Splitting device

Abstract

The present invention provides a splitting device, including a first splitting device, the first splitting device including: a first supporting assembly, having a first top surface and a first bottom surface, the first top surface forming a first supporting surface, the first supporting assembly being provided with a first hollow portion penetrating the first top surface and the first bottom surface; a first fixing structure, provided on the first supporting assembly, to fix the part to be split on the first supporting surface; a first breaking assembly, provided on one side of the first supporting assembly; a first clamping structure, provided on the first breaking assembly, to clamp the part to be split. The technical solution of the present application can effectively solve the problem that the splitting device in the related art is expensive and has high requirements on the operating environment.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing equipment technology, and more specifically, to a slitting device. Background Technology

[0002] As a part of gene analysis and detection technology, biochips have a wide range of applications in the life science research field due to their large information capacity, small size, automated analysis process, fast analysis speed, and small sample and reagent requirements. Existing biochips are generally made relatively large due to throughput and cost requirements. However, with the rise of space transcriptomics research, the use of large-area silicon chips will lead to serious waste of precious reagents and difficulties in transportation and preservation. Therefore, considering the significant impact of silicon chip size on the difficulty and cost of subsequent processing, there is a demand for a large number of small-sized silicon chips with biological signals.

[0003] Due to the unique nature of DNB (DNA Nanoball) signals on biochips, they cannot be heated to high temperatures, and their surfaces cannot be touched with protective films. Traditional laser cutting techniques cannot solve the problems of excessively large heat-affected zones and slag spatter contamination. Therefore, silicon wafers with DNB signals are not suitable for traditional laser cutting. The existing technological solution is laser stealth cutting. Laser stealth cutting uses optical shaping to focus individual pulses of a pulsed laser through the material surface. The high energy density at the focal point creates a multiphoton absorption nonlinear absorption effect, causing material modification and crack formation. Each laser pulse acts at equal intervals, creating equidistant damage and forming a modified layer within the material. At the modified layer, the molecular bonds of the material are broken, making the material's connections fragile and easily separated. After cutting, a dicing machine stretches the carrier film to fully separate the products, creating gaps between the chips, ultimately completing the silicon wafer cutting.

[0004] Although laser stealth cutting can be accurately cut using an image positioning system, it still requires the use of a specialized dicing machine. It also has disadvantages such as high cost, high requirements for the instrument's operating environment, inability to cut with liquid, and the need to dry the silicon wafer before cutting to avoid damage to the signal. Therefore, it is not suitable for use in the early research and development stage. Summary of the Invention

[0005] The main objective of this invention is to provide a segmentation device to solve the problems of high cost and high requirements for operating environment in related technologies.

[0006] To achieve the above objectives, the present invention provides a dividing device, including a first dividing device, the first dividing device comprising: a first supporting component having a first top surface and a first bottom surface, the first top surface forming a first supporting surface, and a first hollow portion penetrating the first top surface and the first bottom surface on the first supporting component; a first fixing structure disposed on the first supporting component to fix the component to be divided on the first supporting surface; a first breaking component disposed on one side of the first supporting component; and a first clamping structure disposed on the first breaking component to clamp the component to be divided.

[0007] According to the technical solution of this invention, the dividing device includes a first dividing device. The first dividing device includes a first supporting component, a first fixing structure, a first breaking component, and a first clamping structure. The first top surface of the first supporting component forms a first supporting surface. During dividing, the part to be divided is placed on the first supporting surface and fastened to the first supporting component by the first fixing structure. The first supporting component is provided with a first hollow portion penetrating the first top surface and the first bottom surface, allowing the operator to insert a scriber into the first supporting component through the first hollow portion and form a dividing scratch on the bottom of the part to be cut. The first breaking component is located on one side of the first supporting component, allowing the operator to extend the part to be cut outside the first supporting component. The first clamping structure cooperates with the first breaking component to clamp the part of the part to be cut that extends outside the first supporting component, and the dividing scratch is located between the first supporting component and the first breaking component. By operating the first breaking component, the part to be divided is broken, thus achieving the dividing function. The above-mentioned first dividing device has the advantages of simple structure, can be operated manually, can cut with liquid, and has no special environmental requirements. Therefore, the technical solution of this application can effectively solve the problems of high price and high requirements for operating environment of the segmentation device in the related technology.

[0008] Furthermore, the first support assembly also includes a first base and a plurality of first support parts detachably disposed on the first base. The top surface of the first support part forms a first support surface. Each first support part is adjustablely disposed on the first base along a first direction. Each first support part is provided with a first hollow part, wherein the first direction is the moving direction of the component to be divided.

[0009] Furthermore, the plurality of first support parts include a plurality of first support bars and a plurality of limiting structures, with each of the plurality of first support bars corresponding to one of the plurality of limiting structures. Each limiting structure includes a first limiting pressure plate and a second limiting pressure plate. A first limiting boss is provided at the first end of each first support bar, and each first limiting pressure plate is connected to the first limiting boss. The first limiting pressure plate protrudes from the first limiting boss toward the second end of the first support bar. The second limiting pressure plate is connected to the second end of the first support bar, and a limiting step is provided on the lower surface of the second limiting pressure plate. The height of the first limiting boss is greater than the thickness of the component to be divided, and the limiting step... The height is greater than the thickness of the component to be divided; and / or, multiple first support parts include a second support bar, the first end of the second support bar is provided with a second limiting boss, the first fixing structure includes a first fixing plate and a second fixing plate, the first fixing plate is connected to the second limiting boss, the first fixing plate protrudes from the second limiting boss toward the second end of the second support bar, the second fixing plate is connected to the second end of the second support bar and a fixing step is provided on the lower surface of the second fixing plate, wherein the height of the second limiting boss is less than or equal to the thickness of the component to be divided, and the height of the fixing step is less than or equal to the thickness of the component to be divided.

[0010] Furthermore, the first dividing device also includes a driving structure, which includes a push rod movably disposed on the first base along a first direction. The push rod includes a top that abuts against the component to be divided. The driving structure also includes a guide structure, in which the push rod passes through.

[0011] Furthermore, the first breaking component includes a third support bar with a third elongated groove structure. A third limiting boss is provided at the first end of the third support bar. The first clamping structure includes a first clamping plate and a second clamping plate. The first clamping plate is connected to the third limiting boss and protrudes from the third limiting boss toward the second end of the third support bar. The second clamping plate is adjustablely disposed at the second end of the third support bar and has a clamping step on its lower surface. The height of the third limiting boss is greater than the thickness of the component to be divided, and the height of the clamping step is greater than the thickness of the component to be divided.

[0012] Furthermore, the dividing device also includes a second dividing device, which includes: a second support assembly having a second top surface and a second bottom surface, the second top surface forming a second support surface, and a second hollow portion penetrating the second top surface and the second bottom surface on the second support assembly; a second fixing structure disposed on the second support assembly to fix the part to be divided on the second support surface; a second breaking assembly disposed on one side of the second support assembly; and a second clamping structure disposed on the second breaking assembly to clamp the part to be divided.

[0013] Furthermore, the second support assembly also includes a second base and a plurality of second support parts detachably disposed on the second base. The top surface of the second support part forms a second support surface. Each second support part is adjustablely disposed on the second base along a second direction. Each second support part is provided with a second hollow part, wherein the second direction is the moving direction of the component to be divided.

