro-component structure according to an embodiment of the present invention;

[0012] Figure 5 It is a partial cross-sectional schematic diagram of a micro-component structure according to an embodiment of the present invention.

[0013] Description of reference numerals:

[0014] 100, 200a, 200b, 200c, 200d, 200e, 200f, 200g, 400, 500: micromodule structure;

[0015] 110, 310, 310': components;

[0016] 110a: upper surface;

[0017] 110b: lower surface;

[0018] 110c: first side surface;

[0019] 110d: second side surface;

[0020] 111: first type semiconductor layer;

[0021] 112: light emitting layer;

[0022] 113: second type semiconductor layer;

[0023] 113a: upper surface;

[0024] 114: a first conductive layer;

[0025] 111c, 112c, 113c, 111c: side wall;

[0026] 115: patterned insulating layer;

[0027] 116: first electrode;

[0028] 117: second electrode;

[0029] 120, 120': fixed structure;

[0030] 125: connection part;

[0031] 121: First turning point;

[0032] 121d: first extension direction;

[0033] 122: The second turning point;

[0034] 122d: second extension direction;

[0035] 121w, 122w: width;

[0036] 121h, 122h: thickness;

[0037] 123: first supporting portion;

[0038] 123d: third extension direction;

[0039] 124: second supporting portion;

[0040] 124d: fourth extension direction;

[0041] 130: carrier board;

[0042] 130a: surface;

[0043] 300: display device;

[0044] 330: Circuit board;

[0045] 350: conductive connector;

[0046] 600: pick-and-place device;

[0047] 811, 911: first type semiconductor material layer;

[0048] 812, 912: light emitting material layer;

[0049] 813, 913: second type semiconductor material layer;

[0050] 820: fixing material layer;

[0051] 830: substrate;

[0052] 841, 842: filling material layer;

[0053] 830a, 842a: surface;

[0054] 843: opening or groove;

[0055] h1: first distance;

[0056] h2: second distance;

[0057] h3: third distance;

[0058] R1: Region. DETAILED DESCRIPTION

[0059] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0060] In the drawings, the sizes of some components or layers may be exaggerated or reduced for clarity.

[0061] For the sake of clarity, some components or layers may be omitted or labeled in the drawings.

[0062] Furthermore, the numerical values ​​expressed in the specification may include the numerical values ​​and deviation values ​​within the acceptable deviation range for those skilled in the art. For example, "about" or "substantially" as used herein includes the numerical values ​​and the average value within the acceptable deviation range (e.g., ±10%) of the specific value determined by those skilled in the art, taking into account the specific number of errors (i.e., the limitation or error of the measurement system; or the limitation or error of the process system, but not limited thereto) of the measurement in question and the error associated with the measurement.

[0063] Figures 1A to 1H It is a partial cross-sectional schematic diagram of a partial manufacturing method of a micro-component structure according to an embodiment of the present invention.

[0064] Please refer to Figure 1A , providing a substrate 830, wherein the surface of the substrate 830 has a second-type semiconductor material layer 813, a light-emitting material layer 812, a first-type semiconductor material layer 811, and a first conductive material layer 814 stacked in sequence. The materials, structures, or formation methods of the substrate 830, the second-type semiconductor material layer 813, the light-emitting material layer 812, the first-type semiconductor material layer 811, and / or the first conductive material layer 814 can be selected by those familiar with the technology, and the present invention is not limited thereto. In addition, the first conductive material layer 814 can be formed as needed, and the present invention is not limited thereto.

[0065] Please refer to Figure 1A to Figure 1B After forming the first type semiconductor material layer 811, part of the second type semiconductor material layer 813, the light emitting material layer 812, the first type semiconductor material layer 811 and the first conductive material layer 814 can be removed to expose part of the substrate 830. And, a patterned second type semiconductor layer 113, a patterned light emitting layer 112, a patterned first type semiconductor layer 111 and a patterned first conductive layer 114 are formed accordingly. The removal method of the above film layers can be selected by those familiar with this technology, and the present invention is not limited thereto.

[0066] Please continue to refer to Figure 1BAfter patterning the second-type semiconductor layer 113, the light-emitting layer 112, the first-type semiconductor layer 111, and the first conductive layer 114, a patterned insulating layer 115 is formed. For example, the patterned insulating layer 115 may cover the sidewalls of the first-type semiconductor layer 111, the light-emitting layer 112, the second-type semiconductor layer 113, and the first conductive layer 114, and the portion of the substrate 830 exposed by the first-type semiconductor layer 111, the light-emitting layer 112, and the second-type semiconductor layer 113, but the present invention is not limited thereto.

