Integrated multi-stage liquid cooling machine case

Abstract

The application relates to an integrated hierarchical liquid cooling machine case, and belongs to the technical field of heat dissipation equipment, and solves the problems of large volume of a liquid cooling system of a military liquid cooling machine case and limited use occasions in the prior art. The application comprises a liquid cooling frame, a gas-liquid heat exchange assembly and a liquid cooling module, the gas-liquid heat exchange assembly and the liquid cooling module are arranged in the liquid cooling frame. The application realizes efficient heat dissipation of the machine case by combining air cooling and liquid cooling, does not need to be equipped with a liquid cooling source, and has small volume and light weight of the liquid cooling system, and is suitable for various occasions.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation equipment, and particularly relates to an integrated hierarchical liquid cooling case. BACKGROUND

[0002] With the development trend of miniaturization, high integration and high power consumption of military information processing technology, the heat flux density of electronic equipment is getting higher and higher. The traditional air-cooled case has appeared a heat dissipation bottleneck, and the local temperature is too high, which has become the main reason for the performance degradation or even failure of electronic equipment. Compared with the traditional air-cooled technology, liquid cooling has the advantages of high heat dissipation efficiency, low energy consumption, easy temperature control and the like, and is considered as one of the effective ways to solve the heat dissipation problem of high heat flux density electronic components in the future.

[0003] At present, the liquid cooling case of 19 inches standard in the market mainly adopts the conduction type liquid cooling mode, and the heat dissipation capacity is limited. The through type liquid cooling refers to the liquid cooling medium penetrating into the module cavity, which can greatly improve the heat dissipation efficiency, but the structure of the through type liquid cooling module is relatively complex, the cost is high and the universality is poor. Secondly, the current military liquid cooling case adopts the external liquid cooling mode, and the liquid cooling equipment must be externally connected with a liquid cooling source through a liquid cooling pipeline to work normally. This will cause the problems of large volume, heavy weight and limited use occasions of the whole liquid cooling system. SUMMARY

[0004] In view of the above analysis, the embodiment of the present application aims to provide an integrated hierarchical liquid cooling case to solve the problems of large volume and limited use occasions of the liquid cooling system of the existing military liquid cooling case.

[0005] The present application provides an integrated hierarchical liquid cooling case, which comprises a liquid cooling frame, a gas-liquid heat exchange assembly and a liquid cooling module, wherein the gas-liquid heat exchange assembly and the liquid cooling module are arranged in the liquid cooling frame.

[0006] Further, the liquid cooling frame comprises a first liquid cooling plate, a second liquid cooling plate and a third liquid cooling plate, and the first liquid cooling plate and the second liquid cooling plate are in communication with the third liquid cooling plate.

[0007] Further, the first liquid cooling plate and the second liquid cooling plate are symmetrically arranged on two sides of the liquid cooling frame, and the third liquid cooling plate is perpendicular to the first liquid cooling plate and the second liquid cooling plate.

[0008] Further, S-shaped flow channels are arranged in the first liquid cooling plate and the second liquid cooling plate, and a water tank is arranged in the third liquid cooling plate.

[0009] Further, the S-shaped flow channels are in communication with the water tank.

[0010] Further, the gas-liquid heat exchange assembly comprises a fan and a gas-liquid heat exchanger, and the fan is arranged on the gas-liquid heat exchanger.

[0011] Further, the gas-liquid heat exchanger is in communication with the water tank.

[0012] Further, the liquid cooling module comprises a through liquid cooling module and a conduction liquid cooling module, and the through liquid cooling module and the conduction liquid cooling module are arranged between the first liquid cooling plate and the second liquid cooling plate.

[0013] Further, the inner cavity of the through liquid cooling module is in communication with the S-shaped flow channel of the first liquid cooling plate.

[0014] Further, the gas-liquid heat exchanger assembly and the liquid cooling module are respectively located at two ends of the liquid cooling case.

