Diaphragm assembly and manufacturing method thereof, audio module and electronic equipment

Abstract

The present disclosure relates to a diaphragm assembly, a method for manufacturing the same, an audio module, and an electronic device. The diaphragm assembly includes a diaphragm and a conductive path disposed on a surface of the diaphragm. The conductive path includes a liquefiable conductive medium that liquefies before or after the audio module to which the diaphragm assembly belongs switches to an operating state.

Description

Technical Field

[0001] The present disclosure relates to the field of terminal technology, and in particular to a diaphragm assembly and a manufacturing method thereof, an audio module, and an electronic device. Background Art

[0002] Currently, mobile terminals are usually equipped with audio modules to achieve sound amplification or sound recording of the mobile terminal. In related technologies, a vibration system can be used to drive the diaphragm to vibrate, and the vibration of the diaphragm can be used to achieve sound production or sound recording. Summary of the Invention

[0003] The present disclosure provides a diaphragm assembly and a manufacturing method thereof, an audio module and an electronic device to address the deficiencies in the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, a diaphragm assembly is provided, comprising:

[0005] diaphragm;

[0006] A conductive path is arranged on the surface of the diaphragm, and the conductive path includes a liquefiable conductive medium. The liquefiable conductive medium is liquefied before the audio module to which the diaphragm assembly belongs is switched to a working state, or is liquefied after the audio module is switched to a working state.

[0007] Optionally, the conductive path further includes a protective layer, and the liquefiable conductive medium is arranged between the protective layer and the diaphragm.

[0008] Optionally, the conductive path further includes a solid conductive medium, one end of the solid conductive medium is electrically connected to the vibration component, and the other end of the solid conductive medium is electrically connected to the target circuit;

[0009] The liquefiable conductive medium is liquefied before the audio module to which the diaphragm assembly belongs is switched to a working state, and the liquid liquefiable conductive medium is used to connect the disconnected portion of the solid conductive medium.

[0010] Optionally, the liquefiable conductive medium includes a conductive metal medium and a conductive adhesive, and the conductive adhesive is used to bond the conductive metal medium when the liquefiable conductive medium solidifies, so that the solidified liquefiable conductive medium is conductive.

[0011] Optionally, the liquefiable conductive medium includes silver paste or gallium-based liquid alloy.

[0012] Optionally, the conductive paths are symmetrically arranged on the surface of the diaphragm along the symmetry center of the diaphragm.

[0013] Optionally, the diaphragm includes an annular raised portion protruding along the thickness direction of the diaphragm, and the conductive path is provided on the surface of the annular raised portion.

[0014] According to a second aspect of an embodiment of the present disclosure, an audio module is provided, including:

[0015] Bracket;

[0016] The diaphragm assembly as described in any of the above embodiments, wherein the diaphragm of the diaphragm assembly is connected to the bracket;

[0017] a vibration assembly connected to the diaphragm;

[0018] One end of the conductive path is electrically connected to the vibration component, and the other end is electrically connected to the target circuit, the target circuit includes an audio signal input circuit or an audio signal output circuit, and when the audio module is in working state, the diaphragm vibrates and the liquefiable conductive medium is in liquid state.

[0019] Optionally, the vibration component includes:

[0020] A magnet, the magnet being connected to the bracket;

[0021] A voice coil is connected to the diaphragm, and when the voice coil moves, it cuts the magnetic flux lines of the magnet component, and the voice coil is electrically connected to the conductive path.

[0022] Optionally, the melting point of the liquefiable conductive medium is less than or equal to the lowest operating temperature of the audio module;

[0023] Alternatively, the melting point of the liquefiable conductive medium is greater than the lowest operating temperature of the audio module and less than the highest operating temperature of the audio module.

[0024] Optionally, the audio module includes a speaker module, a microphone module, or an earpiece module.

[0025] According to a third aspect of an embodiment of the present disclosure, an electronic device is provided, comprising the audio module as described in any one of the above embodiments.

[0026] According to a fourth aspect of an embodiment of the present disclosure, a method for manufacturing a diaphragm assembly is provided, comprising:

[0027] Get the diaphragm;

[0028] A conductive path is processed on the surface of the diaphragm to obtain the diaphragm assembly. The conductive path includes a liquefiable conductive medium. The liquefiable conductive medium is in liquid form when the audio module to which the diaphragm assembly belongs is in working state.

