Computing system and method implemented by a controller in a computing system

Abstract

A system includes a first printed circuit board, a temperature sensor, a switching circuit, and a controller. The temperature sensor is configured to measure the temperature of at least one area of ​​the first printed circuit board. The switching circuit is disposed on the first printed circuit board. The controller is configured to trigger the switching circuit to shut off power to the first printed circuit board based at least in part on a temperature detected by the temperature sensor above a temperature threshold. Since known power protection methods rely on interrupting power when maximum power is sensed, these methods may have blind spots for certain areas of the first printed circuit board. The system provided herein can interrupt power faster than known power protection methods.

Description

Technical Field

[0001] The present invention is generally related to a computing device, and more specifically to responding to a high-temperature region detected on a printed circuit board of the computing device. Background Technology

[0002] Computing systems typically include printed circuit boards (PCBs) that generate heat. PCBs may include electronic fuses (eFuses), which are used for power protection purposes to alter the operation of the PCB. The electronic fuses and / or hot-swap controllers are designed to protect the computing system when dynamic insertion / removal of the PCB and / or short circuits that could cause burnout occur. Short-circuit protection provided by the electronic fuses and / or hot-swap controllers utilizes the maximum current in the power domain, network, or metal traces on the PCB. This short-circuit protection is designed to protect against short circuits by monitoring the current flowing through the electronic fuse and / or hot-swap controller subsystem as a trigger threshold. Once the current exceeds a certain threshold setting, the electronic fuse and / or hot-swap controller interrupts the current flow.

[0003] Current electronic fuse and / or hot-swap controller subsystems have several drawbacks. These systems fail to provide protection when the power supply area and / or network or metal traces do not reach maximum current and / or power. Therefore, the power plane topology on the printed circuit board may leave certain areas of the board unprotected by the electronic fuse and / or hot-swap controller subsystem. This disclosure addresses problems related to electronic fuse and / or hot-swap controllers, as well as other related issues. Summary of the Invention

[0004] The terms used herein, including examples and similar terms, are intended to refer broadly to all objects of this disclosure and the following claims. Several statements containing these terms should be understood not to limit the objects described herein or to limit the meaning or scope of the following claims. The embodiments of this disclosure covered herein are defined by the following claims and are not part of the content of this invention. This summary is a high-level overview of various features of this disclosure and introduces some concepts further described in the following description paragraphs. This summary is not intended to identify key or essential components of the objects of the claims, nor is it intended to be used independently to determine the scope of the objects of the claims. The subject matter should be understood by referring to the complete specification of this disclosure, including all drawings to appropriate scale and each claim.

[0005] According to certain features of this disclosure, a system includes a first printed circuit board, a temperature sensor, a switching circuit, and a controller. The temperature sensor is configured to measure the temperature of at least one area of ​​the first printed circuit board. The switching circuit is disposed on the first printed circuit board. The controller is configured to trigger the switching circuit, at least in part, based on a temperature detected by the temperature sensor above a temperature threshold, to shut off power to the first printed circuit board.

[0006] In one embodiment, the temperature sensor is an infrared sensor. In another embodiment, the temperature sensor is an array of infrared sensors. In one embodiment, a second printed circuit board is connected to a first printed circuit board via a communication bus. The second printed circuit board includes the temperature sensor. In one embodiment, the system also includes a chassis having a top portion and a bottom portion. The first printed circuit board is attached to the bottom portion of the chassis, and the second printed circuit board is attached to the top portion of the chassis. The communication bus may be a suspended jumper from the first printed circuit board to the second printed circuit board. In one embodiment, the switching circuitry is a hot-swap controller, an electronic fuse, or any power controller device capable of starting / stopping a power supply.

