A high-speed and high-density test device for wafer testing

Abstract

The present application relates to a high-speed, high-density test device for wafer testing, comprising: a high-speed, high-density connector, comprising a plurality of first connectors and a plurality of second connectors, each of the first connectors and each of the second connectors being connected via a coaxial cable; a test machine, the test machine being provided with a plurality of signal test boards that send test signals to the wafer under test, the signal test boards being provided with a plurality of first board-end connectors connected to the first connectors; a probe card, the probe card being provided with a plurality of second board-end connectors connected to the second connectors, and a plurality of probes fixed on the probe card and connected to the wafer under test. The high-speed, high-density connector of the high-speed, high-density connection device of the present application has a small link loss for high-speed, high-frequency signals, reduces the signal link loss of multiple links in the existing spring pin connection scheme, and improves the signal integrity and reliability of the test equipment.

Description

Technical Field

[0001] The present application relates to the field of wafer testing technology, and in particular to a high-speed and high-density testing device for wafer testing. Background Art

[0002] Wafer testing occurs between wafer fabrication and packaging in the chip manufacturing process. After wafer fabrication, thousands of unpackaged chips are regularly distributed across the wafer. Because the wafers haven't yet been diced and packaged, the chip pins are exposed. These tiny pins require even finer probes to connect to the test equipment.

[0003] Currently, wafer testing uses probes connected to the pin pads of the chip under test, making signal integrity control extremely difficult. Direct contact between the probe and the pad has electrical performance limitations and is prone to leakage and contact resistance, significantly impacting high-precision signal measurement. Testing high-speed and high-precision signals often requires specialized high-speed probing solutions. The high-speed, high-density, and high-precision signal connections from the tester to the probe significantly increase hardware costs.

[0004] Existing solutions mostly rely on spring pins, which connect to pads on the back of the probe card through elastic contact. To ensure effective contact between all spring pins, the spring pressure must be greater than a certain value, such as 30g / pin. As the number of pins increases, the positive pressure or retention force required on the tester and probe card increases, making it unsuitable for today's increasingly high-density testing requirements. Furthermore, with a growing number of spring pins, reliable connection is impossible, and in extreme cases, it can easily lead to damage or burnout of the spring pins. Summary of the Invention

[0005] An embodiment of the present application provides a high-speed and high-density testing device for wafer testing to solve the problem in related technologies that direct contact between probes and pads in wafer testing has limitations in electrical performance, easily generates leakage and contact resistance, and is not conducive to high-precision signal measurement.

[0006] The present invention provides a high-speed and high-density test device for wafer testing, comprising:

[0007] A high-speed, high-density connector comprising a plurality of first connectors and a plurality of second connectors, wherein each of the first connectors and each of the second connectors are connected via a coaxial cable;

[0008] A test machine, wherein the test machine is provided with a plurality of signal test boards that send test signals to the wafer under test, and the signal test boards are provided with a plurality of first board-end connectors connected to the first plug-in components;

[0009] A probe card is provided with a plurality of second board-end connectors connected to second plug-in components, and a plurality of probes fixed on the probe card and connected to the wafer to be tested.

[0010] In some embodiments: the high-speed and high-density connector further comprises a lower fixing plate for fixing a plurality of the first plug-in components, wherein the plurality of the first plug-in components are arranged along a linear array on the lower fixing plate;

[0011] The first plug-in connector is provided with a mounting hole, and a screw for fixing the first plug-in connector on the lower fixing plate is loosely fitted in the mounting hole.

[0012] In some embodiments: a rivet plate for fixing the second board-end connector to the probe card is provided on a side wall of the second board-end connector, and a rivet for riveting the second board-end connector to the probe card is provided on the rivet plate;

[0013] The riveted plates are asymmetrically arranged on the side walls of the second board end connectors, and the riveted plates between two adjacent second board end connectors are staggered and spaced along the length direction of the second board end connectors.

[0014] In some embodiments: the high-speed and high-density connector further includes an upper fixing plate for fixing a plurality of the second plug-in connectors, and the plurality of the second plug-in connectors are arranged circumferentially on the upper fixing plate;

[0015] The second plug-in connector is provided with a mounting hole, and a screw for fixing the second plug-in connector on the upper fixing plate is loosely fitted in the mounting hole.

