Electrical connection device and method for mounting an electrical connection device

Abstract

The invention relates to an electrical connection device (1) comprising at least one contact (3; 4) and a carrier (2), wherein the carrier (2) comprises at least one accommodation (6; 7) and the contact (3; 4) is inserted into the accommodation (6; 7), wherein the carrier (2) comprises a printed circuit board (10) and at least one temperature sensor, wherein the temperature sensor is arranged on the printed circuit board (10) in the vicinity of the contact (3; 4). The invention furthermore relates to a method for mounting an electrical connection device (1).

Description

Technical Field

[0001] This invention relates to electrical connection devices and methods for installing electrical connection devices. Background Technology

[0002] A charging plug implemented as an electrical connection device is known from DE 10 2016 211 876 A1, the charging plug including at least one contact portion, at least one temperature sensor and at least one printed circuit board, wherein the contact portion is guided through a notch in the printed circuit board, and wherein the temperature sensor is arranged on the printed circuit board near the contact portion. Summary of the Invention

[0003] The objective of this invention is to develop an electrical connection device or a method for installing an electrical connection device, which can be manufactured or implemented cost-effectively and simply, by means of which the current temperature of at least one contact can be monitored particularly reliably, and by means of which a reliable connection can be established between the contact and the temperature monitoring device.

[0004] The electrical connection device according to the present invention includes at least one contact and a carrier.

[0005] - wherein the carrier includes at least one receiving portion and the contact portion is inserted into the receiving portion.

[0006] -The carrier includes a printed circuit board and at least one temperature sensor.

[0007] -The temperature sensor is arranged on a printed circuit board near the contact portion.

[0008] - The printed circuit board includes an electrically insulating layer and a conductive upper layer separated from the support plate by the electrically insulating layer.

[0009] -The conductive upper layer is disposed in the region of the recess in the electrical insulating layer, and includes an external connection region and an internal contact region.

[0010] -The internal contact area is formed by the contact portion passing through the notch of the support plate, such that the conductive upper layer abuts against the side of the contact portion.

[0011] Electrical connection devices can be manufactured by simply placing a conductive upper layer on the side.

[0012] Furthermore, it is specified that the conductive upper layer is connected to the electrical insulating layer via a notch surrounding the electrical insulating layer. This effectively prevents the conductive upper layer from slipping.

[0013] It is also specified that the support plate is constructed to be rigid, and the printed circuit board is constructed to be flexible compared to the support plate. Thus, the flexible printed circuit board gains stability through the support plate.

[0014] Furthermore, the printed circuit board includes a conductive lower layer as a third layer, wherein the conductive lower layer is current-separated from the conductive upper layer by an electrically insulating layer. A temperature sensor is disposed on the conductive lower layer and connected to a contact portion constructed through the conductive lower layer. The temperature sensor is positioned such that it is opposite to a segment of the conductive upper layer. The insulating layer is made, in particular, of polyimide. This structure allows for reliable monitoring of the temperature of each contact portion because the thermally conductive components have only low heat capacity and are minimally spaced from each other for electrical insulation. Therefore, temperature changes at each contact portion can be detected by the temperature sensor with a small delay. By using polyimide for the insulating layer, the insulating layer has thermal conductivity, allowing the conductive upper and conductive lower layers to be thermally coupled to each other. The conductive upper and conductive lower layers are implemented as copper layers in a heat-storing manner, but have low inertia in terms of temperature changes relative to the heat source formed by the contacts.

[0015] Furthermore, it is specified that at least one recess is provided in the support plate, wherein the recess is open towards the upper side of the support plate facing the printed circuit board, and wherein the recess is positioned and sized such that the temperature sensor is accommodated within the recess. Thus, the temperature sensor is mechanically protected and also electrically insulated relative to the one or more contacts, thereby ensuring interference-free operation.

[0016] It also stipulates that,

[0017] Connect the contact part of the temperature sensor to the circuit.

[0018] - The circuitry is formed as printed conductors through a conductive underlayer, wherein the circuitry has a zigzag path toward the temperature sensor, and

[0019] Specifically, it is specified that the electrical connection device includes a regulating device and at least one temperature sensor is connected to the regulating device via a line.

[0020] -In particular, it is specified that the printed circuit board includes a polyimide film covering the printed conductors.

[0021] Undesirable heat dissipation is reduced by the zigzag routing of the printed conductors, thereby preventing distortion of measurement results. The printed conductors are additionally electrically insulated and protected by a polyimide film.

[0022] Furthermore, it is specified that the electrical connection device is equipped with an upper cover plate placed on the printed circuit board and / or a lower cover plate placed on the support plate. The cover plate further stabilizes the support plate, enabling it to reliably hold at least one contact pin. Additionally, the lower cover plate optimizes the placement of a conductive upper layer on the one or more contacts.

[0023] It is also specified that the upper side of the support plate, adjacent to its recess, is constructed as a primary bent edge, through which the conductive upper layer of the printed circuit board is bent by 5° to 90°, and particularly by at least 15°. Thus, the support plate itself becomes an installation tool, simplifying the manufacture of electrical connection devices.