[0014] Furthermore, the second base includes a side body portion, a first protrusion portion disposed at a first end of the side body portion, and a second protrusion portion disposed at a second end of the side body portion. A plurality of second support portions are located between the first protrusion portion and the second protrusion portion. The first protrusion portion is provided with a third hollow portion penetrating its top and bottom surfaces, and the second protrusion portion is provided with a fourth hollow portion penetrating its top and bottom surfaces. The top of the side body portion protrudes upward from the first and second protrusion portions, and a first limiting groove extending in a second direction is provided between the top of the side body portion and the second support surface. And / or, the second fixing structure includes a side clamping structure, the side clamping structure being movably engaged with the second base perpendicular to the second direction, and a second limiting groove extending in a second direction is provided between the top of the side clamping structure and the second support surface.

[0015] Furthermore, the second dividing device includes a first limiting groove and a second limiting groove. The first limiting groove includes a first vertical surface and a first inclined surface located above the first vertical surface. The second limiting groove includes a second vertical surface and a second inclined surface located above the second vertical surface. The first vertical surface and the second vertical surface form a straight groove, and the first inclined surface and the second inclined surface form a dovetail groove.

[0016] Furthermore, the second breaking assembly includes a third base and a width-limiting clamping block disposed on the third base. The second clamping structure is a movable clamping block, which is movably engaged with the third base perpendicular to the second direction. The width-limiting clamping block is adjustablely disposed on the third base, and a third limiting groove is provided on the width-limiting clamping block. A fourth limiting groove is formed between the movable clamping block and the third base. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0018] Figure 1 A three-dimensional structural schematic diagram of a first embodiment of the first dividing device according to the present invention is shown;

[0019] Figure 2 It shows Figure 1 An enlarged view of point A in the first dividing device;

[0020] Figure 3A three-dimensional structural schematic diagram of a second embodiment of the first dividing device according to the present invention is shown;

[0021] Figure 4 It shows Figure 1 A bottom view of the first dividing device;

[0022] Figure 5 It shows Figure 1 A three-dimensional structural diagram of the second clamping pressure plate of the first dividing device;

[0023] Figure 6 It shows Figure 1 A three-dimensional structural schematic diagram of the first breaking component and the first clamping structure of the first dividing device;

[0024] Figure 7 It shows Figure 1 A schematic diagram of the split structure of the first support bar and the limiting structure of the first dividing device;

[0025] Figure 8 It shows Figure 7 A cross-sectional schematic diagram of the first support bar and the limiting structure;

[0026] Figure 9 It shows Figure 1 A schematic diagram of the split structure of the second support bar and the first fixing structure of the first dividing device;

[0027] Figure 10 It shows Figure 9 A cross-sectional schematic diagram of the second support bar and the first fixing structure;

[0028] Figure 11 The part to be divided is shown in the figure. Figure 3 Top view of the first dividing device;

[0029] Figure 12 A three-dimensional structural schematic diagram of an embodiment of the second dividing device according to the present invention is shown;

[0030] Figure 13 It shows Figure 12 An enlarged view of point B of the second dividing device;

[0031] Figure 14 It shows Figure 12 An enlarged view of point C of the second dividing device;

[0032] Figure 15 It shows Figure 12 A three-dimensional structural diagram of another location of the second dividing device;

[0033] Figure 16 The part to be divided is shown in the figure. Figure 12Top view of the second dividing device;

[0034] Figure 17 It shows Figure 12 A cross-sectional schematic diagram of a portion of the third base and the second clamping structure of the second dividing device;

[0035] Figure 18 It shows Figure 12 A schematic diagram of the split structure of the second support component and the second fixing structure of the second segmentation device; and

[0036] Figure 19 A flowchart illustrating the operation of slicing silicon wafers using an embodiment of the slicing apparatus of the present invention is shown.

[0037] The above figures include the following reference numerals:

[0038] 1. First dividing device; S1. First direction; 10. First support assembly; 11. First support surface; 12. First hollow part; 13. First base; 131. First guide groove; 14. First support part; 141. First support bar; 1411. First limiting boss; 1412. First long groove structure; 142. Limiting structure; 1421. First limiting pressure plate; 14211. Anti-rotation nut; 1422. Second limiting pressure plate; 1423. Limiting step; 143. Second support bar; 1431. Second limiting boss; 1432. 20. Second long slot structure; 21. First fixing structure; 22. First fixing pressure plate; 22. Second fixing pressure plate; 221. Fixing step; 23. Fixing nut; 30. First break-off assembly; 31. Third support bar; 311. Third long slot structure; 312. Third limiting boss; 32. Hinge assembly; 33. Length limiting module; 40. First clamping structure; 41. First clamping pressure plate; 42. Second clamping pressure plate; 421. Clamping step; 50. Drive structure; 51. Push rod; 511. Top abutment; 52. Guide structure; 53. Support block;

[0039] 2. Second dividing device; S2. Second direction; 60. Second support assembly; 61. Second support surface; 62. Second hollowed-out portion; 63. Second base; 631. Side body portion; 6311. Second guide groove; 632. First protrusion; 6321. Third hollowed-out portion; 6322. Fourth limiting boss; 633. Second protrusion; 6331. Fourth hollowed-out portion; 634. Third guide groove; 64. Second support portion; 65. First limiting groove 651. First elevation; 652. First inclined surface; 66. Second limiting slide groove; 661. Second elevation; 662. Second inclined surface; 67. Clearance passage; 70. Second fixing structure; 71. Side clamping structure; 80. Second breaking component; 81. Third base; 82. Width limiting clamp; 83. Third limiting slide groove; 84. Fourth limiting slide groove; 85. Length limiting stop; 90. Second clamping structure; 91. Guide block; 911. Fourth guide slide groove;

[0040] 101. First guide post; 102. Second guide post; 201. Third guide post; 202. Fourth guide post; 203. Fifth guide post;

[0041] 3. Large pieces of biochips to be segmented; 4. Long strips of biochips to be segmented. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0044] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0045] Figure 1 A perspective structural diagram of a first embodiment of the first dividing device 1 of this application is shown. The first dividing device 1 includes a first support assembly 10, a first fixing structure 20, a first breaking assembly 30, and a first clamping structure 40. The first support assembly 10 has a first top surface and a first bottom surface, the first top surface forming a first support surface 11, and a first hollow portion 12 penetrating the first top surface and the first bottom surface. The first fixing structure 20 is disposed on the first support assembly 10 to fix the part to be divided on the first support surface. The first breaking assembly 30 is disposed on one side of the first support assembly 10. The first clamping structure 40 is disposed on the first breaking assembly 30 to clamp the part to be divided.

[0046] Applying the technical solution of this embodiment, the dividing device includes a first dividing device 1. The first dividing device 1 includes a first support component 10, a first fixing structure 20, a first breaking component 30, and a first clamping structure 40. The first top surface of the first support component 10 forms a first support surface 11. During the dividing operation, the part to be divided is placed on the first support surface 11, and the part to be divided is fastened to the first support component 10 by the first fixing structure 20. The first support component 10 is provided with a first hollow portion 12 that penetrates the first top surface and the first bottom surface, allowing the operator to insert a scriber into the first support component 10 through the first hollow portion 12 and form dividing scratches on the bottom of the part to be cut. The first breaking component 30 is disposed on one side of the first support component 10. The operator can extend the part to be cut beyond the first support component 10. The first clamping structure 40 cooperates with the first breaking component 30 to clamp the portion of the part to be cut extending beyond the first support component 10, and the aforementioned dividing scratch is located between the first support component 10 and the first breaking component 30. By operating the first breaking component 30, the part to be divided is broken, thus achieving the dividing function. The aforementioned first dividing device 1 has the advantage of simple structure, can be operated manually, can cut with liquid, and has no special environmental requirements. Therefore, the technical solution of this application can effectively solve the problems of high cost and high environmental requirements of dividing devices in related technologies.