[0029] Optionally, obtaining a diaphragm includes: obtaining a flat diaphragm;

[0030] The processing of the conductive path on the surface of the diaphragm includes:

[0031] printing the conductive path on the membrane;

[0032] The diaphragm is processed so that a portion of the diaphragm corresponding to the conductive path is raised along the thickness direction of the diaphragm to form an annular raised portion, so as to obtain the diaphragm assembly.

[0033] Optionally, printing the conductive path on the diaphragm includes:

[0034] printing a liquefiable conductive medium on the surface of the membrane;

[0035] Before forming the annular protrusion, a protective layer is processed on the surface of the liquefiable conductive medium, and the liquefiable conductive medium is located between the diaphragm and the protective layer; or, processing a conductive path on the surface of the diaphragm includes:

[0036] After the annular protrusion is formed, a protective layer is processed on the surface of the liquefiable conductive medium, and the liquefiable conductive medium is located between the diaphragm and the protective layer.

[0037] Optionally, obtaining the diaphragm includes:

[0038] Obtaining a flat membrane sheet;

[0039] Processing the diaphragm to form an annular protrusion protruding along the thickness direction of the diaphragm to obtain the diaphragm;

[0040] Processing a conductive path on the surface of the diaphragm further comprises:

[0041] The conductive path is printed on the surface of the annular protrusion.

[0042] Optionally, printing the conductive path on the surface of the annular raised portion includes:

[0043] printing a liquefiable conductive medium on the surface of the annular protrusion;

[0044] A protective layer is sprayed, and the liquefiable conductive medium is arranged between the protective layer and the annular protrusion.

[0045] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0046] It can be seen from the above embodiments that in the technical solution of the present invention, a conductive path including a liquefiable conductive medium can be set on the surface of the diaphragm. The liquefiable conductive medium is in liquid form when the audio module to which the diaphragm assembly belongs is in working state. On the one hand, the liquid can relieve stress, which is beneficial to extending the service life of the audio module. On the other hand, the liquid can conduct the circuit breaks that may exist in the conductive path through the liquid liquefiable conductive medium, thereby realizing the conduction of the conductive path.

[0047] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0049] Figure 1 It is a structural diagram of an audio module according to an embodiment of an exemplary embodiment.

[0050] Figure 2 yes Figure 1 Exploded diagram of the mid-range audio module.

[0051] Figure 3 yes Figure 1 Cross-sectional diagram of the mid-range audio module.

[0052] Figure 4 The figure is a schematic diagram showing the assembly of a diaphragm and a conductive path according to an exemplary embodiment.

[0053] Figure 5 The figure is a flowchart of a method for manufacturing an audio module according to an exemplary embodiment.

[0054] Figure 6 The figure is a flowchart of another method for manufacturing an audio module according to an exemplary embodiment.

[0055] Figure 7 The figure is a flowchart of another method for manufacturing an audio module according to an exemplary embodiment. DETAILED DESCRIPTION

[0056] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0057] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0058] It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining."

[0059] Figure 1 is a structural diagram of a speaker module 100 according to an exemplary embodiment. Figure 2 yes Figure 1 An exploded diagram of the speaker module 100 is shown. Figure 3 yes Figure 1 A schematic cross-sectional view of the speaker module 100, Figure 4 FIG. 1 is a schematic diagram showing an assembly of a diaphragm 21 and a conductive path 22 according to an exemplary embodiment. Figures 1-4 As shown, the speaker module 100 may include a bracket 1, a diaphragm assembly 2, a magnet 3, and a voice coil 4. The magnet 3 may be fixedly connected to the bracket 1, and by properly positioning the magnets within the magnet 3, the magnet 3 may be arranged to form a magnetic gap. A portion of the voice coil 4 may be disposed within the magnetic gap. Consequently, when the voice coil 4 is subsequently energized, it cuts the magnetic flux lines of the magnet 3, interacting with the magnet 3 and enabling the voice coil 4 to move up and down. The diaphragm assembly 2 may include a diaphragm 21 and a conductive path 22. The diaphragm 21 may be connected to the bracket 1, and the voice coil 4 may be connected to one side of the diaphragm 21. The conductive path 22 may be disposed on the surface of the diaphragm 21, and one end of the conductive path 22 may be electrically connected to the voice coil 4, while the other end may be electrically connected to the audio signal input circuit.