[0016] In some embodiments: the notch of the first connector slot is provided with a chamfer or a rounded corner, and the plug of the first board-end connector is provided with a tapered guide head.

[0017] In some embodiments: the notch of the second connector slot is provided with a chamfer or a rounded corner, and the plug of the second board-end connector is provided with a tapered guide head.

[0018] In some embodiments, at least two layers of contact springs connected to the first board-end connector are provided in the slot of each first connector, and each layer of contact springs of the first connector is pluggably connected to the first board-end connector in sequence.

[0019] In some embodiments, at least two layers of contact springs connected to the second board-end connector are provided in the slot of each second plug-in connector, and each layer of contact springs of the second plug-in connector is pluggably connected to the second board-end connector in sequence.

[0020] In some embodiments: the test machine further includes a chassis with an open top and closed on all sides, and a plurality of the signal test boards are arranged at intervals and plugged into the chassis.

[0021] In some embodiments, the probe card has a circular structure, and a plurality of the second board-end connectors are radially and evenly distributed on the probe card.

[0022] The beneficial effects of the technical solution provided by this application include:

[0023] An embodiment of the present application provides a high-speed, high-density testing device for wafer testing. Since the high-speed, high-density testing device of the present application is provided with a high-speed, high-density connector, it includes a plurality of first connectors and a plurality of second connectors, and each first connector and each second connector are connected by a coaxial cable; a testing machine, the testing machine is provided with a plurality of signal testing boards that send test signals to the wafer under test, and the signal testing board is provided with a plurality of first board-end connectors connected to the first connectors; a probe card, the probe card is provided with a plurality of second board-end connectors connected to the second connectors, and a plurality of probes fixed on the probe card and connected to the wafer under test.

[0024] Therefore, the test machine and probe card of the high-speed, high-density test device of the present application are connected via a high-speed, high-density connector. The high-speed, high-density connector is provided with a plurality of first connectors and a plurality of second connectors, and each first connector and each second connector is connected via a coaxial cable. The high-speed, high-frequency test signal is emitted by the signal test board of the test machine, and after the mapping relationship of the high-speed, high-density connector is connected, the signal is accurately connected to the corresponding probe of the probe card, thereby realizing the test of the wafer.

[0025] The mapping relationship arrangement of the high-speed, high-density connectors in the high-speed, high-density test device of this application can be flexibly defined. By designing and adjusting the line sequence of the coaxial cable, different test solution requirements can be quickly implemented. Compared with the design definition of existing spring pin connection solutions, it is more flexible and faster. The high-speed, high-density connectors of the high-speed, high-density connection device have low link loss for high-speed, high-frequency signals, reducing the signal link loss of multiple links in the existing spring pin connection solution, and improving the signal integrity and reliability of the test equipment.

[0026] The test machine and probe card of the high-speed and high-density test device of this application are connected through a high-speed and high-density connector. It is a structural application to solve the signal connection between the test machine and the probe card. In particular, it is aimed at the current trend of high-speed and high-density signal testing. The probe card is required to cover all unpackaged chips on the wafer with as few tests as possible, and arrange up to 30,000 signals in a circular area with a limited area, effectively ensuring the signal reliability connection between the probe card and the test machine, ensuring the signal integrity and maintainability of the equipment, improving the test efficiency, and reducing the test cost of the test equipment.

[0027] The high-speed, high-density connector of the high-speed, high-density test device of the present application also includes a lower fixing plate for fixing a plurality of first connectors, wherein the plurality of first connectors are arranged in a linear array on the lower fixing plate; the first connectors are provided with mounting holes, and the mounting holes are clearance-fitted with screws that secure the first connectors to the lower fixing plate. When the first connectors and the first board-end connector are docked, the first connectors can be adaptively positioned relative to the screws on the lower fixing plate to achieve adaptive centering of the first connector and the first board-end connector. In practical applications, this can ensure that up to 100-200 sets of first connectors and first board-end connectors can be accurately and reliably docked simultaneously.