[0067] The material or formation method of the patterned insulating layer 115 can be selected by those skilled in the art, and the present invention is not limited thereto.

[0068] Please continue to refer to Figure 1B After forming the patterned insulating layer 115, a first electrode 116 and a second electrode 117 are formed. The first electrode 116 is electrically connected to the first-type semiconductor layer 111. The second electrode 117 is electrically connected to the second-type semiconductor layer 113. In one embodiment, the first electrode 116 and the first-type semiconductor layer 111 may be electrically connected via the corresponding first conductive layer 114, but the present invention is not limited thereto.

[0069] In addition, for the sake of clarity, Figure 1B The subsequent diagrams do not show all the first-type semiconductor layers 111 , light-emitting layers 112 , second-type semiconductor layers 113 , first conductive layers 114 , patterned insulating layers 115 , first electrodes 116 , second electrodes 117 or other similar components or corresponding positions.

[0070] Please refer to Figure 1B to Figure 1C After forming the first electrode 116 and the second electrode 117 , a filling material layer 841 is formed on the substrate 830 .

[0071] In the present embodiment, the material of the filling material layer 841 may include benzocyclobutene (BCB), cycloolefins, polyimides, polyamides, polyesters, polyols, polyethylene oxides, polyphenyls, resins, polyethers, polyketones, other similar polymers or combinations of the aforementioned materials, so that in a subsequent process, the filling material layer 841 can be removed by an etching reagent. The method of forming or removing the filling material layer 841 can be selected by those skilled in the art, and the present invention is not limited thereto.

[0072] Please continue to refer to Figure 1C After forming the filling material layer 841, the carrier 130 may be disposed on the filling material layer 841. In one embodiment, a corresponding adhesive material may be provided between the carrier 130 and the filling material layer 841, but the present invention is not limited thereto.

[0073] Please refer to Figure 1C to Figure 1D After the carrier 130 is configured, the substrate 830 may be removed. Figure 1C The structure shown in FIG. 8 is rotated or flipped upside down, and then the substrate 830 is removed.

[0074] In the present embodiment, after the substrate 830 is removed, the upper surface 113 a of the second-type semiconductor layer 113 (ie, the surface farthest from the first-type semiconductor layer 111 ) may be exposed.

[0075] Please refer to Figure 1D to Figure 1E After removing the substrate 830, a portion of the filling material layer 841 (indicated at Figure 1D For example, a portion of the filling material layer 841 (indicated by Figure 1D ) to form a thinner filling material layer 842 (indicated at Figure 1E In this way, the surface 842 a of the filling material layer 842 can be made lower than the upper surface 113 a of the second-type semiconductor layer 113 .

[0076] In this embodiment, after removing part of the filling material layer 841 (indicated at Figure 1D ), a portion of the patterned insulating layer 115 may be removed before or during the step of removing the patterned insulating layer 115. That is, the patterned insulating layer 115 may not substantially cover the thinner filling material layer 842 (indicated by Figure 1E ) surface 824a.

[0077] In one embodiment, a portion of the patterned insulating layer 115 may be removed by dry etching, wet etching, laser drilling or grinding, but the present invention is not limited thereto.

[0078] In the present embodiment, the surface 842 a of the filling material layer 842 is substantially parallel to the upper surface 113 a of the second-type semiconductor layer 113 , but the present invention is not limited thereto.

[0079] Please refer to Figure 1E to Figure 1F , removing a portion of the filling material layer 842 to expose a portion of the carrier 130. For example, one or more openings or grooves 843 penetrating the filling material layer 842 may be formed by dry etching, wet etching, laser drilling, or mechanical drilling.

[0080] Please refer to Figure 1F to Figure 1G After removing part of the filling material layer 842 to expose part of the carrier 130, a fixed material layer 820 can be formed on the second type semiconductor layer 113 and the filling material layer 842. The fixed material layer 820 can extend from the upper surface 113a of the second type semiconductor layer 113 to the surface of the filling material layer 842, and further fill the opening or groove 843 (marked at Figure 1F ) to connect to the carrier 130. The material or formation method of the fixing material layer 820 can be selected by those skilled in the art, and the present invention is not limited thereto.