[0060] Based on this, when the audio signal input circuit of the speaker module 100 receives an audio signal, the audio signal can be transmitted to the voice coil 4 through the conductive path 22, causing the voice coil 4 to conduct electricity and interact with the magnetic component 3, causing the voice coil 4 to move up and down, thereby driving the diaphragm 21 to vibrate and produce sound. The conductive path 22 may include a liquefiable conductive medium 221 and a protective layer 222. The liquefiable conductive medium 221 is located between the protective layer 222 and the diaphragm 21. The liquefiable conductive medium 221 may be liquefied before the speaker module 100 switches to the operating state, or it may be liquefied after the speaker module 100 switches to the operating state. This can be achieved by controlling the relationship between the melting point of the liquefiable conductive medium 221 and the operating temperature of the speaker module 100.

[0061] The liquid liquefiable conductive medium 221 can, on the one hand, alleviate the internal stress caused by the vibration of the diaphragm 21, thereby extending the service life of the speaker module 100. Furthermore, the liquid liquefiable conductive medium can conduct any circuit gaps in the conductive path, thereby ensuring that the conductive path is continuous. The protective layer 222 prevents the liquefiable conductive medium 221 from flowing irregularly on the surface of the diaphragm 21, ensuring that the liquefiable conductive medium 221 can conduct electricity between the audio signal input circuit and the voice coil 4 in both liquid and solid states. Furthermore, in the technical solution disclosed herein, the conductive path 22 is disposed on the surface of the diaphragm 21. Compared to the related art solution that uses a skeleton and a circuit board fixed to the skeleton, and conducts electricity between the voice coil 4 and the audio signal input circuit via the circuit board, the structure of the speaker module 100 can be simplified, and the internal space of the speaker module 100 can be expanded. Among them, the liquefiable conductive medium 221 can include silver paste or gallium-based liquid alloy. By utilizing the flexibility, low resistance and low melting point of the gallium-based liquid alloy, the electrical performance of the conductive path 22 can be maintained in harsh environments such as high temperature and high humidity. At the same time, it can also adapt to multiple vibrations of the diaphragm 21 without deformation.

[0062] In this embodiment, the melting point of the liquefiable conductive medium 221 can be less than or equal to the minimum operating temperature of the speaker module 100. For example, the melting point of the liquefiable conductive medium 221 can be adjusted to near room temperature or a lower temperature to ensure that the liquefiable conductive medium 221 is liquefied before the speaker module 100 switches to the operating state, or the liquefiable conductive medium 221 is in a liquid state regardless of whether the speaker module 100 is in the operating state or the non-operating state. In this way, the liquefiable conductive medium 221 melts into a liquid state before the speaker module 100 switches to the operating state. The liquid liquefiable conductive medium 221 can, on the one hand, buffer the stress of the vibration deformation of the diaphragm 21, thereby extending the service life of the speaker module 100. On the other hand, the liquefaction of the liquefiable conductive medium 221 before the speaker module 100 switches to the operating state can avoid the problem of circuit breakage caused by the solidification of the liquefiable conductive medium 221 after the speaker module 100 completes the previous operation. The minimum operating temperature of the speaker module 100 can be determined through a limited number of tests. Alternatively, in other embodiments, the melting point of the liquefiable conductive medium 221 can be greater than the minimum operating temperature of the speaker module 100 and less than the maximum operating temperature of the speaker module 100. This allows the liquefiable conductive medium 221 to liquefy for a period of time after the speaker switches to an operating state, thereby relieving internal stress.

[0063] In the above embodiment, the conductive medium in the conductive pathway 22 disposed on the diaphragm 21 can be a liquefiable conductive medium 221. In this case, the liquefiable conductive medium 221, when liquefied, can provide electrical connection between the voice coil 4 and the audio signal input circuit. If the conductive medium in the conductive pathway 22 can be a liquefiable conductive medium 221, then to avoid the formation of cracks in the liquefiable conductive medium 221 after solidification, which would subsequently prevent the voice coil 4 from being electrically connected, the liquefiable conductive medium 221 can be made of a mixture of a conductive metal medium and a conductive adhesive. The conductive adhesive can be used to bond the solidified conductive metal medium when the liquefiable conductive medium 221 solidifies, so that the liquefiable conductive medium 221 remains conductive after solidification, thereby preventing the speaker module 100 from being unable to start.