[0015] Compared with the prior art, the present application can achieve at least one of the following beneficial effects:

[0016] (1) The gas-liquid heat exchanger assembly and the liquid cooling module are arranged in the case, and the combination of air cooling and liquid cooling is used to realize efficient heat dissipation of the case, solving the problems of the traditional liquid cooling case, such as the need to be equipped with a liquid cooling source, resulting in a large volume and heavy weight of the overall liquid cooling system, and limited use occasions;

[0017] (2) The partition plate is arranged in the interior of the liquid cooling frame, and the gas-liquid heat exchanger assembly is independent of the liquid cooling module and the electrical connector, so that the gas-liquid heat exchanger assembly has an independent space, and the liquid cooling module and the plug-in connector are not in direct contact with air, improving the three-proofing performance and electromagnetic shielding performance of the equipment;

[0018] (3) The first liquid cooling plate and the second liquid cooling plate are provided with S-shaped flow channels, and the S-shaped flow channels are uniformly distributed with fins for heat dissipation, increasing the heat dissipation area and improving the heat dissipation effect;

[0019] (4) The third liquid cooling plate is provided with a water tank, and the water tank is provided with cooling liquid for heat dissipation of the liquid cooling case, reducing the setting of the liquid cooling source, and further reducing the volume and weight of the liquid cooling system;

[0020] (5) The third liquid cooling plate integrates the water tank, the plurality of liquid flow channels, the liquid pump interface, the liquid injection port and the liquid discharge port, realizes the circulation work of the liquid cooling system, and has a compact structure and is convenient to process;

[0021] (6) The through liquid cooling module not only dissipates heat through the cooling liquid passing through the module cavity, but also dissipates heat through liquid cooling conduction through the guide rail, greatly improving the heat dissipation effect of the module;

[0022] (7) The application adopts a hierarchical heat dissipation mode, the conventional modules can still adopt the conduction heat dissipation form, and the high heat consumption processing modules can adopt the combination of the through liquid cooling and the conduction liquid cooling, the heat dissipation capacity of a single module can be improved to 300W, the versatility of the equipment is stronger, the cost is lower, and the heat dissipation performance is stronger.

[0023] The above technical solutions can be combined with each other in the application to realize more preferred combination solutions. Other features and advantages of the application will be described in the subsequent description, and some advantages will become apparent from the description, or will be understood by implementing the application. The purposes and other advantages of the application can be realized and obtained from the contents particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings:

[0025] Figure 1 Structure schematic view of a liquid cooling machine case without a case cover plate for the specific embodiment;

[0026] Figure 2 Overall structure schematic view of a liquid cooling machine case for the specific embodiment;

[0027] Figure 3 Structure schematic view of a first liquid cooling plate for the specific embodiment;

[0028] Figure 4 Structure schematic view of a second liquid cooling plate for the specific embodiment;

[0029] Figure 5 Structure schematic view of the internal structure of a third liquid cooling plate for the specific embodiment;

[0030] Figure 6 Structure schematic view of a gas-liquid heat exchange assembly for the specific embodiment;

[0031] Figure 7 Structure schematic view of a through liquid cooling module for the specific embodiment;

[0032] Figure 8 Structure schematic view of a liquid cooling machine case for the specific embodiment 3.

[0033] Reference signs:

[0034] 1-liquid cooling frame; 11-first liquid cooling plate; 111-first flow channel; 112-first guide groove; 113-first liquid inlet; 114-first liquid outlet; 115-first fin; 116-first module liquid outlet; 12-second liquid cooling plate; 121-second flow channel; 122-second guide groove; 123-second liquid inlet; 124-second liquid outlet; 125-second fin; 126-second module liquid outlet;

[0035] 13-third liquid cooling plate; 131-water tank; 1311-drainage port; 1312-liquid pump interface; 132-first liquid flow channel; 133-second liquid flow channel; 134-third liquid flow channel; 135-fourth liquid flow channel; 136-fifth liquid flow channel; 137-liquid injection port; 14-side plate; 15-blind plug fluid connection seat; 16-separation plate;

[0036] 2-gas-liquid heat exchange assembly; 21-fan; 22-gas-liquid heat exchanger; 23-fixing plate; 3-liquid cooling module; 31-penetrating liquid cooling module; 311-assistant puller; 312-locking strip; 313-blind plug fluid connection head; 32-conducting liquid cooling module; 41-first cover plate; 411-air inlet; 412-air outlet; 42-second cover plate; 43-third cover plate; 5-micro liquid pump. DETAILED DESCRIPTION

[0037] The preferred embodiments of the present application will be described in detail below with reference to the drawings, which form a part of this description. The drawings, together with the description, explain the principles of the application, and the preferred embodiments demonstrate the application.