[0007] According to certain portions of this disclosure, a method implemented by a controller in a computing system is provided. This method includes receiving a temperature from a temperature sensor relating to at least a region of a first printed circuit board, the first printed circuit board being fixed to the bottom surface of the chassis of the computing system. The method further includes determining whether the received temperature exceeds a temperature threshold. The method also includes triggering a switching circuit to shut off power to the first printed circuit board based at least in part on the received temperature exceeding the temperature threshold.

[0008] In one embodiment, the temperature sensor is an infrared sensor. In another embodiment, the method is implemented by a controller in the computing system, wherein the temperature sensor is an array of infrared sensors. In one embodiment, the temperature is received via a communication bus connecting a second printed circuit board to a first printed circuit board, and the temperature sensor is disposed on the second printed circuit board. The second printed circuit board is attached to the top surface of the chassis of the computing system. The second printed circuit board may be disposed on the top surface of the chassis of the computing system. The communication bus is a suspended jumper from the first printed circuit board to the second printed circuit board. In one embodiment, the switching circuit is a hot-swap controller, an electronic fuse, or any power controller device capable of starting / stopping a power supply.

[0009] The foregoing description is not intended to represent every embodiment or every feature of this disclosure. Rather, the foregoing description provides only examples of some novel features and characteristics set forth herein. These features and advantages, as well as other features and advantages of this disclosure, will become apparent from the following detailed description of representative embodiments and modes when taken in conjunction with the accompanying drawings and the appended claims. Additional features of this disclosure will be apparent to those skilled in the art in light of the detailed description of the various embodiments with reference to the illustrations, a brief summary of which is provided below. Attached Figure Description

[0010] The advantages of this disclosure and the accompanying drawings will be better understood from the following description of embodiments in conjunction with the accompanying drawings. These drawings depict only exemplary embodiments and should not be construed as limiting the scope of the various embodiments or the claims.

[0011] Figure 1 illustrates a system according to certain aspects of this disclosure for providing power protection for components on a printed circuit board (PCB).

[0012] Figure 2 is a partial top view of a printed circuit board showing heat distribution according to certain aspects of this disclosure.

[0013] Figure 3 is an exemplary system according to certain aspects of this disclosure for providing power protection for components on a printed circuit board.

[0014] 100: System

[0015] 102: Sensor

[0016] 104: Controller

[0017] 106: Printed Circuit Board

[0018] 108: Power Supply

[0019] 200: Printed Circuit Board

[0020] 202: Wide Shape Area

[0021] 204: Narrow-shaped area

[0022] 300: System

[0023] 302a: Top chassis section

[0024] 302b: Bottom chassis section

[0025] 304a: Printed Circuit Board

[0026] 304b: Printed Circuit Board

[0027] 306: Communication Bus

[0028] 308: Controller

[0029] 310: Switching circuit

[0030] 312: Infrared sensor

[0031] 314: Wide-shaped area

[0032] 316: Narrow-shaped area Detailed Implementation

[0033] Circuit components placed on printed circuit boards (PCBs) may sporadically generate heat, or generate heat in highly concentrated areas on the PCB. Depending on the inability to dissipate excessive heat, circuit components or metal traces on the PCB may be damaged. Embodiments of this disclosure provide systems and methods for detecting excessive heat generated on a printed circuit board and interrupting power to prevent damage to circuit components on the PCB.

[0034] Various embodiments are described with reference to the accompanying drawings, throughout which similar reference numerals are used to designate similar or equivalent elements. The drawings are not drawn to scale and are provided solely for illustrative purposes. It should be understood that many specific details, relationships, and methods are set forth to provide a comprehensive understanding. However, those skilled in the art will readily appreciate that various embodiments may be practiced without one or more specific details or in other ways. In other instances, well-known structures or operations are shown in detail to avoid obscuring certain features of the various embodiments. The various embodiments are not limited to the order in which actions or events are shown, as some actions may occur in a different order and / or simultaneously with other actions or events. Furthermore, not all actions or events shown are necessary for carrying out the method according to the invention.