[0064] Alternatively, in other embodiments, the conductive path 22 may also include a solid conductive medium, one end of which is electrically connected to the voice coil 4 and the other end to the audio signal input circuit. Before the audio module 100 switches to the operating state, the liquefiable conductive medium 221 may liquefy. The liquid liquefiable conductive medium 221 may flow along the solid conductive medium, allowing the liquid liquefiable conductive medium 221 to flow to any breaks in the solid conductive medium caused by the vibration of the diaphragm 21, filling the gaps and achieving electrical continuity between the audio input circuit and the voice coil 4. In this manner, the liquid liquefiable conductive medium 221 can bridge breaks or cracks in the solid conductive medium caused by stress, ensuring that the conductive path 22 can properly transmit electrical signals. Compared to a solution where electrical conduction is entirely through the liquefiable conductive medium 221, this reduces the amount of liquefiable conductive medium 221 used, resulting in more stable electrical performance.

[0065] like Figure 3 As shown, the diaphragm 21 may include an annular raised portion 211, which may be formed as a protrusion along the thickness direction of the diaphragm 21. The radially inner edge of the annular raised portion 211 on the diaphragm 21 may be connected to the dome 5 of the speaker module 100, and the dome 5 is connected to the voice coil 4. The connection between the voice coil 4 and the diaphragm 21 allows the diaphragm 21 to move relative to the bracket 1 when the diaphragm 21 moves. In other embodiments, the radially inner edge of the annular raised portion 211 on the diaphragm 21 may be directly connected to the voice coil 4, which is not limited in this disclosure. The radially outer edge of the annular raised portion 211 on the diaphragm 21 may be connected to the bracket 1. The conductive path 22 may be provided on the surface of the annular raised portion 211, specifically, on the surface of the annular raised portion 211 near the voice coil 4, to facilitate electrical connection between the conductive path 22 and the voice coil wire of the voice coil 4. The conductive path 22 can be symmetrically arranged on the surface of the annular protrusion 211 along the symmetry center of the diaphragm 21 so that the diaphragm 21 can maintain balance during vibration.

[0066] In the embodiments provided herein, a vibration assembly including a magnet 3 and a voice coil 4 is used as an example for illustration. In other embodiments, the vibration assembly may also include a piezoelectric ceramic. One end of the conductive path 22 may be connected to the piezoelectric ceramic, and the other end may be connected to an audio signal input circuit. In this way, when the audio signal is transmitted to the piezoelectric ceramic through the conductive path 22, the piezoelectric ceramic may be deformed, and the diaphragm 21 may be attached to the piezoelectric ceramic. The deformation of the piezoelectric ceramic then drives the diaphragm 21 to vibrate, thereby producing sound. In the embodiments provided herein, an example is provided in which the conductive path 22 includes a protective layer 222, and the protective layer 222 restricts the flow of a liquid liquefiable conductive medium 221. In other embodiments, a groove may be formed on the surface of the diaphragm 21, and the liquefiable conductive medium 221 may be processed in the groove. The groove restricts the flow of the liquid liquefiable conductive medium 221. The specific design can be as desired, and this disclosure is not limited thereto.

[0067] In the above embodiment, the audio module is described using the speaker module 100 as an example. In other embodiments, the audio module may also include a microphone module. When the audio module includes a microphone module, one end of the conductive path can be electrically connected to the voice coil, and the other end can be connected to the audio output circuit. In this way, the current generated by the voice coil can be output through the audio output circuit, and the user's voice signal can be obtained through processing. In some other embodiments, the audio module may also include an earpiece module, and this disclosure is not limited to this.

[0068] Based on the technical solution of the present disclosure, the present disclosure further provides an electronic device, which may include a housing and a speaker module 100 as described in any of the above embodiments. The housing may include a sound outlet. The speaker module 100 may be disposed within the housing, with the diaphragm 21 disposed toward the sound outlet, so that when the diaphragm 21 vibrates, air vibrates, and sound can be transmitted through the sound outlet. Of course, the electronic device may also include a microphone module and an earpiece module. The structure of at least one of the microphone module and the earpiece module may refer to the structure of the speaker module 100 in the above embodiments.

