Lighting module and lighting device comprising the same

Abstract

The lighting module disclosed in the embodiments of the present application includes a circuit board, a plurality of light emitting devices arranged on the circuit board in a first direction, a resin layer for sealing the plurality of light emitting devices, and a reflective member provided on a surface of the resin layer and having an opening portion on one side thereof, wherein the resin layer includes an exit surface portion in which the opening portion is provided, a curved surface portion on an opposite side of the exit surface portion, and an upper surface portion provided on the curved surface portion and the exit surface portion, the light emitting devices overlap the curved surface portion in a vertical direction, the upper surface portion of the resin layer has a horizontal surface, a vertical direction width of the opening portion is smaller than a vertical direction height of the exit surface portion, and the light emitting devices can be arranged closer to a lower end of the curved surface portion than to a lower end of the exit surface portion.

Description

Technical Field

[0001] Embodiments of the present invention relate to an illumination module that illuminates a surface in the lateral direction. Embodiments of the present invention also relate to an illumination device having an illumination module, illumination unit, or vehicle lamp. Background Technology

[0002] Compared to traditional light sources such as fluorescent and incandescent lamps, light-emitting diodes (LEDs) offer advantages such as low power consumption, semi-permanent lifespan, fast response time, and safety and environmental friendliness. These LEDs are used in various lighting devices, such as displays, indoor and outdoor lights. Recently, LED-based lamps have been proposed as vehicle light sources. Compared to incandescent lamps, LEDs have the advantage of low power consumption. Furthermore, the small size of LEDs increases design freedom and their semi-permanent lifespan makes them economical. Summary of the Invention

[0003] Technical issues

[0004] Embodiments of the present invention can provide a lighting module capable of improving the luminous intensity and focusing efficiency of light emitted to one side. Embodiments of the present invention provide a lighting module that provides one or more surface lights on one side. Embodiments of the present invention can provide a lighting module for illuminating surface lights, as well as a lighting device, lighting unit, liquid crystal display device, or vehicle lamp having the lighting module.

[0005] Technical solution

[0006] An illumination module according to an embodiment of the present invention includes: a circuit board; a plurality of light-emitting devices arranged on the circuit board along a first direction; a resin layer sealing the plurality of light-emitting devices; and a reflective member disposed on the surface of the resin layer and having an opening on one side of the resin layer, wherein the resin layer includes: an emission surface having the opening thereon; a curved surface opposite to the emission surface; and an upper surface disposed on the curved surface and the emission surface, wherein the light-emitting devices overlap the curved surface in a vertical direction, and the light-emitting devices overlap a portion of the reflective member disposed on the emission surface in a horizontal direction, wherein the upper surface of the resin layer has a horizontal plane, the vertical width of the opening is smaller than the vertical height of the emission surface, and the light-emitting devices can be configured to be closer to the lower end of the curved surface than the lower end of the emission surface.

[0007] According to an embodiment of the present invention, the reflective member includes a first reflective portion disposed on a curved portion of the resin layer, a second reflective portion disposed on a first upper surface portion, and a third reflective portion disposed on an exiting portion and having an opening. The third reflective portion may be disposed below the exiting portion, and the height of the upper end of the third reflective portion may be set to be higher than the height of the upper end of the light-emitting device. The curved portion or the first reflective portion may have a parabolic shape. A reflective layer may be included between the resin layer and the circuit board, and a diffuser layer disposed on the exiting portion may be included.

[0008] According to an embodiment of the present invention, a reflector is disposed between the light-emitting device and the emitting surface, and the upper end of the reflector may be higher than the upper surface of the light-emitting device and less than or equal to 50% of the maximum thickness of the resin layer. The distance between the emitting surface and the light-emitting device may be greater than the distance between the reflector and the light-emitting device.

[0009] The lighting module according to an embodiment of the present invention includes: a circuit board; a plurality of light-emitting devices arranged on the circuit board along a first direction; a resin layer sealing the plurality of light-emitting devices; and a reflective member disposed on the surface of the resin layer and having an opening on one side, wherein the light-emitting devices include a plurality of first light-emitting devices disposed in a first row and a plurality of second light-emitting devices disposed in a second row, wherein the resin layer includes a first resin portion sealing the first light-emitting devices and providing a first emission surface, and a second resin portion sealing the second light-emitting devices and providing a second emission surface, wherein the reflective member includes: a first reflective member having a first opening on the first emission surface and disposed on the first resin portion; and a second reflective member having a second opening on the second emission surface and disposed between the first resin portion and the second resin portion.

[0010] According to an embodiment of the present invention, the first resin portion includes a first curved portion opposite to the second emission portion and a first upper surface portion disposed on the first curved portion and the first emission portion, the second resin portion includes a second curved portion opposite to the second emission portion and a second upper surface portion disposed on the upper portion of the second curved portion and the second emission portion, and a portion of the reflective member may be disposed on at least a portion of the first emission portion and the second emission portion.

[0011] According to an embodiment of the present invention, a first light-emitting device overlaps with a first curved surface in the vertical direction, a first upper surface portion and a second upper surface portion have horizontal planes, and the first light-emitting device may be configured to be closer to the lower end of the first curved surface portion than the lower end of the first emitting surface portion. A second emitting surface portion may be disposed above the first emitting surface portion. A diffuser layer may be included disposed on at least one of the first emitting surface portion and the second emitting surface portion.

[0012] Beneficial effects

[0013] According to embodiments of the present invention, the luminous intensity and light collection efficiency in the lighting module can be improved. According to embodiments of the present invention, a lighting module suitable for the center luminous intensity of daytime running lights can be provided, and the light extraction efficiency of the lighting module can be improved.