[0024] Furthermore, it is specified that the electrical connection device is equipped with a top cover plate, wherein the top cover plate includes an upper through-hole aligned with a recess in the printed circuit board, wherein the top cover plate covers the upper side of the printed circuit board, and / or wherein the electrical connection device is equipped with a bottom cover plate, wherein the bottom cover plate includes a lower through-hole aligned with a recess in the printed circuit board, wherein the bottom cover plate covers the lower side of the support plate. Thus, in each of the three structural shapes, a stabilized carrier is formed, which can reliably hold the one or more contacts.

[0025] Furthermore, it is specified that the wraparound edge of the lower cover plate constitutes a secondary curved edge, and the upper side of the lower cover plate turns into a lower through-hole at the wraparound edge. A conductive upper layer of a printed circuit board is angletted onto the side of the contact portion through the secondary curved edge, such that the conductive upper layer is clamped between the inner side of the lower through-hole and the side of the contact portion. Thus, the lower cover plate itself becomes another mounting tool, simplifying the manufacture of electrical connection devices and establishing reliable contact with the conductive upper layer.

[0026] It is also specified that the electrical connection device is equipped with two contacts and the carrier, wherein the carrier includes the support plate and the printed circuit board, and in particular an upper cover plate and a lower cover plate, wherein these plates are interconnected and each includes a groove arranged between the contacts, wherein the contacts are arranged in a mirror manner relative to the grooves. This achieves electrical and thermal insulation of the contacts, making the measurement results less susceptible to the influence of the other contact. Better electrical insulation is achieved, in particular, by increasing the creepage distance.

[0027] Furthermore, it is specified that the notch in the support plate is constructed as a polygonal notch, and the lower through hole in the lower cover plate is constructed as a circle. Specifically, it is specified that the lower through hole, in its projection along the longitudinal axis of the contact portion, forms the inscribed circle of the polygonal notch. Thus, during installation, when one or more contact portions are pushed into their receiving portions, the carrier's influence on the formation of the conductive upper layer of the printed circuit board gradually increases with the advancement of the insertion path, thereby avoiding sudden and potentially damaging formation of the conductive upper layer.

[0028] It is further specified that the outer connection area of ​​the conductive upper layer surrounds the recess of the printed circuit board in a ring shape, and the inner contact area of ​​the conductive upper layer is formed by contact protrusions emanating from the outer connection area. Specifically, it is specified that the number of contact protrusions corresponds to the number of angles of the polygonal recess of the support plate. This further facilitates the forming of the conductive upper layer, which constitutes the contact protrusions as part of the printed circuit board, and thus ensures error-free manufacturing of the electrical connection device.

[0029] Furthermore, it is specified that the contact portion is equipped with a surrounding collar protruding from its side, and that the lower annular side of the collar rests on the outer connection area of ​​the conductive upper layer of the printed circuit board. This further increases the contact area between the contact portion and the conductive upper layer, allowing for faster and more reliable extraction of the current temperature of the contact portion.

[0030] Finally, it is stipulated that the electrical connection device shall be constructed as a charging plug and at least one contact portion shall be constructed as a contact pin, or the electrical connection device shall be constructed as a charging socket and at least one contact portion shall be constructed as a contact sleeve. Thus, since the carrier of the electrical connection device can be used to manufacture both charging plugs and charging sockets, manufacturing can be simplified.

[0031] According to the method for installing electrical connection devices of the present invention,

[0032] -The electrical connection device wherein the electrical connection device includes a carrier having at least one receiving portion and at least one contact portion,

[0033] -The carrier, viewed in the pushing direction of the contact portion, includes a printed circuit board with a conductive upper layer, particularly a primary curved edge with polygonal surrounding and a secondary curved edge with circular surrounding.

[0034] -The upper layer, which is both electrically and thermally conductive, extends into the receiving portion, especially with contact protrusions.

[0035] And it includes the following steps:

[0036] - Push the contact portion in until it touches the conductive upper layer extending into the receiving portion.

[0037] - Continue pushing the contact portion into the receiving portion, and in this case, bend the conductive upper layer at the primary bending edge through the contact portion, and in particular, also bend the electrical insulating layer, and

[0038] - Continue pushing the contact portion into the receiving portion, and in this case, bend the conductive upper layer and, in particular, the electrical insulating layer at the secondary bending edge through the contact portion, and place the contact protrusion on the side of the contact portion, so that the conductive upper layer is placed entirely on the side of the contact portion in the area following the secondary bending edge.

[0039] Because reliable contact is made between the one or more contacts and the conductive upper layer when the contacts are pushed into the one or more receiving portions of the carrier, this method enables the cost-effective and simple manufacture of electrical connection devices. This tool-free installation reliably establishes optimal connection between the conductive upper layer and the one or more contacts, allowing for particularly reliable monitoring of the current temperature of at least one contact.

[0040] In the context of this invention, temperature sensors are understood in particular as thermistors, semiconductors, integrated circuits, or thermal radiation sensors. Attached Figure Description

[0041] Further details of the invention are described in the accompanying drawings with reference to embodiments shown schematically.

