Electronic device and heat-conducting wave-absorbing material

Abstract

This application provides an electronic device and a thermally conductive and microwave-absorbing material, comprising: a motherboard disposed within a housing space formed by the casing of the electronic device, the motherboard having at least one functional component and corresponding peripheral circuitry; a heat dissipation module disposed on the side of the motherboard where the functional component and peripheral circuitry are disposed, for at least heat dissipation of the functional component and peripheral circuitry; a first thermal conductive element disposed between each functional component and the heat dissipation module, for conducting heat generated by the functional component to the heat dissipation module; and a second thermal conductive element disposed at least between the peripheral circuitry and the heat dissipation module, for conducting heat generated by the peripheral circuitry to the heat dissipation module; wherein the first thermal conductive element can also absorb electrical noise generated by the functional component, and the second thermal conductive element can also absorb electrical noise generated by the peripheral circuitry.

Description

Technical Field

[0001] This application relates to the field of thermally conductive and microwave absorbing structure technology, and in particular to an electronic device and a thermally conductive and microwave absorbing material. Background Technology

[0002] High-performance computers, due to their faster processing speeds and higher power consumption of the chips on their motherboards, generate stronger radio frequency (RF) noise, severely impacting wireless network connection quality and even causing network outages. Simultaneously, the motherboard chips in high-performance computers also generate more heat during operation, leading to extremely high temperatures near the chips. Traditional shielding solutions, such as shielding covers or absorbing materials, severely hinder heat dissipation, causing system crashes and shutdowns. Therefore, the industry has yet to find a satisfactory solution for shielding the RF noise from the high-heat-generating motherboards themselves, making it an unsolved problem in high-performance computer design. Summary of the Invention

[0003] This application provides an electronic device and a thermally conductive and microwave-absorbing material.

[0004] According to a first aspect of this application, an electronic device is provided, comprising: a motherboard disposed within a receiving space formed by a housing of the electronic device, the motherboard having at least one functional component and peripheral circuitry corresponding to the functional component; a heat dissipation module disposed on the side of the motherboard where the functional component and the peripheral circuitry are disposed, for at least dissipating heat from the functional component and the peripheral circuitry; a first heat-conducting element disposed between each of the functional components and the heat dissipation module, for conducting heat generated by the functional component to the heat dissipation module; and a second heat-conducting element disposed at least between the peripheral circuitry and the heat dissipation module, for conducting heat generated by the peripheral circuitry to the heat dissipation module; wherein the first heat-conducting element is also capable of absorbing electrical noise generated by the functional component, and the second heat-conducting element is also capable of absorbing electrical noise generated by the peripheral circuitry.

[0005] In one possible embodiment, the thermal conductivity of the first thermally conductive element is superior to that of the second thermally conductive element; and / or, the ability of the second thermally conductive element to absorb electrical noise is superior to that of the first thermally conductive element to absorb electrical noise.

[0006] In one embodiment, the second heat-conducting element is further disposed in other areas of the motherboard where the functional components and peripheral circuits are not disposed, and forms a recessed area with the area where each of the functional components is located; the first heat-conducting element is filled between the recessed area and the heat dissipation module.

[0007] In one possible embodiment, the thickness of the second thermal conductive element in the direction perpendicular to the motherboard is not less than the maximum distance between the motherboard and the heat dissipation module, and the thickness of the first thermal conductive element in the direction perpendicular to the motherboard is not less than the maximum distance between the functional component and the heat dissipation module; and / or, the hardness of the first thermal conductive element is less than the hardness of the second thermal conductive element.

[0008] In one embodiment, the second thermally conductive element is also capable of absorbing electrical noise generated by the functional component; and / or, the first thermally conductive element has stronger adhesion than the second thermally conductive element.

[0009] In one possible embodiment, the package further includes: an encapsulation structure disposed on at least one exposed surface of the functional component, the encapsulation structure being used to fix the functional component at a designated location on the motherboard; wherein the encapsulation structure is capable of conducting heat generated by the functional component to the first heat-conducting element and / or the second heat-conducting element, and / or the encapsulation structure is also capable of absorbing a portion of the electrical noise generated by the functional component.

[0010] In one embodiment, the peripheral circuit is disposed around the periphery of the corresponding functional component. The peripheral circuit includes a plurality of electronic components spaced apart, with a first gap between the plurality of electronic components. The second heat-conducting component has a recess corresponding to the electronic component and a first protrusion corresponding to the first gap on the side facing the peripheral circuit, so as to achieve a sealed connection with the peripheral circuit; and / or, the peripheral circuit has a second gap with the corresponding functional component, and the second heat-conducting component has a second protrusion corresponding to the second gap, so as to achieve a sealed connection with the motherboard and the functional component.

[0011] In one embodiment, the first heat-conducting component and the second heat-conducting component are made of multiple raw materials of the same type but in different proportions, and the raw materials include at least heat-conducting particles, microwave-absorbing particles, fillers, and binders.