[0081] In this embodiment, the material of the fixing material layer 820 may be different from the material of the filling material layer 842. For example, in this embodiment, the material of the fixing material layer 820 may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, or a combination thereof, but the present invention is not limited thereto.

[0082] Please refer to Figure 1G to Figure 1H After forming the fixed material layer 820, the filling material layer 842 is removed. The method of removing the filling material layer 842 can be selected by those familiar with the technology, and the present invention is not limited thereto. For example, the filling material layer 842 can be removed by wet etching.

[0083] In this embodiment, after the filling material layer 842 is removed, in the absence of external force, part or all of the fixing material layer 820 can be used as a fixing structure 120 for support or fixing.

[0084] After the above processes, the manufacture of the micro-module structure 100 of this embodiment can be substantially completed.

[0085] Figure 1H The present invention may be a partial cross-sectional schematic diagram of a micro-component structure according to an embodiment of the present invention. Fig. 1I It can be a partial top view of a micro-component structure according to an embodiment of the present invention. For example, Fig. 1I It can be corresponding to Figure 1H Schematic top view of the middle region R1.

[0086] Please refer to Figures 1H to 1I, the micro-component structure 100 includes a component 110 and a fixing structure 120. The component 110 may have an upper surface 110a, a lower surface 110b, a first side surface 110c and a second side surface 110d. The lower surface 110b is opposite to the upper surface 110a. The first side surface 110c is opposite to the second side surface 110d. The opposite ends of the first side surface 110c are respectively connected to one side of the upper surface 110a and one side of the lower surface 110b. The opposite ends of the second side surface 110d are respectively connected to the other side of the upper surface 110a and the other side of the lower surface 110b. The fixing structure 120 includes a connecting portion 125 and a first transition portion 121. The connecting portion 125 extends at least from the upper surface 110a of the component 110 to the first side surface 110c to connect the component 110. The first transition portion 121 is connected to the connecting portion 125. The first transition portion 121 may extend outward (i.e., away from the component 110) from the first side surface 110c of the component 110 along the first extension direction 121d. The first transition portion 121 is between the upper surface 110a and the lower surface 110b. In this embodiment, the component 110 may include a first-type semiconductor layer 111, a light-emitting layer 112, a second-type semiconductor layer 113, and a patterned insulating layer 115.

[0087] In this embodiment, the first extension direction 121d may be substantially parallel to the upper surface 110a.

[0088] In this embodiment, a width 121w of the first turning portion 121 is between 0.1 micrometers (μm) and 20 μm.

[0089] In this embodiment, the thickness 121h of the first turning portion 121 is less than 3 μm.

[0090] In this embodiment, the connecting portion 125 may further extend from the upper surface 110a of the component 110 to the second side surface 110d to connect the component 110. In addition, the fixing structure 120 may further include a second turning portion 122. The second turning portion 122 is connected to the connecting portion 125, and the second turning portion 122 is different from the first turning portion 121. The second turning portion 122 may extend outward (i.e., in a direction away from the component 110) from the second side surface 110d of the component 110 along a second extension direction 122d. The second turning portion 122 is between the upper surface 110a and the lower surface 110b.

[0091] In this embodiment, the second extension direction 122d may be substantially parallel to the upper surface 110a.

[0092] In this embodiment, the width 122w of the second turning portion 122 is between 0.1 μm and 20 μm.

[0093] In this embodiment, the thickness 122h of the second turning portion 122 is less than 3 μm.

[0094] In one embodiment, the first turning portion 121 and / or the second turning portion 122 may be referred to as a protruding structure.

[0095] In this embodiment, there is a first distance h1 between the upper surface 110a of the component 110 and the protruding structure (the first turning portion 121 and / or the second turning portion 122), and there is a third distance h3 between the upper surface 110a of the component 110 and the lower surface 110b, and the third distance h3 is greater than the first distance h1. In this way, it is possible to prevent the fixed structure layer from protruding from the lower surface 110b of the component 110 (the electrode surface of the first electrode 116 or the second electrode 117), so as to reduce the possibility that the first electrode 116 or the second electrode 117 cannot be effectively bonded to the electrode on the target substrate when the component 110 is bonded.

[0096] In this embodiment, the component 110 may be disposed on the carrier 130 via the fixing structure 120 .