[0042] In this case:

[0043] Figure 1 An electrical connection device according to the invention is shown in perspective, wherein the second contact portion is hidden;

[0044] Figure 2 Show Figure 1 An exploded view of the diagram, in which the adjustment device is hidden;

[0045] Figure 3 Show Figure 1 and Figure 2 A perspective view of the various components of the electrical connection device shown;

[0046] Figure 4 Shown from the opposite viewpoint Figure 2 A portion of the exploded diagram shown, and

[0047] Figure 5 A top view is shown of the support plate and the lower cover plate arranged below the support plate. Detailed Implementation

[0048] exist Figure 1 The electrical connection device 1 according to the present invention is shown in perspective view. The electrical connection device 1 includes a carrier 2, a first contact portion 3, a second contact portion 4 shown only symbolically by lines, and an adjustment device 5 shown symbolically. The second contact portion 4 is implemented in the same manner as the first contact portion 3. The contact portion 3 is received in a first receiving portion 6 of the carrier 2. The second contact portion 4 is received in a second receiving portion 7 of the carrier 2. Furthermore, the carrier 2 includes slots S9-S10.

[0049] exist Figure 2 The electrical connection device 1 is shown in an exploded view, with the adjustment device 5 hidden.

[0050] Carrier 2 includes an upper cover plate 9, a flexible printed circuit board 10, a support plate 12, and a lower cover plate 11 (see also...). Figure 1 ).

[0051] The flexible printed circuit board 10 includes an electrically insulating layer 14 as an intermediate layer. Furthermore, the printed circuit board 10 includes a conductive upper layer 15 disposed on the electrically insulating layer 14. (As shown in...) Figure 4 As can be seen from this, the aforementioned Figure 4 Shown from the opposite viewpoint Figure 2 The partial exploded view shown is in Figure 4 The printed circuit board 10 shown below includes a conductive lower layer 16 as a third layer.

[0052] The conductive lower layer 16 is electrically separated from the conductive upper layer 15 through the electrical insulating layer 14.

[0053] The carrier 2 also includes two temperature sensors 17 and 18. The temperature sensors are respectively arranged on the conductive lower layer 16 of the printed circuit board 10 near the first contact portion 3 or the second contact portion 4.

[0054] As from Figure 3 It can be known that the above Figure 3 Show Figure 1 and Figure 2 The diagram shows a perspective view of the various components of the electrical connection device 1, with temperature sensors 17 and 18 connected to contact points 17a, 17b and 18a, 18b constructed via the conductive lower layer 16. In this case, the electrical insulating layer 14... Figure 3 The middle part is hidden.

[0055] The conductive upper layer 15 is implemented in two parts and includes a first conductor region 19 assigned to the first contact portion 3 and a second conductor region 20 assigned to the second contact portion 4.

[0056] The first conductor region 19 is disposed in the region of the first recess A14 of the electrical insulating layer 14 and includes an external connection region 19a and an internal contact region 19b. In this case, the internal contact region 19b is formed through the first contact portion 3 through the first recess A12 of the support plate 12, such that the conductive upper layer 15 abuts against the side surface M3 of the first contact portion 3 with its contact region 19b.

[0057] The second conductor region 20 is disposed in the region of the second recess B14 in the electrical insulating layer 14 and includes an external connection region 20a and an internal contact region 20b. In this case, the internal contact region 20b is formed through the second contact portion 4 through the second recess B12 of the support plate 12, such that the conductive upper layer 15 abuts against the second contact portion 4 with its contact region 20b. Figure 3 The side view of M4 is shown in a partial manner.

[0058] The first temperature sensor 17 is positioned such that it faces a segment S19a of the external connection region 19a of the first conductor region 19 of the conductive upper layer 15. Thus, the temperature sensor 17 is separated from the first conductor region 19 of the conductive upper layer 15 only by the electrical insulating layer 14, such that the heat energy absorbed by the first conductor region 19 from the first contact portion 3 must be conducted only through a thin polyimide film, through which the electrical insulating layer 14 is formed. Therefore, the segment S19a of the first conductor region 19 and the first temperature sensor 17 arranged on the conductive lower layer 16 are arranged such that heat flows orthogonally through the electrical insulating layer 14 to reach the first temperature sensor 17. The second temperature sensor 18 is arranged in a similar manner.

[0059] In this configuration, the second temperature sensor 18 is positioned such that it is opposite to segment S20a of the external connection region 20a of the second conductor region 20 of the conductive upper layer 15. Thus, the temperature sensor 18 is separated from the second conductor region 20 of the conductive upper layer 15 only through the electrical insulating layer 14, ensuring that the temperature absorbed by the second conductor region 20 from the second contact portion 4 must be conducted only through the aforementioned polyimide film, through which the electrical insulating layer 14 is formed.