[0038] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly defined and limited, the term "connected" should be interpreted broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected, it can be mechanically connected, or electrically connected, it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above-mentioned term in the present application can be understood according to the specific circumstances.

[0039] The terms "top", "bottom", "above", "under" and "on" used throughout the description are relative positions of the components of the device, for example, the relative positions of the top and bottom substrates inside the device. It can be understood that the device is multifunctional, regardless of their orientation in space.

[0040] Embodiment 1

[0041] One specific embodiment of the present application is as follows: Figure 1As shown, a one-piece hierarchical liquid cooling machine case is disclosed, comprising a liquid cooling frame 1, a gas-liquid heat exchange assembly 2 and a liquid cooling module 3, the gas-liquid heat exchange assembly 2 and the liquid cooling module 3 are arranged in the liquid cooling frame 1.

[0042] Compared with the prior art, the one-piece hierarchical liquid cooling machine case provided by the embodiment integrates the liquid cooling system in the case, realizes efficient heat dissipation and high integration of the case by combining air cooling and liquid cooling, solves the problems of the traditional liquid cooling case, such as the need to equip the liquid cooling source, the large volume and heavy weight of the overall liquid cooling system, and the limited use occasions.

[0043] In order to create a clean working environment for the components inside the one-piece hierarchical liquid cooling machine case, reduce the influence of dust, particles and other impurities on the internal electrical devices, and also for the safety of the operation of the one-piece hierarchical liquid cooling machine case, the hierarchical liquid cooling machine case further comprises a case cover plate arranged on the side of the liquid cooling frame 1.

[0044] As shown in Figure 2 , the case cover plate comprises a first cover plate 41, a second cover plate 42, a third cover plate 43 and a fourth cover plate, the first cover plate 41 and the second cover plate 42 are arranged in parallel on the front and rear sides of the liquid cooling frame 1, the third cover plate 43 and the fourth cover plate are symmetrically and parallelly arranged on the upper and lower sides of the liquid cooling frame 1, and the first cover plate 41 is perpendicular to the third cover plate 43.

[0045] It is worth noting that the second cover plate 42 and the fixing plate 23 of the gas-liquid heat exchange assembly 2 are jointly arranged at the rear end of the liquid cooling machine case. The second cover plate 42, the third cover plate 43 and the fourth cover plate have equal lengths.

[0046] In the embodiment, the first cover plate 41 is arranged on the front side of the liquid cooling frame 1, the second cover plate 42 is arranged on the rear side of the liquid cooling frame 1, the third cover plate 43 is arranged on the rear end of the upper side of the liquid cooling frame 1, and the fourth cover plate is arranged on the rear end of the lower side of the liquid cooling frame 1.

[0047] It should be noted that the third cover plate 43 is provided with a ventilation hole, and the ventilation hole is opposite to the gas-liquid heat exchange assembly 2.

[0048] The liquid cooling frame 1 is the overall frame of the one-piece hierarchical liquid cooling machine case, and the internal space of the liquid cooling frame 1 is used to accommodate the gas-liquid heat exchange assembly 2 and the liquid cooling module 3. The gas-liquid heat exchange assembly 2 and the liquid cooling module 3 are integrated in the interior of the one-piece hierarchical liquid cooling machine case, and the one-piece hierarchical liquid cooling machine case is cooled by combining air cooling of the gas-liquid heat exchange assembly 2 and liquid cooling of the liquid cooling module 3, thereby reducing the use of the liquid cooling source and the volume and weight of the liquid cooling system.