[0097] In this embodiment, there is a second distance h2 between the lower surface 110b of the component 110 and the carrier 130, and the first distance h1 is greater than the second distance h2. In this way, the component 110 can be prevented from hitting the vertical fixing structure 120 when pressed down during suction, which can cause a decrease in suction yield.

[0098] In this embodiment, the fixing structure 120 further includes a first supporting portion 123. The first supporting portion 123 is connected to the first transition portion 121, and the first supporting portion 123 is connected to the carrier 130. The first supporting portion 123 may have a third extending direction 123d. The third extending direction 123d is different from the first extending direction 121d.

[0099] In this embodiment, the height of the first support portion 123 is greater than the distance between the component 110 and the carrier 130. In other words, the distance between the surface 130a of the carrier 130 and the first transition portion 121 is greater than the second distance h2 between the surface 130a of the carrier 130 and the lower surface 110b of the component 110. In this way, an air gap can be provided between the component 110 and the carrier 130. In other words, there can be a space between the component 110 and the carrier 130 that is not occupied by a physical object.

[0100] In this embodiment, the fixing structure 120 may further include a second supporting portion 124. The second supporting portion 124 is connected to the second transition portion 122, and the second supporting portion 124 is connected to the carrier 130. The second supporting portion 124 may have a fourth extending direction 124d. The fourth extending direction 124d is different from the second extending direction 122d.

[0101] In this embodiment, the height of the second support portion 124 is greater than the distance between the component 110 and the carrier 130. That is, the distance between the surface 130a of the carrier 130 and the second transition portion 122 is greater than the shortest distance between the surface 130a of the carrier 130 and the lower surface 110b of the component 110.

[0102] In this embodiment, the fixing structure 120 is a continuous structure, that is, the connecting portion 125, the first transition portion 121, the first supporting portion 123, the part of the continuous structure located on the second side surface 110d of the component 110 (e.g., part of the connecting portion 125), the second transition portion 122 and the second supporting portion 124 are made of substantially the same material.

[0103] In this embodiment, the component 110 is a micro LED (micro LED; μLED). For example, when viewed from above (eg: Fig. 1I The component 110 is a micro light emitting diode having a size of about (1 μm-100 μm)×(1 μm-100 μm) when viewed in the direction shown.

[0104] In the present embodiment, the upper surface 110 a of the component 110 may be a surface 113 a of the second-type semiconductor layer 113 away from the first-type semiconductor layer 111 , but the present invention is not limited thereto.

[0105] In this embodiment, the first side surface 110 c and the second side surface 110 d of the component 110 may be partial surfaces of the patterned insulating layer 115 .

[0106] In the present embodiment, at least a portion of the lower surface 110 b of the component 110 may be a portion of the surface of the patterned insulating layer 115 away from the upper surface 110 a , but the present invention is not limited thereto.

[0107] In this embodiment, the component 110 may further include a first conductive layer 114 , but the present invention is not limited thereto.

[0108] In this embodiment, the component 110 may include a first electrode 116 and a second electrode 117. At least a portion of the lower surface 110b of the component 110 may be a portion of the surface of the first electrode 116 away from the upper surface 110a. At least a portion of the lower surface 110b of the component 110 may be a portion of the surface of the second electrode 117 away from the upper surface 110a. However, the present invention is not limited thereto.

[0109] Figure 2A 1 is a partial top view of a micro-module structure according to another embodiment of the present invention. The micro-module structure 200 of this embodiment is similar to the micro-module structure 100 of the first embodiment, and the same or similar components are represented by the same or similar reference numerals, and have similar functions, materials or configurations, and description thereof is omitted.

[0110] Please refer to Figure 1H and Figure 2A The micro-component structure 200a includes a component 110 and a fixing structure 120. In addition, the fixing structure 120 includes a connecting portion 125 and a first transition portion 121. The connecting portion 125 extends from at least the upper surface 110a of the component 110 to the first side surface 110c. The first transition portion 121 is connected to the connecting portion 125. The first transition portion 121 can extend outward (i.e., in a direction away from the component 110) from the first side surface 110c of the component 110 along a first extension direction 121d.

[0111] The fixing structure 120 of this embodiment is similar to the above-mentioned fixing structure 120, except that: when viewed from above (e.g.: Figure 2A The connecting portion 125 is located between the first electrode 116 and the second electrode 117 when viewed from the direction shown.