[0060] The conductive upper layer 15 is connected to the electrically insulating layer 14 around the recess A14 or B14 of the electrically insulating layer 14 and is specifically configured as a copper-clad portion applied to the electrically insulating layer 14. In the region of the recess A14 or B14, the conductive upper layer 15 is configured as a continuation of the copper-clad portion when the contacts 3 and 4 are not inserted, the continuation extending freely into the recess A14 or B14. It is also specified that the electrically insulating layer 14, configured as a polyimide film, extends into the recess A14 or B14 as a support for the conductive upper layer 15.

[0061] The inner contact region 19b of the first conductor region 19 of the conductive upper layer 15 is configured as an annulus with multiple radially outward slots relative to the longitudinal axis L3 of the first contact portion 3, facing the outer connection region 19a of the first conductor region 19. The annulus has multiple contact protrusions 19-1, 19-2 (shown only by illustration) connected to the outer connection region 19a. Figure 1 , 2 3 and 4).

[0062] The inner contact region 20b of the second conductor region 20 of the conductive upper layer 15 is configured as an annulus having multiple radially outward slots relative to the longitudinal axis L4 of the second contact portion 4, facing the outer connection region 20a of the second conductor region 20. The annulus has multiple contact protrusions 20-1, 20-2 (shown only illustratively) connected to the outer connection region 20a. Figure 1 , 2 3 and 4).

[0063] The support plate 12 is constructed to be rigid, while the printed circuit board 10 is constructed to be flexible compared to the support plate 12. The printed circuit board 10 is implemented as a three-layer structure, wherein the conductive upper layer 15 is constructed as a copper-clad portion, the electrically insulating layer 14 is constructed as a polyimide film, and the conductive lower layer 16 is constructed as another copper-clad portion. Accordingly, the printed circuit board consists of three thin films. It is also specified that the upper layer 15 and the lower layer 16 are respectively covered with polyimide films (not shown) for electrical insulation in areas where they are not in contact.

[0064] As from Figure 2 and 4 As can be seen, the support plate 12 includes two recesses 21 and 22, which are open on the upper side 12a facing the printed circuit board 10. The recesses 21 and 22 are positioned and sized such that a first temperature sensor 17 is accommodated in the first recess 21 and a second temperature sensor 18 is accommodated in the second recess 22. The recesses 21 and 22 respectively constitute an enclosure for the first temperature sensor 17 or the second temperature sensor 18, through which the first and second temperature sensors are also electrically insulated relative to the contact pins.

[0065] Contacts 17a, 17b or 18a, 18b are connected to three lines 23, 24, 25, to which the first or second temperature sensor 17, 18 is connected. These lines 23, 24, 25 are formed as printed conductors 26, 27, 28 by a conductive underlayer 16. The printed conductors 26, 27, 28 have a zigzag path toward the temperature sensors 17, 18. In particular, these printed conductors 26, 27, 28 are each covered by one of the polyimide films (not shown) mentioned above. As already mentioned above, the electrical insulating layer 14 of the printed circuit board 10... Figure 3 The middle part is hidden, and only the conductive upper layer 15, which includes the first conductor region 19 and the second conductor region 20, is shown, as well as the conductive lower layer 16, which includes contact portions 17a, 17b, 18a, 18b and printed wires 26, 27, 28.

[0066] Temperature sensors 17 and 18 are connected to the regulating device 5 via lines 23, 24, and 25, such that the regulating device can trigger a reduction in the charging current, for example, when the critical temperature of the first and / or second contacts 3 and 4 is about to occur.

[0067] For example, especially from Figure 1 and 2 As can be seen, the upper cover plate 9 is placed on the printed circuit board 10, and the lower cover plate 11 is abutted against the support plate 12, thus ensuring the compact structure of the carrier 2. In this case, the aforementioned plates are bonded to each other or otherwise connected.

[0068] The upper side 12a of the support plate 12 is configured as primary curved edges 31 and 32 by surrounding edges 29 and 30 adjacent to the first recess A12 or the second recess B12. Through these curved edges 31 and 32 of the support plate, the conductive upper layer 15, in the form of the first conductor region 19 and the second conductor region 20, is bent by almost 90°, particularly through the first contact portion 3 or the second contact portion 4, in the completed installation state of the electrical connection device 1. In this case, bending occurs in the transition region between the outer connection region 19a or 20a of the first conductor region 19 or the second conductor region 20 and the inner contact region 19b or 20b of the first conductor region 19 or the second conductor region 20 of the conductive upper layer 15. Figure 3 and 4 The conductive upper layer 15 in this bent state is shown in the figure. Figure 4 The exploded view only schematically shows the contact portion. As long as (as stated above) the upper layer 15 is supported in the region of notch A14 or B14 by the electrically insulating layer 14 configured as a polyimide film, the electrically insulating layer 14 will naturally also bend along with it, wherein the electrically insulating layer... Figure 3 Not shown in the image. From... Figure 3 It can be seen how the internal contact area 19b is attached to the side M3 of the first contact part 3 and how the internal contact area 10b is attached to the side M4 of the contact part 4.