[0012] In one possible embodiment, the proportion of the thermally conductive particles in the first thermally conductive component is higher than that in the second thermally conductive component, the proportion of the filler in the first thermally conductive component is lower than that in the second thermally conductive component, and / or the proportion of the binder in the first thermally conductive component is higher than that in the second thermally conductive component.

[0013] According to a second aspect of the embodiments of this application, a thermally conductive and microwave-absorbing material is provided, comprising: 40% to 45% thermally conductive particles, 25% to 30% microwave-absorbing particles, 10% to 15% adhesive, and 5% to 10% filler; or, 40% to 45% microwave-absorbing particles, 25% to 30% thermally conductive particles, 10% to 15% filler, and 5% to 10% adhesive.

[0014] The electronic device and thermally conductive and wave-absorbing material provided in this application embodiment, by setting a first thermally conductive component between the functional components of the motherboard and the heat dissipation module, and setting a second thermally conductive component between the peripheral circuits corresponding to the functional components and the heat dissipation module, conducts the heat generated by the functional components and peripheral circuits to the heat dissipation module, and absorbs the electrical noise generated by the functional components and peripheral circuits. During the operation of the electronic device, it achieves effective heat dissipation of the motherboard, avoids electrical noise from affecting the structural design and user experience of the electronic device, solves the problem of electrical noise shielding of high-heat-generating motherboards, suppresses the electrical noise of the entire electronic device to a lower level, and greatly improves the communication quality of the electronic device.

[0015] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0016] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily apparent from the following detailed description taken in conjunction with the accompanying drawings. Several embodiments of this application are illustrated in the drawings by way of example and not limitation, in which:

[0017] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0018] Figure 1 This paper shows a schematic diagram of the overall structure of an electronic device according to an embodiment of the present application;

[0019] Figure 2 This paper shows a schematic diagram of the overall structure of the motherboard of an electronic device according to an embodiment of the present application;

[0020] Figure 3 This paper shows a top view of the motherboard structure of an electronic device according to an embodiment of the present application;

[0021] Figure 4 This paper illustrates a schematic cross-sectional structure of a motherboard of an electronic device according to an embodiment of this application. Figure 1 ;

[0022] Figure 5 This paper illustrates a schematic cross-sectional structure of a motherboard of an electronic device according to an embodiment of this application. Figure 2 ;

[0023] Figure 6 This paper shows an exploded cross-sectional view of an electronic device according to an embodiment of the present application;

[0024] Figure 7 An exploded cross-sectional view of an electronic device according to another embodiment of this application is shown.

[0025] The reference numerals in the attached drawings are as follows: 1. Mainboard; 11. Functional component; 12. Peripheral circuit; 121. Electronic component; 13. Other area; 14. Recessed area; 15. Packaging structure; 16. First gap; 17. Second gap; 2. Housing; 21. Accommodation space; 3. Heat dissipation module; 4. First heat conduction component; 5. Second heat conduction component; 51. Recess; 52. First convex part; 53. Second convex part. Detailed Implementation

[0026] To make the objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] Figure 1 A schematic diagram of the overall structure of an electronic device according to an embodiment of this application is shown.

[0028] See Figure 1 According to a first aspect of this application, an electronic device is provided, comprising: a motherboard 1 disposed within a receiving space 21 formed by a housing 2 of the electronic device, the motherboard 1 having at least one functional component 11 and a corresponding peripheral circuit 12 for the functional component 11; a heat dissipation module 3 disposed on the side of the motherboard 1 where the functional component 11 and the peripheral circuit 12 are disposed, for at least heat dissipation of the functional component 11 and the peripheral circuit 12; a first heat conductor 4 disposed between each functional component 11 and the heat dissipation module 3, for conducting heat generated by the functional component 11 to the heat dissipation module 3; and a second heat conductor 5 disposed at least between the peripheral circuit 12 and the heat dissipation module 3, for conducting heat generated by the peripheral circuit 12 to the heat dissipation module 3; wherein the first heat conductor 4 is also capable of absorbing electrical noise generated by the functional component 11, and the second heat conductor 5 is also capable of absorbing electrical noise generated by the peripheral circuit 12.

[0029] The electronic device provided in this application embodiment, by setting a first heat-conducting component 4 between the functional component 11 of the motherboard 1 and the heat dissipation module 3, and by setting a second heat-conducting component 5 between the peripheral circuit 12 and the heat dissipation module 3, allows the first heat-conducting component 4 to conduct heat generated by the functional component 11 to the heat dissipation module 3 and absorb electrical noise generated by the functional component 11. The second heat-conducting component 5 can conduct heat generated by the peripheral circuit 12 to the heat dissipation module 3 and absorb electrical noise generated by the peripheral circuit 12. With this configuration, during the operation of the electronic device, the heat generated by the functional component 11 and the peripheral circuit 12 on the motherboard 1 can be conducted to the heat dissipation module 3 through the first heat-conducting component 4 and the second heat-conducting component 5, thereby achieving effective heat dissipation of the motherboard 1. Furthermore, since the first heat-conducting component 4 and the second heat-conducting component 5 also have the function of absorbing electrical noise, it can prevent electrical noise from affecting the structural design and user experience of the electronic device. There is no need to set an additional shielding cover. The problem of electrical noise shielding of the high-heat-generating motherboard 1 is solved at the motherboard 1 level, and the electrical noise of the entire electronic device is suppressed to a low level, which greatly improves the communication quality of the electronic device.