[0028] The side wall of the first board end connector of the high-speed, high-density connector of the high-speed, high-density test device of the present application is provided with a rivet plate for fixing the second board end connector to the probe card, and the rivet plate is provided with rivets for riveting the second board end connector to the probe card; the rivet plate is asymmetrically arranged on the side wall of the second board end connector, and the rivet plates between two adjacent second board end connectors are staggered and spaced along the length direction of the second board end connector. The second board end connector and the probe card are installed through a rivet mechanical structure, which is simple to install and has strong replacement and maintainability. The design position of the rivet plate adopts an asymmetric structural arrangement, which can form an avoidance structure when arranged regularly horizontally or vertically and arranged circumferentially. The area per unit area can increase the arrangement density of the second board end connector, effectively improving the test density.

[0029] The high-speed, high-density connector of the high-speed, high-density test device of the present application also includes an upper fixing plate for fixing a plurality of second connectors, wherein the plurality of second connectors are arranged circumferentially on the upper fixing plate; the second connectors are provided with mounting holes, and the mounting holes are clearance-fitted with screws that secure the second connectors to the upper fixing plate. When the second connectors are mated with the second board-end connector, the second connectors can be adaptively positioned relative to the screws on the upper fixing plate to achieve adaptive centering of the second connectors with the second board-end connector. In practical applications, this can ensure that up to 100-200 sets of second connectors can be accurately and reliably mated simultaneously with the second board-end connector.

[0030] The notch of the first connector slot of the high-speed, high-density connector of the high-speed, high-density test device of the present application is provided with a chamfer or fillet, and the plug of the first board-end connector is provided with a conical guide head. When the first connector and the first board-end connector are docked, the first board-end connector achieves adaptive centering of the first connector under the guidance of the conical guide head and the notch of the first connector slot. The notch of the second connector slot is provided with a chamfer or fillet, and the plug of the second board-end connector is provided with a conical guide head. When the second connector and the second board-end connector are docked, the second board-end connector achieves adaptive centering of the second connector under the guidance of the conical guide head and the notch of the second connector slot.

[0031] The high-speed, high-density test device of the present application has at least two layers of contact springs connected to the first board-end connector in the slot of each first connector, and the layers of contact springs of the first connector are plugged and unplugged with the first board-end connector in sequence. The slot of each second connector has at least two layers of contact springs connected to the second board-end connector, and the layers of contact springs of the second connector are plugged and unplugged with the second board-end connector in sequence. When several first connectors are docked with several first board-end connectors, and when several second connectors are docked with several second board-end connectors, the contact resistance and friction are reduced, thereby realizing a low plug-in force structural connection, ensuring that the overall plug-in force is small when the entire machine interface is connected as a whole, and ensuring the reliability of the connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] Figure 1 This is a structural diagram of an embodiment of the present application;

[0034] Figure 2 This is a schematic structural diagram of an embodiment of the present application;

[0035] Figure 3 This is a schematic structural diagram of a high-speed, high-density connector and a probe card according to an embodiment of the present application;

[0036] Figure 4 This is a schematic diagram of the connection between the second plug-in connector and the second board-end connector according to an embodiment of the present application;

[0037] Figure 5 This is a schematic structural diagram of the second board-end connector and the probe card according to an embodiment of the present application;

[0038] Figure 6 This is a schematic diagram of the arrangement of multiple second board-end connectors according to an embodiment of the present application;

[0039] Figure 7 This is a schematic structural diagram of the second connector according to an embodiment of the present application;

[0040] Figure 8 This is a schematic structural diagram of the second board-end connector according to an embodiment of the present application.

[0041] Reference numerals:

[0042] 1. High-speed, high-density connector; 2. Probe card; 3. Tester; 11. First connector; 12. Second connector; 13. Coaxial cable; 14. Upper fixing plate; 15. Side panel; 16. Screws; 17. Contact springs; 18. Slots; 19. Chamfers; 21. Second board-end connector; 22. Probes; 23. Plugs; 24. Rivets; 25. Riveted plate; 31. Signal test board; 32. First board-end connector; 33. Chassis. DETAILED DESCRIPTION

[0043] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0044] The embodiment of the present application provides a high-speed and high-density testing device for wafer testing, which can solve the problem in the related art that direct contact between probes and pads in wafer testing has limitations in electrical performance, easily generates leakage and contact resistance, and is not conducive to high-precision signal measurement.