[0049] Specifically, as shown in Figure 1 , Figure 2As shown, the liquid cooling frame 1 includes a first liquid cooling plate 11, a second liquid cooling plate 12, a third liquid cooling plate 13, and a side plate 14. The first liquid cooling plate 11 and the second liquid cooling plate 12 are symmetrically arranged on both sides of the liquid cooling frame 1, and the third liquid cooling plate 13 and the side plate 14 are symmetrically arranged on both sides of the liquid cooling frame 1. The first liquid cooling plate 11 and the second liquid cooling plate 12 are arranged in parallel, and the third liquid cooling plate and the side plate 14 are arranged in parallel.

[0050] Further, the first liquid cooling plate 11 is coplanar with the third cover plate 43 and together constitutes the first side of the integrated hierarchical liquid cooling cabinet, and the second liquid cooling plate 12 is coplanar with the fourth cover plate and together constitutes the second side of the integrated hierarchical liquid cooling cabinet. The third liquid cooling plate 13 and the side plate 14 are the third side and the fourth side of the integrated hierarchical liquid cooling cabinet respectively, and together with the first cover plate 41, the second cover plate 42 and the fixed plate 23, form the external structure of the integrated hierarchical liquid cooling cabinet.

[0051] Notably, one end of the third liquid cooling plate 13 and the side plate 14 is provided with a ventilation hole.

[0052] In this embodiment, the first liquid cooling plate 11 is located at the front end of the upper side of the integrated hierarchical liquid cooling cabinet, and the second liquid cooling plate 12 is located at the front end of the lower side of the integrated hierarchical liquid cooling cabinet, and is just butted against the third cover plate 43 and the fourth cover plate, forming the upper and lower sides of the integrated hierarchical liquid cooling cabinet. The third liquid cooling plate 13 and the side plate 14 are located on the left and right sides of the integrated hierarchical liquid cooling cabinet respectively.

[0053] In this embodiment, the first liquid cooling plate 11 and the second liquid cooling plate 12 have equal widths and are equal to the width of the first cover plate 41. The first liquid cooling plate 11, the second liquid cooling plate 12, the third liquid cooling plate 13 and the side plate 14, and the first cover plate 41, the second cover plate 42, the third cover plate 43, the fourth cover plate and the fixed plate 23 together constitute the shell of the integrated hierarchical liquid cooling cabinet. The gas-liquid heat exchange assembly 2 and the liquid cooling module 3 are arranged in the shell, which reduces the influence of dust, particles and other impurities on the internal components of the integrated hierarchical liquid cooling cabinet, and makes the appearance of the integrated hierarchical liquid cooling cabinet neat.

[0054] It should be noted that the second cover plate 42 and the fixed plate 23 have equal lengths and are coplanar, together forming the rear side of the liquid cooling cabinet. The fixed plate 23 is arranged above the second cover plate 42, i.e. the gas-liquid heat exchange assembly 2 is arranged above the internal space of the liquid cooling cabinet.

[0055] In order to improve the three-proofing performance and electromagnetic shielding performance of the integrated hierarchical liquid cooling cabinet, as shown in the drawings, Figure 1 As shown, the liquid cooling frame 1 further includes a partition plate 16, which is arranged inside the liquid cooling frame 1 and parallel to the first cover plate 41. The partition plate 16 separates the gas-liquid heat exchange assembly 2 from the liquid cooling module 3 and the electrical connector, improving the three-proofing performance and electromagnetic shielding performance of the equipment.

[0056] In order to facilitate the heat dissipation of the integrated hierarchical liquid cooling case, as shown in Figure 3 , the first liquid cooling plate 11 is internally provided with a first flow channel 111, the first flow channel 111 is S-shaped, one side of the first liquid cooling plate 11 is provided with a first guide groove 112, and the first guide groove 112 is used for placing the liquid cooling module 3.

[0057] Further, one end of the first liquid cooling plate 11 is provided with a first liquid inlet 113 and a first liquid outlet 114, and the first liquid inlet 113 and the first liquid outlet 114 are in communication with the first flow channel 111. In this embodiment, as shown in Figure 3 , the first liquid inlet 113 and the first liquid outlet 114 are both located at the right end of the first liquid cooling plate 11, and when the first liquid cooling plate 11 is installed on the liquid cooling frame 1, the end provided with the first liquid inlet 113 and the first liquid outlet 114 is adjacent to the third liquid cooling plate 13, so that the first liquid cooling plate 11 is connected in series with the third liquid cooling plate 13.