[0030] Electronic devices are devices with data processing capabilities, including but not limited to: computers, mobile phones, tablets, cameras, etc. In this embodiment, the electronic device is further selected as a high-performance computer, possessing high-performance computing capabilities and needing to perform complex computational tasks. The electronic device is enclosed by a housing 2 to form a receiving space 21 for housing the motherboard 1, thus protecting the motherboard 1. The motherboard 1 is used to perform various data processing tasks. The functional components 11 and peripheral circuits 12 on the motherboard 1 generate heat and electrical noise during operation. The functional components 11 include, but are not limited to, chips with various functions, voltage regulator modules (VRMs), memory, onboard SSDs, etc. The functional components 11 can also be CPUs, wireless communication modules, etc. Electrical noise includes, but is not limited to, radio frequency noise, current noise, etc.

[0031] Figure 2 This paper shows a schematic diagram of the overall structure of the motherboard of an electronic device according to an embodiment of the present application; Figure 3 The diagram shows a top view of the motherboard structure of an electronic device according to an embodiment of this application.

[0032] See Figure 2 and Figure 3According to the design requirements of the motherboard 1, there can be one or more functional components 11, located at any position on the motherboard 1, including but not limited to the middle position of the motherboard 1, the periphery of the motherboard 1, etc. When there are multiple functional components 11, the multiple functional components 11 can be located in the same area of ​​the motherboard 1 or in different areas of the motherboard 1. Peripheral circuits 12 or other areas 13 of the motherboard 1 can be provided between the multiple functional components 11, and the multiple functional components 11 can be interconnected or abutted. When the multiple functional components 11 are interconnected or abutted, the corresponding multiple functional components 11 can be heat-conducted and absorb electrical noise through the same first heat-conducting element 4; when the multiple functional components 11 are located in different areas of the motherboard 1, this application can provide multiple first heat-conducting elements 4 to achieve heat conduction and absorption of electrical noise for the functional components 11 located in different areas. Correspondingly, the peripheral circuits 12 and the corresponding second heat-conducting elements 5 can also be set at any position on the motherboard 1, and their number is determined according to the actual situation and is not limited, which will not be elaborated below.

[0033] The first heat-conducting element 4 is attached to the functional component 11, and the second heat-conducting element 5 is attached to the peripheral circuit 12, with the second heat-conducting element 5 and the first heat-conducting element 4 being attached to each other. The first heat-conducting element 4 and the second heat-conducting element 5 can be made of thermally conductive and microwave-absorbing materials to achieve the purpose of heat conduction and absorption of electrical noise. In the specific selection of thermally conductive and microwave-absorbing materials, the first heat-conducting element 4 and the second heat-conducting element 5 can be made of thermally conductive and microwave-absorbing materials with the same composition or with different compositions.

[0034] Furthermore, in one embodiment of this application, the thermally conductive and microwave-absorbing material used to manufacture the first thermally conductive element 4 can be determined based on the specific values ​​of the heat and electrical noise generated by the functional component 11, and the thermally conductive and microwave-absorbing material used to manufacture the second thermally conductive element 5 can be determined based on the specific values ​​of the heat and electrical noise generated by the peripheral circuit 12. The first thermally conductive element 4 and the second thermally conductive element 5 are typically made of thermally conductive and microwave-absorbing materials with different compositions.

[0035] For example, if the defects caused by the heat generated by functional component 11 to the operation of the electronic device are more severe than the defects caused by the electrical noise generated by functional component 11, then a thermally conductive and microwave-absorbing material with excellent thermal conductivity can be selected when choosing the thermally conductive and microwave-absorbing material of the first heat-conducting component 4. Conversely, if the defects caused by the electrical noise generated by functional component 11 to the operation of the electronic device are more severe than the defects caused by the heat generated by functional component 11, then a thermally conductive and microwave-absorbing material with excellent electrical noise absorption capability can be selected when choosing the thermally conductive and microwave-absorbing material of the first heat-conducting component 4. Similarly, the thermally conductive and microwave-absorbing material of the second heat-conducting component 5 can be selected based on the heat and electrical noise generated by the peripheral circuit 12, which will not be elaborated further below.

[0036] The thermal conductivity of the first heat-conducting component 4 is better than that of the second heat-conducting component 5; and / or, the ability of the second heat-conducting component 5 to absorb electrical noise is better than that of the first heat-conducting component 4 to absorb electrical noise.