[0035] The disclosed elements and limitations, for example, in the abstract, summary, and description of embodiments, but not expressly stated in the claims, should not be incorporated individually or collectively into the claims by implication, inference, or otherwise. For the purposes of this embodiment, unless expressly stated otherwise, the singular includes the plural and vice versa. The noun “comprising” means “including but not limited to”. Furthermore, similar words such as “about,” “almost,” “substantially,” and “approximately” and their analogies may be meant herein as, for example, “at,” “near,” “within 3-5% of,” “within acceptable manufacturing tolerances,” or any logical combination thereof. Similarly, the terms “vertical” or “horizontal” are intended to additionally include “within 3-5%” in the vertical or horizontal direction, respectively. In addition, directional terms such as “top,” “bottom,” “left,” “right,” “above,” and “below” are intended to relate to the equivalent directions described in the reference illustrations, and to be understood from the context of the referenced object or element, such as from the object or element’s usual location, or as otherwise described herein.

[0036] Referring to Figure 1, according to some embodiments of this disclosure, a system 100 is provided for interrupting power to a printed circuit board 106 using one or more sensors 102. System 100 includes sensors 102, a power supply 108, a controller 104, and a printed circuit board 106. The printed circuit board 106 and the controller 104 are shown as separate components. However, in some embodiments, the controller 104 may be integrated on the printed circuit board 106. The printed circuit board 106 may include resistors, integrated circuits, processors, transistors, etc. Sensor 102 may include an infrared sensor or an infrared camera. Sensor 102 detects heat generated on the printed circuit board 106. Controller 104 determines whether the heat generated on the printed circuit board 106 exceeds a temperature threshold. Controller 104 interrupts power to the printed circuit board 106 at least in part based on the heat generated on the printed circuit board 106 exceeding the temperature threshold. In some embodiments, the temperature threshold is 70°C. In some embodiments, the temperature threshold is set below the temperature rating of at least one component mounted on the printed circuit board 106. For example, the temperature rating of a component with a minimum rating on printed circuit board 106 is 85°C. To prevent damage to the component or to prevent the component from being exposed to an environment where the component is not rated for temperature, the temperature threshold is set to 80°C.

[0037] Power supply 108 provides power to sensor 102, controller 104, and printed circuit board 106. Power supply 108 may be a single power supply or may include a combination of multiple power supplies. For example, sensor 102 may operate using a different power supply (e.g., a battery) than printed circuit board 106 (e.g., alternating current, AC).

[0038] Referring to Figure 2, a printed circuit board 200 is provided according to some embodiments of the present disclosure. The printed circuit board 200 includes two shape regions: a wide shape region 202 and a narrow shape region 204. These shape regions are examples of heat distribution across the surface of the printed circuit board 200, indicating that heat may not be uniformly distributed across the printed circuit board 200. Some areas on the printed circuit board 200 are not adequately protected by known electronic fuses (eFuse) and / or hot-swap controllers. For example, uneven power distribution on the printed circuit board 200 can cause problems in both the wide shape region 202 and the narrow shape region 204. Known electronic fuses and / or hot-swap controllers may fail to protect against short circuits and / or become damaged circuits or components, resulting in abnormally high currents. If the abnormally high current is below a current threshold or far from the area where the electronic fuse and / or hot-swap controller operates, power protection will fail to protect the circuit components and may cause the printed circuit board 200 to burn out in the narrow shape region 204.

[0039] Referring to Figure 3, a cross-sectional view of a system 300 is provided according to certain aspects of this disclosure for providing power protection for components on a printed circuit board 304b. The system 300 can be a computing system (e.g., a server, desktop computer, laptop computer, etc.), a measuring device, consumer electronics, etc. The system 300 includes a chassis having a top chassis portion 302a and a bottom chassis portion 302b. The printed circuit board 304b is disposed on the bottom chassis portion 302b, and a heat-detecting printed circuit board 304a is disposed on the top chassis portion 302a.