[0058] In order to increase the heat dissipation area, the first flow channel 111 is provided with first fins 115 for heat dissipation, and the first fins 115 are uniformly distributed in the first flow channel 111.

[0059] In this embodiment, by providing the S-shaped first flow channel 111 in the first liquid cooling plate 11, the cooling liquid travels in an S shape in the first liquid cooling plate 11, and the cooling liquid fully contacts the first liquid cooling plate 11 to take away heat. The first fins 115 are uniformly distributed in the S-shaped first flow channel 111, which increases the heat dissipation area and further improves the heat dissipation effect of the first liquid cooling plate 11.

[0060] The tail end of the S-shaped first flow channel 111 is provided with a plurality of parallel first module liquid outlets 116, the first module liquid outlets 116 are provided with blind plug type fluid connection seats 15, and the blind plug type fluid connection seats 15 are connected with the liquid cooling module 3.

[0061] In order to further improve the heat dissipation effect of the integrated hierarchical liquid cooling case, as shown in Figure 4 , the second liquid cooling plate 12 is internally provided with a second flow channel 121, the second flow channel 121 is S-shaped, one side of the second liquid cooling plate 12 is provided with a second guide groove 122, and the second guide groove 122 is used for placing the liquid cooling module 3.

[0062] Further, one end of the second liquid cooling plate 12 is provided with a second liquid inlet 123 and a second liquid outlet 124, and the second liquid inlet 123 and the second liquid outlet 124 are in communication with the second flow channel 121. In this embodiment, as shown in Figure 4 , the second liquid inlet 123 and the second liquid outlet 124 are both located at the right end of the second liquid cooling plate 12, and when the second liquid cooling plate 12 is installed on the liquid cooling frame 1, the end provided with the second liquid inlet 123 and the second liquid outlet 124 is adjacent to the third liquid cooling plate 13, so that the second liquid cooling plate 12 is connected in series with the third liquid cooling plate 13.

[0063] In order to further increase the heat dissipation area, the second fins 125 for heat dissipation are arranged in the second flow channel 121, and the second fins 125 are uniformly arranged in the second flow channel 121.

[0064] In the embodiment, the S-shaped second flow channel 121 is arranged in the second liquid cooling plate 12, so that the cooling liquid travels in an S shape in the second liquid cooling plate 12, the cooling liquid is fully in contact with the second liquid cooling plate 12 to carry away heat, the second fins 125 are uniformly arranged in the S-shaped second flow channel 121, the heat dissipation area is increased, and the heat dissipation effect of the second liquid cooling plate 12 is further improved.

[0065] The tail end of the S-shaped second flow channel 121 is provided with a plurality of parallel second module liquid outlets 126, the blind plug type fluid connection seat 15 is installed at the second module liquid outlet 126, and the blind plug type fluid connection seat 15 is connected with the liquid cooling module 3.

[0066] In the embodiment, the first liquid inlet 113, the first liquid outlet 114, the second liquid inlet 123 and the second liquid outlet 124 are arranged opposite to each other, the first liquid cooling plate 11 and the second liquid cooling plate 12 are fixed on the third liquid cooling plate 13 through screws and sealing strips, and the first liquid cooling plate 11 and the second liquid cooling plate 12 are connected in series through the third liquid cooling plate 13. The first liquid cooling plate 11 and the second liquid cooling plate 12 are fastened to the side plate 14 by means of sealing strips and screws, so that the convenience of subsequent cooling plate maintenance and replacement is ensured, and the cost is lower.

[0067] It is worth noting that the first guide groove 112 of the first liquid cooling plate 11 and the second guide groove 122 of the second liquid cooling plate 12 are arranged opposite to each other, and the through-type liquid cooling module 31 is arranged in the space formed by the first guide groove 112 and the second guide groove 122 arranged opposite to each other.

[0068] It is worth noting that the first liquid cooling plate 11 and the second liquid cooling plate 12 are mirror-symmetric structures.