[0037] Under normal circumstances, the heat generated by functional component 11 during operation is usually greater than the heat generated by peripheral circuit 12 during operation. Therefore, in this application, the thermal conductivity of the thermally conductive and absorbing material used to make the first thermally conductive component 4 is superior to that used to make the second thermally conductive component 5. This ensures that the thermal conductivity of the first thermally conductive component 4 can meet the heat dissipation requirements of functional component 11. In this embodiment, functional component 11 can be further defined as a component that generates more heat than a specified heat value during operation. This configuration allows for targeted and rapid heat dissipation of functional components 11 with high heat dissipation requirements, ensuring the normal operation of the electronic device. Furthermore, the specified heat value can be determined based on the heat generated by peripheral circuit 12 during operation; that is, functional component 11 is defined as a functional component 11 that generates more heat than the corresponding peripheral circuit 12 when performing data processing tasks.

[0038] Correspondingly, the absorption performance of the thermally conductive and microwave-absorbing material used to make the first thermally conductive element 4 can be stronger, weaker, or equal to the absorption performance of the thermally conductive and microwave-absorbing material used to make the second thermally conductive element 5. Specifically, if the ability of the first thermally conductive element 4 to absorb electrical noise is sufficient to absorb the electrical noise generated by the functional component 11, the absorption performance of the thermally conductive and microwave-absorbing material used to make the second thermally conductive element 5 can be weaker, stronger, or equal to the absorption performance of the thermally conductive and microwave-absorbing material used to make the first thermally conductive element 4. The thermally conductive and microwave-absorbing material used to make the second thermally conductive element 5 only needs to meet the absorption requirements of the peripheral circuit 12. If the ability of the first thermally conductive element 4 to absorb electrical noise is insufficient to absorb the electrical noise generated by the functional component 11, this application may select a thermally conductive and microwave-absorbing material with a stronger absorption capacity than the first thermally conductive element 4 to make the second thermally conductive element 5, so that the second thermally conductive element 5 can simultaneously absorb the electrical noise generated by the functional component 11 and the peripheral circuit 12, thus meeting the operational requirements of the electronic equipment.

[0039] Figure 4 This paper illustrates a schematic cross-sectional structure of a motherboard of an electronic device according to an embodiment of this application. Figure 1 ; Figure 5 This paper illustrates a schematic cross-sectional structure of a motherboard of an electronic device according to an embodiment of this application. Figure 2 .

[0040] See Figure 3 , Figure 4 and Figure 5The second heat-conducting component 5 is also disposed in other areas 13 of the motherboard 1 where no functional components 11 and peripheral circuits 12 are disposed, and together with the area where each functional component 11 is located, they form a recessed area 14; the first heat-conducting component 4 is filled and disposed between the recessed area 14 and the heat dissipation module 3.

[0041] Based on the material characteristics of thermally conductive and microwave-absorbing materials, the state of these materials is related to the ratio of thermally conductive particles to microwave-absorbing particles in their composition. Thermally conductive and microwave-absorbing materials with good thermal conductivity are usually in the form of a paste, while those with good microwave-absorbing properties are usually in the form of a solid. Therefore, when the first thermally conductive component 4 is made of a paste-like thermally conductive and microwave-absorbing material, in order to facilitate the molding of the first thermally conductive component 4, this application uses a second thermally conductive component 5 to enclose the circumference of each functional component 11, forming a recessed area 14 corresponding to each functional component 11. With this configuration, the first thermally conductive component 4 can be filled into the recessed area 14 to achieve the purpose of shaping the paste-like thermally conductive and microwave-absorbing material, thus forming the first thermally conductive component 4. This prevents the paste-like thermally conductive and microwave-absorbing material from flowing onto the surface of the functional component 11 and onto the peripheral circuit 12 or even the motherboard 1. Based on the characteristic that the paste has a certain surface tension, the first thermally conductive component 4 can be filled into the recessed area 14 using an interference filling method to ensure that the first thermally conductive component 4 can fully contact the heat dissipation module 3 and the corresponding functional component 11.

[0042] Other areas 13 can refer to the mounting area on the motherboard 1 for mounting the functional component 11, or they can be blank areas on the motherboard 1 located around the functional component 11 and without peripheral circuits 12 or other components. It should be noted that if the area on the motherboard 1 located around the functional component 11 and attached to the functional component 11 is the peripheral circuit 12, then the recessed area 14 is formed by the functional component 11 and the second heat-conducting element 5 disposed on the peripheral circuit 12; if the area located around the functional component 11 and attached to the functional component 11 is the mounting area of ​​the functional component 11, then the recessed area 14 is formed by the functional component 11 and the second heat-conducting element 5 disposed on the mounting area; if the area located around the functional component 11 and attached to the functional component 11 is a blank area, then the recessed area 14 is formed by the functional component 11 and the second heat-conducting element 5 disposed on the blank area.