[0112] Other micromodule structures 200b, 200c, 200d, 200e, 200f, 200g, which are similar to the micromodule structure 100 or the micromodule structure 200a, can be as follows Figures 2B to 2G shown.

[0113] like Figure 2B As shown, from the top view, in the micromodule structure 200b, the fixing structure 120 is a plurality of structures separated from each other and dispersed around the module 110. The fixing structure 120 can be located at the four sides, four corners or a combination thereof of the module 110. A portion of each structure in the fixing structure 120 is connected to the module 110, and another portion of each structure in the fixing structure 120 extends to the outside of the module 110. Figure 2B As shown, when viewed from above, the fixing structure 120 may be a pattern having point symmetry and / or plane symmetry.

[0114] like Figure 2C As shown, when viewed from above, in the micro-component structure 200c, the fixing structure 120 is a single structure. The fixing structure 120 may include a first portion and a plurality of second portions. The first portion covers the upper surface 110a of the component 110. The second portion extends to the outside of the component 110 (e.g., extending from the upper surface 110a of the component 110 to the side surface 110c, and extending outward from the side surface of the component 110). The first portion of the fixing structure 120 does not cover the entire upper surface 110a of the component 110. Each second portion may be connected to the first portion, respectively. Figure 2C As shown, when viewed from above, the fixing structure 120 may be a pattern having a point-symmetric form.

[0115] like Figure 2D As shown, when viewed from above, in the micro-component structure 200d, the fixing structure 120 is a single structure. The fixing structure 120 may include a first portion and a plurality of second portions. The first portion covers the upper surface 110a of the component 110. The second portion extends to the outside of the component 110 (e.g., extending from the upper surface 110a of the component 110 to the side surface 110c, and extending outward from the side surface of the component 110). The first portion of the fixing structure 120 does not cover the entire upper surface 110a of the component 110. Each second portion may be connected to the first portion, respectively. Figure 2D As shown, when viewed from above, the fixing structure 120 may be a pattern having point symmetry and / or plane symmetry.

[0116] like Figure 2E As shown, when viewed from above, in the micro-component structure 200e, the fixing structure 120 is a single structure. The fixing structure 120 may include a first portion and a second portion. The first portion covers the upper surface 110a of the component 110. The second portion extends to the outside of the component 110 (e.g., extending from the upper surface 110a of the component 110 to the side surface 110c, and extending outward from the side surface of the component 110). The first portion of the fixing structure 120 covers the entire upper surface 110a of the component 110. The second portion may surround the first portion. Figure 2E As shown, when viewed from above, the fixing structure 120 may be a pattern having point symmetry and / or plane symmetry.

[0117] like Figure 2F As shown, viewed from above, in the micro-component structure 200f, the fixed structure 120 is a single structure. The fixed structure 120 may include a first portion and a plurality of second portions. The first portion covers the upper surface 110a of the component 110. The second portion extends to the outside of the component 110 (e.g., extending from the upper surface 110a of the component 110 to the side surface 110c, and extending outward from the side surface of the component 110). The first portion of the fixed structure 120 does not cover the entire upper surface 110a of the component 110. The first portion of the fixed structure 120 may have pattern openings of circular, square or other shapes. Each second portion may be connected to the first portion, respectively. As Figure 2F As shown, when viewed from above, the fixing structure 120 may be a pattern having point symmetry and / or plane symmetry.

[0118] like Figure 2GAs shown, viewed from above, in the micro-component structure 200g, the fixing structure 120 is a single structure. The fixing structure 120 may include a first portion and a second portion. The first portion covers the upper surface 110a of the component 110. The second portion extends to the outside of the component 110 (e.g., extending from the upper surface 110a of the component 110 to the side surface 110c, and extending outward from the side surface of the component 110). The first portion of the fixing structure 120 does not cover the entire upper surface 110a of the component 110. The first portion of the fixing structure 120 may have patterned openings of circular, square, or other shapes. The second portion may surround the first portion. As shown in FIG. Figure 2G As shown, when viewed from above, the fixing structure 120 may be a pattern having point symmetry and / or plane symmetry.

[0119] FIG. 3A to FIG. 3C It is a partial cross-sectional schematic diagram of a partial manufacturing method of a display device according to an embodiment of the present invention.