[0047] Specifically, the first breaking component 30 is located downstream of the first support component 10. During the process of dividing the component to be divided, the component to be divided moves along the first support component 10, thus the first support component 10 has an upstream side and a downstream side. The upstream side and the downstream side are relative positions; the upstream side refers to the side that the component to be divided passes through first during its movement, and the downstream side refers to the side that the component to be divided passes through last during its movement. The component to be divided refers to a large piece of biochip 3 to be divided, see details below. Figure 11 .

[0048] The aforementioned first segmentation device 1 can be operated entirely manually, requiring no electricity or gas. It only requires a clean workbench, minimizing environmental requirements. Compared to laser stealth cutting, it can be performed anytime, anywhere, reducing variables and time during transportation. It eliminates the need for pre-cutting the component to be segmented with a high-energy laser, avoiding heat damage to biological signals. A small incision is made on the back of the component to be segmented (the small incision is located on...). Figure 11 As shown, the small opening (also known as the dividing scratch) is located near the lower edge of biochip 3. A slight directional force is then used to cause the component to be divided to naturally break along the predetermined edge, without chipping or debris. The entire process does not require pre-drying the biochip, and there is no contact between the biochip and the surface, reducing the risk of damaging the surface signal.

[0049] like Figure 1As shown, the first support assembly 10 further includes a first base 13 and a plurality of first support portions 14 detachably disposed on the first base 13. The top surface of each first support portion 14 forms a first support surface 11. Each first support portion 14 is adjustablely disposed on the first base 13 along a first direction S1. Each first support portion 14 is provided with a first hollow portion 12, wherein the first direction S1 is the direction of movement of the component to be divided (e.g., ...). Figure 1 (As shown). During analysis and testing, biological sequencing chips have various size requirements, such as 10mm*10mm, 15mm*15mm, etc., therefore the dicing device needs to adapt to these requirements. Each first support portion 14 is provided with a first cutout portion 12. During silicon wafer dicing, the operator inserts a scriber into the first cutout portion 12 and forms dicing marks on the bottom of the silicon wafer. Each first support portion 14 can be adjustablely disposed on the first base 13 along the first direction S1. This allows the distance between multiple first cutout portions 12 to be controlled by adjusting the distance between multiple first support portions 14, thereby controlling the distance between adjacent dicing marks on the bottom of the silicon wafer. Therefore, the first support assembly 10 of this embodiment has the advantage of adapting to various size requirements, is highly adaptable, and is easy to operate.

[0050] like Figure 1 , Figure 4 , Figure 7 and Figure 9 As shown, the first base 13 has first guide grooves 131 extending along the first direction S1 at both ends parallel to the first direction S1. Each first support part 14 has a first guide post 101 at both ends, and a fastening nut is provided at the lower end of the first guide post 101. When the fastening nut is unscrewed, the first support part 14 can be removed from the first base 13. When the fastening nut is loosened, the first guide post 101 can move along the first guide groove 131. When the first support part 14 is moved to the designated position, the fastening nut can be tightened to fix the first support part 14 to the first base 13.

[0051] like Figure 1 , Figure 2 , Figure 7 and Figure 8As shown, the plurality of first support parts 14 include a plurality of first support bars 141 and a plurality of limiting structures 142. The plurality of first support bars 141 and the plurality of limiting structures 142 are arranged one-to-one. Each limiting structure 142 includes a first limiting plate 1421 and a second limiting plate 1422. The first end of each first support bar 141 is provided with a first limiting boss 1411. Each first limiting plate 1421 is connected to the first limiting boss 1411. The first limiting plate 1421 protrudes from the first limiting boss 1411 toward the second end of the first support bar 141. The second limiting plate 1422 is connected to the second end of the first support bar 141, and a limiting step 1423 is provided on the lower surface of the second limiting plate 1422. The height of the first limiting boss 1411 is greater than the thickness of the component to be divided, and the height of the limiting step 1423 is greater than the thickness of the component to be divided. Multiple first support bars 141 are arranged parallel to each other, and each first support bar 141 is correspondingly provided with a first limiting pressure plate 1421 and a second limiting pressure plate 1422. Each first support bar 141 has a first limiting boss 1411 at its first end, which can cooperate with the side of the component to be divided (specifically, a silicon wafer). Each first limiting boss 1411 is provided with a first limiting pressure plate 1421, which protrudes from the first limiting boss 1411 toward the second end of the first support bar 141. This allows the first limiting pressure plate 1421 to extend beyond the first limiting boss 1411 and be positioned above the component to be divided, preventing the component to be divided from detaching from the first support assembly 10. The height of the first limiting boss 1411 is greater than the thickness of the component to be divided, meaning the first limiting pressure plate 1421 is higher than the upper surface of the component to be divided. This allows the first limiting pressure plate 1421 to perform its limiting function without hindering the movement of the component to be divided along the first direction S1, making the operation smoother and improving the dividing efficiency. The second limiting pressure plate 1422 is connected to the second end of the first support bar 141, and a limiting step 1423 is provided on the lower surface of the second limiting pressure plate 1422. The limiting step 1423 can limit the other side of the component to be divided, preventing the component to be divided from detaching from the first support assembly 10. Specifically, the first limiting pressure plate 1421 and the second limiting pressure plate 1422 are located on both sides of the component to be divided, and the horizontal distance between the first limiting boss 1411 and the limiting step 1423 is slightly greater than the distance between the two sides of the component to be divided that are limited, so that the component to be divided can only slide smoothly along the first direction S1. Meanwhile, the first limiting pressure plate 1421 and the second limiting pressure plate 1422 are located above the part to be divided. In this way, when the part to be divided is processed with a scriber, the lower surfaces of the first limiting pressure plate 1421 and the second limiting pressure plate 1422 can stop the part to be divided, preventing the part to be divided from falling off the first support assembly 10, thus having a good limiting effect.

[0052] At the same time, such as Figure 7 and Figure 8 As shown, the first limiting pressure plate 1421 is connected to the first limiting boss 1411 by screws. An anti-rotation nut 14211 is provided below the first limiting pressure plate 1421. Correspondingly, a groove is provided on the first limiting boss 1411 to cooperate with the anti-rotation nut 14211.

[0053] like Figure 7 and Figure 8 As shown, the first hollow portion 12 of the first support bar 141 is a first elongated groove structure 1412, and the second limiting pressure plate 1422 is adjustablely arranged along the first elongated groove structure 1412. In this way, the second limiting pressure plate 1422 can move along the first elongated groove to accommodate parts of different sizes to be divided. Simultaneously, the aforementioned first elongated groove structure 1412 not only allows for the adjustment of the second limiting pressure plate 1422 but also allows a scriber to be inserted into it to make cuts on the back of the part to be divided, resulting in a simple and compact structure. Specifically, the second limiting pressure plate 1422 is provided with a second guide post 102, which passes through the first elongated groove structure 1412. A nut is provided at the upper end of the second guide post 102. When the nut is loosened, the second limiting pressure plate 1422 can slide relative to the first support bar 141 to reach a designated position; when the nut is tightened, the second limiting pressure plate 1422 is secured to the first support bar 141. Specifically, the first long groove structure 1412 is a stepped long groove, and a square nut is provided at the lower end of the second guide post 102. The square nut cooperates with the stepped long groove, so that the second limiting pressure plate 1422 will not rotate relative to the first support bar 141.