[0069] The upper cover plate 9 includes upper through holes A9 and B9 that align with recesses A14 and B14 of the printed circuit board 10 or its electrical insulating layer 14. The lower cover plate 11 includes lower through holes A11 and B11 that align with recesses A14 and B14 of the printed circuit board 10 or its electrical insulating layer 14. The receiving portions 6 and 7 of the carrier 2 are formed by the aforementioned recesses and through holes.

[0070] Secondary curved edges 35 and 36 are formed around the through holes A11 and B11 at the upper side 11a of the lower cover plate 11. Through these curved edges 35 and 36, a conductive upper layer 15 of the printed circuit board 10 is molded on the sides M3 and M4 of the contact portions 3 and 4 in the form of a first conductor region 19 and a second conductor region 20 having their internal contact regions 19b or 20b, such that the conductive layer 15 is clamped and pressed between the inner sides 37 and 38 of the lower through holes A11 and B11 and the sides M3 or M4 of the contact portions 3 and 4.

[0071] The two contact portions 3 and 4 of the electrical connection device 1 are arranged parallel to each other with respect to their longitudinal axes L3 and L4. For better electrical insulation, the support plate 12, the printed circuit board 10, the upper cover plate 9, and the lower cover plate 11 each include slots S12, S10, S9, and S11. The contact portions 3 and 4 are arranged in a mirror image with respect to the slots S12, S10, S9, and S11.

[0072] Especially from Figure 2 , 4 As can be seen from Figure 5, the recesses A12 and B12 in the support plate 12 are constructed as polygonal recesses, and the through holes A11 and B11 in the lower cover plate 11 are constructed as circular holes. The lower cover plate 11... Figure 5 The lower cover plate 11 is arranged below the support plate 12. The through holes A11 and B11 of the lower cover plate 11 (viewed in the projection along the longitudinal axes L3 and L4 extending perpendicularly into the plane of the attached drawing along the contact portions 3 and 4) respectively form the inscribed circles 39 and 40 of the polygonal recesses A12 or B12 of the support plate 12. Accordingly, when the contact portions 3 and 4 are pushed into the receiving portions 6 and 7 of the carrier 2 in the region of the support plate 12, the contact protrusions 19-1, 19-2 or 20-1, 20-2 of the first conductor region 19 or the second conductor region 20 of the conductive upper layer 15 are first bent, and then the contact protrusions 19-1, 19-2 or 20-1, 20-2 are placed in the region of the lower cover plate 11 in a planar manner onto the first contact portion 3 or the second contact portion 4.

[0073] The external connection area 19a or 20a of the printed circuit board 10 surrounds the recesses A14 and B14 of the printed circuit board 10 in a ring shape, and the internal contact area 19b or 20b of the printed circuit board 10 is formed by contact protrusions 19-1, 19-2 or 20-1, 20-2, which originate from the external connection area 19a or 20a, respectively. In this case, the number of contact protrusions 19-1, 19-2 or 20-1, 20-2 corresponds to the number of corners of the polygonal recesses A12 or B12 of the support plate 12, respectively.

[0074] According to the above implementation scheme, the contact protrusions 19-1, 19-2 or 20-1, 20-2, which are composed of conductive upper layer 15 segments and electrically insulating layer 14 segments, can be configured as contacts connected to external connection areas 19a or 20a, respectively.

[0075] The two contacts 3 and 4 each include a surrounding collar K3 protruding from its side M3. Using the annular lower side KU3 of this collar K3, contacts 3 and 4 respectively abut against the outer connection area 19a or 20a of the conductive upper layer 15 of the printed circuit board 10, so that heat is also transferred from the contacts 3 or 4 to the first conductor area 19 or the second conductor area 20. Beyond the contact surfaces used by the contact pins KS3 and KS4 on the conductive upper layer 15, the conductive upper layer is also protected from damage and, in particular, from peeling in its outer connection area 19a or 20a by an insulating layer (not shown), which is, for example, made of the aforementioned polyimide film. Contact 4 is shown only schematically in this figure, but has a similar structural form to contact 3. Here, during installation, contacts 3 and 4 are positioned along the insertion direction x (see...). Figure 2 They are pushed into the receiving parts 6 and 7 of the carrier 2.

[0076] The through holes A9 and B9 of the upper cover plate 9 are sized such that the through holes respectively accommodate the collar K3 of the contact portion 3 or 4, so that the contact portion is respectively placed on the printed circuit board 10 by means of its collar K3.

[0077] Figures 1 to 5 The electrical connection device 1 shown is configured as a charging plug LS, and its contact portions 3 and 4 are configured as contact pins KS3 and KS4, respectively.

[0078] According to one implementation variation, the electrical connection device is configured as a charging socket, wherein its contact portion is configured as a contact sleeve.

[0079] A method for installing electrical connection device 1 is specified.

[0080] - The electrical connection device 1 includes a carrier 2 having at least one receiving portion 6, 7 and at least one contact portion 3, 4.

[0081] - Viewed in the pushing direction x of the contacts 3 and 4, the carrier 2 includes a printed circuit board 10, which has a conductive upper layer 15, particularly polygonal surrounding primary curved edges 31 and 32, and particularly circular surrounding secondary curved edges 35 and 36, and

[0082] -The conductive upper layer 15, in particular, extends into the receiving portions 6 and 7 via contact protrusions 19-1, 19-2, 20-1, and 20-2.