[0040] The heat-detecting printed circuit board 304a includes an infrared sensor 312. The infrared sensor 312 may be an array or matrix of infrared sensors dispersed across the surface of the printed circuit board 304a. The infrared sensor 312 measures the temperature of the printed circuit board 304b. The measured temperature information is communicated via the infrared sensor 312 through a communication bus 306 connecting the printed circuit boards 304a and 304b. The communication bus 306 may be a hanging jumper cable connecting the printed circuit boards 304a and 304b. The spacing between the printed circuit boards 304a and 304b determines the field of view of the infrared sensor 312. In some embodiments, the distance between the top chassis portion 302a and the bottom chassis portion 302b is adjustable so that the field of view of the infrared sensor 312 on the printed circuit board 304b can be adjusted. The closer the infrared sensor 312 is to the printed circuit board 304b, the smaller its field of view. Therefore, the infrared sensor 312 will cover a smaller area on the printed circuit board 304b. Alternatively, the farther the infrared sensor 312 is from the printed circuit board 304b, the larger its field of view. Therefore, the infrared sensor 312 will cover a larger area on the printed circuit board 304b.

[0041] In some embodiments, the infrared sensor 312 is a digital infrared temperature sensor (e.g., ORISYSTECH OTI-502T120). The infrared sensor 312 may include multiple temperature sensors within a surface-mount device package. For example, the surface-mount device package may include an ambient temperature detection sensor, an object temperature detection sensor, and dedicated circuitry. In some embodiments, the infrared sensor 312 can measure ambient temperatures in the range between -20°C and 85°C. In some embodiments, the infrared sensor 312 can measure object temperatures in the range between -20°C and 120°C. In some embodiments, the infrared sensor 312 can measure object temperatures with a resolution within 0.01°C. The infrared sensor 312 can use I... 2 The measured temperature information is communicated via a C-type data cable. In some embodiments, the infrared sensor 312 requires an I-type sensor from at least one of the printed circuit boards 304a or 304b. 2 C is the clock line used to operate any digital dedicated circuitry within the infrared sensor 312.

[0042] Printed circuit board 304b includes controller 308 and switching circuitry 310 (e.g., hot-swap controller, electronic fuse, or any power controller device capable of starting and / or stopping power supply). Printed circuit board 304b may have regions showing a wide-shaped area 314 (similar to the wide-shaped area 202 in Figure 2) and / or a narrow-shaped area 316 (similar to the narrow-shaped area 204 in Figure 2). Whether a particular area on printed circuit board 304b is classified as wide-shaped area 314 or narrow-shaped area 316 depends on the circuit components on printed circuit board 304b and the power distribution among the circuit components on printed circuit board 304b. Depending on the field of view of infrared sensor 312, controller 308, in cooperation with infrared sensor 312, can determine that the sensed temperature in narrow-shaped area 316 on printed circuit board 304b exceeds a temperature threshold. Controller 308 may provide a stop-start signal to switching circuitry 310 to shut down power to printed circuit board 304b. By controlling the power supply to the printed circuit board 304b using the sensed temperature, overcurrent situations that could cause the printed circuit board to burn out or be damaged can be avoided.

[0043] Although the invention has been shown and described with respect to one or more embodiments, equivalents and modifications will arise upon reading and understanding this specification and the accompanying drawings by those skilled in the art. Furthermore, while specific features of the invention may have been disclosed with respect to only one of several embodiments, such features may be combined with one or more other features of other embodiments, as may be desired and advantageous for any given or particular application.

[0044] While various embodiments of the invention have been described above, it should be understood that they are presented by way of example only and not as limiting. Various changes may be made to the embodiments disclosed herein without departing from the spirit or scope of the invention. Therefore, the breadth and scope of the invention should not be limited by any of the above embodiments. Rather, the scope of the invention should be defined by the following claims and their equivalents.