[0014] The optical reliability of the lighting module and the lighting device having the lighting module can be improved according to embodiments of the present invention. Furthermore, the present invention can be applied to vehicle lighting devices having lighting modules, lighting units, various types of display devices, surface light source lighting devices, or vehicle lamps. Attached Figure Description

[0015] Figure 1 This is a perspective view showing a lighting module according to a first embodiment of the present invention.

[0016] Figure 2 yes Figure 1 An example of a front view of a lighting module.

[0017] Figure 3 yes Figure 1 and Figure 2 Example of a side sectional view of the lighting module.

[0018] Figures 4 to 6 yes Figure 3 Example of a modified lighting module.

[0019] Figure 7 This is a side sectional view of the lighting module according to a second embodiment of the present invention.

[0020] Figure 8 yes Figure 7 An example of a front view of a lighting module.

[0021] Figures 9 to 11 yes Figure 7 Example of a modified lighting module.

[0022] Figure 12 This is an example of an illumination module having another example of a reflective member according to an embodiment of the present invention.

[0023] Figure 13 This is a plan view of a vehicle equipped with a lamp having a lighting module according to an embodiment of the present invention.

[0024] Figure 14 This is an example of a vehicle's front lighting device according to an embodiment of the present invention.

[0025] Figure 15 This is a diagram illustrating an example of a rear lighting device for a vehicle according to an embodiment of the present invention. Detailed Implementation

[0026] Preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings. The spirit of the invention is not limited to the embodiments described herein and can be implemented in various other forms. One or more components may be selectively combined and substituted within the scope of the spirit of the invention. Furthermore, the terminology used in the embodiments of the invention (including technical and scientific terms) is to be interpreted in a way that is generally understood by one of ordinary skill in the art to which this invention pertains, unless specifically defined and explicitly described, and common terms such as those defined in dictionaries should be interpretable in light of the context of prior art. Moreover, the terminology used in the embodiments of the invention is for explaining the embodiments and is not intended to limit the invention. In this specification, the singular form may also include the plural form unless explicitly stated otherwise in the wording, and where A and (with) at least one (or more) of B, C are stated, it may include one or more of all combinations that can be combined with A, B, and C. In describing components of embodiments of the invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, order, or process of the corresponding constituent elements cannot be determined by the term. Furthermore, when describing a component as "connected," "joined," or "engaged" to another component, this description can include not only direct connection, joining, or engagement to the other component, but also connection, joining, or engagement via another component between the component and the other component. Additionally, when describing something as formed or disposed "above" or "below" each component, this description includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or disposed between the two components. Furthermore, when expressed as "above" or "below," it can refer to the downward and upward directions relative to an element. The lighting device according to the invention can be applied to various lighting devices requiring illumination, such as automotive lights, household lighting devices, or industrial lighting devices. For example, when applied to automotive lights, the lighting device can be applied to headlights, side lights, rearview mirror lights, fog lights, taillights, brake lights, daytime running lights, interior lighting, door scarves, rear combination lights, reversing lights, etc. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various electric vehicle fields. In addition, it can be applied to all lighting-related or advertising-related fields that are currently being developed and commercialized or that may be realized according to future technological developments.

[0027] <First Embodiment>

[0028] Figure 1 This is a perspective view showing a lighting module according to a first embodiment of the present invention. Figure 2 yes Figure 1Example of a front view of a lighting module, Figure 3 yes Figure 1 and Figure 2 Example of a side sectional view of the lighting module. Figures 4 to 6 yes Figure 3 Example of a modified lighting module.

[0029] Reference Figures 1 to 3 According to an embodiment of the present invention, the lighting module 100 includes a circuit board 11, a light-emitting device 21 disposed on the circuit board 11, a resin layer 31 disposed on the upper surface of the circuit board 11 for sealing the light-emitting device 21, reflective members 60 disposed on the upper surface and a plurality of side surfaces of the resin layer 31, and an opening 65 having at least a partial opening on one side of the reflective member 60. The opening 65 may be a region where a portion of the resin layer 31 is exposed, or it may be a region where other light-transmitting members are exposed.

[0030] The light-emitting devices 21 can be arranged in at least one row on the circuit board 11. The light-emitting devices 21 can emit light of the same color, or at least two or more can emit light of different colors. The light emitted from the light-emitting devices 21 can emit at least one or more of blue, green, red, and yellow. The illumination module 100 can emit light emitted from the light-emitting devices 21 as surface light. The illumination module 100 can illuminate the surface light emitted from the light-emitting devices 21 in a side-view configuration. Because the illumination module 100 is configured as a side-view surface light, hot spots can be prevented, and light collection efficiency and luminous intensity can be improved. The thickness of the illumination module 100 can be in the range of more than 10 mm from the bottom of the circuit board 11, in the range of 10 mm to 20 mm, or in the range of 10 mm to 15 mm. The thickness of the illumination module 100 can be the straight-line distance between the lower surface of the circuit board 11 and the uppermost surface of the reflective member 60. The illumination module 100 can be configured to have a thickness of less than 20 mm, and with such a thin thickness, the surface light can be emitted in a linear form, and the directional characteristics can be relatively wide.

[0031] In the lighting module 100, the circuit board 11 can serve as a substrate or support member located below the light-emitting device 21, the resin layer 31, and the reflective member 60. The circuit board 11 includes a printed circuit board (PCB). For example, the circuit board 11 may include at least one of a resin-based printed circuit board (PCB), a metal-core PCB, a flexible PCB, a ceramic PCB, or an FR-4 board. For example, the circuit board 11 may include a flexible PCB or a rigid PCB. The circuit board 11 may have a relatively long length in one direction, and its width in the direction perpendicular to the length direction may be less than that length.