[0069] As shown in Figure 5 The water tank 131 is arranged in the third liquid cooling plate 13, and the cooling liquid is arranged in the water tank 131, so that the setting of the external liquid cooling source is reduced, and the volume and weight of the liquid cooling system are reduced.

[0070] The third liquid cooling plate 13 is further provided with a first liquid flow channel 132, a second liquid flow channel 133, a third liquid flow channel 134, a fourth liquid flow channel 135 and a fifth liquid flow channel 136. The top of the third liquid cooling plate 13 is provided with a liquid injection port 137, and the first liquid flow channel 132 is connected with the liquid injection port 137 and the water tank 131. The second liquid flow channel 133 is arranged at the lower part of the third liquid cooling plate 13 and is used for connecting the second liquid cooling plate 12 and the micro liquid pump 5, and the micro liquid pump 5 is connected with the water tank 131. The third liquid flow channel 134 is arranged at the side of the third liquid cooling plate 13 away from the gas-liquid heat exchange assembly 2 and is used for connecting the first liquid cooling plate 11 and the second liquid cooling plate 12. The fourth liquid flow channel 135 is arranged at the upper part of the third liquid cooling plate 13 and is used for connecting the first liquid cooling plate 11 and the gas-liquid heat exchange assembly 2. The fifth liquid flow channel 136 is connected with the gas-liquid heat exchange assembly 2 and the water tank 131.

[0071] The lower end of the water tank 131 is provided with a liquid discharge port 1311 and a liquid pump interface 1312. The liquid discharge port 1311 is used when the cooling liquid in the water tank 131 is replaced, and the liquid pump interface 1312 is connected with the micro liquid pump 5.

[0072] The micro liquid pump 5 is fixed to the inner side of the third liquid cooling plate 13 through a sealing strip and a screw, and provides power for the circulation of the cooling liquid.

[0073] In the embodiment, the third liquid cooling plate 13 is designed in an integrated manner, and the water tank 131, the plurality of liquid flow channels, the liquid pump interface 1312, the liquid injection port 137 and the liquid discharge port 1311 are designed in an integrated manner, so that the circulation of the liquid cooling system is realized, and the structure is compact and convenient to process.

[0074] The gas-liquid heat exchange assembly 2 is located at the rear side of the liquid cooling frame 1, as shown in Figure 6 The gas-liquid heat exchange assembly 2 includes a fan 21, a gas-liquid heat exchanger 22 and a fixing plate 23. A plurality of fans 21 are arranged on the gas-liquid heat exchanger 22, the gas-liquid heat exchanger 22 is arranged on the fixing plate 23, the fans 21 face the partition plate 16, and the gas-liquid heat exchanger 22 is connected with the third liquid cooling plate 13 through a hose.

[0075] In the embodiment, the gas-liquid heat exchange assembly 2 has an independent space, and the functional modules (i.e. the liquid cooling module 3 in the embodiment) and connectors are not directly contacted with the ambient air. This structure greatly improves the three-proof performance and electromagnetic shielding performance of the integrated hierarchical liquid cooling case, and the gas-liquid heat exchange assembly 2 has the advantages of easy disassembly and replacement.

[0076] The liquid cooling module 3 includes a through-type liquid cooling module 31 and a conduction-type liquid cooling module 32, and the through-type liquid cooling module 31 and the conduction-type liquid cooling module 32 are arranged in the internal space of the liquid cooling frame 1.

[0077] As shown in Figure 7As shown, the through liquid cooling module 31 is provided with a puller 311 and a locking strip 312, the puller 311 is rotationally connected with the locking strip 312, and the through liquid cooling module 31 can be quickly plugged and unplugged. The guide rail end of the through liquid cooling module 31 is provided with a blind insertion type fluid connector 313, the blind insertion type fluid connector 313 is connected with the blind insertion type fluid connection seat 15, and the through liquid cooling module 31 is provided with a flow channel in the cavity, so that the heat dissipation of the high heat chip can be enhanced. The guide rail of the through liquid cooling module 31 is connected with the guide groove of the first liquid cooling plate 11 and the second liquid cooling plate 12.