[0043] Wherein, the thickness of the second heat-conducting component 5 in the direction perpendicular to the motherboard 1 is not less than the maximum distance between the motherboard 1 and the heat dissipation module 3, and the thickness of the first heat-conducting component 4 in the direction perpendicular to the motherboard 1 is not less than the maximum distance between the functional component 11 and the heat dissipation module 3; and / or, the hardness of the first heat-conducting component 4 is less than the hardness of the second heat-conducting component 5.

[0044] Figure 6 An exploded cross-sectional view of an electronic device according to an embodiment of this application is shown.

[0045] Combination Figure 1and Figure 6 The solid second heat-conducting element 5 can be made of silicone-like thermally conductive and wave-absorbing material. When the second heat-conducting element 5 is made of silicone-like thermally conductive and wave-absorbing material, based on the elasticity of silicone, when setting the second heat-conducting element 5, its thickness can be greater than the maximum distance between the motherboard 1 and the heat dissipation module 3 in an unpressurized state. With this setting, when the second heat-conducting element 5 is located between the peripheral circuit 12 and the heat dissipation module 3, the pressure generated by the motherboard 1 and the heat dissipation module 3 causes the second heat-conducting element 5 to deform under pressure, so that the side of the second heat-conducting element 5 facing the heat dissipation module 3 can be in close contact with the heat dissipation module 3, and the side of the second heat-conducting element 5 facing the motherboard 1 can be in close contact with the motherboard 1.

[0046] The first heat-conducting component 4 is made of a paste-like heat-conducting and wave-absorbing material. When the first heat-conducting component 4 is not under pressure, due to the characteristics of the paste-like material, its surface tension allows the amount of paste-like heat-conducting and wave-absorbing material injected to be slightly higher than the opening of the recessed area 14. With this arrangement, when the first heat-conducting component 4 is located between the heat dissipation module 3 and the functional component 11, due to the compression of the heat dissipation module 3 and the functional component 11, the first heat-conducting component 4 can fill the circumferential gap of the recessed area 14, so that the first heat-conducting component 4 can be in close contact with the heat dissipation module 3 and the functional component 11.

[0047] In one embodiment, the first heat-conducting element 4 has stronger adhesion than the second heat-conducting element 5. It is understood that the stronger the adhesion of the first heat-conducting element 4, the better the connection effect between it and the gap between the second heat-conducting element 5 and the first heat-conducting element 4. The stronger the adhesion of the first heat-conducting element 4, the worse its fluidity, which can improve the stability of the connection structure between the motherboard 1 and the heat dissipation module 3.

[0048] Combination Figure 1 and Figure 2 In one embodiment, the device further includes: an encapsulation structure 15 disposed on at least one exposed surface of the functional component 11, the encapsulation structure 15 being used to fix the functional component 11 at a designated position on the motherboard 1; wherein the encapsulation structure 15 is capable of conducting the heat generated by the functional component 11 to the first heat-conducting element 4 and / or the second heat-conducting element 5, and / or the encapsulation structure 15 is also capable of absorbing a portion of the electrical noise generated by the functional component 11.

[0049] When the functional component 11 is a chip, the packaging structure 15 of this application is used to encapsulate the chip, forming a chip-specific packaging structure 15. The packaging structure 15 can be located on the surface of the functional component 11 facing the first heat-conducting element 4. Through the packaging structure 15, multiple functional components 11 can be connected into a single plane, facilitating the enclosure of the functional components 11 after the second heat-conducting element 5 is packaged, and facilitating the potting of the first heat-conducting element 4. Because the first heat-conducting element 4 has a high viscosity, after encapsulating the chip, the surface of the packaging structure 15 is smooth, which facilitates the tight adhesion between the first heat-conducting element 4 and the functional component 11 through the packaging structure 15, avoiding gaps at the connection surface between the first heat-conducting element 4 and the functional component 11 due to excessive viscosity. Furthermore, the smooth surface of the packaging structure 15 facilitates the removal of the paste-like first heat-conducting element 4.

[0050] Figure 7 An exploded cross-sectional view of an electronic device according to another embodiment of this application is shown.

[0051] Combination Figure 1 , Figure 2 and 7 In one embodiment, the peripheral circuit 12 is disposed around the periphery of the corresponding functional component 11. The peripheral circuit 12 includes a plurality of electronic components 121 spaced apart, with a first gap 16 between the plurality of electronic components 121. The second heat-conducting element 5 is provided with a recess 51 corresponding to the electronic component 121 and a first protrusion 52 corresponding to the first gap 16 on the side facing the peripheral circuit 12, so as to achieve a sealed connection with the peripheral circuit 12; and / or, the peripheral circuit 12 and the corresponding functional component 11 are provided with a second gap 17, and the second heat-conducting element 5 is provided with a second protrusion 53 corresponding to the second gap 17, so as to achieve a sealed connection with the motherboard 1 and the functional component 11.

