Communication device and manufacturing method thereof

Abstract

A communication device is provided having a first metal component to which surface treatment is performed, an exposed area is formed on at least a portion of the first metal component, a metal foil is arranged on the first metal component in a manner covering at least the exposed area, and a conductive member is arranged on the metal foil and electrically connects the first metal component to a second metal component via the metal foil.

Description

Technical Field

[0001] The present disclosure relates to a communication device and a method for manufacturing the communication device. Background Art

[0002] In communication devices including cellular phone terminals, in order to control the influence of unnecessary radiation, a technique of welding a plated metal sheet to a housing of the communication device is known.

[0003] Citation List

[0004] Patent Literature

[0005] Patent Document 1: JP 2011-139283 A Summary of the Invention

[0006] Technical issues

[0007] Welding the plated metal plate to the housing increases cost and complicates the manufacturing process. It would be desirable to control the effects of unwanted radiation through a simple method at low cost.

[0008] Therefore, the present disclosure proposes a communication device and a method for manufacturing the communication device, by which the influence of unnecessary radiation can be controlled at low cost and by a simple method.

[0009] Solution to the problem

[0010] A communication device includes: a first metal member, on which surface treatment is performed and an exposed area is at least partially formed therein; a metal foil arranged on the first metal member in a manner covering at least the exposed area; and a conductive member arranged on the metal foil and electrically connecting the first metal member to a second metal member via the metal foil.

[0011] A method for manufacturing a communication device includes: performing a chemical conversion treatment on a surface of a first metal member; forming an exposed area by performing an etching treatment on a partial area of the first metal member; arranging a metal foil on the exposed area; and arranging a conductive member on the metal foil. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a view illustrating a schematic configuration of a communication device according to the embodiment.

[0013] Figure 2 is a flowchart illustrating an example of a method of manufacturing a communication device according to the embodiment.

[0014] Figure 3 are views for describing a chemical conversion process according to an embodiment.

[0015] Figure 4 is a diagram for describing an etching process according to an embodiment.

[0016] Figure 5 is a view for describing a method of arranging metal foil according to an embodiment.

[0017] Figure 6 2 is a view for describing a method of arranging a conductive member according to an embodiment.

[0018] Figure 7 is a view for describing a method of arranging a display unit according to an embodiment. DETAILED DESCRIPTION

[0019] Hereinafter, embodiments of the present disclosure will be described in detail based on the accompanying drawings. Note that in each of the following embodiments, duplicate descriptions are omitted by assigning the same reference numerals to the same parts.

[0020] Note that the description will be given in the following order.

[0021] 1. Communication equipment

[0022] 2. Manufacturing method of communication equipment

[0023] 3. Modify the example

[0024] 4. Effect

[0025] <1. Communication Equipment>

[0026] Will refer to Figure 1 The configuration of a communication device according to the embodiment is described. Figure 1 is a view schematically illustrating a configuration of a communication device according to the embodiment.

[0027] like Figure 1 As shown in FIG, the communication device 1 includes a metal housing 12, a metal foil 14, a conductive member 16, and a display unit 18. Note that, Figure 1 Components not particularly relevant to the present disclosure are omitted. The communication device 1 is a cellular phone, a smartphone, or the like. The communication device 1 is a communication device that performs communication using MMW, sub-6, Long Term Evolution (LTE), Universal Mobile Telecommunications System (UMTS), Global System for Mobile Communications (GSM) (registered trademark), or the like. The communication device 1 may be a communication device equipped with a wireless local area network (WLAN), Bluetooth (registered trademark), or the like.

[0028] The metal shell 12 is arranged in a manner covering various parts including the circuit board. The metal shell 12 is electrically connected to various parts including the circuit board. A chemical conversion treatment is performed on the entire area of the surface of the metal shell 12. Therefore, a film for preventing corrosion is formed on the surface of the metal shell 12. The metal shell 12 has an exposed area where an etching treatment is performed on at least a portion of the film formed on the surface and the metal shell 12 is exposed from the film. Specifically, the exposed area is formed at the contact where the metal shell 12 and the display unit 18 are electrically connected. The metal shell 12 is formed of magnesium, for example. In this case, a film is formed on the entire area of magnesium, and magnesium is exposed in the exposed area. The metal shell 12 is formed of aluminum, for example. The metal shell 12 is formed of other metals, for example. In the present disclosure, the metal shell 12 may be referred to as a first metal member.