[0045] See also Figures 1 to 3 As shown, the embodiment of the present application provides a high-speed and high-density testing device for wafer testing, comprising:

[0046] A high-speed, high-density connector 1 includes a plurality of first connectors 11 and a plurality of second connectors 12, each of which is connected to the second connector 12 by a coaxial cable 13. A tester 3 includes a plurality of signal test boards 31 for sending test signals to the wafer under test, and the signal test boards 31 are provided with a plurality of first board-end connectors 32 connected to the first connectors 11. The tester 3 also includes a chassis 33 with an open top and closed on all sides, and the plurality of signal test boards 31 are arranged at intervals and plugged into the chassis 33. A probe card 2 includes a plurality of second board-end connectors 21 connected to the second connectors 12, and a plurality of probes 22 fixed on the probe card 2 and connected to the wafer under test. The probe card 2 is a circular structure, and the plurality of second board-end connectors 21 are radially and evenly distributed on the probe card 2.

[0047] The tester 3 and probe card 2 of the high-speed, high-density test device of the present embodiment are connected via a high-speed, high-density connector 1. The high-speed, high-density connector 1 is provided with a plurality of first connectors 11 and a plurality of second connectors 12. Each first connector 11 and each second connector 12 are connected via a coaxial cable 13. High-speed, high-frequency test signals are emitted via a signal test board 31 of the tester 3. After being mapped by the high-speed, high-density connector 1, the signals are accurately connected to the corresponding probes 22 of the probe card 2, thereby enabling wafer testing.

[0048] The mapping relationship arrangement of the high-speed, high-density connector 1 of the high-speed, high-density test device of the present embodiment can be flexibly defined. By designing and adjusting the line sequence of the coaxial cable 13, different test solution requirements can be quickly implemented. Compared with the design definition of existing spring pin connection solutions, the high-speed, high-density connector 1 of the high-speed, high-density connection device has a low link loss for high-speed, high-frequency signals, reducing the signal link loss of multiple links in the existing spring pin connection solution, and improving the signal integrity and reliability of the test equipment.

[0049] In some alternative embodiments: See Figure 1 As shown, an embodiment of the present application provides a high-speed, high-density test device for wafer testing. The high-speed, high-density connector 1 of the high-speed, high-density test device also includes a lower fixing plate for fixing a plurality of first connectors 11. The plurality of first connectors 11 are arranged in a linear array on the lower fixing plate. The first connectors 11 are provided with mounting holes, and the mounting holes are clearance-fitted with screws 16 that secure the first connectors 11 to the lower fixing plate.

[0050] When the first connector 11 and the first board-end connector 32 of the embodiment of the present application are docked, the first connector 11 can make adaptive position adjustments relative to the screw 16 on the lower fixing plate to achieve adaptive floating alignment of the first connector 11 and the first board-end connector 32. In actual applications, it can ensure that up to 100-200 groups of first connectors 11 and first board-end connectors 32 are accurately and reliably docked at the same time.

[0051] In some alternative embodiments: See Figure 5 、 Figure 6 and Figure 8 As shown, an embodiment of the present application provides a high-speed, high-density test device for wafer testing. A rivet plate 25 for fixing the second board-end connector 21 to the probe card 2 is provided on the side wall of the second board-end connector 21 of the high-speed, high-density test device. The rivet plate 25 is provided with a rivet 24 for riveting the second board-end connector 21 to the probe card 2. The rivet plates 25 are asymmetrically arranged on the side wall of the second board-end connector 21, and the rivet plates 25 between two adjacent second board-end connectors 21 are staggered and spaced along the length direction of the second board-end connector 21.

[0052] The second board connector 21 of the high-speed, high-density test device of the present application is mechanically mounted to the probe card 2 via rivets 24, resulting in a simple installation structure and enhanced replacement and maintainability. The rivet plates 25 are designed with an asymmetrical arrangement, allowing the second board connectors 21 to form a clearance structure when arranged horizontally, vertically, or in a circular pattern. This increases the density of the second board connectors 21 per unit area, effectively improving test density.

[0053] In some alternative embodiments: See Figure 1 、 Figure 2 and Figure 7 As shown, an embodiment of the present application provides a high-speed, high-density test device for wafer testing. The high-speed, high-density connector of the high-speed, high-density test device also includes an upper fixing plate 14 for fixing a plurality of second connectors 12. The plurality of second connectors 12 are arranged circumferentially on the upper fixing plate 14. The second connectors 12 are provided with mounting holes, and screws 16 for fixing the second connectors 12 to the upper fixing plate 14 are fitted with clearances in the mounting holes. The upper fixing plate 14 and the lower fixing plate are parallel to each other and spaced apart. Side panels 15 are provided around the upper fixing plate 14 and the lower fixing plate. A cavity for accommodating the coaxial cable 13 is formed between the upper fixing plate 14, the lower fixing plate, and the side panels 15.