[0120] Please refer to Fig. 1I and Figure 3A , a micro-component structure is provided. In this embodiment, the provided micro-component structure is based on the micro-component structure 100 of the first embodiment as an example, and therefore, in the subsequent descriptions and markings, the micro-component structure 100 of the first embodiment is used as an exemplary representation. In addition, the same or similar components are represented by the same or similar reference numerals, and have similar functions, materials or configurations, and the description is omitted. However, in other embodiments not shown, the provided micro-component structure may be other micro-component structures similar to the micro-component structure 100 of the first embodiment (e.g., the micro-component structure 200 of the second embodiment).

[0121] Please refer to Figure 3A The component 110 in the micro-component structure 100 can be extracted by the transfer apparatus 500. For example, the pick-and-place apparatus 600 can extract the component 110 from the upper surface 110a of the component 110 (eg, the surface of the fixing material layer 820).

[0122] It is worth noting that the present invention does not limit the type of the pick-and-place device 600. Figure 3A or Figure 3B ) only schematically illustrates a portion of the pick-and-place device 600. That is, the way the pick-and-place device 600 is illustrated in the diagram does not limit the appearance, type, quantity, sample, or pick-and-place method of the pick-and-place device 600.

[0123] Please refer to FIG. 3A to FIG. 3BDuring the pressing or extracting process of the pick-and-place device 600, stress is generated between the component 110 and the carrier 130, and the aforementioned stress causes a corresponding crack in the fixing structure 120 between the component 110 and the carrier 130, so that the component 110 can be separated from the carrier 130 and can be transferred.

[0124] In this embodiment, the first extension direction 121d of the first turning portion 121 and / or the second extension direction 122d of the second turning portion 122 are substantially parallel to the upper surface 110a of the component 110. Thus, during the pressing or extraction process of the pick-and-place device 600, since the direction of the aforementioned stress is substantially perpendicular to the first extension direction 121d and / or the second extension direction 122d, it is easier to cause a corresponding fracture at a certain point of the first turning portion 121 and / or a certain point of the second turning portion 122, thereby improving the speed or yield of the extraction process.

[0125] In this embodiment, the width 121w of the first turning portion 121 (indicated at Fig. 1I , Figure 2A ) is between 0.1 μm and 20 μm, and / or the thickness 121h of the first turning portion 121 (indicated at Figure 1H ) is less than 3 μm; and / or, the width 122w of the second turning portion 122 is between 0.1 μm and 20 μm (indicated at Fig. 1I , Figure 2A ), and / or the thickness 122h of the second turning portion 122 (indicated at Figure 1H ) is less than 3 μm. In this way, during the pressing or extraction process of the pick-and-place device 600, it is easier to cause a corresponding fracture at a certain point of the first turning portion 121 and / or a certain point of the second turning portion 122, thereby improving the speed or yield of the extraction process.

[0126] Please refer to Figure 3B In this embodiment, after the first turning portion 121 is fractured at a certain position by the pick-and-place device 600, the fixed structure 120' remaining on the component 110 still basically extends from the upper surface 110a of the component 110 to the first side surface 110c, and the fixed structure 120' remaining on the component 110 basically includes a first turning portion 121' extending outward from the first side surface 110c, wherein the first turning portion 121' is located between the upper surface 110a and the lower surface 110b. In other words, the component 110 and the fixed structure 120' can still be referred to as a micro-component structure 100'. Here, the end of the first turning portion 121' away from the first side surface 110c is suspended. In other words, the end of the first turning portion 121' away from the first side surface 110c is a free end.

[0127] In this embodiment, the end of the first turning portion 121 ′ away from the first side surface 110 c has an irregular surface, but the present invention is not limited thereto.

[0128] Similarly, in this embodiment, the fixing structure 120' may also include a second transition portion 122' extending outward from the second side surface 110d', wherein the second transition portion 122' is located between the upper surface 110a and the lower surface 110b. Here, the end of the second transition portion 122' away from the second side surface 110d is suspended. In other words, the end of the second transition portion 122' away from the second side surface 110d is a free end.

[0129] Similarly, in this embodiment, the end of the second turning portion 122 ′ away from the second side surface 110 d has an irregular surface.

[0130] Please refer to FIG. 3B to FIG. 3C , the component 110 can be placed on the circuit board 330 via the pick-and-place device 600. Then, the component 110 can be electrically connected to the corresponding circuit (not shown) in the circuit board 330.