[0029] The metal foil 14 is arranged on the metal housing 12. The metal foil 14 is partially arranged on the metal housing 12. The metal foil 14 is arranged in a manner that covers at least the exposed area on the metal housing 12. The metal foil 14 can be arranged in an area that includes the exposed area and is wider than the exposed area on the metal housing 12. The metal foil 14 can be arranged in a manner that covers the entire surface of the metal housing 12. The metal foil 14 is attached to the metal housing 12 with, for example, a conductive adhesive (not shown). The metal foil 14 is, for example, a copper foil. The metal foil 14 can be, for example, a gold foil or a silver foil. The metal foil 14 can be, for example, other metal foils that can reduce the resistance value. The metal foil 14 prevents oxidation of the exposed area by covering the exposed area. In other words, the metal foil 14 prevents the resistance of the metal housing 12 from increasing due to oxidation.

[0030] The conductive member 16 is arranged on the metal foil 14. The conductive member 16 electrically connects the metal foil 14 and the display unit 18. That is, the conductive member 16 electrically connects the metal housing 12 and the display unit 18. More specifically, the conductive member 16 electrically connects the display unit 18 to a reference potential. The reference potential is, for example, ground, but the present invention is not limited thereto. The conductive member 16 is affixed to the metal foil 14 using, for example, a conductive double-sided tape. The conductive member 16 can be affixed to the metal foil 14 using, for example, a conductive adhesive. The area of the metal foil 14 is larger than the contact area between the conductive member 16 and the metal foil 14. The conductive member 16 can be implemented, for example, by a well-known gasket covered with a nickel-plated member around an elastic member (such as polyurethane). Therefore, the conductive member 16 improves the conductivity between the metal foil 14 and the display unit 18.

[0031] Display unit 18 displays various images. For example, display unit 18 may be configured integrally with a touch panel. Display unit 18 is, for example, an organic electroluminescent (EL) display. The surface of display unit 18 displays images, and a metal foil (such as copper foil) is provided on its back surface. Specifically, conductive member 16 electrically connects metal foil 14 to the metal foil provided on the back surface of display unit 18.

[0032] <2. Manufacturing Method of Communication Device>

[0033] Will refer to Figure 2 A method of manufacturing a communication device according to an embodiment is described. Figure 2 is a flowchart illustrating an example of a method of manufacturing a communication device according to the embodiment.

[0034] First, a chemical conversion treatment is performed on the surface of the metal housing 12 (step S10). Specifically, in the case where the metal housing 12 is formed of magnesium, the chemical conversion treatment is performed by a known method using chromic acid or phosphoric acid.

[0035] Figure 3 : is a diagram for describing a chemical conversion process according to an embodiment. Figure 3 As shown in FIG, by performing a chemical conversion treatment on the surface of the metal housing 12, a film 22 is formed on the surface of the metal housing 12. The film 22 improves the corrosion resistance of the metal housing 12. That is, the film 22 prevents oxidation of the metal housing 12.

[0036] Next, an etching process is performed on the film 22 formed on the surface of the metal housing 12 (step S12). Specifically, a laser etching process is performed on the surface of the metal housing 12, and the film 22 is partially removed.

[0037] Figure 4 1 is a diagram for describing an etching process according to an embodiment. Figure 4 As shown in FIG, the exposed area 24 where the surface of the metal housing 12 is exposed is formed by performing a laser etching process on the film 22. A known method is used for laser etching. Specifically, the exposed area 24 is formed at a portion where the metal housing 12 and the display unit 18 are electrically connected via the conductive member 16.

[0038] Next, the metal foil 14 is placed on the surface of the metal housing 12 (step S14 ). Specifically, the metal foil 14 is placed so as to cover the exposed area 24 formed by the laser etching process.

[0039] Figure 5 1 is a diagram for describing a method of arranging the metal foil 14 according to an embodiment. Figure 5As shown in FIG, the metal foil 14 is arranged so as to cover at least the metal housing 12 whose surface is exposed in the exposure area 24. For example, the metal foil 14 is attached with a conductive adhesive so as to cover at least the metal housing 12 whose surface is exposed in the exposure area 24. For example, the metal foil 14 can be attached with a conductive adhesive so as to cover the metal housing 12 and the film 22 whose surfaces are exposed in the exposure area 24. When the exposed metal housing 12 is covered with the metal foil 14, the progress of oxidation of the metal housing 12 can be controlled, and the resistance can be maintained at a low state.

[0040] Next, the conductive member 16 is placed on the surface of the metal foil 14 (step S16 ). Specifically, the conductive member 16 is placed on the surface of the metal foil 14 so that the metal foil 14 and the conductive member 16 are electrically connected.

[0041] Figure 6 1 is a diagram for describing a method of arranging the conductive member 16 according to an embodiment. Figure 6 As shown in FIG, the conductive member 16 is arranged on the metal foil 14 using a conductive adhesive material, for example. The method of arranging the conductive member 16 on the metal foil 14 is not particularly limited as long as the conduction between the metal foil 14 and the conductive member 16 can be ensured.