[0054] When the second connector 12 and the second board-end connector 21 of the embodiment of the present application are docked, the second connector 12 can be adaptively adjusted in the horizontal direction relative to the screw 16 on the upper fixing plate 14 to achieve adaptive floating alignment of the second connector 12 and the second board-end connector 21. In actual applications, it can ensure that up to 100-200 groups of second connectors 12 and second board-end connectors 21 are accurately and reliably docked at the same time.

[0055] In some alternative embodiments: See Figure 4 As shown, an embodiment of the present application provides a high-speed, high-density test device for wafer testing. The notch of the slot 18 of the first connector 11 of the high-speed, high-density test device is provided with a chamfer 19 or a rounded corner, and the plug 23 of the first board-side connector 32 is provided with a tapered guide head. The notch of the slot 18 of the second connector 12 is provided with a chamfer 19 or a rounded corner, and the plug 23 of the second board-side connector 21 is provided with a tapered guide head.

[0056] When the first connector 11 and the first board-end connector 32 of the embodiment of the present application are docked, the first board-end connector 32 achieves adaptive centering of the first connector 11 under the guidance of the tapered guide head and the notch of the slot 18 of the first connector 11, thereby achieving floating docking between the first connector 11 and the first board-end connector 32. When the second connector 12 and the second board-end connector 21 are docked, the second board-end connector 21 achieves adaptive centering of the second connector 12 under the guidance of the tapered guide head and the notch of the slot 18 of the second connector 12, thereby achieving floating docking between the second connector 12 and the second board-end connector 21.

[0057] In some alternative embodiments: See Figure 4 As shown, an embodiment of the present application provides a high-speed, high-density test device for wafer testing. In the high-speed, high-density test device, at least two layers of contact springs 17 connected to a first board-end connector 32 are provided in the slot 18 of each first connector 11. The contact springs of each layer of the first connector 11 are pluggable and connected to the first board-end connector 32 in a sequential order. At least two layers of contact springs 17 connected to a second board-end connector 21 are provided in the slot 18 of each second connector 12. The contact springs 17 of each layer of the second connector 12 are pluggable and connected to the second board-end connector 21 in a sequential order.

[0058] When the several first connectors 11 of the embodiment of the present application are docked with the several first board-end connectors 32, and when the several second connectors 12 are docked with the several second board-end connectors 21, the contact resistance and friction are reduced, thereby realizing a low plug-in force structural connection, ensuring that the overall plug-in force is small when the entire machine interface is connected as a whole, and ensuring the reliability of the connection.

[0059] How it works

[0060] An embodiment of the present application provides a high-speed, high-density testing device for wafer testing. Since the high-speed, high-density testing device of the present application is provided with a high-speed, high-density connector 1, which includes a plurality of first connectors 11 and a plurality of second connectors 12, each first connector 11 and each second connector 12 are connected by a coaxial cable 13; a testing machine 3, the testing machine 3 is provided with a plurality of signal testing boards 31 for sending test signals to the wafer under test, and the signal testing board 31 is provided with a plurality of first board end connectors 32 connected to the first connectors 11; a probe card 2, the probe card 2 is provided with a plurality of second board end connectors 21 connected to the second connectors 12, and a plurality of probes 22 fixed on the probe card 2 and connected to the wafer under test.

[0061] Therefore, the test machine 3 and the probe card 2 of the high-speed, high-density test device of the present application are connected via a high-speed, high-density connector 1. The high-speed, high-density connector 1 is provided with a plurality of first connectors 11 and a plurality of second connectors 12. Each first connector 11 and each second connector 12 are connected via a coaxial cable 13. The high-speed, high-frequency test signal is emitted through the signal test board 31 of the test machine 3. After the mapping relationship of the high-speed, high-density connector 1 is connected, the signal is accurately connected to the corresponding probe 22 of the probe card 2, thereby realizing the test of the wafer.