[0083] And specify the steps:

[0084] - Push in the contact portions 3 and 4 until they touch the conductive upper layer 15 that extends into the receiving portions 6 and 7.

[0085] - Continue pushing the contacts 3 and 4 into the receiving portions 6 and 7, and in this case, the conductive upper layer 15 is bent at the primary bending edges 31 and 32 by the contacts 3 and 4, and in particular, the electrically insulating layer 14 is also bent.

[0086] - Continue pushing the contacts 3 and 4 into the receiving portions 6 and 7, and in this case, the conductive upper layer 15 is bent at the secondary bending edges 35 and 36 by the contacts 3 and 4, and in particular the electrical insulating layer 14 is also bent, and the contact protrusions 19-1, 19-2, 20-1, 20-2 are placed at the sides M3 and M4 of the contacts 3 and 4, so that the conductive upper layer 15 is placed entirely at the sides M3 and M4 of the contacts 3 and 4 in the area following the secondary bending edges 35 and 36.

[0087] In principle, the conductive and thermally conductive upper layer 15 is constructed on the upper side of the electrically insulating layer 14 of the flexible printed circuit board 10, wherein the upper layer includes a first conductor region 19 and a second conductor region 20. The first conductor region 19 and the second conductor region 20 are respectively constructed as annularly extending copper-clad surfaces having contact protrusions 19-1, 19-2 or 20-1, 20-2 arranged in annular order to form contact sheets.

[0088] These surfaces are exposed in the inner contact areas 19b or 20b, respectively, without an insulating layer. These surfaces are also exposed in the outer contact areas 19a or 20a as annular regions (where contact pins KS3 or KS4 are placed with their collars K3), without an insulating layer, and are covered outside these annular regions with solder resist or a polyimide film. This covering of the conductive upper layer in all areas where it does not contact contact pins KS3 or KS4 serves for protection and insulation.

[0089] The outer contact areas 19a or 20a of the conductive upper layer 15 are configured in shape such that the outer contact areas extend beyond the temperature sensors 17 or 18 located on the conductive lower layer 16, wherein the temperature sensors 17 or 18 are respectively arranged on the underside of the electrical insulating layer 14.

[0090] The conductive lower layer 17 of the flexible printed circuit board 10 includes thin printed conductors 26 to 28 made of copper and pads or contact portions 17a, 17b, 18a, 18b for placing temperature sensors 17, 18 and connecting them as thermally decoupled as possible. The printed conductors 26 to 28 are also protected by a solder mask or polyimide. A minimum distance is maintained from the conductive lower layer 16 to the notches A14, B14 for contact pins KS3, KS4, where no copper is present.

[0091] Above the flexible printed circuit board 10, the carrier 2 includes an upper cover plate 9 with circular through holes A9 and B9. The through holes are used to center the contact pins KS3 or KS4 relative to the recesses A14 and B14 of the flexible printed circuit board 10.

[0092] Below the flexible printed circuit board 10, the carrier 2 optionally includes one or more plates (in this embodiment, these are carrier plate 12 and lower cover plate 11) that, through contact with said one or more plates 11, 12, contact protrusions 19-1, 19-2 or 20-1, 20-2 (also referred to as sheets) are molded onto the first contact pin KS3 and the second contact pin KS4 from their orientation relative to the horizontal of the printed circuit board 10 during a two-stage bending process when assembling the electrical connection device 1.

[0093] After assembly, especially by means of adhesive bonding, it is further stipulated that the components of carrier 2 are at least partially bonded to each other. This ensures that the first receiving part 6 and the second receiving part 7 for contact pins KS3 or KS4 are fully and concentrically constructed. Adhesive can also be used to reduce creepage distance.

[0094] List of reference numerals in the attached diagram:

[0095] 1 Electrical connection device

[0096] 2. Carrier

[0097] 3 First contact part

[0098] 4 Second contact part

[0099] 5. Adjustment device

[0100] The first receiving part for 3 in 6 2

[0101] The second receiving part for 4 in 7 2

[0102] 9 2 top cover plate

[0103] 10 2 printed circuit boards

[0104] 11 2 lower cover plate

[0105] 11a 11's upper side

[0106] 12 Support Plate

[0107] 12a 12's upper side

[0108] 14 10 electrical insulation layer

[0109] 15 10 conductive upper layer

[0110] 16 10 conductive lower layer

[0111] 17 First Temperature Sensor

[0112] Contact portions for 17 on 16 (17a, 17b)

[0113] 18 Second Temperature Sensor

[0114] 18a, 18b Contact portions on 16 for 18

[0115] The first conductor region of 19 15

[0116] 19a 19 external connection area

[0117] 19b 19 internal contact area

[0118] 19-1, 19-2, contact protrusions of 19, 15, or 10.