Claims

1. A computing system comprising: a chassis having a top portion and a bottom portion, the top portion and the bottom portion arranged in parallel; a first printed circuit board attached to the bottom portion of the chassis; a second printed circuit board attached to the top portion of the chassis, the second printed circuit board communicatively coupled to the first printed circuit board, the second printed circuit board including a temperature sensor configured to measure a temperature of at least a region of the first printed circuit board; a switching circuit disposed on the first printed circuit board; and a controller disposed on the first printed circuit board, the controller communicatively coupled to the temperature sensor and configured to receive temperature information from the temperature sensor and trigger the switching circuit to shut off power to the first printed circuit board based at least in part on the temperature information indicating a temperature above a temperature threshold.

2. The computing system of claim 1, wherein the temperature sensor is an infrared sensor.

3. The computing system of claim 1, wherein the temperature sensor is an array of infrared sensors.

4. The computing system of claim 1, wherein: the second printed circuit board is connected to the first printed circuit board via a communication bus.

5. The computing system of claim 4, wherein the communication bus is a hanging jumper from the first printed circuit board to the second printed circuit board.

6. The computing system of claim 1, wherein the switching circuit is a power controller device capable of starting or stopping a starting power, the power controller device being a hot plug controller or an electronic fuse.

7. The computing system of claim 2, wherein a field of view of the infrared sensor is determined by a spacing between the first printed circuit board and the second printed circuit board. a distance between the top portion of the chassis and the bottom portion of the chassis is adjustable such that the spacing between the first printed circuit board and the second printed circuit board is changeable to adjust the field of view of the infrared sensor.

8. The computing system of claim 7, wherein, 10. The computing system of claim 3, wherein the array of infrared sensors is dispersed across a surface of the second printed circuit board.

9. The computing system of claim 2, wherein the infrared sensor comprises a digital circuit configured to receive an I 2 C clock from the first printed circuit board.

11. A method implemented by a controller in a computing system, comprising: receiving temperature information from a temperature sensor related to at least a region of a first printed circuit board, the first printed circuit board secured to a bottom portion of a chassis of the computing system and the temperature sensor disposed on a second printed circuit board secured to a top portion of the chassis, the top portion and the bottom portion arranged in parallel; determining, via a controller disposed on the first printed circuit board, whether the received temperature information indicates a temperature exceeding a temperature threshold, the controller communicatively coupled to the temperature sensor; and triggering a switching circuit to shut off power to the first printed circuit board based at least in part on the temperature exceeding the temperature threshold, the switching circuit disposed on the first printed circuit board.

12. The method implemented by a controller in a computing system of claim 11, wherein the temperature sensor is an infrared sensor. ​ 13. The method implemented by a controller in a computing system of claim 11, wherein the temperature sensor is an array of infrared sensors.

14. The method implemented by a controller in a computing system of claim 11, wherein the temperature is received via a communication bus connecting the second printed circuit board to the first printed circuit board.

15. The method implemented by a controller in a computing system of claim 14, wherein the communication bus is a hanging jumper from the first printed circuit board to the second printed circuit board.

16. The method implemented by a controller in a computing system of claim 11, wherein the switching circuit is a power controller device capable of enabling or disabling an enabling power source, the power controller device being a hot plug controller or an electronic fuse.

17. The method implemented by a controller in a computing system of claim 12, wherein a field of view of the infrared sensor is determined by a spacing between the first printed circuit board and the second printed circuit board.

18. The method implemented by a controller in a computing system of claim 17, further comprising: adjusting a distance between the top portion of the chassis and the bottom portion of the chassis to increase or decrease the spacing between the first printed circuit board and the second printed circuit board to adjust the field of view of the infrared sensor.

19. The method implemented by a controller in a computing system of claim 12, further comprising: I 2 C clock to operate a digital circuit within the infrared sensor.

20. The method implemented by a controller in a computing system of claim 13, wherein the array of infrared sensors is dispersed across a surface of the second printed circuit board.

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