[0052] Various types of electronic components 121 can also be disposed on the peripheral circuit 12 to meet the needs of the functional component 11. The electronic components 121 protrude relative to the peripheral circuit 12, so that a first gap 16 is formed between the electronic components 121. In order to enable the second heat-conducting element 5 to fit tightly with the peripheral circuit 12 on which the electronic components 121 are disposed, this application can provide a recess 51 corresponding to the electronic components 121 and a first protrusion 52 corresponding to the first gap 16 on the second heat-conducting element 5. When the structure is matched and the second heat-conducting element 5 has deformability, the second heat-conducting element 5 and the peripheral circuit 12 can be sealed together.

[0053] Similarly, since the functional component 11 protrudes relative to the motherboard 1, a second gap 17 will be formed between the functional component 11 and the electronic component 121. Correspondingly, a second protrusion 53 can be provided on the second heat-conducting component 5 for the second gap 17, and a second recess 51 corresponding to the electronic component 121 can be opened to achieve a sealed connection between the motherboard 1 and the functional component 11.

[0054] It should be added that when the surface of the peripheral circuit 12 is equipped with a variety of electronic components 121, the peripheral circuit 12 will be uneven. Since the second heat-conducting element 5 is made of silicone, it can still be easily separated from the peripheral circuit 12 after it is in close contact with the uneven surface of the peripheral circuit 12, making it easy to disassemble.

[0055] Additionally, the electronic device may also include an antenna. The first heat-conducting component 4 and the second heat-conducting component 5 provide heat conduction and noise shielding for the motherboard 1, allowing the antenna to be positioned closer to the noise source on the motherboard 1, greatly improving the flexibility of the overall layout design. The electronic device of this application does not alter the layout and structure of the motherboard 1, does not occupy the wiring space of the motherboard 1, and has no impact on the design of the motherboard 1. Furthermore, the first heat-conducting component 4 and the second heat-conducting component 5 can be designed in any shape for the heat-generating functional component 11, offering high design flexibility. It has strong thermal conductivity, perfectly compatible with heat dissipation, and has no impact on heat dissipation.

[0056] To facilitate a comprehensive understanding of the above embodiments, the following provides a radio frequency noise shielding structure for a high-heat-generating motherboard 1, thereby solving the radio frequency noise shielding problem of the high-heat-generating motherboard 1.

[0057] The main sources of radio frequency noise on the high-heat motherboard are the functional components 11 and the peripheral circuits 12. The functional components 11 are the chip body, and the surface of the chip body is packaged to form a flat package structure 15. Various types of electronic components 121 are soldered on the peripheral circuits 12. The electronic components 121 protrude relative to the motherboard 1, forming a first gap 16 between adjacent electronic components 121, so that the motherboard 1 has an uneven structure on the peripheral circuits 12.

[0058] A first heat-conducting component 4 is embedded between the chip body and the heat dissipation module 3. The heat generated by the chip body is conducted to the heat dissipation module 3 through the first heat-conducting component 4, and the generated radio frequency noise is absorbed by the first heat-conducting component 4 and the second heat-conducting component 5. A second heat-conducting component 5 is embedded between the peripheral circuit 12 and the heat dissipation module 3. The heat generated by the peripheral circuit 12 is conducted to the heat dissipation module 3 through the second heat-conducting component 5, and the generated radio frequency noise is absorbed by the second heat-conducting component 5.

[0059] Both the first heat-conducting component 4 and the second heat-conducting component 5 use heat-conducting and microwave-absorbing materials that include heat-conducting particles, microwave-absorbing particles, fillers, binders, and other raw materials. Different raw material ratios result in different thermal conductivity and microwave-absorbing properties, and the materials will also exhibit different physical forms. The thermal conductivity and microwave-absorbing capacity of the same heat-conducting material cannot simultaneously reach their maximum. Specifically, a higher proportion of heat-conducting particles results in better thermal conductivity; a higher proportion of microwave-absorbing particles results in better microwave-absorbing performance. The first heat-conducting component 4 and the second heat-conducting component 5 have different raw material ratios.

[0060] Specifically, the thermally conductive and wave-absorbing material used to make the first thermal conductive element 4 has the characteristics of high thermal conductivity, strong thermal conductivity, and weak wave absorption capacity by adjusting the raw material ratio. The thermally conductive and wave-absorbing material is in the form of paste and has good contact. The first thermal conductive element 4 can be coated on the packaging structure 15 of the chip body with huge heat generation. The heat can be fully conducted to the heat dissipation module 3 through the high thermal conductivity paste first thermal conductive element 4. Moreover, since the surface of the packaging structure 15 is smooth, the first thermal conductive element 4 can be easily cleaned.