[0032] The circuit board 11 may include a wiring layer (not shown), and the wiring layer may be electrically connected to the light-emitting device 21. A reflective material or protective layer disposed on the circuit board 11 may protect the wiring layer. The light-emitting devices 21 may be connected in series, in parallel, or in series-parallel configurations via the wiring layer of the circuit board 11. Among a plurality of light-emitting devices 21, two or more groups may be connected in series or in parallel, or groups may be connected in series or in parallel. The protective layer may include a component having a solder resist material, and the solder resist material is a white material and may reflect incident light. The thickness of the circuit board 11 may be less than 0.5 mm, for example, in the range of 0.3 mm to 0.5 mm. Because the thickness of the circuit board 11 is set thin, the thickness of the lighting module 100 is not increased. Because the circuit board 11 has a thickness of less than 0.5 mm, it can support a flexible module. A resin layer 31 may be formed on the circuit board 11, or the resin layer 31 may be formed on the circuit board 11 on which a reflective material layer or component is formed. Figure 4 As shown, the lighting module 100 may include a reflective layer 15 disposed on the upper surface of the circuit board 11. The reflective layer 15 can reflect light traveling onto the upper surface of the circuit board 11. The reflective layer 15 may be attached to the upper surface of the circuit board 11, or it may be disposed between the circuit board 11 and the resin layer 31. An adhesive layer may be formed between the reflective layer 15 and the circuit board 11, for example, a material such as UV adhesive, silicone resin, or epoxy resin. The reflective layer 15 may be a film made of any one of resin material, transparent PET, white polyethylene terephthalate (PET), and Ag sheet. Reflective dots may be disposed on the reflective layer 15 to reflect incident light. For example, the reflective dots may contain ink, which may be printed on a material containing any one of TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS. Here, the reflective layer 15 has an opening area, and a light-emitting device 21 may be disposed through the opening area. The reflective layer 15 may be formed on the entire upper surface of the circuit board 11, or it may be disposed below a region of the resin layer 31 of the circuit board 11. As another example, the circuit board 11 may include a transparent material. When the circuit board 11 is provided as being made of a transparent material, light emitted from the light-emitting device 21 can be emitted along both the upper and lower surfaces of the circuit board 11.

[0033] The light-emitting device 21 can be arranged in at least one row on the circuit board 11. As another example, the light-emitting device 21 can be arranged in multiple rows and / or columns. The light-emitting device 21 can be perpendicularly overlapped with the resin layer 31 and the reflective member 60. The light-emitting device 21 can be disposed in the resin layer 31 or can be sealed in the resin layer 31. The light-emitting device 21 can be implemented as a light-emitting chip, i.e., an LED, or can include a light-emitting chip and a wavelength conversion layer covering the light-emitting chip. Multiple pads can be exposed on the lower part of the light-emitting device 21, and light can be emitted through the upper surface and side surfaces. The wavelength conversion layer converts a portion of the light emitted from the light-emitting chip into wavelengths. The light-emitting chip can be configured as a blue LED chip. The light-emitting chip can be arranged in the form of a flip chip, a vertical chip, or a horizontal chip. The wavelength conversion layer can include at least one or more of red phosphors, yellow phosphors, and green phosphors. The thickness of the wavelength conversion layer can be less than 200 μm, for example, in the range of 100 μm to 200 μm. The thickness of the light-emitting chip can be less than 0.3 mm. As another example, at least one or more of the light-emitting devices 21 can emit light with the same or different wavelengths.

[0034] The resin material disposed on the circuit board 11 can be configured as at least one or more layers. The resin layer 31 is disposed on the light-emitting device 21 and can be made of a transparent resin material, such as UV (ultraviolet) resin, silicone resin, or epoxy resin. The resin layer 31 can be a layer containing or not containing a diffusing agent. The resin layer 31 can be configured to have a relatively long length in one direction, and the width of its lower surface can be less than that length, for example, less than 50% of that length. The circuit board 11 and the resin layer 31 can be configured as straight shapes, or partially or entirely of a curved shape in the longitudinal direction. Figure 3As shown, the width D3 of the upper surface of resin layer 31 can be smaller than the width D1 of the lower surface. The width D1 of the lower surface of resin layer 31 can be the maximum distance from one side surface of resin layer 31 to the opposite side surface, and the width D3 of the upper surface can be the distance from the upper end of one side surface to the upper end of the horizontally extending opposite side surface. One end of the lower surface and one end of the upper surface of resin layer 31 can be aligned on the same straight line, and the other end of the lower surface can be positioned further away from one side surface of resin layer 31 than the other end of the upper surface. The width D3 of the upper surface of resin layer 31 can be less than 90% of the width D1 of the lower surface, for example, in the range of 40% to 90%, or in the range of 50% to 80%. Since the width D3 of the upper surface of resin layer 31 is set to be narrower than the width D1 of the lower surface, light can be guided in the direction of the opening 65. Resin layer 31 may include a curved portion R1 and an upper surface portion R2. The curved portion R1 may have a predetermined curvature and may extend from the other end of the lower surface of resin layer 31 to the other end of the upper surface portion R2. The lower end of the curved surface R1 can be adjacent to the light-emitting device 21. That is, the light-emitting device 21 can be positioned closer to the other end than the lower end of the resin layer 31. The curved surface R1 can be formed in a parabolic shape. The light-emitting device 21 can be positioned at a location that overlaps with the curved surface R1 in the vertical direction. The central region between the upper and lower ends of the curved surface R1 can overlap with the opening 65 in the horizontal direction. The distance G1 between the lower end or the other end of the lower surface of the curved surface R1 and the center of the light-emitting device 21 is more than 9% of the width D1 of the lower surface of the resin layer 31, for example, in the range of 9% to 15%, or in the range of 9% to 13%. The distance G1 from the center of the light-emitting device 21 to the other end of the lower surface of the resin layer 31 can be less than 1 / 5 of the distance G2 from the lower end of the resin layer 31, for example, in the range of 1 / 5 to 1 / 8. The distance G1 can be less than 2.5 mm, for example, within the range of 1.8 mm to 2.5 mm, or within the range of 1.8 mm to 2.3 mm. When the distance G1 is narrower than the above range, the light extraction efficiency may decrease, while when the distance G1 is greater than the above range, the light extraction efficiency may decrease or the module width may increase. Here, the width of the lower surface of the resin layer 31 can be a first distance D1, the distance or minimum distance between the straight line perpendicular to the lower end of the curved surface R1 of the resin layer 31 and the upper end of the curved surface R1 can be a second distance D2, and the width of the upper surface portion R2 of the resin layer 31 can be a third distance D3. The distance G1 from the center of the light-emitting device 21 to the lower end of the curved surface R1 can be less than 0.5 of the second distance D2, for example, within the range of 0.2 to 0.4 or 0.2 to 0.35 of the second distance D2. The second distance D2 can be less than the third distance D3. The second distance D2 can be 1.2 or more of the third distance D3, for example, in the range of 1.2 to 2 of the third distance D3, or in the range of 1.2 to 1.5.Since the second distance D2 is arranged to be smaller than the third distance D3, the reflection efficiency can be improved by the area and curvature of the curved surface R1. The first distance D1 can be greater than 15mm, for example, in the range of 15mm to 25mm or 15mm to 20mm.