[0119] 20 15 Second conductor region

[0120] 20a 20 external connection area

[0121] 20b 20 internal contact area

[0122] 20-1, 20-2, 20 or 15 or 10 contact protrusions

[0123] 21, 22, and 12 are used for the recesses in 17 and 18.

[0124] Lines 23-25 ​​leading to lines 17 and 18

[0125] 26-28 Printed conductors consisting of 16 wires

[0126] 29, 30 Wrap-around edges from 12 to A12 or B12

[0127] 31, 32 1. The first curved edge formed by 29 or 30 at 12 locations.

[0128] 33, 34. The wraparound edge around A11, B11 at point 11a of 11.

[0129] 35, 36 2. The second curved edge formed by 33 and 34 at point 11.

[0130] 37, 38. Inner surfaces of A11, B11

[0131] 39, 40 The inscribed circle formed by A11 and B11

[0132] Through holes in A9 and B9

[0133] Through holes in A11 and B11 11

[0134] The first and second polygonal notches in A12 and B12 12

[0135] The first and second notches in A14 and B14 14

[0136] The rings in K3 and 3

[0137] KU3 K3 bottom side

[0138] KS3 and KS4 are contact pins composed of pins 3 and 4.

[0139] The longitudinal axes of L3, L4, and L4

[0140] LS charging plug

[0141] Side views of M3 and M4 (M3 and M4)

[0142] Slots in S9-S12 (9, 10, 11, 12)

[0143] S19a, S20a Segmentation of 19a and 20a

[0144] x is the direction of push-in.

Claims

1. An electrical connection device (1), the electrical connection device comprising: - At least one contact part (3; 4) and carrier (2). - Support plate (12). -The carrier (2) includes at least one receiving portion (6; 7) and the contact portion (3; 4) is inserted into the receiving portion (6; 7). -The carrier (2) includes a printed circuit board (10) and at least one temperature sensor (17; 18). -The temperature sensors (17; 18) are arranged on the printed circuit board (10) near the contacts (3; 4). -The printed circuit board (10) therein includes an electrically insulating layer (14) and a conductive upper layer (15) separated from the support plate (12) by the electrically insulating layer (14). -The conductive upper layer (15) is disposed in the region of the recess (A14; B14) of the electrically insulating layer (14), and includes an external connection region (19a; 20a) and an internal contact region (19b; 20b). -The internal contact areas (19b; 20b) are formed through the contact portions (3; 4) through the recesses (A12; B12) of the support plate (12), such that the conductive upper layer (15) rests against the side surfaces (M3; M4) of the contact portions (3; 4). -The upper side (12a) of the support plate (12) is configured as a primary curved edge (31; 32) adjacent to its notch (A12; B12), and the conductive upper layer (15) of the printed circuit board (10) is bent by 5° to 90° through the primary curved edge.

2. The electrical connection device according to claim 1, characterized in that, The conductive upper layer (15) is connected to the electrical insulating layer (14) around the notch (A14; B14) of the electrical insulating layer (14).

3. The electrical connection device according to claim 1 or 2, characterized in that, The support plate (12) is constructed to be rigid, and the printed circuit board (10) is constructed to be flexible compared to the support plate (12).

4. The electrical connection device according to claim 1 or 2, characterized in that, The printed circuit board (10) includes a conductive lower layer (16) as a third layer, wherein the conductive lower layer (16) is current-separated from the conductive upper layer (15) through the electrical insulating layer (14), wherein the temperature sensors (17; 18) are disposed on the conductive lower layer (16) and connected to contact portions (17a, 17b; 18a, 18b) constructed through the conductive lower layer (16), wherein the temperature sensors (17; 18) are positioned such that the temperature sensors are opposite to segments (S19a; S20a) of the conductive upper layer (15).

5. The electrical connection device according to claim 1 or 2, characterized in that, The support plate (12) includes at least one recess (21; 22), wherein the recess (21; 22) is open on the upper side (12a) of the support plate (12) facing the printed circuit board (10), and the recess (21, 22) is positioned and sized such that the temperature sensor (17; 18) is accommodated in the recess (21; 22).

6. The electrical connection device according to claim 4, characterized in that, - The contact portions (17a, 17b; 18a, 18b) to which the temperature sensors (17; 18) are connected are connected to lines (23-25). - The lines (23-25) are formed in the form of printed conductors (26-28) through the conductive underlayer (16) and have a tortuous path toward the temperature sensor (17; 18).

7. The electrical connection device according to claim 6, characterized in that, The electrical connection device (1) includes an adjustment device (5) and the at least one temperature sensor (17; 18) is connected to the adjustment device (5) via the line.

8. The electrical connection device according to claim 1 or 2, characterized in that, - The electrical connection device (1) includes a top cover (9) placed on the printed circuit board (10) and / or - The electrical connection device (1) includes a lower cover plate (11) placed on the support plate (12).

9. The electrical connection device according to claim 1 or 2, characterized in that, The upper side (12a) of the support plate (12) is configured as a primary bent edge (31; 32) adjacent to its notch (A12; B12), and the conductive upper layer (15) of the printed circuit board (10) is bent by at least 15° through the primary bent edge.