[0131] In this embodiment, the lower surface 110b of the component 110 can be made to face the circuit board 330, so that the first electrode 116 and the second electrode 117 of the component 110 are electrically connected to the corresponding circuits (not shown) in the circuit board 330. In addition, since the fixing structure 120' extends from the upper surface 110a of the component 110 to the first side surface 110c and the second side surface 110d, and the first turning portion 121' and / or the second turning portion 122' are between the upper surface 110a and the lower surface 110b, the influence of the fixing structure 120' on the component 110 and / or the circuit board 330 can be reduced when or after the component 110 is arranged on the circuit board 330.

[0132] In this embodiment, the circuit board 330 may be a hard board or a soft board, but the present invention is not limited thereto.

[0133] In this embodiment, the circuit board 330 may further include active components (such as transistors), passive components (such as capacitors, resistors or inductors) or other suitable electronic components, but the present invention is not limited thereto.

[0134] In this embodiment, the component 110 and the circuit board 330 may be electrically connected to each other via a conductive connection member 350. The conductive connection member 350 may include a conductive pillar, a solder ball, a conductive bump, a conductive sheet, a conductive glue, a conductive film, a conductive member having other forms or shapes, or a combination thereof, but the present invention is not limited thereto.

[0135] In this embodiment, the components 310 and 310' can be disposed on the circuit board 330 in the same, similar or different manner as described above. In addition, the present invention does not limit the arrangement order of the components 110, 310 and 310'.

[0136] In this embodiment, the component 310 and / or the component 310' is a micro light emitting diode, but the present invention is not limited thereto. In this embodiment, the components 110, 310 and 310' can emit different colors, but the present invention is not limited thereto.

[0137] After the above processes, the display device 300 of this embodiment can be substantially manufactured.

[0138] Figure 3C It may be a partial cross-sectional schematic diagram of a display device according to an embodiment of the present invention.

[0139] Please refer to Figure 3C The display device 300 includes a component 110 and a first transition portion 121'. The first transition portion 121' is between the upper surface 110a and the lower surface 110b. The first transition portion 121' extends outward from the first side surface 110c of the component 110. The width 121w of the first transition portion 121' is between 0.1μm and 10μm, and the thickness 121h of the first transition portion 121' is less than 3μm. The component 110 of the display device 300 is a micro light emitting diode.

[0140] Figure 4 is a partial cross-sectional schematic diagram of a micro-component structure according to an embodiment of the present invention.

[0141] In the micro-component structure 400 of the present embodiment, the lower surface 110 b of the component 110 may be a surface of the second-type semiconductor layer 113 away from the first-type semiconductor layer 111 ; or, a portion of the upper surface 110 a of the component 110 may be a portion of the surface of the patterned insulating layer 115 , the first electrode 116 and / or the second electrode 117 away from the second-type semiconductor layer 113 .

[0142] Figure 5 is a partial cross-sectional schematic diagram of a micro-component structure according to an embodiment of the present invention.

[0143] In the micro-component structure 500 of this embodiment, the upper surface 110 a of the component 110 may be a partial surface of the first electrode 116 ; or, the lower surface 110 b of the component 110 may be a partial surface of the second electrode 117 .

[0144] In summary, the components of the micro-component structure or display device according to an embodiment of the present invention can be efficiently transferred during the manufacturing or application process.

[0145] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A micro-component structure, characterized in that: include: A component having an upper surface, a lower surface and a first side surface, wherein the lower surface is opposite to the upper surface, and the first side surface connects the upper surface and the lower surface; as well as A fixing structure comprises a connecting portion and a first turning portion, wherein the connecting portion extends from at least the upper surface of the component to the first side surface, the first turning portion contacts to connect the first end of the connecting portion and extends outward from the first side surface to be away from the first side surface, wherein the first end of the connecting portion is located on the first side surface between the upper surface and the lower surface, and there is a distance between the end of the first turning portion away from the first side surface and the first side surface.

2. The micromodule structure according to claim 1, characterized in that: The width of the first turning portion is between 0.1 μm and 10 μm, and / or the thickness of the first turning portion is less than 3 μm.

3. The micromodule structure according to claim 1, characterized in that: The fixing structure is made of the same material.

4. The micromodule structure according to claim 1, characterized in that: The fixed structure is a continuous structure.

5. The micromodule structure according to claim 1, characterized in that: The fixing structure exposes a portion of the upper surface.