[0054] like Figure 2 As shown, the two sides of the first limiting boss 1411 protrude from the two sides of the first limiting pressure plate 1421. A gap is formed between adjacent first limiting pressure plates 1421. During the division operation, the operator can observe through the gap whether the side of the part to be divided is flush with the side of the first limiting boss 1411, thus ensuring the limiting effect.

[0055] like Figure 1 , Figure 8 , Figure 9 and Figure 10As shown, the plurality of first support parts 14 also include a second support bar 143. A second limiting boss 1431 is provided at the first end of the second support bar 143. The first fixing structure 20 includes a first fixing plate 21 and a second fixing plate 22. The first fixing plate 21 is connected to the second limiting boss 1431 and protrudes from the second limiting boss 1431 towards the second end of the second support bar 143. The second fixing plate 22 is connected to the second end of the second support bar 143, and a fixing step 221 is provided on the lower surface of the second fixing plate 22. The height of the second limiting boss 1431 is less than or equal to the thickness of the component to be divided, and the height of the fixing step 221 is less than or equal to the thickness of the component to be divided. The structure of the second support bar 143 is similar to that of the first support bar 141, the main difference being that the height of the second limiting boss 1431 is less than or equal to the thickness of the component to be divided. Thus, the first fixing plate 21 located above the second limiting boss 1431 can press against the upper edge of the component to be divided, thereby fixing the component to be divided. The first fixing plate 21 and the second fixing plate 22 have similar structures to the first limiting plate 1421 and the second limiting plate 1422. The main difference is that the height of the fixing step 221 on the second fixing plate 22 is less than or equal to the thickness of the part to be divided, so that the lower surface of the fixing step 221 can press against the upper edge of the other side of the part to be divided, thereby fixing the part to be divided. Preferably, the height of the second limiting boss 1431 is equal to the thickness of the part to be divided, and the height of the fixing step 221 is equal to the thickness of the part to be divided. The first fixing plate 21 and the second fixing plate 22 are provided with fixing nuts 23. This not only fixes the part to be divided, but also prevents excessive force from being applied to the part to be divided and damaging it when the fixing nuts 23 are tightened.

[0056] In this embodiment, both the first fixing plate 21 and the second fixing plate 22 have a fixed state of pressing the component to be divided and a relaxed state of relaxing the component to be divided. During operation, the component to be divided is first moved to a designated position, then the fixing nut 23 is tightened, fixing the first fixing plate 21 and the second fixing plate 22 to a fixed state. The first breaking component 30 is then rotated upwards to complete one division action. Afterwards, the fixing nut 23 is loosened, relaxing the first fixing plate 21 and the second fixing plate 22. The component to be divided is then moved to a lower division position, and the above operation is repeated until the entire component to be divided is divided. Since the operation requires multiple loosening and tightening of the fixing nut 23, for ease of operation, the fixing nut 23 is preferably a wing nut.

[0057] like Figure 9As shown, the first hollow portion 12 of the second support bar 143 is a second elongated groove structure 1432, and the second fixing plate 22 is adjustablely arranged along the second elongated groove structure 1432. In this way, the second fixing plate 22 can move along the second elongated groove structure 1432 to accommodate parts of different sizes to be divided. Simultaneously, the aforementioned second elongated groove structure 1432 not only allows for the adjustment of the second fixing plate 22 but also allows a scriber to extend into it to make incisions on the back of the part to be divided, resulting in a simple and compact structure. Specifically, the sliding fit between the second fixing plate 22 and the second elongated groove structure 1432 is implemented in the same way as the sliding fit between the second limiting plate 1422 and the first elongated groove structure 1412, and will not be described again here.

[0058] like Figure 1 and Figure 4 As shown, the first dividing device 1 further includes a driving structure 50, which includes a push rod 51 movably disposed on the first base 13 along a first direction S1. The push rod 51 includes an abutment top 511 that abuts against the part to be divided. Moving the push rod 51 along the first direction S1 allows the abutment top 511 to abut against the side edge of the part to be divided and push the part to be divided along the first direction S1. Preferably, the push rod 51 is provided with a scale, which facilitates precise control of the distance the part to be divided is pushed each time.

[0059] like Figure 1 As shown, the drive structure 50 also includes a guide structure 52, in which the push rod 51 passes. Specifically, the guide structure 52 is an arched slide, extending along a first direction S1, allowing the push rod 51 to move along the guide structure 52 in the first direction S1. The drive structure 50 also includes a support block 53 located below the push rod 51. The support block 53 is connected to the first base 13 and extends along the width direction of the push rod, ensuring the stability of the movement of the push rod 51 and the component to be divided, thus giving the first dividing device 1 the advantages of simple structure and reliable movement.

[0060] like Figure 1 , Figure 5 and Figure 6As shown, the first breaking component 30 includes a third support bar 31, on which a third elongated groove structure 311 is provided. A third limiting boss 312 is provided at the first end of the third support bar 31. The first clamping structure 40 includes a first clamping plate 41 and a second clamping plate 42. The first clamping plate 41 is connected to the third limiting boss 312 and protrudes from the third limiting boss 312 toward the second end of the third support bar 31. The second clamping plate 42 is adjustablely disposed at the second end of the third support bar 31, and a clamping step 421 is provided on its lower surface. The height of the third limiting boss 312 is greater than the thickness of the component to be divided, and the height of the clamping step 421 is greater than the thickness of the component to be divided. The third support bar 31 has a similar structure to the first support bar 141, and the first clamping plate 41 and the second clamping plate 42 have similar structures to the first limiting plate 1421 and the second limiting plate 1422, which will not be described further here. This ensures that the parts to be divided are held firmly without hindering their movement, making the division operation convenient.

[0061] like Figure 6 As shown, in this embodiment, a length limiting module 33 is also provided at the end of the first breaking component 30 away from the first support component 10. The length limiting module 33 is adjustablely disposed on the first breaking component 30. During the segmentation operation, the length limiting module is first adjusted to a specified position, such that the distance between the side of the length limiting module 33 near the first support component 10 and the side of the first breaking component 30 near the first support component 10 is equal to the width of the expected strip of biochip. With the help of the push rod 51, it can be ensured that the breaking length of each operation is the expected value.

[0062] Of course, this also allows you to omit the length limit module (e.g.) Figure 3 As shown, the push rod 51 can have a scale, and the distance the push rod pushes the part to be divided can be directly controlled by each push rod.

[0063] like Figure 1 As shown, the first breaking component 30 is rotatably connected to the first support component 10 via a hinge component 32. This ensures the stability of the movement when the first breaking component 30 is rotated upwards, allowing the part to be divided to be broken smoothly along the dividing lines, thus ensuring the quality of the division. Of course, in other feasible embodiments, the first breaking component and the first support component can also be a separate structure, which has the advantage of flexible operation.