10. The electrical connection device according to claim 1 or 2, characterized in that, - The electrical connection device (1) includes a top cover (9), wherein the top cover (9) includes an upper through hole (A9; B9) aligned with a notch (A12, A14; B12, B14) of the printed circuit board (10), wherein the top cover (9) covers the upper side of the printed circuit board (10), and / or - The electrical connection device (1) includes a lower cover plate (11), wherein the lower cover plate (11) includes a lower through hole (A11; B11) aligned with a notch (A12, A14; B12, B14) of the printed circuit board (10), wherein the lower cover plate (11) covers the lower side of the support plate (12).

11. The electrical connection device according to claim 10, characterized in that, The surrounding edges (33, 34) of the lower cover plate (11) form secondary curved edges (35; 36). The upper side of the lower cover plate (11) turns into the lower through hole (A11; B11) at the surrounding edge. The conductive upper layer (15) of the coupling plate (13) is molded on the side surface (M3; M4) of the contact portion (3; 4) through the secondary curved edge, so that the conductive upper layer (15) is clamped between the inner side surface (37; 38) of the lower through hole (A11; B11) and the side surface (M3; M4) of the contact portion (3; 4).

12. The electrical connection device according to claim 1 or 2, characterized in that, The electrical connection device (1) includes two contact portions (3; 4) and the carrier (2), wherein the carrier (2) includes the support plate (12), the printed circuit board (10), the upper cover plate (9), and the lower cover plate (11), wherein these plates are interconnected and each includes a groove (S9; S10; S11; S12) arranged between the contact portions (3; 4), wherein the contact portions (3; 4) are arranged in a mirror manner relative to the grooves (S9; S10; S11; S12).

13. The electrical connection device according to claim 11, characterized in that, The recesses (A12; B12) in the support plate (12) are constructed as polygonal recesses, and the lower through holes (A11; B11) in the lower cover plate (11) are constructed as circular.

14. The electrical connection device according to claim 13, characterized in that, The lower through holes (A11; B11) form the inscribed circles (39, 40) of the polygonal notch in the projection along the longitudinal axis (L3; L4) of the contact portion (3; 4).

15. The electrical connection device according to claim 1 or 2, characterized in that, The outer connection regions (19a; 20a) of the conductor regions (19; 20) of the conductive upper layer (15) surround the recess (A14; B14) of the printed circuit board (10) in a ring shape, and the inner contact regions (19b; 20b) of the conductive upper layer (15) are formed by contact protrusions (19-1, 19-2; 20-1, 20-2) originating from the outer connection regions (19a; 20a).

16. The electrical connection device according to claim 15, characterized in that, The number of the contact protrusions (19-1, 19-2; 20-1, 20-2) corresponds to the number of corners of the polygonal notch (A12; B12) of the support plate (12).

17. The electrical connection device according to claim 1 or 2, characterized in that, The contact portion (3; 4) includes a circumferential collar (K3) protruding from its side (M3; M4), and the annular lower side (KU3) of the collar (K3) abuts against the outer connection area (19a; 20a) of the conductive upper layer (15) of the printed circuit board (10).

18. The electrical connection device according to claim 1 or 2, characterized in that, - The electrical connection device (1) is configured as a charging plug (LS) and the at least one contact (3; 4) is configured as a contact pin (KS3; KS4), or - The electrical connection device (1) is configured as a charging socket, and the at least one contact portion is configured as a contact sleeve.

19. A method for installing an electrical connection device (1), -The electrical connection device (1) mentioned therein includes a carrier (2) having at least one receiving portion (6; 7) and at least one contact portion (3; 4). -The carrier (2) in the pushing direction (x) of the contact portion (3; 4) includes a printed circuit board (10) having a conductive upper layer (15) and an electrically insulating layer (14), a surrounding primary curved edge (31; 32) and a surrounding secondary curved edge (35; 36). - The conductive and thermally conductive upper layer (15) extends into the receiving portion (6; 7) to contact the protrusions (19-1, 19-2; 20-1, 20-2). The method includes the following steps: - Push the contact portion (3; 4) in until the contact portion (3; 4) touches the conductive upper layer (15) extending into the receiving portion (6; 7). - Continue pushing the contact portion (3; 4) into the receiving portion (6; 7), and in this case, the conductive upper layer (15) and the electrically insulating layer (14) are bent at the primary bending edge (31; 32) by the contact portion (3; 4), and - Continue pushing the contact portion (3; 4) into the receiving portion (6; 7), and in this case, bend the conductive upper layer (15) and also the electrical insulating layer (14) at the secondary bending edge (35; 36) through the contact portion (3; 4), and place the contact protrusions (19-1, 19-2; 20-1, 20-2) on the side (M3; M4) of the contact portion (3; 4), such that the conductive upper layer (15) is placed entirely on the side (M3; M4) of the contact portion (3; 4) in the area following the secondary bending edge (35; 36).

20. The method according to claim 19, characterized in that, The primary curved edges (31; 32) are polygonal.

21. The method according to claim 19, characterized in that, The secondary curved edges (35; 36) are circularly surrounding.

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