[0035] The upper surface portion R2 of the resin layer 31 can be configured as a flat surface. The area of ​​the upper surface portion R2 in the resin layer 31 can be smaller than the area of ​​the lower surface. The resin layer 31 may include an exit portion 35. The exit portion 35 may be a surface facing the opening 65 or a surface on which the opening 65 is formed. The exit portion 35 can extend vertically from one end of the lower surface of the resin layer 31 to one end of the upper surface portion R2. The surface of the exit portion 35 opposite to the opening 65 can be flat. As another example, the surface of the exit portion 35 opposite to the opening 65 can be a flat surface, while the other surface can be a curved surface, an inclined surface, or a stepped portion. The maximum thickness B1 of the resin layer 31 can be 8 mm or more, for example, in the range of 8 mm to 15 mm or in the range of 8 mm to 13 mm. Therefore, a reflective member 60 or a housing can be formed on the outer side of the exit portion 35 of the resin layer 31, and light can be focused or high brightness can be provided through the opening 65.

[0036] The reflective member 60 can be formed on both sides of the curved surface R1, the upper surface R2, the resin layer 31 in the longitudinal direction, and on the outer side of the emission surface 35, excluding the opening 65. The lower part of the reflective member 60 can contact the upper surface of the circuit board 11, or it can contact... Figure 4 and Figure 5The reflective layer 15 is in contact with the structure. A reflective member 60 can be formed on the surface of the resin layer 31 by a reflective member made of a metallic or non-metallic material. The metallic material can be formed of a material such as aluminum or silver. The non-metallic material can be at least one of resin material, transparent PET, and white polyethylene terephthalate (PET) material. The reflective member 60 can include any one of TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS within the resin. The thickness of the reflective member 60 can be formed to have a light reflectivity of 85% or more, for example, 90% or more. The reflective member 60 includes a first reflective portion 61 disposed on the curved surface R1 of the resin layer 31, a second reflective portion 62 disposed on the upper surface R2 of the resin layer 31, and a third reflective portion 63 disposed on the emitting surface 35 of the resin layer 31. The first reflective portion 61 can be formed on the entire surface of the curved surface R1. The second reflective portion 62 can extend from the first reflective portion 61 and can be formed on the entire surface of the upper surface R2. The third reflective portion 63 can be formed on the entire surface of the ejector face 35, excluding the opening 65. The third reflective portion 63 may include a first portion 63A extending from the second reflective portion 62 to the upper part of the ejector face 35 and a second portion 63B disposed below the ejector face 35. The opening 65 may be disposed between the first portion 63A and the second portion 63B. The first portion 63A and the second portion 63B may be formed on the ejector face 35 of the resin layer 31. In the vertical direction, the height B4 of the first portion 63A and the height B3 of the second portion 63B of the third reflective portion 63 may be the same height, or may have a difference of less than 10%. The sum of the heights B4 and B3 of the first portion 63A and the second portion 63B is equal to the width B2 of the opening 65, or may be within the range of 40% to 60% of the width B2 of the opening 65. That is, the width B2 of the opening 65 in the vertical direction can be less than 60% of the thickness (e.g., B1) of the emitting surface 35, for example, in the range of 40% to 60%, or in the range of 45% to 55%. The lower end of the opening 65 can be positioned within the range of less than 80% of the height of the emitting surface 35, for example, in the range of 70% to 80% or 72% to 78% of the height of the emitting surface 35. Therefore, the side surface of the light-emitting device 21 can face the second portion 63B and may not face the opening 65. The lower end of the opening 65 can be positioned higher than the upper surface of the light-emitting device 21. The height of the lower end of the opening 65 is the height of the second portion 63B relative to the upper surface of the circuit board 11, and can be more than 5 times the thickness of the light-emitting device 21, for example, in the range of 5 to 10 times or 5 to 7 times. Therefore, the amount of light directly emitted from the light-emitting device 21 through the opening 65 can be reduced. The height of Part 2, 63B, can be in the range of 2mm or more, for example, 2mm to 3mm.