6. The micromodule structure according to claim 1, characterized in that: The extending direction of the first turning portion is substantially parallel to the upper surface of the component.

7. The micromodule structure according to claim 1, characterized in that: There is a first distance between the upper surface and the first turning portion, there is a third distance between the upper surface and the lower surface, and the third distance is greater than the first distance.

8. The micromodule structure according to claim 1, characterized in that: Also includes: A carrier, wherein the component is arranged on the carrier via the fixing structure.

9. The micromodule structure according to claim 8, characterized in that: An air gap is provided between the component and the carrier board.

10. The micromodule structure according to claim 8, characterized in that: The fixing structure further includes a first supporting portion connected to the first turning portion, and the first supporting portion is connected to the carrier plate.

11. The micromodule structure according to claim 10, characterized in that: The extending direction of the first turning portion is different from the extending direction of the first supporting portion.

12. The micromodule structure according to claim 10, characterized in that: The height of the first supporting portion is greater than the distance between the component and the carrier board.

13. A micro-module structure, characterized in that: include: A component having an upper surface, a lower surface and a first side surface, wherein the lower surface is opposite to the upper surface, and the first side surface connects the upper surface and the lower surface; as well as A fixing structure comprises a connecting portion and a first turning portion, wherein the connecting portion extends from at least the upper surface of the component to the first side surface, the first turning portion contacts to connect the first end of the connecting portion and extends outward from the first side surface to be away from the first side surface, wherein the first end of the connecting portion is located on the first side surface between the upper surface and the lower surface, and wherein the fixing structure exposes a portion of the first side surface away from the upper surface.

14. A micro-component structure, characterized in that: include: A component having an upper surface, a lower surface and a first side surface, wherein the lower surface is opposite to the upper surface, and the first side surface connects the upper surface and the lower surface; as well as A fixing structure comprises a connecting portion and a first turning portion, wherein the connecting portion extends at least from the upper surface of the component to the first side surface, the first turning portion contacts to connect the first end of the connecting portion and extends outward from the first side surface to be away from the first side surface, wherein the first end of the connecting portion is located on the first side surface between the upper surface and the lower surface, and the first turning portion is suspended away from the end of the first side surface.

15. A micro-module structure, characterized in that: include: A component having an upper surface, a lower surface and a first side surface, wherein the lower surface is opposite to the upper surface, and the first side surface connects the upper surface and the lower surface; as well as A fixing structure comprises a connecting portion and a first turning portion, wherein the connecting portion extends at least from the upper surface of the component to the first side surface, the first turning portion contacts to connect the first end of the connecting portion and extends outward from the first side surface to be away from the first side surface, wherein the first end of the connecting portion is located on the first side surface between the upper surface and the lower surface, and wherein the end of the first turning portion away from the first side surface has an irregular surface.

16. A micromodule structure, characterized in that: include: A component having an upper surface, a lower surface and a first side surface, wherein the lower surface is opposite to the upper surface, and the first side surface connects the upper surface and the lower surface; as well as A fixing structure, comprising a connecting portion and a first turning portion, wherein the connecting portion extends at least from the upper surface of the component to the first side surface, the first turning portion contacts to connect the first end of the connecting portion and extends outward from the first side surface to be away from the first side surface, wherein the first end of the connecting portion is located on the first side surface between the upper surface and the lower surface, wherein the component also has a second side surface, the second side surface connects the upper surface and the lower surface, the second side surface is relative to the first side surface, the fixing structure also extends from the upper surface of the component to the second side surface, the fixing structure also comprises a second turning portion extending outward from the second side surface, wherein the second turning portion contacts to connect the second end of the connecting portion and extends outward from the second side surface to be away from the second side surface, wherein the second end of the connecting portion is located on the second side surface between the upper surface and the lower surface.

17. A display device, characterized in that: include: A micro light-emitting component having an upper surface, a lower surface and a first side surface, wherein the lower surface is opposite to the upper surface, and the first side surface connects the upper surface and the lower surface; as well as A fixing structure includes a connecting portion and a first turning portion, wherein the connecting portion at least extends from the upper surface of the micro-light-emitting component to the first side surface, the first turning portion contacts to connect the first end of the connecting portion and extends outward from the first side surface to be away from the first side surface, wherein the first end of the connecting portion is located on the first side surface between the upper surface and the lower surface, and the first turning portion is suspended away from the end of the first side surface.

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