[0069] like Figure 5 As shown, the present disclosure also provides a method for manufacturing a diaphragm assembly 2, which may include the following steps:

[0070] In step 501 , a diaphragm is obtained.

[0071] In step 502, a conductive path is processed on the surface of the diaphragm to obtain the diaphragm assembly, wherein the conductive path includes a liquefiable conductive medium, and the liquefiable conductive medium is in liquid form when the audio module to which the diaphragm assembly belongs is in working state.

[0072] Thus, by changing the state of the liquefiable conductive medium 221 in the conductive path, it is possible to avoid frequent changes in the internal stress of the conductive path 22 caused by the vibration of the diaphragm 21, which may lead to breakage of the conductive path 22 and damage to the speaker module 100.

[0073] In order to elaborate on the specific production method in this disclosure, Figure 6 As shown:

[0074] In step 601 , a flat membrane is obtained.

[0075] In step 602 , a liquefiable conductive medium 221 is printed on the membrane.

[0076] In this embodiment, the diaphragm can be processed according to the desired shape of the diaphragm 21, and the liquefiable conductive medium 221 can be printed according to the desired position of the conductive path 22. For example, in the present disclosure, the annular protrusion 211 of the diaphragm 21 is located in the middle area of the diaphragm 21, so the liquefiable conductive medium 221 can be printed in the middle area of the diaphragm.

[0077] In step 603 , the membrane is processed so that a portion of the membrane corresponding to the liquefiable conductive medium 221 is raised along the thickness direction of the membrane to form an annular raised portion.

[0078] In this embodiment, the liquefiable conductive medium 221 may be printed on the membrane first, and then when the annular protrusion 211 is formed integrally therewith, the liquefiable conductive medium 221 may be located on the surface of the annular protrusion 211 .

[0079] In step 604 , a protective layer 222 is processed on the annular protrusion 211 , with the liquefiable conductive medium 221 located between the protective layer 222 and the annular protrusion 211 .

[0080] In this embodiment, a protective layer 222 can be sprayed on the surface of the annular protrusion 211, and the liquefiable conductive medium 221 can be positioned between the protective layer 222 and the diaphragm 21. Thus, the protective layer 222 can restrict the flow of the liquefiable conductive medium 221 when in liquid form. The protective layer 222 can include a protective adhesive layer or other protective flexible layer to prevent the protective layer 222 from breaking during vibration of the diaphragm 21 and thereby failing to restrict the flow of the liquefiable conductive medium 221.

[0081] In some other embodiments, before forming the annular protrusion 211, a protective layer 222 may be processed on the surface of the liquefiable conductive medium 221, and the liquefiable conductive medium 221 may be located between the diaphragm and the protective layer 222. When the annular protrusion 211 is subsequently processed, the liquefiable conductive medium 221 and the protective layer 222 located on the surface of the annular protrusion 211 may be formed simultaneously.

[0082] In step 605, the diaphragm assembly 2 is obtained.

[0083] In another embodiment, Figure 7 As shown, the manufacturing method of the diaphragm assembly 2 may include:

[0084] In step 701 , a flat membrane is obtained.

[0085] In step 702 , the diaphragm is processed so that the diaphragm is raised in the thickness direction to form an annular raised portion 211 , thereby obtaining the diaphragm 21 .

[0086] In step 703 , a liquefiable conductive medium 221 is printed on the surface of the annular protrusion 211 .

[0087] In step 704 , a protective layer 222 is processed on the surface of the liquefiable conductive medium 221 so that the liquefiable conductive medium 221 is located between the protective layer 222 and the annular protrusion 211 .

[0088] In this embodiment, the diaphragm can be processed to obtain the annular protrusion 211, and then the surface of the annular protrusion 211 is printed with a liquefiable conductive medium 221 and a sprayed protective layer 222. Figure 6 The illustrated embodiment can more accurately determine the position of the conductive path 22 , thereby improving the processing yield of the speaker module 100 .

[0089] In step 705, the diaphragm assembly 2 is obtained.