[0037] like Figure 1 and Figure 2 As shown, the third reflective portion 63 may include a third portion 63C disposed on two side surfaces in the longitudinal direction of the emission portion 35 of the resin layer 31. The third portion 63C is connected to the first portion 63A and the second portion 63B, and the width of the third portion 63C may vary depending on the length of the opening 65. Figure 5 and Figure 6 As shown, reflector 15B can be formed in resin layer 31. Reflector 15B can be disposed between light-emitting device 21 and third reflective portion 63 of reflective member 60. Reflector 15B can be disposed on circuit board 11 or on reflective layer 15. Reflector 15B can have a longer length in one direction, and its lower surface can be formed to have a wider width than its upper end. Reflector 15B can have a polygonal side cross-section, for example, triangular or hemispherical. The distance G1 between the center of light-emitting device 21 and the other end of the lower surface of resin layer 31 (refer to...) Figure 3 The distance to the reflector 15B can be the same. Therefore, the position of the light-emitting device 21 can be set at the center between the lower end of the first reflective part 61 of the reflective member 60 and the reflector 15B, so that the reflection efficiency distribution of the light emitted from both sides of the light-emitting device 21 is similar.

[0038] The upper end of reflector 15B may perpendicularly overlap with the curved surface R1 of the first reflective portion 61 or resin layer 31 of reflective member 60. The upper end of reflector 15B may not perpendicularly overlap with the second reflective portion 62 or upper surface R2 of resin layer 31 of reflective member 60. The upper end of reflector 15B may correspond to a position adjacent to the boundary portion between the first reflective portion 61 and the second reflective portion 62 of reflector 60. The distance between reflector 15B and light-emitting device 21 may be less than the distance between the emitting surface 35 and reflector 15B. Therefore, light emitted towards one side of light-emitting device 21 can be effectively reflected, and light extraction efficiency or loss can be reduced. The upper end height B5 of reflector 15B may be set higher than the upper surface of light-emitting device 21. The upper end of reflector 15B may be set higher than the lower end of opening 65. The upper end height B5 of reflector 15B may be less than 50% of the maximum height B1 of emitting surface 35, and may be greater than or equal to the upper end height B3 of second portion 63B. The upper end of reflector 15B can be located on an imaginary straight line K1 passing through the upper end of the emitting surface 35 of the light-emitting device 21 and the resin layer 31. For example, the upper end of reflector 15B can be set at a height of 100% to 120% relative to the straight line K1. That is, the light reflection area can be set considering the distribution of the beam angle of the light-emitting device 21. Therefore, the amount of light emitted directly from the light-emitting device 21 through the opening 65 can be minimized. As a first example, reflector 15B can be configured to cover... Figure 2 The structure contains multiple light-emitting devices 21. The length of the reflector 15B can be shorter than the length of the resin layer 31 and longer than the distance between the outermost light-emitting devices 21.

[0039] As a second example, multiple reflectors 15B can be disposed in regions respectively corresponding to the light-emitting devices 21. Each reflector 15B can be configured to be longer than the length of each light-emitting device 21, for example, in the range of 120% to 250% of the length of each light-emitting device 21. Therefore, each reflector 15B can effectively reflect light emitted from each light-emitting device 21 facing each other. That is, the reflectors 15B can be disposed in a structure with at least a portion of the opening in the region between the individual light-emitting devices 21.

[0040] Reflector 15B can be formed of metallic or non-metallic materials. Metallic materials can be formed of materials such as aluminum or silver. Non-metallic materials can be at least one of resin materials, transparent PET, and white polyethylene terephthalate (PET) materials. Reflector 15B can include any one of TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS within the resin. Because the thickness of reflector 15B decreases towards its upper end, the light reflectivity at the lower center of reflector 15B can be 85% or more, for example, 90% or more, and the light reflectivity at the upper center of reflector 15B is less than 85% or the light transmittance is more than 15%. This reflector 15B can suppress hot spots on the side surface of the light-emitting device 21.

[0041] like Figure 6As shown, a diffuser layer 81 can be disposed on the emitting portion 35 of the resin layer 31. The diffuser layer 81 can be disposed over the entire emitting portion 35 of the resin layer 31. The diffuser layer 81 can extend from the upper end to the lower end of the emitting portion 35 of the resin layer 31. The diffuser layer 81 can contact the emitting portion 35 of the resin layer 31. The diffuser layer 81 can contact the third reflective portion 63 of the reflective member 60. The diffuser layer 81 can be disposed between the emitting portion 35 of the resin layer 31 and the third reflective portion 63 of the reflective member 60. The diffuser layer 81 can be disposed in the opening 65 disposed in the third reflective portion 63 of the reflective member 60. Therefore, light passing through the opening 65 can be diffused to the diffuser layer 81 before being emitted. As another example, the diffuser layer 81 can be disposed on the outer surface of the third reflective portion 63 of the reflective member 60 to cover the outer side of the opening 65. The diffuse layer 81 can contact the inner sides of the first portion 63A, the second portion 63B, and the third portion 63C of the third reflective portion 63. The opening 65 of the third reflective portion 63 can be open or exposed on the outer surface of the diffuse layer 81. As another example, the diffuse layer 81 is formed to correspond to the shape of the opening 65 of the third reflective portion 63, and the first portion 63A, the second portion 63B, and the third portion 63C can be provided in the opening 65.