[0064] The first segmentation device 1 described above can divide a large piece of biochip 3 into several strip-shaped biochips of a specified width. In actual testing, small square pieces of biochip are generally required, so the strip-shaped biochip needs to be divided into several smaller pieces.

[0065] The segmentation device of this application also includes a second segmentation device 2. Figure 12 A perspective structural diagram of an embodiment of the second dividing device 2 of this application is shown. The second dividing device 2 includes a second support component 60, a second fixing structure 70, a second breaking component 80, and a second clamping structure 90. The second support component 60 has a second top surface and a second bottom surface, the second top surface forming a second support surface 61, and a second hollow portion 62 penetrating the second top surface and the second bottom surface. The second fixing structure 70 is disposed on the second support component 60 to fix the component to be divided onto the second support surface 61. The second breaking component 80 is disposed on one side of the second support component 60. The second clamping structure 90 is disposed on the second breaking component 80 to clamp the component to be divided.

[0066] Specifically, the second dividing device 2 is located downstream of the first dividing device 1 and is capable of dividing the elongated component to be divided that has been processed by the first dividing device 1. Therefore, the aforementioned component to be divided is the elongated component to be divided that has been processed by the first dividing device 1 (i.e., Figure 16 The long strip of biochip to be segmented (4).

[0067] During the segmentation operation, the component to be segmented is placed on the second support surface 61 and secured to the second support assembly 60 by the second fixing structure 70. The second support assembly 60 has a second perforated portion 62 penetrating the second top and second bottom surfaces. The operator can insert a scriber into the second support assembly 60 through the second perforated portion 62 to create a segmentation mark on the bottom of the component to be cut. The second breaking component 80 is located on one side of the second support assembly 60. The component to be cut can protrude from the second support assembly 60. The second clamping structure 90 cooperates with the second breaking component 80 to clamp the portion of the component to be cut that protrudes from the second support assembly 60 and breaks the component along the aforementioned segmentation mark, thus achieving the segmentation function. The aforementioned second segmentation device 2 has the advantage of simple structure, can be operated manually, and has no special environmental requirements. Therefore, the technical solution of this application can effectively solve the problems of high cost and high environmental requirements of segmentation devices in related technologies.

[0068] Specifically, the second breaking component 80 is disposed downstream of the second support component 60. During the process of dividing the component to be divided, the component to be divided moves along the second support component 60, thus the second support component 60 has an upstream side and a downstream side. The upstream side refers to the side that the component to be divided passes through first during its movement, and the downstream side refers to the side that the component to be divided passes through last during its movement.

[0069] like Figure 12As shown, the second support assembly 60 further includes a second base 63 and a plurality of second support portions 64 detachably disposed on the second base 63. The top surface of each second support portion 64 forms a second support surface 61. Each second support portion 64 is adjustablely disposed on the second base 63 along a second direction S2. Each second support portion 64 is provided with a second hollow portion 62, wherein the second direction S2 is the direction of movement of the component to be divided (e.g., ...). Figure 12 (As shown). Each second support portion 64 can be adjustablely disposed on the second base 63 along the second direction S2. In this way, the distance between the multiple second support portions 64 can be controlled by adjusting the distance between the multiple second hollow portions 62, thereby controlling the distance between adjacent dividing marks on the bottom of the part to be divided. Therefore, the second support assembly 60 of this embodiment has the advantage of being able to adapt to various size specifications, and is highly adaptable and easy to operate.

[0070] like Figure 15 and Figure 18 As shown, a second guide groove 6311 extending along the second direction S2 is provided on the side wall of the second base 63, and the second guide groove 6311 penetrates through the side wall of the second base 63. Correspondingly, a third guide post 201 is provided on the side wall of each second support part 64, and the third guide post 201 passes through the second guide groove 6311. A fastening nut is provided at the free end of the third guide post 201. When the fastening nut is unscrewed, the second support part 64 can be removed from the second base 63. When the fastening nut is loosened, the third guide post 201 can move along the second guide groove 6311. When the second support part 64 is moved to a designated position, the fastening nut can be tightened, so that the second support part 64 is fixed on the second base 63. Preferably, there are two second guide grooves 6311.

[0071] like Figure 12 and Figure 15As shown, the second base 63 includes a side body portion 631, a first protrusion 632 disposed at the first end of the side body portion 631, and a second protrusion 633 disposed at the second end of the side body portion 631. Multiple second support portions 64 are located between the first protrusion 632 and the second protrusion 633. The first protrusion 632 has a third hollow portion 6321 penetrating its top and bottom surfaces, and the second protrusion 633 has a fourth hollow portion 6331 penetrating its top and bottom surfaces. During the processing of the large component to be divided using the first dividing device 1, in order to fix the large component to be divided, the first fixing structure 20 is used to press against the opposite side edges and the upper surface near the side edges of the large component to be divided. Therefore, a blank area without biosignals is reserved at the outer edge of the large component to be divided. The second base 63 is provided with a first protrusion 632 at the first end of the side body portion 631 and a second protrusion 633 at the second end of the side body portion 631. The first protrusion 632 is provided with a third hollow portion 6321, and the second protrusion 633 is provided with a fourth hollow portion 6331. During the segmentation operation, the long strip of the component to be segmented can be slit along the third hollow portion 6321 and the fourth hollow portion 6331, and then a certain length of the component on both sides of the long strip to be segmented can be removed. This can remove blank areas that do not carry biosignals and ensure the accuracy of the detection structure.

[0072] like Figure 12 As shown, the upper surfaces of the second support portion 64, the first protrusion 632, and the second protrusion 633 together form the second support surface 61, on which the elongated component to be divided can be placed. The top of the side body portion 631 protrudes upward from the first protrusion 632 and the second protrusion 633, and a first limiting groove 65 extending along the second direction S2 is provided between the top of the side body portion 631 and the second support surface 61. In this way, the elongated component to be divided can move along the first limiting groove 65, making it less likely for the component to be divided to deviate.

[0073] like Figure 12 and Figure 13As shown, the second fixing structure 70 includes a side clamping structure 71, which is movably engaged with the second base 63 perpendicular to the second direction S2. A second limiting groove 66 extending along the second direction S2 is provided between the top of the side clamping structure 71 and the second support surface 61. The elongated component to be divided can move along the second limiting groove 66. When the elongated component to be divided is placed on the second dividing device 2, the side clamping structure 71 is moved away from the second base 63, making it easy to place the elongated component to be divided. When it is necessary to perform slicing and breaking operations on the bottom of the elongated component to be divided, the two outer edges of the side clamping structure 71 and the second base 63 are pinched respectively, so that the side clamping structure 71 is close to the second base 63 and clamps the elongated component to be divided by the sides of the first limiting groove 65 and the second limiting groove 66, thereby clamping the elongated component to be divided and facilitating subsequent operations.

[0074] Specifically, such as Figure 18 As shown, a third guide groove 634 perpendicular to the second direction S2 is provided on the second base 63 along the horizontal direction, and a fourth guide post 202 is correspondingly provided on the side clamping structure 71. A limit nut is provided at the free end of the fourth guide post 202, so that the second base 63 and the side clamping structure 71 are always connected together. At the same time, the side clamping structure 71 can move relative to the second base 63, which is convenient for the operator to operate.