[0078] In the embodiment, the through liquid cooling module 31 not only dissipates heat through the cooling liquid passing through the module cavity, but also dissipates heat through the liquid cooling conduction of the guide rail, thereby greatly improving the heat dissipation effect of the module.

[0079] In the embodiment, the conduction liquid cooling module 32 has similar size to the through liquid cooling module 31, and is also provided with a puller and a locking strip, but lacks a blind insertion type fluid connector and a flow channel in the cavity. The conduction liquid cooling module 32 conducts heat to the guide rail of the first liquid cooling plate 11 and the second liquid cooling plate 12 through the aluminum alloy cavity.

[0080] The liquid adding process of the integrated hierarchical liquid cooling machine case is as follows: the cooling liquid is added from the liquid injection port 137 of the liquid cooling machine case, when the liquid level of the water tank 131 reaches 4 / 5, the micro liquid pump 5 is started and the liquid adding is continued, when the cooling liquid in the liquid cooling machine case is stably circulated and the liquid level of the water tank 131 reaches 4 / 5 again, the liquid adding is stopped, and the water injection cover is screwed on.

[0081] The liquid discharging process of the integrated hierarchical liquid cooling machine case is as follows: the liquid injection port 137 and the liquid discharging port 1311 are opened at the same time, and the liquid in the first liquid cooling plate 11, the second liquid cooling plate 12 and the water tank 131 is discharged by gravity or a liquid suction device.

[0082] The working process of the embodiment is as follows: the cooling liquid enters the micro liquid pump 5 from the water tank 131, part of the cooling liquid is branched to the first liquid cooling plate 11 through the third liquid cooling plate 13 after flowing through the second liquid cooling plate 12, and absorbs the heat conducted by the guide rail of the liquid cooling module 3; the other part of the cooling liquid is branched to the first liquid cooling plate 11 through the through liquid cooling module 31, and directly absorbs the heat conducted by the chip, the high-temperature cooling liquid after confluence flows out from the first liquid cooling plate 11, enters the gas-liquid heat exchanger 22 through the third liquid cooling plate 13 and the hose, and the cooling liquid after being cooled by the fan 21 flows back to the water tank 131, thereby completing the liquid cooling circulation of the whole machine.

[0083] The embodiment adopts integrated design, and one liquid cooling source is less than that of a conventional liquid cooling case during work, so that the volume and weight of the equipment are greatly reduced, the height is reduced from 8U to 6U compared with the traditional air cooling case, the heat dissipation case of the whole machine is improved from 550W to 1200W, not only the volume is reduced, but also the heat dissipation capacity is more than doubled.

[0084] The embodiment adopts a hierarchical mode, and the conventional module can still adopt the conduction heat dissipation form, and the high heat consumption processing module can adopt the combination of the through liquid cooling and the conduction liquid cooling, the heat dissipation capacity of a single module can be improved to 300W, the equipment is more universal, the cost is lower, and the heat dissipation performance is stronger.

[0085] The embodiment adopts a partition design mode, and the functional module and the gas-liquid heat exchanger are separated, so that the electromagnetic shielding performance and the waterproof performance of the case are greatly improved.

[0086] Embodiment 2

[0087] Another specific embodiment of the application discloses an integrated hierarchical liquid cooling case, which is different from the embodiment 1 in that the first liquid cooling plate 11, the second liquid cooling plate 12, the third liquid cooling plate 13 and the side plate 14 are not fixedly connected through screws and sealing strips but are formed by welding, so that the integrated liquid cooling rack is made, and the reliability is higher. The other structures and beneficial effects are the same as those of the embodiment 1, and will not be repeated here.

[0088] Embodiment 3

[0089] Another specific embodiment of the application discloses an integrated hierarchical liquid cooling case, which is different from the embodiment 1 in that, as shown in the figure, Figure 8 the height of the case is increased, the height of the first cover plate 41 is increased as an air inlet 411, the middle partition plate 16 is removed, the cooling air enters from the air inlet 411, passes through the fan 21 and the gas-liquid heat exchanger 22, and is discharged from the rear air outlet 412. The other structures and beneficial effects are the same as those of the embodiment 1, and will not be repeated here.