[0042] The diffuse layer 81 can be formed of a resin material such as silicone or epoxy resin, thereby preventing degradation of adhesion to the resin layer 31. The diffuse layer 81 may contain a diffusing agent in the transparent resin material. The diffuse layer 81 can diffuse incident light. The diffusing agent may include at least one from the polymethyl methacrylate (PMMA) series, TiO2, SiO2, Al2O3, and silicon series. The diffuse layer 81 may contain at least one or more diffusing agents, such as beads, phosphors, and ink particles. The inner surface of the diffuse layer 81 may be in contact with the resin layer 31, and the outer surface of the diffuse layer 81 may be exposed to the outside. The diffuse layer 81 may comprise a single layer or multiple layers. The thickness of the diffuse layer 81 is the gap between the inner and outer sides and is 25 μm or more, for example, it may be in the range of 25 μm to 250 μm, or in the range of 100 μm to 250 μm. The diffuse layer 81 may have the above-mentioned thickness range and provide incident light as uniform surface light. As another example, a microlens pattern can be formed on the inner and / or outer surface of the diffuse layer 81. Therefore, the diffuse layer 81 can improve the uniformity of the emitted light. The vertical length of the diffuse layer 81 can be equal to the length of the vertical surface of the exit face 35 or greater than the vertical width of the opening 65. The horizontal length of the diffuse layer 81 can be equal to the horizontal length of the exit face 35 or greater than the horizontal length of the opening 65. Here, as another example of the invention, a phosphor layer (not shown) can be disposed between the reflective member 60 and the resin layer 31. The phosphor layer can convert the wavelength of the incident light. The phosphor layer can include at least one of blue, green, yellow, and red phosphors. The phosphor layer can be disposed on the curved face R1 of the resin layer 31 or on the curved face R1 and the upper surface portion.

[0043] <Second Embodiment>

[0044] Figures 7 to 12 This is a diagram illustrating a lighting module or lighting device according to a second embodiment. Figures 7 to 12 In the second embodiment, the same configuration as that in the first embodiment will be referred to the description of the first embodiment, and may be selectively applied to the second embodiment.

[0045] Reference Figure 7 and Figure 8The lighting module 100B includes a circuit board 11, a resin layer having a first resin portion 31A and a second resin portion 31B on the circuit board 11, a reflective member having a first reflective member 60A and a second reflective member 60B, and a light-emitting portion having a first light-emitting device 21A and a second light-emitting device 21B on the circuit board 11. A reflective layer 15 is disposed on the circuit board 11 and may be disposed below the first resin portion 31A and the second resin portion 31B. The first resin portion 31A may include a first curved portion R1A, a first upper surface portion R2A, and a first emission portion 35A. The second resin portion 31B may include a second curved portion R3, a second upper surface portion R4, and a second emission portion 35B. The first reflective member 60A may include a first reflective portion 61A disposed on the first curved portion R1A of the first resin portion 31A and a second reflective portion 62A disposed on the first upper surface portion R2A. The second reflective member 60B may include a fourth reflective portion 61B disposed on the second curved surface R3 of the second resin portion 31B and a fifth reflective portion 62B disposed on the second upper surface R4 of the second resin portion 31B. A first light-emitting device 21A is disposed in a first row on the circuit board 11 and sealed within the first resin portion 31A. A second light-emitting device 21B may be disposed in a second row preceding the first row on the circuit board 11 and sealed within the second resin portion 31B. A plurality of first light-emitting devices 21A are disposed along the longitudinal direction of the circuit board 11 and may be disposed between the first reflective portion 61A of the first reflective member 60A and the second reflective portion 61B of the second reflective member 60B. The center of the first light-emitting device 21A may be spaced equidistant from the first reflective portion 61A and the fourth reflective portion 61B. A plurality of second light-emitting devices 21B are disposed along the longitudinal direction of the circuit board 11 and may be disposed between the fourth reflective portion 61B of the second reflective member 60B and the second emitting surface 35B of the second resin portion 31B. The distance between the second light-emitting device 21B and the fourth reflective portion 61B of the second reflective member 60B can be less than the distance between the second light-emitting device 21B and the second emitting portion 35B.

[0046] Here, the first reflective member 60A and the second reflective member 60B may include a third reflective portion 63 (63, 63B, 63C, see above) disposed on at least a portion of the upper part, lower part, or two outer parts of the first emission surface 35A and the second emission surface 35B. Figure 8The second reflective member 60B may be disposed between the first resin portion 31A and the second resin portion 31B. The first reflective member 60A and the second reflective member 60B may be connected to each other via a third reflective portion 63, and the first reflective member 60A, the second reflective member 60B, or the third reflective portion 63 may include a first opening 65A where the first emission surface portion 35A of the first resin portion 31A opens, and a second opening 65B where the second emission surface portion 35B of the second resin portion 31B opens. The first opening 65A may be disposed on the second resin portion 31B. The first opening 65A may be disposed on the outer side between the second reflective portion 62A of the first reflective member 60A and the fifth reflective portion 62B of the second reflective member 60B. The first opening 65A may be disposed above the second opening 65B, and the second opening 65B may be disposed below the first opening 65A. The first emission surface portion 35A or the first opening 65A may be disposed on the outer side between the second reflective portion 62A of the first reflective member 60A and the fifth reflective portion 62B of the second reflective member 60B. The second exit face 35B or the second opening 65B may be disposed on the outer side between the second reflective portion 62B of the second reflective member 60B and the circuit board 11 or the reflective layer 15.