[0075] like Figure 12 and Figure 13 As shown, the first limiting groove 65 includes a first vertical surface 651 and a first inclined surface 652 located above the first vertical surface 651, and the second limiting groove 66 includes a second vertical surface 661 and a second inclined surface 662 located above the second vertical surface 661. The first vertical surface 651 and the second vertical surface 661 form a straight groove, and the first inclined surface 652 and the second inclined surface 662 form a dovetail groove. When clamping the elongated part to be divided, the first vertical surface 651 and the second vertical surface 661 respectively abut against the two opposite sides of the elongated part to be divided, so that the elongated part to be divided can be fixed to the second support assembly 60. The first inclined surface 652 and the second inclined surface 662 form a dovetail groove. When the elongated part to be divided moves upward, the first inclined surface 652 and the second inclined surface 662 can stop the elongated part to be divided. This can prevent the elongated part to be divided from coming off the second support assembly 60. At the same time, when stopping, the first inclined surface 652 and the second inclined surface 662 contact the edge of the elongated part to be divided without touching the upper surface of the elongated part to be divided, thus avoiding contamination of the biological information on it and ensuring the accuracy of the final detection result.

[0076] like Figure 12 and Figure 15As shown, the second breaking component 80 cooperates with the second protrusion 633. A fourth limiting boss 6322 is provided on the first protrusion 632, and a clearance channel 67 is formed between the fourth limiting boss 6322 and the top of the side body part 631. The short side of the elongated part to be divided abuts against the fourth limiting boss 6322, so that the elongated part to be divided can be positioned upright and extended along the second direction S2. At the same time, the clearance channel 67 is formed between the fourth limiting boss 6322 and the top of the side body part 631. The width of the clearance channel 67 is 3mm to 5mm. The operator can use tweezers or other tools to push the elongated part to be divided along the second direction S2 through the clearance channel 67, which is convenient to operate and has a simple structure.

[0077] like Figure 12 and Figure 14 As shown, the second breaking assembly 80 includes a third base 81 and a width-limiting clamping block 82 disposed on the third base 81. The second clamping structure 90 is a movable clamping block, which is movably engaged with the third base 81 perpendicular to the second direction S2. The width-limiting clamping block 82, in conjunction with the second clamping structure 90, can clamp the long side of the elongated strip-shaped component to be divided that extends out of the second fixed structure 70, facilitating the subsequent breaking operation.

[0078] Specifically, such as Figure 17 As shown, in this embodiment, the second clamping structure 90 is provided with a guide block 91 extending toward the third base 81. Correspondingly, the third base 81 is provided with a receiving space that matches the guide block 91. The guide block 91 is provided with a fourth guide groove 911, and the third base 81 is provided with a fifth guide post 203. The free end of the fifth guide post 203 extends into the fourth guide groove 911, so that the second clamping structure 90 can move relative to the second breaking assembly 80.

[0079] like Figure 12As shown, the width-limiting clamp 82 is adjustablely mounted on the third base 81. The width-limiting clamp 82 has a third limiting groove 83, and a fourth limiting groove 84 is formed between the movable clamp and the third base 81. The third limiting groove 83 and the fourth limiting groove 84 respectively engage with the opposite long sides of the elongated component to be divided, thus limiting the elongated component. When the second breaking component 80 and the second protrusion 633 are aligned, the width-limiting clamp 82 is moved away from the third base 81, and the distance between the third limiting groove 83 and the fourth limiting groove 84 is large. This prevents the second breaking component 80 and the second clamping structure 90 from easily bumping into the elongated component, damaging it, or contaminating its bio-information. After the second breaking component 80 and the second protrusion 633 are aligned, the outer edges of the third base 81 and the second clamping structure 90 can be pinched so that the second clamping structure 90 is close to the third base 81 and tightens the long strip of the part to be divided that protrudes from the second support component 60, which facilitates the subsequent breaking operation.

[0080] Specifically, the width-limiting clamp 82 can move along a direction perpendicular to the second direction S2 to accommodate the different sizes of small biochips.

[0081] Preferably, the third limiting groove 83 and the fourth limiting groove 84 have similar structures, which enables the clamping of the long strip-shaped component to be divided without contaminating the biological information on it.

[0082] like Figure 12 and Figure 14 As shown, the second breaking component 80 also includes a length limiting stop 85, which is adjustablely mounted on the third base 81. During the segmentation operation, the length limiting stop 85 is first adjusted to a designated position so that the distance between the side of the length limiting stop 85 near the second support component 60 and the side of the third base 81 near the second support component 60 is equal to the side length of the expected small biochip piece. Due to the limiting and pushing action of the length limiting stop 85, the pre-cut slits are pushed precisely to the plane where the second support component 60 and the second breaking component 80 meet, ensuring that the breaking length in each operation is the expected value. During operation, the left hand firmly grasps the second support component 60 and the second fixing structure 70, while the right hand firmly grasps the second breaking component 80 and the second clamping structure 90 and rotates upwards. The elongated component to be segmented will split along the pre-cut line. It is then removed with tweezers and placed in a protective reagent to achieve the desired square small chip cutting.

[0083] In this embodiment, the width of the first support portion 14 is 10mm (of course, the width of the first support portion can also be set according to the size of other required small chips, for example, when an 8mm*8mm chip is required, the width of the first support portion can be 8mm or smaller), the length of the first support portion 14 is 100mm to 150mm, and the size of the first cutout portion 12 is 90mm*3mm. When all the first support portions 14 are close together, the width of the elongated biochip is 10mm. For a width greater than 10mm, the corresponding number of first support portions 14 can be removed according to the actual size. The remaining parts can be adjusted by sliding them to the set width when the fixing screws are loosened. The width of the elongated biochip is 8mm. The width of the first limiting pressure plate 1421 is 2mm smaller than the width of the first support portion 14 (10mm). This leaves a 1mm gap on each side of the first limiting pressure plate 1421 for observing whether the biochip is close to the side of the first limiting protrusion 1411. The first limiting clamping plate 1421 protrudes approximately 2mm to 3mm from the first limiting boss 1411 and can be used to press against the blank area at the edge of the biochip. The thickness of the first limiting boss 1411 is approximately 30µm greater than the thickness of the bulk biochip. The second limiting clamping plate 1422 is an L-shaped clamping plate, and the height of the limiting step 1423 on it is also approximately 30µm greater than the thickness of the bulk biochip, making it easy to pull and move when the biochip is fitted.

[0084] The top surface of the top 511 is used as the limiting surface of the bottom of the biochip to be cut, and the side of the first limiting protrusion 1411 is used as the limiting surface for aligning the side base surface of the biochip. The side of the movable L-shaped pressing plate (i.e. the second limiting pressing plate 1422) is used as the limiting surface of the other base surface of the biochip to perform the fitting and positioning of the entire chip.

[0085] The push rod 51 is fitted into the arched slide (i.e., guide structure 52) and combined with the first base 13. When the push rod 51 is pulled to the top, the top plane of the top 511 is used as the limiting surface of the bottom base surface of the biochip to be cut. The outermost side of the arched slide is used as the zero point to mark the upper surface of the push rod 51. Whenever a strip of a set width is cut off, the push rod 51 is pushed forward by a width according to the scale on it, so as to push the next cut of the biochip to the breaking position (the breaking position refers to the position between the first support component 10 and the first breaking component 30).