[0090] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0091] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An audio module, characterized in that: include: Bracket; diaphragm; A conductive path, the conductive path is provided on the surface of the diaphragm, the conductive path includes a liquefiable conductive medium, the liquefiable conductive medium is liquefied before the audio module switches to the working state, or is liquefied after the audio module switches to the working state, the conductive path also includes a solid conductive medium, the liquefiable conductive medium is liquefied before the audio module switches to the working state, the liquefiable conductive medium in liquid form is used to conduct the disconnection of the solid conductive medium, and the liquid conductive medium flows along the solid conductive medium, and the diaphragm is connected to the bracket; a vibration assembly connected to the diaphragm; One end of the conductive path is electrically connected to the vibration component, and the other end is electrically connected to a target circuit, the target circuit includes an audio signal input circuit or an audio signal output circuit, and when the audio module is in an operating state, the diaphragm vibrates and the liquefiable conductive medium is in a liquid state; The vibration assembly comprises: A magnet, the magnet being connected to the bracket; A voice coil is connected to the diaphragm, and when the voice coil moves, it cuts the magnetic flux lines of the magnet component, and the voice coil is electrically connected to the conductive path.

2. The audio module according to claim 1, wherein: The conductive path further includes a protective layer, and the liquefiable conductive medium is disposed between the protective layer and the diaphragm.

3. The audio module according to claim 1, wherein: The liquefiable conductive medium includes a conductive metal medium and a conductive adhesive. The conductive adhesive is used to bond the conductive metal medium when the liquefiable conductive medium solidifies, so that the solidified liquefiable conductive medium is conductive.

4. The audio module according to claim 1, wherein: The liquefiable conductive medium includes silver paste or gallium-based liquid alloy.

5. The audio module according to claim 1, wherein: The conductive paths are symmetrically arranged on the surface of the diaphragm along the symmetry center of the diaphragm.

6. The audio module according to claim 1, wherein: The diaphragm includes an annular protrusion protruding along a thickness direction of the diaphragm, and the conductive path is provided on a surface of the annular protrusion.

7. The audio module according to claim 1, wherein: The melting point of the liquefiable conductive medium is less than or equal to the lowest operating temperature of the audio module; Alternatively, the melting point of the liquefiable conductive medium is greater than the lowest operating temperature of the audio module and less than the highest operating temperature of the audio module.

8. An electronic device, characterized in that: Comprising the audio module as described in any one of claims 1-7.

9. A method for manufacturing a diaphragm assembly, characterized in that: include: Get the diaphragm; A conductive path is processed on the surface of the diaphragm to obtain the diaphragm assembly, wherein the conductive path includes a liquefiable conductive medium, which is in liquid form when the audio module to which the diaphragm assembly belongs is in a working state; the conductive path also includes a solid conductive medium, which is liquefied before the audio module to which the diaphragm assembly belongs is switched to a working state, and the liquid liquefiable conductive medium is used to conduct the disconnection of the solid conductive medium, so that the liquid conductive medium flows along the solid conductive medium.

10. The method for manufacturing a diaphragm assembly according to claim 9, wherein: The obtaining of the diaphragm includes: obtaining a flat diaphragm; The processing of the conductive path on the surface of the diaphragm includes: printing the conductive path on the membrane; The diaphragm is processed so that a portion of the diaphragm corresponding to the conductive path is raised along the thickness direction of the diaphragm to form an annular raised portion, so as to obtain the diaphragm assembly.

11. The method for manufacturing a diaphragm assembly according to claim 10, wherein: Printing the conductive path on the diaphragm includes: printing a liquefiable conductive medium on the surface of the membrane; Before forming the annular protrusion, a protective layer is processed on the surface of the liquefiable conductive medium, and the liquefiable conductive medium is located between the diaphragm and the protective layer; or, processing a conductive path on the surface of the diaphragm includes: After the annular protrusion is formed, a protective layer is processed on the surface of the liquefiable conductive medium, and the liquefiable conductive medium is located between the diaphragm and the protective layer.

12. The method for manufacturing a diaphragm assembly according to claim 10, wherein: The obtaining of the diaphragm includes: Obtaining a flat membrane sheet; Processing the diaphragm to form an annular protrusion protruding along the thickness direction of the diaphragm to obtain the diaphragm; Processing a conductive path on the surface of the diaphragm further comprises: The conductive path is printed on the surface of the annular protrusion.

13. The method for manufacturing a diaphragm assembly according to claim 12, wherein: Printing the conductive path on the surface of the annular raised portion includes: printing a liquefiable conductive medium on the surface of the annular protrusion; A protective layer is processed, and the liquefiable conductive medium is arranged between the protective layer and the annular protrusion.

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