[0042] Then, the display unit 18 is arranged (step S18 ). Specifically, the display unit 18 is arranged so that the metal housing 12 and the display unit 18 are electrically connected.

[0043] Figure 7 1 is a diagram for describing a method of arranging the display unit 18 according to an embodiment. Figure 7 As shown in , the metal foil 26 is provided on the surface (back surface) on one side of the conductive member 16 of the display unit 18. The metal foil 26 is, for example, a copper foil. However, this is not a limitation. In the present disclosure, the metal foil 26 is a second metal member. The display unit 18 is provided in such a manner that the metal foil 26 provided on the back surface contacts the surface of the conductive member 16. That is, the display unit 18 is connected to the metal housing 12 via the metal foil 14, the conductive member 16, and the metal foil 26. The metal housing 12 serves as a ground. That is, with this structure, the ground can be shared.

[0044] As described above, in this embodiment, the metal foil 14 covers the connection portion where the metal housing 12 and the display unit 18 are electrically connected. Therefore, oxidation of the connection portion between the metal housing 12 and the display unit 18 is suppressed, and the electrical resistance can be maintained at a low level. Consequently, when the communication device 1 transmits radio waves, it is possible to prevent the influence of unnecessary radiation on other systems.

[0045] <3. Modification Example>

[0046] Although the above embodiment has described an example in which the metal housing 12 and the display unit 18 are electrically connected, this is an example and the present disclosure is not limited thereto. For example, by electrically connecting an antenna (not shown) and a circuit board (not shown) having a similar configuration using the metal foil 14 and the conductive member 16 of the present disclosure, it is possible to ensure grounding of the antenna.

[0047] In addition, although the metal foil 14 and the conductive member 16 are used to connect the display unit 18 to the ground in the embodiment, the present disclosure is not limited thereto. For example, any parts including the circuit board of the communication device 1 can be connected by using the metal foil 14 and the conductive member 16 as needed.

[0048] Furthermore, while the embodiments have been described using the communication device 1 as an example, the present disclosure is not limited thereto. In the present disclosure, the configuration of the metal foil 14 and the conductive member 16 can be used to electrically connect any components in other electronic equipment. Examples of other electronic equipment include, but are not limited to, tablet computers, notebook personal computers (PCs), and portable game consoles.

[0049] <4. Effect>

[0050] The communication device 1 according to the present disclosure includes: a first metal component 12, on which surface treatment is performed and an exposed area 24 is at least partially formed; a metal foil 14, which is arranged on the first metal component 12 in a manner covering the exposed area 24; and a conductive component 16, which is arranged on the metal foil 14 and electrically connects the first metal component 12 with a second metal component 26 via the metal foil 14.

[0051] Therefore, oxidation of the connection portion where the metal housing 12 and the display unit 18 are electrically connected is suppressed, and the resistance can be maintained at a low state. Therefore, generation of unnecessary radiation can be suppressed.

[0052] The surface treatment is a chemical conversion treatment, whereby the film 22 can be formed on the surface of the first metal member 12 and the corrosion resistance of the first metal member 12 can be improved.

[0053] The first metal member 12 is a housing formed of magnesium. Therefore, since the metal housing of the communication device 1 can be realized by magnesium, the weight reduction of the communication device 1 can be achieved.

[0054] The metal foil 14 is formed of a metal having a lower resistance value than the first metal member 12. Therefore, the resistance of the surface of the first metal member 12 can be reduced, and unnecessary radiation can be controlled.

[0055] The metal foil 14 is a copper foil. Therefore, since the surface resistance of the first metal member 12 can be reduced using the copper foil, unnecessary radiation can be easily controlled.

[0056] The metal foil 14 is provided so as to cover the entire surface of the first metal member 12 including the exposed area 24. Therefore, the corrosion resistance of the entire surface area of the first metal member 12 can be improved.

[0057] The metal foil 14 is pasted on the first metal member 12 with a conductive adhesive. Therefore, the metal foil 14 on the first metal member 12 can be easily arranged.

[0058] The area of the metal foil 14 is larger than the contact area between the metal foil 14 and the conductive member 16. Therefore, it is possible to prevent oxidation of the first metal member 12 and ensure conductivity between the metal foil 14 and the conductive member 16.

[0059] The conductive member 16 is connected to the ground. Therefore, the device or the like arranged on the conductive member 16 can be connected to the ground, and performance degradation of the device can be suppressed.

[0060] Second metal member is a metal member provided on display unit 18. Therefore, since first metal member 12 and display unit 18 can be electrically connected by utilizing metal foil 14 and conductive member 16, it is possible to realize communication device 1 in which generation of unnecessary radiation is controlled.