[0086] The top of the first breaking component 30 is connected to the second support bar 143 via an open-type hinge (i.e., hinge component 32) to prevent the two modules from separating and the biochip from tilting due to improper force during rotation. Both ends of the first breaking component 30, like the first support bar 141, are respectively provided with a third limiting protrusion 312 that protrudes 30 μm above the biochip thickness and a slidably adjustable L-shaped clamping plate (i.e., a second clamping clamping plate 42). When the slit of the biochip to be cut is pushed to the gap between the first breaking component 30 and the second support bar 143, the first breaking component 30 is rotated upwards about the hinge's axis of rotation. The biochip will split parallel to the base plane along the crystal direction, starting from the slit, thus obtaining a long strip-shaped biochip of a predetermined width.

[0087] The third cutout 6321 and the fourth cutout 6331 are 3mm wide and are used to cut and remove the blank areas at both ends of the long strip of bio-silicon wafer. The second support 64 is specifically L-shaped and 10mm wide, with a second cutout 62 3mm wide for inserting a scribing tool to make cuts on the biochip. The rear side of the second support 64 has two threaded holes that correspond to the two second guide grooves 6311 on the side wall of the second base 63 for fixing with screws. The lower side of the support surface of the second fixing structure 70 is a finger pinching area. When the spacing of the second support part 64 is adjusted and the elongated biochip is placed on it, the second base 63 and the second fixing structure 70 are pinched by hand. The first limiting groove 65 and the second limiting groove 66 will clamp the two sides of the elongated biochip, so as to fix the elongated biochip without touching or damaging the biosignals on the chip surface. Then, the size of the small chip can be planned by scribing the back of the chip from the hollow part of the second support part 64.

[0088] The silicon wafer can be diced using the dicing device of this embodiment. The specific operation process is as follows: Figure 19As shown. Now, taking a 1 / 4-circular sequencing chip (specifically a silicon wafer with biological signals) with a radius of 100mm and a base length of 69.2mm as an example, this chip needs to be divided into smaller chips of 10mm*10mm. First, the first support part 14 of the first segmentation device 1 is tightly pressed and fixed to the first base 13, and the second support part 64 is tightly pressed and fixed to the second base 63. Since the width of the first support part 14 and the second support part 64 is 10mm, the spacing between the first cutouts 12 on the first support part 14 and the spacing between the second cutouts 62 on the second support part 64 are both 10mm. Pull the push rod 51 to the bottom and place the sequencing silicon wafer to be cut onto the first support surface 11. Push the silicon wafer in until the bottom base surface of the silicon wafer is in contact with the top surface. Set the position of the second limiting clamping plate 1422, and tighten the screws to fix the second limiting clamping plate 1422 with a movement gap of about 1 mm between the second limiting clamping plate 1422 and the clamping silicon wafer. Push the wing screws on the second fixing clamping plate 22 so that one side of the silicon wafer is completely in contact with the side of the first limiting protrusion 1411 and the second limiting protrusion 1431. At this point, tighten the two wing screws on the second support bar 143. The sequencing silicon wafer is now positioned and fixed (e.g., Figure 11 As shown (where the dashed lines indicate the slits on the bottom surface of the silicon wafer and the cracks when the silicon wafer is broken), the device is used to insert a silicon wafer scribing tool into the first cutout 12 on the back of each first support bar 141 and second support bar 143 to make a small cut about 3mm long on the lower side of the silicon wafer. This completes the cutting of slits parallel to the base surface, spaced 10mm apart. Loosen the two wing screws on the second support bar 143, and use the push rod 51 to push the first slit on the silicon wafer to the edge of the second support bar 143. Tighten the wing screws to fix it, and then put on the first breaking assembly 30 and rotate it upwards around the axis of the hinge assembly 32. The silicon wafer will naturally crack from the slit position along a direction parallel to the base edge, discarding the first silicon wafer without signal. Loosen the wing screws and use the scale on the push rod 51 to advance 10mm. The next slit will be exactly at the edge of the second support bar 143. Then, the silicon wafer is clamped by pushing the wing screw on the second fixing plate 22. After observing whether the silicon wafer is placed parallel through the gap between the first limiting clamping plates 1421, tighten the wing screws to fix the silicon wafer after confirming that it is parallel, and then put on the first breaking component 30 to rotate and break it. Repeat this process until the last strip is broken. At this point, a large sequencing silicon wafer is broken into several strips of silicon wafer with a width of 10mm.

[0089] It should be noted that the "top" mentioned above refers to the part of each component that is close to the first broken component 30, and the "bottom" refers to the part that is far away from the first broken component 30.

[0090] A 10mm wide strip of silicon wafer is placed on the second support surface 61 of the second slitting device 2 (e.g., ...). Figure 16 (As shown), use tweezers to push the long silicon wafer until it touches the limiting surface of the fourth limiting boss 6322. Pinch the second support component 60 and the second fixing structure 70 until the device clamps the silicon wafer. Hold it firmly and lift it out. Then, insert the silicon wafer scribing knife through the second hollow part 62 on the back of the second support part 64 to scribing. This completes the pre-cutting of the 10mm wide long silicon wafer into 10*10mm small silicon wafers. Next, adjust the length limiting stop 85 on the second breaking component 80 to the 10mm position. Use tweezers to push the silicon wafer through the avoidance channel 67 on the second base 63. The first scribe line on the bottom of the silicon wafer is located at the edge of the second support component 60. The second breaking component 80 is used to clamp the protruding part and break it upwards. This completes the step of removing the blank area at one end of the silicon wafer. Then, the silicon wafer is pushed with tweezers to make it protrude. The second breaking component 80 is used to clamp the protruding part until the protruding end of the long silicon wafer reaches the length limiting stop 85. At this time, the scribe line will be exactly at the edge of the second support component 60. The second breaking component 80 is pinched to clamp the protruding small piece and break it upwards. This achieves the purpose of cutting the silicon wafer into 10*10mm small pieces.

[0091] If it is necessary to break a large silicon wafer into a small silicon wafer of 15*15mm, simply remove one piece from the first support part 14 and the second support part 64, adjust the center distance between the remaining adjacent first support parts 14 and the center distance between the adjacent second support parts 64 to 15mm, and the remaining steps are the same as the steps for breaking into a small silicon wafer of 10*10mm, thus achieving the purpose of breaking into a small piece of 15*15mm.

[0092] The segmentation device of this embodiment has the advantages of simple and compact structure, low cost, and easy operation. It has no parts or operations that could cause significant harm to the human body, is inexpensive, and can be mass-produced. It is particularly suitable for situations with small-batch silicon wafer segmentation needs, early-stage research and development, or when the solution is still uncertain, where silicon wafers of the desired size are available. It can smoothly segment signal-carrying bio-silicon wafers into predetermined square sizes without edge chipping or debris. Simultaneously, the segmentation process does not touch the silicon wafer surface, allowing the cut wafers to be reassembled for comparison, with the edge damage of the crack not exceeding 0.5mm after reassembly.

[0093] Furthermore, the slitting device of this application can not only slit square or rectangular silicon wafers, but also has low requirements for the size and appearance of the silicon wafers. As long as the blank areas on both sides of the silicon wafer can be clamped, and the distance between the first support strip and the second support strip can be adjusted, the cutting and splitting of the set size can be completed. For example, as long as the first clamping plate and the second clamping plate on the first breaking component are pressed against the upper and lower surfaces of the edge of the circular silicon wafer, the circular silicon wafer can be cut and split, thus demonstrating strong scalability.