[0047] The first ejection surface 35A of the first resin portion 31A and the second ejection surface 35B of the second resin portion 31B can be disposed on the same vertical plane. As another example, the first ejection surface 35A can be configured as a vertical or inclined surface, and the second ejection surface 35B can also be configured as a vertical or inclined surface. Here, the inclined surfaces of the first ejection surface 35A and the second ejection surface 35B can be flat, wherein the upper end of the first ejection surface 35A or the second ejection surface 35B protrudes outward more than the lower end, or the lower end of the first ejection surface 35A or the second ejection surface 35B protrudes outward more than the upper end. The third reflective portion 63 may include a first portion 63A on the first ejection surface 35A, a second portion 63B on the second ejection surface 35B, and a third portion 63C on both outer sides (see [link to relevant documentation]). Figure 8 The first opening 65A and the second opening 65B can be exposed. The height of the upper end of the second portion 63B of the third reflective portion 63 can be higher than the height of the upper surfaces of the first light-emitting device 21A and the second light-emitting device 21B. Therefore, the amount of light directly emitted through the second emitting portion 35B via the side surface of the second light-emitting device 21B can be reduced.

[0048] The first curved surface R1A of the first resin portion 31A is disposed outside the first light-emitting device 21A. The lower region of the first curved surface R1A may face the second curved surface R3, and the upper region may face the first emitting surface 35A. The lower region of the first curved surface R1A of the first resin portion 31A may have the same curvature as the second curved surface R3 of the second resin portion 31B. Since the lower regions of the first curved surface R1A and the second curved surface R3 have the same curvature, the reflection characteristics of the light emitted from the first light-emitting device 21A and the second light-emitting device 21B can be uniform.

[0049] The first resin portion 31A extends upward from the rear of the second resin portion 31B and emits light emitted from the first light-emitting device 21A through the first emission surface portion 35A. The second resin portion 31B may be disposed in front of the first resin portion 31A and emits light emitted from the second light-emitting device 21B through the second emission surface portion 35B. The second light-emitting device 21B may vertically overlap with a portion of the second curved surface portion R3 of the second resin portion 31B. Alternatively, the second light-emitting device 21B may vertically overlap with a portion of the second curved surface portion R3 and / or the second upper surface portion R4 of the second resin portion 31B. The first light-emitting device 21A and the second light-emitting device 21B may be driven separately from each other or may be driven concurrently. The vertical width B7 of the first emission surface portion 35A is the same as the vertical width B6 of the second emission surface portion 35B, or may be in the range of 50% to 100% of the vertical width B6 of the second emission surface portion 35B. The vertical width B7 of the first opening 65A is equal to the vertical width B6 of the second opening 65B, or can be within the range of 50% to 100% of the width of the second opening 65B. Therefore, the emission area of ​​the emitted light can be adjusted by the dimensions of the first opening 65A and the second opening 65B. Here, the height B1 from the upper surface of the circuit board 11 to the first upper surface portion R2A of the first resin portion 31A can be 8 mm or more, for example, within the range of 8 mm to 15 mm or within the range of 8 mm to 13 mm. Therefore, each of the widths B6 and B7 can be set within the range of 3 mm or more, for example, 3 mm to 7 mm.

[0050] As a first modification of the present invention, a first phosphor layer (not shown) may be disposed between the first reflective member 60A and the first resin portion 31A. The first phosphor layer can convert the wavelength of the incident light. The first phosphor layer may include at least one of a blue phosphor, a green phosphor, a yellow phosphor, and a red phosphor. The first phosphor layer may be disposed on the first curved surface portion R1A of the first resin portion 31A, or it may be disposed on the first curved surface portion R1A and the first upper surface portion R2A.

[0051] As a second modification of the present invention, a second phosphor layer (not shown) may be disposed between the second reflective member 60B and the second resin portion 31B. The second phosphor layer can convert the wavelength of the incident light. The second phosphor layer may include at least one of a blue phosphor, a green phosphor, a yellow phosphor, and a red phosphor. The second phosphor layer may be disposed on the second curved portion R3 of the second resin portion 31B, or it may be disposed on the second curved portion R3 and the second upper surface portion R4.

[0052] A third modification of the present invention may include the first phosphor layer and the second phosphor layer described above. For example, the first phosphor layer may be disposed on the first curved portion R1A and / or the first upper surface portion R2A of the first resin portion 31A, and the second phosphor layer may be disposed on the second curved portion R3 and / or the second upper surface portion R4 of the second resin portion 31B. Furthermore, the phosphors added to the first phosphor layer and the second phosphor layer may be the same or different from each other.

[0053] The first light-emitting device 21A and the second light-emitting device 21B can emit light of the same color wavelength or light of different color wavelengths. The number of the first light-emitting device 21A and the second light-emitting device 21B can be the same or different. For example, the number of the first light-emitting device 21A can be greater than the number of the second light-emitting device 21B. The number of light-emitting devices can be set as needed according to the luminous intensity characteristics of the lamp.

[0054] like Figure 10 As shown, in the lighting module, the third reflective portion 63 of the reflective member may include a fourth portion 63D, which is disposed below the first emission portion 35A of the first resin portion 31A and above the second emission portion 35B of the second resin portion 31B. The fourth portion 63D of the third reflective portion 63 may contact one end of the fifth reflective portion 62B of the second reflective member 60B. The fourth portion 63D of the third reflective portion 63 may be configured to horizontally overlap with the first emission portion 35A and the second emission portion 35B. Therefore, the dimensions of the first opening 65A and the second opening 65B can be adjusted by the third reflective unit 63. Figure 11 As shown, the fourth part 63D of the third reflector 63 can be disposed below the first emission surface 35A or above the second emission surface 35B.

[0055] like Figure 11As shown, diffuser layers 81A and 81B can be disposed on at least one or both of the first emitting surface 35A and the second emitting surface 35B. For example, diffuser layers 81A and 81B can include a first diffuser layer 81A disposed on the first emitting surface 35A and a second diffuser layer 81B disposed on the second emitting surface 35B. The first diffuser layer 81A and the second diffuser layer 81B can be separated from each other by a fourth portion 63D of the third reflective portion 63. The fourth portion 63D of the third reflective portion 63 can be disposed between the first diffuser layer 81A and the second diffuser layer 81B to block optical interference. The first diffuser layer 81A can be in contact with the surface of the first emitting surface 35A to diffuse the light emitted from the first light-emitting device 21A. The second diffuser layer 81B can be in contact with the surface of the second emitting surface 35B to diffuse the light emitted from the second light-emitting device 21B.