[0061] The conductive member 16 is a spacer in which the surface of the elastic member is covered with metal. Therefore, since a well-known member can be used as the conductive member 16, unnecessary radiation can be easily controlled.

[0062] In the manufacturing method of the communication device 1 according to the present disclosure, a chemical conversion treatment is performed on the surface of the first metal member 12, an exposed area 24 is formed by performing an etching treatment on a partial area of the first metal member 12, the metal foil 14 is arranged on the exposed area 24, and the conductive member 16 is arranged on the metal foil 14.

[0063] Therefore, oxidation of the connection portion where the metal housing 12 and the display unit 18 are electrically connected is suppressed, and the resistance can be maintained at a low state. Therefore, generation of unnecessary radiation can be suppressed.

[0064] In addition, the effects described in this specification are merely illustrative or exemplary, and not restrictive. That is, in addition to or in place of the above effects, the technology according to the present disclosure may exhibit effects that are different from the description of this specification and are obvious to those skilled in the art.

[0065] Note that the present technology can also have the following configurations. (1)

[0067] A communication device, comprising:

[0068] a first metal member on which surface treatment is performed and in which an exposed area is at least partially formed;

[0069] a metal foil disposed on the first metal member in a manner covering at least the exposed area; and

[0070] A conductive member is disposed on the metal foil and electrically connects the first metal member to the second metal member via the metal foil. (2)

[0072] The communication device according to (1) above, wherein

[0073] The surface treatment is a chemical conversion treatment. (3)

[0075] The communication device according to (1) to (2) above, wherein

[0076] The first metal member is a housing formed of magnesium. (4)

[0078] The communication device according to (1) to (3) above, wherein

[0079] The metal foil is formed of a metal having a lower electrical resistance than that of the first metal member. (5)

[0081] The communication device according to (4) above, wherein

[0082] The metal foil is copper foil. (6)

[0084] The communication device according to (1) to (5) above, wherein

[0085] The metal foil is provided so as to cover the entire area of the surface of the first metal member including the exposed area. (7)

[0087] The communication device according to (1) to (6) above, wherein

[0088] The metal foil is attached to the first metal member with a conductive adhesive. (8)

[0090] The communication device according to (1) to (7) above, wherein

[0091] The area of the metal foil is larger than the contact area between the metal foil and the conductive member. (9)

[0093] The communication device according to (1) to (8) above, wherein

[0094] The conductive member is connected to ground. (10)

[0096] The communication device according to (1) to (9) above, wherein

[0097] The second metal member is a metal member provided on the display unit. (11)

[0099] The communication device according to (1) to (10) above, wherein

[0100] The conductive member is a spacer in which the surface of the elastic member is covered with metal. (12)

[0102] A method for manufacturing a communication device, comprising:

[0103] performing a chemical conversion treatment on a surface of the first metal member;

[0104] forming an exposed region by performing an etching process on a partial region of the first metal member;

[0105] disposing a metal foil over the exposed area; and

[0106] A conductive member is arranged on the metal foil.

[0107] Reference Signs List

[0108] 1. Communication equipment

[0109] 12 Metal housing

[0110] 14,26 metal foil

[0111] 16 Conductive components

[0112] 18 display units

[0113] 22 membrane

[0114] 24 Exposed Areas

Claims

1. A communication device comprising: a first metal member on which surface treatment is performed and in which an exposed area is at least partially formed; a metal foil disposed on the first metal member in a manner covering at least the exposed area; as well as a conductive member disposed on the metal foil and electrically connecting the first metal member to a second metal member via the metal foil, wherein the surface treatment is a chemical conversion treatment, and The metal foil is provided so as to cover the entire surface of the first metal member including the exposed area.

2. The communication device according to claim 1, wherein The first metal member is a housing formed of magnesium.

3. The communication device according to claim 1, wherein The metal foil is formed of a metal having a lower electrical resistance than that of the first metal member. The communication device according to claim 3 , wherein The metal foil is copper foil.

5. The communication device according to claim 1, wherein The metal foil is attached to the first metal member with a conductive adhesive. The communication device according to claim 1 , wherein An area of the metal foil is larger than a contact area between the metal foil and the conductive member.

7. The communication device according to claim 1, wherein The conductive member is connected to ground.

8. The communication device according to claim 1, wherein The second metal member is a metal member provided on the display unit.

9. The communication device according to claim 1, wherein The conductive member is a spacer in which a surface of an elastic member is covered with metal.

10. A method for manufacturing a communication device, comprising: performing a chemical conversion treatment on a surface of the first metal member; forming an exposed area by performing an etching process on a partial area of the first metal member; disposing a metal foil on the exposed area; as well as disposing a conductive member on the metal foil, The metal foil is provided so as to cover the entire surface of the first metal member including the exposed area.

Images