[0062] The mapping relationship arrangement of the high-speed, high-density connector 1 of the high-speed, high-density test device of the present application can be flexibly defined. By designing and adjusting the line sequence of the coaxial cable 13, different test solution requirements can be quickly implemented. Compared with the design definition of existing spring pin connection solutions, the high-speed, high-density connector 1 of the high-speed, high-density connection device has a low link loss for high-speed, high-frequency signals, reducing the signal link loss of multiple links in the existing spring pin connection solution, and improving the signal integrity and reliability of the test equipment.

[0063] In the description of this application, it should be noted that the terms "upper" and "lower" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0064] It should be noted that, in this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0065] The foregoing is merely a list of specific embodiments of the present application, intended to enable those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the broadest scope consistent with the principles and novel features of the present application.

Claims

1. A high-speed and high-density test device for wafer testing, characterized in that: include: A high-speed, high-density connector (1) comprises a plurality of first connectors (11) and a plurality of second connectors (12), wherein each of the first connectors (11) and each of the second connectors (12) are connected via a coaxial cable (13); A test machine (3), the test machine (3) being provided with a plurality of signal test boards (31) for sending test signals to the wafer under test, the signal test boards (31) being provided with a plurality of first board-end connectors (32) connected to the first connectors (11); A probe card (2) is provided with a plurality of second board-end connectors (21) connected to second connectors (12), and a plurality of probes (22) fixed on the probe card (2) and connected to a wafer to be tested.

2. The high-speed, high-density test device for wafer testing according to claim 1, wherein: The high-speed, high-density connector (1) further comprises a lower fixing plate for fixing a plurality of the first connectors (11), wherein the plurality of the first connectors (11) are arranged in a linear array on the lower fixing plate; The first connector (11) is provided with a mounting hole, and a screw (16) for fixing the first connector (11) to the lower fixing plate is loosely fitted in the mounting hole.

3. The high-speed, high-density test device for wafer testing according to claim 1, wherein: A rivet plate (25) for fixing the second board-end connector (21) to the probe card (2) is provided on a side wall of the second board-end connector (21), and a rivet (24) for riveting the second board-end connector (21) to the probe card (2) is provided on the rivet plate (25); The riveted plates (25) are asymmetrically arranged on the side walls of the second board end connectors (21), and the riveted plates (25) between two adjacent second board end connectors (21) are staggered and arranged along the length direction of the second board end connectors (21).

4. The high-speed, high-density test device for wafer testing according to claim 1, wherein: The high-speed, high-density connector (1) further comprises an upper fixing plate (14) for fixing a plurality of the second connectors (12), wherein the plurality of the second connectors (12) are arranged circumferentially on the upper fixing plate (14); The second connector (12) is provided with a mounting hole, and a screw (16) is loosely fitted in the mounting hole to fix the second connector (12) to the upper fixing plate (14).

5. The high-speed, high-density test device for wafer testing according to claim 1, wherein: The notch of the slot (18) of the first connector (11) is provided with a chamfer (19) or a rounded corner, and the plug (23) of the first board-end connector (32) is provided with a conical guide head.

6. The high-speed, high-density test device for wafer testing according to claim 1, wherein: The notch of the slot (18) of the second connector (12) is provided with a chamfer (19) or a rounded corner, and the plug (23) of the second board-end connector (21) is provided with a tapered guide head.

7. The high-speed, high-density test device for wafer testing according to claim 1, wherein: At least two layers of contact springs (17) connected to the first board-end connector (32) are provided in the slots (18) of each first connector (11), and the contact springs (17) of each layer of the first connector (11) are plug-in connected to the first board-end connector (32) in a sequential order.

8. The high-speed, high-density test device for wafer testing according to claim 1, wherein: At least two layers of contact springs (17) connected to the second board-end connector (21) are provided in the slots (18) of each second plug connector (12), and each layer of contact springs (17) of the second plug connector (12) is pluggably connected to the second board-end connector (21) in a sequential order.

9. The high-speed, high-density test device for wafer testing according to claim 1, wherein: The test machine (3) further comprises a chassis (33) with an opening on the top and closed on all sides, wherein a plurality of signal test boards (31) are arranged at intervals and plugged into the chassis (33).

10. The high-speed and high-density test device for wafer testing according to claim 1, characterized in that: The probe card (2) is a circular structure, and a plurality of the second board end connectors (21) are evenly distributed radially around the probe card (2).

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