[0061] The thermally conductive and microwave-absorbing material used to make the second thermal conductive element 5 has the characteristics of strong microwave absorption and weak thermal conductivity by adjusting the raw material ratio. The thermally conductive and microwave-absorbing material is in the form of silicone, with good elasticity, good sealing performance, easy peeling, and no residue. The silicone-like thermally conductive and microwave-absorbing material can be die-cut to remove the position corresponding to the chip body to obtain the second thermal conductive element 5. The second thermal conductive element 5 is attached to the peripheral circuit 12 around the chip body, and the second thermal conductive element 5 attached to the periphery of the chip body can form a recessed area 14 with the encapsulation surface of the chip body. The paste-like first thermal conductive element 4 is placed in the recessed area 14. Due to the obstruction of the second thermal conductive element 5 around the chip body, the flow of the first thermal conductive element 4 can be restricted, and the overflow of the paste-like first thermal conductive element 4 can be avoided.

[0062] The heat dissipation module 3 is pressed against the motherboard 1, which puts pressure on the first heat-conducting component 4 and the second heat-conducting component 5 located between the heat dissipation module 3 and the motherboard 1. The pressure makes the first heat-conducting component 4 and the second heat-conducting component 5 tightly connected, and also makes the first heat-conducting component 4 tightly connected to the heat dissipation module 3 and the chip body. After the second heat-conducting component 5 is deformed by pressure, it is tightly connected to the heat dissipation module 3 and the peripheral circuit 12, forming a completely sealed structure.

[0063] The first heat-conducting element 4, which is in the form of a paste, has weak wave absorption capability. However, its upper surface is a metal heat dissipation module 3, and its surrounding area is a second heat-conducting element 5 with stronger wave absorption capability. Therefore, the noise generated by the chip itself is fully absorbed by the first and second heat-conducting elements 4 and 5. The peripheral circuit 12 of the chip itself is fitted with a second heat-conducting element 5, which has a stronger wave absorption capability than the first heat-conducting element 4. The second heat-conducting element 5 can fully absorb the noise generated by the peripheral circuit 12 and the chip itself, thereby achieving shielding of the noise source of the entire motherboard 1. The huge heat generated by the chip itself can be fully conducted to the heat dissipation module 3 through the highly thermally conductive first heat-conducting element 4, and the lower heat generated by the peripheral circuit 12 can also be fully conducted to the heat dissipation module 3 through the second heat-conducting element 5. This achieves heat dissipation for the entire motherboard 1. In summary, the high-heat-generating motherboard RF noise shielding structure proposed in this application solves the industry problem of RF noise shielding for high-heat-generating motherboards 1 at the motherboard 1 level, without affecting heat dissipation, and has broad application prospects.

[0064] According to a second aspect of the embodiments of this application, a thermally conductive and microwave-absorbing material is provided for manufacturing the electronic device of this application. The first thermally conductive element 4 and the second thermally conductive element 5 are made of multiple raw materials of the same type but different proportions, the raw materials including at least thermally conductive particles, microwave-absorbing particles, fillers, and binders. Specifically, the proportion of thermally conductive particles in the first thermally conductive element 4 is higher than that in the second thermally conductive element 5, the proportion of fillers in the first thermally conductive element 4 is lower than that in the second thermally conductive element 5, and / or the proportion of binders in the first thermally conductive element 4 is higher than that in the second thermally conductive element 5.

[0065] Furthermore, the following provides a specific composition of the thermally conductive and microwave-absorbing material used to manufacture the first thermally conductive element 4, comprising: 40% to 45% thermally conductive particles, 25% to 30% microwave-absorbing particles, 10% to 15% binder, and 5% to 10% filler; or, 40% to 45% microwave-absorbing particles, 25% to 30% thermally conductive particles, 10% to 15% filler, and 5% to 10% binder.

[0066] In one specific implementation scenario, the composition of the thermally conductive and microwave-absorbing material used to make the first thermally conductive component is as follows: 30% microwave-absorbing particles, 50% thermally conductive particles, 10% adhesive, and 10% filler. The above raw materials are mixed and cured to form a paste-like thermally conductive and microwave-absorbing material.

[0067] The composition of the heat-conducting and microwave-absorbing material used to make the second heat-conducting component 5 is as follows: 45% microwave-absorbing particles, 30% heat-conducting particles, 5% adhesive, and 10% filler. The above raw materials are mixed and cured to form a silicone-like heat-conducting and microwave-absorbing material.

[0068] Regarding the electronic device of this application, this application also provides a manufacturing process, which includes:

[0069] First, the silicone-like thermally conductive and microwave-absorbing material is die-cut according to the size of the functional component 11 to form a second thermally conductive component 5 with an opening. The opening is used for embedding the functional component 11. The size of the functional component 11 can be slightly larger than the size of the opening.

[0070] Then, the second heat-conducting component 5 is attached to the surface of the motherboard 1, so that the second heat-conducting component 5 is in close contact with the peripheral circuit 12 on the surface of the motherboard 1, and the second heat-conducting component 5 is tightly snapped into the functional component 11 through the opening to form a recessed area 14.