[0090] The application adopts integrated design, integrates the gas-liquid heat exchange assembly, the micro pump, the water tank and the like in a 19-inch standard single machine, adopts hierarchical liquid cooling design, the high heat consumption module adopts the combination of the through liquid cooling and the conduction liquid cooling, the conventional module adopts the conduction liquid cooling mode, not only the heat dissipation problem of the high power consumption module is solved, but also the normal use of the conventional module is considered, the equipment is universal, the heat dissipation performance is strong, and the cost is low.

[0091] The above merely describes preferred specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. An integrated multi-stage liquid cooling chassis, characterized by, The liquid cooling frame, the gas-liquid heat exchange assembly and the liquid cooling module are arranged in the liquid cooling frame; the liquid cooling frame comprises a first liquid cooling plate, a second liquid cooling plate, a third liquid cooling plate and a partition plate, and the first liquid cooling plate and the second liquid cooling plate are in communication with the third liquid cooling plate; S-shaped flow channels are arranged in the first liquid cooling plate and the second liquid cooling plate, and a water tank is arranged in the third liquid cooling plate, and the S-shaped flow channels are in communication with the water tank; The inner side of the third liquid cooling plate is provided with a micro liquid pump in communication with the water tank; the third liquid cooling plate is further provided with a first liquid flow channel, a second liquid flow channel, a third liquid flow channel, a fourth liquid flow channel and a fifth liquid flow channel; the second liquid flow channel is arranged at the lower part of the third liquid cooling plate and is used for connecting the second liquid cooling plate and the micro liquid pump; the third liquid flow channel is arranged at the side of the third liquid cooling plate away from the gas-liquid heat exchange assembly and is used for connecting the first liquid cooling plate and the second liquid cooling plate; the fourth liquid flow channel is arranged at the upper part of the third liquid cooling plate and is used for connecting the first liquid cooling plate and the gas-liquid heat exchange assembly; the fifth liquid flow channel connects the gas-liquid heat exchange assembly and the water tank; the top of the third liquid cooling plate is provided with a liquid injection port, and the first liquid flow channel connects the liquid injection port and the water tank; the lower end of the water tank is provided with a liquid discharge port and a liquid pump interface in communication with the micro liquid pump; The integrated hierarchical liquid cooling machine case is a military 19-inch standard liquid cooling machine case, the partition plate is arranged in the interior of the liquid cooling frame and separates the gas-liquid heat exchange assembly from the liquid cooling module and the electrical connector; the liquid cooling module comprises a through-type liquid cooling module and a conduction-type liquid cooling module, which are arranged in the interior space of the liquid cooling frame, the guide rail of the through-type liquid cooling module is connected with the guide groove of the first liquid cooling plate and the second liquid cooling plate, and the conduction-type liquid cooling module conducts heat to the guide rail of the first liquid cooling plate and the second liquid cooling plate through an aluminum alloy cavity.

2. The integrated liquid-cooled hierarchical computer chassis of claim 1, wherein, The first liquid cooling plate and the second liquid cooling plate are symmetrically arranged on the two sides of the liquid cooling frame, and the third liquid cooling plate is perpendicular to the first liquid cooling plate and the second liquid cooling plate.

3. The integrated liquid-cooled hierarchical computer chassis of claim 1, wherein, The gas-liquid heat exchange assembly comprises a fan and a gas-liquid heat exchanger, and the fan is arranged on the gas-liquid heat exchanger.

4. The integrated liquid-cooled hierarchical computer chassis of claim 3, wherein, The gas-liquid heat exchanger is in communication with the water tank.

5. The integrated liquid-cooled hierarchical computer chassis of claim 1, wherein, The through-type liquid cooling module and the conduction-type liquid cooling module are arranged between the first liquid cooling plate and the second liquid cooling plate.

6. The integrated liquid-cooled hierarchical computer chassis of claim 5, wherein, The inner cavity of the through-type liquid cooling module is in communication with the S-shaped flow channel of the first liquid cooling plate.

7. The integrated multi-stage liquid chiller cabinet of any of claims 1-6, wherein, The gas-liquid heat exchange assembly and the liquid cooling module are respectively located at the two ends of the liquid cooling machine case.

Images