[0094] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0095] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0096] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0097] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A splitting device, characterized in that: The invention comprises a first segmentation device (1), wherein the first segmentation device (1) comprises: A first support component (10) having a first top surface and a first bottom surface, the first top surface forming a first support surface (11), the first support component being provided with a first hollow portion (12) penetrating the first top surface and the first bottom surface, the first hollow portion (12) being used for a cutter to extend into so as to form a cutter mark on the bottom of the component to be cut; A first fixing structure (20) is arranged on the first supporting assembly (10) to fix the component to be cut on the first supporting surface; A first breaking assembly (30) is rotatably arranged on the downstream side of the first supporting assembly (10); A first clamping structure (40) is arranged on the first breaking assembly (30) to cooperate with the first breaking assembly (30) to clamp the portion of the component to be separated that extends outside the first supporting assembly (10); The first support assembly (10) further comprises a first base (13) and a plurality of first support portions (14) detachably arranged on the first base (13), each of the first support portions (14) being provided with the first hollow portion (12); The first dividing device (1) further comprises a driving structure (50), the driving structure (50) comprising a push rod (51) movably arranged on the first base (13) along a first direction (S1), the driving structure (50) further comprising a guide structure (52), the push rod (51) being inserted into the guide structure (52).

2. The segmentation device according to claim 1, characterized in that: The top surfaces of the plurality of first support portions (14) form the first top surface, and the bottom surfaces of the plurality of first support portions (14) form the first bottom surface, and each of the first support portions (14) can be adjustably arranged on the first base (13) along the first direction (S1), wherein the first direction (S1) is a moving direction of the component to be separated.

3. The segmentation device according to claim 2, characterized in that: The plurality of first support parts (14) include a plurality of first support bars (141) and a plurality of limiting structures (142); the plurality of first support bars (141) and the plurality of limiting structures (142) are arranged in a one-to-one correspondence; each of the limiting structures (142) includes a first limiting pressing sheet (1421) and a second limiting pressing sheet (1422); a first limiting boss (1411) is arranged at a first end of each of the first support bars (141); and each of the first limiting pressing sheets (1421) is connected to the first limiting boss (1411). The first limiting pressing piece (1421) protrudes from the first limiting boss (1411) toward the second end of the first supporting bar (141), the second limiting pressing piece (1422) is connected to the second end of the first supporting bar (141) and a limiting step (1423) is provided on the lower surface of the second limiting pressing piece (1422), wherein the height of the first limiting boss (1411) is greater than the thickness of the component to be separated, and the height of the limiting step (1423) is greater than the thickness of the component to be separated; and / or The plurality of first support portions (14) include a second support bar (143), a first end of the second support bar (143) being provided with a second limiting boss (1431), the first fixing structure (20) including a first fixing pressing plate (21) and a second fixing pressing plate (22), the first fixing pressing plate (21) being connected to the second limiting boss (1431), the first fixing pressing plate (21) protruding from the second limiting boss (1431) toward the second end of the second support bar (143), the second fixing pressing plate (22) being connected to the second end of the second support bar (143) and a fixing step (221) being provided on the lower surface of the second fixing pressing plate (22), wherein a height of the second limiting boss (1431) is less than or equal to a thickness of the component to be segmented, and a height of the fixing step (221) is less than or equal to a thickness of the component to be segmented.

4. The segmentation device according to claim 2, characterized in that: The push rod (51) comprises an abutting portion (511) that abuts against the component to be cut.

5. The segmentation device according to claim 1, characterized in that: The first breaking assembly (30) comprises a third support bar (31), on which a third long groove structure (311) is provided, and a third limiting boss (312) is provided at the first end of the third support bar (31), and the first clamping structure (40) comprises a first clamping plate (41) and a second clamping plate (42), wherein the first clamping plate (41) is connected to the third limiting boss (312), and the first clamping plate (41) protrudes from the third limiting boss (312) toward the second end of the third support bar (31), and the second clamping plate (42) is adjustably arranged at the second end of the third support bar (31) and a clamping step (421) is provided on the lower surface of the second clamping plate (42), wherein the height of the third limiting boss (312) is greater than the thickness of the component to be separated, and the height of the clamping step (421) is greater than the thickness of the component to be separated.

6. The segmentation device according to claim 1, characterized in that: The segmentation device further comprises a second segmentation device (2), wherein the second segmentation device (2) comprises: A second support component (60) having a second top surface and a second bottom surface, the second top surface forming a second support surface (61), and the second support component (60) being provided with a second hollow portion (62) penetrating the second top surface and the second bottom surface; A second fixing structure (70) is arranged on the second supporting assembly (60) to fix the component to be cut on the second supporting surface (61); A second breaking assembly (80) is arranged on one side of the second supporting assembly (60); A second clamping structure (90) is arranged on the second breaking assembly (80) to clamp the component to be separated.

7. The segmentation device according to claim 6, characterized in that: The second support assembly (60) further comprises a second base (63) and a plurality of second support portions (64) detachably arranged on the second base (63); the top surface of the second support portion (64) forms the second support surface (61); each second support portion (64) can be adjustably arranged on the second base (63) along a second direction (S2); each second support portion (64) is provided with the second hollow portion (62); wherein the second direction (S2) is a moving direction of the component to be segmented.

8. The segmentation device according to claim 7, characterized in that: The second base (63) comprises a side body portion (631), a first extension portion (632) arranged at a first end of the side body portion (631), and a second extension portion (633) arranged at a second end of the side body portion (631); a plurality of second support portions (64) are located between the first extension portion (632) and the second extension portion (633); the first extension portion (632) is provided with a third hollow portion (6321) passing through the top and bottom surfaces thereof; the second extension portion (633) is provided with a fourth hollow portion (6331) passing through the top and bottom surfaces thereof; the top of the side body portion (631) protrudes upward from the first extension portion (632) and the second extension portion (633); and a first limiting sliding groove (65) extending along the second direction (S2) is provided between the top of the side body portion (631) and the second support surface (61); and / or The second fixing structure (70) comprises a side clamping structure (71), the side clamping structure (71) being movably engaged with the second base (63) perpendicular to the second direction (S2), and a second limiting sliding groove (66) extending along the second direction (S2) is provided between the top of the side clamping structure (71) and the second supporting surface (61).

9. The segmentation device according to claim 8, characterized in that: The second dividing device (2) comprises a first limiting slide groove (65) and a second limiting slide groove (66); the first limiting slide groove (65) comprises a first vertical surface (651) and a first inclined surface (652) located above the first vertical surface (651); the second limiting slide groove (66) comprises a second vertical surface (661) and a second inclined surface (662) located above the second vertical surface (661); the first vertical surface (651) and the second vertical surface (661) form a straight groove; the first inclined surface (652) and the second inclined surface (662) form a dovetail groove.

10. The segmentation device according to claim 7, characterized in that: The second breaking assembly (80) comprises a third base (81) and a width limiting clamp (82) arranged on the third base (81); the second clamping structure (90) is a movable clamp; the movable clamp can be movably matched with the third base (81) perpendicular to the second direction (S2); the width limiting clamp (82) can be adjustably arranged on the third base (81); a third limiting slide groove (83) is arranged on the width limiting clamp (82); and a fourth limiting slide groove (84) is formed between the movable clamp and the third base (81).

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