[0071] Next, a paste-like thermally conductive and microwave-absorbing material is added to the recessed area 14 until the upper surface of the paste-like thermally conductive and microwave-absorbing material exceeds or is flush with the upper surface of the second thermally conductive element 5.

[0072] Then, the heat dissipation module 3 is attached to the upper surface of the first heat-conducting element 4 and the second heat-conducting element 5. The heat dissipation module 3 is connected to the motherboard 1 by fasteners to achieve the pressing of the heat dissipation module 3 and the motherboard 1. The first heat-conducting element 4 and the second heat-conducting element 5 are pressed, so that the first heat-conducting element 4 is tightly connected to the heat dissipation module 3 and the chip body. After the second heat-conducting element 5 is deformed by pressure, it is tightly connected to the heat dissipation module 3 and the peripheral circuit 12 to form a completely sealed structure.

[0073] It should be understood that the various forms of processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this disclosure can be achieved, and this is not limited herein.

[0074] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0075] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An electronic device, comprising: A motherboard is disposed within the housing of the electronic device, and the motherboard is provided with at least one functional component and peripheral circuitry corresponding to the functional component. A heat dissipation module is disposed on the side of the motherboard where the functional components and peripheral circuits are located, and is used at least for dissipating heat from the functional components and peripheral circuits; A first heat-conducting component is disposed between each of the functional components and the heat dissipation module, for conducting the heat generated by the functional components to the heat dissipation module. A second heat-conducting component is disposed at least between the peripheral circuit and the heat dissipation module, for conducting the heat generated by the peripheral circuit to the heat dissipation module. The first heat-conducting component can also absorb the electrical noise generated by the functional component, and the second heat-conducting component can also absorb the electrical noise generated by the peripheral circuit. Wherein, the thermal conductivity of the first thermally conductive component is superior to that of the second thermally conductive component; and / or, The second heat-conducting component has a better ability to absorb electrical noise than the first heat-conducting component.

2. The electronic device according to claim 1, wherein, The second heat-conducting component is also disposed in other areas of the motherboard where the functional components and peripheral circuits are not disposed, and forms a recessed area with the area where each functional component is located; The first thermal conductive element is filled and disposed between the recessed area and the heat dissipation module.

3. The electronic device according to claim 2, wherein, The thickness of the second thermal conductive component in the direction perpendicular to the motherboard is not less than the maximum distance between the motherboard and the heat dissipation module; and the thickness of the first thermal conductive component in the direction perpendicular to the motherboard is not less than the maximum distance between the functional component and the heat dissipation module; and / or, The hardness of the first heat-conducting component is less than that of the second heat-conducting component.

4. The electronic device according to claim 2, wherein, The second heat-conducting component can also absorb the electrical noise generated by the functional components; and / or The first thermally conductive element has stronger adhesion than the second thermally conductive element.

5. The electronic device according to claim 1, further comprising: A packaging structure disposed on at least one exposed surface of the functional component, the packaging structure being used to fix the functional component at a designated location on the motherboard; The encapsulation structure can conduct the heat generated by the functional component to the first heat-conducting element and / or the second heat-conducting element, and / or the encapsulation structure can also absorb a portion of the electrical noise generated by the functional component.

6. The electronic device according to claim 1, wherein the peripheral circuit is disposed around the periphery of the corresponding functional component, the peripheral circuit comprising a plurality of electronic components spaced apart, the plurality of electronic components having a first gap between them, and the second heat-conducting element having a recess corresponding to the electronic components and a first protrusion corresponding to the first gap on the side facing the peripheral circuit, so as to achieve a sealed connection with the peripheral circuit; and / or, There is a second gap between the peripheral circuit and the corresponding functional component, and the second heat-conducting component is provided with a second protrusion corresponding to the second gap to seal and connect with the motherboard and the functional component.

7. The electronic device according to claim 1, wherein, The first heat-conducting component and the second heat-conducting component are made of multiple raw materials of the same type but different proportions, and the raw materials include at least heat-conducting particles, microwave-absorbing particles, fillers, and binders.

8. The electronic device according to claim 7, wherein, The proportion of the thermally conductive particles in the first thermally conductive component is higher than that in the second thermally conductive component, the proportion of the filler in the first thermally conductive component is lower than that in the second thermally conductive component, and / or the proportion of the binder in the first thermally conductive component is higher than that in the second thermally conductive component.

9. The electronic device according to claim 1, wherein, The specific composition of the thermally conductive and microwave-absorbing material of the first thermally conductive component includes: 40%~45% thermally conductive particles, 25%~30% microwave-absorbing particles, 10%~15% adhesive, and 5%~10% filler.

10. The electronic device according to claim 1, wherein, The specific composition of the heat-conducting and microwave-absorbing material of the second heat-conducting component includes: 40%~45% microwave-absorbing particles, 25%~30% heat-conducting particles, 10%~15% filler, and 5%~10% adhesive.

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