[0056] Here, the first diffuse layer 81A is formed on the entire surface of the first emissive portion 35A of the first resin portion 31A, or it may be disposed inside the third reflective portion 63 other than the first opening 65A. The second diffuse layer 81B may be formed on the entire surface of the second emissive portion 35B of the second resin portion 31B, or it may be disposed inside the third reflective portion 63 other than the second opening 65B.

[0057] like Figure 12 As shown, the lighting module can be configured as a housing 60C having a predetermined shape relative to the reflective member. The housing 60C can cover the curved portion R1 and the upper surface portion R2 of the resin layer 31 on the circuit board 11, and can have a third reflective portion 63 and serve as a reflective member. The first portion 63A and the second portion 63B of the third reflective portion 63 can extend to the emission portion 35 other than the opening 65. The housing 60C can be formed of a reflective plastic material or a metal material.

[0058] Figure 13 This is a plan view of a vehicle equipped with lamps having a lighting module according to an embodiment. Figure 14 It is shown Figure 13 An example image of a vehicle's headlights. Figure 15 It is shown Figure 13 A diagram of the vehicle's taillights. (Refer to...) Figures 13 to 15 In vehicle 900, the headlight 850 may include one or more lighting modules 855, and the driving time of these lighting modules 855 may be individually controlled to function as ordinary headlights and welcome lights when the driver opens the door. It may also provide additional functions such as lighting or celebratory effects. The light may be used as daytime running lights, high beams, low beams, fog lights, or turn signals.

[0059] Additionally, the taillight 800 of the vehicle 900 may include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be an illumination module used as a turn indicator, the second lamp unit 814 may be an illumination module used as a side lamp, and the third lamp unit 816 may be an illumination module used as a brake light, but is not limited thereto. At least one or all of the first lamp unit 812, the second lamp unit 814, and the third lamp unit 816 may include the illumination modules disclosed in the embodiments. The housing 810 accommodates the first lamp unit 812, the second lamp unit 814, and the third lamp unit 816, and may be made of a light-transmitting material. In this case, depending on the vehicle body design, the housing 810 may have a curve, and the first lamp unit 812, the second lamp unit 814, and the third lamp unit 816 may be implemented as surface light sources with curved surfaces according to the shape of the housing 810. When the lamp units are applied to the taillights, brake lights, or turn signals of the vehicle, such lamps may be applied to the turn signals of the vehicle.

[0060] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc., shown in each embodiment can be combined or modified by those skilled in the art for other embodiments. Accordingly, the content related to these combinations and modifications should be interpreted as being included within the scope of the present invention. Additionally, although embodiments have been described above, these are merely examples and do not limit the present invention; those skilled in the art have illustrated the above content without departing from the essential characteristics of the present invention. It can be seen that various modifications and applications that have not yet been made are possible. For example, the various components specifically shown in this embodiment can be implemented by modification. Differences related to these modifications and applications should be understood as being included within the scope of the present invention as defined by the appended claims.

Claims

1. A lighting module, comprising: Circuit board; Multiple light-emitting devices are arranged on the circuit board along a first direction; A resin layer is used to seal the plurality of light-emitting devices; as well as A reflective member is disposed on the surface of the resin layer and has an opening on one side. The resin layer includes: an ejector surface having an opening; a curved surface opposite to the ejector surface; and an upper surface disposed on the curved surface and the ejector surface. Each of the light-emitting devices overlaps with the curved surface in the vertical direction. In this configuration, each of the light-emitting devices and the portion of the reflective member disposed on the emitting surface horizontally overlaps. The upper surface of the resin layer has a horizontal plane. Wherein, the width of the opening in the vertical direction is smaller than the height of the exiting surface in the vertical direction. Each of the light-emitting devices is configured to be closer to the lower end of the curved surface than the lower end of the emitting surface. The reflective member includes a first portion extending from the upper part of the emission surface and a second portion disposed at the lower part of the emission surface. The opening is located between the first part and the second part. In this configuration, the side surface of each of the light-emitting devices faces the second portion. The lower end of the opening is positioned higher than the upper surface of each light-emitting device. The lighting module includes a reflective layer disposed between the resin layer and the circuit board, and a reflector disposed between the light-emitting device and the emitting surface. The upper end of the reflector is higher than the upper surface of each light-emitting device and is less than 50% of the maximum thickness of the resin layer.

2. The lighting module according to claim 1, wherein, The reflective member includes a first reflective portion disposed on the curved surface of the resin layer, a second reflective portion disposed on the upper surface, and a third reflective portion disposed on the exiting surface and having the opening. The third reflective portion comprises the first portion and the second portion.

3. The lighting module according to claim 2, wherein, The upper end of the second portion of the third reflective part is configured to be higher than the upper end of each of the light-emitting devices.

4. The lighting module according to claim 2, wherein, The curved surface or the first reflective portion has a parabolic shape.

5. The lighting module according to any one of claims 1 to 4, comprising a diffuse layer disposed on the emitting surface, and in, The diffuse layer is in contact with the inside of the first portion and the second portion.

6. The lighting module according to claim 1, wherein, The distance between the emitting surface and the light-emitting device is greater than the distance between the reflector and the light-emitting device. Wherein, the height of the reflector is equal to or greater than the height of the upper end of the second part, and The length of the reflector is shorter than the length of the resin layer and longer than the distance between the outermost light-emitting devices.

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